Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, the display panel comprises a hole area and a display area surrounding at least part of the hole area, in the hole area, the display panel comprises a substrate, a third insulating layer, a first packaging layer and a panel film layer, the first packaging layer extends to the hole area from the display area, and the second packaging layer extends to the hole area from the third insulating layer. The first packaging layer is located on the surface of the side, away from the substrate, of the third insulating layer, the side, close to the substrate, of the first packaging layer makes contact with the side, away from the substrate, of the third insulating layer, the hole area comprises at least two through holes communicated with each other in the thickness direction of the substrate, and the diameters of the through holes are not equal. And the diameter of the through hole in the third insulating layer is equal to that of the through hole in the first packaging layer. According to the invention, the third insulating layer and the first packaging layer are not liable to generate cracks, so that the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0004] To overcome the technical problems mentioned in the background, embodiments of this application provide a display panel, the display panel including a hole area and a display area surrounding at least a portion of the hole area, wherein the display panel includes:

[0005] First functional membrane layer;

[0006] The third insulating layer is located on one side surface of the first functional film layer;

[0007] The first encapsulation layer extends from the display area to the hole area and is located on the side surface of the third insulating layer away from the first functional film layer;

[0008] The second functional film layer is located on the surface of the first encapsulation layer away from the first functional film layer;

[0009] Along the thickness direction of the display panel, the hole area includes a first sub-through hole and a second sub-through hole that are interconnected. The first sub-through hole and the second sub-through hole have different diameters. The third insulating layer and the first encapsulation layer have the first sub-through hole, and at least a portion of the first functional film layer or at least a portion of the second functional film layer has the second sub-through hole.

[0010] In some possible implementations, the first functional film layer includes a first sub-layer, wherein the first sub-layer contacts the side of the third insulating layer near the first functional film layer, and the second functional film layer includes a second sub-layer, wherein the second sub-layer contacts the side of the first encapsulation layer away from the third insulating layer, and at least one of the first sub-layer or the second sub-layer has the first sub-via.

[0011] Preferably, the first sublayer includes a substrate;

[0012] Preferably, the second sub-layer includes a filling layer;

[0013] Preferably, the distance from the side of the first encapsulation layer located in the hole area away from the substrate to the substrate is less than the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate;

[0014] Preferably, the distance from the side of the filling layer away from the substrate to the substrate is equal to the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate;

[0015] Preferably, the material of the filler layer includes organic materials;

[0016] Preferably, the material of the third insulating layer includes inorganic materials;

[0017] Preferably, the material of the first encapsulation layer includes inorganic materials.

[0018] In some possible implementations, the first functional film layer includes a third sub-layer that is furthest from the third insulating layer, and the second functional film layer includes a fourth sub-layer that is furthest from the first encapsulation layer.

[0019] Wherein, at least one of the third sub-layer and the fourth sub-layer has the second sub-via;

[0020] Preferably, the third sub-layer includes a support film layer or a protective layer;

[0021] Preferably, the fourth sub-layer comprises a second optical adhesive layer or a release film layer;

[0022] Preferably, the thickness of the second functional film layer is greater than the thickness of the first functional film layer;

[0023] Preferably, the material of the supporting membrane layer includes organic materials;

[0024] Preferably, the material of the protective layer includes organic materials.

[0025] In some possible implementations, the third insulating layer extends to the display area and has a plurality of openings in the display area, wherein a light-emitting unit is disposed within the openings;

[0026] Preferably, the display panel includes a pixel defining layer, and the pixel defining layer and the third insulating layer are disposed in the same layer and of the same material;

[0027] Preferably, the first functional film layer extends to the display area, and the display panel further includes an array layer located in the display area, the array layer being located between the first functional film layer and the pixel defining layer, and the array layer being provided with transistors and capacitors.

[0028] In some possible implementations, this application also provides another display panel, the display panel including an aperture area and a display area surrounding at least a portion of the aperture area, wherein the display panel includes:

[0029] Substrate;

[0030] A third insulating layer is located on one side surface of the substrate;

[0031] A first encapsulation layer extends from the display area to the aperture area and is located on the surface of the third insulating layer away from the substrate. The side of the first encapsulation layer close to the substrate is in contact with the side of the third insulating layer away from the substrate.

[0032] A panel film layer is located on the surface of the first encapsulation layer away from the substrate;

[0033] Along the thickness direction of the substrate, the hole region includes at least two interconnected vias, each with a different diameter, and the diameter of the via located in the third insulating layer is equal to the diameter of the via located in the first encapsulation layer.

[0034] In some possible implementations, the diameter of the via in the third insulating layer is greater than or equal to the diameter of the via in the substrate; or, the diameter of the via in the first encapsulation layer is greater than or equal to the diameter of the via in the panel film layer.

[0035] Preferably, the third insulating layer extends to the display area and has multiple openings in the display area, with light-emitting units disposed within the openings;

[0036] Preferably, the display panel includes a pixel defining layer, and the pixel defining layer and the third insulating layer are disposed in the same layer and of the same material;

[0037] Preferably, the diameter of at least one of the vias located in the substrate and the vias located in the panel film layer is the same as the diameter of the via located in the first encapsulation layer.

[0038] In some possible implementations, in the hole region, the panel film layer includes a filling layer, and the diameter of the through hole in the first encapsulation layer is greater than or equal to the diameter of the through hole in the filling layer;

[0039] Preferably, the display panel further includes a first insulating layer, a second insulating layer, a first optical adhesive layer, a polarizer and a second optical adhesive layer, which are sequentially stacked in the direction away from the substrate of the filling layer, and a support film layer located on the side of the substrate away from the third insulating layer;

[0040] Preferably, the distance from the side of the first encapsulation layer located in the hole area away from the substrate to the substrate is less than the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate;

[0041] Preferably, the distance from the side of the filling layer away from the substrate to the substrate is equal to the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate;

[0042] Preferably, the material of the filler layer includes organic materials;

[0043] Preferably, the material of the third insulating layer includes inorganic materials;

[0044] Preferably, the material of the first encapsulation layer includes inorganic materials;

[0045] Preferably, the material of the supporting membrane layer includes organic materials.

[0046] In some possible implementations, the diameters of the vias located in the support film layer, the substrate, the third insulating layer, and the first encapsulation layer are equal;

[0047] Preferably, the diameters of the through holes located in the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, and the second optical adhesive layer are equal;

[0048] Preferably, the diameter of the through-hole located in the first encapsulation layer is larger than the diameter of the through-hole located in the filling layer.

[0049] In some possible implementations, the diameters of the through holes located in the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer are equal;

[0050] Preferably, the diameters of the vias located in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, and the support film layer are equal;

[0051] Preferably, the diameter of the through hole located in the filling layer is smaller than the diameter of the through hole located in the first insulating layer.

[0052] In some possible implementations, the diameters of the vias located in the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filler layer, the first encapsulation layer, the third insulating layer, the substrate, and the support film layer are equal;

[0053] Preferably, the diameter of the through hole located in the second optical adhesive layer is larger than the diameter of the through hole located in the polarizer.

[0054] In some possible implementations, in the hole area, the display panel further includes a release film layer located on the side of the second optical adhesive layer away from the substrate, and a protective layer located on the side of the support film layer away from the substrate;

[0055] Preferably, the diameters of the through holes located in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the fill layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer and the second optical adhesive layer, and the release film layer are equal;

[0056] Preferably, the diameter of the through hole in the protective layer is larger than the diameter of the through hole in the supporting film layer;

[0057] Preferably, the material of the protective layer includes organic materials.

[0058] In some possible implementations, the third insulating layer extends from the hole area to the display area, and the display panel further includes:

[0059] An isolation structure is located on the side of the third insulating layer away from the substrate. The isolation structure encloses and forms an isolation opening and a light-transmitting opening. The isolation opening is located in the display area, and the light-transmitting opening is located in the aperture area.

[0060] Preferably, the orthographic projection of the through hole on the substrate at least partially overlaps with the orthographic projection of the light-transmitting opening on the substrate;

[0061] Preferably, in the display area, the display panel further includes a first touch layer and a second touch layer stacked sequentially on the side of the first encapsulation layer away from the substrate, the first insulating layer and the second insulating layer both extending from the hole area to the display area, the first insulating layer being located between the first encapsulation layer and the first touch layer, and the second insulating layer being located between the first touch layer and the second touch layer.

[0062] In some possible implementations, the display panel further includes:

[0063] The light-emitting unit is at least partially located within the isolation opening;

[0064] A second encapsulation layer, the second encapsulation layer including a plurality of spaced-apart encapsulation units, at least a portion of the encapsulation units extending from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate;

[0065] Preferably, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the substrate, and the first encapsulation layer is located on the side of the third encapsulation layer away from the substrate;

[0066] Preferably, the aperture area includes a transition area, the display panel further includes a dam located in the transition area, and the third encapsulation layer is located on the side of the dam closer to the display area;

[0067] Preferably, both the first encapsulation layer and the second encapsulation layer are made of inorganic materials;

[0068] Preferably, the material of the third encapsulation layer includes organic materials;

[0069] Preferably, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the substrate, wherein the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0070] Preferably, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion;

[0071] Preferably, the material of the third isolation portion includes molybdenum; and / or, the material of the first isolation portion includes aluminum; and / or, the material of the second isolation portion includes titanium.

[0072] In some possible embodiments, this application provides a method for manufacturing a display panel, the display panel including a hole region and a display area surrounding at least a portion of the hole region, the method comprising:

[0073] Provide substrate;

[0074] A third insulating layer is formed on one side of the substrate;

[0075] A first encapsulation layer is formed on the side of the third insulating layer away from the substrate. The first encapsulation layer extends from the display area to the hole area. The side of the first encapsulation layer near the substrate contacts the side of the third insulating layer away from the substrate.

[0076] A panel film layer is formed on the side of the first encapsulation layer away from the substrate;

[0077] Along the thickness direction of the substrate, at least two interconnected through holes are cut in the hole area using a cutting device. The diameters of each through hole are not equal, and the diameter of the through hole located in the third insulating layer is equal to the diameter of the through hole located in the first encapsulation layer.

[0078] In some possible implementations, prior to the step of cutting at least two interconnected through holes in the hole area using a cutting device, the method further includes:

[0079] A filler layer, a first insulating layer, a second insulating layer, and a first optical adhesive layer are sequentially formed on the side of the first encapsulation layer away from the substrate;

[0080] A support film layer and a protective layer are sequentially formed on the side of the substrate away from the third insulating layer;

[0081] A polarizer, a second optical adhesive layer, and a release film are sequentially formed on the side of the first optical adhesive layer away from the substrate;

[0082] Preferably, the diameter of the via in the third insulating layer is greater than or equal to the diameter of the via in the substrate, and the diameter of the via in the first encapsulation layer is greater than or equal to the diameter of the via in the panel film layer.

