Operation method for monitoring and improving offset breakage of Padless hole
By setting inner layer monitoring patterns on the edge of the PCB core board, simulating the ringless design of padless holes, detecting the through-hole offset and adjusting drilling parameters, the problem of insufficient alignment of padless holes is solved, and the product yield is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUANGSHI HUSHI ELECTRONICS CO LTD
- Filing Date
- 2026-02-04
- Publication Date
- 2026-04-28
AI Technical Summary
Padless holes require strict alignment in PCB manufacturing, which is difficult to meet with existing technology, leading to inner layer misalignment and affecting product yield.
An inner layer monitoring pattern is formed at the edge of the core board. By combining a cross-shaped structure with through holes, the design of a padless hole without rings is simulated. The offset of the through hole is detected, and the drilling parameters are adjusted to improve the alignment.
By monitoring the via offset, the alignment deviation of padless holes can be identified in advance, avoiding inner layer damage and improving the PCB yield.
Smart Images
Figure CN121940964A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCB drilling technology, and more particularly to an operational method for monitoring and improving the deviance and breakage of padless holes. Background Technology
[0002] In PCB development, high-speed signal technology is advancing rapidly, and signal requirements are becoming increasingly stringent. Reducing impedance fluctuation interference is a crucial direction. Research has found that at high-speed impedance line cross-layer connections, reducing the inner layer ring (the copper ring surrounding the via or through-hole) can effectively reduce impedance fluctuation, leading to the development of Padless via design. Padless vias are through-hole structures without traditional pads, meeting customers' high-speed signal requirements. However, because padless vias reduce the inner layer connection ring of the through-hole, alignment requirements are extremely stringent. General alignment standards are insufficient, and lower alignment quality may lead to inner layer misalignment, resulting in product defects. Summary of the Invention
[0003] The purpose of this application is to provide a method for monitoring and improving the operation of Padless hole misalignment, in order to solve the problem that the alignment accuracy requirements of Padless holes in related technologies are strict, the general alignment standards are difficult to meet, and the low alignment quality may lead to the problem of inner layer misalignment.
[0004] To solve the above-mentioned technical problems, this application adopts the following technical solution:
[0005] This application provides a method for monitoring and improving the operation of Padless hole deviance breakage, including:
[0006] A plurality of core boards are provided, inner layer circuits are formed on the plurality of core boards, and inner layer monitoring patterns are formed on the edges of the plurality of core boards to obtain a plurality of inner layer core boards;
[0007] The inner monitoring pattern is cross-shaped and has a center of symmetry. The extension directions of the cross are a first direction and a second direction that are perpendicular to each other. The cross end of the inner monitoring pattern is a semi-circle. The semi-circle of the semi-circle is centered on the positioning point. The diameter of the semi-circle is the same as the diameter of the Padless hole to be drilled.
[0008] According to the data, the aforementioned inner core boards and buffer materials are laminated together to obtain a pre-treated board;
[0009] Using the positioning point of the inner core plate at the top layer as the center, a through hole with the same diameter as the Padless hole to be drilled is formed on the pretreatment plate;
[0010] Detect the offset of the through hole;
[0011] Set the drilling parameters for the Padless hole to be drilled based on the test results.
[0012] Optionally, the provision of a plurality of core boards, forming inner layer circuitry on the plurality of core boards, and forming inner layer monitoring patterns on the edges of the plurality of core boards, resulting in a plurality of inner layer core boards, including:
[0013] A plurality of substrates are provided, and the plurality of substrates are cut according to the data to obtain the plurality of core boards;
[0014] The aforementioned core boards undergo pretreatment.
[0015] The pre-processed core boards are coated, exposed, developed, etched, and de-adhesive removed to form inner layer circuitry and inner layer monitoring patterns.
[0016] Rivet holes are punched in the core boards to obtain the inner core boards.
[0017] Optionally, the process of laminating and pressing the plurality of inner core boards and buffer materials according to the data to obtain a pre-treated board includes:
[0018] The aforementioned inner core boards undergo browning treatment;
[0019] Rivet the aforementioned inner core plates together;
[0020] The plurality of inner core plates and the buffer material are stacked together;
[0021] The stacked inner core boards and the buffer material are pressed together to obtain a pre-treated board.
[0022] Optionally, there are four inner monitoring patterns, which are symmetrically arranged at the four corners of the core board.
[0023] Optionally, detecting the offset of the through hole includes:
[0024] The offset of the center of the through hole from the positioning point in the several inner core layers is detected using an X-ray device in a first direction and a second direction.
[0025] Optionally, setting the drilling parameters of the Padless hole to be drilled based on the detection results includes:
[0026] If the offset of the through hole is within the preset threshold range, then the preset expansion / contraction coefficient and alignment parameters are set accordingly.
