Inverter and photovoltaic system

Abstract

The embodiment of the invention relates to the technical field of heat dissipation, and particularly discloses an inverter which comprises a shell, a circuit board assembly, an inner heat dissipation mechanism and an outer heat dissipation mechanism, the circuit board assembly and the inner heat dissipation mechanism are arranged in the shell, the outer heat dissipation mechanism is arranged on the outer surface of the shell, and the inner heat dissipation mechanism drives airflow to circularly flow in the shell. And the outer heat dissipation mechanism is arranged outside the shell and is used for dissipating heat of part of the circuit board assemblies with relatively high heat productivity. In this way, the heat dissipation efficiency of the inverter can be improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of heat dissipation technology, and in particular to an inverter and a photovoltaic system. Background Technology

[0002] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). It is widely used in photovoltaics, energy storage, automobiles, and home appliances—scenarios requiring DC-AC switching—and is a key component connecting DC power sources to AC loads / grids. However, inverters release a significant amount of heat during operation. If this heat cannot be dissipated in time, the temperature of the components inside the inverter will rise sharply, leading to decreased efficiency, unstable performance, accelerated component aging, and even permanent damage.

[0003] In the process of implementing the embodiments of the present invention, the inventors discovered that: currently, inverters achieve heat dissipation by installing a fan on the casing and driving the air inside the casing to exchange with the outside air. This single heat dissipation method is not very efficient. Summary of the Invention

[0004] The main technical problem solved by the embodiments of the present invention is to provide an inverter that addresses the issue that traditional inverters only have a single heat dissipation method.

[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide an inverter, including a housing, a circuit board assembly, an internal heat dissipation mechanism and an external heat dissipation mechanism, wherein the circuit board assembly and the internal heat dissipation mechanism are disposed inside the housing, and the external heat dissipation mechanism is disposed on the outer surface of the housing, wherein the internal heat dissipation mechanism drives airflow to circulate within the housing to dissipate heat from the circuit board assembly, and the external heat dissipation mechanism is used to dissipate heat from a portion of the circuit board assembly that generates a large amount of heat.

[0006] Optionally, the internal heat dissipation mechanism includes a first internal fan, a second internal fan, and a heat exchanger. The first and second internal fans are arranged on both sides of the output plate and the function plate along a second direction. The air outlet of the first internal fan faces the output plate, and the air outlet of the second internal fan faces the function plate. The first and second internal fans are used to drive the airflow to circulate between the capacitor plate, the output plate, and the function plate. The heat exchanger is arranged on the path of the airflow circulation and is used to exchange the heat of the airflow to the outside of the housing to cool the airflow.

[0007] Optionally, the heat exchanger includes a first air box, a second air box, and a first flat tube, with one end of the first flat tube connected to the first air box and the other end of the first flat tube connected to the second air box.

[0008] Optionally, the first air box is provided with a first air outlet and a first air cavity communicating with the first air outlet, and the first air box is provided with a first communicating hole on the surface near the first flat tube. The second air box is provided with a second air outlet and a second air cavity communicating with the second air outlet, and the second air box is provided with a second communication hole on the surface near the first flat tube; The first flat tube is provided with a first channel, which extends in a third direction. One end of the first channel is aligned with the first connecting hole, and the other end of the first channel is aligned with the second connecting hole.

[0009] Optionally, there are multiple first flat tubes, first connecting holes, and second connecting holes. The multiple first flat tubes, multiple first connecting holes, and multiple second connecting holes are all spaced apart along a first direction. A first connecting hole is connected to a second connecting hole through a first flat tube.

[0010] Optionally, the external heat dissipation mechanism includes a heat sink and an external fan. The heat sink is attached to the functional board, and the external fan is disposed on the heat sink. The heat sink is used to transfer the heat from the functional board to the outside, and the external fan is used to accelerate the heat transfer from the heat sink to the outside.

[0011] Optionally, the radiator includes an evaporator, a first condenser, a second condenser, and a heat transfer medium. The first condenser and the second condenser are respectively connected to the evaporator. The evaporator is attached to the functional plate. The heat transfer medium is located in the evaporator, the first condenser, and the second condenser, and the heat transfer medium can circulate between the evaporator and the first condenser, and between the evaporator and the second condenser, respectively.

