Artificial board with heat insulation function

By using low-density poplar and pine wood substrates in engineered wood panels, embedding multiple layers of thermal insulation materials, and using concealed assembly components, the problems of insufficient thermal insulation performance and unstable assembly of engineered wood panels are solved, achieving efficient thermal insulation and structural stability.

CN121912459AActive Publication Date: 2026-04-24SUZHOU PI MATERIAL RECYCLING ENVIRONMENTAL PROTECTION CO LTD
View PDF 6 Cites 0 Cited by

Patent Information

Application Number
CN202610368540.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-25
Publication Date
2026-04-24
Estimated Expiration
2046-03-25

AI Technical Summary

Technical Problem

Existing engineered wood panels are inadequate in terms of thermal insulation, leading to rapid heat transfer between indoors and outdoors, increasing energy consumption, and traditional assembly methods affect aesthetics and structural stability.

Method used

Using low-density poplar and pine as the base material, a multi-layered insulation structure is embedded with inorganic insulation materials such as expanded perlite and aerogel, as well as organic insulation materials such as polystyrene particles and polyurethane foam. It is fixed by hidden assembly components to form multiple insulation cavities and reduce the heat conduction path.

Benefits of technology

It significantly improves the thermal insulation performance of engineered wood panels, reduces heat exchange, decreases energy consumption, improves energy efficiency, and maintains structural stability and aesthetics.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121912459A_ABST
    Figure CN121912459A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of plates, in particular to an artificial board with a heat insulation function, which comprises two groups of base materials, the two groups of base materials are stacked, a bonding layer is arranged between the two groups of stacked base materials, a protective layer is sleeved above the two groups of stacked base materials, and heat insulation layers are embedded in the two groups of base materials. Hidden assembling assemblies are arranged on the two sides of the base materials and used for assembling and fixing the two base materials. The heat-insulating artificial board has the beneficial effects that the embedding grooves are formed in the top surfaces of the base plate and the clamping plate and are filled with the first heat-insulating filler layer and the second heat-insulating filler layer respectively, and two heat-insulating cavities are formed in the artificial board. The cavity between the base plate and the clamping plate is filled with the first heat insulation packing layer, the cavity between the clamping plate and the sleeve plate is filled with the second heat insulation packing layer, and the multi-layer heat insulation structure effectively reduces heat conduction paths and greatly reduces the heat transfer speed.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of panel technology, specifically to a type of engineered wood panel with heat insulation properties. Background Technology

[0002] In construction, furniture manufacturing, and interior decoration, engineered wood products are widely used as an important material. As people's demands for comfortable living environments continue to increase, higher requirements are being placed on the performance of engineered wood products. Among these, thermal insulation performance has become one of the important indicators for evaluating the quality of engineered wood products.

[0003] Traditional engineered wood panels primarily focus on basic properties such as strength and durability, with relatively weak performance in thermal insulation. In the construction industry, using engineered wood panels with poor thermal insulation as structural materials for walls, ceilings, etc., leads to rapid heat transfer between indoors and outdoors, increasing energy consumption of air conditioning, heating, and other equipment, reducing energy efficiency, and hindering energy conservation and emission reduction. In summer, high outdoor temperatures easily penetrate indoors, raising indoor temperatures and requiring people to run air conditioning for extended periods to maintain a comfortable indoor temperature; while in winter, indoor heat easily dissipates to the outside, requiring even more energy to heat the room.

[0004] From a materials perspective, most engineered wood products on the market today use a single material or a simple composite structure, lacking effective thermal insulation design in their internal structure. While wood itself has some thermal insulation properties, in the manufacturing process of ordinary engineered wood products, the gaps between wood fibers are filled with glue and other substances, reducing the air layer and lowering the insulation effect. Furthermore, some engineered wood products use high-density wood or increase the amount of glue used to improve strength and stability, which not only increases the weight of the board but also further weakens its thermal insulation performance.

[0005] Meanwhile, existing engineered wood panels also have some shortcomings in their assembly methods. Traditional assembly methods typically involve direct splicing or fixing with metal connectors. These methods not only affect the aesthetics of the panels but also easily create thermal bridges at the joints, exacerbating heat transfer and reducing the overall insulation effect. Moreover, metal connectors may rust or loosen over long-term use, affecting the structural stability and lifespan of the engineered wood panels. Summary of the Invention

[0006] The purpose of this invention is to provide a type of engineered wood panel with heat insulation function to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a heat-insulating artificial board, comprising a substrate, wherein the substrate is provided in two sets, the two sets of substrates are stacked, an adhesive layer is provided between the two stacked sets of substrates, a protective layer is provided on the top of the two stacked sets of substrates, and a heat-insulating layer is embedded in both sets of substrates. Hidden assembly components are provided on both sides of the substrate for assembling and fixing the two sets of substrates.

