Bonding device for silicon carbide rod machining

Abstract

The invention discloses a bonding device for silicon carbide rod processing, and belongs to the technical field of silicon carbide rod processing, the bonding device specifically comprises a workbench, a bonding table is fixedly connected to the upper portion of the workbench, and the upper surface of the bonding table is provided with a first containing groove used for containing the hot end of a silicon carbide rod; second containing grooves used for containing the cold ends of the silicon carbide rods are formed in the two sides of the first containing groove in the axial direction of the first containing groove correspondingly, and the second containing grooves communicate with the first containing groove through communicating grooves. A glue injection mechanism is arranged above the communicating groove; through cooperation of the first placement groove, the second placement groove and the communication groove, coaxial positioning of the hot end and the cold ends at the two ends is achieved, and the straightness after bonding is guaranteed; after the lower supporting mold and the upper pressing mold are assembled, the first arc-shaped groove and the second arc-shaped groove wrap the joint of the hot end and the cold end and the end of the cold end correspondingly, a closed glue injection cavity is formed, glue is prevented from overflowing, and meanwhile glue liquid is guided to evenly fill the joint.

Description

Technical Field

[0001] This invention belongs to the field of silicon carbide rod processing technology, and specifically relates to a bonding device for silicon carbide rod processing. Background Technology

[0002] Silicon carbide rods are non-metallic high-temperature electric heating elements made primarily of silicon carbide through high-temperature sintering. They are widely used in high-temperature heating applications in industries such as metallurgy, ceramics, glass, and semiconductors. The structure of a silicon carbide rod typically includes a hot end and a cold end. The hot end is the conductive heating component, while the cold end is the wire-conducting component. During manufacturing, the hot and cold ends must be firmly bonded together using an adhesive to ensure conductivity and structural stability during subsequent use.

[0003] Currently, the bonding of the hot and cold ends of silicon carbide rods is mostly done manually. Operators first position the hot and cold ends of the silicon carbide rod separately, and then manually apply adhesive to the joint. However, there are problems such as unstable positioning, inaccurate glue application, and poor sealing effect during the bonding process. Adhesive overflow and poor sealing at the joint are common during the bonding process, resulting in insufficient bonding strength. As a result, silicon carbide rods are prone to detachment and breakage during high-temperature use.

[0004] Therefore, there is a need to provide a bonding device for silicon carbide rod processing to solve the above-mentioned technical problems. Summary of the Invention

[0005] To address the problems mentioned in the background section, this invention provides a bonding device for silicon carbide rod processing, which features precise positioning, uniform adhesive application, good sealing effect, convenient operation, and high efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a bonding device for processing silicon carbide rods, comprising a worktable, a bonding table fixedly connected above the worktable, a first placement groove for placing the hot end of the silicon carbide rod on the upper surface of the bonding table, and a second placement groove for placing the cold end of the silicon carbide rod on both sides along the axial direction of the first placement groove, the second placement groove and the first placement groove being connected by a connecting groove.

[0007] A glue injection mechanism is provided above the connecting groove. The glue injection mechanism includes a lower support mold and an upper pressure mold that are symmetrically distributed vertically. The lower support mold is fixedly connected inside the connecting groove. The upper pressure mold and the side opposite to the lower support mold are both provided with a first arc-shaped groove extending along the axial direction of the first placement groove. The sidewalls at the same end of the upper pressure mold and the lower support mold are both provided with a second arc-shaped groove extending along the axial direction of the second placement groove. A glue injection nozzle is fixedly connected to the upper mold, and the glue injection port of the glue injection nozzle is connected to the first arc-shaped groove on the upper mold.

[0008] Preferably, a sealing groove is provided on the lower mold outside the first arc groove, and a sealing boss that is fixedly connected to the upper mold is movably inserted in the sealing groove, and the outer wall of the sealing boss is tightly fitted with the inner wall of the sealing groove.

[0009] Preferably, the bonding platform is further provided with a pressing component, which includes a pressing plate. A glue injector corresponding to the glue injection nozzle is fixedly connected to the pressing plate. The glue outlet of the glue injector and the glue inlet of the glue injection nozzle are connected through a glue injection tube, and a glue control valve is provided on the glue injection tube.

