Printed circuit board

Abstract

The present disclosure relates to a printed circuit board including: a glass layer having a first surface and a second surface opposite to each other in a first direction; a heat dissipation member embedded in the glass layer; and a through via extending through at least a portion of the glass layer between the first surface and the second surface. The heat dissipation member may be spaced apart from one or both of the first surface and the second surface of the glass layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0148841, filed on October 28, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a printed circuit board. Background Technology

[0003] Recently, to improve the performance of packaging substrates, there is a need for large-area, multi-layer, and miniaturized structures. Furthermore, copper-clad laminates (CCLs) are commonly used as the core layer included in the packaging substrate. However, in the case of CCLs, warping can occur due to their low modulus and high coefficient of thermal expansion, and there are also limitations in implementing microcircuits. In addition, as semiconductor products become more complex and power consumption increases, this leads to thermal problems in both the semiconductor product and the substrate. Summary of the Invention

[0004] One aspect of this disclosure is to provide a printed circuit board including a core layer that can suppress warping and facilitate the realization of microcircuits.

[0005] Another aspect of this disclosure is to provide a printed circuit board including a core layer, the printed circuit board having excellent heat dissipation characteristics.

[0006] One of the various technical solutions proposed in this disclosure is to use a glass layer as the core layer, which has a high modulus and a low coefficient of thermal expansion to suppress warping, and also has a smooth surface to facilitate the implementation of microcircuits.

[0007] Another technical solution proposed in this disclosure is to embed the heat dissipation component in the glass layer, so that the heat dissipation component can directly contact the glass layer without any tiny gaps.

[0008] For example, the printed circuit board of this disclosure may include: a glass layer having a first surface and a second surface opposite to each other in a first direction; a heat dissipation member embedded in the glass layer; and a through-hole extending through at least a portion of the glass layer between the first surface and the second surface, wherein the heat dissipation member may be spaced apart from at least one of the first surface and the second surface of the glass layer.

[0009] For example, a printed circuit board may include: a glass layer having a first surface and a second surface opposite to each other in a first direction; a plurality of heat dissipation members embedded in the glass layer, wherein in a cross section defined by the first direction and a second direction perpendicular to the first direction, the length of the plurality of heat dissipation members in the second direction is longer than the length of the plurality of heat dissipation members in the first direction; and a plurality of through holes passing through at least a portion of the glass layer between the first surface and the second surface, and spaced apart from the plurality of heat dissipation members.

[0010] For example, a printed circuit board may include: a glass layer having a first surface and a second surface opposite to each other along a first direction; a heat dissipation member embedded in the glass layer; a plurality of through holes extending through at least a portion of the glass layer between the first surface and the second surface; a stacked layer disposed on at least one of the first surface and the second surface of the glass layer; and a stacked wiring layer disposed on the stacked layer, wherein the heat dissipation member is spaced apart from the plurality of through holes.

[0011] One of the various effects of this disclosure is to provide a printed circuit board including a core layer that can suppress warping and can easily implement microcircuits.

[0012] Another effect of this disclosure is to provide a printed circuit board including a core layer, which has excellent heat dissipation characteristics. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which: Figure 1 It is a block diagram that schematically illustrates an example of an electronic device system; Figure 2 This is a schematic cross-sectional view illustrating an example of a printed circuit board; Figure 3 It is shown schematically. Figure 2 A process cross-sectional view of an example of the manufacturing process of a printed circuit board; Figure 4 It is shown schematically. Figure 2 A cross-sectional view of a modified example of a printed circuit board; Figure 5 This is a schematic cross-sectional view illustrating another example of a printed circuit board; Figure 6 It is shown schematically. Figure 5 A cross-sectional view of a modified example of a printed circuit board; and Figure 7 It is shown schematically. Figure 2 Printed circuit boards, Figure 5 The diagram shows the heat dissipation effect of the printed circuit board and the printed circuit board according to the comparative example. Detailed Implementation

[0014] In the following description, this disclosure will be made with reference to the accompanying drawings. In the drawings, for the purpose of clearer description, the shape and size of the elements may be exaggerated or reduced.

[0015] Figure 1 This is a block diagram that schematically illustrates an example of an electronic device system.

[0016] Reference Figure 1 A motherboard 1010 is housed within the electronic device 1000. Chip-related components 1020, network-related components 1030, and other components 1040 are physically and / or electrically connected to the motherboard 1010. These components are also connected to other electronic components described below via various signal lines 1090.