[0083] In some possible implementations, the step of cutting at least two interconnected through holes in the hole area using a cutting device includes:

[0084] A first through hole is cut into the protective layer along the thickness direction of the substrate using a cutting device;

[0085] Along the thickness direction of the substrate, a second through hole is sequentially cut into the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device.

[0086] Preferably, the step of cutting the first through hole in the protective layer using a cutting device includes:

[0087] The first through hole is cut by using a cutting device with a laser energy of 3W-5W and a cutting speed of 800mm / s-1000mm / s to cut 8-10 turns on the protective layer;

[0088] Preferably, the step of sequentially cutting the second through-hole in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device includes:

[0089] Using a cutting device with a laser energy of 8W-10W and a cutting speed of 1100mm / s-1300mm / s, a second through hole is cut after 65-70 turns on the supporting film layer, the substrate, the third insulating layer, the first encapsulation layer, the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer;

[0090] Preferably, after the step of sequentially cutting the second through-hole in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device, the method further includes:

[0091] Remove the protective layer and the release film layer;

[0092] Preferably, the diameter of the second through hole is smaller than the diameter of the first through hole;

[0093] Preferably, the first through hole and the second through hole are coaxially arranged.

[0094] In some possible implementations, the step of cutting at least two interconnected through holes in the hole area using a cutting device includes:

[0095] Along the thickness direction of the substrate, a third through hole is sequentially cut into the protective layer, the support film layer, the substrate, the third insulating layer, and the first encapsulation layer using a cutting device;

[0096] Along the thickness direction of the substrate, a fourth through hole is sequentially cut into the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer using a cutting device;

[0097] Preferably, the step of sequentially cutting a third through-hole in the protective layer, the support film layer, the substrate, the third insulating layer, and the first encapsulation layer using a cutting device includes:

[0098] The third through hole is cut by using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s after cutting 25-30 turns on the protective layer, the support film layer, the substrate, the third insulating layer and the first encapsulation layer.

[0099] Preferably, the step of sequentially cutting a fourth through hole in the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device includes:

[0100] Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, a fourth through hole is cut after 40-50 turns on the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer.

[0101] Preferably, after the step of cutting the fourth through hole sequentially on the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer using a cutting device, the method further includes: removing the protective layer and the release film layer;

[0102] Preferably, the diameter of the fourth through hole is smaller than the diameter of the third through hole;

[0103] Preferably, the third through hole and the fourth through hole are coaxially arranged.

[0104] In some possible implementations, the step of cutting at least two interconnected through holes in the hole area using a cutting device includes:

[0105] Along the thickness direction of the substrate, a fifth through hole is sequentially cut into the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer using a cutting device.

[0106] Along the thickness direction of the substrate, a sixth through hole is sequentially cut into the fill layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device;

[0107] Preferably, the step of sequentially cutting a fifth through hole in the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer using a cutting device includes:

[0108] Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, the fifth through hole is cut after 40-50 turns on the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer and the first insulating layer.

[0109] Preferably, the step of sequentially cutting a sixth through-hole in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device includes:

[0110] Using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s, the sixth through hole is cut after making 25-30 turns in sequence on the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer and the protective layer.

[0111] Preferably, after the step of sequentially cutting the sixth through-hole in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device, the method further includes:

[0112] Remove the protective layer and the release film layer;

[0113] Preferably, the diameter of the sixth through hole is smaller than the diameter of the fifth through hole;

[0114] Preferably, the fifth through hole and the sixth through hole are coaxially arranged.

[0115] In some possible implementations, the step of cutting at least two interconnected through holes in the hole area using a cutting device includes:

[0116] Along the thickness direction of the substrate, a seventh through hole is cut into the release film layer and the second optical adhesive layer using a cutting device;

[0117] Along the thickness direction of the substrate, an eighth through hole is sequentially cut into the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device.

[0118] Preferably, the step of cutting the seventh through hole in the release film layer and the second optical adhesive layer using a cutting device includes:

[0119] Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, the seventh through hole is cut out after 30-40 turns on the release film layer and the second optical adhesive layer.

[0120] Preferably, the step of sequentially cutting an eighth through-hole on the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device includes:

[0121] Using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s, the eighth through hole is cut by making 30-40 cuts in sequence on the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer.

[0122] Preferably, after the step of sequentially cutting the eighth through-hole into the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device, the method further includes:

[0123] Remove the protective layer and the release film layer;

[0124] Preferably, the diameter of the eighth through hole is smaller than the diameter of the seventh through hole;

[0125] Preferably, the seventh through hole and the eighth through hole are coaxially arranged.

[0126] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method for preparing the display panel described in this application, and further includes a photosensitive device located in the aperture region.

[0127] Compared with the prior art, this application has the following beneficial effects:

[0128] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By providing at least two interconnected through holes in the hole area, with unequal diameters between each through hole, and the diameter of the through hole located in the third insulating layer being equal to the diameter of the through hole located in the first encapsulation layer, the third insulating layer and the first encapsulation layer are less prone to cracking, thereby making it less likely for the light-emitting unit to fail and for rainbow patterns to be generated in the hole area, thereby improving the display effect of the display panel. Attached Figure Description

[0129] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0130] Figure 1 A top view of the display panel provided in an embodiment of this application;

[0131] Figure 2 One of the cross-sectional schematic diagrams of the display panel in the display area and the hole area provided in the embodiments of this application;

[0132] Figure 3a A second schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0133] Figure 3b A cross-sectional schematic diagram showing that the third insulating layer of the hole area and the pixel limiting layer of the display area are disposed on the same layer as in the embodiments of this application;

[0134] Figure 4 The third schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0135] Figure 5 Fourth cross-sectional schematic diagram of the display panel in the display area and the hole area provided in the embodiments of this application;

[0136] Figure 6 Fifth schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0137] Figure 7 Sixth schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0138] Figure 8 Seventh schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0139] Figure 9aEighth schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0140] Figure 9b Ninth schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0141] Figure 9c Tenth schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0142] Figure 9d Eleventh schematic cross-sectional view of the display panel in the display area and the hole area provided in the embodiments of this application;

[0143] Figure 9e 12. Cross-sectional schematic diagram of the display panel in the display area and the hole area provided in the embodiments of this application;

[0144] Figure 10 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0145] Figure 11 A cross-sectional schematic diagram showing a first electrode layer, a third insulating layer, an isolation structure, and a dam sequentially formed on one side of a substrate, as provided in an embodiment of this application;

[0146] Figure 12 A cross-sectional schematic diagram of the fabrication of a light-emitting unit at least partially located within an isolation opening and a second encapsulation layer located on the side of the light-emitting unit away from the substrate, provided for an embodiment of this application;

[0147] Figure 13 A cross-sectional view showing the formation of a third encapsulation layer on the side of the second encapsulation layer away from the substrate and the formation of a first encapsulation layer on the side of the third encapsulation layer away from the substrate, as provided in the embodiments of this application.

[0148] Figure 14 A cross-sectional view showing that a filling layer, a first insulating layer, a second insulating layer, and a first optical adhesive layer are sequentially formed on the side of the first encapsulation layer away from the substrate, as provided in an embodiment of this application;

[0149] Figure 15 A cross-sectional view showing a support film layer and a protective layer sequentially formed on the side of the substrate away from the third insulating layer, as provided in an embodiment of this application;

[0150] Figure 16 A cross-sectional view showing the formation of a polarizer, a second optical adhesive layer, and a release film layer sequentially on the side of the first optical adhesive layer away from the substrate, as provided in an embodiment of this application;

[0151] Figure 17 A cross-sectional schematic diagram of a first through hole cut into the protective layer, provided for an embodiment of this application;

[0152] Figure 18 A schematic cross-sectional view of a second through hole cut sequentially in the support film layer, substrate, third insulating layer, first encapsulation layer, filling layer, first insulating layer, second insulating layer, first optical adhesive layer, polarizer, second optical adhesive layer and release film layer provided for embodiments of this application;

[0153] Figure 19 The cross-sectional view of cutting a third through hole sequentially on the protective layer, the support film layer, the substrate, the third insulating layer and the first encapsulation layer is shown in the embodiment of this application.

[0154] Figure 20 The cross-sectional view of cutting a fourth through hole sequentially on the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer is provided for the embodiments of this application.

[0155] Figure 21 A schematic diagram of a cross-section showing a fifth through hole cut sequentially in the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer, provided for an embodiment of this application;

[0156] Figure 22 A cross-sectional view showing a sixth through-hole cut sequentially in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer, as provided in an embodiment of this application;

[0157] Figure 23 This is a schematic diagram of a cross-section showing a seventh through hole cut into the release film layer and the second optical adhesive layer, as provided in an embodiment of this application.

[0158] Figure 24 The cross-sectional view of cutting an eighth through hole sequentially on a polarizer, a first optical adhesive layer, a second insulating layer, a first insulating layer, a filler layer, a first encapsulation layer, a third insulating layer, a substrate, a support film layer, and a protective layer is shown in the embodiment of this application.

[0159] Reference numerals: 1. Substrate; 2. Third insulating layer; 201. Pixel aperture; 3. First encapsulation layer; 4. Panel film layer; 41. Filler layer; 5. Through-hole; 51. First through-hole; 52. Second through-hole; 53. Third through-hole; 54. Fourth through-hole; 55. Fifth through-hole; 56. Sixth through-hole; 57. Seventh through-hole; 58. Eighth through-hole; 59. First sub-through-hole; 510. Second sub-through-hole; 6. Support film layer; 7. Isolation structure; 71. First isolation portion; 72. Second isolation portion; 73. Third isolation portion; 8. Second encapsulation Layer; 81, Encapsulation unit; 9, Third encapsulation layer; 10, First insulating layer; 11, First touch layer; 12, Second insulating layer; 13, Second touch layer; 14, First optical adhesive layer; 15, Polarizer; 16, Second optical adhesive layer; 17, First electrode; 18, Light-emitting part; 19, Second electrode; 20, Dam; 21, Light-emitting unit; 22, Isolation opening; 23, Light-transmitting opening; 24, Protective layer; 25, Release film layer; 26, Pixel limiting layer; 261, Opening; 27, First functional film layer; 28, Second functional film layer. Detailed Implementation

[0160] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0161] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0162] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0163] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0164] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0165] Increasing the density of light-emitting units (i.e., pixel density) in a display panel is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in light-emitting unit density. Through long-term research, the inventors discovered that, to address the technical challenge of limiting light-emitting unit density, an isolation structure can be incorporated into some display panels. During the full-layer deposition of the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode can be disconnected at the isolation structure. Through multiple deposition and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within different isolation openings.

