Texture arrangement structure, welding workpiece and machining method of texture arrangement structure

Abstract

The invention relates to a texture arrangement structure, a welding workpiece and a machining method of the texture arrangement structure. The texture arrangement structure is provided with a plurality of repeatedly arranged texture units, and the adjacent texture units are partially overlapped in the first direction; the texture unit comprises a first spiral groove, the polar radius of the first spiral groove is increased along with the increase of the spiral rotation angle of the first spiral groove, and the first spiral center of the first spiral groove deviates in the first direction; the second spiral groove and the first spiral groove are arranged side by side in the second direction, and the outer ring of the second spiral groove is communicated with the outer ring of the first spiral groove; the polar radius of the second spiral groove is increased along with the increase of the rotation angle of the second spiral groove, the second spiral center of the second spiral groove deviates in the first direction, the deviation direction of the second spiral center is opposite to the deviation direction of the first spiral center, and the second direction intersects with the first direction. And the flow and distribution of the welding flux in the welding seam can be conveniently controlled.

Description

Technical Field

[0001] This application relates to the field of welding workpiece processing technology, and in particular to a textured layout structure, a welding workpiece, and a processing method for the textured layout structure. Background Technology

[0002] During the welding process, there is a difference in the coefficient of thermal expansion between the workpiece and the base material, resulting in a difference in the size of the gap between the two sides of the workpiece and the base material. On the side with a smaller gap, the solder is difficult to spread and fill the surface fully through capillary action. On the side with a larger gap, more solder usually accumulates. Under the action of gravity, this part of the solder is difficult to stay on the surface of the workpiece through good extension and is prone to overflow from the weld, which may lead to defects such as holes and gaps in the weld.

[0003] In related technologies, by forming a textured structure on the welding surface of the workpiece, micro-pits and grooves are formed on the material surface, which can change the contact angle of droplets on the material surface, achieving superhydrophobic or superhydrophilic characteristics, and facilitating the spread of solder on the welding surface of the workpiece.

[0004] However, the texture structure in related technologies has limited ability to improve solder spread and is difficult to effectively control the flow and distribution of solder in complex welds. Summary of the Invention

[0005] Based on this, embodiments of this application provide a textured layout structure, a welded workpiece, and a processing method for the textured layout structure, which can improve the ability of the textured structure to spread solder and facilitate the control of the flow and distribution of solder in the weld.

[0006] On one hand, embodiments of this application provide a textured arrangement structure having multiple repeating textured units, with adjacent textured units partially overlapping along a first direction; the textured unit includes:

[0007] As the spiral rotation angle of the first spiral groove increases, the extreme diameter of the first spiral groove increases, and the first spiral center of the first spiral groove shifts along the first direction.

[0008] The second spiral groove is arranged side by side with the first spiral groove along the second direction, and the outer ring of the second spiral groove is connected to the outer ring of the first spiral groove. As the rotation angle of the second spiral groove increases, the extreme diameter of the second spiral groove increases, and the second spiral center of the second spiral groove is offset along the first direction, wherein the offset direction of the second spiral center is opposite to the offset direction of the first spiral center, and the second direction intersects with the first direction.

[0009] In one implementation, either the first helical groove or the second helical groove includes:

[0010] The first groove segment, along the spiral direction of the first spiral groove, increases the distance by one revolution of the extreme diameter of the first groove segment;

[0011] The second groove segment has its starting end connected to the end of the first groove segment, and the extreme diameter of the starting end of the second groove segment is the same as the extreme diameter of the end of the first groove segment; the distance increased by the extreme diameter of the second groove segment by one revolution along the spiral direction of the first spiral groove is the second distance; the second distance is less than the first distance.

[0012] The third groove segment has its starting end connected to the end of the second groove segment, and the extreme diameter of the starting end of the third groove segment is the same as the extreme diameter of the end of the second groove segment; the extreme diameter of the third groove segment remains unchanged along the rotation direction of the first spiral groove.

[0013] The third section of the first spiral groove is connected to the third section of the second spiral groove.

[0014] In one implementation, along the rotation direction of the first spiral groove, the rotation angle of the first groove segment is a first angle, the rotation angle of the second groove segment is a second angle, and the rotation angle of the third groove segment is a third angle.

[0015] The first angle is greater than or equal to the second angle, and the second angle is greater than or equal to the third angle.

[0016] In one implementation, along the second direction, there is a third distance between the center of the first spiral and the center of the second spiral, the third distance being less than or equal to twice the maximum extreme diameter of the first spiral groove or the second spiral groove.

[0017] In one implementation, the third distance is less than or equal to 0.3 mm.

[0018] In one implementation, along a first direction, there is a fourth distance between adjacent first spiral centers or adjacent second spiral centers, the fourth distance being less than or equal to the maximum extreme diameter of either the first spiral groove or the second spiral groove.

[0019] In one implementation, the fourth distance is less than or equal to 0.15 mm.

[0020] On the other hand, embodiments of this application provide a welded workpiece, including a workpiece body, the workpiece body having a welding surface, and the welding surface having the textured arrangement structure provided in the foregoing embodiments of this application.

[0021] Furthermore, embodiments of this application provide a method for processing a textured layout structure, the method comprising:

[0022] A workpiece is fixed and welded on a laser processing table. The workpiece has a welding surface that faces the laser processing head.

[0023] The laser processing head executes a texture processing cycle until the texture layout is completed on the welding surface. The texture processing cycle includes:

[0024] The laser processing head processes the welding surface along the first spiral path, and the laser processing stage moves linearly along the first direction to form the current first spiral groove on the welding surface;

[0025] The laser processing table drives the welding workpiece to move a fourth distance in a straight line along the first direction. The laser processing head processes the welding surface along the first spiral path, and the laser processing table moves in a straight line along the first direction until the current row of multiple first spiral grooves is processed on the welding surface along the first direction.

[0026] The laser processing stage moves a third distance along the second direction, the laser processing head processes the welding surface along the first spiral path, and the laser processing stage moves in the opposite direction along the first direction to form the current second spiral groove on the welding surface.