[0012] Optionally, the evaporator includes a first housing and an isolation plate. The first housing is provided with an evaporation chamber and a first communication hole communicating with the evaporation chamber. The isolation plate is installed in the evaporation chamber and divides the evaporation chamber into a first sub-chamber and a second sub-chamber. The first sub-chamber is connected to the first condenser through the first communication hole, and the second sub-chamber is connected to the second condenser through the first communication hole.

[0013] The first air vent and the second air vent face the external heat dissipation mechanism along a first direction, and the airflow direction in the internal heat dissipation mechanism is related to the airflow direction in the external heat dissipation mechanism; When the airflow of the external heat dissipation mechanism flows from the first condenser to the second condenser, the airflow of the internal heat dissipation mechanism flows from the first air box to the second air box. When the airflow of the external heat dissipation mechanism flows from the second condenser to the first condenser, the airflow of the internal heat dissipation mechanism flows from the second air box to the first air box.

[0014] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a photovoltaic system, including a photovoltaic panel and the inverter mentioned above, wherein the photovoltaic panel is connected to the inverter.

[0015] The beneficial effects of this invention are as follows: Unlike the prior art, this invention provides an inverter, including a housing, a circuit board assembly, an internal heat dissipation mechanism, and an external heat dissipation mechanism. The circuit board assembly and the internal heat dissipation mechanism are disposed inside the housing, and the external heat dissipation mechanism is disposed on the outer surface of the housing. The internal heat dissipation mechanism drives airflow to circulate within the housing to dissipate heat from the circuit board assembly. The external heat dissipation mechanism dissipates heat from a portion of the circuit board assembly that generates a large amount of heat outside the housing. The internal and external heat dissipation mechanisms simultaneously dissipate heat from the inverter, thereby improving the inverter's heat dissipation efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of an inverter provided in an embodiment of the present invention; Figure 2 This is an exploded view of the inverter provided in an embodiment of the present invention; Figure 3 This is another schematic diagram of the inverter provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the housing of the inverter provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the internal heat dissipation path provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the heat exchanger of the inverter provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the heat sink of the inverter provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of an external heat dissipation path provided in an embodiment of the present invention; Figure 9 This is another schematic diagram of the external heat dissipation path provided in an embodiment of the present invention; Figure 10 This is an exploded view of the heat sink of the inverter provided in an embodiment of the present invention; Figure 11 This is another exploded view of the heat sink of the inverter provided in the embodiment of the present invention; Figure 12 yes Figure 7Sectional view at point d; Figure 13 yes Figure 10 A magnified view of a portion of point a; Figure 14 yes Figure 10 A magnified view of a section at point b in the middle; Figure 15 yes Figure 10 A magnified view of a section at point c.

[0018] Explanation of reference numerals in the attached figures: 100. Inverter; 10. Shell; 11. Lower casing; 111. Window; 112. Ventilation opening; 12. Top cover; 13. Receiving cavity; 20. Circuit board assembly; 21. Functional board; 22. Output board; 23. Capacitor board; 24. External board; 241. DC terminal; 30. Internal heat dissipation mechanism; 31. First internal fan; 32. Second internal fan; 33. Heat exchanger; 331. First air box; 3311. First air outlet; 3312. First air cavity; 3313. First connecting hole; 332. Second air box; 3321. Second air outlet; 3322. Second air cavity; 3323. Second connecting hole; 333. First flat tube; 3331. First channel; 3331a. First sub-channel; 40. External heat dissipation mechanism; 41. Radiator; 411. Evaporator; 4111. First housing; 41111. Evaporation chamber; 41111a. First sub-chamber; 41111b. Second sub-chamber; 41112. Third connecting hole; 41113. Liquid inlet; 4112. Isolation plate; 4113. Heat sink; 4114. Support block; 412. First condenser; 4121. Second housing; 41211. First condensation chamber; 4121 2. Fourth connecting hole; 4122. Second flat tube; 41221. Second channel; 41221a. First sub-channel; 41222. Second limiting notch; 413. Second condenser; 4131. Third housing; 41311. Second condensing chamber; 41312. Fifth connecting hole; 4132. Third flat tube; 41321. Third channel; 41321a. Third sub-channel; 41322. Third limiting notch; 42. External fan; 50. Inverter inductor; 60. Boost inductor; 70. Fin. Detailed Implementation