[0010] Preferably, the lower pressure plate is provided with a first pressing component for pressing the hot end of the silicon carbide rod, and a second pressing component for pressing the cold end of the silicon carbide rod is provided on both sides of the first pressing component. The second pressing component and the first pressing component have the same structure.

[0011] Preferably, the first pressing assembly includes a pressing plate and a limiting plate arranged parallel to each other. The pressing plate is located below the lower pressing plate, and a pressing groove is provided on the lower surface of the pressing plate. The limiting plate is located above the lower pressing plate, and both ends of the limiting plate and the pressing plate are fixedly connected by limiting rods. The limiting rods slide through the lower pressing plate, and an elastic element is also fixedly connected between the limiting plate and the lower pressing plate.

[0012] Preferably, the elastic element includes a buffer spring, and both ends of the buffer spring are fixedly connected to spring seats, one of the spring seats being fixedly connected to the lower pressure plate and the other spring seat being fixedly connected to the limiting plate.

[0013] Preferably, a flexible buffer pad is fixed to the inner wall of the pressing groove. The flexible buffer pad is made of high-temperature resistant silicone material, and the surface of the flexible buffer pad is provided with anti-slip texture.

[0014] Preferably, the workbench is provided with a drive assembly, which includes a base plate and a top plate arranged parallel to each other. The base plate is fixedly connected to the workbench, and both ends of the base plate and the top plate are fixedly connected by a slide rod. A cylinder is fixedly connected above the top plate, and the piston end of the cylinder passes through the top plate and is fixedly connected to a drive plate. The drive plate is slidably connected to the slide rod, and one end of the drive plate is fixedly connected to a lower pressure plate.

[0015] Preferably, one end of the bonding table is provided with an adjustment assembly, which includes a fixed plate and a push-pull plate arranged parallel to each other. The fixed plate is fixedly connected to the bonding table, and a push-pull rod corresponding to the second placement groove is movably passed through the fixed plate. A push plug is fixedly connected to the other end of the push-pull rod, and the push-pull plate is fixedly connected to the other ends of the two push-pull rods. An adjusting bolt is threadedly connected to the push-pull plate, and one end of the adjusting bolt is rotatably connected to the fixed plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. The present invention achieves coaxial positioning of the hot end and the two cold ends by the cooperation of the first placement groove, the second placement groove and the connecting groove, ensuring the straightness after bonding; after the lower mold and the upper mold are closed, the first arc groove and the second arc groove respectively wrap the joint of the hot end and the cold end and the end of the cold end, forming a closed injection cavity to prevent the glue from overflowing, and at the same time guide the glue to fill the joint evenly.

[0017] 2. The present invention can effectively prevent adhesive overflow during the glue injection process by tightly fitting the sealing boss and the sealing groove, avoiding contamination of the silicon carbide rod surface, while ensuring that the adhesive fully acts on the mating surface, further improving the bonding strength.

