Pulse sequence energy monitoring method and device, electronic equipment, processing system and storage medium

By monitoring the electrical signal of the transmitted light pulse from the reflector, a correspondence between the electrical signal and the energy of the pulse sequence is established, and the laser output power is adjusted in real time. This solves the problem that laser energy monitoring in existing technologies cannot meet the high-precision processing requirements of highly brittle materials, and enables high-quality and efficient processing of glass substrates.

CN121945969APending Publication Date: 2026-05-01SHENZHEN DAZU MICROELECTRONICS TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN DAZU MICROELECTRONICS TECHNOLOGY CO LTD
Filing Date
2025-12-19
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In the existing technology, laser energy monitoring methods cannot accurately respond to pulsed lasers with a predetermined temporal energy distribution, making it difficult to meet the high-precision processing requirements of brittle materials such as glass substrates. In particular, in the processing of glass through holes, the fluctuation of pulse energy leads to heat accumulation and stress changes, which seriously affect the processing quality.

Method used

By acquiring the electrical signal of the transmitted light pulse from the reflector, a correspondence between the electrical signal and the pulse sequence energy is established. The pulse sequence energy of the reflected pulsed laser beam is monitored in real time using a photodetector, and the laser output power is adjusted to ensure that the pulse sequence energy is within a reasonable range.

Benefits of technology

It enables precise processing of glass substrates, improves processing quality and efficiency, ensures the mechanical strength and electrical reliability of glass substrates, and avoids processing defects and equipment downtime caused by unsuitable pulse sequence energy.

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Abstract

The invention provides a pulse sequence energy monitoring method and device, electronic equipment, a processing system and a storage medium, and the method comprises the steps: obtaining a first electric signal of a transmission light pulse which penetrates through a reflector when a pulse laser beam enters the reflector, when the pulse laser beam enters the reflector, a reflected pulse laser beam enters the laser processing head, and the laser processing head processes a glass substrate based on the reflected pulse laser beam; and the pulse sequence energy of the reflected pulse laser beam is monitored based on the first electric signal, so that the pulse sequence energy of the reflected pulse laser beam can be accurately monitored in real time, and the processing quality of the glass substrate can be improved.
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Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and in particular relates to a method, device, electronic equipment, processing system and storage medium for monitoring pulse sequence energy. Background Technology

[0002] Precise control and stable output of laser pulse energy are crucial for ensuring processing quality, especially in the laser processing of highly brittle materials. Taking glass substrates as an example, in the high-precision processing of through-glass vias (TGV), the unique physical and chemical properties of glass substrates impose extremely stringent requirements on the laser processing technology. Unexpected heat accumulation and stress changes caused by pulse energy fluctuations can severely damage the mechanical strength and electrical reliability of the glass substrate. Current laser energy monitoring methods mostly focus on direct measurement at the laser output, typically measuring the average value of the laser over a short period. Power meters themselves have long response times and cannot accurately reflect the true energy of pulsed lasers with a predetermined temporal energy distribution, making it difficult to meet the high-precision processing requirements of highly brittle materials. Summary of the Invention

[0003] In view of this, embodiments of this application provide a method, apparatus, electronic device, processing system, and storage medium for monitoring pulse sequence energy, which can achieve accurate monitoring of pulse sequence energy, thereby improving the processing quality of glass substrates.

[0004] In a first aspect, embodiments of this application provide a method for monitoring the energy of a pulse sequence, used to monitor pulsed lasers with tunable time-domain energy distribution, including: A first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector is obtained, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam; The pulse sequence energy of the reflected pulsed laser beam is monitored based on the first electrical signal.

[0005] In some embodiments, monitoring the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal includes: Obtain a pre-established reference table; wherein the reference table includes: the correspondence between electrical signals and pulse sequence energies; Match the first electrical signal with the electrical signals in the reference table; The pulse sequence energy of the reflected pulsed laser beam is determined by the pulse sequence energy corresponding to the electrical signal that matches the first electrical signal.

[0006] In some embodiments, monitoring the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal includes: Obtain a pre-established reference table, wherein the reference table includes the correspondence between standard electrical signals and pulse sequence energies, and wherein the pulse sequence energy corresponding to the standard electrical signal satisfies the processing requirements for the glass substrate. The first electrical signal is matched with the standard electrical signal in the reference table; When the first electrical signal matches the standard electrical signal, it is determined that the pulse sequence energy of the reflected pulse laser beam meets the processing requirements; If the first electrical signal does not match the standard electrical signal, it is determined that the pulse sequence energy of the reflected pulse laser beam does not meet the processing requirements.

[0007] In some embodiments, the method further includes: When the first electrical signal is less than the minimum standard electrical signal in the standard electrical signals, increase the output power of the laser in the laser processing equipment; If the first electrical signal is greater than the maximum standard electrical signal among the standard electrical signals, reduce the output power of the laser of the laser processing equipment.

[0008] In some embodiments, the method further includes: Different test pulse laser beams are incident on the reflector, wherein a second reflected pulse laser beam when the test pulse laser beam is incident on the reflector is incident on the laser processing head; The second electrical signal of the transmitted light pulse that passes through the reflector when the test pulse laser beam is incident on the reflector is obtained, and the pulse sequence energy of the laser processing head outlet is obtained; Establish the correspondence between the second electrical signal and the corresponding pulse sequence energy to obtain the reference table.

[0009] In some embodiments, obtaining the pulse sequence energy at the laser processing head exit point includes: Obtain the actual optical power at the laser processing head's output outlet; The pulse sequence energy at the laser processing head exit point is calculated based on the repetition frequency of the test pulsed laser beam and the actual optical power.

[0010] In some embodiments, an electrical signal is acquired based on a photodetector, and / or the actual optical power is acquired based on a platform power meter, and / or the reflected pulsed laser beam from the reflector is directly incident on the laser processing head.

[0011] In some embodiments, the pulse sequence energy output mode of the time-domain energy distribution tunable pulsed laser includes a single pulse mode or a burst pulse train mode.