[0019] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0021] Please see Figures 1 to 3 The inverter 100 includes a housing 10, a circuit board assembly 20, an internal heat dissipation mechanism 30, and an external heat dissipation mechanism 40. The circuit board assembly 20 and the internal heat dissipation mechanism 30 are disposed inside the housing 10, and the external heat dissipation mechanism 40 is disposed on the outer surface of the housing 10. The internal heat dissipation mechanism 30 drives airflow to carry away the heat of the circuit board assembly 20 and transfer the heat inside the housing 10 to the outside of the housing 10. The external heat dissipation mechanism 40 abuts against a portion of the circuit board assembly 20 and transfers the heat of the abutting portion of the circuit board assembly 20 to the outside.

[0022] For the housing 10 described above, please refer to... Figure 4 The housing 10 includes a lower box 11 and a top cover 12. The top cover 12 covers the lower box 11, and the top cover 12 and the lower box 11 together enclose a receiving cavity 13. The lower box 11 is provided with a window 111 and a vent 112. The window 111 communicates with the receiving cavity 13, and the vent 112 communicates with the outside.

[0023] For the circuit board assembly 20 described above, please refer to... Figure 2 The circuit board assembly 20 includes a function board 21, an output board 22, and a capacitor board 23. The function board 21 is located at the bottom of the lower box 11, the output board 22 is located above the function board 21 along a first direction, and the capacitor board 23 is located on one side of the function board 21 and the output board 22 along a second direction.

[0024] It should be noted that the first direction is the z-direction, the second direction is the x-direction, and the third direction is the y-direction. The first, second, and third directions are perpendicular to each other.

[0025] Specifically, function board 21 includes a boost module (not shown) and an inverter module (not shown). The boost module converts low-voltage DC to high-voltage DC, and the inverter module converts DC to pulse current containing rich harmonics. Capacitor board 23 is used to mitigate voltage surges caused by sudden load changes or external interference, protecting the normal operation of internal components of inverter 100. Output board 22 includes a filter module (not shown), which filters out high-frequency noise and glitches, transforming coarse pulse waves into smooth, stable sinusoidal AC.

[0026] In some embodiments, the circuit board assembly 20 further includes an external board 24, which is provided with DC terminals 241 for connection to a power supply device. The DC terminals 241 are all soldered onto the external board 24, reducing the internal wiring steps of the DC terminals 241 and allowing for direct replacement of faulty DC terminals 241, facilitating maintenance. The external board 24 is also provided with a thermistor (not shown) for quickly and accurately measuring the temperature inside the housing 10.

[0027] For the aforementioned internal heat dissipation mechanism 30, please refer to... Figure 2 and Figure 5 The internal heat dissipation mechanism 30 includes a first internal fan 31, a second internal fan 32, and a heat exchanger 33. The first internal fan 31 and the second internal fan 32 are arranged on both sides of the output plate 22 and the function plate 21 along the second direction. The second air outlet 3321 of the first internal fan 31 faces the output plate 22, and the second air outlet 3321 of the second internal fan 32 faces the function plate 21. The first internal fan 31 and the second internal fan 32 are used to drive the airflow to circulate between the function plate 21, the output plate 22, and the capacitor plate 23. The heat exchanger 33 is arranged on the path of the airflow circulation and is used to exchange the heat of the airflow to the outside of the housing 10 to cool the airflow.