[0027] In one implementation, the laser power of the laser processing head for processing the welding surface is 1W-100W.

[0028] In one implementation, the laser processing head moves at a speed of 1 mm / s to 2000 mm / s along the first helical path.

[0029] The woven fabric arrangement structure, welded workpiece, and processing method of the woven fabric arrangement structure provided in this application embodiment have multiple repeating woven units. Each woven unit includes a first spiral groove. As the spiral rotation angle of this spiral groove increases, the extreme diameter of the first spiral groove increases, and the first spiral center of the first spiral groove shifts along a first direction. A second spiral groove is arranged parallel to the first spiral groove along a second direction. The outer ring of the second spiral groove is connected to the outer ring of the first spiral groove. As the rotation angle of the second spiral groove increases, the extreme diameter of the second spiral groove increases, and the second spiral center of the second spiral groove shifts along the first direction. The offset direction of the second spiral center is opposite to the offset direction of the first spiral center. Thus, along the second direction, the first and second spiral grooves connect to form an S-shaped guide groove. The S-shaped guide groove can guide the flow of solder and prevent the solder from flowing in other directions, facilitating the wetting and spreading of solder on the welding surface. Furthermore, the offset between the centers of the first and second spirals in the first direction creates regions with different densities in the first and second spiral grooves. In the coefficient region, the spreading of solder can be suppressed, thereby reducing solder overflow from the weld. This improves the ability of the texture structure to spread solder, making it easier to control the flow and distribution of solder in the weld, thereby increasing the welding strength between the welded workpiece and the welding substrate, facilitating energy transfer, improving the fatigue resistance of the welded joint, and extending the service life of the welded workpiece. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the textured arrangement structure provided in some embodiments of this application.

[0031] Figure 2 This is a topological diagram of either the first spiral groove or the second spiral groove in the textured arrangement structure provided in some embodiments of this application.

[0032] Figure 3 This is a diagram showing the running trajectory of the processing head for the textured layout structure provided in some embodiments of this application.

[0033] Figure 4 This is a simplified structural diagram of the textured arrangement structure provided in some embodiments of this application.

[0034] Figure 5 This is a flowchart illustrating an implementation method for a fabrication layout structure provided in some embodiments of this application.

[0035] Figure 6 These are structural diagrams of textured layout structures formed under different power conditions according to some embodiments of this application.

[0036] Figure 7 These are three-dimensional structural diagrams of the textured arrangement structures formed under different power conditions according to some embodiments of this application.

[0037] Figure 8 These are structural diagrams of the textured layout structures formed by processing at different moving speeds according to some embodiments of this application.

[0038] Figure 9 These are solder morphology diagrams before and after welding of textured layout structures formed under different power conditions according to some embodiments of this application.

[0039] Figure 10 These are solder morphology diagrams before and after welding of textured layout structures formed at different moving speeds according to some embodiments of this application.

[0040] Figure 11 This is a graph showing the ratio of the spread of the textured layout structure in the x and y directions before and after welding, formed by processing at different power levels according to some embodiments of this application.

[0041] Figure 12 This is a graph showing the spread ratio of the textured layout structure in the x and y directions before and after welding, formed by processing at different moving speeds according to some embodiments of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 10-Texture layout structure;

[0044] 11-Texture unit;

[0045] 111 - First spiral groove; 112 - Second spiral groove;

[0046] 1101 - First slot section; 1102 - Second slot section; 1103 - Third slot section. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] Figure 1 This is a schematic diagram of the textured arrangement structure provided in some embodiments of this application. Figure 2 This is a topological diagram of either the first spiral groove or the second spiral groove in the textured arrangement structure provided in some embodiments of this application.

[0054] In some examples, refer to Figure 1 and Figure 2 As shown, in view of the technical problems existing in the related art, this application provides a textured layout structure 10. The textured layout structure 10 may have multiple repeating textured units 11.

[0055] In some examples, multiple texture units 11 can be arranged in an array.

[0056] In some examples, refer to Figure 1 As described, along the first direction (e.g.) Figure 1 (in the direction shown by the x-axis), adjacent texture units 11 can partially overlap. In this way, the grooves of adjacent texture units 11 along the first direction can be interconnected, which facilitates the flow and spread of solder between adjacent texture units 11, and facilitates the spread of solder on the welding surface of the workpiece, thereby improving the uniformity of solder spread on the welding surface.

[0057] In some examples, refer to Figure 1 and Figure 2As shown, the texture unit 11 may include a first helical groove 111. It is understood that in some examples of embodiments of this application, the first helical groove 111 may be formed by laser processing on the welding surface, for example, by laser ablation on the welding surface to form the first helical groove 111.

[0058] It should be noted that in some examples of the embodiments of this application, the processing and forming method of the first spiral groove 111 is only shown as a specific example and is not intended to limit the processing and forming method of the first spiral groove 111. In some examples, the first spiral groove 111 may be formed by etching or cutting.

[0059] In some examples, refer to Figure 2 As shown, as the helical rotation angle of the first helical groove 111 increases, the extreme diameter of the first helical groove 111 increases. That is to say, in the embodiments of this application, the first helical groove 111 can be an Archimedean-like helical groove.

[0060] In some examples, as the helical rotation angle of the first helical groove 111 increases, the extreme diameter of the first helical groove 111 can be increased uniformly.

[0061] In some examples, refer to Figure 2 As shown, as the helical rotation angle of the first helical groove 111 increases, the first helical center of the first helical groove 111 moves along a first direction (e.g., Figure 2 Offset (in the direction shown by the x-axis).

[0062] Figure 3 This is a diagram showing the running trajectory of the processing head for the textured layout structure provided in some embodiments of this application.

[0063] In some examples, refer to Figure 3 As shown, when forming the textured arrangement structure 10 on the welding surface, the processing head can move along... Figure 3 The Archimedean spiral trajectory shown depicts the workpiece moving along a first direction (e.g., during the movement of the machining head and the ablation of the welding surface). Figure 2 The direction shown by the x-axis moves, thus forming a shape like... Figure 2 The first spiral groove 111 is shown.