[0166] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, and CN1179 CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for isolation structures, the contents of which are incorporated herein by reference.

[0167] The display panel in the related technology includes a hole area and a display area surrounding at least part of the hole area. In the hole area, the display panel includes a substrate, a third insulating layer located on one side of the substrate, and a first encapsulation layer located on the side of the third insulating layer away from the substrate. A photosensitive element, such as a camera, is disposed under the screen of the hole area. In order for the photosensitive element to work better, through holes need to be formed in the hole area along the thickness direction of the substrate. However, when through holes are formed on the third insulating layer and the first encapsulation layer of the hole area, since the materials of the third insulating layer and the first encapsulation layer include inorganic materials, cracks are prone to occur in the third insulating layer and the first encapsulation layer at the location of the through holes. Moisture entering from the through holes can easily extend to the light-emitting unit of the display area through the cracks in the third insulating layer and the first encapsulation layer, thereby causing the light-emitting unit to fail, causing black spots to appear on the display panel, and at the same time, rainbow patterns will appear at the location of the hole area, ultimately affecting the display effect of the display panel.

[0168] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0169] Please see Figure 1 and Figure 2 This embodiment provides a display panel including a hole region HA and a display region AA surrounding at least a portion of the hole region HA. In the hole region HA, the display panel includes a substrate 1, a third insulating layer 2, a first encapsulation layer 3, and a panel film layer 4.

[0170] The substrate 1 may include multiple film layers stacked sequentially. For example, the substrate 1 may include a first organic layer, a first barrier layer, a second organic layer, and a second barrier layer stacked sequentially. The materials of the first organic layer and the second organic layer may include organic materials, specifically including polyimide layers, etc.; the materials of the first barrier layer and the second barrier layer may include inorganic materials, specifically including silicon oxide layers or silicon nitride layers, etc.

[0171] The third insulating layer 2 is located on one side surface of the substrate 1; the first encapsulation layer 3 extends from the display area AA to the hole area HA, the first encapsulation layer 3 is located on the side surface of the third insulating layer 2 away from the substrate 1, and the side of the first encapsulation layer 3 close to the substrate 1 is in contact with the side of the third insulating layer 2 away from the substrate 1.

[0172] The panel film layer 4 is located on the side of the first encapsulation layer 3 away from the substrate 1 and is in contact with the side of the first encapsulation layer 3 away from the substrate 1.

[0173] Along the thickness direction Z of the substrate 1, the hole region HA includes at least two interconnected vias 5, the diameters of each via 5 are not equal, and the diameter of the via 5 located in the third insulating layer 2 is equal to the diameter of the via 5 located in the first encapsulation layer 3.

[0174] In the film layer of the display panel via HA, through holes 5 with equal diameters are defined as one through hole. For example, if three through holes 5 in the film layer of the display panel via HA have equal diameters, then the through holes 5 in these three film layers are the same through hole 5. In this embodiment, the film layer of the display panel via HA includes at least two through holes 5, indicating that at least two through holes 5 in the film layer of the display panel via HA have different diameters.

[0175] However, equal diameters do not necessarily mean absolutely equal diameters. As long as the through holes 5 on the two membrane layers are completed in the same cutting process, the diameters of the through holes 5 on the two membrane layers can be considered equal.

[0176] The materials of the third insulating layer 2 and the first encapsulation layer 3 both include inorganic materials. The main factors affecting the cracks in the third insulating layer 2 and the first encapsulation layer 3 at the through hole 5 include the cutting energy of the cutting equipment. Generally, the thicker the film layer of the display panel, the higher the energy used by the cutting equipment, and the easier it is to generate cracks in the third insulating layer 2 and the first encapsulation layer 3.

[0177] The method of cutting from the front to the back of the display panel (i.e., from the first encapsulation layer 3 to the third insulating layer 2) is defined as a front cut, and the method of cutting from the back to the front of the display panel (i.e., from the third insulating layer 2 to the first encapsulation layer 3) is defined as a back cut.

[0178] In related technologies, a tangential method is usually used to cut through all the film layers of the HA region to create through holes 5 in one go. The cutting equipment uses relatively high energy, which can easily cause cracks in the third insulating layer 2 and the first encapsulation layer 3.

[0179] When a complete through hole 5 in the hole area HA is cut multiple times, the subsequent cut is based on the through hole 5 cut in the previous cut. In order to prevent the subsequent cut from interfering with the through hole 5 cut in the previous cut, the diameter of the through hole 5 cut in the subsequent cut is usually smaller than the diameter of the through hole 5 cut in the previous cut.

[0180] In this embodiment, since the hole region HA includes at least two interconnected through holes 5, the complete through holes 5 are cut in the hole region HA at least twice. In this way, the film layer cut each time is relatively thinner, the cutting equipment uses less energy, and thus it is not easy for the third insulating layer 2 and the first encapsulation layer 3 to crack.

[0181] Since the diameter of the through hole 5 located in the third insulating layer 2 is equal to the diameter of the through hole 5 located in the first encapsulation layer 3, the through holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, thereby reducing the risk of cracks in the third insulating layer 2 and the first encapsulation layer 3.

[0182] Based on the above design, in this embodiment, by setting at least two interconnected through holes 5 in the hole area HA, with different diameters between each through hole 5, and the diameter of the through hole 5 located in the third insulating layer 2 being equal to the diameter of the through hole 5 located in the first encapsulation layer 3, it is possible to prevent cracks from forming in the third insulating layer 2 and the first encapsulation layer 3, thereby making it less likely for the light-emitting unit to fail and for rainbow patterns to form in the hole area HA, thereby improving the display effect of the display panel.

[0183] In some possible implementations, the diameter of the via 5 located in the third insulating layer 2 is greater than or equal to the diameter of the via 5 located in the substrate 1, and the diameter of the via 5 located in the first encapsulation layer 3 is greater than or equal to the diameter of the via 5 located in the panel film layer 4.

[0184] The main factors affecting the formation of cracks in the third insulating layer 2 and the first encapsulation layer 3 at the through hole 5 also include: whether the through hole 5 exposes the third insulating layer 2 and the first encapsulation layer 3 after a certain cut (the through hole 5 can be cut in several times). For example, if the third insulating layer 2 is exposed after the first cut (i.e., the cutting is stopped when the third insulating layer 2 is cut for the first time), then the third insulating layer 2 will be subjected to greater cutting stress, and therefore cracks are more likely to form on the third insulating layer 2.

[0185] Since the diameter of the via 5 located in the third insulating layer 2 is greater than or equal to the diameter of the via 5 located in the substrate 1, the film layer exposed by the via 5 after a certain cutting will not be the third insulating layer 2.

[0186] Specifically, in some embodiments, please refer again Figure 2 The diameter of the through hole 5 located in the third insulating layer 2 is larger than the diameter of the through hole 5 located in the substrate 1.

[0187] In this embodiment, a through hole 5 is cut into the third insulating layer 2 and the first encapsulation layer 3 in a tangential manner. The through hole 5 exposes the substrate 1. The corresponding through hole 5 is then cut into the substrate 1 in the next step. Since the through hole 5 on the third insulating layer 2 is cut out before the through hole 5 on the substrate 1, the diameter of the through hole 5 on the third insulating layer 2 is larger than the diameter of the through hole 5 on the substrate 1. Furthermore, the third insulating layer 2 is not exposed after a certain cut. Therefore, the stress on the third insulating layer 2 is relatively small, and it is not easy for the third insulating layer 2 to crack.

[0188] In other embodiments, please refer to Figure 3a The diameter of the through hole 5 located in the third insulating layer 2 is equal to the diameter of the through hole 5 located in the substrate 1.

[0189] In this embodiment, a back-cutting method is used to cut corresponding through holes 5 on the substrate 1, the third insulating layer 2, and the first encapsulation layer 3 in one cut. Since the through holes 5 on the third insulating layer 2 and the substrate 1 are cut in the same cut, the diameter of the through hole 5 on the third insulating layer 2 is equal to the diameter of the through hole 5 on the substrate 1. Moreover, the third insulating layer 2 will not be exposed after the cut. Therefore, the stress on the third insulating layer 2 is small, and it is not easy for the third insulating layer 2 to crack.

[0190] Since the diameter of the through hole 5 located in the first encapsulation layer 3 is greater than or equal to the diameter of the through hole 5 of the panel film layer 4 located on the side of the first encapsulation layer 3 away from the substrate 1 and in contact with the first encapsulation layer 3, the film layer exposed by the through hole 5 after a certain cutting will not be the first encapsulation layer 3.

[0191] Specifically, in some embodiments, please refer again Figure 2 The diameter of the through hole 5 located in the first encapsulation layer 3 is equal to the diameter of the through hole 5 of the panel film layer 4 located on the side of the first encapsulation layer 3 away from the substrate 1 and in contact with the first encapsulation layer 3.

[0192] In this embodiment, through holes 5 are cut in the panel film layer 4, the first encapsulation layer 3 and the third insulating layer 2 in one cut using a tangential method. Since the through holes 5 located in the panel film layer 4 and the first encapsulation layer 3 are cut in the same cut, the diameter of the through hole 5 located in the first encapsulation layer 3 is equal to the diameter of the through hole 5 located in the panel film layer 4. Moreover, the first encapsulation layer 3 will not be exposed after the cut. Therefore, the stress on the first encapsulation layer 3 is small, and it is not easy for the first encapsulation layer 3 to crack.

[0193] In other embodiments, please refer again. Figure 3a The diameter of the through hole 5 located in the first encapsulation layer 3 is larger than the diameter of the through hole 5 located in the panel film layer 4 on the side of the first encapsulation layer 3 away from the substrate 1 and in contact with the first encapsulation layer 3.

[0194] In this embodiment, a back-cutting method is used to cut corresponding through holes 5 in the third insulating layer 2 and the first encapsulation layer 3 in one operation. The through holes 5 expose the panel film layer 4. The corresponding through holes 5 are then cut in the panel film layer 4 in the next operation. Since the through holes 5 on the first encapsulation layer 3 are cut out before the through holes 5 on the panel film layer 4, the diameter of the through holes 5 on the first encapsulation layer 3 is larger than the diameter of the through holes 5 on the panel film layer 4. Moreover, after a certain cut, the first encapsulation layer 3 will not be exposed. Therefore, the stress on the first encapsulation layer 3 is relatively small, and it is not easy for the first encapsulation layer 3 to crack.

