Light emitting substrate and method of manufacturing the same

Abstract

A light emitting substrate is provided. The light-emitting substrate comprises: a substrate; the one or more bonding pads are positioned on the substrate; the one or more insulating layers are located on the sides, away from the substrate, of the one or more bonding pads, and one or more via holes penetrating through the one or more insulating layers are formed in the areas of the one or more bonding pads; the one or more solders are positioned on one side, far away from the substrate, of the one or more bonding pads; and a light emitting element bound to the one or more pads by at least one or more solders located in at least a partial region of the one or more vias. The pad includes a first body and a respective first portion connected to the first body.

Description

Technical Field

[0001] This invention relates to display technology, and more particularly to light-emitting substrates and methods for manufacturing light-emitting substrates. Background Technology

[0002] Soldering light-emitting diodes (LEDs) onto a substrate involves using molten solder to establish a strong connection between the LED and the surface to which it is attached. These connections enable the LED to efficiently transfer power and manage heat effectively. This is essential for the reliable operation of LEDs in a wide range of applications. As LED technology continues to advance, soldering remains a critical aspect of its assembly process, playing a key role in achieving consistent high-quality production across a variety of LED devices. Summary of the Invention

[0003] On one hand, this disclosure provides a light-emitting substrate, comprising: a substrate; one or more pads located on the substrate; one or more insulating layers located on a side of the one or more pads away from the substrate, wherein regions of the one or more pads have one or more vias penetrating the one or more insulating layers; one or more solders located on a side of the one or more pads away from the substrate; and a light-emitting element bonded to the one or more pads via at least the one or more solders located in at least a portion of the one or more vias; wherein the pads include a first body and a corresponding first portion connected to the first body; the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the first body on the substrate; and the orthographic projection of the corresponding first portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0004] Optionally, the solder includes a second body and a corresponding second portion connected to the second body; the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the second body on the substrate; and the orthographic projection of the corresponding second portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0005] Optionally, the via includes a main portion and an additional portion connected to the main portion; the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the main portion on the substrate; and the orthographic projection of the additional portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0006] Optionally, in the region having the one or more pads, a protective layer is further included on the side of the one or more pads away from the substrate; wherein the protective layer includes one or more protective blocks; the solder is in direct contact with a corresponding protective block among the one or more protective blocks; and the corresponding protective block is in direct contact with a corresponding pad among the one or more pads.

[0007] Optionally, the corresponding protective block includes a third body and a corresponding third portion connected to the third body; the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the third body on the substrate; and the orthographic projection of the corresponding third portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0008] Optionally, the one or more protective blocks are made of a material different from the one or more pads.

[0009] Optionally, the corresponding first portion has a first rectangular shape along a cross section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate.

[0010] Optionally, the first body has a second rectangular shape along a cross-section of a plane intersecting the first body and the corresponding first portion and parallel to the surface of the substrate, the second rectangular shape having a second width and a second length; the first rectangular shape has a first width and a first length; the first width is along a direction substantially parallel to the second width; the first length is along a direction substantially parallel to the second length; the first width is greater than or equal to half of the second width and less than or equal to the second width; and the first length is greater than or equal to one-fifth of the second length and less than or equal to one-third of the second length.

[0011] Optionally, the corresponding first portion has a partially circular shape along a cross section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate.

[0012] Optionally, the first body has a rectangular shape along a cross-section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate, the rectangular shape having a width and a length; and the radius of the partial circular shape is greater than or equal to one-eighth of the length and less than or equal to one-sixth of the length.

[0013] Optionally, the corresponding first portion includes a first sub-part and a second sub-part connected to the first sub-part; the second sub-part is located on the side of the first sub-part away from the first body; the second sub-part, the first sub-part, and the first body are arranged along a first direction; along a direction perpendicular to the first direction, the first sub-part has a first maximum width, the second sub-part has a second maximum width; and the first maximum width is greater than the second maximum width.

[0014] Optionally, the first main body and the corresponding first part are part of an integral structure.

[0015] Optionally, the light-emitting substrate further includes one or more signal lines; wherein each pad and the corresponding signal line among the one or more signal lines are part of an integral structure.

[0016] Optionally, each pad has substantially mirror symmetry with respect to a plane perpendicular to the surface of the substrate and intersecting the respective first portion and the first body.

[0017] Optionally, the light-emitting substrate further includes an adhesive layer located on the side of the one or more pads near the substrate; wherein the one or more pads are in direct contact with the adhesive layer.

[0018] On the other hand, this disclosure provides a method for manufacturing a light-emitting substrate, comprising: forming one or more pads on a substrate; forming one or more insulating layers on a side of the one or more pads away from the substrate, wherein a region of the one or more pads has one or more vias penetrating the one or more insulating layers; forming one or more solders on the side of the one or more pads away from the substrate; and bonding a light-emitting element to the one or more pads by at least the one or more solders located in at least a portion of the one or more vias; wherein the pad includes a first body and a corresponding first portion connected to the first body; the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the first body on the substrate; and the orthographic projection of the corresponding first portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0019] Optionally, the method further includes: determining whether the light-emitting element is aligned with respect to the one or more pads; wherein the one or more pads include two first portions; and the orthographic projections of the two first portions on the substrate are located on opposite sides of the orthographic projection of the light-emitting element on the substrate; wherein the method further includes: determining that the light-emitting element is not aligned with respect to the one or more pads when it is determined that the orthographic projection of the light-emitting element on the substrate completely covers the orthographic projection of one or both first portions on the substrate.

[0020] Optionally, forming the one or more insulating layers includes: forming one or more insulating material layers on the side of the one or more pads away from the substrate; and forming one or more vias extending through the one or more insulating material layers, thereby forming the one or more insulating layers and exposing the surface of the one or more pads.

[0021] Optionally, forming the via includes: forming a main portion and an additional portion connected to the main portion; the orthographic projection of the light-emitting element on the substrate substantially covering the orthographic projection of the main portion on the substrate; and the orthographic projection of the additional portion on the substrate substantially not overlapping the orthographic projection of the light-emitting element on the substrate.

[0022] Optionally, the method further includes: forming a protective layer on the side of the one or more pads away from the substrate in the region having the one or more pads; wherein forming the protective layer includes: forming one or more protective blocks; wherein the solder is in direct contact with a corresponding protective block among the one or more protective blocks; and the corresponding protective block is in direct contact with a corresponding pad among the one or more pads. Attached Figure Description

[0023] The following figures are merely illustrative examples based on various disclosed embodiments and are not intended to limit the scope of the invention.