[0012] Secondly, embodiments of this application provide a pulse sequence energy monitoring device for monitoring pulsed lasers with a predetermined temporal energy distribution, comprising: The acquisition module is used to acquire the first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam; The monitoring module is used to monitor the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal.

[0013] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in any of the above-mentioned embodiments.

[0014] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the preceding claims.

[0015] Fifthly, embodiments of this application provide a processing system, including: a laser processing device, the electronic device described in the third aspect, and a photodetector. The laser processing device includes: a reflector, a laser generator, and a laser processing head. The reflector is used to reflect a pulsed laser beam generated by the laser generator to the laser processing head. The photodetector is used to detect the electrical signal of the pulsed laser beam transmitted through the reflector. The electronic device is communicatively connected to the photodetector and the laser processing device.

[0016] In some embodiments, the pulsed laser beam reflected by the reflector is directly incident on the laser processing head.

[0017] Sixthly, embodiments of this application provide a computer program product that, when run on a terminal device, causes the electronic device to execute any of the methods described above.

[0018] The beneficial effects of the embodiments in this application compared with the prior art are: This application provides a monitoring method that acquires a first electrical signal of the transmitted light pulse through a reflector when a pulsed laser beam is incident on it. The reflected pulsed laser beam is then incident on a laser processing head, which processes a glass substrate based on the reflected pulsed laser beam. By monitoring the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal, the method enables real-time and precise monitoring of the pulse sequence energy, thereby improving the processing quality of the glass substrate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram illustrating the implementation process of a pulse sequence energy monitoring method provided for the purposes of this application; Figure 2 A schematic flowchart for establishing a benchmark table is provided for an embodiment of this application; Figure 3 A schematic diagram illustrating the implementation process of a pulse sequence energy monitoring method provided in this application embodiment; Figure 4 A schematic diagram of the structure of a pulse sequence energy monitoring device provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 6 This is a schematic diagram of a processing system provided in an embodiment of this application. Detailed Implementation

[0021] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0022] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0023] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once detected," or "in response to detection."

[0025] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0027] Before introducing the embodiments of this application, a brief introduction to related technologies will be given: Through-Glass Via (TGV) technology requires the use of ultrafast laser pulses to create single holes. It demands both an extremely small focused spot size and a very large depth of focus, making conventional focusing modes using galvanometers and field lenses insufficient. This is primarily due to the unique physical mechanism of ultrafast laser-material interaction and the extremely high quality requirements of TGV for the holes. TGV necessitates "cold processing" while avoiding thermal damage. An ultrafast laser pulse or high-density pulse train (e.g., picoseconds or femtoseconds) with a predetermined temporal energy distribution is injected into the glass material over an extremely small area within a very short time. Before the laser energy has a chance to diffuse outwards through thermal conduction, it causes the material to vaporize, sublimate, or become plasma through a nonlinear absorption process and is instantly removed. If multiple low-energy pulses with long time intervals are used, the delay between pulses is sufficient for heat to accumulate and diffuse into the material surrounding the hole, leading to glass melting, resolidification, microcracks, and stress. This is fatal for brittle and insulating glass, severely compromising the mechanical strength and electrical reliability of the substrate. The morphology of the hole is determined by the focused spot shape and energy density of the laser beam, allowing for highly regular and consistent results. However, if multiple low-energy pulses are used to drill a single hole, the first pulse will create a shallow pit, and the energy of subsequent pulses will be reflected and absorbed multiple times within this pit, leading to uncontrollable processing. This easily results in flared holes (large inlet), tapered holes (inconsistent dimensions), and irregular hole walls. This is extremely detrimental to subsequent metallization filling. Therefore, the TGV (Transient Light Vapor Transformer) requires the use of a Bezier head focusing mode to generate a long depth of focus, diffraction-free beam. Its spot size remains extremely small over a range of millimeters or even centimeters, unlike a Gaussian beam which has only a sharp focal point and a very short depth of focus. This allows for the drilling of a single hole using a single ultrafast laser pulse or a single high-density ultrafast laser pulse train.

[0028] Most laser energy monitoring methods in related technologies focus on direct measurement at the laser output end. By setting up an energy detection device inside the laser or in the output optical path, the energy information of the laser can be obtained in real time. However, the laser energy monitoring methods in related technologies usually measure the average value of the laser over a period of time, and the power meter itself has a long response time, which cannot accurately respond to the true energy of a single pulse or pulse train, making it difficult to meet the high-precision processing requirements of glass substrates.

[0029] Based on the problems in related technologies, this application provides a method for monitoring pulse sequence energy that can be applied to electronic devices. These electronic devices may include: mobile phones, tablets, wearable devices, augmented reality (AR) / virtual reality (VR) devices, laptops, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), etc. The electronic devices can serve as controllers for processing systems. This application does not impose any limitations on the specific type of electronic device. Figure 1 A schematic diagram illustrating the implementation process of a pulse sequence energy monitoring method provided for the purposes of this application is shown below. Figure 1 As shown, the monitoring methods include: Step S101: Obtain the first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam.