[0027] If the offset of the through hole exceeds the preset threshold range, the expansion and contraction coefficient and alignment parameter settings of the Padless hole to be drilled shall be adjusted accordingly.
[0028] Optionally, after setting the drilling parameters for the Padless hole based on the test results, the method further includes:
[0029] Perform Padless hole drilling according to the drilling parameters;
[0030] Copper is plated in the through holes and the padless holes;
[0031] Create the outer layer circuitry and outer layer monitoring patterns to obtain the PCB board;
[0032] The outer monitoring graphic corresponds to the inner monitoring graphic.
[0033] Optionally, the fabrication of the outer layer circuitry includes:
[0034] The pre-processed board is laminated, exposed, developed, etched, and peeled off to form outer layer circuitry and outer layer monitoring patterns, thus obtaining a PCB board.
[0035] Optionally, the inner monitoring pattern includes a connecting line and a positioning pattern. The connecting line is cross-shaped, and the positioning pattern is located at the cross end of the connecting line. The positioning pattern is a semi-circular shape.
[0036] Optionally, the length of the cross end of the connection line is greater than 8 mil.
[0037] Compared with the prior art, the beneficial effects achieved by this application are as follows: This application sets an inner layer monitoring pattern on the edge of several core boards. The inner layer monitoring pattern is cross-shaped and has a center of symmetry. The extension directions of the cross shape are a first direction and a second direction that are perpendicular to each other. The cross end of the inner layer monitoring pattern is a semi-monolith. The rectangular width of the semi-monolith is the same as the diameter of the Padless hole to be drilled, and the semicircle of the semi-monolith is centered on the positioning point. After several inner core boards and buffer material are laminated to form a pre-treatment board, a through hole with the same diameter as the diameter of the Padless hole to be drilled is formed on the pre-treatment board with the positioning point of the top inner core board as the center. The through hole and the semi-monolith structure of the inner layer monitoring pattern simulate the ringless design of the Padless hole to be drilled. By monitoring the offset of the through hole in the first and second directions, the alignment offset of the Padless hole can be identified in advance, thereby realizing the monitoring of the alignment quality of the Padless hole. Based on the offset detection results of the through hole, the drilling parameters of the Padless hole to be drilled can be adjusted in a timely manner, thereby avoiding inner layer breakage and improving the yield rate. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0039] Figure 1 These are schematic flowcharts illustrating the operation methods of some embodiments provided in this application;
[0040] Figure 2 These are schematic diagrams of the inner core board structure of some embodiments provided in this application;
[0041] Figure 3 These are schematic diagrams of the inner monitoring graphical structure of some embodiments provided in this application;
[0042] Figure 4 This application provides schematic diagrams of through-hole and inner layer monitoring graphic simulation of padless hole design in some embodiments;
[0043] Figure 5 This is a schematic diagram showing the contact length between the through-hole and the inner layer monitoring pattern in some embodiments provided in this application.
[0044] Figure labeling: 1-Inner core board; 2-Inner monitoring pattern; 3-Through hole. Detailed Implementation
[0045] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure / application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use.
[0046] Example 1
[0047] This embodiment describes a method for monitoring and improving the operation of Padless hole deviance breakage, referring to... Figure 1 and Figure 2 The method for monitoring and improving the operation of Padless hole deviance in this embodiment includes:
[0048] S100 provides several core boards, forms inner layer circuits on the several core boards, and forms inner layer monitoring patterns 2 on the edges of the several core boards, thus obtaining several inner layer core boards 1.
[0049] Among them, the inner monitoring pattern 2 is cross-shaped and has a center of symmetry. The extension directions of the cross are a first direction and a second direction that are perpendicular to each other. The first direction and the second direction are the extension directions of the length and width of several inner core boards 1, respectively. The cross end of the inner monitoring pattern 2 is a semi-monolith. The semi-circle of the semi-monolith is centered on the positioning point, and the diameter of the semi-circle is the same as the diameter of the Padless hole to be drilled.
[0050] S200, according to the data, several inner core boards 1 and buffer materials are laminated together to obtain a pre-treated board.
[0051] S300, with the positioning point of the inner core plate 1 at the top layer as the center, a through hole 3 with the same diameter as the Padless hole to be drilled is formed on the pretreatment plate.
[0052] S400, detects the offset of through hole 3.
[0053] S500 sets the drilling parameters for the Padless hole to be drilled based on the test results.
[0054] This embodiment simulates the ringless design of the padless hole to be drilled using the inner layer monitoring pattern 2 and the through hole 3. By monitoring the offset of the through hole 3 in the first and second directions, the alignment offset of the padless hole can be identified in advance, thereby achieving monitoring of the alignment quality of the monitored padless hole. Based on the offset detection results of the through hole 3, the drilling parameters of the padless hole to be drilled can be adjusted in a timely manner, thereby avoiding inner layer breakage and improving the yield rate.