[0018] 3. The present invention can adjust the axial position of the cold end of the silicon carbide rod by means of the adjustment component, so as to adapt to different length specifications or eliminate assembly gaps. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the main structure of the present invention; Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle; Figure 4 This is a side view of the structure of the present invention; Figure 5 This is a side cross-sectional view of the structure of the present invention in the glue-filling state; Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B; Figure 7 This is a schematic diagram of the three-dimensional structure of the adjustment component of the present invention; Figure 8 This is a schematic diagram of the three-dimensional structure of the lower mold and upper pressure mold of the present invention; In the diagram: 1. Workbench; 2. Bonding table; 3. Hot end of silicon carbide rod; 4. Cold end of silicon carbide rod; 5. First placement groove; 6. Second placement groove; 7. Connecting groove; 8. Glue injection mechanism; 81. Lower mold; 82. Upper mold; 83. First arc groove; 84. Second arc groove; 85. Sealing groove; 86. Sealing boss; 87. Lower pressure plate; 88. Glue injector; 89. Glue nozzle; 810. First clamping assembly; 8101. Clamping plate; 81 02. Limiting plate; 8103. Pressing groove; 8104. Limiting rod; 8105. Flexible buffer pad; 8106. Buffer spring; 8107. Spring seat; 811. Second pressing assembly; 9. Drive assembly; 91. Base plate; 92. Top plate; 93. Slide rod; 94. Cylinder; 95. Drive plate; 10. Adjustment assembly; 101. Fixing plate; 102. Push-pull rod; 103. Push plug; 104. Push-pull plate; 105. Adjusting bolt. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1 Please see Figure 1-8 This embodiment provides the following technical solution: a bonding device for processing silicon carbide rods, including a workbench 1, with a bonding table 2 fixedly connected to the top of the workbench 1 by bolts. The bonding table 2 is made of wear-resistant cast iron and its surface is hardened. The upper surface of the bonding table 2 is provided with a first placement groove 5 for placing the hot end 3 of the silicon carbide rod. The cross-section of the first placement groove 5 is semi-circular, and its inner diameter is adapted to the outer diameter of the hot end 3 of the silicon carbide rod, which facilitates the placement of the hot end 3 of the silicon carbide rod and enables preliminary positioning.

[0022] The first placement groove 5 has symmetrical second placement grooves 6 on both sides along its axial direction for placing the cold end 4 of the silicon carbide rod. The cross-section of the second placement groove 6 is also semi-circular, and the inner diameter is adapted to the outer diameter of the cold end 4 of the silicon carbide rod. The second placement groove 6 and the first placement groove 5 are connected by a connecting groove 7, and the axis of the connecting groove 7 is coplanar with the axes of the first placement groove 5 and the second placement groove 6, ensuring accurate docking of the hot end 3 and the cold end of the silicon carbide rod. Through the cooperation of the first placement groove 5, the second placement groove 6 and the connecting groove 7, the hot end and the two cold ends are coaxially positioned, ensuring the straightness after bonding.

[0023] A glue injection mechanism 8 is provided directly above the connecting groove 7. The glue injection mechanism 8 includes a lower mold 81 and an upper mold 82 that are symmetrically distributed vertically. The lower mold 81 is fixedly embedded inside the connecting groove 7, and the upper surface of the lower mold 81 is flush with the upper surface of the bonding platform 2 to avoid steps that would cause the silicon carbide rod to be placed unevenly. The upper mold 82 and the lower mold 81 each have a first arc-shaped groove 83 extending axially along the first placement groove 5 on their opposite end faces. The inner diameter of the first arc-shaped groove 83 is adapted to the outer diameter of the hot end 3 of the silicon carbide rod. The upper mold 82 and the lower mold 81 each have a second arc-shaped groove 84 extending axially along the second placement groove 6 on the same side wall. The inner diameter of the second arc-shaped groove 84 is adapted to the outer diameter of the cold end 4 of the silicon carbide rod. The first arc-shaped groove 83 and the second arc-shaped groove 84 are connected to form a complete positioning channel for the silicon carbide rod, ensuring that the connection between the hot end 3 and the cold end of the silicon carbide rod is accurately aligned with the injection position. After the lower mold 81 and the upper mold 82 are closed, the first arc-shaped groove 83 and the second arc-shaped groove 84 respectively wrap around the joint of the hot end and the cold end and the end of the cold end, forming a closed injection cavity to prevent the glue from overflowing and guide the glue to fill the joint evenly.

[0024] The bonding table 2 is also equipped with a pressing assembly, which includes a horizontally arranged pressing plate 87. The upper surface of the pressing plate 87 is fixedly connected to a glue injector 88 by bolts. The glue injector 88 is a pneumatic glue injector 88, model AB-50, which can realize quantitative and uniform glue injection. The glue outlet of the glue injector 88 is connected to the glue inlet of the glue nozzle 89 through a glue injection tube. The inner diameter is adapted to the inner diameter of the glue nozzle 89, and a glue control valve is connected in series on the glue injection tube. The glue control valve is a ball valve, model Q11F-16C, which is used to control the glue injection volume and injection speed. The operator can adjust it according to the specifications of the silicon carbide rod.