[0030] In this embodiment, a pulsed laser beam refers to a laser emitted in pulses, whose energy is discontinuous in time, outputting as individual pulses or pulse trains (clusters). Each pulse or pulse train has specific energy, pulse width (pulse duration), and repetition frequency (number of pulses per unit time). A pulsed laser with a predetermined temporal energy distribution refers to a pulse sequence whose temporal energy distribution can be adjusted to the optimal level according to the processing requirements, i.e., a specific total energy, number of pulses, pulse interval, pulse width, and repetition frequency in a time domain. For example, in glass substrate processing, a pulsed laser beam can be a single-pulse laser beam, a burst pulse group laser beam, etc. Furthermore, commonly used pulsed lasers include ultraviolet pulsed lasers, near-infrared pulsed lasers, and green pulsed lasers. Different wavelengths of pulsed lasers have different absorption characteristics for glass and are suitable for different processing techniques. A reflector is used to reflect the pulsed laser beam, causing a portion of the light (the reflected pulsed laser beam) to be directed towards the laser processing head, while allowing another portion of the light to pass through, used to obtain the first electrical signal of the transmitted light pulse. A reflected pulsed laser beam is the portion of a pulsed laser beam that is reflected by a reflector after being incident on it; this portion carries the energy used to process the glass substrate. The laser processing head is a key component of a laser processing system. It receives the reflected pulsed laser beam and focuses it onto the glass substrate to perform cutting, drilling, and other processing operations. The laser processing head typically contains optical elements such as focusing lenses, enabling precise focusing and adjustment of the pulsed laser beam to meet various processing requirements. A typical laser processing head can be a Bezier head. The glass substrate is the object being processed and is widely used in electronics, optics, and other fields. During laser processing, the glass substrate needs to be precisely cut and drilled to meet product design and performance requirements. The first electrical signal of the transmitted light pulse occurs when the transmitted light pulse, passing through the reflector, strikes a photodetector. The photodetector converts the optical signal into an electrical signal, which can be a voltage signal. It is understandable that using a reflector has the following advantages: the transmitted light obtained through a reflector, especially the transmitted light obtained through a high-reflectivity mirror, such as the transmitted light of an all-dielectric high-reflectivity mirror which is typically 0.1%-1%, can avoid the power loss caused by splitting the light at a higher ratio, so as not to affect the peak power of the reflected pulse laser beam when processing the glass substrate.

[0031] In this embodiment, a pulsed laser beam can be incident on a reflector in a predetermined direction. The installation position and angle of the reflector need to be precisely adjusted to ensure that the reflected pulsed laser beam can accurately incident on the laser processing head, while sufficient light can pass through for monitoring. A photodetector is placed in the transmission optical path of the reflector. When the transmitted light pulse passing through the reflector illuminates the photodetector, the photodetector generates a corresponding electrical signal. It is understood that the photodetector can sensitively capture the weak light signal of the transmitted light pulse obtained through the reflector, and its microsecond to picosecond response speed allows for real-time electrical signal feedback. The photodetector can be specifically selected according to the laser type and measurement requirements, such as a silicon photodiode, indium gallium arsenide photodiode, avalanche photodiode, or photomultiplier tube. It is understood that the device for acquiring the electrical signal is not limited to a photodetector; the first electrical signal can also be acquired through electrical signal detection devices such as a pyroelectric detector.

[0032] Step S102: Monitor the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal.

[0033] In this embodiment, pulse sequence energy refers to the energy carried by each pulsed laser beam, typically measured in joules (J). When the output mode of the pulsed laser beam is a single pulse, the pulse sequence energy is the single pulse energy; when the output mode of the pulsed laser beam is a multi-pulse sequence, the pulse sequence energy is the sum of the energies of multiple pulses within a complete sequence; when the output mode of the pulsed laser beam is a burst, the pulse sequence energy refers to the sum of the energies of all sub-pulses within a complete burst. Pulse sequence energy is one of the important parameters for measuring the processing capability of pulsed lasers, directly affecting the processing depth, width, and quality. In glass substrate drilling, if the pulse sequence energy is too low, it may be impossible to drill a hole in the glass; while if the pulse sequence energy is too high, it may lead to uneven edges of the hole or even breakage of the glass. Therefore, it is necessary to monitor the pulse sequence energy.

[0034] In this embodiment of the application, since the transmitted light pulse through the reflector and the reflected pulse laser beam are optically connected, the first electrical signal can characterize the pulse sequence energy of the reflected pulse laser beam. Therefore, the pulse sequence energy of the reflected pulse laser beam can be monitored by the first electrical signal.

[0035] In this embodiment, the correspondence between the electrical signal and the pulse sequence energy of the reflected pulsed laser beam can be established in advance through experiments. Test pulsed laser beams of different energies can be incident on a reflector, and the electrical signal of the transmitted light pulses through the reflector can be measured. Simultaneously, the pulse sequence energy at the laser processing head's exit point can be measured. A mathematical model or benchmark table of the electrical signal and pulse sequence energy can be obtained through methods such as data fitting. During actual processing, the acquired first electrical signal is compared with the pre-established benchmark table or mathematical model. If a mathematical model is used, the first electrical signal is substituted into the model to calculate the corresponding pulse sequence energy; if a benchmark table is used, the pulse sequence energy corresponding to the electrical signal that best matches the first electrical signal is found in the benchmark table.

[0036] In this embodiment, the calculated or retrieved pulse sequence energy is used to determine whether it is within a preset reasonable range. If the pulse sequence energy exceeds the range, the pulse sequence energy can be restored to a reasonable level by adjusting parameters such as the laser's output power and pulse repetition frequency to ensure processing quality.

[0037] The method provided in this application acquires a first electrical signal of the transmitted light pulses through a reflector when a pulsed laser beam is incident on it. The reflected pulsed laser beam is then incident on a laser processing head, which processes a glass substrate based on the reflected pulsed laser beam. By monitoring the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal, real-time and precise monitoring of the pulse sequence energy can be achieved, thereby improving the processing quality of the glass substrate. Monitoring the pulse sequence energy of the reflected pulsed laser beam by acquiring the first electrical signal of the transmitted light pulses through the reflector provides a more direct and accurate reflection of the actual laser energy involved in the processing. Because the pulse sequence energy can be precisely controlled, more precise processing of the glass substrate can be achieved, improving processing accuracy. For example, when processing microstructures on a glass substrate, the dimensional and shape accuracy of the structure can be guaranteed.

[0038] In some embodiments, step S102 can be implemented by the following steps: Step S1021: Obtain a pre-established reference table; wherein the reference table includes the correspondence between electrical signals and pulse sequence energy.

[0039] In this embodiment of the application, the reference table is a table established in advance through experiments that contains the correspondence between electrical signals and pulse sequence energies, which provides a basis for determining the pulse sequence energy based on the first electrical signal.