[0195] Preferably, please see again. Figure 2 and Figure 3a The diameter of at least one of the vias 5 located in the substrate 1 and the vias 5 located in the panel film layer 4 is the same as the diameter of the via 5 located in the first encapsulation layer 3. In this way, the stress on the first encapsulation layer 3 is smaller, and it is less likely to cause cracks in the first encapsulation layer 3.

[0196] Preferably, please refer to Figure 3b The third insulating layer 2 extends to the display area AA, and multiple openings 261 are provided in the display area AA, with light-emitting units 21 provided in the openings 261.

[0197] Preferably, the display panel includes a pixel defining layer 26, which is disposed in the same layer and with the same material as the third insulating layer 2.

[0198] In the same layer as the display limiting layer 26 that forms the display area AA, a third insulating layer 2 is formed in the hole area HA. ​​Therefore, there is no need to set up a special process to form the third insulating layer 2, thereby reducing the cost of forming the third insulating layer 2.

[0199] For some possible implementations, please refer to Figure 4 and Figure 5 In the hole area HA, the display panel also includes a filling layer 41 located on the side of the first encapsulation layer 3 away from the substrate 1, and the diameter of the through hole 5 located in the first encapsulation layer 3 is greater than or equal to the diameter of the through hole 5 located in the filling layer 41.

[0200] The filling layer 41 is used to fill the hole area HA. ​​In the above embodiment, the panel film layer 4 includes the filling layer 41, which is located on the side of the first encapsulation layer 3 away from the substrate 1 and is in contact with the first encapsulation layer 3.

[0201] In some embodiments, please refer again Figure 4 A back-cutting method is used to cut corresponding through holes 5 in the third insulating layer 2 and the first encapsulation layer 3 in one operation, exposing the filling layer 41. The corresponding through holes 5 are then cut in the filling layer 41 in the next operation. Since the through holes 5 on the third insulating layer 2 and the first encapsulation layer 3 are cut before the through holes 5 on the filling layer 41, the diameter of the through holes 5 on the third insulating layer 2 and the first encapsulation layer 3 is larger than the diameter of the through holes 5 on the filling layer 41. Moreover, after a certain cut, the third insulating layer 2 and the first encapsulation layer 3 will not be exposed. Therefore, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small, and it is not easy for the third insulating layer 2 and the first encapsulation layer 3 to crack.

[0202] In other embodiments, please refer again. Figure 5 A through hole 5 is cut into the filler layer 41, the first encapsulation layer 3, and the third insulating layer 2 in a single cut using a tangential method. Since the through holes 5 in the filler layer 41, the first encapsulation layer 3, and the third insulating layer 2 are cut in the same cut, the diameters of the through holes 5 in the filler layer 41, the first encapsulation layer 3, and the third insulating layer 2 are equal. Furthermore, the third insulating layer 2 and the first encapsulation layer 3 will not be exposed after a single cut. Therefore, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small, and it is not easy for the third insulating layer 2 and the first encapsulation layer 3 to crack.

[0203] For some possible implementations, please refer to Figure 6The display panel also includes a first insulating layer 10, a second insulating layer 12, a first optical adhesive layer 14, a polarizer 15 and a second optical adhesive layer 16, which are sequentially stacked in the direction away from the substrate 1 in the filling layer 41, and a support film layer 6 located on the side of the substrate 1 away from the third insulating layer 2.

[0204] The display panel also includes an isolation structure 7 and a light-emitting unit 21, with a third insulating layer 2 extending from the aperture area HA to the display area AA, and the light-emitting unit 21 located at least partially within the isolation opening 22.

[0205] The isolation structure 7 is located on the side of the third insulating layer 2 away from the substrate 1. The isolation structure 7 encloses and forms an isolation opening 22 and a light-transmitting opening 23. The isolation opening 22 is located in the display area AA, and the light-transmitting opening 23 is located in the aperture area HA. ​​The third insulating layer 2 includes a pixel opening 201 that exposes at least a portion of the first electrode 17 of the light-emitting unit 21. The pixel opening 201 is connected to the isolation opening 22. The orthographic projection of the pixel opening 201 on the substrate 1 is located within the orthographic projection of the isolation opening 22 on the substrate 1. Both the pixel opening 201 and the isolation opening 22 are located in the display area AA.

[0206] In this embodiment, the pixel opening 201 is equivalent to the opening 261 in the above embodiment. The isolation structure 7 allows the display panel to form film layers of different color light-emitting units 21 in different isolation openings 22 without the need for a fine metal mask. Specifically, when forming the light-emitting material layer, the light-emitting material layer is separated by the isolation structure 7 to form multiple spaced light-emitting parts 18. When forming the second electrode material layer, the second electrode material layer is separated by the isolation structure 7 to form multiple spaced second electrodes 19. The isolation structure 7 includes a conductive material, and the second electrodes 19 are electrically connected to the isolation structure 7. A first electrode 17, a light-emitting part 18, and a second electrode 19 form a light-emitting unit 21. The first electrode 17 can be an anode, and the second electrode 19 can be a cathode.

[0207] In this way, different light-emitting units 21 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 21 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 7, the light-emitting material layer and the second electrode material layer in each color light-emitting unit 21 of the display panel can be prepared as a whole and then patterned, thereby eliminating the need for a fine metal mask and saving the manufacturing cost of the display panel.

[0208] The display panel also includes a second encapsulation layer 8 and a third encapsulation layer 9. The second encapsulation layer 8 includes a plurality of spaced encapsulation units 81, at least some of which extend from the side of the isolation structure 7 toward the isolation opening 22 to the side of the isolation structure 7 away from the substrate 1.

[0209] The third encapsulation layer 9 is located on the side of the second encapsulation layer 8 away from the substrate 1, and the first encapsulation layer 3 is located on the side of the third encapsulation layer 9 away from the substrate 1.

[0210] Optionally, the materials of the third insulating layer 2, the first encapsulation layer 3, and the second encapsulation layer 8 all include inorganic materials.

[0211] Optionally, the materials of the filler layer 41, the support film layer 6, and the third encapsulation layer 9 include organic materials. When the through-hole 5 is cut, cracks are less likely to form on the filler layer 41 and the support film layer 6.

[0212] During the patterning process of the light-emitting unit 21, the second encapsulation layer 8 is disconnected at the isolation structure 7 to form an encapsulation unit 81. The encapsulation unit 81 can completely and independently encapsulate the corresponding light-emitting unit 21, thereby improving the display characteristics of the display panel.

[0213] For example, the first encapsulation layer 3 and the second encapsulation layer 8 can be formed by chemical vapor deposition (CVD), and the third encapsulation layer 9 can be formed by inkjet printing (IJP).

[0214] Preferably, please see again. Figure 6 The distance H1 from the side of the first encapsulation layer 3 located in the hole area HA away from the substrate 1 is less than the distance H2 from the side of the first encapsulation layer 3 located in the display area AA away from the substrate 1.

[0215] From the boundary between the hole area HA and the display area AA to the via 5, at least part of the first encapsulation layer 3 gradually decreases in distance from the side away from the substrate 1. The first encapsulation layer 3 forms a recessed groove in the hole area HA towards the substrate and is filled by the filling layer 41.

[0216] Preferably, the distance H3 from the side of the filling layer 41 away from the substrate 1 is equal to the distance H2 from the side of the first encapsulation layer 3 located in the display area AA away from the substrate 1.

[0217] The filling layer 41 can completely fill the groove of the first encapsulation layer 3 in the hole area HA, and make the side of the filling layer 41 away from the substrate 1 and the side of the first encapsulation layer 3 located in the display area AA away from the substrate 1 lie on the same plane. In this way, the first insulating layer 10, the second insulating layer 12 and other film layers provided on the filling layer 41 and the side of the first encapsulation layer 3 located in the display area AA away from the substrate 1 can be provided more smoothly.

[0218] Preferably, the orthographic projection of the through-hole 5 on the substrate 1 at least partially overlaps with the orthographic projection of the light-transmitting opening 23 on the substrate 1. In this way, external light passes through the light-transmitting opening 23 and the through-hole 5 to reach the under-screen photosensitive element, thereby enabling the photosensitive element to perform its corresponding function.

[0219] Preferably, please see again. Figure 6 In the display area AA, the display panel also includes a first touch layer 11 and a second touch layer 13 stacked sequentially on the side of the first encapsulation layer 3 away from the substrate 1. The first insulating layer 10 and the second insulating layer 1212 both extend from the hole area HA to the display area AA. The first insulating layer 10 is located between the first encapsulation layer 3 and the first touch layer 11, and the second insulating layer 1212 is located between the first touch layer 11 and the second touch layer 13.

[0220] The first touch layer 11 includes a plurality of first touch electrodes, and the second touch layer 13 includes a plurality of second touch electrodes. For example, the first touch electrodes can be touch receiving electrodes, and the second touch electrodes can be touch transmitting electrodes. The touch function of the display panel can be realized through the first touch electrodes and the second touch electrodes.

[0221] Preferably, the aperture area HA includes a transition area DA, and the display panel also includes a dam 20 located in the transition area DA, with a third encapsulation layer 9 located on the side of the dam 20 close to the display area AA.

[0222] The orthographic projection of the transition region DA on the substrate 1 surrounds the orthographic projection of the via 5 on the substrate 1. The dam 20 can block the material of the third encapsulation layer 9 in the display area AA, so that the material of the third encapsulation layer 9 does not overflow from the display area AA to the via area HA.

[0223] The following are several preferred embodiments of display panels in which through holes 5 are formed in the hole area HA by two cuts.

[0224] In the first implementation, please refer again. Figure 6 The diameters of the through holes 5 located in the support film layer 6, substrate 1, third insulating layer 2 and first encapsulation layer 3 are equal.

[0225] The diameters of the through holes 5 located in the filler layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, and the second optical adhesive layer 16 are equal.

[0226] In this embodiment, a back-cutting method is used. The first cut creates through-holes 5 in the support film layer 6, substrate 1, third insulating layer 2, and first encapsulation layer 3. The second cut creates through-holes 5 in the fill layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, and second optical adhesive layer 16. Since the through-holes 5 in the support film layer 6, substrate 1, third insulating layer 2, and first encapsulation layer 3 are completed in the same cut, the diameters of the through-holes 5 in these layers are equal. This ensures the integrity of the screen encapsulation.