[0024] Figure 1 This is a schematic diagram showing the structure of the relevant light-emitting substrate.

[0025] Figure 2 This is a schematic diagram showing a light-emitting element bonded to a relevant light-emitting substrate.

[0026] Figure 3 Optical detection of a light-emitting element bonded to a light-emitting substrate according to some embodiments of the present disclosure is shown.

[0027] Figure 4 It is along Figure 3 A cross-sectional view of line A-A' in the diagram.

[0028] Figure 5 It is along Figure 3 A cross-sectional view of line B-B' in the diagram.

[0029] Figure 6 The structure of a portion of a light-emitting substrate having light-emitting elements bonded to a light-emitting substrate is shown in some embodiments of the present disclosure.

[0030] Figure 7 It is along Figure 6 A cross-sectional view of the C-C' line in the diagram.

[0031] Figure 8 It is along Figure 6 A cross-sectional view of the D-D' line in the diagram.

[0032] Figure 9 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0033] Figure 10 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0034] Figure 11 It is a stack of one or more pads, one or more solders, and light-emitting elements bonded to one or more pads by one or more solders according to some embodiments of this disclosure.

[0035] Figure 12 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0036] Figure 13 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0037] Figure 14 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0038] Figure 15 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0039] Figure 16 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0040] Figure 17 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure.

[0041] Figure 18 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0042] Figure 19 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0043] Figure 20 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0044] Figure 21 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0045] Figure 22 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0046] Figure 23 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0047] Figure 24 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0048] Figure 25 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0049] Figure 26 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0050] Figure 27 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0051] Figure 28 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0052] Figure 29 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure.

[0053] Figure 30This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0054] Figure 31 This is a plan view of one or more insulating layers in a light-emitting substrate according to some embodiments of the present disclosure.

[0055] Figure 32 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0056] Figure 33 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0057] Figure 34 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0058] Figure 35 Optical detection of a light-emitting element bonded to a light-emitting substrate according to some embodiments of the present disclosure is shown.

[0059] Figure 36 It is along Figure 35 A cross-sectional view of the E-E' line in the diagram.

[0060] Figure 37 It is along Figure 35 A cross-sectional view of line F-F' in the diagram.

[0061] Figure 38 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0062] Figure 39 This is a schematic diagram illustrating the structure of one or more protection blocks according to some embodiments of the present disclosure.

[0063] Figure 40 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure.

[0064] Figure 41 It is a stack of one or more pads, one or more guard blocks, one or more solders, and light-emitting elements bonded to one or more pads by one or more solders, according to some embodiments of this disclosure. Detailed Implementation

[0065] This disclosure will now be described in more detail with reference to the following embodiments. It should be noted that the following description of some embodiments presented herein is for illustrative and descriptive purposes only. It is not exhaustive or limited to the precise forms disclosed.

[0066] Figure 1This is a schematic diagram showing the structure of the relevant light-emitting substrate. Figure 2 This is a schematic diagram showing a light-emitting element bonded to a relevant light-emitting substrate. (Refer to...) Figure 1 and Figure 2 In some embodiments, the light-emitting substrate includes one or more pads SP configured to be soldered to one or more contact pads of a light-emitting element. The one or more pads SP are connected to one or more signal lines. In one example, the one or more signal lines include a first signal line SL1 and a second signal line SL2. (Refer to...) Figure 2 The light-emitting element (LED) is bonded to one or more solder pads (SPs). During the manufacturing process of the relevant display panel, the orthographic projection of the LED onto the substrate completely overlaps with the orthographic projection of one or more solder pads (SPs) onto the substrate. Therefore, the soldering status of the LED cannot be observed after reflow soldering through automated optical inspection. During the manufacturing process of the relevant display panel, there is a risk that the LED may experience solder voids or insufficient wetting due to insufficient solder. This leads to problems such as LED failure due to poor soldering during subsequent use or dependency, affecting production yield and customer satisfaction.

[0067] Therefore, this disclosure particularly provides a light-emitting substrate and a method for manufacturing a light-emitting substrate, which substantially eliminates one or more problems caused by the limitations and disadvantages of the prior art. In one aspect, this disclosure provides a light-emitting substrate. In some embodiments, the light-emitting substrate includes: a substrate; one or more pads located on the substrate; one or more insulating layers located on a side of the one or more pads away from the substrate, wherein regions of the one or more pads have one or more vias penetrating the one or more insulating layers; one or more solders located on a side of the one or more pads away from the substrate; and a light-emitting element bonded to the one or more pads by at least one or more solders located in at least a portion of the one or more vias. Optionally, the pad includes a first body and a corresponding first portion connected to the first body. Optionally, the orthographic projection of the light-emitting element on the substrate substantially overlaps the orthographic projection of the first body on the substrate. Optionally, the orthographic projection of the corresponding first portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

[0068] Figure 3 Optical detection of a light-emitting element bonded to a light-emitting substrate according to some embodiments of the present disclosure is shown. Figure 4 It is along Figure 3 Cross-sectional view of line A-A' in the middle. Figure 5 It is along Figure 3 Cross-sectional view of line B-B'. (Refer to...) Figures 3 to 5When performing optical inspection on light-emitting elements bonded to a light-emitting substrate, white paint (WO) is applied to the surface of the substrate, leaving an opening where the white paint is not present. A lens (LEN) is placed over the white paint and covers the opening to allow optical inspection of the bonding between the light-emitting element (LED) and the substrate.

[0069] In one particular example, the edge of the white paint (WO) surrounding the window is spaced more than 50 μm away from the LED to allow sufficient manufacturing margin, for example, to prevent the white paint from contaminating one or more pads (SP) and to prevent the white paint from interfering with the bonding of the LED to the substrate.

[0070] In some embodiments, the light-emitting substrate includes: a substrate BS; a buffer layer BUF located on the substrate BS; one or more signal lines (e.g., a first signal line SL1 and a second signal line SL2) and one or more pads SP located on the side of the buffer layer BUF away from the substrate BS, the one or more pads SP being connected to the one or more signal lines; a passivation layer PVX located on the side of the one or more signal lines away from the substrate BS; and an overcoat layer OC located on the side of the passivation layer PVX away from the substrate BS.

[0071] In some embodiments, regions of one or more pads SP have one or more vias penetrating one or more insulating layers on the side of one or more pads SP away from the substrate BS. In one example, the light-emitting substrate includes a passivation layer PVX and a cladding layer OC located on the side of one or more pads SP away from the substrate BS, and one or more vias are formed through the passivation layer PVX and the cladding layer OC.

