Layout and wiring method of low-profile multi-channel transmission line topology network based on dielectric integrated suspension line

Abstract

The invention discloses a low-profile multi-channel transmission line topology network layout and wiring method based on dielectric integrated suspension lines, and the low-profile multi-channel transmission line topology network comprises N dielectric integrated suspension lines and / or double-layer interconnection dielectric integrated suspension lines which are combined by quasi-coaxial structures, the dielectric integrated suspension line and / or the double-layer interconnection dielectric integrated suspension line are / is connected with N quasi-coaxial structures through strip lines, the quasi-coaxial structures are connected with a multi-channel system circuit, and N is larger than or equal to 1. On the basis of a quasi-coaxial structure in combination with a dielectric integrated suspension line, the low-profile multi-channel transmission line topology network layout wiring which is high in isolation, low in loss, high in power capacity, good in amplitude-phase consistency and self-packaged is realized.

Description

Layout and routing method for low-profile multi-channel transmission line topology networks based on dielectric integrated suspension lines Technical Field

[0001] This invention relates to the field of low-profile multi-channel transmission line topology technology, and in particular to a layout and routing method for low-profile multi-channel transmission line topology networks based on dielectric integrated suspension lines. Background Technology

[0002] With the development of military communications fields such as radar and satellite, the design of complex, large-scale backtracking antenna arrays and other multi-channel systems has become a research hotspot. Substrate Integrated Suspended Line (SISL), a structure based on multilayer printed circuit boards, offers advantages such as low loss, weak dispersion, high power capacity, and self-packaging, bringing significant flexibility and simplicity to the design of multi-channel system circuits, and has broad application prospects in the field of microwave RF communications. Currently, no publicly available circuits disclose layout and routing methods for low-profile multi-channel transmission line topology networks based on SISL. Summary of the Invention

[0003] The purpose of this invention is to provide a low-loss, high-isolation, high-power-capacity, self-encapsulated, and good amplitude-phase consistency low-profile multi-channel transmission line topology layout and routing method based on dielectric integrated suspension lines for scenarios where planar transmission lines intersect in the design of large-scale multi-channel system circuits. The technology of this invention involves signal transmission through structures such as coaxial structures and planar transmission lines (such as dielectric integrated suspension lines and double-layer interconnected dielectric integrated suspension lines).

[0004] This invention is achieved through the following technical solution:

[0005] A routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines is disclosed. The low-profile multi-channel transmission line topology network includes N dielectric integrated suspension lines and / or double-layer interconnected dielectric integrated suspension lines combined with coaxial structures. The dielectric integrated suspension lines and / or double-layer interconnected dielectric integrated suspension lines are connected to the N coaxial structures via striplines. The coaxial structures are connected to the multi-channel system circuit, and N≥1.

[0006] Preferably, the coaxial-like structure includes N layers of printed circuit boards, each layer of printed circuit boards is covered with copper foil on both sides, each layer of printed circuit board (PCB) includes metallized vias, the metallized vias include a central metallized via and outer metallized vias arranged rotatably around the central metallized via; the central metallized via and the outer metallized vias are separated by an annular partition.

[0007] Preferably, the dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board is covered with copper foil on both sides, and the middle printed circuit board includes a suspension line in the middle and grounds on both sides of the suspension line. The grounds on both sides are symmetrically arranged on both sides of the suspension line, and each ground is connected to the suspension line through a dielectric board without copper foil on the surface to form an I-shaped structure.

[0008] Preferably, the printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle corresponding to the suspension line; each layer of the printed circuit board has a pre-made self-sealing hole.

[0009] Preferably, the dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board being covered with copper foil on both sides, and a middle printed circuit board including a suspension line located in the middle and grounds located on both sides of the suspension line, with the grounds on both sides symmetrically arranged on both sides of the suspension line; each side of the ground is connected to the suspension line through a dielectric board without copper foil on its surface to form an I-shaped structure, and a suspension line metallized through-hole is formed on the suspension line.