[0227] Since the through hole 5 located in the first encapsulation layer 3 is completed in the first cut and the through hole 5 located in the filling layer 41 is completed in the second cut, the diameter D1 of the through hole 5 located in the first encapsulation layer 3 is greater than the diameter D2 of the through hole 5 located in the filling layer 41.

[0228] Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut and after the filling layer 41, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to develop cracks at the through-holes 5. Moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​This can improve the display quality of the display panel in this embodiment.

[0229] In the second implementation, please refer to Figure 7 The diameters of the through holes 5 located in the second optical adhesive layer 16, polarizer 15, first optical adhesive layer 14, second insulating layer 12 and first insulating layer 10 are equal.

[0230] Preferably, the diameters of the through holes 5 located in the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, and the support film layer 6 are equal.

[0231] In this embodiment, a tangential cutting method is used. The first cut creates through-holes 5 in the second optical adhesive layer 16, polarizer 15, first optical adhesive layer 14, second insulating layer 12, and first insulating layer 10. The second cut creates through-holes 5 in the filler layer 41, first encapsulation layer 3, third insulating layer 2, substrate 1, and support film layer 6. Since the through-holes 5 in the second optical adhesive layer 16, polarizer 15, first optical adhesive layer 14, second insulating layer 12, and first insulating layer 10 are completed in the same cutting process, the diameters of the through-holes 5 in these layers are equal. Similarly, since the through-holes 5 in the filler layer 41, first encapsulation layer 3, third insulating layer 2, substrate 1, and support film layer 6 are completed in the same cutting process, the diameters of the through-holes 5 in these layers are equal, ensuring the integrity of the screen encapsulation.

[0232] Since the through hole 5 located in the first insulating layer 10 is completed in the first cut and the through hole 5 located in the filling layer 41 is completed in the second cut, the diameter D4 of the through hole 5 located in the filling layer 41 is smaller than the diameter D3 of the through hole 5 located in the first insulating layer 10.

[0233] Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut and after the filling layer 41, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to develop cracks at the through-holes 5. Moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​This can improve the display quality of the display panel in this embodiment.

[0234] In the third implementation, please refer to Figure 8 The diameters of the through holes 5 located in the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filler layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, and the support film layer 6 are equal.

[0235] Preferably, the diameter D5 of the through hole 5 located in the second optical adhesive layer 16 is larger than the diameter D6 of the through hole 5 located in the polarizer 15.

[0236] In this embodiment, a tangential cutting method is used. The first cutting creates a through-hole 5 in the second optical adhesive layer 16, and the second cutting creates through-holes 5 in the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filler layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, and the support film layer 6. Since the through-holes 5 in the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filler layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, and the support film layer 6 are completed in the same cutting. Therefore, the diameters of the through-holes 5 in the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filler layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, and the support film layer 6 are equal, and the integrity of the screen can be guaranteed.

[0237] Since the through hole 5 located in the second optical adhesive layer 16 is completed in the first cut and the through hole 5 located in the polarizer 15 is completed in the second cut, the diameter D5 of the through hole 5 located in the second optical adhesive layer 16 is larger than the diameter D6 of the through hole 5 located in the polarizer 15.

[0238] Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut and after the polarizer 15, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to develop cracks at the through-holes 5. Moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​This can improve the display quality of the display panel in this embodiment.

[0239] In the fourth embodiment, please refer to Figure 9a In the hole area HA, the display panel also includes a release film layer 25 located on the side of the second optical adhesive layer 16 away from the substrate 1, and a protective layer 24 located on the side of the support film layer 6 away from the substrate 1. The support film layer 6 and the release film layer 25 are made of organic materials, so that cracks are not easily generated on the support film layer 6 and the release film layer 25 when the through hole 5 is cut.

[0240] Preferably, the diameters of the through holes 5 located in the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25 are equal.

[0241] Preferably, the diameter D7 of the through hole 5 located in the protective layer 24 is larger than the diameter D8 of the through hole 5 located in the support film layer 6.

[0242] In this embodiment, a back-cutting method is used. The first cut creates the through-hole 5 located in the protective layer 24, and the second cut creates the through-hole 5 located in the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25. Since the through-hole 5 located in the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25 are completed in the same cut, the diameters of the through-hole 5 located in the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25 are equal, and the integrity of the module can be guaranteed.

[0243] Since the through hole 5 located in the protective layer 24 is completed in the first cut and the through hole 5 located in the support film layer 6 is completed in the second cut, the diameter D7 of the through hole 5 located in the protective layer 24 is greater than the diameter D8 of the through hole 5 located in the support film layer 6.

[0244] Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut and reaches the support film layer 6, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to develop cracks at the through-holes 5, and moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21. Furthermore, rainbow patterns are less likely to occur in the hole area HA, thereby improving the display quality of the display panel in this embodiment.

[0245] Preferably, please see again. Figure 8 The isolation structure 7 includes a first isolation portion 71 and a second isolation portion 72 stacked sequentially along the direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 71 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 72 on the substrate 1.

[0246] Since the second isolation portion 72 is located on the side of the first isolation portion 71 away from the substrate, and on a plane parallel to the substrate, the lateral width of the second isolation portion 72 is greater than the lateral width of the first isolation portion 71. Therefore, the second isolation portion 72 causes the light-emitting material layer and the second electrode material layer to be disconnected at the isolation structure 7. In this way, the isolation structure 7 formed by the first isolation portion 71 and the second isolation portion 72 makes it easier to independently package each light-emitting unit 21, thereby improving the packaging yield of the display panel.

[0247] Please see again Figure 8The second electrode 19 of the light-emitting unit 21 is electrically connected to the first isolation part 71. The first isolation part 71 includes a conductive material, and the second electrode 19 corresponding to the light-emitting unit 21 extends to contact the side wall of the first isolation part 71 so as to realize the electrical connection between the second electrode 19 corresponding to the light-emitting unit 21 and the first isolation part 71.

[0248] Please see again Figure 9a The isolation structure 7 also includes a third isolation section 73 located on the side of the first isolation section 71 facing the substrate 1, and the second electrode 19 of the light-emitting unit 21 is electrically connected to the third isolation section 73.

[0249] The third isolation section 73 includes a conductive material, and the second electrode 19 corresponding to the light-emitting unit 21 extends to contact the side wall of the third isolation section 73 so as to realize the electrical connection between the second electrode 19 corresponding to the light-emitting unit 21 and the third isolation section 73.

[0250] Specifically, the material of the third isolation portion 73 includes molybdenum; and / or, the material of the first isolation portion 71 includes aluminum; and / or, the material of the second isolation portion 72 includes titanium. Thus, when the isolation structure 7 isolates the second electrode material layer as the second electrode 19, the second electrode 19 is more easily electrically connected to the first isolation portion 71 and / or the third isolation portion 73.

[0251] The orthographic projection of the light-emitting portion 18 onto the substrate is outside the orthographic projection of the third isolation portion 73 and / or the first isolation portion 71 onto the substrate. In this way, the light-emitting portion 18 does not overlap with the isolation structure 7, thereby effectively improving the crosstalk problem between the light-emitting units 21.

[0252] For some possible implementations, please refer to Figure 9b This application also provides another display panel, which includes an aperture region HA and a display region AA surrounding at least a portion of the aperture region HA. In the aperture region HA, the display panel includes a first functional film layer 27, a third insulating layer 2, a first encapsulation layer 3, and a second functional film layer 28.

[0253] The thickness of the second functional film layer 28 is greater than the thickness of the first functional film layer 27, and the third insulating layer 2 is located on one side surface of the first functional film layer 27.

[0254] The first encapsulation layer 3 extends from the display area AA to the hole area HA and is located on the side surface of the third insulating layer 2 away from the first functional film layer 27.

[0255] The second functional film layer 28 is located on the surface of the first encapsulation layer 3 away from the first functional film layer 27.

[0256] Along the thickness direction of the display panel, the hole area HA includes a first sub-through hole 59 and a second sub-through hole 510 that are interconnected. The diameters of the first sub-through hole 59 and the second sub-through hole 510 are different. The third insulating layer 2 and the first encapsulation layer 3 have the first sub-through hole 59. At least a portion of the first functional film layer 27 or at least a portion of the second functional film layer 28 has the second sub-through hole 510.

[0257] In this way, after a certain cutting, the first encapsulation layer 3 and the third insulating layer 2 will not be exposed. Therefore, the stress on the first encapsulation layer 3 and the third insulating layer 2 is small, and it is not easy for the first encapsulation layer 3 and the third insulating layer 2 to crack. This makes it less likely for the light-emitting unit 21 to fail and for rainbow patterns to be generated in the hole area HA, thereby improving the display effect of the display panel.

[0258] For some possible implementations, please refer to Figure 9c The first functional film layer 27 includes a first sub-layer, wherein the first sub-layer is in contact with the side of the third insulating layer 2 near the first functional film layer 27, and the second functional film layer 28 includes a second sub-layer, wherein the second sub-layer is in contact with the side of the first encapsulation layer 3 away from the third insulating layer 2, and at least one of the first sub-layer or the second sub-layer has a first sub-via 59.

[0259] The first sublayer includes a substrate 1, and the second sublayer includes a filling layer 4.

[0260] In this way, after a certain cutting, the first encapsulation layer 3 and the third insulating layer 2 will not be exposed. Therefore, the stress on the first encapsulation layer 3 and the third insulating layer 2 is relatively small, and it is not easy for the first encapsulation layer 3 and the third insulating layer 2 to crack.

[0261] For some possible implementations, please refer to Figure 9d The first functional film layer 27 includes a third sub-layer that is furthest from the third insulating layer 2, and the second functional film layer 28 includes a fourth sub-layer that is furthest from the first encapsulation layer 3.

[0262] At least one of the third and fourth sub-layers has a second sub-via 510.

[0263] In some embodiments, see Figure 9d The third sublayer includes a support film layer 6, and the fourth sublayer includes a second optical adhesive layer 16.

[0264] In other embodiments, please refer to Figure 9e The third sublayer includes a protective layer 24, and the fourth sublayer includes a release film layer 25.

[0265] In this way, after a certain cutting, the first encapsulation layer 3 and the third insulating layer 2 will not be exposed. Therefore, the stress on the first encapsulation layer 3 and the third insulating layer 2 is relatively small, and it is not easy for the first encapsulation layer 3 and the third insulating layer 2 to crack.

[0266] Preferably, the first functional film layer 27 extends to the display area AA, and the display panel further includes an array layer located in the display area AA. The array layer is located between the first functional film layer 27 and the pixel defining layer 26, and the array layer is provided with transistors and capacitors.