[0072] In some embodiments, one or more solder SDs are disposed on the side of one or more pads SP away from the substrate BS. The solder SDs are in direct contact with the corresponding pads in the one or more pads SPs.

[0073] In some embodiments, the light-emitting element (LED) is bonded to one or more pads (SP) via one or more solder SDs. The LED is in direct contact with the one or more solder SDs. In one example, one or more contact pads of the LED are bonded to one or more pads (SP) via one or more solder SDs located in at least a portion of one or more vias. In another example, one or more contact pads of the LED include N-contact pads and P-contact pads. The contact pads are in direct contact with the corresponding solder in one or more solder SDs.

[0074] In some embodiments, the orthographic projection of one or more pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0075] In some embodiments, the orthographic projection of one or more first portions of one or more pads SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding first portion of the pad SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0076] In some embodiments, the orthographic projection of one or more solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0077] In some embodiments, the orthographic projection of one or more second portions of one or more solder SDs onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding second portion of the solder SD onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0078] The inventors of this disclosure have discovered that, because the orthographic projection of one or more first portions of one or more pads SP onto the substrate BS does not at least partially overlap (e.g., not overlap at all) with the orthographic projection of the light-emitting element LED onto the substrate BS, during the process of bonding the light-emitting element LED to one or more pads SP, one or more second portions of one or more solder SD extend into the area corresponding to one or more first portions of one or more pads SP. During optical inspection of the bonding between the light-emitting element LED and the light-emitting substrate, if no solder is detected on one or more first portions of one or more pads SP, it indicates that the bonding between the light-emitting element LED and the light-emitting substrate may be defective. The optical inspection system can intervene and prevent defective products from continuing downstream, thereby avoiding waste of manpower and materials. The inventors of this disclosure have discovered that by setting up this unique structure, production efficiency can be significantly improved.

[0079] Various suitable embodiments can be practiced in this disclosure to form one or more pads SP. In some embodiments, the pads SP and signal lines are part of an integral structure. For example, a first pad and a first signal line SL1 in one or more pads SP are part of a first integral structure; and / or, a second pad and a second signal line SL2 in one or more pads SP are part of a second integral structure. Optionally, the individual pads and individual signal lines may be formed using the same conductive material in the same manufacturing process. Optionally, one or more pads SP and one or more signal lines are formed using the same conductive material in the same manufacturing process.

[0080] In an alternative embodiment, at least one of the one or more pads SP is formed separately from one or more signal lines. Optionally, at least one of the one or more pads SP is formed using a different material than the one or more signal lines. The pad SP is connected to a corresponding signal line among the one or more signal lines.

[0081] Various suitable implementations can be practiced in this disclosure to form one or more solder SDs. In some embodiments, one or more solder SDs are first deposited on a light-emitting element (LED), and the LED with the one or more solder SDs attached is bonded to one or more pads SP on a light-emitting substrate. In alternative embodiments, one or more solder SDs are first deposited on one or more pads SP, and the LED is bonded to one or more pads SP with the one or more solder SDs attached.

[0082] Various suitable light-emitting elements can be used in this disclosure. Examples of suitable light-emitting elements include light-emitting diodes, such as miniature light-emitting diodes and micro-light-emitting diodes. In one example, the light-emitting element LED is a miniature light-emitting diode.

[0083] Figure 6 The structure of a portion of a light-emitting substrate having light-emitting elements bonded to a light-emitting substrate is shown in some embodiments of the present disclosure. Figure 7 It is along Figure 6 A cross-sectional view of the C-C' line in the diagram. Figure 8 For along Figure 6 A cross-sectional view of line D-D' in the diagram. (Refer to...) Figures 6 to 8In some embodiments, the light-emitting substrate includes: a substrate BS; a buffer layer BUF located on the substrate BS; one or more signal lines (e.g., a first signal line SL1 and a second signal line SL2) and one or more pads SP located on the side of the buffer layer BUF away from the substrate BS, the one or more pads SP being connected to the one or more signal lines; and one or more insulating layers located on the side of the one or more signal lines away from the substrate BS. Optionally, the one or more insulating layers include a passivation layer PVX located on the side of the one or more signal lines away from the substrate BS, and a cladding layer OC located on the side of the passivation layer PVX away from the substrate BS.

[0084] In some embodiments, regions of one or more pads SP have one or more vias penetrating one or more insulating layers on the side of one or more pads SP away from the substrate BS. In one example, the light-emitting substrate includes a passivation layer PVX and a cladding layer OC located on the side of one or more pads SP away from the substrate BS, and one or more vias are formed through the passivation layer PVX and the cladding layer OC.

[0085] In some embodiments, one or more solder SDs are disposed on the side of one or more pads SP away from the substrate BS. The solder SDs are in direct contact with the corresponding pads in the one or more pads SPs.

[0086] In some embodiments, the light-emitting element (LED) is bonded to one or more pads (SP) via one or more solder SDs. The LED is in direct contact with the one or more solder SDs. In one example, one or more contact pads of the LED are bonded to one or more pads (SP) via one or more solder SDs located in at least a portion of one or more vias. In another example, one or more contact pads of the LED include N-contact pads and P-contact pads. The contact pads are in direct contact with the corresponding solder in the one or more solder SDs.

[0087] In some embodiments, the orthographic projection of one or more pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0088] In some embodiments, the orthographic projection of one or more first portions of one or more pads SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding first portion of the pad SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0089] In some embodiments, the orthographic projection of one or more solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0090] In some embodiments, the orthographic projection of one or more second portions of one or more solder SDs onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding second portion of the solder SD onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0091] In some embodiments, pads SP and signal lines are part of an integral structure. For example, a first pad and a first signal line SL1 in one or more pads SP are part of a first integral structure; and / or, a second pad and a second signal line SL2 in one or more pads SP are part of a second integral structure. Optionally, the individual pads and individual signal lines may be formed using the same conductive material in the same manufacturing process. Optionally, one or more pads SP and one or more signal lines may be formed using the same conductive material in the same manufacturing process.

[0092] In an alternative embodiment, at least one of the one or more pads SP is formed separately from one or more signal lines. Optionally, at least one of the one or more pads SP is formed using a different material than the one or more signal lines. The pad SP is connected to a corresponding signal line among the one or more signal lines.

[0093] Figure 9 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure. (Refer to...) Figure 9In some embodiments, the pad includes a first body MB1 and a corresponding first portion P1 connected to the first body MB1. Optionally, the first body MB1 and the corresponding first portion P1 are part of an integral structure. Optionally, the first body MB1 has a regular polygonal shape (i.e., one cross-section of the first body MB1 has a regular polygonal shape along a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate), such as a rectangular or square shape. Optionally, the corresponding first portion P1 extends from one side of the first body MB1.