[0008] Preferably, the substrate includes a pad and a clamp stacked on top of the pad. The pad and the clamp are the same size. An adhesive layer is distributed in a ring between the pad and the clamp. An adhesive layer is also provided between the top of the clamp and the protective layer.

[0009] Preferably, the pad is made of low-density poplar wood, and the plywood is made of low-density pine wood.

[0010] Preferably, the top surfaces of the pad and the clamp are provided with mounting grooves, and two sets of heat insulation layers are provided, with the two sets of heat insulation layers filling the mounting grooves on the top surfaces of the pad and the clamp respectively.

[0011] Preferably, the two sets of heat insulation layers are heat insulation filler layer one and heat insulation filler layer two. Heat insulation filler layer one is filled in the mounting groove on the top surface of the pad, and heat insulation filler layer two is filled in the mounting groove on the top surface of the clamping plate. The top surface of heat insulation filler layer one and the top surface of the pad are coplanar, and the top surface of heat insulation filler layer two and the top surface of the clamping plate are coplanar.

[0012] Preferably, the heat insulation filler layer is made of at least one of expanded perlite, aerogel, and silicate inorganic heat insulation materials.

[0013] Preferably, the second heat insulation filler layer is made of at least one of polystyrene particles and polyurethane foam organic heat insulation materials.

[0014] Preferably, the top surface of both the pad and the clamp is provided with an adhesive embedding structure for embedding the adhesive layer.

[0015] Preferably, the colloid embedding structure includes a coating groove, which is an annular groove. Two sets of coating grooves are respectively opened on the top surface of the pad and the clamping plate. The adhesive layer includes an adhesive layer, which is an annular structure and is embedded in the coating groove. A locking component is provided between the adhesive layer and the coating groove.

[0016] Preferably, the positioning assembly includes a slot and a strip integrally formed on the adhesive layer. Slots are provided on the four inner and four outer ring surfaces of the adhesive coating groove. Strips are integrally formed on the inner and outer ring surfaces of the four side plates of the adhesive layer. After the adhesive layer fills the adhesive coating groove, the strip is inserted into the slot.

[0017] Preferably, the adhesive layer is one of isocyanate adhesive and soybean protein adhesive.

[0018] Preferably, the protective layer includes a sleeve plate, which has a square frame structure. The pad plate and the clamping plate are stacked and inserted into the sleeve plate. The bottom surface of the sleeve plate and the bottom surface of the pad plate are coplanar. The sleeve plate is made of either low-density poplar or low-density pine.

[0019] The concealed assembly component includes a connecting strip. Both sides of the sleeve plate have side grooves. After the two artificial boards are assembled end to end, the two sides of the connecting strip are inserted into the side grooves on the surfaces of the two sets of sleeve plates respectively. The front and rear ends of the sleeve plate have reserved grooves with through holes on their surfaces. The front and rear ends of the connecting strip have two screw holes. Screws are inserted into the reserved grooves. The screws pass through the through holes and are screwed into the screw holes. A silicone plug is inserted into the reserved groove. One end of the silicone plug has a bevel that matches the corner surface of the sleeve plate.