[0017] Chip-related components 1020 may include: memory chips, such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM, flash memory), etc.; application processor chips, such as central processing units (e.g., CPUs), graphics processing units (e.g., GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (ADCs), application-specific integrated circuits (ASICs), etc. However, chip-related components 1020 are not limited to these and may also include other types of chip-related components. Furthermore, chip-related components 1020 may be combined with each other. Chip-related components 1020 may be in the form of a package including the aforementioned chips and / or electronic components.

[0018] Network-related components 1030 may include components compatible with or communicating with protocols such as: Wi-Fi (such as the IEEE 802.11 series), WiMAX (such as the IEEE 802.16 series), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, GSM+, EDGE+, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, LAN, 3G, 4G, and 5G protocols, as well as any other wireless or wired standards or protocols specified herein. However, network-related component 1030 is not limited to this, and may also include components that are compatible with or communicate with any of a plurality of other wireless standards or protocols and wired standards or protocols. Furthermore, network-related component 1030 may be integrated into chip-related component 1020.

[0019] Other components 1040 may include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, low-temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCCs), etc. However, other components are not limited to these and may also include passive components in the form of chip modules for various other purposes. Additionally, other components 1040 may be combined with chip-related components 1020 and / or network-related components 1030.

[0020] Depending on the type of electronic device 1000, it may include other electronic components that are physically and / or electrically connected to the motherboard 1010 or not physically and / or electrically connected to the motherboard 1010. These other electronic components may include, for example, a camera 1050, an antenna 1060, a display 1070, and a battery 1080. However, these other electronic components are not limited to these and may also include audio codecs, video codecs, power amplifiers, compasses, accelerometers, gyroscopes, speakers, mass storage devices (e.g., hard disk drives), optical disc (CD) drives, digital versatile disc (DVD) drives, etc. In addition, depending on the type of electronic device 1000, it may also include other electronic components for various purposes.

[0021] Electronic device 1000 may be a smartphone, personal digital assistant, digital video camera, digital camera, network system, computer, monitor, tablet PC, laptop PC, netbook PC, television, video game console, smartwatch, automotive component, or server. However, electronic device 1000 is not limited to these and may be any other electronic device capable of processing data.

[0022] Figure 2 This is a schematic cross-sectional view of an example of a printed circuit board.

[0023] Reference Figure 2 The printed circuit board 100A according to an example embodiment may include: a glass layer 111 having a first surface and a second surface opposite to each other in a first direction; a heat dissipation member 151 embedded in the glass layer 111; and a through-hole 131 penetrating at least a portion of the glass layer 111 located between the first surface and the second surface. If desired, the printed circuit board 100A according to the example embodiment may further include: a first wiring layer 121 disposed on the first surface of the glass layer 111; a second wiring layer 122 disposed on the second surface of the glass layer 111; a first resist layer 141 disposed on the first surface of the glass layer 111 and covering a portion of the first wiring layer 121 while exposing another portion of the first wiring layer 121; and / or a second resist layer 142 disposed on the second surface of the glass layer 111 and covering a portion of the second wiring layer 122 while exposing another portion of the second wiring layer 122.

[0024] Furthermore, as mentioned above, CCL is typically used as the core layer included in a packaging substrate. However, recently, for high-performance packaging substrates, large-area, multi-layer, and miniaturized structures are required, and there are limitations in meeting these requirements when CCL is included as the core layer. On the other hand, the printed circuit board 100A according to the example embodiment, which includes a glass layer 111 as the core layer, can have a high modulus and a low coefficient of thermal expansion (which can suppress warping), and can also have a smooth surface to facilitate the implementation of microcircuits. Therefore, the printed circuit board 100A can have advantageous effects compared to the case where CCL is included as the core layer.

[0025] Furthermore, as mentioned above, with the increasing complexity and power consumption of semiconductor products, thermal problems arise between the semiconductor product and the substrate. Therefore, improved heat dissipation characteristics are needed. One approach is to form heat dissipation vias in the glass layer using through-glass vias (TGVs), but this may be difficult to completely fill the metal without gaps. Another approach is to attach dies of different materials to the cavity using a chip-first mounting method, utilizing a glass layer in which a cavity is first formed; however, since the glass layer is formed from a very brittle material, cracks may occur in the glass layer during the cavity formation process. On the other hand, the printed circuit board 100A according to the example embeds a heat dissipation member 151 in the glass layer 111 that can directly contact the glass without minute gaps. For example, the heat dissipation member 151 can be placed in a casting mold, and the glass can be cast to achieve a structure in which the heat dissipation member 151 is embedded in the glass layer 111. In this case, cracks in the glass layer 111 are prevented when the heat dissipation member 151 is embedded in the glass layer 111. In addition, the heat dissipation component 151 can be in direct contact with the glass layer 111 without any step difference or small gap, thereby achieving excellent heat dissipation.