[0040] In this embodiment, an adjustable-output pulsed laser, a reflector, a photodetector, a laser processing head, and an energy measurement device (such as an energy meter) can be prepared. Ensure that all devices are correctly installed and connected, and that the optical path is accurate. Set the pulsed laser to different output energies and sequentially emit pulsed laser beams. Each time a beam is emitted, record the electrical signal (such as voltage or current value) after the transmitted light pulse through the reflector is converted and processed by the photodetector. Simultaneously, use the energy meter to measure the pulse sequence energy at the laser processing head's exit point. Organize the collected electrical signals and corresponding pulse sequence energy data into a tabular form, forming a reference table.

[0041] Step S1022: Match the first electrical signal with the electrical signal in the reference table.

[0042] In this embodiment, the first electrical signal can be matched with the electrical signals in the reference table using nearest neighbor matching algorithms, interpolation algorithms, etc. For example, the nearest neighbor matching algorithm can be used to find the electrical signal in the reference table that is closest to the first electrical signal.

[0043] Step S1023: Determine the pulse sequence energy of the reflected pulsed laser beam by the pulse sequence energy corresponding to the electrical signal that matches the first electrical signal.

[0044] In this embodiment, the pulse sequence energy corresponding to the electrical signal that matches the first electrical signal can be found in the reference table based on the matching result. The found pulse sequence energy is used as the pulse sequence energy output of the reflected pulsed laser beam, which can be used for real-time monitoring and display, and can also be used for subsequent processing parameter adjustment.

[0045] The method provided in this application determines the pulse sequence energy by pre-establishing a precise reference table and matching the actual acquired first electrical signal with the electrical signals in the reference table, thus avoiding potential errors associated with direct measurement of pulse sequence energy. Direct measurement can be affected by factors such as the accuracy of the measuring equipment and environmental conditions, while the reference table is established under relatively stable experimental conditions, resulting in higher data reliability. In actual processing, only the first electrical signal needs to be quickly acquired, and the corresponding pulse sequence energy can be found in the reference table using a simple matching algorithm; the entire process can be completed in a short time. Compared to some complex real-time measurement methods, this method does not require complex calculations and analysis, and can acquire pulse sequence energy information in a timely manner, enabling real-time monitoring of the processing process. Because it can accurately and in real-time acquire the pulse sequence energy of the reflected pulsed laser beam, operators can adjust the laser's output parameters (such as power and pulse repetition frequency) according to the monitoring results to ensure that the pulse sequence energy remains within a suitable range.

[0046] In some embodiments, step S102 can be implemented by the following steps: Step S1024: Obtain a pre-established reference table, wherein the reference table includes the correspondence between standard electrical signals and pulse sequence energies, and the pulse sequence energy corresponding to the standard electrical signals meets the processing requirements for the processing effect on the glass substrate.

[0047] In this embodiment, the reference table is a table established in advance through experiments, containing the correspondence between standard electrical signals and pulse sequence energies. The pulse sequence energy corresponding to the standard electrical signal ensures that the processing effect on the glass substrate meets the processing requirements, providing a reference standard for judging whether the pulse sequence energy of the reflected pulsed laser beam is qualified in actual processing. The standard electrical signals are the electrical signals recorded in the reference table. These electrical signals correspond to the pulse sequence energy that enables the glass substrate to meet the processing requirements, and are determined based on a large number of experiments. They serve as a reference for judging whether the actual first electrical signal is qualified. Here, meeting the processing requirements means that the diameter, depth, edge quality, and other indicators of the drilled hole meet the design requirements.

[0048] In this embodiment, an adjustable-output pulsed laser, a reflector, a photodetector, a laser processing head, and testing equipment (such as a microscope or profilometer) for evaluating the processing effect of the glass substrate can be prepared, ensuring that all equipment is correctly installed and connected, and that the optical path is accurate. The pulsed laser is set to different output energies and pulsed laser beams are emitted sequentially. Each time a beam is emitted, the electrical signal (such as voltage or current value) after the transmitted light pulse through the reflector is converted and processed by the photodetector is recorded as a standard electrical signal. Simultaneously, the glass substrate is processed using the laser processing head, and the processing effect is evaluated using the testing equipment. Samples with processing effects meeting the requirements are selected, and their corresponding standard electrical signals and the pulse sequence energy at the laser processing head's exit point are recorded. The collected sets of standard electrical signals and corresponding pulse sequence energy data are organized into a tabular form to form a benchmark table.

[0049] Step S1025: Match the first electrical signal with the standard electrical signal in the reference table.

[0050] In this embodiment, the first electrical signal can be matched with the standard electrical signals in the reference table using nearest neighbor matching algorithms, range matching algorithms, etc. For example, the nearest neighbor matching algorithm finds the standard electrical signal in the reference table that is closest to the first electrical signal; the range matching algorithm determines whether the first electrical signal falls within a preset range of a certain standard electrical signal.

[0051] Step S1026: When the first electrical signal matches the standard electrical signal, determine that the pulse sequence energy of the reflected pulse laser beam meets the processing requirements.

[0052] In this embodiment, the matching algorithm determines whether the first electrical signal matches a standard electrical signal. If the match is successful, it means that the first electrical signal is similar to or the same as a standard electrical signal that meets the processing requirements. Since the pulse sequence energy corresponding to the standard electrical signal meets the processing requirements, it can be determined that the pulse sequence energy of the reflected pulsed laser beam also meets the processing requirements.

[0053] Step S1027: If the first electrical signal does not match the standard electrical signal, it is determined that the pulse sequence energy of the reflected pulse laser beam does not meet the processing requirements.

[0054] In this embodiment of the application, if the matching algorithm determines that the first electrical signal does not match any standard electrical signal in the reference table, it means that the first electrical signal is significantly different from the standard electrical signal that can make the processing effect meet the requirements. Therefore, it can be inferred that the pulse sequence energy of the reflected pulse laser beam does not meet the processing requirements.