[0020] Compared with the prior art, the beneficial effects of the present invention are: The thermally insulated engineered wood panel proposed in this invention forms two thermally insulated cavities within the panel by creating embedding grooves on the top surfaces of the base plate and the clamping plate, respectively filling them with thermal insulation filler layer one and thermal insulation filler layer two. The cavity between the base plate and the clamping plate is filled with thermal insulation filler layer one, while the cavity between the clamping plate and the sleeve plate is filled with thermal insulation filler layer two. This multi-layered thermal insulation structure effectively reduces the heat conduction path and significantly slows down the heat transfer rate. Thermal insulation filler layer one uses at least one of expanded perlite, aerogel, and silicate inorganic thermal insulation materials. These inorganic thermal insulation materials have characteristics such as low thermal conductivity and high porosity, which can effectively prevent heat transfer. Thermal insulation filler layer two uses at least one of polystyrene particles and polyurethane foam organic thermal insulation materials. Organic thermal insulation materials have good thermal insulation performance and elasticity, which can further enhance the thermal insulation effect. Compared with traditional engineered wood panels, the engineered wood panel of this invention has significantly improved thermal insulation performance, effectively reducing the exchange of heat between indoors and outdoors, reducing the energy consumption of air conditioning, heating and other equipment, improving energy utilization efficiency, and creating a more comfortable living and working environment for people. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 Enlarged schematic diagram of the structure at point A in the middle; Figure 3 This is a top view of the structure of the present invention; Figure 4 for Figure 3 Sectional view of the structure at point AA; Figure 5 for Figure 4 Enlarged schematic diagram of the structure at point B; Figure 6 This is an exploded view of the structure of the present invention; Figure 7for Figure 6 Enlarged schematic diagram of the structure at point C; Figure 8 This is a schematic diagram of the adhesive layer structure of the present invention; Figure 9 This is a schematic diagram of the pad structure of the present invention; Figure 10 This is a schematic diagram of the structure after the two sets of artificial boards of the present invention are spliced ​​together; Figure 11 for Figure 10 Enlarged schematic diagram of the structure at point D; Figure 12 for Figure 10 Top view of the structure; Figure 13 for Figure 12 Structural cross-section view at point BB; Figure 14 for Figure 13 Enlarged schematic diagram of the structure at point E in the middle; Figure 15 This is a schematic diagram of the connecting strip structure of the present invention; Figure 16 This is a schematic diagram of the silicone plug structure of the present invention.

[0022] In the diagram: 1. Pad plate; 2. Clamp plate; 3. Sleeve plate; 4. Insert groove; 5. Thermal insulation filler layer one; 6. Thermal insulation filler layer two; 7. Glue application groove; 8. Slot; 9. Adhesive layer; 10. Side groove; 11. Reserved groove; 12. Perforation; 13. Connecting strip; 14. Screw hole; 15. Silicone plug. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1 to 16This invention provides a technical solution: a heat-insulating artificial board, comprising a substrate, wherein the substrate is provided in two sets, the two sets of substrate are stacked, an adhesive layer is provided between the two stacked sets of substrate, and a protective layer is provided on top of the two stacked sets of substrate. The substrate includes a pad 1 and a clamping plate 2 stacked on top of the pad 1. The pad 1 and the clamping plate 2 are the same size. The adhesive layer is distributed in a ring between the pad 1 and the clamping plate 2, and an adhesive layer is also provided between the top of the clamping plate 2 and the protective layer. The pad 1 is made of low-density poplar wood, and the clamping plate 2 is made of low-density pine wood. The protective layer includes a sleeve 3, which has a square frame structure. After the pad 1 and the clamping plate 2 are stacked, they are inserted into the sleeve 3. The bottom surface of the sleeve 3 is coplanar with the bottom surface of the pad 1. The sleeve 3 is made of either low-density poplar wood or low-density pine wood. After the pad 1 and the clamping plate 2 are stacked, they are pushed into the sleeve plate 3. The sleeve plate 3 protects the pad 1 and the clamping plate 2 to prevent them from being damaged. The pad 1, the clamping plate 2 and the sleeve plate 3 are all made of low-density wood to reduce the weight of the artificial board.

[0025] Both the pad 1 and the clamping plate 2 have an adhesive embedding structure on their top surfaces for embedding the adhesive layer. The adhesive embedding structure includes an adhesive groove 7, which is an annular groove. Two sets of adhesive grooves 7 are respectively opened on the top surfaces of the pad 1 and the clamping plate 2. The adhesive layer includes an adhesive layer 9, which is an annular structure and is embedded in the adhesive groove 7. A locking component is provided between the adhesive layer 9 and the adhesive groove 7. The locking component includes a locking groove 8 and a locking strip integrally formed on the adhesive layer 9. The four inner and four outer annular surfaces of the adhesive groove 7 are provided with locking grooves 8. The four side plates of the adhesive layer 9 are integrally formed with locking strips on their inner and outer annular surfaces. After the adhesive layer 9 fills the adhesive groove 7, the locking strip is inserted into the locking groove 8. The adhesive layer 9 uses either isocyanate glue or soybean protein glue. First, glue is poured into the glue-coating groove 7 on the top surface of the pad 1. Then, the clamping plate 2 is stacked on the pad 1, and the glue adheres to the bottom surface of the clamping plate 2. After the glue cures, it forms an adhesive layer 9. The retaining strips on both sides of the inner ring of the adhesive layer 9 are inserted into the retaining groove 8 to improve the anti-detachment effect of the adhesive layer 9 in the glue-coating groove 7. Similarly, glue is poured into the glue-coating groove 7 on the top surface of the clamping plate 2. Then, the clamping plate 2 with the pad 1 connected to the bottom is pushed into the sleeve plate 3. The glue adheres to the bottom surface of the top plate of the sleeve plate 3. After the glue cures, it forms an adhesive layer 9, realizing the connection between the sleeve plate 3 and the clamping plate 2. The retaining strips on both sides of the inner ring of the adhesive layer 9 are inserted into the retaining groove 8 to improve the anti-detachment effect of the adhesive layer 9 in the glue-coating groove 7.