[0055] refer to Figure 4 In the production design stage, PCB products require the connection length L (chord length) between the padless hole and the ringless design in a padless design as a design specification. In this embodiment, a through-hole 3 and a semi-mono circle are used to simulate the ringless design of the padless hole to be drilled. The rectangular width of the semi-mono circle is the same as the diameter of the padless hole to be drilled, and the semicircle of the semi-mono circle has the same diameter as the padless hole, centered at the positioning point. Therefore, the connection length L between the padless hole and the ringless design is the chord length of the contact arc between the through-hole 3 and the inner layer monitoring pattern 2 (hereinafter referred to as the contact length). After forming the through-hole 3 with the same diameter as the padless hole to be drilled on the pre-processing board, the contact length L between the through-hole 3 and the inner layer monitoring pattern 2 can be obtained more intuitively and accurately, thus obtaining the parameter required for the design specification.
[0056] Furthermore, in this embodiment, the inner monitoring pattern 2 is cross-shaped with a center of symmetry, and the extension directions of the cross are the first direction and the second direction, respectively. The cross-shaped design allows for better confirmation of the offset direction, facilitating subsequent adjustments and improvements to the drilling parameters of the Padless hole.
[0057] Example 2
[0058] Based on the same inventive concept as Embodiment 1, refer to Figure 1 and Figure 2 The method for monitoring and improving the operation of Padless hole deviance in this embodiment includes:
[0059] S100 provides several core boards, forms inner layer circuits on the several core boards, and forms inner layer monitoring patterns 2 on the edges of the several core boards, thus obtaining several inner layer core boards 1.
[0060] The inner monitoring pattern 2 is cross-shaped with a center of symmetry. The extension directions of the cross are the first and second directions that are perpendicular to each other. The cross end of the inner monitoring pattern 2 is a semi-circle. The semi-circle of the semi-circle is centered on the positioning point, and the diameter of the semi-circle is the same as the diameter of the Padless hole to be drilled.
[0061] The process of providing several core boards, forming inner layer circuits on several core boards, and forming inner layer monitoring patterns 2 on the edges of several core boards to obtain several inner layer core boards 1 includes: providing several substrates, cutting several substrates according to data to obtain several core boards; performing pretreatment on several core boards; coating, exposing, developing, etching, and removing adhesive from the pretreated several core boards to form inner layer circuits and inner layer monitoring patterns 2; punching rivet holes to obtain the several inner layer core boards 1.
[0062] In some embodiments, the inner core board 1 has a quadrilateral structure, and the first direction and the second direction are the extension directions of the length and width of the plurality of inner core boards 1, respectively. There are four inner monitoring patterns 2, which are symmetrically arranged at the four corners of the core board.
[0063] S200, according to the data, several inner core boards 1 and buffer materials are laminated together to obtain a pre-treated board.
[0064] Specifically, this includes: browning several inner core boards 1 to remove dirt and roughen the copper layer on the core surface; assembling several inner core boards 1 together using external rivets; stacking several inner core boards 1 with cushioning material; and placing the stacked inner core boards 1 and cushioning material in a vacuum hot press, pressing them together under specific temperature and pressure to obtain a pre-treated board.
[0065] S300, with the positioning point of the inner core plate 1 at the top layer as the center, a through hole 3 with the same diameter as the Padless hole to be drilled is formed on the pretreatment plate.
[0066] S400, detects the offset of through hole 3.
[0067] Specifically, this includes using X-ray equipment to detect the offset of the center of the through-hole 3 from the positioning points in several inner core layers 1 in a first direction and a second direction. While detecting the offset of the through-hole 3, the quality can be simultaneously confirmed by slicing the pre-processed board, effectively avoiding scrap within the sliced board and achieving the goal of improving yield.
[0068] S500 sets the drilling parameters for the Padless hole to be drilled based on the test results.
[0069] Specifically, this includes: if the offset of through hole 3 is within the preset threshold range, then the preset expansion / contraction coefficient and alignment parameters are set accordingly. If the offset of through hole 3 exceeds the preset threshold range, then the expansion / contraction coefficient and alignment parameters of the Padless hole to be drilled are adjusted accordingly.
[0070] After setting the drilling parameters for the padless holes based on the test results, the process also includes: drilling the padless holes according to the drilling parameters; plating copper in the through holes 3 and the padless holes; and creating the outer layer circuitry and outer layer monitoring pattern to obtain the PCB board. Specifically, this involves laminating, exposing, developing, etching, and peeling the pre-processed board to form the outer layer circuitry and outer layer monitoring pattern, thus obtaining the PCB board. The outer layer monitoring pattern corresponds to the inner layer monitoring pattern 2.