[0010] Preferably, the dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board having copper foil on both sides, and a middle printed circuit board including a suspension line in the middle and grounds on both sides of the suspension line, with the grounds on both sides symmetrically arranged on both sides of the suspension line; each ground and the suspension line are connected to each other through a dielectric board without copper foil on the surface in an I-shaped structure; the sidewalls of the suspension line and / or each ground are plated with copper.

[0011] Preferably, the printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle corresponding to the suspension line; each layer of the printed circuit board has a pre-made self-sealing hole.

[0012] Preferably, the low-profile multi-channel transmission line topology network is constructed using multilayer printed circuit boards. The multilayer printed circuit boards are fixed by fasteners or press-fit connections. The multilayer printed circuit boards integrate N coaxial-like dielectric integrated suspension lines and / or double-layer interconnect dielectric integrated suspension lines. The multi-channel system circuit, such as a backtracking antenna array, is arranged on the outer surface of the printed circuit board.

[0013] Preferably, the multi-channel system circuit includes at least a backtracking antenna array, which is connected to internal suspension lines located on different layers via a coaxial-like structure.

[0014] Preferably, there are cavities above and / or below the suspension lines located in different layers inside.

[0015] This invention is based on a coaxial structure combined with a dielectric integrated suspension line to achieve a low-profile multi-channel transmission line topology network layout and cabling with high isolation, self-encapsulation, low loss, high power capacity, and good amplitude and phase consistency. Attached Figure Description

[0016] Figure 1 is a schematic diagram of the layout and wiring of a low-profile multi-channel transmission line topology network.

[0017] Figure 2 is a cross-sectional view of the coaxial structure.

[0018] Figure 3 is a cross-sectional view of medium-integrated suspension line type 1.

[0019] Figure 4 is a cross-sectional view of medium-integrated suspension line type 2.

[0020] Figure 5 is a cross-sectional view of type 1 dual-layer interconnect medium integrated suspension line.

[0021] Figure 6 is a cross-sectional view of type 2 dual-layer interconnect medium integrated suspension line.

[0022] Figure 7 is a cross-sectional view of type 3 dual-layer interconnect medium integrated suspension line.

[0023] Figure 8 is a cross-sectional view of type 4 dual-layer interconnect medium integrated suspension line.

[0024] Figure 9 is a cross-sectional view of the wiring layout of the low-profile multi-channel transmission line topology network in Example 1.

[0025] Figure 10 shows the isolation simulation results of Example 1.

[0026] Figure 11 shows the amplitude simulation results of Example 1.

[0027] Figure 12 shows the phase simulation results of Example 1.

[0028] Figure 13 is a schematic diagram of the wiring layout of the low-profile multi-channel transmission line topology network in Example 2.

[0029] Figure 14 is a cross-sectional view of Example 2. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0031] In this embodiment of the application, a layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines is provided. The low-profile multi-channel transmission line topology network includes N dielectric integrated suspension lines and / or double-layer interconnected dielectric integrated suspension lines combined with coaxial structures. The dielectric integrated suspension lines and / or double-layer interconnected dielectric integrated suspension lines are connected to the N coaxial structures via striplines. The coaxial structures are connected to multi-channel system circuits, such as backtracking antenna arrays, where N≥1.

[0032] Figure 1 shows a schematic diagram of the low-profile multi-channel transmission line topology network layout and wiring of an embodiment of the present invention. It can be applied to the design of multi-channel circuits in large-scale backtracking antenna arrays and other cross-scenario multi-channel circuits. It uses coaxial-like structures, striplines, dielectric integrated suspension lines, and double-layer interconnected dielectric integrated suspension lines to realize the interconnection between multi-channel system circuits. The striplines are used to realize the transition between coaxial-like structures and dielectric integrated suspension lines and / or double-layer interconnected dielectric integrated suspension lines.

[0033] Figure 2 is a cross-sectional view of a coaxial structure according to an embodiment of the present invention. This cross-sectional view shows a three-layer structure: Sub1-Sub3 represent three layers of printed circuit boards (PCBs), and G1-G6 represent double-sided copper foil on the PCBs, which are composed of inner and outer metallized vias. It should be noted that in the coaxial structure, the number of printed circuit boards is N, where N≥1, designed according to the number of circuit layers. The metallized vias include a central metallized via and outer metallized vias arranged rotatably around the central metallized via. The central metallized via and the outer metallized vias are separated by an annular region. The area where the outer metallized vias are located is ground, separated from and not connected to the central metallized via.