[0026] Furthermore, the material included in the glass layer 111 can be disposed between one or more of the first and second surfaces of the glass layer 111 and the heat dissipation member 151. For example, the heat dissipation member 151 and the first surface can be in contact with each other, but the heat dissipation member 151 and the second surface can be spaced apart from each other; or the heat dissipation member 151 and the second surface can be in contact with each other, but the heat dissipation member 151 and the first surface can be spaced apart from each other; or the heat dissipation member 151 can be spaced apart from both the first and second surfaces. Preferably, since the heat dissipation member 151 is spaced apart from both the first and second surfaces of the glass layer 111, the material included in the glass layer 111 can be disposed between each of the first and second surfaces of the glass layer 111 and the heat dissipation member 151. For example, the heat dissipation member 151 can be spaced apart from the first and second surfaces of the glass layer 111 respectively, and the glass layer 111 can completely surround the heat dissipation member 151, and the glass layer 111 and the heat dissipation member 151 can be in direct contact with each other. The heat dissipation member 151 can be embedded in the glass layer 111 in this way, thereby easily achieving the above-mentioned technical effects.

[0027] Furthermore, the heat dissipation member 151 may be made of metal. In this case, the heat dissipation member 151 may be spaced apart from and electrically insulated from the through-hole 131. For example, the heat dissipation member 151 may be unrelated to the through-hole used for signal transmission. In an example, in a cross-section of a first direction and a second direction (e.g., the second direction is perpendicular to the first direction), the heat dissipation member 151 may have a structure in which its length in the first direction is longer than its length in the second direction. For example, the heat dissipation member 151 may be a metal pillar structure that penetrates a portion of the glass layer 111 in a direction substantially the same as (e.g., substantially parallel to) the first direction. Multiple heat dissipation members 151 with metal pillar structures may exist, which may be spaced apart from each other and may be embedded in the glass layer 111 respectively.

[0028] In the following description, the components of the printed circuit board 100A according to an exemplary embodiment will be described in more detail with reference to the accompanying drawings.

[0029] Glass layer 111 may comprise glass (an amorphous solid). The glass may comprise, for example, pure silica (approximately 100% SiO2), soda-lime glass, borosilicate glass, and aluminosilicate glass. However, this disclosure is not limited thereto, and alternative glass materials (such as fluorine-based glasses, phosphate glasses, and chalcogenide glasses) may also be used as materials for glass layer 111. Furthermore, other additives may be included to form a glass with specific physical properties. These additives may include magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, and may include carbonates and / or oxides of these elements as well as carbonates and / or oxides of other elements, for example, calcium carbonate (e.g., lime) and / or sodium carbonate (e.g., soda ash). Furthermore, glass layer 111 may be distinguished from organic insulating materials (such as copper-clad laminates (CCL), prepregs (PPG), etc.) that include glass fibers (e.g., glass fabrics, such as glass cloth). Glass layer 111 may be in the form of, for example, a glass plate.

[0030] Each of the first wiring layer 121 and the second wiring layer 122 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the first wiring layer 121 and the second wiring layer 122 may include titanium (Ti) layers and copper (Cu) layers formed by sputtering as multiple seed layers, and may include electrolytically plated copper layers formed by electrolytic plating based on titanium (Ti) layers and copper (Cu) as patterned plating layers. However, this disclosure is not limited thereto, and, if desired, the first wiring layer 121 and the second wiring layer 122 may include electrolessly plated copper layers formed by electroless plating as seed layers. The first wiring layer 121 and the second wiring layer 122 may perform various functions according to the design. For example, the first wiring layer 121 and the second wiring layer 122 may include signal patterns, power patterns, and ground patterns. These patterns may take various forms, such as lines, traces, planes, pads, and solder pads. In the example, the first wiring layer 121 and the second wiring layer 122 may be formed directly on the first and second surfaces of the glass layer 111, respectively, but this disclosure is not limited thereto. The first wiring layer 121 and the second wiring layer 122 may be electrically connected to each other through a through-hole 131. In addition, the first wiring layer 121 and the second wiring layer 122 may include various types of patterned structures that can be varied according to the design, as not shown in the figures.