[0055] The method provided in this application establishes a reference table containing the correspondence between standard electrical signals and pulse sequence energies that meet processing requirements. During actual processing, the first electrical signal is matched with the standard electrical signal. If the match is successful, it means that the pulse sequence energy of the current reflected pulsed laser beam is within a suitable range, ensuring that the processing effect on the glass substrate meets requirements, such as a smooth cut during cutting and hole diameter and depth meeting design standards during drilling. This effectively avoids processing defects caused by unsuitable pulse sequence energy, ensuring the stability and consistency of product quality. When the first electrical signal does not match the standard electrical signal, it can be immediately determined that the pulse sequence energy does not meet the processing requirements. Operators can take timely measures, such as adjusting laser parameters and checking equipment status, to prevent a large number of defective products from being generated due to continuous unqualified processing, reducing the production of defective products and lowering quality risks. The method provided in this application achieves rapid monitoring and judgment of pulse sequence energy. In actual processing, complex measurements and lengthy analyses are unnecessary; simply matching the first electrical signal with the reference table is sufficient to determine whether the pulse sequence energy meets the requirements in a short time. Once a problem is detected, adjustments can be made quickly, avoiding processing interruptions caused by prolonged uncertain pulse sequence energy states, reducing equipment downtime, and improving overall processing efficiency.

[0056] In some embodiments, after step S102, the method further includes: Step S103: When the first electrical signal is less than the minimum standard electrical signal in the standard electrical signals, increase the output power of the laser of the laser processing equipment.

[0057] In this embodiment, the laser processing equipment is a complete set of devices for processing glass substrates, mainly including a laser, a reflector, a photodetector, a laser processing head, and a control system for controlling parameters such as the laser output power. The laser is the core component for generating pulsed laser light, and its output power directly affects the pulse sequence energy of the reflected pulsed laser beam.

[0058] In this embodiment, if the first electrical signal is less than the minimum standard electrical signal, it indicates that the pulse sequence energy of the current reflected pulsed laser beam may be too low to meet the processing requirements of the glass substrate. In this case, a command can be sent to the laser's control system to request an increase in the laser's output power. Upon receiving the command, the laser's control system increases the laser's output power by adjusting the laser's power supply, the working state of the gain medium, etc., thereby increasing the pulse sequence energy of the reflected pulsed laser beam.

[0059] Step S104: If the first electrical signal is greater than the maximum standard electrical signal among the standard electrical signals, reduce the output power of the laser of the laser processing equipment.

[0060] In this embodiment, if the first electrical signal is greater than the maximum standard electrical signal, it indicates that the pulse sequence energy of the current reflected pulsed laser beam may be too high, potentially causing over-processing of the glass substrate, such as excessively wide kerfs during cutting or excessively large hole diameters during drilling. In this case, a command to reduce the output power can be sent to the laser's control system. The laser's control system, based on the command, reduces the laser's output power in a corresponding manner, bringing the pulse sequence energy of the reflected pulsed laser beam back to a suitable range.

[0061] The method provided in this application increases the laser output power when the first electrical signal is less than the minimum standard electrical signal. This ensures the reflected pulsed laser beam has sufficient pulse sequence energy, allowing the glass substrate to be fully processed and avoiding problems such as incomplete cutting or insufficient drilling depth, thus guaranteeing that the processing effect meets design requirements. When the first electrical signal is greater than the maximum standard electrical signal, the laser output power is reduced to prevent excessive damage to the glass substrate caused by excessive pulse sequence energy, such as excessively wide cuts or uneven edges during cutting, or excessively large hole diameters or rough hole walls during drilling, thereby improving the stability and consistency of processing quality. The method can monitor the first electrical signal in real time and compare it with the standard electrical signal, adjusting the laser output power promptly based on the comparison results, eliminating the need for frequent manual intervention and complex measurement operations. This reduces processing interruptions and rework caused by unsuitable pulse sequence energy, increases the continuous processing time of the equipment, and thus improves overall processing efficiency. By rapidly adjusting the laser output power, the processing parameters are always kept within a suitable range, better adapting to different processing tasks and glass substrate material characteristics, shortening the processing cycle, and increasing the processing output per unit time.

[0062] In some embodiments, prior to step S101, the method further includes: establishing a benchmark table. Figure 2 This application provides a schematic flowchart for establishing a benchmark table, as shown in the embodiments. Figure 2 As shown, the method further includes: Step S1: Different test pulse laser beams are incident on the reflector, wherein the second reflected pulse laser beam when the test pulse laser beam is incident on the reflector is incident on the laser processing head.

[0063] In this embodiment, the test pulsed laser beam is a pulsed laser with specific parameters (such as power, frequency, pulse width, etc.) specifically emitted to establish a reference table. These parameters can be varied within a certain range to cover various situations that may affect the processing effect, thereby comprehensively obtaining the correspondence between the electrical signal of the transmitted light pulse through the reflector and the energy of the pulse sequence at the laser processing head's exit under different conditions.

[0064] In this embodiment, different combinations of parameters for the test pulsed laser beam are determined based on the capabilities of the laser processing equipment and the processing requirements, such as power, frequency, and pulse width. For example, the power can be set to start at 20W and increase to 80W in 10W increments, and the frequency can be set to start at 2kHz and increase to 8kHz in 1kHz increments. Test pulsed laser beams are emitted sequentially according to the set parameter combinations, causing them to strike the reflector. The reflector reflects part of the laser beam to form a second reflected pulsed laser beam, which is then guided to the laser processing head.

[0065] Step S2: Obtain the second electrical signal of the transmitted light pulse that passes through the reflector when the test pulse laser beam is incident on the reflector, and obtain the pulse sequence energy at the laser processing head outlet.

[0066] In this embodiment, while the test pulsed laser beam is incident on the reflector, a photodetector receives the transmitted light pulse through the reflector and converts it into an electrical signal. Then, a signal processing circuit (such as an amplifier or filter) amplifies and filters the electrical signal to obtain a second electrical signal.