[0026] Both sets of substrates are embedded with heat insulation layers. The top surfaces of the pad 1 and the clamping plate 2 are each provided with an embedding groove 4. There are two sets of heat insulation layers, which are filled in the embedding grooves 4 on the top surfaces of the pad 1 and the clamping plate 2, respectively. The two sets of heat insulation layers are heat insulation filler layer one 5 and heat insulation filler layer two 6. Heat insulation filler layer one 5 is filled in the embedding groove 4 on the top surface of the pad 1, and heat insulation filler layer two 6 is filled in the embedding groove 4 on the top surface of the clamping plate 2. The top surface of heat insulation filler layer one 5 is coplanar with the top surface of the pad 1, and the top surface of heat insulation filler layer two 6 is coplanar with the top surface of the clamping plate 2. Heat insulation filler layer one 5 is made of at least one of expanded perlite, aerogel, and silicate inorganic heat insulation materials, and heat insulation filler layer two 6 is made of at least one of polystyrene particles and polyurethane foam organic heat insulation materials. Firstly, the grooves 4 on the surfaces of the pad 1 and the clamping plate 2 form two cavities in the engineered wood panel, reducing the heat conduction path. Furthermore, the cavity between the pad 1 and the clamping plate 2 is filled with a heat insulation filler layer 5, and the cavity between the clamping plate 2 and the sleeve plate 3 is filled with a heat insulation filler layer 6. This improves the heat insulation effect of the engineered wood panel, and the grooves 4 on the surfaces of the pad 1 and the clamping plate 2 reduce the overall weight of the engineered wood panel.

[0027] The substrate has hidden assembly components on both sides for assembling and fixing two sets of substrates. The hidden assembly components include connecting strips 13. The sleeve plate 3 has side grooves 10 on both sides. After the two artificial boards are assembled end to end, the two sides of the connecting strip 13 are respectively inserted into the side grooves 10 on the surface of the two sets of sleeve plates 3. The sleeve plate 3 has reserved grooves 11 at both the front and rear ends. The surface of the reserved grooves 11 has through holes 12. The connecting strip 13 has two screw holes 14 at both the front and rear ends. Screws are inserted into the reserved grooves 11. The screws pass through the through holes 12 and are screwed into the screw holes 14. The reserved grooves 11 also have silicone plugs 15 inserted into the reserved grooves 11. One end of the silicone plug 15 has a bevel, which matches the corner surface of the sleeve plate 3. When two engineered wood panels are first joined together, a connecting strip 13 is inserted between the two sleeves 3. At this time, the screw hole 14 at the end of the connecting strip 13 corresponds to the through hole 12. Then, the screw is inserted into the reserved groove 11. The end of the reserved groove 11 passes through the through hole 12 and is screwed into the screw hole 14. In this way, the connecting strip 13 is fixed in the side groove 10. The connecting strip 13 forms a flat line at the joint of the two pads 1, avoiding gaps at the joint of the two pads 1. Then, the silicone plug 15 is inserted into the reserved groove 11 to seal the screw, and the silicone plug 15 fills the groove of the reserved groove 11.