[0267] For some possible implementations, please refer to Figure 1 and Figure 10 This application provides a method for manufacturing a display panel, the display panel including an aperture region HA and a display region AA surrounding at least a portion of the aperture region HA, the method comprising:

[0268] S10: Provide substrate 1.

[0269] S11: A third insulating layer 2 is formed on one side of the substrate 1.

[0270] Please see Figure 11 Along the thickness direction Z of substrate 1, a first electrode layer 17, a third insulating layer 2, an isolation structure 7 and a dam 20 are sequentially formed on one side of substrate 1.

[0271] The isolation structure 7 encloses and forms an isolation opening 22 and a light-transmitting opening 23. The isolation opening 22 is located in the display area AA, and the light-transmitting opening 23 is located in the aperture area HA. ​​The third insulating layer 2 located in the display area AA includes a pixel opening 201 that exposes at least a portion of the first electrode 17 of the light-emitting unit 21. The pixel opening 201 is connected to the isolation opening 22. The orthographic projection of the pixel opening 201 on the substrate is located within the orthographic projection of the isolation opening 22 on the substrate. Both the pixel opening 201 and the isolation opening 22 are located in the display area AA, and the dam 20 is located in the aperture area HA.

[0272] Please see Figure 12 A light-emitting unit 21 is at least partially located within the isolation opening 22, and a second encapsulation layer 8 is located on the side of the light-emitting unit 21 away from the substrate 1. The second encapsulation layer 8 includes an encapsulation unit 81.

[0273] S12: A first encapsulation layer 3 is formed on the side of the third insulating layer 2 away from the substrate 1. The first encapsulation layer 3 extends from the display area AA to the hole area HA. ​​The side of the first encapsulation layer 3 close to the substrate 1 contacts the side of the third insulating layer 9 away from the substrate 1.

[0274] Please see Figure 13 A third encapsulation layer 9 is formed on the side of the second encapsulation layer 8 away from the substrate 1, and a first encapsulation layer 3 is formed on the side of the third encapsulation layer 9 away from the substrate 1.

[0275] S13: A panel film layer 4 is formed on the side of the first encapsulation layer 3 away from the substrate 1, and the panel film layer 4 is in contact with the side of the first encapsulation layer 3 away from the substrate 1.

[0276] Please see Figure 14 A filling layer 41, a first insulating layer 10, a first touch layer 11, a second insulating layer 12, a second touch layer 13 and a first optical adhesive layer 14 are sequentially formed on the side of the first encapsulation layer 3 away from the substrate 1.

[0277] The panel film layer 4 includes a filling layer 41 located in the hole area HA, and a first insulating layer 10, a second insulating layer 12 and a first optical adhesive layer 14 extending from the display area AA to the hole area HA.

[0278] Please see Figure 15 A support film layer 6 and a protective layer 24 are sequentially formed on the side of the substrate 1 away from the third insulating layer 2.

[0279] The supporting film layer 6 and the protective layer 24 extend from the display area AA to the hole area HA, and the protective layer 24 protects the supporting film layer 6.

[0280] Please see Figure 16 A polarizer 15, a second optical adhesive layer 16, and a release film layer 25 are sequentially formed on the side of the first optical adhesive layer 14 away from the substrate 1. The polarizer 15, the second optical adhesive layer 16, and the release film layer 25 extend from the display area AA to the aperture area HA.

[0281] S14: Along the thickness direction Z of the substrate 1, at least two interconnected through holes 5 are cut in the hole area HA by a cutting device. The diameters of each through hole 5 are not equal. The diameter of the through hole 5 located in the third insulating layer 2 is equal to the diameter of the through hole 5 located in the first encapsulation layer 3. The diameter of the through hole 5 located in the third insulating layer 2 is greater than or equal to the diameter of the through hole 5 located in the substrate 1. The diameter of the through hole 5 located in the first encapsulation layer 3 is greater than or equal to the diameter of the through hole 5 located in the panel film layer 4.

[0282] The following describes several preferred embodiments of the method for preparing a display panel by forming a through hole 5 in the hole area HA through two cutting operations in step S13.

[0283] In the first implementation method, please refer to Figure 17 Along the thickness direction Z of substrate 1, a first through hole 51 is cut into the protective layer 24 using a cutting device.

[0284] Specifically, the protective layer 24 has a film thickness of 60μm. The first through hole 51 is cut out by cutting 8 to 10 turns on the protective layer 24 using a cutting device with a laser energy of 3W-5W and a cutting speed of 800mm / s-1000mm / s.

[0285] For example, the first through hole 51 can be cut by using a cutting device with a laser energy of 3W and a cutting speed of 800mm / s to cut 8 turns on the protective layer 24; or, the first through hole 51 can be cut by using a cutting device with a laser energy of 4W and a cutting speed of 900mm / s to cut 9 turns on the protective layer 24; or, the first through hole 51 can be cut by using a cutting device with a laser energy of 5W and a cutting speed of 1000mm / s to cut 10 turns on the protective layer 24.

[0286] Please see Figure 18 Along the thickness direction Z of substrate 1, the second through hole 52 is cut sequentially on the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16 and release film layer 25 using a cutting device.

[0287] In this embodiment, the second through hole 52 is equivalent to the first sub-through hole 59 in the above embodiment, and the first through hole 51 is equivalent to the second sub-through hole 510 in the above embodiment.

[0288] Specifically, the overall thickness of the supporting film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, and the film layer located on the first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25 is 381μm. The second through hole 52 is cut out by using a cutting device with a laser energy of 8W-10W and a cutting speed of 1100mm / s-1300mm / s after cutting 65-70 turns on the supporting film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, and the film layer located on the first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16, and release film layer 25.

[0289] For example, by using a cutting device with a laser energy of 8W and a cutting speed of 1100mm / s, a second through hole 52 is cut out after 65 turns on the support film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16 and release film layer 25.

[0290] Alternatively, by using a cutting device with a laser energy of 9W and a cutting speed of 1200mm / s, the second through hole 52 is cut out after 68 turns on the supporting film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16 and release film layer 25.

[0291] Alternatively, by using a cutting device with a laser energy of 10W and a cutting speed of 1300mm / s, the second through hole 52 is cut out after 70 turns on the supporting film layer 6, substrate 1, third insulating layer 2, first encapsulation layer 3, filling layer 41, first insulating layer 10, second insulating layer 12, first optical adhesive layer 14, polarizer 15, second optical adhesive layer 16 and release film layer 25.

[0292] The diameter D8 of the second through hole 52 is smaller than the diameter D7 of the first through hole 51.

[0293] Preferably, the first through hole 51 and the second through hole 52 are coaxially arranged. In this way, the interference of the second cut on the film layer cut in the first cut is smaller.

[0294] This embodiment uses a back-cutting method. Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut at the filling layer 41, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to crack at the through-holes 5. Moisture is less likely to be transmitted from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​It can also ensure the integrity of the module, thereby improving the display quality of the display panel in this embodiment.

[0295] In the second implementation, please refer to Figure 19 Along the thickness direction Z of substrate 1, the third through hole 53 is cut sequentially on the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2 and the first encapsulation layer 3 using a cutting device.

[0296] Specifically, the overall film thickness of the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2, and the first encapsulation layer 3 is 168μm. The third through hole 53 is cut out by using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s after cutting 25-30 times on the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2, and the first encapsulation layer 3.

[0297] For example, by using a cutting device with a laser energy of 5W and a cutting speed of 1000mm / s, the third through hole 53 is cut out after cutting 25 times on the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2 and the first encapsulation layer 3.

[0298] Alternatively, by using a cutting device with a laser energy of 5.5W and a cutting speed of 1050mm / s, the third through hole 53 can be cut out after making 28 cuts on the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2 and the first encapsulation layer 3.

[0299] Alternatively, by using a cutting device with a laser energy of 6W and a cutting speed of 1100mm / s, the third through hole 53 can be cut out after making 30 cuts on the protective layer 24, the support film layer 6, the substrate 1, the third insulating layer 2 and the first encapsulation layer 3.

[0300] Please see Figure 20 Along the thickness direction Z of substrate 1, a fourth through hole 54 is sequentially cut into the filling layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16 and the release film layer 25 using a cutting device.

[0301] In this embodiment, the third through hole 53 is equivalent to the first sub-through hole 59 in the above embodiment, and the fourth through hole 54 is equivalent to the second sub-through hole 510 in the above embodiment.

[0302] Specifically, the overall film thickness of the filler layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16, and the release film layer 25 is 273.6 μm. The fourth through hole 54 is cut out by using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s after cutting 40-50 turns on the filler layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16, and the release film layer 25.

[0303] For example, by using a cutting device with a laser energy of 7W and a cutting speed of 1100mm / s, a fourth through hole 54 is cut out after cutting 40 times on the filling layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16 and the release film layer 25.

[0304] Alternatively, by using a cutting device with a laser energy of 7.5W and a cutting speed of 1150mm / s, the fourth through hole 54 can be cut out after making 45 turns on the filling layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16 and the release film layer 25.

[0305] Alternatively, by using a cutting device with a laser energy of 8W and a cutting speed of 1200mm / s, the fourth through hole 54 can be cut out after making 50 turns on the filling layer 41, the first insulating layer 10, the second insulating layer 12, the first optical adhesive layer 14, the polarizer 15, the second optical adhesive layer 16 and the release film layer 25.

[0306] Please see again Figure 6After the first through hole 51 and the second through hole 52 are cut in the hole area HA, the diameter D2 of the fourth through hole 54 is smaller than the diameter D1 of the third through hole 53.

[0307] Preferably, the third through-hole 53 and the fourth through-hole 54 are coaxially arranged. In this way, the interference of the second cut on the film layer cut in the first cut is smaller.

[0308] This embodiment uses a tangential cutting method. Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut and reaches the filling layer 41, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to crack at the through-holes 5. Moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​It can also ensure the integrity of the screen encapsulation, thereby improving the display quality of the display panel in this embodiment.

[0309] In the third implementation, please refer to Figure 21 Along the thickness direction of the substrate 1, a fifth through hole 55 is sequentially cut into the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer, and the first insulating layer 10 using a cutting device.

[0310] Specifically, the overall film thickness of the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer, and the first insulating layer 10 is 273.6 μm. A fifth through hole 55 is cut out by using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s after cutting 40-50 turns on the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer, and the first insulating layer 10.

[0311] For example, by using a cutting device with a laser energy of 7W and a cutting speed of 1100mm / s, a fifth through hole 55 is cut out after cutting 40 times on the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer and the first insulating layer 10.