[0067] In this embodiment, a measuring device such as an energy meter can be used to measure the pulse sequence energy at the laser processing head's exit point. The energy meter is typically placed near the laser processing head's exit point and can accurately measure the energy of each laser pulse.

[0068] Step S3: Establish the correspondence between the second electrical signal and the corresponding pulse sequence energy to obtain the reference table.

[0069] In this embodiment, the recorded second electrical signal and corresponding pulse sequence energy data are organized to ensure data accuracy and completeness. For example, outlier data points are removed, and the data is sorted. Then, based on the organized data, the variation patterns between the second electrical signal and the pulse sequence energy are analyzed, and a mathematical model or correspondence between them is established. Modeling can be performed using methods such as linear regression or polynomial fitting. The established correspondence is presented in the form of a table or database to obtain a benchmark table. The benchmark table can be stored on a computer's hard drive or in a database for easy retrieval during actual processing.

[0070] The method provided in this application establishes an accurate reference table. During actual processing, the acquired first electrical signal (similar to the second electrical signal, reflecting the characteristics of the transmitted light pulse through the reflector) can be compared with the reference table to accurately determine whether the pulse sequence energy of the reflected pulse laser beam meets the processing requirements. This avoids processing errors caused by inaccurate energy judgment and improves processing accuracy. Different test pulse laser beam parameters are used when establishing the reference table, covering various possible processing conditions. Therefore, the reference table has strong versatility and adaptability, and can accurately determine whether the pulse sequence energy is appropriate under different processing environments (such as different glass materials, different processing requirements, etc.), ensuring the stability of processing quality.

[0071] In some embodiments, step S2 may include the following steps: Step S21: Obtain the actual optical power at the laser processing head's output outlet.

[0072] In this embodiment, the actual optical power at the laser processing head outlet refers to the energy of the laser beam at the laser processing head outlet per unit time, usually expressed in watts (W), which reflects the actual energy intensity of the laser at that location.

[0073] In this embodiment, the detector portion of the power meter is installed near the laser processing head's output port to ensure that the detector can fully receive the emitted laser beam. Care should be taken during installation to avoid obstructing the laser beam, and the detector should be perpendicular to the laser beam to obtain accurate measurement results.

[0074] Step S22: Calculate the pulse sequence energy at the laser processing head exit point based on the repetition frequency of the test pulse laser beam and the actual optical power.

[0075] In this embodiment, the repetition frequency, also known as the pulse repetition rate, refers to the number of laser pulses emitted by the laser per unit time. The unit is usually Hertz (Hz). It indicates the frequency of laser pulse emission. The higher the repetition frequency, the more laser pulses are emitted per unit time.

[0076] In this embodiment, the repetition frequency of the test pulsed laser beam can be obtained through the laser's control panel or related software. Some lasers allow the repetition frequency to be set and displayed directly on the control panel, while others can be obtained by connecting to a computer and using specialized software to read the laser's parameters.

[0077] In this embodiment, the relationship between pulse sequence energy, actual optical power, and repetition frequency is based on the formula... E = P / f Calculations are performed, in which, E Represents the energy of the pulse sequence. P Indicates actual optical power. f This represents the repetition frequency. The actual optical power and repetition frequency can be substituted into the formula to calculate the pulse sequence energy at the laser processing head's exit point.

[0078] The method provided in this application improves the accuracy of pulse sequence energy calculation by directly measuring the actual optical power at the laser processing head's output and obtaining the repetition frequency of the test pulse laser beam, and then calculating the pulse sequence energy. Furthermore, when the pulse sequence energy output mode is a burst mode, the sub-pulse energy can be further calculated: Sub-pulse energy (E_sub) = Pulse sequence energy (E) / Number of sub-pulses (N).

[0079] In some embodiments, electrical signals are acquired based on a photodetector. These electrical signals may include a first electrical signal and a second electrical signal.

[0080] In this embodiment, compared to a power meter, the sensitivity of the photodetector is much higher. Even for a single laser pulse, it can convert the pulse energy into the voltage amplitude and output it stably.

[0081] In some embodiments, the actual optical power is obtained based on a platform power meter.

[0082] In this embodiment, the table power meter is set on the processing table, which can directly and accurately measure the actual laser power emitted by the processing head and applied to the substrate to be processed.

[0083] In some embodiments, the reflected pulsed laser beam from the reflector is directly incident on the laser processing head.

[0084] In this embodiment, the direct incident of the reflected pulsed laser beam onto the laser processing head can simplify the optical path to obtain a compact optical path, effectively reduce transmission loss or delay caused by additional optical components, reduce beam divergence or distortion, and maintain beam quality.

[0085] Based on the foregoing embodiments, this application provides another method for monitoring pulse sequence energy. The idea behind this method is as follows: by placing a photodetector behind any mirror in the optical path (preferably behind the last mirror in front of the processing head), when the pulsed laser passes through the mirror, a very small portion of the transmitted light will pass through the mirror and enter the photodetector. Therefore, the photodetector detects the transmitted light to obtain a voltage signal, and uses the detected voltage signal result to characterize the laser pulse sequence energy during processing.

[0086] Figure 3 A schematic diagram illustrating the implementation flow of a pulse sequence energy monitoring method provided in this application embodiment includes: Step S301: Before laser emission, fix the position of the photodetector in the optical path.

[0087] In step S302, the laser beam emitted by the laser passes through a series of optical components and is finally formed on the processing table. The actual optical power at the exit of the processing head is measured by the table power meter. The actual pulse sequence energy can be calculated by the set laser repetition frequency.

[0088] Step S303: Measure the voltage amplitude of each transmitted light pulse output by the photodetector and establish the correspondence between the energy of different pulse sequences and the voltage amplitude output by the photodetector.

[0089] In this embodiment, the correspondence can be considered as the baseline table in the above embodiments.

[0090] Step S304: During the actual processing, the voltage amplitude of each transmitted light pulse output by the photodetector is monitored in real time to characterize the actual pulse sequence energy of each transmitted light pulse on the processing table.