[0028] Application process of engineered wood panels with heat insulation function: Low-density poplar wood is used to make the pad 1. A ring-shaped glue groove 7 and an embedding groove 4 are formed on the top surface of the pad 1 to prepare for subsequent insulation layer filling and bonding. Low-density pine wood is used to make the plywood 2. Similarly, a ring-shaped glue groove 7 and an embedding groove 4 are formed on the top surface of the plywood 2. This structure, together with the pad 1, forms a dual foundation for insulation and bonding. At least one of expanded perlite, aerogel, and silicate inorganic insulation materials is filled into the embedding groove 4 on the top surface of the pad 1 to form an insulation filler layer 5, with its top surface coplanar with the top surface of the pad 1. This insulation filler layer 5 uses inorganic insulation materials, which can effectively reduce heat conduction and provide basic insulation performance for the board. At least one of polystyrene particles and polyurethane foam organic insulation materials is filled into the embedding groove 4 on the top surface of the plywood 2 to form an insulation filler layer 6, with its top surface coplanar with the top surface of the plywood 2. The second layer of heat insulation filler 6 uses organic heat insulation material, which works together with the first layer of heat insulation filler 5 to further improve the heat insulation effect of the board.

[0029] Isocyanate adhesive or soybean protein adhesive is poured into the adhesive groove 7 on the top surface of the pad 1. The adhesive not only serves as a bond but also provides some fixation for the insulation filler layer 5, enhancing the stability of the insulation structure. The clamping plate 2 is stacked on the pad 1, allowing the adhesive to adhere to the bottom surface of the clamping plate 2. After curing, the adhesive layer 9 is formed, and the strips extending from both sides of the inner ring of the adhesive layer 9 are inserted into the grooves 8 of the adhesive groove 7, achieving bonding and fixation between the pad 1 and the clamping plate 2, while ensuring the stability of the insulation filler layer 5. The stacked pad 1 and clamping plate 2 are then pushed into the sleeve plate 3. The sleeve plate 3 is made of low-density poplar or low-density pine wood, with a square frame structure, and its bottom surface is coplanar with the bottom surface of the pad 1. The sleeve plate 3 protects the pad 1 and clamping plate 2 from damage and, together with the insulation filler layer, forms a complete insulation structure. Isocyanate adhesive or soybean protein adhesive is poured into the adhesive groove 7 on the top surface of the clamping plate 2. The clamping plate 2, with the pad plate 1 attached to its bottom, is then pushed into the sleeve plate 3, allowing the adhesive to bond to the bottom surface of the top plate of the sleeve plate 3. After the adhesive cures, it forms the adhesive layer 9, and the retaining strips extending from both sides of the inner ring of the adhesive layer 9 are inserted into the retaining grooves 8 of the adhesive groove 7, thus connecting the sleeve plate 3 and the clamping plate 2. This structure further enhances the overall strength of the board and provides better protection for the heat insulation filler layer 6, improving the heat insulation performance.

[0030] When two engineered wood panels need to be assembled end-to-end, the two sides of the connecting strip 13 are inserted into the side grooves 10 on the surfaces of the two sets of sleeve plates 3. The connecting strip 13 forms a flat line at the joint of the two pad plates 1, preventing gaps and ensuring the continuity of the insulation structure. Screws are inserted into the pre-drilled grooves 11 at both ends of the sleeve plate 3. The surface of the pre-drilled grooves 11 has through holes 12, and the connecting strip 13 has two screw holes 14 at both ends. The screws are screwed through the through holes 12 and then screwed into the screw holes 14 of the connecting strip 13, fixing the connecting strip 13 in the side grooves 10. The connecting strip 13 forms a flat line at the joint of the two pad plates 1, preventing gaps and ensuring the integrity of the insulation structure. Silicone plugs 15 are inserted into the pre-drilled grooves 11 to seal the screws. The silicone plugs 15 fill the opening of the pre-drilled grooves 11, improving the overall aesthetics and protecting the screws from external environmental influences.

[0031] Through the above process, the preparation and assembly of the heat-insulating engineered wood panel are completed. This engineered wood panel, through its multi-layered heat-insulating structure (heat-insulating filler layer 1, 5 and heat-insulating filler layer 2, 6) and a reasonable assembly method (the cooperation of connecting strip 13 with screws and screw holes 14), ensures the flatness and stability of the panel joints, while also enhancing the overall heat insulation function.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A type of engineered wood panel with heat insulation function, comprising a substrate, characterized in that: The substrate is provided in two sets, which are stacked together. An adhesive layer is provided between the two stacked substrates, and a protective layer is provided on top of the two stacked substrates. A heat insulation layer is embedded in each of the two substrates. Hidden assembly components are provided on both sides of the substrate for assembling and fixing the two substrates. The substrate includes a pad (1) and a clamp (2) stacked on top of the pad (1). The pad (1) and the clamp (2) are the same size. The adhesive layer is distributed in a ring between the pad (1) and the clamp (2). An adhesive layer is also provided between the top of the clamp (2) and the protective layer. The pad (1) and the clamp (2) are stacked together. The top surface of the plate (2) is provided with an embedding groove (4). There are two sets of heat insulation layers. The two sets of heat insulation layers are filled in the embedding groove (4) on the top surface of the pad (1) and the clamp (2), respectively. The two sets of heat insulation layers are heat insulation filler layer one (5) and heat insulation filler layer two (6). Heat insulation filler layer one (5) is filled in the embedding groove (4) on the top surface of the pad (1), and heat insulation filler layer two (6) is filled in the embedding groove (4) on the top surface of the clamp (2). The top surface of heat insulation filler layer one (5) is coplanar with the top surface of the pad (1), and the top surface of heat insulation filler layer two (6) is coplanar with the top surface of the clamp (2).