[0094] Figure 10 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 10 In some embodiments, the solder includes a second body MB2 and a corresponding second portion P2 connected to the second body MB2. Optionally, the second body MB2 and the corresponding second portion P2 are part of an integral structure. Optionally, the second body MB2 has a regular polygonal shape, such as a rectangle or square shape, in its cross-section along a plane intersecting the second body MB2 and the corresponding second portion P2 and parallel to the surface of the substrate. Optionally, the corresponding second portion P2 extends from one side of the second body MB2.

[0095] Figure 11 This refers to a stack of one or more pads, one or more solders, and light-emitting elements bonded to one or more pads via one or more solders, according to some embodiments of this disclosure. See also... Figures 9 to 11 In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the first body MB1 onto the substrate; and the orthographic projection of the corresponding first portion P1 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0096] Reference Figures 9 to 11In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the second body MB2 onto the substrate; and the orthographic projection of the corresponding second portion P2 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0097] The corresponding first part P1 can have various suitable shapes. Figure 9 In the example depicted, the corresponding first portion P1 has a partially circular shape, such as a semi-circular shape, along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0098] The corresponding second part P2 can have various suitable shapes. Figure 9 In the example depicted, the corresponding second portion P2 has a partially circular shape, such as a semi-circular shape, along a cross section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0099] Figure 12 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 12 In some embodiments, the corresponding first portion P1 has a rectangular shape along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0100] Figure 13 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 13 In some embodiments, the corresponding first portion P1 has a trapezoidal shape along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0101] Figure 14 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 14 In some embodiments, the corresponding first portion P1 has a partially elliptical shape, such as a semi-elliptical shape, along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0102] Figure 15 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 15 In some embodiments, the corresponding first portion P1 has a partially circular shape, such as a three-quarter circular shape, along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0103] Figure 16 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 16 In some embodiments, the corresponding first portion P1 has a cross-section along a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate, comprising a smaller rectangular shape connected to a larger rectangular shape, wherein the smaller rectangular shape is located on the side of the larger rectangular shape away from the first body MB1. The portion having the smaller rectangular shape can be used for alignment.

[0104] In some embodiments, the corresponding first portion P1 includes a first sub-part SP1 and a second sub-part SP2 connected to the first sub-part SP1. The second sub-part SP2 is located on the side of the first sub-part SP1 away from the first body MB1. The second sub-part SP2, the first sub-part SP1, and the first body MB1 are arranged along a first direction DR1. In some embodiments, along a direction perpendicular to the first direction DR1, the first sub-part SP1 has a first maximum width mw1, and the second sub-part SP2 has a second maximum width mw2. Optionally, the first maximum width mw1 is greater than the second maximum width mw2. In some embodiments, along a direction perpendicular to the first direction DR1, the first sub-part SP1 has a first average width, and the second sub-part SP2 has a second average width. Optionally, the first average width is greater than the second average width. In some embodiments, along a direction perpendicular to the first direction DR1, the first sub-part SP1 has a first minimum width, and the second sub-part SP2 has a second maximum width mw2. Optionally, the first minimum width is greater than the second maximum width mw2.

[0105] The first sub-part SP1 can have a variety of suitable shapes. Examples of suitable shapes for the first sub-part SP1 include rectangular shapes, square shapes, trapezoidal shapes, partially elliptical shapes, partially circular shapes, and triangular shapes.

[0106] The second sub-part SP2 can have a variety of suitable shapes. Examples of suitable shapes for the second sub-part SP2 include rectangular shapes, square shapes, trapezoidal shapes, partially elliptical shapes, partially circular shapes, and triangular shapes.

[0107] Figure 17 This is a schematic diagram illustrating the structure of one or more pads and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figure 17 In some embodiments, the corresponding first portion P1 has a triangular shape in cross-section along a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate.

[0108] Figure 18 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 18 In some embodiments, the corresponding second portion P2 has a rectangular shape along a cross section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0109] Figure 19 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 19 In some embodiments, the corresponding second portion P2 has a trapezoidal shape along a cross section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0110] Figure 20 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 20 In some embodiments, the corresponding second portion P2 has a partially elliptical shape, such as a semi-elliptical shape, along a cross section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0111] Figure 21 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 21 In some embodiments, the corresponding second portion P2 has a partially circular shape, such as a three-quarter circular shape, along a cross section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0112] Figure 22 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 22 In some embodiments, the corresponding second portion P2 has a cross-section along a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate, and includes a smaller rectangular shape connected to the larger rectangular shape, wherein the smaller rectangular shape is located on the side of the larger rectangular shape away from the second body MB2.

[0113] Figure 23This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. (Refer to...) Figure 23 In some embodiments, the corresponding second portion P2 has a triangular shape in cross section along a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate.

[0114] Figure 24 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. Figure 25 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. Figure 26 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. Figure 27 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. Figure 28 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. Figure 29 This is a schematic diagram illustrating the structure of one or more pads, one or more solders, and one or more signal lines according to some embodiments of the present disclosure. (Refer to...) Figures 12 to 29In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the first body MB1 onto the substrate; and the orthographic projection of the corresponding first portion P1 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely). In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the second body MB2 onto the substrate; and the orthographic projection of the corresponding second portion P2 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0115] The inventors of this disclosure have discovered that each pad having a corresponding first portion with a semi-circular shape has several advantages. First, when solder paste is applied to each pad having a corresponding first portion with a semi-circular shape, the solder paste has better flowability, making it easier to monitor the soldering status to determine if there is insufficient solder. Second, it is easier to control the formation of semi-circular openings in one or more insulating layers to form each pad, and etching residues are less likely to occur. Similarly, each pad having a corresponding first portion with a three-quarter circular shape has similar advantages.

[0116] In some embodiments, each pad has substantially (e.g., at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or 100%) mirror symmetry with respect to a plane perpendicular to the substrate surface and intersecting the respective first portion and first body. For example, the respective first portion is connected to the center point of one side of the first body. This structure facilitates automated optical inspection because the camera is positioned directly above the light-emitting element for photographic monitoring.

[0117] In an alternative embodiment, the individual pads do not have mirror symmetry, and the points adjacent to the corresponding first portion are away from the center point on the side of the first body. Figure 30 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure. (Refer to...) Figure 30 The first center line CL1 of the corresponding first part P1 and the second center line CL2 of the first body MB1 are spaced apart by a distance d greater than zero. Optionally, the distance d is greater than at least 10% (e.g., at least 15%, at least 20%, at least 25%, at least 30%, at least 35%, or at least 40%) of the length of the edge S of the first body MB1 connected to the corresponding first part P1.