[0025] like Figure 2 , Figure 4 and Figure 5 As shown, a drive assembly 9 is provided on the workbench 1. The drive assembly 9 includes a base plate 91 and a top plate 92 arranged parallel to each other. The base plate 91 is fixedly connected to the workbench 1. The two ends of the base plate 91 and the top plate 92 are fixedly connected by vertical slide rods 93. A cylinder 94 is fixedly connected above the top plate 92. The piston end of the cylinder 94 passes through the top plate 92 and is fixedly connected to a drive plate 95. The drive plate 95 is slidably connected to the slide rod 93. One end of the drive plate 95 is fixedly connected to the lower pressure plate 87. When the cylinder 94 is activated, the drive plate 95 drives the lower pressure plate 87 to move up and down along the slide rod 93.

[0026] The hot end is placed into the first placement groove 5, and the left and right cold ends are placed into the second placement grooves 6 respectively. The hot end face and the cold end face are aligned at the connecting groove 7. This can be finely adjusted by adjusting component 10. Then, the upper mold 82 is pressed down and closed with the lower mold 81. The glue injector 88 is started, and the adhesive enters the first arc groove 83 of the upper mold 82 through the glue injection nozzle 89. Since the first arc groove 83 is connected to the joint area, the glue fills the joint between the hot end and the cold end under the action of gravity or pressure, thereby filling the closed glue injection cavity. After the glue injection is completed, the upper mold 82 is lifted after the glue has cured, and the bonded silicon carbide rod is taken out.

[0027] Example 2 like Figure 8 As shown in the embodiment, a sealing groove 85 is provided on the upper surface of the lower mold 81 outside the first arc groove 83. The cross-section of the sealing groove 85 is rectangular. A sealing boss 86 that matches the sealing groove 85 is fixedly connected to the lower surface of the upper mold 82. The sealing boss 86 is movably inserted into the interior of the sealing groove 85, and the outer wall of the sealing boss 86 is tightly fitted with the inner wall of the sealing groove 85. This effectively prevents the adhesive from overflowing from the gaps during the glue injection process, ensuring that all the adhesive acts on the connection between the hot end 3 and the cold end of the silicon carbide rod, thus improving the bonding quality. Example 3 like Figure 2-6 As shown, the lower pressure plate 87 is provided with a first pressing component 810 for pressing the hot end 3 of the silicon carbide rod, and a second pressing component 811 for pressing the cold end 4 of the silicon carbide rod is provided on both sides of the first pressing component 810. The structure of the second pressing component 811 is completely consistent with that of the first pressing component 810, ensuring that both the hot end 3 and the cold end of the silicon carbide rod can be stably pressed and avoiding displacement during the bonding process.

[0028] The first pressing assembly 810 includes a pressing plate 8101 and a limiting plate 8102 arranged parallel to each other. The pressing plate 8101 is located below the lower pressing plate 87, and a pressing groove 8103 is provided on the lower surface of the pressing plate 8101. The inner diameter of the pressing groove 8103 on the first pressing assembly 810 matches the outer diameter of the hot end 3 of the silicon carbide rod, and the inner diameter of the pressing groove 8103 on the second pressing assembly 811 matches the outer diameter of the cold end 4 of the silicon carbide rod. The limiting plate 8102 is located above the lower pressing plate 87. Both ends of the 2 and the pressure plate 8101 are fixedly connected by vertically arranged limiting rods 8104. The limiting rods 8104 slide through the lower pressure plate 87. An elastic element is also fixedly connected between the limiting plate 8102 and the lower pressure plate 87. By setting the pressure plate 8101 and the elastic element, the pressure plate 8101 can be made to contact the outer surface of the hot end 3 and the cold end 4 of the silicon carbide rod first during the downward movement of the lower pressure plate 87, until the upper mold 82 can be pressed against the upper surface of the lower mold 81.