[0091] In this embodiment, when the voltage amplitude of the transmitted light pulse output by the photodetector shows a significant upward, downward, or fluctuating trend, the laser can be controlled to adjust the energy of the output pulse sequence. For example, upper and lower limits of the voltage amplitude can be preset. When the measured voltage amplitude exceeds the upper limit, the pulse sequence energy is considered too high, and the laser reduces its power coefficient; when the measured voltage amplitude is below the lower limit, the pulse sequence energy is considered too low, and the laser increases its power coefficient. This allows for real-time monitoring of laser energy, ensuring consistent processing.

[0092] The method provided in this application allows for the recording of the amplitude of each laser-transmitted light pulse signal detected by a photodetector before processing. This signal is used as a standard signal (which represents an effective processing range), and its amplitude is equivalent to the energy of the laser-transmitted light pulse. During processing, the signal output by the photodetector is monitored in real time and compared with the recorded standard electrical signal. When the detected electrical signal is higher than the standard electrical signal, the laser output power is reduced within a certain range; when the detected electrical signal is lower than the standard electrical signal, the laser output power is increased within a certain range.

[0093] The method provided in this application embodiment has higher accuracy compared to obtaining the power of one beam by monitoring one of the beams after beam splitting in the optical path. This is because beam splitting in the optical path results in laser power loss and the splitting ratio is difficult to set. If too many beams are directly monitored, it will affect the peak power of the table processing; if too few beams are directly monitored, it will affect the data stability. Compared to a power meter, the photodetector provided in this application embodiment has a much higher sensitivity. Even for a single laser transmission pulse, it can convert the pulse energy into the voltage amplitude and output it stably.

[0094] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0095] According to the foregoing embodiments, this application provides a pulse sequence energy monitoring device. The various modules and units included in the device can be implemented by a processor in a computer device; of course, they can also be implemented by specific logic circuits. In the implementation process, the processor can be a central processing unit (CPU), a microprocessor (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA), etc.

[0096] This application provides a device for monitoring the energy of a pulse sequence, used to monitor pulsed lasers with a predetermined temporal energy distribution. Figure 4 This is a schematic diagram of the structure of a pulse sequence energy monitoring device provided in an embodiment of this application, as shown below. Figure 4 As shown, the pulse sequence energy monitoring device 400 includes: The acquisition module 401 is used to acquire the first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam. The monitoring module 402 is used to monitor the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal.

[0097] In some embodiments, the monitoring module includes: The first acquisition unit is used to acquire a pre-established reference table; wherein, the reference table includes: the correspondence between electrical signals and pulse sequence energies; The first matching unit is used to match the first electrical signal with the electrical signal in the reference table; The first determining unit is used to determine the pulse sequence energy of the reflected pulse laser beam by the pulse sequence energy corresponding to the electrical signal that matches the first electrical signal.

[0098] In some embodiments, the monitoring module includes: The second acquisition unit is used to acquire a pre-established reference table, wherein the reference table includes the correspondence between standard electrical signals and pulse sequence energies, and the pulse sequence energy corresponding to the standard electrical signals meets the processing requirements for the processing effect on the glass substrate. The second matching unit is used to match the first electrical signal with the standard electrical signal in the reference table; The second determining unit is used to determine that the pulse sequence energy of the reflected pulse laser beam meets the processing requirements when the first electrical signal is matched with a standard electrical signal; The third determining unit is used to determine that the pulse sequence energy of the reflected pulse laser beam does not meet the processing requirements when the first electrical signal does not match the standard electrical signal.

[0099] In some embodiments, the pulse sequence energy monitoring device 400 includes: The first control module is used to increase the output power of the laser in the laser processing equipment when the first electrical signal is less than the minimum standard electrical signal in the standard electrical signals. The second control module is used to reduce the output power of the laser of the laser processing equipment when the first electrical signal is greater than the maximum standard electrical signal among the standard electrical signals.

[0100] The pulse sequence energy monitoring device 400 includes: The third control module is used to incident different test pulse laser beams onto the reflector, wherein the second reflected pulse laser beam when the test pulse laser beam is incident onto the reflector is incident onto the laser processing head; The test signal acquisition module is used to acquire the second electrical signal of the transmitted light pulse that passes through the reflector when the test pulse laser beam is incident on the reflector, and to acquire the pulse sequence energy at the laser processing head outlet. A module is established to establish the correspondence between the second electrical signal and the corresponding pulse sequence energy, so as to obtain the reference table.

[0101] In some embodiments, the test signal acquisition module includes: The third acquisition unit is used to acquire the actual optical power at the laser processing head's emission outlet; The calculation unit is used to calculate the pulse sequence energy at the laser processing head exit point based on the repetition frequency of the test pulse laser beam and the actual optical power.

[0102] In some embodiments, the device includes at least one of the following features: (1) Acquiring electrical signals based on photodetectors, (2) Obtain the actual optical power based on the platform power meter. (3) The reflected pulsed laser beam from the mirror is directly incident on the laser processing head.

[0103] In some embodiments, the pulse sequence energy output mode of the pulsed laser having a predetermined time-domain energy distribution includes a single-pulse mode or a burst pulse train mode.

[0104] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0105] In addition, the pulse sequence energy monitoring device described above can be a software unit, a hardware unit, or a combination of software and hardware. It can also be integrated into electronic devices as an independent component or exist as an independent terminal device.

[0106] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0107] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 5 As shown, the electronic device 3 in this embodiment may include: at least one processor 30 ( Figure 5 Only one processor 30, memory 31, and computer program 32 stored in memory 31 and executable on at least one processor 30 are shown. When the processor 30 executes the computer program 32, it implements the steps in any of the above method embodiments, or the processor 30 executes the computer program 32 to implement the functions of each module / unit in the above device or system embodiments.

[0108] For example, computer program 32 may be divided into one or more modules / units, one or more of which are stored in memory 31 and executed by processor 30 to complete this application. One or more modules / units may be a series of computer program 32 instruction segments capable of performing a specific function, which describe the execution process of computer program 32 in electronic device 3.