[0118] Figure 31 This is a plan view of one or more insulating layers in a light-emitting substrate according to some embodiments of the present disclosure. (Refer to...) Figure 31 In some embodiments, the light-emitting substrate includes one or more vias V extending through one or more insulating layers INS, thereby exposing the surfaces of one or more pads. In some embodiments, the one or more insulating layers INS include a passivation layer. Optionally, the one or more insulating layers INS also include a cover layer. (See also...) Figure 31 The via V includes a main part MP and an additional part AP connected to the main part MP.

[0119] In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the main portion MP onto the substrate; and the orthographic projection of the additional portion AP onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70% non-overlap, at least 75% non-overlap, at least 80% non-overlap, at least 85% non-overlap, at least 90% non-overlap, at least 95% non-overlap, at least 99% non-overlap, or completely non-overlap).

[0120] In some embodiments, the main portion MP has a regular polygonal shape, such as a rectangle or square shape, along a cross section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0121] The additional portion AP can have various suitable shapes. Figure 31 In the example depicted, the additional portion AP has a partially circular shape, such as a semi-circular shape, along a cross-section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0122] In an alternative embodiment, the additional portion AP has a rectangular shape along a cross-section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0123] In an alternative embodiment, the additional portion AP has a trapezoidal shape along a cross-section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0124] In an alternative embodiment, the additional portion AP has a partially elliptical shape, such as a semi-elliptical shape, along a cross section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0125] In an alternative embodiment, the additional portion AP has a partially circular shape, such as a three-quarter circular shape, along a cross section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0126] In an alternative embodiment, the additional portion AP has a shape comprising a smaller rectangular shape connected to the larger rectangular shape along a cross section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate, wherein the smaller rectangular shape is located on the side of the larger rectangular shape away from the main portion MP.

[0127] In an alternative embodiment, the additional portion AP has a triangular shape along a cross-section of a plane that intersects the main portion MP and the additional portion AP and is parallel to the surface of the substrate.

[0128] Figure 32 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure. (Refer to...) Figure 32 In some embodiments, the corresponding first portion P1 has a maximum width w along the direction from the corresponding first portion P1 to the first body. Optionally, the maximum width w is in the range of 30 μm to 40 μm, for example, 35 μm. Figure 32 As shown, the light-emitting substrate includes a total of two pads. Each pad includes a first portion. There are two first portions. The orthographic projections of the two first portions onto the substrate lie on opposite sides of the orthographic projections of the light-emitting element bonded to the light-emitting substrate onto the substrate. The two first portions can be used as positioning constraints for the light-emitting element. If the light-emitting element is misaligned and completely covers one of the two first portions, it can be determined that the light-emitting element is not properly bonded. Therefore, the two first portions facilitate automated optical inspection to check the bonding of the light-emitting element.

[0129] Figure 33 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure. (Refer to...) Figure 33In some embodiments, each pad includes a first body MB1 and a corresponding first portion P1 connected to the first body MB1. In some embodiments, the first body MB1 has a rectangular shape having a second width a and a second length b. In some embodiments, the corresponding first portion P1 has a rectangular shape having a first width c and a first length d. The second width a is along a direction substantially parallel to the first width c. The second length b is along a direction substantially parallel to the first length d. As used herein, the term "substantially parallel" means an angle in the range of 0 degrees to about 45 degrees, for example, 0 degrees to about 5 degrees, 0 degrees to about 10 degrees, 0 degrees to about 15 degrees, 0 degrees to about 20 degrees, 0 degrees to about 25 degrees, and 0 degrees to about 30 degrees.

[0130] In some embodiments, a / 2 ≤ c ≤ a. In some embodiments, b / 5 ≤ d ≤ b / 3. Optionally, the second width a is in the range of 50 μm to 70 μm, for example, 50 μm to 55 μm, 55 μm to 60 μm, 60 μm to 65 μm, or 65 to 70 μm. Optionally, the second length b is in the range of 150 μm to 200 μm, for example, 150 μm to 160 μm, 160 μm to 170 μm, 170 μm to 180 μm, 180 μm to 190 μm, or 190 μm to 200 μm. The inventors of this disclosure have found that by making the width and length within these ranges, the etching process of the light-emitting substrate can be easily controlled, and the exposure and development durations can be substantially unaffected.

[0131] In some embodiments, L1≤b≤L2, where L1 represents the width of the contact pad of the light-emitting element and L2 represents the total width of the light-emitting element.

[0132] In some embodiments, the second width a ≥ L1.

[0133] In one specific example, the size of the light-emitting element is 218μm × 218μm. In another example, the spacing between the pad openings is in the range of 50μm to 60μm.

[0134] In a specific example, the second width a is 65 μm, the second length b is 175 μm, the first width c is 60 μm, and the first length d is 40 μm.

[0135] Figure 34 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure. (Refer to...) Figure 34In some embodiments, each pad includes a first body MB1 and a corresponding first portion P1 connected to the first body MB1. In some embodiments, the first body MB1 is a rectangular shape having a second width a and a second length b. In some embodiments, the corresponding first portion P1 is a semi-circular shape having a radius r.

[0136] In some embodiments, b / 8 ≤ r ≤ b / 6. Optionally, the second width a is in the range of 50 μm to 70 μm, for example, 50 μm to 55 μm, 55 μm to 60 μm, 60 μm to 65 μm, or 65 μm to 70 μm. Optionally, the second length b is in the range of 150 μm to 200 μm, for example, 150 μm to 160 μm, 160 μm to 170 μm, 170 μm to 180 μm, 180 μm to 190 μm, or 190 μm to 200 μm. The inventors of this disclosure have found that by making the radius within this range, the etching process of the light-emitting substrate can be easily controlled, and the exposure and development durations can be substantially unaffected.

[0137] In some embodiments, L1≤b≤L2, where L1 represents the width of the contact pad of the light-emitting element and L2 represents the total width of the light-emitting element.

[0138] In some embodiments, the second width a ≥ L1.

[0139] In one specific example, the size of the light-emitting element is 218μm × 218μm. In another example, the spacing between the pad openings is in the range of 50μm to 60μm.