[0031] The through-hole 131 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the through-hole 131 may include a titanium (Ti) layer and a copper (Cu) layer formed by sputtering as multiple seed layers, and may include an electrolytically plated copper layer formed by electrolytic plating based on the titanium (Ti) layer and the copper (Cu) layer as a filler plating. However, this disclosure is not limited thereto, and if desired, the through-hole 131 may include a chemically plated copper layer formed by electroless plating as a seed layer. The through-hole 131 may perform various functions depending on the design. For example, the through-hole 131 may include a signal via, a power via, and a ground via. If desired, the length of the through-hole 131 in the first direction may be relatively shorter than the length of the glass layer 111 in the first direction. For example, the two ends of the through-hole 131 in the first direction may be partially recessed relative to the first surface and the second surface of the glass layer 111, respectively. In the cross-sections of the first and second directions, the through-hole 131 may have a vertical shape for its side surfaces, but is not limited thereto, and may also have an inclined shape for its side surfaces, for example, an hourglass shape. The through-hole 131 can connect at least a portion of the first wiring layer 121 and at least a portion of the second wiring layer 122 to each other. The through-hole 131 may be a through-glass via (TGV). Multiple through-holes 131 may be provided, and the multiple through-holes 131 may be spaced apart from each other in the second direction.

[0032] Each of the first resist layer 141 and the second resist layer 142 may include an organic insulating material. The organic insulating material may include a thermosetting resin (such as epoxy resin), a thermoplastic resin (such as polyimide), or a material prepared by impregnating inorganic fillers, organic fillers, and / or glass fibers (e.g., glass fabric, such as glass cloth) in the aforementioned resin. For example, the organic insulating material may include Ajinomoto deposited film (ABF), photosensitive dielectric (PID), solder resist (SR), but this disclosure is not limited thereto. Each of the first resist layer 141 and the second resist layer 142 may be formed using multiple layers. The first resist layer 141 and the second resist layer 142 may each have openings that expose the first wiring layer 121 and the second wiring layer 122, and each of the first resist layer 141 and the second resist layer 142 may have multiple openings. The pad patterns exposed through the openings may be solder mask defined (SMD) and / or non-solder mask defined (NSMD) pad patterns.

[0033] The heat dissipation component 151 may comprise various materials that facilitate heat dissipation. The melting point of the material of the heat dissipation component 151 may be higher than that of glass, for example, such that the material of the heat dissipation component 151 will not melt during the glass molding process. For example, the heat dissipation component 151 may comprise metals, more specifically, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the heat dissipation component 151 may comprise Invar alloys, etc. However, this disclosure is not limited thereto, and in addition to the metals described above, the heat dissipation component 151 may also comprise graphite, polymer thermally conductive materials, or the heat dissipation component 151 may also comprise heat dissipation strips. The heat dissipation component 151 may be spaced apart from the first surface and / or the second surface of the glass layer 111, and may be electrically insulated from the first wiring layer 121 and the second wiring layer 122 and the through-hole 131. In an example, the heat dissipation component 151 may have a metal pillar shape, and in this case, the metal pillar may have various shapes such as cylindrical pillars and polygonal pillars. If desired, the heat dissipation member 151 may have a plate structure in which its length in a third direction (e.g., a direction perpendicular to the first and second directions) is longer than its length in the second direction. Furthermore, the length of the heat dissipation member 151 in the first direction may be longer than its length in the second direction. Multiple heat dissipation members 151 may be provided, and each of the heat dissipation members 151 may be completely surrounded by the glass layer 111. Additionally, the heat dissipation members 151 may be spaced apart from each other in the glass layer 111 in the second and / or third directions.

[0034] Furthermore, if desired, a stacked layer may be further disposed on at least one of the first and second surfaces of the glass layer 111, and a stacked wiring layer may be further disposed on each stacked layer. Additionally, a stacked via layer may be further formed in the stacked layers. In this case, the first resist layer 141 and the second resist layer 142 may be disposed on the stacked layers on both sides in the first direction, respectively. Furthermore, a frame with through-holes may be further included, and in this case, the glass layer 111 may be disposed in the through-holes of the frame, and the remaining space of the through-holes may be filled with filler or a stacked layer. In this way, the printed circuit board 100A according to the example embodiment can be applied to various structures and can be applied in various forms. Therefore, the printed circuit board 100A can be used as a package board. Furthermore, the printed circuit board 100A can be easily applied to large-area boards for servers.

[0035] Figure 3 It is shown schematically. Figure 2 A cross-sectional view of an example of the manufacturing process of a printed circuit board.