[0071] In some embodiments, the inner monitoring pattern 2 includes connecting lines and positioning patterns. The connecting lines are cross-shaped, and the positioning patterns are located at the cross ends of the connecting lines; the positioning patterns are semi-circular. Further, the length of the cross ends of the connecting lines is greater than 8 mil. Through the connecting lines, open / short circuit detection of the vias 3 can be performed on the outer monitoring pattern.
[0072] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this disclosure / application, and these improvements and modifications should also be considered within the protection scope of this disclosure / application.
Claims
1. A method for monitoring and improving the breakage of Padless holes, characterized in that, Including the following steps: A plurality of core boards are provided, inner layer circuits are formed on the plurality of core boards, and inner layer monitoring patterns are formed on the edges of the plurality of core boards to obtain a plurality of inner layer core boards; The inner monitoring pattern is cross-shaped and has a center of symmetry. The extension directions of the cross are a first direction and a second direction that are perpendicular to each other. The cross end of the inner monitoring pattern is a semi-circle. The semi-circle of the semi-circle is centered on the positioning point. The diameter of the semi-circle is the same as the diameter of the Padless hole to be drilled. According to the data, the aforementioned inner core boards and buffer materials are laminated together to obtain a pre-treated board; Using the positioning point of the inner core plate at the top layer as the center, a through hole with the same diameter as the Padless hole to be drilled is formed on the pretreatment plate; Detect the offset of the through hole; Set the drilling parameters for the Padless hole to be drilled based on the test results.
2. The method for monitoring and improving the operation of Padless hole deviance as described in claim 1, characterized in that, The method involves providing a plurality of core boards, forming inner layer circuitry on the plurality of core boards, and forming inner layer monitoring patterns on the edges of the plurality of core boards, thereby obtaining a plurality of inner layer core boards, including: A plurality of substrates are provided, and the plurality of substrates are cut according to the data to obtain the plurality of core boards; The aforementioned core boards undergo pretreatment. The pre-processed core boards are coated, exposed, developed, etched, and de-adhesive removed to form inner layer circuitry and inner layer monitoring patterns. Rivet holes are punched in the core boards to obtain the inner core boards.
3. The method for monitoring and improving the operation of Padless hole deviance as described in claim 2, characterized in that, The process involves laminating and pressing the plurality of inner core boards and buffer materials together according to the data to obtain a pre-treated board, including: The aforementioned inner core boards undergo browning treatment; Rivet the aforementioned inner core plates together; The plurality of inner core plates and the buffer material are stacked together; The stacked inner core boards and the buffer material are pressed together to obtain a pre-treated board.
4. The method for monitoring and improving the operation of Padless hole deviance as described in claim 1, characterized in that, The inner monitoring pattern has four elements, which are symmetrically arranged at the four corners of the core board.
5. The method for monitoring and improving the operation of Padless hole deviance breakage according to claim 1, characterized in that, The detection of the offset of the through hole includes: The offset of the center of the through hole from the positioning point in the inner core layer of the plurality of layers is detected using an X-ray device in the first and second directions.
6. The method for monitoring and improving the operation of Padless hole deviance as described in claim 5, characterized in that, The step of setting the drilling parameters for the Padless hole to be drilled based on the test results includes: If the offset of the through hole is within the preset threshold range, then the preset expansion / contraction coefficient and alignment parameters are set accordingly. If the offset of the through hole exceeds the preset threshold range, the expansion and contraction coefficient and alignment parameter settings of the Padless hole to be drilled shall be adjusted accordingly.
7. The method for monitoring and improving the operation of Padless hole deviance breakage according to claim 1, characterized in that, After setting the drilling parameters for the Padless hole to be drilled based on the test results, the method further includes: Perform Padless hole drilling according to the drilling parameters; Copper is plated in the through holes and the padless holes; Create the outer layer circuitry and outer layer monitoring patterns to obtain the PCB board; The outer monitoring graphic corresponds to the inner monitoring graphic.
8. The method for monitoring and improving the operation of Padless hole deviance as described in claim 7, characterized in that, The fabrication of the outer layer circuitry includes: The pre-processed board is laminated, exposed, developed, etched, and peeled off to form outer layer circuitry and outer layer monitoring patterns, thus obtaining a PCB board.
9. The method for monitoring and improving the operation of Padless hole deviance breakage according to claim 1, characterized in that, The inner monitoring pattern includes a connecting line and a positioning pattern. The connecting line is cross-shaped, and the positioning pattern is located at the cross end of the connecting line. The positioning pattern is a semi-circular shape.
10. The method for monitoring and improving the operation of Padless hole deviance as described in claim 9, characterized in that, The length of the cross end of the connecting line is greater than 8 mil.