[0034] In this application, the dielectric integrated suspension line includes multiple stacked printed circuit boards, each layer of which is covered with copper foil on both sides. A central printed circuit board includes a suspension line in the middle and ground planes on both sides of the suspension line. The ground planes on both sides are symmetrically arranged on both sides of the suspension line, and each ground plane is connected to the suspension line through a dielectric board without copper foil on its surface, forming an I-shaped structure. For example, the printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle corresponding to the suspension line; each layer of printed circuit board has pre-formed self-sealing holes.

[0035] Figure 3 is a cross-sectional view of the dielectric integrated suspension line type 1 of the present invention; the cross-sectional view is a five-layer structure: Sub1-Sub5 represent five layers of printed circuit board (PCB), G1-G10 represent double-sided copper foil of the circuit board, and the suspension line is located on the top copper foil G5 of the printed circuit board Sub3. The specific number of layers is set according to requirements and is not limited to five layers.

[0036] Figure 4 is a cross-sectional view of the dielectric integrated suspension line type 2 of the present invention; the cross-sectional view is a five-layer structure: Sub1-Sub5 represent five layers of printed circuit board (PCB), G1-G10 represent double-sided copper foil of the circuit board, and the suspension line is located on the bottom copper foil G6 of the printed circuit board Sub3.

[0037] In this embodiment, the dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each layer of which is covered with copper foil on both sides. A central printed circuit board includes a suspension line in the middle and ground planes on both sides of the suspension line, symmetrically arranged. Each ground plane is connected to the suspension line via a dielectric substrate without copper foil, forming an I-shaped structure. Metallized through-holes are formed on the suspension line to connect the upper and lower copper foil surfaces. For example, the printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle corresponding to the suspension line; each layer of the printed circuit board has pre-formed self-sealing holes.

[0038] Figure 5 is a cross-sectional view of type 1 of the dual-layer interconnect medium integrated suspension line according to an embodiment of the present invention; the cross-sectional view is a five-layer structure, but is not limited to five layers, and the number of layers can be set as needed: Sub1-Sub5 represent five-layer printed circuit boards (PCBs) respectively, G1-G10 represent double-sided copper foils of the circuit board respectively, and the top copper foil G5 and bottom copper foil G6 of the printed circuit board Sub3 are connected by metallized through holes.

[0039] For example, the dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board having copper foil on both sides, and a middle printed circuit board including a suspension line in the middle and grounds on both sides of the suspension line, with the grounds on both sides symmetrically arranged on both sides of the suspension line; each ground is connected to the suspension line through a dielectric board without copper foil on its surface in an I-shaped structure; the sidewalls of the suspension line and / or each ground are plated with copper.

[0040] Figure 6 is a cross-sectional view of the dual-layer interconnect dielectric integrated suspension line type 2 of the present invention; the cross-sectional view is a five-layer structure: Sub1-Sub5 represent five-layer printed circuit boards (PCBs) respectively, G1-G10 represent double-sided copper foils of the circuit board respectively, and the sidewalls of the dual-layer interconnect dielectric integrated suspension lines are copper plated.

[0041] Figure 7 is a cross-sectional view of the dual-layer interconnect dielectric integrated suspension line type 3 of the present invention; the cross-sectional view is a five-layer structure: Sub1-Sub5 represent five-layer printed circuit boards (PCBs) respectively, G1-G10 represent double-sided copper foils of the circuit board respectively, and the sidewalls of the dual-layer interconnect dielectric integrated suspension line are plated with copper on both sides.

[0042] Figure 8 is a cross-sectional view of the dual-layer interconnect dielectric integrated suspension line type 4 of the present invention; the cross-sectional view is a five-layer structure: Sub1-Sub5 represent five-layer printed circuit boards (PCBs) respectively, G1-G10 represent double-sided copper foils of the circuit board respectively, and the dual-layer interconnect dielectric integrated suspension line and its two sides are copper plated on the sidewalls.