[0064] In some examples, the welded workpiece can be along Figure 2 The negative direction of the x-axis is moved, thus causing the machining head to move relative to the welding workpiece along... Figure 2 The movement in the positive direction of the x-axis causes the first helical center of the first helical groove 111 to shift along the first direction, forming... Figure 2 The first spiral groove 111 shown is illustrated.

[0065] In some examples, refer to Figure 1As shown, the texture unit 11 may include a second helical groove 112. Along the second direction (e.g.) Figure 1 (in the direction shown by the y-axis), the second helical groove 112 can be arranged side by side with the first helical groove 111. That is, the first helical groove 111 and the second helical groove 112 can be arranged side by side along the second direction.

[0066] In some examples, the second direction may intersect with the first direction.

[0067] In some examples, the second direction may be perpendicular to the first direction. It is understood that in some examples of embodiments of this application, "perpendicular" does not refer to absolute perpendicularity in a mathematical sense, but rather to approximate perpendicularity.

[0068] In some examples, the outer ring of the second helical groove 112 can communicate with the outer ring of the first helical groove 111. That is, the first helical groove 111 and the second helical groove 112 can be connected through the helical groove of the outer ring. In this way, the texture structure of the welding surface can be interconnected along the second direction, which facilitates the spread of solder along the first helical groove 111 and the second helical groove 112 in the second direction, improves the spreading and wetting properties of the solder on the welding surface, and facilitates the control of the distribution and spreading of the solder on the welding surface.

[0069] In some examples, refer to Figure 2 and Figure 3 As shown, the extreme diameter of the second spiral groove 112 increases with the increase of the rotation angle of the second spiral groove 112. It can be understood that in some examples of the embodiments of this application, the arrangement of the second spiral groove 112 may be the same as, similar to or similar to the arrangement of the first spiral groove 111. For details, please refer to the detailed description of the first spiral groove 111 in the foregoing embodiments of this application. This application will not repeat the description in this embodiment.

[0070] In some examples, as the helical rotation angle of the second helical groove 112 increases, the second helical center of the second helical groove 112 can be offset along the first direction. The offset direction of the second helical center can be opposite to the offset direction of the first helical center.

[0071] In other words, in some examples of the embodiments of this application, during the process of ablation to form the second spiral groove 112 on the welding surface, the formation method of the second spiral groove 112 can be the same as the formation method of the first spiral groove 111, only the movement direction of the welded workpiece relative to the processing head is opposite. For example, referring to... Figure 2 As shown, during the machining of the first spiral groove 111, the welded workpiece can move along... Figure 2 The negative direction of the x-axis causes the helical center of the machining head to move relative to the workpiece along... Figure 2The workpiece can move in the positive direction of the x-axis during the machining of the second spiral groove 112. Figure 2 The positive movement of the x-axis allows the helical center of the machining head to be positioned relative to the workpiece along... Figure 2 Shift in the negative direction of the x-axis.

[0072] In some examples, the helical direction of the second helical groove 112 may be the same as that of the first helical groove 111.

[0073] In some examples, the helical direction of the second helical groove 112 may be opposite to that of the first helical groove 111.

[0074] It is understood that in some examples of the embodiments of this application, as the helical rotation angle of the first helical groove 111 increases, the first helical center of the first helical groove 111 is set to be offset along the first direction. Thus, referring to... Figure 1 and Figure 2 As shown, the first spiral groove 111 has a large groove spacing on one side along the first direction and a small groove spacing on the other side along the first direction. The area with a large spacing can suppress the flow of solder along the first direction, while the side with a small spacing can allow the solder to spread effectively. Furthermore, as the spiral rotation angle of the second spiral groove 112 increases, the second spiral center of the second spiral groove 112 is set to be offset along the first direction, and the offset direction of the second spiral center is opposite to the offset direction of the first spiral center. Thus, referring to... Figure 1 As shown, the second spiral groove 112 forms a region with a small groove spacing, which is exactly the opposite of the first spiral groove 111. After the second spiral groove 112 connects with the first spiral groove 111, the solder can spread in the region with a small groove spacing between the first spiral groove 111 and the second spiral groove 112, allowing the solder to spread along an S-shaped path on the welding surface, thus improving the uniformity of the solder spreading on the welding surface. In addition, the region with a large groove spacing can inhibit the flow of solder, thereby reducing solder overflow from the weld, reducing porosity in the welding area, and improving the welding strength.

[0075] The textured arrangement structure 10 provided in this application embodiment has a plurality of repeating textured units 11. Each textured unit 11 includes a first spiral groove 111. As the spiral rotation angle of this spiral groove increases, the extreme diameter of the first spiral groove 111 increases, and the first spiral center of the first spiral groove 111 is offset along a first direction. A second spiral groove 112 is arranged side by side with the first spiral groove 111 along a second direction. The outer ring of the second spiral groove 112 is connected to the outer ring of the first spiral groove 111. As the rotation angle of the second spiral groove 112 increases, the extreme diameter of the second spiral groove 112 increases, and the second spiral center of the second spiral groove 112 is offset along the first direction. The offset direction of the second spiral center is opposite to the offset direction of the first spiral center. Thus, along the second direction, the first spiral groove 111 and the second spiral groove 112 are connected to form an S-shaped guide groove. The S-shaped guide groove can guide the flow of solder and prevent the solder from flowing in other directions, which facilitates the solder to wet and spread on the welding surface. In the first direction, the centers of the first and second spirals are offset, so that there are areas with different densities in the first spiral groove 111 and the second spiral groove 112. In the coefficient area, the spreading of solder can be suppressed, thereby reducing the overflow of solder from the weld. The ability of the texture structure to spread solder is improved, which makes it easier to control the flow and distribution of solder in the weld. This can improve the welding strength between the welded workpiece and the weld base, facilitate energy transfer, and improve the fatigue resistance of the welded workpiece joint and the service life of the welded workpiece.