[0140] Figure 35 Optical detection of a light-emitting element bonded to a light-emitting substrate according to some embodiments of the present disclosure is shown. Figure 36 It is along Figure 35 A cross-sectional view of the E-E' line in the diagram. Figure 37 It is along Figure 35 The cross-sectional view of line F-F' in the diagram. (Refer to...) Figures 35 to 37 In some embodiments, the light-emitting substrate includes: a substrate BS; a buffer layer BUF located on the substrate BS; an adhesive layer AL located on the side of the buffer layer BUF away from the substrate BS; one or more signal lines (e.g., a first signal line SL1 and a second signal line SL2) and one or more pads SP located on the side of the adhesive layer AL away from the substrate BS, the one or more pads SP being connected to the one or more signal lines; and one or more insulating layers located on the side of the one or more signal lines away from the substrate BS. Optionally, the one or more insulating layers include a passivation layer PVX located on the side of the one or more signal lines away from the substrate BS, and a covering layer OC located on the side of the passivation layer PVX away from the substrate BS.

[0141] Various suitable materials can be used to manufacture the adhesive layer AL. Examples of suitable materials for manufacturing the adhesive layer AL include various suitable alloys, such as alloys including molybdenum and niobium, alloys including copper and titanium, and alloys including nickel and chromium.

[0142] In some embodiments, regions of one or more pads SP have one or more vias penetrating one or more insulating layers on the side of one or more pads SP away from the substrate BS. In one example, the light-emitting substrate includes a passivation layer PVX and a cladding layer OC located on the side of one or more pads SP away from the substrate BS, and one or more vias are formed through the passivation layer PVX and the cladding layer OC.

[0143] In some embodiments, in the region having one or more pads SP, the light-emitting substrate further includes a protective layer PL on the side of the one or more pads SP away from the substrate BS. Optionally, the protective layer PL is made of a different material than the one or more pads SP. In a particular example, the one or more pads SP comprise copper; and the protective layer PL comprises at least one element different from copper.

[0144] Various suitable materials can be used to manufacture the protective layer PL. Examples of suitable materials for manufacturing the protective layer PL include various suitable alloys, such as alloys including nickel and gold, and alloys including copper and 10% of another element different from copper.

[0145] In some embodiments, the protective layer PL includes one or more protective blocks. In some embodiments, the orthographic projection of the protective block on the substrate BS at least partially overlaps with the orthographic projection of the corresponding pad in one or more pads on the substrate BS. Optionally, the orthographic projection of the protective block on the substrate BS substantially overlaps with the orthographic projection of the corresponding pad in one or more pads on the substrate BS (e.g., at least 70% overlap, at least 75% overlap, at least 80% overlap, at least 85% overlap, at least 90% overlap, at least 95% overlap, at least 99% overlap, or 100% overlap).

[0146] In some embodiments, one or more solder SDs are disposed on the side of one or more guard blocks away from the substrate BS. The solder SDs are in direct contact with the respective guard blocks in the one or more guard blocks.

[0147] In some embodiments, one or more protective blocks are disposed on the side of one or more pads SP that is away from the substrate BS. The protective blocks are in direct contact with the corresponding pads in the one or more pads SP.

[0148] In some embodiments, the light-emitting element (LED) is bonded to one or more pads (SP) via one or more solder SDs and one or more guard blocks. The LED is in direct contact with the one or more solder SDs. In one example, one or more contact pads of the LED are bonded to one or more pads (SP) via one or more solder SDs and one or more guard blocks. In another example, one or more contact pads of the LED include N-contact pads and P-contact pads. The contact pads are in direct contact with the corresponding solder in one or more solder SDs.

[0149] In some embodiments, the orthographic projection of one or more pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the pads SP on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0150] In some embodiments, the orthographic projection of one or more protective blocks on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the protective blocks on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0151] In some embodiments, the orthographic projection of one or more solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS. Optionally, the orthographic projection of the solder SDs on the substrate BS does not at least partially overlap with the orthographic projection of the light-emitting element LED on the substrate BS.

[0152] In some embodiments, pads SP and signal lines are part of an integral structure. For example, a first pad and a first signal line SL1 in one or more pads SP are part of a first integral structure; and / or, a second pad and a second signal line SL2 in one or more pads SP are part of a second integral structure. Optionally, the individual pads and individual signal lines may be formed using the same conductive material in the same manufacturing process. Optionally, one or more pads SP and one or more signal lines may be formed using the same conductive material in the same manufacturing process.

[0153] In an alternative embodiment, at least one of the one or more pads SP is formed separately from one or more signal lines. Optionally, at least one of the one or more pads SP is formed using a different material than the one or more signal lines. The pad SP is connected to a corresponding signal line among the one or more signal lines.

[0154] Figure 38 This is a schematic diagram illustrating the structure of one or more pads according to some embodiments of the present disclosure.

[0155] Figure 39 This is a schematic diagram illustrating the structure of one or more protection blocks according to some embodiments of the present disclosure.

[0156] Figure 40 This is a schematic diagram illustrating the structure of one or more solders according to some embodiments of the present disclosure. Figure 41 It is a stack of one or more pads, one or more guard blocks, one or more solders, and light-emitting elements bonded to one or more pads by one or more solders, according to some embodiments of this disclosure.

[0157] Reference Figures 35 to 41 In some embodiments, the solder pad includes a first body MB1 and a corresponding first portion P1 connected to the first body MB1. Optionally, the first body MB1 and the corresponding first portion P1 are part of an integral structure. Optionally, the first body MB1 has a regular polygonal shape, such as a rectangle or square shape, in its cross-section along a plane intersecting the first body MB1 and the corresponding first portion P1 and parallel to the surface of the substrate. Optionally, the corresponding first portion P1 extends from one side of the first body MB1. In some embodiments, the solder includes a second body MB2 and a corresponding second portion P2 connected to the second body MB2. Optionally, the second body MB2 and the corresponding second portion P2 are part of an integral structure. Optionally, the second body MB2 has a regular polygonal shape, such as a rectangle or square shape, in its cross-section along a plane intersecting the second body MB2 and the corresponding second portion P2 and parallel to the surface of the substrate. Optionally, the corresponding second portion P2 extends from one side of the second body MB2. In some embodiments, the guard block PB includes a third body MB3 and a corresponding third portion P3 connected to the third body MB3. Optionally, the third body MB3 and the corresponding third part P3 are integral parts of the overall structure. Optionally, the cross-section of the third body MB3 along a plane intersecting the third body MB3 and the corresponding third part P3 and parallel to the surface of the substrate has a regular polygonal shape, such as a rectangular or square shape. Optionally, the corresponding third part P3 extends from one side of the third body MB3.