[0312] Alternatively, by using a cutting device with a laser energy of 7.5W and a cutting speed of 1150mm / s, a fifth through hole 55 can be cut after making 45 turns on the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer, and the first insulating layer 10.

[0313] Alternatively, by using a cutting device with a laser energy of 8W and a cutting speed of 1200mm / s, the fifth through hole 55 can be cut out after making 50 cuts on the release film layer 25, the second optical adhesive layer 16, the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, and the first insulating layer 10.

[0314] Please see Figure 22 Along the thickness direction Z of substrate 1, a sixth through hole 56 is cut sequentially on the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6 and the protective layer 24 using a cutting device.

[0315] In this embodiment, the sixth through hole 56 is equivalent to the first sub-through hole 59 in the above embodiment, and the fifth through hole 55 is equivalent to the second sub-through hole 510 in the above embodiment.

[0316] Specifically, the overall film thickness of the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24 is 168μm. The sixth through hole 56 is cut by using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s. After cutting 25-30 turns in sequence on the filling layer, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24, the sixth through hole 56 is cut out.

[0317] For example, by using a cutting device with a laser energy of 5W and a cutting speed of 1000mm / s, the sixth through hole 56 is cut out after making 25 cuts in sequence on the filling layer, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6 and the protective layer 24.

[0318] Alternatively, by using a cutting device with a laser energy of 5.5W and a cutting speed of 1050mm / s, the sixth through hole 56 can be cut out by sequentially cutting 28 times on the filling layer, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6 and the protective layer 24.

[0319] Alternatively, by using a cutting device with a laser energy of 6W and a cutting speed of 1100mm / s, the sixth through hole 56 can be cut out by sequentially cutting 30 times on the filling layer, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6 and the protective layer 24.

[0320] Please see Figure 7 After forming the fifth through hole 55 and the sixth through hole 56, the protective layer 24 and the release film layer 25 are removed.

[0321] Preferably, the diameter D4 of the sixth through hole 56 is smaller than the diameter D3 of the fifth through hole 55.

[0322] Preferably, the fifth through hole 55 and the sixth through hole 56 are coaxially arranged. In this way, the interference of the second cut on the film layer cut in the first cut is smaller.

[0323] In the fourth embodiment, please refer to Figure 23 Along the thickness direction Z of substrate 1, a seventh through hole 57 is cut into the release film layer 25 and the second optical adhesive layer 16 using a cutting device.

[0324] Specifically, the overall thickness of the release film layer 25 and the second optical adhesive layer 16 is 255μm. The seventh through hole 57 is cut out by using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s after cutting 30-40 times on the release film layer 25 and the second optical adhesive layer 16.

[0325] For example, by using a cutting device with a laser energy of 7W and a cutting speed of 1100mm / s, the seventh through hole 57 is cut out after 30 rounds of cutting on the release film layer 25 and the second optical adhesive layer 16.

[0326] Alternatively, by using a cutting device with a laser energy of 7.5W and a cutting speed of 1150mm / s, the seventh through hole 57 can be cut out after cutting 35 turns on the release film layer 25 and the second optical adhesive layer 16.

[0327] Alternatively, by using a cutting device with a laser energy of 8W and a cutting speed of 1200mm / s, the seventh through hole 57 can be cut out after cutting 40 times on the release film layer 25 and the second optical adhesive layer 16.

[0328] Please see Figure 24 Along the thickness direction Z of substrate 1, the eighth through hole 58 is cut sequentially on polarizer 15, first optical adhesive layer 14, second insulating layer 12, first insulating layer 10, filling layer 41, first encapsulation layer 3, third insulating layer 2, substrate 1, support film layer 6 and protective layer 24 using a cutting device.

[0329] Specifically, the overall film thickness of the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24 is 186.6 μm. The eighth through hole 58 is cut by using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s. The device cuts 30-40 times in sequence on the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24.

[0330] In this embodiment, the eighth through hole 58 is equivalent to the first sub-through hole 59 in the above embodiment, and the seventh through hole 57 is equivalent to the second sub-through hole 510 in the above embodiment.

[0331] For example, by using a cutting device with a laser energy of 5W and a cutting speed of 1000mm / s, the sixth through hole 56 is cut out by making 30 cuts in sequence on the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24.

[0332] Alternatively, by using a cutting device with a laser energy of 5.5W and a cutting speed of 1050mm / s, the sixth through hole 56 is cut out by making 35 cuts in sequence on the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24.

[0333] Alternatively, by using a cutting device with a laser energy of 6W and a cutting speed of 1100mm / s, the sixth through hole 56 can be cut by making 40 cuts in sequence on the polarizer 15, the first optical adhesive layer 14, the second insulating layer 12, the first insulating layer 10, the filling layer 41, the first encapsulation layer 3, the third insulating layer 2, the substrate 1, the support film layer 6, and the protective layer 24.

[0334] Please see again Figure 8 After forming the seventh through hole 57 and the eighth through hole 58, the protective layer 24 and the release film layer 25 are removed.

[0335] Preferably, the diameter D6 of the eighth through hole 58 is smaller than the diameter D5 of the seventh through hole 57.

[0336] Preferably, the seventh through hole 57 and the eighth through hole 58 are coaxially arranged. In this way, the interference of the second cut on the film layer cut in the first cut is smaller.

[0337] This embodiment uses a tangential cutting method. Since the through-holes 5 located in the third insulating layer 2 and the first encapsulation layer 3 are cut in the same cut, and the cutting stops after the first cut at the polarizer 15, the stress on the third insulating layer 2 and the first encapsulation layer 3 is relatively small during the cutting process. The third insulating layer 2 and the first encapsulation layer 3 are less likely to crack at the through-holes 5. Moisture is less likely to be transferred from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​This also ensures the integrity of the screen and improves the display quality of the display panel in this embodiment.

[0338] In the above embodiments, by cutting through holes 5 in the hole area HA twice using a tangential or back-cutting method from different angles (such as ensuring the integrity of the module, ensuring the integrity of the screen enclosure, and ensuring the integrity of the screen), the stress on the third insulating layer 2 and the first encapsulation layer 3 can be reduced. The third insulating layer 2 and the first encapsulation layer 3 are less likely to crack at the through hole 5. Moisture is less likely to be transmitted from the third insulating layer 2 and the first encapsulation layer 3 in the hole area HA to the light-emitting unit 21, and rainbow patterns are less likely to occur in the hole area HA. ​​This can improve the display quality of the display panel in this embodiment.

[0339] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method described in this application, and further includes a photosensitive device located in the aperture area. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, it is less prone to rainbow-like patterns and has better display quality.

[0340] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0341] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes a hole area and a display area surrounding at least a portion of the hole area, wherein the display panel includes: First functional membrane layer; The third insulating layer is located on one side surface of the first functional film layer; The first encapsulation layer extends from the display area to the hole area and is located on the side surface of the third insulating layer away from the first functional film layer; The second functional film layer is located on the surface of the first encapsulation layer away from the first functional film layer; Along the thickness direction of the display panel, the hole area includes a first sub-through hole and a second sub-through hole that are interconnected. The first sub-through hole and the second sub-through hole have different diameters. The third insulating layer and the first encapsulation layer have the first sub-through hole, and at least a portion of the first functional film layer or at least a portion of the second functional film layer has the second sub-through hole.

2. The display panel according to claim 1, characterized in that, The first functional film layer includes a first sub-layer, wherein the first sub-layer is in contact with the side of the third insulating layer near the first functional film layer, and the second functional film layer includes a second sub-layer, wherein the second sub-layer is in contact with the side of the first encapsulation layer away from the third insulating layer, and at least one of the first sub-layer or the second sub-layer has a first sub-via. Preferably, the first sublayer includes a substrate; Preferably, the second sub-layer includes a filling layer; Preferably, the distance from the side of the first encapsulation layer located in the hole area away from the substrate to the substrate is less than the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate; Preferably, the distance from the side of the filling layer away from the substrate to the substrate is equal to the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate; Preferably, the material of the filler layer includes organic materials; Preferably, the material of the third insulating layer includes inorganic materials; Preferably, the material of the first encapsulation layer includes inorganic materials.

3. The display panel according to claim 1, characterized in that, The first functional film layer includes a third sub-layer that is furthest from the third insulating layer, and the second functional film layer includes a fourth sub-layer that is furthest from the first encapsulation layer; Wherein, at least one of the third sub-layer and the fourth sub-layer has the second sub-via; Preferably, the third sub-layer includes a support film layer or a protective layer; Preferably, the fourth sub-layer comprises a second optical adhesive layer or a release film layer; Preferably, the thickness of the second functional film layer is greater than the thickness of the first functional film layer; Preferably, the material of the supporting membrane layer includes organic materials; Preferably, the material of the protective layer includes organic materials.

4. The display panel according to claim 1, characterized in that, The third insulating layer extends to the display area and has multiple openings in the display area, with light-emitting units disposed within the openings; Preferably, the display panel includes a pixel defining layer, and the pixel defining layer and the third insulating layer are disposed in the same layer and of the same material; Preferably, the first functional film layer extends to the display area, and the display panel further includes an array layer located in the display area, the array layer being located between the first functional film layer and the pixel defining layer, and the array layer being provided with transistors and capacitors.

5. A display panel, characterized in that, The display panel includes a hole area and a display area surrounding at least a portion of the hole area, wherein the display panel includes: Substrate; A third insulating layer is located on one side surface of the substrate; A first encapsulation layer extends from the display area to the aperture area and is located on the surface of the third insulating layer away from the substrate. The side of the first encapsulation layer close to the substrate is in contact with the side of the third insulating layer away from the substrate. A panel film layer is located on the surface of the first encapsulation layer away from the substrate; Along the thickness direction of the substrate, the hole region includes at least two interconnected vias, each with a different diameter, and the diameter of the via located in the third insulating layer is equal to the diameter of the via located in the first encapsulation layer.

6. The display panel according to claim 5, characterized in that, The diameter of the via located in the third insulating layer is greater than or equal to the diameter of the via located in the substrate; or, the diameter of the via located in the first encapsulation layer is greater than or equal to the diameter of the via in the panel film layer; Preferably, the third insulating layer extends to the display area and has multiple openings in the display area, with light-emitting units disposed within the openings; Preferably, the display panel includes a pixel defining layer, and the pixel defining layer and the third insulating layer are disposed in the same layer and of the same material; Preferably, the diameter of at least one of the vias located in the substrate and the vias located in the panel film layer is the same as the diameter of the via located in the first encapsulation layer.