[0076] In some examples, refer to Figure 2 and Figure 3 As shown, either the first spiral groove 111 or the second spiral groove 112 may include the first groove segment 1101.

[0077] In some examples, the first groove segment 1101 may be the inner segment of the first helical groove 111. When forming the first helical groove 111, it can be formed by spiraling outward from the inner starting end.

[0078] In some examples, the distance increased by one revolution of the extreme diameter of the first groove segment 1101 along the spiral direction of the first spiral groove 111 can be a first distance d1. The first distance d1 can be set according to the specific material of the workpiece to be welded, the area of ​​the welding surface, etc. In some examples of the embodiments of this application, the specific value of the first distance d1 is not limited.

[0079] In some examples, refer to Figure 2 and Figure 3As shown, either the first spiral groove 111 or the second spiral groove 112 may include a second groove segment 1102. The starting end of the second groove segment 1102 may be connected to the end of the first groove segment 1101. That is, the starting end of the second groove segment 1102 may be the end of the first groove segment 1101.

[0080] In some examples, the extreme diameter of the starting end of the second groove segment 1102 can be the same as the extreme diameter of the ending end of the first groove segment 1101. That is, the starting end of the second groove segment 1102 can be tangent to the ending end of the first groove segment 1101. This facilitates a smooth transition between the first groove segment 1101 and the second groove segment 1102, and facilitates the uniform spread of solder on the welding surface.

[0081] In some examples, the distance increased by one revolution of the second groove segment 1102 along the rotation direction of the first spiral groove 111 can be a second distance d2. It is understood that the second distance d2 can be set according to the specific material of the welded workpiece, the area of ​​the welded surface, etc. In some examples of the embodiments of this application, the specific value of the second distance d2 is not limited.

[0082] In some examples, the second distance d2 can be less than the first distance d1. In this way, in the outer region of either the first spiral groove 111 or the second spiral groove 112, the spacing between two adjacent spiral grooves can be reduced, so that the distribution density of the spiral grooves in the outer region is similar to or approximates the distribution density of the spiral grooves in the inner region. This facilitates the uniform spread of the solder on the welding surface, thereby improving the welding strength between the welded workpiece and the welding substrate.

[0083] In some examples of embodiments of this application, by configuring either the first spiral groove 111 or the second spiral groove 112 to include a first groove segment 1101 and a second groove segment 1102, along the spiral direction of the first spiral groove 111, the distance increased by one revolution of the extreme diameter of the first groove segment 1101 is a first distance d1, and the distance increased by one revolution of the extreme diameter of the second groove segment 1102 is a second distance d2, and the second distance d2 is set to be less than the first distance d1. In this way, the first groove segment 1101 is located on the inner side of the spiral, and its larger first spacing can enable the spiral grooves in the inner region to expand rapidly in a smaller number of revolutions, avoiding the grooves being too densely distributed due to the inner spacing being too small; when the spiral extends to the outer region, the smaller second spacing is switched, which can reduce the rate of increase of the extreme diameter, so that the spacing between two adjacent spiral grooves on the outer side does not increase excessively due to the increase of the radius, thereby making the spiral groove distribution on the entire welding surface more uniform. It helps the solder to flow and fill the groove more smoothly during the welding process, improving the density and bonding strength of the weld joint, and enhancing the reliability and stability of the connection between the welded workpiece and the weld base.

[0084] In some examples, the second distance d2 can be less than or equal to half of the first distance d1.

[0085] In some examples of embodiments of this application, the second distance d2 is set to be less than or equal to half of the first distance d1. This improves the overall uniformity of the spiral grooves on the weld surface; for the second groove segment 1102, the spacing between adjacent spiral grooves can be more effectively controlled, avoiding situations where the solder flow is interrupted or insufficiently filled due to excessive spacing. This helps the solder form a more continuous and uniform filling path during welding, further improving the density of the weld joint, reducing welding defects such as porosity and cracks, and thus significantly enhancing the reliability and long-term stability of the connection between the welded workpiece and the weld substrate.

[0086] In some examples, refer to Figure 2 and Figure 3 As shown, either the first spiral groove 111 or the second spiral groove 112 may include a third groove segment 1103. The starting end of the third groove segment 1103 may be connected to the end of the second groove segment 1102.

[0087] In some examples, the extreme diameter of the starting end of the third slot segment 1103 may be the same as the extreme diameter of the ending end of the second slot segment 1102. It is understood that the connection relationship between the third slot segment 1103 and the second slot segment 1102 may be the same as, similar to, or analogous to the connection relationship between the second slot segment 1102 and the first slot segment 1101 in the foregoing embodiments of this application. For details, please refer to the detailed description of the second slot segment 1102 and the first slot segment 1101 in the foregoing embodiments of this application; this application will not repeat this description further.

[0088] In some examples, the extreme diameter of the third groove segment 1103 remains unchanged along the rotation direction of the first helical groove 111. That is, referring to... Figure 3 As shown, the third groove segment 1103 can be formed by rotating the center of a perfect circle along the first direction. Figure 2 The third slot section 1103.

[0089] In some examples, the third segment 1103 of the first helical groove 111 may be connected to the third segment 1103 of the second helical groove 112.

[0090] In some examples, the third segment 1103 of the first spiral groove 111 may be tangent to the third segment 1103 of the second spiral groove 112.

[0091] In some examples of embodiments of this application, either the first spiral groove 111 or the second spiral groove 112 includes a third groove segment 1103. The starting end of the third groove segment 1103 is connected to the end of the second groove segment 1102, and the extreme diameter of the starting end of the third groove segment 1103 is set to be the same as the extreme diameter of the end of the second groove segment 1102, while the extreme diameter of the third groove segment 1103 remains unchanged. The third groove segment 1103 of the first spiral groove 111 and the third groove segment 1103 of the second spiral groove 112 are connected. This design, where the extreme diameter of the third groove segment 1103 remains unchanged, allows it to form an approximately circular transition region. When the third groove segment 1103 of the first spiral groove 111 and the second spiral groove 112 are connected, a smooth connection channel can be constructed between the two spiral grooves, avoiding stress concentration that may occur due to abrupt changes in the extreme diameter at the groove segment connection point. This helps improve the smoothness of solder flow and facilitates solder guidance.