[0029] The elastic element includes a buffer spring 8106, with spring seats 8107 fixedly connected to both ends of the buffer spring 8106. One spring seat 8107 is fixedly connected to the upper surface of the lower pressure plate 87 by bolts, and the other spring seat 8107 is fixedly connected to the lower surface of the limiting plate 8102 by bolts. The elastic coefficient of the buffer spring 8106 is 20-30 N / mm, and the compression amount is adjustable to 2-3 mm. It can provide a clamping force of about 40-90 N. In actual use, the clamping force range is 50-100 N, while avoiding damage to the silicon carbide rod due to excessive clamping force.

[0030] In some embodiments, the parameters of the buffer spring 22 of the first clamping component and the second clamping component are different. Specifically, the elastic coefficient of the buffer spring 8106 of the first clamping component (used to clamp the hot end of the silicon carbide rod) is 20-25 N / mm, and the elastic coefficient of the buffer spring 8106 of the second clamping component (used to clamp the cold end of the silicon carbide rod) is 25-30 N / mm. The initial compression of both is adjusted to 2-3 mm to ensure that the clamping amount of the hot end and the cold end is uniformly 0.1-0.2 mm, ensuring that the clamping force is matched (the clamping force of the hot end is controlled at 50-80 N, and the clamping force of the cold end is controlled at 80-100 N). This avoids damage to the silicon carbide rod due to excessive clamping force, and also ensures that the silicon carbide rod is tightly fitted with the first placement groove 5, the second placement groove 6, the first arc groove 83 and the second arc groove 84, ensuring the stability of the bonding process.

[0031] A flexible buffer pad 8105 is fixed to the inner wall of the pressing groove 8103. The flexible buffer pad 8105 is made of high temperature resistant silicone material, and the surface of the flexible buffer pad 8105 is provided with anti-slip texture. This can not only avoid damage to the surface of the silicon carbide rod during the pressing process, but also enhance the friction, improve the pressing stability, and prevent the silicon carbide rod from rotating or shifting during the bonding process.

[0032] Example 4 like Figure 7 As shown, an adjustment assembly 10 is provided at the left end of the bonding table 2. The adjustment assembly 10 includes a fixed plate 101 and a push-pull plate 104 arranged parallel to each other. The fixed plate 101 is fixedly connected to the bonding table 2. A push-pull rod 102 corresponding to the second placement groove 6 is movably passed through the fixed plate 101. A push plug 103 is fixedly connected to the right end of the push-pull rod 102. The push-pull plate 104 is fixedly connected to the left ends of the two push-pull rods 102. An adjustment bolt 105 is threadedly connected to the push-pull plate 104. One end of the adjustment bolt 105 is rotatably connected to the fixed plate 101.

[0033] In some embodiments, the pusher 103 is made of rubber with a Shore A hardness of 50-60 to avoid damaging the cold end 4 of the silicon carbide rod.

[0034] The operator rotates the adjusting bolt 105. Since the adjusting bolt 105 is threadedly connected to the push-pull plate 104 and the push-pull rod 102 is movably connected to the fixed plate 101, the push-pull plate 104 will drive the push-pull rod 102 to move axially along the second placement groove 6, thereby adjusting the position of the push plug 103 in the second placement groove 6. The position of the push plug 103 is set according to the length of the silicon carbide rod to complete the positioning adjustment.

[0035] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding device for processing silicon carbide rods, characterized in that: Includes a workbench (1), and an adhesive table (2) is fixedly connected above the workbench (1). The upper surface of the adhesive table (2) is provided with a first placement groove (5) for placing the hot end (3) of the silicon carbide rod. The first placement groove (5) is provided with a second placement groove (6) for placing the cold end (4) of the silicon carbide rod on both sides along its axial direction. The second placement groove (6) and the first placement groove (5) are connected by a connecting groove (7). An injection mechanism (8) is provided above the connecting groove (7). The injection mechanism (8) includes a lower mold (81) and an upper mold (82) that are symmetrically distributed vertically. The lower mold (81) is fixedly connected inside the connecting groove (7). The upper mold (82) and the lower mold (81) are both provided with a first arc-shaped groove (83) extending axially along the first placement groove (5) on the opposite side. The upper mold (82) and the lower mold (81) are both provided with a second arc-shaped groove (84) extending axially along the second placement groove (6) on the sidewall of the same end. An injection nozzle (89) is fixedly connected to the upper mold (82), and the injection port of the injection nozzle (89) is connected to the first arc groove (83) on the upper mold (82).