7. The display panel according to claim 5, characterized in that, In the hole region, the panel film layer includes a filling layer, and the diameter of the through hole located in the first encapsulation layer is greater than or equal to the diameter of the through hole located in the filling layer; Preferably, the display panel further includes a first insulating layer, a second insulating layer, a first optical adhesive layer, a polarizer and a second optical adhesive layer, which are sequentially stacked in the direction away from the substrate of the filling layer, and a support film layer located on the side of the substrate away from the third insulating layer; Preferably, the distance from the side of the first encapsulation layer located in the hole area away from the substrate to the substrate is less than the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate; Preferably, the distance from the side of the filling layer away from the substrate to the substrate is equal to the distance from the side of the first encapsulation layer located in the display area away from the substrate to the substrate; Preferably, the material of the filler layer includes organic materials; Preferably, the material of the third insulating layer includes inorganic materials; Preferably, the material of the first encapsulation layer includes inorganic materials; Preferably, the material of the supporting membrane layer includes organic materials.

8. The display panel according to claim 7, characterized in that, The diameters of the vias located in the supporting film layer, the substrate, the third insulating layer, and the first encapsulation layer are equal; Preferably, the diameters of the through holes located in the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, and the second optical adhesive layer are equal; Preferably, the diameter of the through-hole located in the first encapsulation layer is larger than the diameter of the through-hole located in the filler layer.

9. The display panel according to claim 7, characterized in that, The diameters of the through holes located in the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer are equal; Preferably, the diameters of the vias located in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, and the support film layer are equal; Preferably, the diameter of the through hole located in the filling layer is smaller than the diameter of the through hole located in the first insulating layer.

10. The display panel according to claim 7, characterized in that, The diameters of the through holes located in the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filling layer, the first encapsulation layer, the third insulating layer, the substrate, and the support film layer are equal. Preferably, the diameter of the through hole located in the second optical adhesive layer is larger than the diameter of the through hole located in the polarizer.

11. The display panel according to claim 7, characterized in that, In the hole area, the display panel further includes a release film layer located on the side of the second optical adhesive layer away from the substrate, and a protective layer located on the side of the support film layer away from the substrate; Preferably, the diameters of the through holes located in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the fill layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer and the second optical adhesive layer, and the release film layer are equal; Preferably, the diameter of the through hole in the protective layer is larger than the diameter of the through hole in the supporting film layer; Preferably, the material of the protective layer includes organic materials.

12. The display panel according to claim 7, characterized in that, The third insulating layer extends from the hole area to the display area, and the display panel further includes: An isolation structure is located on the side of the third insulating layer away from the substrate. The isolation structure encloses and forms an isolation opening and a light-transmitting opening. The isolation opening is located in the display area, and the light-transmitting opening is located in the aperture area. Preferably, the orthographic projection of the through hole on the substrate at least partially overlaps with the orthographic projection of the light-transmitting opening on the substrate; Preferably, in the display area, the display panel further includes a first touch layer and a second touch layer stacked sequentially on the side of the first encapsulation layer away from the substrate, the first insulating layer and the second insulating layer both extending from the hole area to the display area, the first insulating layer being located between the first encapsulation layer and the first touch layer, and the second insulating layer being located between the first touch layer and the second touch layer.

13. The display panel according to claim 12, characterized in that, The display panel also includes: The light-emitting unit is at least partially located within the isolation opening; A second encapsulation layer, the second encapsulation layer including a plurality of spaced-apart encapsulation units, at least a portion of the encapsulation units extending from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate; Preferably, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the substrate, and the first encapsulation layer is located on the side of the third encapsulation layer away from the substrate; Preferably, the aperture area includes a transition area, the display panel further includes a dam located in the transition area, and the third encapsulation layer is located on the side of the dam closer to the display area; Preferably, both the first encapsulation layer and the second encapsulation layer are made of inorganic materials; Preferably, the material of the third encapsulation layer includes organic materials; Preferably, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the substrate, wherein the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum; and / or, the material of the first isolation portion includes aluminum; and / or, the material of the second isolation portion includes titanium.

14. A method for manufacturing a display panel, characterized in that, The display panel includes a hole area and a display area surrounding at least a portion of the hole area, the method comprising: Provide substrate; A third insulating layer is formed on one side of the substrate; A first encapsulation layer is formed on the side of the third insulating layer away from the substrate. The first encapsulation layer extends from the display area to the hole area. The side of the first encapsulation layer near the substrate contacts the side of the third insulating layer away from the substrate. A panel film layer is formed on the side of the first encapsulation layer away from the substrate; Along the thickness direction of the substrate, at least two interconnected through holes are cut in the hole area using a cutting device. The diameters of each through hole are not equal, and the diameter of the through hole located in the third insulating layer is equal to the diameter of the through hole located in the first encapsulation layer.

15. The method for manufacturing a display panel according to claim 14, characterized in that, Prior to the step of cutting at least two interconnected through holes in the hole area using a cutting device, the method further includes: A filler layer, a first insulating layer, a second insulating layer, and a first optical adhesive layer are sequentially formed on the side of the first encapsulation layer away from the substrate; A support film layer and a protective layer are sequentially formed on the side of the substrate away from the third insulating layer; A polarizer, a second optical adhesive layer, and a release film are sequentially formed on the side of the first optical adhesive layer away from the substrate; Preferably, the diameter of the via in the third insulating layer is greater than or equal to the diameter of the via in the substrate; or, the diameter of the via in the first encapsulation layer is greater than or equal to the diameter of the via in the panel film layer.

16. The method for manufacturing a display panel according to claim 15, characterized in that, The step of cutting at least two interconnected through holes in the hole area using a cutting device includes: A first through hole is cut into the protective layer along the thickness direction of the substrate using a cutting device; Along the thickness direction of the substrate, a second through hole is sequentially cut into the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device. Preferably, the step of cutting the first through hole in the protective layer using a cutting device includes: The first through hole is cut by using a cutting device with a laser energy of 3W-5W and a cutting speed of 800mm / s-1000mm / s to cut 8-10 turns on the protective layer; Preferably, the step of sequentially cutting the second through-hole in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device includes: Using a cutting device with a laser energy of 8W-10W and a cutting speed of 1100mm / s-1300mm / s, a second through hole is cut after 65-70 turns on the supporting film layer, the substrate, the third insulating layer, the first encapsulation layer, the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer; Preferably, after the step of sequentially cutting the second through-hole in the support film layer, the substrate, the third insulating layer, the first encapsulation layer, the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device, the method further includes: Remove the protective layer and the release film layer; Preferably, the diameter of the second through hole is smaller than the diameter of the first through hole; Preferably, the first through hole and the second through hole are coaxially arranged.

17. The method for manufacturing a display panel according to claim 15, characterized in that, The step of cutting at least two interconnected through holes in the hole area using a cutting device includes: Along the thickness direction of the substrate, a third through-hole is sequentially cut into the protective layer, the support film layer, the substrate, the third insulating layer, and the first encapsulation layer using a cutting device; Along the thickness direction of the substrate, a fourth through hole is sequentially cut into the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer using a cutting device; Preferably, the step of sequentially cutting a third through-hole in the protective layer, the support film layer, the substrate, the third insulating layer, and the first encapsulation layer using a cutting device includes: The third through hole is cut by using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s after cutting 25-30 turns on the protective layer, the support film layer, the substrate, the third insulating layer and the first encapsulation layer. Preferably, the step of sequentially cutting a fourth through hole in the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer, and the release film layer using a cutting device includes: Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, a fourth through hole is cut after 40-50 turns on the filling layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer. Preferably, after the step of cutting the fourth through hole sequentially on the filler layer, the first insulating layer, the second insulating layer, the first optical adhesive layer, the polarizer, the second optical adhesive layer and the release film layer using a cutting device, the method further includes: removing the protective layer and the release film layer; Preferably, the diameter of the fourth through hole is smaller than the diameter of the third through hole; Preferably, the third through hole and the fourth through hole are coaxially arranged.

18. The method for manufacturing a display panel according to claim 15, characterized in that, The step of cutting at least two interconnected through holes in the hole area using a cutting device includes: Along the thickness direction of the substrate, a fifth through hole is sequentially cut into the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer using a cutting device. Along the thickness direction of the substrate, a sixth through hole is sequentially cut into the fill layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device; Preferably, the step of sequentially cutting a fifth through hole in the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer, and the first insulating layer using a cutting device includes: Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, the fifth through hole is cut after 40-50 turns on the release film layer, the second optical adhesive layer, the polarizer, the first optical adhesive layer, the second insulating layer and the first insulating layer. Preferably, the step of sequentially cutting a sixth through-hole in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device includes: Using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s, the sixth through hole is cut after making 25-30 turns in sequence on the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer and the protective layer. Preferably, after the step of sequentially cutting the sixth through-hole in the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device, the method further includes: Remove the protective layer and the release film layer; Preferably, the diameter of the sixth through hole is smaller than the diameter of the fifth through hole; Preferably, the fifth through hole and the sixth through hole are coaxially arranged.

19. The method for manufacturing a display panel according to claim 15, characterized in that, The step of cutting at least two interconnected through holes in the hole area using a cutting device includes: Along the thickness direction of the substrate, a seventh through hole is cut into the release film layer and the second optical adhesive layer using a cutting device; Along the thickness direction of the substrate, an eighth through hole is sequentially cut into the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device. Preferably, the step of cutting the seventh through hole in the release film layer and the second optical adhesive layer using a cutting device includes: Using a cutting device with a laser energy of 7W-8W and a cutting speed of 1100mm / s-1200mm / s, the seventh through hole is cut out after 30-40 turns on the release film layer and the second optical adhesive layer. Preferably, the step of sequentially cutting an eighth through-hole on the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device includes: Using a cutting device with a laser energy of 5W-6W and a cutting speed of 1000mm / s-1100mm / s, the eighth through hole is cut by making 30-40 cuts in sequence on the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filling layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer. Preferably, after the step of sequentially cutting the eighth through-hole into the polarizer, the first optical adhesive layer, the second insulating layer, the first insulating layer, the filler layer, the first encapsulation layer, the third insulating layer, the substrate, the support film layer, and the protective layer using a cutting device, the method further includes: Remove the protective layer and the release film layer; Preferably, the diameter of the eighth through hole is smaller than the diameter of the seventh through hole; Preferably, the seventh through hole and the eighth through hole are coaxially arranged.

20. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-13, or a display panel prepared by the method for preparing a display panel as described in any one of claims 14-19, and further includes a photosensitive device located in the aperture region.

Images