[0092] In some examples, the rotation angle of the first groove segment 1101 along the rotation direction of the first helical groove 111 can be a first angle. For example, the rotation angle of the first groove segment 1101 in one revolution can be 360°. The first groove segment 1101 can rotate multiple revolutions.

[0093] In some examples, the rotation angle of the second slot segment 1102 can be a second angle.

[0094] In some examples, the first angle can be greater than or equal to the second angle. For example, the first angle can be the angle corresponding to the first slot segment 1101 rotating 7.5 revolutions. The second angle can be the angle corresponding to the second slot segment 1102 rotating 6 revolutions.

[0095] It is understood that in the embodiments of this application, the number of rotations of the first groove segment 1101 and the second groove segment 1102 are only used as specific examples for illustration, and are not intended to limit the number of rotations of the first groove segment 1101 and the second groove segment 1102.

[0096] In some examples, the rotation angle of the third slot segment 1103 can be a third angle. The second angle can be greater than or equal to the third angle.

[0097] In some examples of embodiments of this application, along the rotation direction of the first spiral groove 111, the rotation angle of the first groove segment 1101 is set as a first angle, the rotation angle of the second groove segment 1102 is set as a second angle, and the rotation angle of the third groove segment 1103 is set as a third angle; and the first angle is set to be greater than or equal to the second angle, and the second angle is set to be greater than or equal to the third angle. Thus, by setting the first angle to be greater than or equal to the second angle, i.e., the first groove segment 1101 rotates a relatively large number of times, a longer flow path and more sufficient guidance can be provided for the solder in the initial stage of the textured arrangement structure 10, allowing the solder to gradually stabilize its flow state before entering the second groove segment 1102, reducing turbulence during initial flow. Setting the second angle to be greater than or equal to the third angle allows for effective control of the solder flow speed and direction when the solder transitions from the second groove segment 1102 to the third groove segment 1103, avoiding flow obstruction due to sudden angle changes. This gradually decreasing angle setting creates a gradient guidance mechanism, making the solder flow more smoothly and orderly throughout the spiral groove. This improves the uniformity and consistency of solder filling during welding, reducing the probability of welding defects. Simultaneously, this rational angle configuration also helps optimize the stress distribution within the textured arrangement structure 10, further enhancing its structural stability during welding and extending its service life.

[0098] In some examples, the arc length corresponding to the third angle along the rotation direction of the first helical groove 111 can be less than or equal to 2π.

[0099] In other words, in some examples of the embodiments of this application, the third groove segment 1103 can rotate one revolution or less than one revolution. It is only necessary to ensure that the third groove segment 1103 of the first spiral groove 111 can communicate with the third groove segment 1103 of the second spiral groove 112.

[0100] In some examples, the arc length corresponding to the third slot segment 1103 can be 2π.

[0101] In some examples of embodiments of this application, the arc length corresponding to the third angle is set to be less than or equal to 2π. This reduces the processing length of the third groove segment 1103, shortens processing time, and improves the processing efficiency of the textured layout structure 10.

[0102] Figure 4 This is a simplified structural diagram of the textured arrangement structure provided in some embodiments of this application.

[0103] In some examples, refer to Figure 1 and Figure 4As shown, along the second direction, there is a third distance d3 between the center of the first spiral and the center of the second spiral. The third distance d3 can be less than or equal to twice the maximum diameter of the first spiral groove 111 or the second spiral groove 112. This facilitates the interconnection of the third groove segment 1103 of the first spiral groove 111 and the second spiral groove 112, and facilitates the uniform spreading and flow of solder on the welding surface.

[0104] In some examples, the textural arrangement 10 formed by a laser processing head on the welding surface is used as an example for illustration. After the first helical groove 111 is ablated, the welded workpiece can be welded along a second direction (e.g., Figure 1 and Figure 4 Move the third distance d3 (in the direction shown by the y-axis) and then process the second spiral groove 112 on the welding surface to facilitate the connection between the second spiral groove 112 and the first spiral groove 111.

[0105] In some examples of embodiments of this application, along the second direction, the distance between the center of the first spiral and the center of the second spiral is set as a third distance d3, and the third distance d3 is set to be less than or equal to twice the maximum diameter of the first spiral groove 111 or the second spiral groove 112. This ensures that the third groove segments 1103 of the first spiral groove 111 and the second spiral groove 112 are close to each other and connected in the second direction, providing a continuous and smooth channel for the flow of solder during the welding process. This effectively avoids the problem of solder flow obstruction or uneven distribution caused by excessively large groove segment intervals, thereby ensuring that the solder can be more evenly spread across the entire welding surface and improving welding quality.

[0106] In some examples, the third distance d3 can be less than or equal to 0.3 mm. That is, in some examples of embodiments of this application, twice the maximum diameter of either the first spiral groove 111 or the second spiral groove 112 can be 0.3 mm. Thus, each of the first spiral groove 111 and the second spiral groove 112 is a microstructure formed on the welding surface. This facilitates the active regulation of the interaction with the external environment through the microstructure of the first spiral groove 111 and the second spiral groove 112. The micro-pits and grooves formed on the welding surface can mechanically interlock with the solder, enhancing the bonding strength and adhesion of the solder on the welding surface. Furthermore, it facilitates the directional flow and spread of the solder under the guidance of the microstructure, making it easy to control the flow and spread direction of the solder on the welding surface.

[0107] In some examples, refer to Figure 1 and Figure 4 As shown, along the first direction, there can be a fourth distance d4 between adjacent first spiral centers or adjacent second spiral centers.

[0108] In some examples, refer to Figure 1 and Figure 4 As shown, along the first direction, there can be a fourth distance d4 between adjacent first spiral centers.

[0109] In some examples, refer to Figure 1 and Figure 4 As shown, along the first direction, there can be a fourth distance d4 between adjacent second spiral centers.