2. The engineered wood panel with heat insulation function according to claim 1, characterized in that: The pad (1) is made of low-density poplar wood, and the plywood (2) is made of low-density pine wood.

3. The engineered wood panel with heat insulation function according to claim 1, characterized in that: The heat insulation filler layer (5) is made of at least one of expanded perlite, aerogel, and silicate inorganic heat insulation materials.

4. The engineered wood panel with heat insulation function according to claim 1, characterized in that: The second heat insulation filler layer (6) is made of at least one of polystyrene particles and polyurethane foam organic heat insulation materials.

5. A type of engineered wood panel with heat insulation function according to claim 2, characterized in that: The top surfaces of both the pad (1) and the clamp (2) are provided with an adhesive embedding structure for embedding the adhesive layer.

6. A type of engineered wood panel with heat insulation function according to claim 5, characterized in that: The adhesive embedding structure includes an adhesive coating groove (7), which is an annular groove. Two sets of adhesive coating grooves (7) are respectively opened on the top surface of the pad (1) and the clamping plate (2). The adhesive layer includes an adhesive layer (9), which is an annular structure. The adhesive layer (9) is embedded in the adhesive coating groove (7). A positioning component is provided between the adhesive layer (9) and the adhesive coating groove (7).

7. A type of engineered wood panel with heat insulation function according to claim 6, characterized in that: The positioning assembly includes a slot (8) and a strip integrally formed on the adhesive layer (9). The four inner and four outer ring surfaces of the adhesive coating groove (7) are provided with slots (8). The inner and outer ring surfaces of the four side plates of the adhesive layer (9) are integrally formed with strips. After the adhesive layer (9) fills the adhesive coating groove (7), the strip is inserted into the slot (8).

8. A type of engineered wood panel with heat insulation function according to claim 7, characterized in that: The adhesive layer (9) is made of either isocyanate adhesive or soybean protein adhesive.

9. A type of engineered wood panel with heat insulation function according to claim 2, characterized in that: The protective layer includes a sleeve (3), which has a square frame structure. The pad (1) and the clamp (2) are stacked and inserted into the sleeve (3). The bottom surface of the sleeve (3) and the bottom surface of the pad (1) are coplanar. The sleeve (3) is made of either low-density poplar or low-density pine.

10. A type of engineered wood panel with heat insulation function according to claim 9, characterized in that: The concealed assembly includes a connecting strip (13), and side grooves (10) are provided on both sides of the sleeve plate (3). After the two artificial boards are assembled end to end, the two sides of the connecting strip (13) are respectively inserted into the side grooves (10) on the surface of the two sets of sleeve plates (3). The front and rear ends of the sleeve plate (3) are provided with reserved grooves (11). The surface of the reserved groove (11) is provided with through holes (12). The front and rear ends of the connecting strip (13) are provided with two screw holes (14). Screws are inserted into the reserved groove (11). The screws pass through the through holes (12) and are screwed into the screw holes (14). A silicone plug (15) is inserted into the reserved groove (11). One end of the silicone plug (15) is provided with a slope, and the slope matches the corner surface of the sleeve plate (3).

Citation Information

Patent Citations

  • Heat-preservation, heat-insulation and sound-insulation type environment-friendly plate

    CN221441793U

  • Veneer with heat insulation structure

    CN221761173U

  • Melamine facing plate with heat insulation function

    CN224028569U

  • Combined felt

    CN2446193Y

  • PCR combo kit and cartridge for SARS-CoV-2 and Influenza Virus

    KR1020220058006A