[0036] Reference Figure 3A casting mold 210 can be prepared, the heat dissipation member 151 can be inserted into the casting mold 210, and glass can be cast into the casting mold 210 to form a glass layer 111 in which the heat dissipation member 151 is embedded. In this way, due to the use of the casting process, cracks and the like in the glass layer 111 can be prevented, and the glass layer 111 and the heat dissipation member 151 can be completely adhered without small gaps or step differences. In addition, since the heat dissipation member 151 has a high degree of freedom, there are almost no structural restrictions. Furthermore, since the heat dissipation member 151 does not come into contact with the organic insulating layer with low thermal conductivity, the heat dissipation characteristics can be further improved. In addition, the glass layer 111 can surround the entire surface of the heat dissipation member 151. For example, with the upper side of the heat dissipation member 151 fixed by a clamp, the lower part of the casting mold 210 can be cast with glass, then the clamp can be removed, and the heat dissipation member 151 can be embedded in the glass layer 111 in such a way that glass is cast on the upper side of the heat dissipation member 151. Alternatively, the casting mold 210 itself can support the heat dissipation component 151 in a clamping manner, so that the glass layer 111 can surround the entire surface of the heat dissipation component 151.

[0037] Next, vias h can be formed in glass layer 111 using etching, sandblasting, laser, plasma, etc. A seed layer can be formed on the entire exposed surface of glass layer 111 by sputtering or electroless plating, and a plating layer can be formed on the seed layer by electrolytic plating. Annealing can then be performed, and the seed layer and plating layer located on the first and second surfaces (e.g., the upper and lower surfaces) of glass layer 111 can be removed by a polishing process (e.g., chemical mechanical planarization (CMP) process), thereby forming through vias 131 in glass layer 111. Next, a seed layer can be formed on glass layer 111 by sputtering or electroless plating, and a plating layer can be formed on the seed layer by electrolytic plating, thereby forming the first wiring layer 121 and the second wiring layer 122. If desired, the seed layer and plating layer initially disposed on the first and second surfaces of glass layer 111 can be directly patterned by etching or the like without a polishing process, thereby forming the first wiring layer 121 and the second wiring layer 122. The first resist layer 141 and the second resist layer 142 can then be formed using a lamination or coating process of insulating materials, and openings can be formed in the first resist layer 141 and the second resist layer 142 if desired. A printed circuit board 100A according to the above example can be manufactured through a series of processes, and the above can be applied substantially the same to other descriptions.

[0038] Figure 4 It is shown schematically. Figure 2 A cross-sectional view of a modified example of a printed circuit board.

[0039] Reference Figure 4Compared to the printed circuit board 100A according to the above example embodiment, the printed circuit board 100B according to the modified example embodiment can be configured such that: a first insulating layer 112 can be disposed on a first surface of a glass layer 111, and a second insulating layer 113 can be disposed on a second surface of a glass layer 111. A first wiring layer 121 can be disposed on the first insulating layer 112, a second wiring layer 122 can be disposed on the second insulating layer 113, a first resist layer 141 can be disposed on the first insulating layer 112, and a second resist layer 142 can be disposed on the second insulating layer 113. Additionally, the printed circuit board 100B according to the modified example embodiment may further include: a first connection via 132, penetrating the first insulating layer 112 and connecting (e.g., directly connecting) at least a portion of the first wiring layer 121 to one side of the via 131; and a second connection via 133, penetrating the second insulating layer 113 and connecting (e.g., directly connecting) at least a portion of the second wiring layer 122 to the other side of the via 131. The first connecting via 132 and the second connecting via 133 can be directly connected to one side and the other side of the through via 131, respectively.

[0040] In this manner, in the printed circuit board 100B according to the modified example embodiment, the first wiring layer 121 and the second wiring layer 122 may not be formed directly on the first and second surfaces of the glass layer 111, but rather on additional first insulating layers 112 and second insulating layers 113. Furthermore, the first wiring layer 121 and the second wiring layer 122 may be directly connected to the through-hole 131 via the first connection via 132 and the second connection via 133, respectively. In this case, the adhesion of the first wiring layer 121 and the second wiring layer 122 can be improved by the first insulating layer 112 and the second insulating layer 113, and the stress generated in the glass layer 111 can be reduced by these insulating layers.

[0041] In the following, the components of the printed circuit board 100B according to a modified example embodiment will be described in more detail with reference to the accompanying drawings.

[0042] Each of the first insulating layer 112 and the second insulating layer 113 may include an organic insulating material. The organic insulating material may include thermosetting resins (such as epoxy resins), thermoplastic resins (such as polyimide), or materials prepared by impregnating inorganic fillers, organic fillers, and / or glass fibers (e.g., glass fabric, such as glass cloth) with the aforementioned resin. For example, the organic insulating material may be a prepreg (PPG), an ajinomoto laminate (ABF), or a photosensitive dielectric (PID), but this disclosure is not limited thereto. The first insulating layer 112 and the second insulating layer 113 may include substantially the same insulating material, but are not limited thereto.