[0110] In some examples, the fourth distance d4 is less than or equal to the maximum extreme diameter of either the first spiral groove 111 or the second spiral groove 112.

[0111] In other words, after a first spiral groove 111 is machined in the first direction, when machining the next first spiral groove 111 in the first direction, the next first spiral groove 111 can partially overlap with the current first spiral groove 111. For example, the distance the workpiece moves along the first direction can be less than twice the maximum diameter of the first spiral groove 111.

[0112] In some examples of embodiments of this application, along the first direction, the distance between adjacent first spiral centers or adjacent second spiral centers is set as a fourth distance d4, and the fourth distance d4 is set to be less than or equal to the maximum extreme diameter of either the first spiral groove 111 or the second spiral groove 112. Thus, along the first direction, adjacent first spiral grooves 111 or adjacent second spiral grooves 112 can partially overlap. When the solder flows during welding, the overlapping area can provide more flow channels and adhesion points for the solder, promoting more uniform and sufficient solder spreading, reducing solder aggregation or uneven distribution, thereby improving the overall quality and reliability of the weld. Furthermore, the partially overlapping microstructure can enhance the mechanical interlocking between the welding surface and the solder. The complex morphology formed by the overlap makes the interlocking between the solder and the microstructure more compact after solidification, not only resisting greater shear and tensile forces, but also effectively preventing delamination or detachment between the solder and the welding surface, significantly improving the mechanical properties and long-term stability of the weld joint.

[0113] In some examples, the fourth distance d4 can be less than or equal to 0.15 mm.

[0114] It should be noted that the numerical values ​​and ranges involved in the embodiments of this application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors, which can be considered negligible by those skilled in the art.

[0115] In some examples, the width of either the first helical groove 111 or the second helical groove 112 may be less than or equal to 60 μm.

[0116] In some examples, the method of using a laser processing head to process the welded surface of a workpiece is illustrated. The laser processing spot of the laser processing head can be focused into a spot of less than or equal to 60 μm, thereby forming a groove width of less than or equal to 60 μm.

[0117] In some examples of embodiments of this application, the width of either the first spiral groove 111 or the second spiral groove 112 is set to be less than or equal to 60 μm. This smaller groove width increases the specific surface area of ​​the welding surface, allowing the solder to spread fully on the welding surface through a siphon effect during the filling process. This facilitates the solder filling deeper into the texture, reducing welding defects such as porosity and slag inclusions, and ensuring the tightness of the weld joint.

[0118] In some examples, embodiments of this application provide a welded workpiece, including a workpiece body. The workpiece body may have a welding surface.

[0119] In some examples, the welding surface may be provided with the textured arrangement structure 10 provided in the foregoing embodiments of this application.

[0120] In some examples, the workpiece to be welded may include the cutting tools required for welding.

[0121] In some examples, the workpiece to be welded can be made of cemented carbide.

[0122] It is understood that the welded workpieces provided in some examples of the embodiments of this application have the same, corresponding or similar technical features as the textured arrangement structure 10 provided in the foregoing embodiments of this application; therefore, the welded workpieces provided in some examples of the embodiments of this application may have the same, corresponding or similar technical effects as the textured arrangement structure 10 provided in the foregoing embodiments of this application. For details, please refer to the detailed description of the foregoing embodiments of this application. The embodiments of this application will not repeat the details here.

[0123] Figure 5 This is a flowchart illustrating an implementation method for a fabrication layout structure provided in some embodiments of this application.

[0124] In some examples, refer to Figure 5 As shown, this application embodiment provides a method for processing a textured fabric structure 10. The method for processing the textured fabric structure 10 includes the following steps:

[0125] S501, a workpiece is fixed and welded on a laser processing table. The workpiece has a welding surface facing the laser processing head.

[0126] It is understood that in some examples of the embodiments of this application, the welding surface of the welding workpiece can be pretreated before the welding workpiece is fixed on the laser processing table.

[0127] In some examples, the pretreatment of the welding surface of the welded workpiece can be the same as, similar to or similar to that in related technologies. For details, please refer to the detailed description of related technologies. This application will not repeat the details in the embodiments.

[0128] S502, the laser processing head executes a texture processing cycle until the texture arrangement structure 10 is processed on the welding surface. The texture processing cycle includes:

[0129] s5021, the laser processing head processes the welding surface along the first spiral path, and the laser processing table moves linearly along the first direction to form the current first spiral groove 111 on the welding surface.

[0130] In some examples, refer to Figure 2 and Figure 3 As shown, when forming the textured arrangement structure 10 on the welding surface, the laser processing head can process along the first helical path on the welding surface. The path trajectory expression of the first helical path can be given by the following formula:

[0131] First section 1101:

[0132] Second section 1102:

[0133] Third section 1103:

[0134] Wherein, a, b, c, d, e, and f are constants, which can be set according to the actual width of the spiral groove and the increase in the radius of the spiral groove after one revolution. This application embodiment does not impose any restrictions on this. θ is the rotation angle of the first spiral path, which can be set according to actual needs. In this application embodiment, the angle of θ is only shown as some specific examples and is not a limitation on the rotation angle of the first spiral path. x is the coordinate of any point on the first spiral path on the x-axis when the first spiral center corresponding to the starting point of the first spiral path is taken as the origin of the coordinate system. y is the coordinate of any point on the first spiral path on the y-axis when the first spiral center corresponding to the starting point of the first spiral path is taken as the origin of the coordinate system.

[0135] In some examples, during the laser processing head's processing of the welding surface, the laser processing stage can move along a first direction, causing the first helical center of the first helical groove 111 to shift along the first direction. For example, when the laser processing stage moves along the first direction with the welding workpiece... Figure 1 During the movement along the negative x-axis, the center of the first spiral along Figure 1 Offset in the positive x-axis direction.

[0136] s5022, the laser processing table drives the welding workpiece to move a fourth distance d4 in a straight line along the first direction, the laser processing head processes the welding surface along the first spiral path, and the laser processing table moves in a straight line along the first direction until the current row of multiple first spiral grooves 111 are processed on the welding surface along the first direction.