[0028] For further details, please refer to Figure 6The heat exchanger 33 includes a first air box 331, a second air box 332, and a plurality of first flat tubes 333. One end of each first flat tube 333 is connected to the first air box 331, and the other end is connected to the second air box 332. The first air box 331 is provided with a first air outlet 3311 and a first air cavity 3312 communicating with the first air outlet 3311. The first air box 331 has a plurality of first connecting holes 3313 spaced apart along a first direction on its surface near the first flat tubes 333. The first air outlet 3311 of the first air box 331 communicates with the outside through the ventilation opening 112 of the lower box 11. The second air box 332 is provided with a second air outlet 3321 and a second air cavity 3322 communicating with the second air outlet 3321. The second air box 332 has a plurality of second connecting holes 3323 spaced apart along a first direction on its surface near the first flat tubes 333. The second air outlet 3321 of the second air box 332 communicates with the outside through the ventilation opening 112 of the lower box 11. The first flat tube 333 is provided with a first channel 3331, which includes multiple first sub-channels 3331a spaced apart along a second direction. The multiple first flat tubes 333 are spaced apart along a first direction. One end of one first channel 3331 is connected to a first air cavity 3312 through a first connecting hole 3313, and the other end of one first channel 3331 is connected to a second air cavity 3322 through a second connecting hole 3323. The multi-channel configuration of the first flat tube 333 makes it less prone to heat concentration and facilitates heat exchange with the outside air.

[0029] It should be noted that the heat exchanger 33 has a symmetrical structure. The first air box 331 and the second air box 332 have the same structure. The first air outlet 3311 and the second air outlet 3321 face the external heat dissipation mechanism 40 in the first direction. The airflow direction of the internal heat dissipation mechanism 30 is determined by the airflow direction in the external heat dissipation mechanism 40. The external heat dissipation mechanism drives the airflow to conduct heat along the airflow direction, resulting in different temperatures at the first air outlet 3311 and the second air outlet 3321. When the air temperature at the first air outlet 3311 is lower than the air temperature at the second air outlet 3321, the airflow enters the first air chamber 3312 from the first air outlet 3311, flows through the first flat tube 333 and enters the second air chamber 3322, and flows back to the outside from the second air outlet 3321. The heat inside the shell 10 is conducted to the outside along the airflow direction. Similarly, when the air temperature at the second air vent 3321 is lower than the air temperature at the first air vent 3311, the airflow enters the second air cavity 3322 from the second air vent 3321, flows through the first flat tube 333 and then enters the first air cavity 3312, and flows back to the outside from the first air vent 3311. The heat inside the casing 10 is conducted to the outside along the direction of airflow.

[0030] In some embodiments, the shape of the first sub-channel 3331 can be set as V-shaped, triangular or rectangular. This channel structure can increase the contact area between the air in the first sub-channel and the outside air, thereby increasing the heat dissipation efficiency.

[0031] For the external heat dissipation mechanism 40 mentioned above, please refer to Figure 3 The external heat dissipation mechanism 40 includes a heat sink 41 and an external fan 42. The heat sink 41 is attached to the functional board 21, and the external fan 42 is disposed on the heat sink 41. The heat sink 41 is used to transfer the heat of the functional board 21 to the outside, and the external fan 42 is used to accelerate the airflow speed so that the external heat dissipation mechanism 40 can transfer the heat to the outside more quickly.

[0032] For further details, please refer to Figures 6 to 12 The radiator 41 includes an evaporator 411, a first condenser 412, a second condenser 413, and a heat transfer medium (not shown). The first condenser 412 and the second condenser 413 are respectively connected to the evaporator 411. The evaporator 411 is attached to the functional plate 21. The heat transfer medium is located in the evaporator 411, the first condenser 412, and the second condenser 413, and the heat transfer medium can circulate between the evaporator 411 and the first condenser 412, and between the evaporator 411 and the second condenser 413.

[0033] In some embodiments, the inverter 100 further includes an inverter inductor 50 and a boost inductor 60, which are fixed to the outer surface of the lower housing 11. The inverter inductor 50 is installed along a third direction on the side of the second condenser 413 away from the first condenser 412, and the boost inductor 60 is installed along a third direction on the side of the first condenser 412 away from the second condenser 413.