2. The bonding device for processing silicon carbide rods according to claim 1, characterized in that: A sealing groove (85) is also provided on the lower mold (81) outside the first arc groove (83). A sealing boss (86) fixedly connected to the upper mold (82) is movably inserted in the sealing groove (85). The outer wall of the sealing boss (86) is tightly fitted with the inner wall of the sealing groove (85).

3. The bonding device for processing silicon carbide rods according to claim 1, characterized in that: The bonding table (2) is also provided with a pressing component, which includes a pressing plate (87). A glue injector (88) corresponding to the glue injection nozzle (89) is fixedly connected to the pressing plate (87). The glue outlet of the glue injector (88) and the glue inlet of the glue injection nozzle (89) are connected through a glue injection tube. A glue control valve is provided on the glue injection tube.

4. The bonding device for silicon carbide rod processing according to claim 3, characterized in that: The lower pressure plate (87) is provided with a first pressing component (810) for pressing the hot end (3) of the silicon carbide rod. The first pressing component (810) is provided with a second pressing component (811) for pressing the cold end (4) of the silicon carbide rod on both sides. The second pressing component (811) and the first pressing component (810) have the same structure.

5. The bonding device for silicon carbide rod processing according to claim 4, characterized in that: The first pressing assembly (810) includes a pressing plate (8101) and a limiting plate (8102) arranged parallel to each other. The pressing plate (8101) is located below the lower pressing plate (87), and a pressing groove (8103) is provided on the lower surface of the pressing plate (8101). The limiting plate (8102) is located above the lower pressing plate (87). The two ends of the limiting plate (8102) and the pressing plate (8101) are fixedly connected by limiting rods (8104). The limiting rods (8104) slide through the lower pressing plate (87). An elastic element is also fixedly connected between the limiting plate (8102) and the lower pressing plate (87).

6. The bonding device for silicon carbide rod processing according to claim 5, characterized in that: The elastic element includes a buffer spring (8106), and both ends of the buffer spring (8106) are fixedly connected to spring seats (8107). One of the spring seats (8107) is fixedly connected to the lower pressure plate (87), and the other spring seat (8107) is fixedly connected to the limiting plate (8102).

7. The bonding device for processing silicon carbide rods according to claim 5, characterized in that: The inner wall of the pressing groove (8103) is fixed with a flexible buffer pad (8105), which is made of high temperature resistant silicone material and has anti-slip texture on its surface.

8. The bonding device for silicon carbide rod processing according to claim 1, characterized in that: The workbench (1) is provided with a drive assembly (9), which includes a base plate (91) and a top plate (92) arranged parallel to each other. The base plate (91) is fixedly connected to the workbench (1). The two ends of the base plate (91) and the top plate (92) are fixedly connected by a slide rod (93). A cylinder (94) is fixedly connected above the top plate (92). The piston end of the cylinder (94) passes through the top plate (92) and is fixedly connected to a drive plate (95). The drive plate (95) is slidably connected to the slide rod (93). One end of the drive plate (95) is fixedly connected to the lower pressure plate (87).

9. The bonding device for processing silicon carbide rods according to claim 1, characterized in that: One end of the bonding table (2) is provided with an adjustment component (10). The adjustment component (10) includes a fixed plate (101) and a push-pull plate (104) arranged parallel to each other. The fixed plate (101) is fixedly connected to the bonding table (2). A push-pull rod (102) corresponding to the second placement groove (6) is movably passed through the fixed plate (101). A push plug (103) is fixedly connected to the other end of the push-pull rod (102). The push-pull plate (104) is fixedly connected to the other ends of the two push-pull rods (102). An adjustment bolt (105) is threadedly connected to the push-pull plate (104). One end of the adjustment bolt (105) is rotatably connected to the fixed plate (101).

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