[0137] For example, refer to Figure 1 As shown, after the laser processing head completes processing a first spiral groove 111 at the current position along the first spiral path, the laser processing head can pause processing. At this time, the laser processing table can drive the welding workpiece along... Figure 1 The laser processing head moves a fourth distance d4 in the negative x-axis direction. Figure 1 The spiral center of the next first spiral groove 111 is shifted by a fourth distance d4 in the positive direction of the x-axis. This causes the spiral center of the next first spiral groove 111 to be offset by a fourth distance d4 relative to the spiral center of the current first spiral groove 111.

[0138] In some examples, after the laser processing stage moves a fourth distance d4 along the first direction, the laser processing head can continue to process the welding surface along the first helical path.

[0139] s5023, the laser processing table moves a third distance d3 along the second direction, the laser processing head processes the welding surface along the first spiral path, and the laser processing table moves in the opposite direction along the first direction to form the current second spiral groove 112 on the welding surface.

[0140] In some examples, this can be done after the laser processing head has processed a row of multiple first helical grooves 111 along a first direction on the welding surface, referring to... Figure 1 and Figure 4 As shown, the laser processing stage can move a third distance d3 along the second direction. For example, the laser processing stage can move along... Figure 1 and Figure 4 Move a third distance d3 in the direction shown by the y-axis.

[0141] In some examples, the laser processing head can process the welding surface along the first helical path after the laser processing stage has moved a third distance d3 along the second direction. At this time, the laser processing stage can move linearly in the opposite direction of the first direction. That is, the laser processing stage can move along... Figure 1 and Figure 4 The second spiral center of the second spiral groove 112 moves along the positive x-axis direction, thereby causing the second spiral center of the second spiral groove 112 to move along the positive x-axis direction. Figure 1 and Figure 4 Offset in the negative x-axis direction. Until the entire surface of the welding surface is machined to form a textured arrangement structure 10.

[0142] It is understood that the processing methods of the textured layout structure 10 provided in some examples of the embodiments of this application have the same or corresponding technical features as the textured layout structure 10 provided in the foregoing embodiments of this application; therefore, the processing methods of the textured layout structure 10 provided in some examples of the embodiments of this application may have the same, corresponding or similar technical effects as the textured layout structure 10 provided in the foregoing embodiments of this application. For details, please refer to the detailed description of the foregoing embodiments of this application, and this application will not repeat them here.

[0143] In some examples, the laser processing head can process the welding surface with a power of 1W-100W.

[0144] Figure 6 These are structural diagrams of textured layout structures formed under different power conditions according to some embodiments of this application. Figure 7 These are three-dimensional structural diagrams of the textured arrangement structures formed under different power conditions according to some embodiments of this application.

[0145] In some examples, refer to Figure 6 and Figure 7 As shown, Figure 6 and Figure 7 The diagrams show the structural diagrams of the subsequent arrangement structures formed after processing at laser powers of 5W, 10W, 15W, 35W, 50W, 75W, and 100W. From... Figure 6 and Figure 7 It can be seen that as the laser power increases, the depth of the texture arrangement structure 10 on the welded surface becomes more obvious. After the power reaches a certain value, the welded surface becomes blurred due to overheating.

[0146] In some examples, the laser power of the laser processing head for processing welded workpieces can be 35W-60W.

[0147] In some examples, the laser power can be 35W, 50W, or 60W.

[0148] In some examples of embodiments of this application, reference is made to Figure 6 and Figure 7 As shown, the laser power is set between 35W and 60W. This results in a clearly textured structure 10 after processing, which facilitates the guidance of the solder by the textured structure 10, ensuring uniform distribution of the solder on the welding surface and improving the stability of the weld between the workpiece and the substrate.

[0149] In some examples, the laser processing head can move at a speed of 1 mm / s to 2000 mm / s along the first helical path.

[0150] Figure 8 These are structural diagrams of the textured layout structures formed by processing at different moving speeds according to some embodiments of this application.

[0151] In some examples, refer to Figure 8 As shown, the moving speed of the laser processing head along the first spiral path can be 50mm / s, 100mm / s, 250mm / s, 500mm / s, 1000mm / s or 2000mm / s.

[0152] In some examples, refer to Figure 8 As shown, when the laser processing head moving speed is low, the laser roughening area of ​​the weld surface is incomplete. When the laser processing head moving speed reaches 500 mm / s, the entire weld surface is roughened, but the grooves tend to be horizontal, making it difficult to guide the solder in a specific direction. When the moving speed reaches 1000 mm / s, the entire weld surface is roughened, and the grooves are obvious.

[0153] In some examples, the laser processing head moves at a speed of 700 mm / s to 1500 mm / s along the first helical path.

[0154] In some examples, after the textured arrangement structure 10 is fabricated on the weld surface, laser ablation residue on the weld surface can also be removed.

[0155] In some examples, the removal of laser ablation residue from the weld surface can be the same as, similar to or similar to that in related technologies. For details, please refer to the detailed description of related technologies. This application will not repeat the details in the embodiments.

[0156] Figure 9 These are solder morphology diagrams before and after welding of textured layout structures formed under different power conditions according to some embodiments of this application. Figure 10 These are solder morphology diagrams before and after welding of textured layout structures formed at different moving speeds according to some embodiments of this application.

[0157] In some examples, after forming a textured arrangement structure 10 on the welding surface of the welded workpiece, the spread of the solder on the welding surface can be tested.

[0158] In some examples, a drop of silver-copper solder can be placed on the welding surface and baked in an industrial oven at 80℃-250℃ for 5-60 minutes. After baking, the workpiece is transferred to a vacuum furnace for heating, which can be done at 300℃-600℃ for 5-60 minutes, followed by a 5-60 minute holding period. After the holding period, the temperature is raised to 400℃-700℃ within 5-60 minutes and held for another 5-60 minutes. After the holding period, the temperature is raised to 600℃-900℃ within 5-60 minutes and held for another 5-60 minutes. After the holding period, the temperature is cooled to room temperature at a rate of 1℃-20℃ / min. The solder extension is recorded after cooling. Figure 9 and Figure 10 As shown.