[0034] Understandably, please refer to Figure 8 and Figure 9An external fan 42 can be positioned between the first condenser 412 and the second condenser 413. The external fan 42 can enhance air convection. By changing the direction of the air outlet of the external fan 42, the airflow direction through the external heat dissipation mechanism 40 can be changed. When the air outlet of the external fan 42 faces the second condenser 413, the airflow flows from the outside through the boost inductor 60, the first condenser 412, the external fan 42, the second condenser 413, and the inverter inductor 50 before returning to the outside. Heat is carried away with the airflow direction, resulting in the air temperature at the first air outlet 3311 being lower than the air temperature at the second air outlet 3321. Air enters the first air box 331 from the first air outlet 3311, then flows through the second air box 332 and exits from the second air outlet 3321. The heat from the internal heat dissipation mechanism enters the airflow of the external heat dissipation mechanism 40 along with the airflow through the internal heat dissipation mechanism 30. The heat from the internal heat dissipation mechanism 30 and the heat from the external heat dissipation mechanism 40 enter the outside together. When the air outlet of the external fan 42 faces the first condenser 412, the airflow flows from the outside through the inverter inductor 50, the second condenser 413, the external fan 42, the first condenser 412, and the boost inductor 60 before returning to the outside. At this time, the air temperature at the second air outlet 3321 is lower than the temperature at the first air outlet 3311. The airflow flows in from the second air outlet 3321 and flows out from the first air outlet 3311. The heat inside the housing 10 is carried away by the airflow of the internal heat dissipation mechanism 30 and is conducted to the outside along with the heat of the external heat dissipation mechanism 40. That is, the arrangement of the external fan between the first condenser 412 and the second condenser 413 gives the external heat dissipation mechanism 40 a unidirectional airflow path.

[0035] In some embodiments, the external fan 42 may also be disposed on the side of the first condenser 412 and the second condenser 413 away from the evaporator 411 along a first direction, and the air outlet of the external fan 42 is oriented towards the space between the first condenser 412 and the second condenser 413 along a third direction. In this case, the airflow has two paths. The first path is that the airflow flows through the outside, the first condenser 412 and the boost inductor 60 and then returns to the outside. The second path is that the airflow flows through the outside, the second condenser 413 and the inverter inductor 50 and then returns to the outside. That is, in this arrangement of the external fan 42, the airflow has two flow paths.

[0036] Preferably, in order to further enhance heat dissipation efficiency, the number of external fans 42 can be set to multiple, increasing the airflow speed so that the heat from the inverter 100 can be carried to the outside more quickly.

[0037] In some embodiments, the heat transfer medium can be selected from green and environmentally friendly mediums such as HP-1, R-134a, R515B, and R1233zd. These heat transfer mediums can be reused and will not cause environmental pollution.

[0038] Specifically, the evaporator 411 includes a first housing 4111 and an isolation plate 4112. The first housing 4111 is provided with an evaporation chamber 41111, and the isolation plate 4112 is installed in the evaporation chamber 41111. The first housing 4111 has a plurality of third connecting holes 41112 spaced apart along a second direction on its surface opposite to the lower housing 11. The third connecting holes 41112 communicate with the evaporation chamber 41111. The isolation plate 4112 divides the evaporation chamber 41111 into a first sub-chamber 41111a and a second sub-chamber 41111b. The first sub-chamber 41111a communicates with the first condenser 412 through the third connecting holes 41112, and the second sub-chamber 41111b communicates with the second condenser 413 through the third connecting holes 41112. By dividing the evaporation chamber 41111 into the first sub-chamber 41111a and the second sub-chamber 41111b, different modules can be cooled in segments, maximizing heat dissipation efficiency. The first housing 4111 is also provided with a liquid injection port 41113 on the surface opposite to the lower housing 11. The liquid injection port 41113 is used to inject heat transfer medium into the evaporation chamber 41111.

[0039] In some embodiments, the evaporator 411 further includes heat sinks 4113 and support blocks 4114. The heat sinks 4113 are disposed in the first compartment 41111a and the second compartment 41111b, and are attached to the inner surface of the evaporator 411 near the bottom of the lower casing 11. The support blocks 4114 are disposed around the heat sinks 4113 and are offset from the first connecting hole 3313 in a second direction to prevent the flow path of the heat transfer medium in the evaporator 411 from being blocked by the support blocks 4114. The heat sinks 4113 can transfer heat from the functional plate 21 to the liquid heat transfer medium, causing the liquid heat transfer medium to absorb heat and vaporize for circulation. The support blocks 4114 are used to strengthen the first housing 4111, preventing deformation or damage to the first housing 4111 when subjected to pressure, which could lead to leakage of the heat transfer medium.