[0043] Each of the first connection via 132 and the second connection via 133 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the first connection via 132 and the second connection via 133 may include a chemically plated copper layer formed by electroless plating as a seed layer, and may include an electrolytically plated copper layer formed by electrolytic plating based on the chemically plated copper layer as a via plating layer. The first connection via 132 and the second connection via 133 may perform various functions according to the design. For example, the first connection via 132 and the second connection via 133 may include signal vias, power vias, and grounding vias. Each of the first connection via 132 and the second connection via 133 may include a filled via formed by filling the via with metal, and may also include a conformal via formed by distributing the metal along the wall surface of the via. The first connection via 132 and the second connection via 133 may have a shape that tapers in opposite directions in cross-sections in a first direction and a second direction. Each of the first connecting via 132 and the second connecting via 133 can be configured as multiple.

[0044] Furthermore, if necessary, additional stacked layers can be provided on each of the first insulating layer 112 and the second insulating layer 113, and stacked wiring layers can be further provided on each of the stacked layers. Additionally, stacked via layers can be further formed in the stacked layers. In this case, each of the first resist layer 141 and the second resist layer 142 can be disposed on the stacked layers on both sides in the first direction. Furthermore, a frame with through-holes can be further included, in which case the glass layer 111 can be disposed within the through-holes of the frame, and the remaining space of the through-holes can be filled with filler, the first insulating layer 112, and / or the second insulating layer 113. In this way, the printed circuit board 100B according to the modified example embodiment can also be applied to various structures and can also be applied in various forms. Therefore, the printed circuit board 100B can be used as a package board. Additionally, the printed circuit board 100B can be readily applied to large-area boards for servers. Furthermore, the above-described contents of the printed circuit board 100A and its manufacturing method according to the example embodiment can be applied substantially the same to the printed circuit board 100B.

[0045] Figure 5 This is a schematic cross-sectional view illustrating another example of a printed circuit board.

[0046] Figure 6 It is shown schematically. Figure 5 A cross-sectional view of a modified example of the printed circuit board shown.

[0047] Reference Figure 5 and Figure 6Compared to the printed circuit board 100A according to the above-described example embodiment and the printed circuit board 100B according to the modified example embodiment thereof, the printed circuit boards 100C and 100D according to another example embodiment can be configured such that the structure and arrangement of the heat dissipation member 152 embedded in the glass layer 111 can be changed. For example, in another example embodiment and its modified example embodiment, in the cross-section of the first and second directions, the heat dissipation member 152 may have a structure in which its length in the second direction is longer than its length in the first direction. For example, the heat dissipation member 152 may have a metal plate structure configured to have a substantially flat surface in the glass layer 111 that is substantially parallel to the second direction. For example, each of the lengths of the metal plate structure in the second and third directions may be longer than its length in the first direction. In addition, the two surfaces of the metal plate structure may be substantially flat relative to the first direction. The heat dissipation member 152 of the metal plate structure may be provided in plurality, and the plurality of heat dissipation members 152 may be spaced apart from each other and may be embedded in the glass layer 111 respectively. In this case, the heat dissipation member 152 may be embedded in the glass layer 111 more stably.

[0048] Furthermore, the above-described contents in the printed circuit board 100A according to the exemplary embodiment and the printed circuit board 100B according to the modified exemplary embodiment can be applied substantially the same to the printed circuit boards 100C and 100D. Additionally, in the description of the manufacturing process example of the printed circuit board 100A according to the exemplary embodiment, the remaining contents, except for the structure and arrangement of the heat dissipation member 151, can be applied substantially the same to the manufacturing processes of the printed circuit boards 100C and 100D, and the manufacturing processes of the printed circuit boards 100C and 100D can be performed with reference to the example of the manufacturing process of the printed circuit board 100A.

[0049] Figure 7 It is shown schematically. Figure 2 The printed circuit board shown Figure 5 The diagram shows the heat dissipation effect of the printed circuit board shown and the printed circuit board according to the comparative example.