[0109] This application also provides a computer-readable storage medium storing a computer program 32, which, when executed by a processor 30, implements the steps described in the above-described method embodiments.

[0110] This application provides a computer program product that, when run on an electronic device, enables the electronic device to perform the steps described in the various method embodiments above.

[0111] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program 32 instructing related hardware. The computer program 32 can be stored in a computer-readable storage medium, and when executed by the processor 30, it can implement the steps of the various method embodiments described above. The computer program 32 includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. A computer-readable medium can include at least: any entity or device capable of carrying computer program code to a terminal, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0112] This application provides another processing system, which includes: a laser processing device, the electronic device and photodetector described in the above embodiments. The laser processing device includes: a reflector, a laser generator and a laser processing head. The reflector is used to reflect the pulsed laser beam generated by the laser generator to the laser processing head. The photodetector is used to detect the electrical signal of the pulsed laser beam transmitted through the reflector. The electronic device is communicatively connected to the photodetector and the laser processing device.

[0113] Laser processing equipment can be dual-beam laser processing equipment. The following explanation uses a dual-beam laser processing equipment as an example to illustrate the processing system provided in this application's embodiments. Figure 6 This is a schematic diagram of the structure of a processing system provided in an embodiment of this application, such as... Figure 6 As shown, the laser processing equipment includes: a reflector 11, a laser generator (not shown in the figure), and a laser processing head 12.

[0114] After the laser beam is emitted from the laser source, it is deflected by a reflector, and then the beam expander enlarges the spot size while compressing the beam divergence angle. It then enters the beam splitting system and travels through two different optical paths into two different processing heads 12. A photodetector 13 is positioned behind the last reflector 11 before the processing head 12 in each of the two optical paths. When the pulsed laser passes through this reflector 11, a portion of the transmitted light passes through the reflector and enters the photodetector 13. By monitoring the electrical signal of this transmitted light in real time during processing, the energy of the pulse sequence during processing can be monitored.

[0115] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0116] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0117] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0118] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0119] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A pulse sequence energy monitoring method for monitoring pulsed lasers with a predetermined temporal energy distribution, characterized in that, include: A first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector is obtained, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam; The pulse sequence energy of the reflected pulsed laser beam is monitored based on the first electrical signal.

2. The method according to claim 1, characterized in that, The monitoring of the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal includes: Obtain a pre-established reference table; wherein the reference table includes: the correspondence between electrical signals and pulse sequence energies; Match the first electrical signal with the electrical signals in the reference table; The pulse sequence energy of the reflected pulsed laser beam is determined by the pulse sequence energy corresponding to the electrical signal that matches the first electrical signal.

3. The method according to claim 1, characterized in that, The monitoring of the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal includes: Obtain a pre-established reference table, wherein the reference table includes the correspondence between standard electrical signals and pulse sequence energies, and wherein the pulse sequence energy corresponding to the standard electrical signal satisfies the processing requirements for the glass substrate. The first electrical signal is matched with the standard electrical signal in the reference table; When the first electrical signal matches the standard electrical signal, it is determined that the pulse sequence energy of the reflected pulse laser beam meets the processing requirements; If the first electrical signal does not match the standard electrical signal, it is determined that the pulse sequence energy of the reflected pulse laser beam does not meet the processing requirements.

4. The method according to claim 2 or 3, characterized in that, The method further includes: When the first electrical signal is less than the minimum standard electrical signal in the standard electrical signals, increase the output power of the laser in the laser processing equipment; If the first electrical signal is greater than the maximum standard electrical signal among the standard electrical signals, reduce the output power of the laser of the laser processing equipment.

5. The method according to claim 2 or 3, characterized in that, The method further includes: Different test pulse laser beams are incident on the reflector, wherein a second reflected pulse laser beam when the test pulse laser beam is incident on the reflector is incident on the laser processing head; The second electrical signal of the transmitted light pulse that passes through the reflector when the test pulse laser beam is incident on the reflector is obtained, and the pulse sequence energy of the laser processing head outlet is obtained; Establish the correspondence between the second electrical signal and the corresponding pulse sequence energy to obtain the reference table.

6. The method according to claim 5, characterized in that, The step of obtaining the pulse sequence energy at the laser processing head exit point includes: Obtain the actual optical power at the laser processing head's output outlet; The pulse sequence energy at the laser processing head exit point is calculated based on the repetition frequency of the test pulsed laser beam and the actual optical power.

7. The method according to claim 6, characterized in that, The method includes at least one of the following features: (1) Acquiring electrical signals based on photodetectors, (2) Obtain the actual optical power based on the platform power meter. (3) The reflected pulsed laser beam from the mirror is directly incident on the laser processing head.

8. The method according to claim 1, characterized in that, The pulse sequence energy output mode of the pulsed laser with a predetermined time-domain energy distribution includes a single-pulse mode or a burst pulse train mode.

9. A device for monitoring the energy of a pulse sequence, characterized in that, include: The acquisition module is used to acquire the first electrical signal of the transmitted light pulse that passes through the reflector when the pulsed laser beam is incident on the reflector, wherein the reflected pulsed laser beam when the pulsed laser beam is incident on the reflector is incident on the laser processing head, and the laser processing head processes the glass substrate based on the reflected pulsed laser beam; The monitoring module is used to monitor the pulse sequence energy of the reflected pulsed laser beam based on the first electrical signal.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 8.

11. A processing system, characterized in that, include: The laser processing equipment, the electronic device of claim 10, and the photodetector are provided. The laser processing equipment includes a reflector, a laser generator, and a laser processing head. The reflector is used to reflect a pulsed laser beam generated by the laser generator to the laser processing head. The photodetector is used to detect the electrical signal of the pulsed laser beam transmitted through the reflector. The electronic device is communicatively connected to the photodetector and the laser processing equipment.

12. The processing system according to claim 11, characterized in that, The pulsed laser beam reflected by the mirror is directly incident on the laser processing head.

13. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 8.