[0040] The first condenser 412 includes a second housing 4121 and a plurality of second flat tubes 4122. One end of each second flat tube 4122 is connected to the second housing 4121, and the other end is connected to the first housing 4111. The second housing 4121 is provided with a first condensing chamber 41211. A plurality of fourth connecting holes 41212 are spaced apart along a second direction on the surface of the second housing 4121 near the second flat tubes 4122. The fourth connecting holes 41212 communicate with the first condensing chamber 41211. The second flat tubes 4122 are provided with second channels 41221, which include a plurality of second sub-channels 41221a spaced apart along a third direction. The plurality of second flat tubes 4122 are spaced apart along the second direction. One end of one second channel 41221 communicates with the first condensing chamber 41211 through a fourth connecting hole 41212, and the other end of one second channel 41221 communicates with a first sub-chamber 41111a through a third connecting hole 41112. After absorbing heat and vaporizing, the liquid heat transfer medium located in the first sub-cavity 41111a flows through the second sub-channel 41221a into the first condensing cavity 41211. After being cooled and liquefied in the first condensing cavity 41211, it is converted into a liquid heat transfer medium and flows back to the first sub-cavity 41111a through the second sub-channel 41221a for the next cycle.

[0041] The second condenser 413 includes a third housing 4131 and a plurality of third flat tubes 4132. One end of each third flat tube 4132 is connected to the third housing 4131, and the other end is connected to the first housing 4111. The third housing 4131 is provided with a second condensing chamber 41311. A plurality of fifth connecting holes 41312 are spaced apart along a second direction on the surface of the third housing 4131 near the third flat tubes 4132. The fifth connecting holes 41312 communicate with the second condensing chamber 41311. Each third flat tube 4132 is provided with a third channel 4132, which includes a plurality of third sub-channels 41321a spaced apart along a third direction. The plurality of third flat tubes 4132 are spaced apart along the second direction. One end of one third channel 4132 communicates with the second condensing chamber 41311 through a fifth connecting hole 41312, and the other end of one third channel 4132 communicates with a second sub-chamber 41111b through a third connecting hole 41112. After absorbing heat and vaporizing, the liquid heat transfer medium located in the second sub-cavity 41111b flows through the third sub-channel 41321a into the second condensing cavity 41311. After being cooled and liquefied in the second condensing cavity 41311, it is converted into a liquid heat transfer medium and flows back to the second sub-cavity 41111b through the third sub-channel 41321a for the next cycle.

[0042] It is understood that in this embodiment, the first condenser 412 is used to dissipate heat from the boost module, and the second condenser 413 is used to dissipate heat from the inverter module. Since the inverter module generates more heat than the boost module, it requires higher heat dissipation efficiency. The width of the second flat tube 4122 along the third direction is smaller than the width of the third flat tube 4132 along the third direction, that is, the heat dissipation area of ​​the second flat tube 4122 is smaller than the heat dissipation area of ​​the third flat tube 4132.

[0043] In some embodiments, the second flat tube 4122 has second limiting notches 41222 at both ends, and the third flat tube 4132 has third limiting notches 41322 at both ends, for limiting the installation of the second flat tube 4122 and the third flat tube 4132. When one end of the second flat tube 4122 is installed in the evaporator 411 and the other end of the second flat tube 4122 is installed in the first condenser 412, one end of the second flat tube 4122 extends into the evaporation chamber 41111, and the second limiting notch 41222 abuts against the surface of the first housing 4111 for limiting. The other end of the second flat tube 4122 extends into the first condensation chamber 41211, and the second limiting notch 41222 abuts against the surface of the second housing 4121 for limiting. Similarly, the third limiting notch 41322 of the third flat tube 4132 has the same limiting function.

[0044] In some embodiments, the inverter 100 further includes a plurality of fins 70, with one fin 70 disposed between two adjacent first flat tubes 333, two adjacent second flat tubes 4122 and two adjacent third flat tubes 4132. In order to increase the heat dissipation area, the fins 70 are corrugated. The corrugated structure forces the air to continuously change the flow direction to generate vortices, continuously carrying away heat and improving heat dissipation efficiency.