[0050] Reference Figure 7 The structure of Invention Example 1 can be a printed circuit board 100A according to the above-described example embodiment, wherein the heat dissipation member 151 is embedded in the glass layer 111. The structure of Invention Example 2 can be a printed circuit board 100C according to another example embodiment, wherein the heat dissipation member 152 is embedded in the glass layer 111. The structure of the comparative example can be a printed circuit board 100A according to the above-described example embodiment, wherein the heat dissipation member 151 is omitted. The thermal resistance of each of these structures in the first direction is compared and... Figure 7The comparison results are shown below. In the normalized thermal resistance, the thermal resistance value of the comparative example structure is used as a reference value. It can be seen that, compared to the structure of the comparative example, the structures of Invention Example 1 and Invention Example 2 have relatively smaller thermal resistance in the first direction. Therefore, it can be seen that the structures of Invention Example 1 and Invention Example 2 have excellent heat dissipation performance.

[0051] In this disclosure, the term "cover" can include covering a portion or the entirety of a component, and can also include direct or indirect coverage. Furthermore, the term "fill" can include not only complete filling but also partial filling and substantially filling. For example, this could include the presence of holes or gaps. Additionally, the term "surround" can include not only complete surrounding but also partial surrounding and substantially surrounding. Furthermore, the term "expose" can include not only complete exposure but also partial exposure, and exposure can mean exposing a component from another component in which it is embedded. For example, exposing a pad through an opening can mean exposing the pad from a resist layer, and a surface treatment layer may also be provided on the exposed pad.

[0052] In this disclosure, the placement of an object within a through portion or through hole can refer not only to the case where the object is completely contained within the through portion or through hole, but also to the case where the object protrudes upwards or downwards from the through portion or through hole in cross-section. For example, the placement of the object can be interpreted more broadly when the object is positioned within a through portion or through hole in a plan view.

[0053] In this disclosure, "substantially" can be a concept that includes process errors, positional deviations, and measurement errors that may occur during the manufacturing process. For example, substantially the same direction can include not only exactly the same direction, but also substantially the same direction. Furthermore, substantially parallel can include not only perfectly parallel cases, but also substantially parallel cases. Additionally, substantially flat can include not only perfectly flat cases, but also substantially flat cases.

[0054] In this disclosure, "the same insulating material" can refer not only to the same insulating material, but also to the same type of insulating material. Therefore, although the composition of the insulating materials is basically the same, the specific composition ratios may vary slightly.

[0055] In this disclosure, "section" can refer to the shape of a cross-section when an object is cut vertically, or the shape of an object when viewed in a side view. Furthermore, "plane" can refer to the shape when an object is cut horizontally, or the planar shape of an object when viewed in a top or bottom view.

[0056] In this disclosure, for convenience, the word "lower" in "lower side," "lower part," and "lower surface" refers to the downward direction relative to the cross-section in the drawings, and the word "upper" in "upper side," "upper part," and "upper surface" refers to the opposite direction. However, the above directions are defined for ease of interpretation, and the scope of the claims is not specifically limited by the description of these directions, and the concepts of upper / lower can be changed at any time.

[0057] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Furthermore, expressions such as "first" and "second" are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of this disclosure, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component.

[0058] In this disclosure, thickness, width, length, depth, linewidth, gap, pitch, spacing, surface roughness, etc., can be measured using a scanning microscope, optical microscope, or similar method based on a polished or cut cross-section of the printed circuit board. The cross-section can be a vertical or horizontal cross-section, and each value can be measured based on the desired cross-section. For example, the width of the upper and / or lower portion of a via can be measured on a cross-section cut along the central axis of the via. In this case, when the value is not constant, it can be determined as the average of values ​​measured at any five points.

[0059] The term "example embodiment" as used in this disclosure does not imply the same embodiment and is provided to explain different unique features. However, the example embodiments presented above do not preclude implementation in combination with features of other example embodiments. For example, even if something described in a particular example embodiment is not described in other example embodiments, it may be understood as an explanation relating to other example embodiments unless there is an interpretation contrary to or contradictory to that content in other example embodiments.

[0060] The terminology used in this disclosure is intended to describe exemplary embodiments only and is not intended to limit the scope of this disclosure. In the context, unless explicitly stated otherwise, singular terms include their plural forms.

[0061] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A printed circuit board, comprising: A glass layer having a first surface and a second surface that are opposite to each other in a first direction; A heat dissipation component is embedded in the glass layer; as well as Through the hole, extending through at least a portion of the glass layer located between the first surface and the second surface. The heat dissipation component is spaced apart from at least one of the first surface and the second surface of the glass layer.

2. The printed circuit board according to claim 1, in, The material included in the glass layer is disposed between at least one of the first and second surfaces of the glass layer and the heat dissipation member.

3. The printed circuit board according to claim 1, in, The heat dissipation component is spaced apart from each of the first and second surfaces of the glass layer. The glass layer completely surrounds the heat dissipation component, and The glass layer is in direct contact with the heat dissipation component.