[0158] In some embodiments, the orthographic projection of one or more first portions of one or more pads SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding first portion P1 of the pad SP onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0159] In some embodiments, the orthographic projection of one or more second portions of one or more solder SDs onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of a corresponding second portion P2 of the solder SD onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0160] In some embodiments, the orthographic projection of one or more third portions of one or more protective blocks PB onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS. Optionally, the orthographic projection of the respective third portion P3 of each of the one or more protective blocks PB onto the substrate BS is at least partially non-overlapping (e.g., completely non-overlapping) with the orthographic projection of the light-emitting element LED onto the substrate BS.

[0161] In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the first body MB1 onto the substrate; and the orthographic projection of the corresponding first portion P1 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0162] In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the second body MB2 onto the substrate; and the orthographic projection of the corresponding second portion P2 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0163] In some embodiments, the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate substantially covers (e.g., covers at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely covers) the orthographic projection of the third body MB3 onto the substrate; and the orthographic projection of the corresponding third part P3 onto the substrate substantially does not overlap with the orthographic projection of the light-emitting element bonded to the light-emitting substrate onto the substrate (e.g., at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 99%, or completely).

[0164] The corresponding first portion P1 can have various suitable shapes. In this example, the corresponding first portion P1 has a shape selected from the following along a cross section of a plane that intersects the first body MB1 and the corresponding first portion P1 and is parallel to the surface of the substrate: a partially circular shape, such as a semi-circular shape or a three-quarter circular shape; a rectangular or square shape; a trapezoidal shape; a partially elliptical shape, such as a semi-elliptical shape; a triangular shape; and a shape that includes a smaller rectangular shape connected to a larger rectangular shape.

[0165] The corresponding second portion P2 can have various suitable shapes. In this example, the corresponding second portion P2 has a shape selected from the following along a cross-section of a plane that intersects the second body MB2 and the corresponding second portion P2 and is parallel to the surface of the substrate: a partially circular shape, such as a semi-circular shape or a three-quarter circular shape; a rectangular or square shape; a trapezoidal shape; a partially elliptical shape, such as a semi-elliptical shape; a triangular shape; and a shape that includes a smaller rectangular shape connected to a larger rectangular shape.

[0166] The corresponding third portion P3 can have various suitable shapes. In this example, the corresponding third portion P3 has a shape selected from the following along a cross-section of a plane that intersects the third body MB3 and the corresponding third portion P3 and is parallel to the surface of the substrate: a partially circular shape, such as a semi-circular shape or a three-quarter circular shape; a rectangular or square shape; a trapezoidal shape; a partially elliptical shape, such as a semi-elliptical shape; a triangular shape; and a shape that includes a smaller rectangular shape connected to a larger rectangular shape.

[0167] On the other hand, this disclosure provides a method for manufacturing a light-emitting substrate. In some embodiments, the method includes: forming one or more pads on a substrate; forming one or more insulating layers on a side of the one or more pads away from the substrate, wherein a region of the one or more pads has one or more vias penetrating the one or more insulating layers; forming one or more solders on the side of the one or more pads away from the substrate; and bonding a light-emitting element to the one or more pads at least by means of one or more solders located in at least a portion of the region of the one or more vias. Optionally, the pad includes a first body and a corresponding first portion connected to the first body. Optionally, the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the first body on the substrate. Optionally, the orthographic projection of the corresponding first portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0168] In some embodiments, the method further includes: determining whether the light-emitting element is aligned with one or more pads. Optionally, the one or more pads include two first portions. Optionally, the orthographic projections of the two first portions on the substrate are located on opposite sides of the orthographic projection of the light-emitting element on the substrate. Optionally, the method further includes: determining that the light-emitting element is misaligned with one or more pads when it is determined that the orthographic projection of the light-emitting element on the substrate completely covers the orthographic projections of one or both first portions on the substrate.

[0169] In some embodiments, forming one or more insulating layers includes: forming one or more insulating material layers on the side of one or more pads away from the substrate; and forming one or more vias extending through the one or more insulating material layers, thereby forming one or more insulating layers and exposing the surface of one or more pads.

[0170] In some embodiments, forming a via includes forming a main portion and an additional portion connected to the main portion. Optionally, the orthographic projection of the light-emitting element on the substrate substantially overlaps the orthographic projection of the main portion on the substrate. Optionally, the orthographic projection of the additional portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0171] In some embodiments, the method further includes: forming a protective layer on the side of one or more pads away from the substrate in a region having one or more pads. Optionally, forming the protective layer includes: forming one or more protective blocks. Optionally, solder is in direct contact with a corresponding protective block among the one or more protective blocks. Optionally, each protective block is in direct contact with a corresponding pad among the one or more pads.

[0172] In some embodiments, forming solder includes: forming a second body and forming a corresponding second portion connected to the second body. Optionally, the orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the second body on the substrate. Optionally, the orthographic projection of the corresponding second portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate.

[0173] In some embodiments, forming each protective block includes: forming a third body and forming a corresponding third portion connected to the third body. Optionally, the orthographic projection of the light-emitting element on the substrate substantially overlaps the orthographic projection of the third body on the substrate. Optionally, the orthographic projection of the corresponding third portion on the substrate substantially does not overlap with the orthographic projection of the light-emitting element on the substrate. Optionally, one or more protective blocks are made of a material different from one or more pads.

[0174] In some embodiments, the first body and the corresponding first part are formed as part of an integral structure.

[0175] In some embodiments, the method further includes forming one or more signal lines. Optionally, the signal lines and corresponding pads are formed as part of an integral structure.

[0176] In some embodiments, the method further includes forming an adhesive layer on the side of one or more pads near the substrate. Optionally, the one or more pads are in direct contact with the adhesive layer.

[0177] For illustrative and descriptive purposes, the foregoing description of embodiments of the invention has been provided. It is not exhaustive, nor is it intended to limit the invention to the precise forms or exemplary embodiments disclosed. Therefore, the foregoing description should be considered illustrative rather than restrictive. Clearly, many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to explain the principles of the invention and its best mode of practical application, thereby enabling those skilled in the art to understand the various embodiments of the invention and the various modifications suitable for the particular use or implementation contemplated. The scope of the invention is intended to be defined by the appended claims and their equivalents, wherein, unless otherwise stated, all terms are to be interpreted in their broadest reasonable sense. Therefore, the terms “the invention,” “the present invention,” etc., do not necessarily limit the scope of the claims to the specific embodiments, and references to exemplary embodiments of the invention do not imply limitation of the invention, nor should such limitation be inferred. The invention is defined only by the spirit and scope of the appended claims. Furthermore, these claims may involve the use of “first,” “second,” etc., followed by nouns or elements. These terms should be understood as nomenclature and should not be construed as limiting the number of elements modified by these nomenclatures unless a specific number has been given. Any advantages and benefits described may not apply to all embodiments of the invention. It should be understood that changes to the described embodiments can be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims. Furthermore, the elements and components in this disclosure are not intended for public distribution, whether or not they are expressly recited in the appended claims.