[0045] In some embodiments, the second flat tube 4122 and the third flat tube 4132 are installed at an angle X with the evaporator 411 along a first direction, and 75°≤X≤85°, which can accelerate the return of the liquid heat transfer medium located in the first condenser 412 and the second condenser 413 to the evaporator 411 for the next cycle.

[0046] To facilitate the reader's understanding of the present invention, the assembly process of the inverter 100 of the present invention is described below: Functional board 21 is positioned at the bottom of lower housing 11. Output board 22 is positioned above functional board 21 along a first direction. Capacitor board 23 is positioned on one side of output board 22 and functional board 21 along a second direction. Air exchanger is positioned on the other side of output board 22 and functional board 21 along a second direction. First internal fan 31 and second internal fan 32 are positioned on both sides of output board 22 and functional board 21, with the second air outlet 3321 of first internal fan 31 facing output board 22 and the second air outlet 3321 of second internal fan 32 facing functional board 21. The first internal fan 31 and second internal fan 32 drive airflow to circulate between capacitor board 23, output board 22 and functional board 21. In the circulating flow, the heat exchanger 33 is positioned along the airflow path. Outside air flows in through the first air inlet 3311 and out through the second air inlet 3321, or vice versa. Heat inside the casing 10 is transferred to the first flat tube 333 and fins 70 after reaching the heat exchanger 33. The heat in the first flat tube 333 and fins 70 continuously exchanges heat with the flowing air in the first flat tube 333 within the heat exchanger 33, thereby transferring heat from inside the casing 10 to the outside air. In other words, the heat exchanger 33 transfers the heat of the airflow to the outside of the casing 10 to cool the circuit board assembly 20 inside the casing 10.

[0047] The external heat dissipation mechanism 40 is disposed on the outer surface of the lower box 11 away from the top cover 12, and the external heat dissipation mechanism 40 abuts against the function board 21 through the window 111 of the lower box 11. The inverter module and boost module on the function board 21 generate a large amount of heat. The heat is conducted to the heat sink 4113 through the evaporator 411 that abuts against the function board 21. The heat sink 4113 dissipates the heat to the heat transfer medium. The liquid heat transfer medium in the first compartment 41111a and the second compartment 41111b absorbs the heat and undergoes a phase change to become a gaseous heat transfer medium. The gaseous heat transfer medium in the first compartment 41111a flows through the third connecting hole 41112 and the second channel 41221 and enters the first condensing chamber 41211. The gaseous heat transfer medium in the second compartment 41111b flows through the third connecting hole 41112 and the third channel 4132 and enters the second condensing chamber 41311 for cooling and transformation into a liquid heat transfer medium. The liquid heat transfer medium flows back to the evaporator 41111 for the next cycle. The external fan 42 accelerates the airflow to quickly remove the heat.

[0048] In this embodiment of the invention, the inverter 100 includes a housing 10, a circuit board assembly 20, an internal heat dissipation mechanism 30, and an external heat dissipation mechanism 40. The circuit board assembly 20 and the internal heat dissipation mechanism 30 are disposed inside the housing 10, and the external heat dissipation mechanism 40 is disposed on the outer surface of the housing 10. The internal heat dissipation mechanism 30 forms an airflow circulation inside the housing 10, which conducts the heat of the circuit board assembly 20 inside the housing 10 to the outside. The external heat dissipation structure dissipates heat from the part of the circuit board assembly 20 attached to it outside the housing, thereby improving the heat dissipation efficiency of the inverter.

[0049] The present invention provides an embodiment of a photovoltaic system, which includes a photovoltaic panel (not shown) and the inverter 100 described above. The structure and function of the photovoltaic panel and the inverter 100 can be referred to the above embodiment, and will not be described in detail here.