[0159] from Figure 9 and Figure 10 As can be seen, in some examples of the embodiments of this application, after adopting the textured arrangement structure 10 provided in the foregoing embodiments of this application, the solder on the welding surface after processing with a power of 35W-60W is spread well; in addition, the solder on the welding surface after processing with a laser processing head moving speed of 700mm / s-1500mm / s is spread well.

[0160] Figure 11 This is a graph showing the ratio of the spread of the textured layout structure in the x and y directions before and after welding, formed by processing at different power levels according to some embodiments of this application. Figure 12 This is a graph showing the spread ratio of the textured layout structure in the x and y directions before and after welding, formed by processing at different moving speeds according to some embodiments of this application.

[0161] In some examples, refer to Figure 11 and Figure 12 As shown, to further verify the spreading performance of the solder in different directions of the textured arrangement structure 10, the length of the solder in the y-direction after drying on the welding surface is marked as y1, and the length in the x-direction is marked as x1, with the ratio R1 = y1 / x1. The length of the solder in the y-direction after vacuum furnace welding on the welding surface is marked as y2, and the length in the x-direction is marked as x2, with the ratio R2 = y2 / x2.

[0162] from Figure 11 It can be seen that at power levels of 35W-60W, the ratio of solder thickness along the y-direction to the x-direction is the largest, indicating good directional spreading ability. Similarly, referring to... Figure 12 As shown, when the laser processing head moving speed is between 700 mm / s and 1500 mm / s, the ratio of solder along the y-direction to the x-direction is the largest, indicating the best directional spreading ability. Furthermore, from... Figure 11 and Figure 12It can be seen that after the workpiece is dried, almost no solder loss or shrinkage occurs during the vacuum green brazing process, indicating that the textured arrangement structure 10 provided in this application embodiment has the function of locking the solder.

[0163] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0164] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A textured arrangement structure, characterized in that, The textured arrangement has multiple repeating textured units, with adjacent textured units partially overlapping along a first direction; the textured unit includes: As the spiral rotation angle of the first spiral groove increases, the extreme diameter of the first spiral groove increases, and the first spiral center of the first spiral groove shifts along the first direction. The second spiral groove is arranged side by side with the first spiral groove along the second direction, and the outer ring of the second spiral groove is connected to the outer ring of the first spiral groove; as the rotation angle of the second spiral groove increases, the extreme diameter of the second spiral groove increases, and the second spiral center of the second spiral groove is offset along the first direction, wherein the offset direction of the second spiral center is opposite to the offset direction of the first spiral center, and the second direction intersects with the first direction.

2. The textured arrangement structure according to claim 1, characterized in that, Either the first helical groove or the second helical groove includes: The first groove segment, along the spiral direction of the first spiral groove, increases by a first distance with one revolution of the extreme diameter of the first groove segment; The second groove segment has its starting end connected to the end of the first groove segment, and the extreme diameter of the starting end of the second groove segment is the same as the extreme diameter of the end of the first groove segment; the distance increased by the extreme diameter of the second groove segment by one revolution along the spiral direction of the first spiral groove is the second distance; the second distance is less than the first distance. The third groove segment has its starting end connected to the end of the second groove segment, and the extreme diameter of the starting end of the third groove segment is the same as the extreme diameter of the end of the second groove segment; the extreme diameter of the third groove segment remains unchanged along the rotation direction of the first spiral groove. The third segment of the first spiral groove is connected to the third segment of the second spiral groove.

3. The textured arrangement structure according to claim 2, characterized in that, Along the rotation direction of the first spiral groove, the rotation angle of the first groove segment is a first angle, the rotation angle of the second groove segment is a second angle, and the rotation angle of the third groove segment is a third angle. The first angle is greater than or equal to the second angle, and the second angle is greater than or equal to the third angle.

4. The textured arrangement structure according to any one of claims 1-3, characterized in that, Along the second direction, there is a third distance between the first spiral center and the second spiral center, the third distance being less than or equal to twice the maximum extreme diameter of the first spiral groove or the second spiral groove.

5. The textured arrangement structure according to claim 4, characterized in that, The third distance is less than or equal to 0.3 mm.

6. The textured arrangement structure according to any one of claims 1-3, characterized in that, Along the first direction, there is a fourth distance between adjacent first spiral centers or adjacent second spiral centers, the fourth distance being less than or equal to the maximum extreme diameter of either the first spiral groove or the second spiral groove.

7. The textured arrangement structure according to claim 6, characterized in that, The fourth distance is less than or equal to 0.15 mm.

8. A welded workpiece, characterized in that, The invention includes a workpiece body, the workpiece body having a welding surface, the welding surface having a textured arrangement structure as described in any one of claims 1-7.

9. A method for processing a textured layout structure, characterized in that, The method includes: A workpiece is fixed and welded on a laser processing table. The workpiece has a welding surface that faces the laser processing head. The laser processing head performs a texturing cycle until the texturing arrangement is completed on the welding surface. The texturing cycle includes: The laser processing head processes the welding surface along a first spiral path, and the laser processing table moves linearly along a first direction to form a current first spiral groove on the welding surface; The laser processing table drives the welding workpiece to move a fourth distance in a straight line along the first direction, the laser processing head processes the welding surface along the first spiral path, and the laser processing table moves in a straight line along the first direction until the current row of multiple first spiral grooves is processed on the welding surface along the first direction. The laser processing stage moves a third distance along the second direction, the laser processing head processes the welding surface along the first spiral path, and the laser processing stage moves in the opposite direction along the first direction to form a current second spiral groove on the welding surface.

10. The processing method of the textured layout structure according to claim 9, characterized in that, The laser power of the laser processing head for processing the welding surface is 1W-100W.

11. The processing method of the textured layout structure according to claim 9 or 10, characterized in that, The laser processing head moves at a speed of 1 mm / s to 2000 mm / s along the first spiral path.

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