Claims

1. A light-emitting substrate, comprising: Substrate; One or more pads located on the substrate; One or more insulating layers are located on the side of the one or more pads away from the substrate, wherein the regions of the one or more pads have one or more vias penetrating the one or more insulating layers; One or more solder pads located on the side of the one or more pads away from the substrate; and A light-emitting element, which is bonded to the one or more pads by at least one or more solders located in at least a portion of the one or more vias; The pad includes a first body and a corresponding first portion connected to the first body; The orthogonal projection of the light-emitting element on the substrate substantially covers the orthogonal projection of the first body on the substrate; and The orthographic projection of the corresponding first portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

2. The light-emitting substrate according to claim 1, wherein, The solder includes a second body and a corresponding second portion connected to the second body; The orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the second body on the substrate; as well as The orthographic projection of the corresponding second portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

3. The light-emitting substrate according to claim 1, wherein, The via includes a main portion and an additional portion connected to the main portion; The orthogonal projection of the light-emitting element on the substrate substantially covers the orthogonal projection of the main part on the substrate; as well as The orthographic projection of the additional portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

4. The light-emitting substrate according to any one of claims 1 to 3, further comprising a protective layer located on the side of the one or more pads away from the substrate in the region having the one or more pads; in, The protective layer includes one or more protective blocks; The solder is in direct contact with the corresponding protective block in the one or more protective blocks; and The corresponding protection block is in direct contact with the corresponding pad in one or more of the pads.

5. The light-emitting substrate according to claim 4, wherein, The corresponding protection block includes a third body and a corresponding third part connected to the third body; The orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the third body on the substrate; as well as The orthographic projection of the corresponding third part on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

6. The light-emitting substrate according to claim 4, wherein, The one or more protection blocks are made of a material different from the one or more solder pads.

7. The light-emitting substrate according to any one of claims 1 to 6, wherein, The corresponding first portion has a first rectangular shape along a cross section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate.

8. The light-emitting substrate according to claim 7, wherein, The first body has a second rectangular shape along a cross section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate, the second rectangular shape having a second width and a second length; The first rectangular shape has a first width and a first length; The first width is along a direction that is substantially parallel to the second width; The first length is along a direction that is substantially parallel to the second length; The first width is greater than or equal to half of the second width, and less than or equal to the second width; and The first length is greater than or equal to one-fifth of the second length and less than or equal to one-third of the second length.

9. The light-emitting substrate according to any one of claims 1 to 6, wherein, The corresponding first portion has a partially circular shape along a cross section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate.

10. The light-emitting substrate according to claim 9, wherein, The first body has a rectangular shape along a cross-section of a plane that intersects the first body and the corresponding first portion and is parallel to the surface of the substrate, the rectangular shape having a width and a length; as well as The radius of the partially circular shape is greater than or equal to one-eighth of the length and less than or equal to one-sixth of the length.

11. The light-emitting substrate according to any one of claims 1 to 6, wherein, The corresponding first part includes a first sub-part and a second sub-part connected to the first sub-part; The second sub-part is located on the side of the first sub-part that is furthest from the first main body; The second sub-part, the first sub-part, and the first main body are arranged along a first direction; Along a direction perpendicular to the first direction, the first sub-part has a first maximum width, and the second sub-part has a second maximum width; and The first maximum width is greater than the second maximum width.

12. The light-emitting substrate according to any one of claims 1 to 11, wherein, The first main body and the corresponding first part are part of an integral structure.

13. The light-emitting substrate according to any one of claims 1 to 12, further comprising one or more signal lines; in, The individual pads and the corresponding signal lines in the one or more signal lines are part of an integral structure.

14. The light-emitting substrate according to any one of claims 1 to 13, wherein, The individual pads have substantially mirror symmetry with respect to a plane perpendicular to the surface of the substrate and intersecting with the corresponding first portion and the first body.

15. The light-emitting substrate according to any one of claims 1 to 14, further comprising an adhesive layer located on the side of the one or more pads near the substrate; in, The one or more pads are in direct contact with the adhesive layer.

16. A method for manufacturing a light-emitting substrate, comprising: One or more pads are formed on the substrate. One or more insulating layers are formed on the side of the one or more pads away from the substrate, wherein the region of the one or more pads has one or more vias penetrating the one or more insulating layers; One or more solder pads are formed on the side of the one or more pads away from the substrate; and The light-emitting element is bonded to the one or more pads by at least one or more solder located in at least a portion of the area of ​​the one or more vias; The pad includes a first body and a corresponding first portion connected to the first body; The orthogonal projection of the light-emitting element on the substrate substantially covers the orthogonal projection of the first body on the substrate; and The orthographic projection of the corresponding first portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

17. The method of claim 16, further comprising: Determine whether the light-emitting element is aligned with the one or more pads; Wherein, the one or more pads include two first portions; and The orthographic projections of the two first portions on the substrate are located on opposite sides of the orthographic projection of the light-emitting element on the substrate; The method further includes: determining that the light-emitting element is misaligned relative to the one or more pads when the orthogonal projection of the light-emitting element on the substrate completely covers the orthogonal projection of one or two of the first portions on the substrate.

18. The method according to claim 16, wherein, Forming the one or more insulating layers includes: One or more insulating material layers are formed on the side of the one or more pads away from the substrate; and One or more vias are formed extending through the one or more insulating material layers, thereby forming the one or more insulating layers and exposing the surface of the one or more pads.

19. The method according to claim 18, wherein, Forming the via includes: forming a main portion and an additional portion connected to the main portion; The orthographic projection of the light-emitting element on the substrate substantially covers the orthographic projection of the main portion on the substrate; and The orthographic projection of the additional portion on the substrate does not substantially overlap with the orthographic projection of the light-emitting element on the substrate.

20. The method according to any one of claims 16 to 19, further comprising: In the region having the one or more pads, a protective layer is formed on the side of the one or more pads away from the substrate. The formation of the protective layer includes: forming one or more protective blocks; Wherein, the solder is in direct contact with the corresponding protective block in the one or more protective blocks; and The corresponding protection block is in direct contact with the corresponding pad in one or more of the pads.

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