[0050] It should be noted that while the preferred embodiments of the present invention are given in the specification and accompanying drawings, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of the present invention; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of the present invention. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of the present invention specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An inverter, characterized in that, include: The housing includes a lower box and a top cover, the top cover being disposed on the lower box, the lower box and the top cover together enclosing a receiving cavity, the lower box being provided with a window communicating with the receiving cavity; The circuit board assembly includes a capacitor board, an output board, and a function board. The function board is disposed at the bottom of the lower box, the output board is disposed above the function board along a first direction, and the capacitor board is disposed on one side of the output board and the function board along a second direction. An internal heat dissipation mechanism is disposed in the receiving cavity. The internal heat dissipation mechanism is used to drive airflow to circulate between the capacitor plate, the output plate and the function plate to dissipate heat from the capacitor plate, the output plate and the function plate. An external heat dissipation mechanism is disposed on the outer surface of the lower box away from the top cover. The external heat dissipation mechanism abuts against the functional board through the window and is used to dissipate heat from the functional board.

2. The inverter according to claim 1, characterized in that, The internal heat dissipation mechanism includes a first internal fan, a second internal fan, and a heat exchanger. The first and second internal fans are arranged along a second direction on both sides of the output plate and the function plate. The air outlet of the first internal fan faces the output plate, and the air outlet of the second internal fan faces the function plate. The first and second internal fans are used to drive the airflow to circulate between the capacitor plate, the output plate, and the function plate. The heat exchanger is arranged on the path of the airflow circulation and is used to exchange the heat of the airflow to the outside of the housing to cool the airflow.

3. The inverter according to claim 2, characterized in that, The heat exchanger includes a first air box, a second air box, and a first flat tube. One end of the first flat tube is connected to the first air box, and the other end of the first flat tube is connected to the second air box.

4. The inverter according to claim 3, characterized in that, The first air box is provided with a first air outlet and a first air cavity communicating with the first air outlet, and the first air box is provided with a first communicating hole on the surface near the first flat tube; The second air box is provided with a second air outlet and a second air cavity communicating with the second air outlet, and the second air box is provided with a second communication hole on the surface near the first flat tube; The first flat tube is provided with a first channel, which extends in a third direction. One end of the first channel is aligned with the first connecting hole, and the other end of the first channel is aligned with the second connecting hole.

5. The inverter according to claim 4, characterized in that, The number of the first flat tube, the first connecting hole and the second connecting hole is multiple. The multiple first flat tubes, the multiple first connecting holes and the multiple second connecting holes are all spaced apart along the first direction. A first connecting hole is connected to a second connecting hole through a first flat tube.

6. The inverter according to claim 1, characterized in that, The external heat dissipation mechanism includes a heat sink and an external fan. The heat sink is attached to the functional board, and the external fan is disposed on the heat sink. The heat sink is used to transfer the heat from the functional board to the outside, and the external fan is used to accelerate the heat transfer from the heat sink to the outside.

7. The inverter according to claim 6, characterized in that, The radiator includes an evaporator, a first condenser, a second condenser, and a heat transfer medium. The first condenser and the second condenser are respectively connected to the evaporator. The evaporator is attached to the functional plate. The heat transfer medium is located in the evaporator, the first condenser, and the second condenser, and the heat transfer medium can circulate between the evaporator and the first condenser, and between the evaporator and the second condenser, respectively.

8. The inverter according to claim 7, characterized in that, The evaporator includes a first housing and an isolation plate. The first housing is provided with an evaporation chamber and a first communication hole communicating with the evaporation chamber. The isolation plate is installed in the evaporation chamber and divides the evaporation chamber into a first sub-chamber and a second sub-chamber. The first sub-chamber is connected to the first condenser through the first communication hole, and the second sub-chamber is connected to the second condenser through the first communication hole.

9. The inverter according to any one of claims 1-8, characterized in that, The first air vent and the second air vent face the external heat dissipation mechanism along a first direction, and the airflow direction within the internal heat dissipation mechanism is related to the airflow direction within the external heat dissipation mechanism; When the airflow of the external heat dissipation mechanism flows from the first condenser to the second condenser, the airflow of the internal heat dissipation mechanism flows from the first air box to the second air box. When the airflow of the external heat dissipation mechanism flows from the second condenser to the first condenser, the airflow of the internal heat dissipation mechanism flows from the second air box to the first air box.

10. A photovoltaic system, characterized in that, It includes a photovoltaic panel and an inverter as described in any one of claims 1-9, wherein the photovoltaic panel and the inverter are connected.

Images