4. The printed circuit board according to claim 1, in, The heat dissipation component includes metal. The heat dissipation component is spaced apart from the through hole, and The heat dissipation component is electrically insulated from the through hole.

5. The printed circuit board according to claim 1, in, In a cross-section defined by the first direction and a second direction perpendicular to the first direction, the length of the heat dissipation member in the first direction is longer than the length of the heat dissipation member in the second direction.

6. The printed circuit board according to claim 5, in, The heat dissipation component includes one or more metal pillars that extend through a portion of the glass layer in a direction parallel to the first direction.

7. The printed circuit board according to claim 1, in, In a cross-section defined by the first direction and a second direction perpendicular to the first direction, the length of the heat dissipation member in the second direction is longer than the length of the heat dissipation member in the first direction.

8. The printed circuit board according to claim 7, in, The heat dissipation component includes one or more metal plates, which are configured to have a flat surface in the glass layer that is parallel to the second direction.

9. The printed circuit board according to claim 1, further comprising: A first wiring layer is disposed on the first surface of the glass layer; as well as A second wiring layer is disposed on the second surface of the glass layer. The through-hole connects at least a portion of the first wiring layer and at least a portion of the second wiring layer.

10. The printed circuit board according to claim 9, further comprising: A first resist layer is disposed on the first surface of the glass layer and covers a portion of the first wiring layer while exposing another portion of the first wiring layer. as well as A second resist layer is disposed on the second surface of the glass layer and covers a portion of the second wiring layer while exposing another portion of the second wiring layer.

11. The printed circuit board according to claim 1, further comprising: A first insulating layer is disposed on the first surface of the glass layer; The first wiring layer is disposed on the first insulating layer; A first connection via penetrates the first insulating layer and connects at least a portion of the first wiring layer to one side of the through-hole; A second insulating layer is disposed on the second surface of the glass layer; The second wiring layer is disposed on the second insulating layer; as well as The second connection via penetrates the second insulating layer and connects at least a portion of the second wiring layer to the other side of the through-hole. Each of the first connecting via and the second connecting via is directly connected to the through-hole.

12. The printed circuit board according to claim 11, further comprising: A first resist layer is disposed on the first insulating layer and covers a portion of the first wiring layer while exposing another portion of the first wiring layer; as well as A second resist layer is disposed on the second insulating layer and covers a portion of the second wiring layer while exposing another portion of the second wiring layer.

13. A printed circuit board, comprising: A glass layer having a first surface and a second surface that are opposite to each other in a first direction; Multiple heat dissipation components are embedded in the glass layer, and in a cross section defined by the first direction and the second direction perpendicular to the first direction, the length of the multiple heat dissipation components in the second direction is longer than the length of the multiple heat dissipation components in the first direction. as well as Multiple through holes extend through at least a portion of the glass layer between the first surface and the second surface, and are spaced apart from the multiple heat dissipation components.

14. The printed circuit board according to claim 13, in, Each of the plurality of heat dissipation components includes a metal plate embedded in the glass layer, and the metal plate has a flat surface parallel to the second direction.

15. The printed circuit board of claim 13, further comprising: A first wiring layer is disposed on the first surface of the glass layer; as well as A second wiring layer is disposed on the second surface of the glass layer. The plurality of through holes electrically connect the first wiring layer and the second wiring layer.

16. The printed circuit board of claim 13, further comprising: A first insulating layer is disposed on the first surface of the glass layer; The first wiring layer is disposed on the first insulating layer; A plurality of first connection vias penetrate the first insulating layer and respectively connect at least a portion of the first wiring layer directly to one side of the plurality of through-holes; A second insulating layer is disposed on the second surface of the glass layer; The second wiring layer is disposed on the second insulating layer; as well as Multiple second connection vias penetrate the second insulating layer and directly connect at least a portion of the second wiring layer to the other side of the multiple through-holes.

17. A printed circuit board, comprising: A glass layer having a first surface and a second surface that are opposite to each other along a first direction; A heat dissipation component is embedded in the glass layer; Multiple through holes extend through at least a portion of the glass layer located between the first surface and the second surface; An accumulation layer is disposed on at least one of the first surface and the second surface of the glass layer; as well as A stacked wiring layer is disposed on the stacked layer. The heat dissipation component is spaced apart from the plurality of through holes.

18. The printed circuit board according to claim 17, in, An accumulation of vias is formed in the accumulation layer.

19. The printed circuit board according to claim 18, The printed circuit board also includes a frame with through holes. in, The glass layer is disposed within the through-hole of the frame.

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