[0043] Figure 9 is a layout and wiring cross-sectional view of the low-profile multi-channel transmission line topology network of Embodiment 1 proposed in this invention; there are a total of 18 dielectric substrates, and the multi-channel transmission lines are divided into four parts located at the four suspension line positions marked in the figure. They are fixed by means of pins and screws to form a multi-layer printed circuit board package structure. The dielectric substrates above and / or below the internal suspension lines form cavities. The blank parts in the figure are all cavities.

[0044] Figure 10 shows the isolation simulation results of Example 1; the isolation is less than -70dB within the 8-12GHz range. Figure 11 shows the amplitude simulation results of Example 1; the amplitude imbalance is within 0.05 within the 8-12GHz range. Figure 12 shows the phase simulation results of Example 1; the phase imbalance is within 1° within the 8-12GHz range.

[0045] Figure 13 is a layout and routing schematic diagram of the low-profile multi-channel transmission line topology network proposed in Embodiment 2 of the present invention. This layout and routing schematic diagram includes multiple channels, and the power supply port uses the coaxial-like structure shown in Figure 2 for signal input. By adjusting the layout, the interconnecting transmission lines are distributed across two layers, forming upper and lower layer lines, including multiple channels. The transition line types and the lengths of various types of dielectric integrated suspension lines included in the multiple channels are consistent, further ensuring phase consistency. Figure 14 is a cross-sectional view of Embodiment 2. Embodiment 2 adopts a different implementation method, using PCB lamination technology to achieve the connection structure of multi-layer printed circuits, with cavities formed above and / or below the internal suspension lines.

[0046] The above description is only intended to enable the present invention to be fully understood and easy to operate in practice. It is described only through some preferred embodiments. The claims of this patent should not only include the given embodiments, but should include any combination and layout structure of transmission lines with corresponding structures given in Figures 1-14.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention.

[0048] Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalents of the claims be included within the invention.

[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A layout and routing method for low-profile multi-channel transmission line topology networks based on dielectric integrated suspension lines, characterized in that, The low-profile multi-channel transmission line topology network includes N medium-integrated suspension lines and / or double-layer interconnected medium-integrated suspension lines combined with coaxial structures. The medium-integrated suspension lines and / or double-layer interconnected medium-integrated suspension lines are connected to the N coaxial structures via striplines. The coaxial structures are connected to the multi-channel system circuit, where N≥1.

2. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 1, characterized in that, The coaxial-like structure includes N layers of printed circuit boards, each layer of printed circuit boards is covered with copper foil on both sides, and each layer of printed circuit board (PCB) includes metallized vias, the metallized vias including a central metallized via and outer metallized vias arranged rotatably around the central metallized via; the central metallized via and the outer metallized vias are separated by an annular partition.

3. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 1, characterized in that, The dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board is covered with copper foil on both sides, and the middle printed circuit board includes a suspension line in the middle and ground on both sides of the suspension line. The ground on both sides is symmetrically arranged on both sides of the suspension line, and each side of the ground is connected to the suspension line through a dielectric board without copper foil on the surface to form an I-shaped structure.

4. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 3, characterized in that, The printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle, corresponding to the suspension line; each layer of printed circuit board has a pre-made self-sealing hole.

5. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 1, characterized in that, The dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board is covered with copper foil on both sides, and the middle printed circuit board includes a suspension line in the middle and ground on both sides of the suspension line. The ground on both sides is symmetrically arranged on both sides of the suspension line. Each side of the ground is connected to the suspension line through a dielectric board without copper foil on the surface to form an I-shaped structure. The suspension line has metallized through holes.

6. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 5, characterized in that, The dual-layer interconnect dielectric integrated suspension line includes multiple stacked printed circuit boards, each printed circuit board having copper foil on both sides. The middle printed circuit board includes a suspension line in the middle and ground planes on both sides of the suspension line. The ground planes on both sides are symmetrically arranged on both sides of the suspension line. Each ground plane is connected to the suspension line through a dielectric board without copper foil on its surface, forming an I-shaped structure. The sidewalls of the suspension line and / or each ground plane are plated with copper.

7. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspended lines according to claim 5, characterized in that, The printed circuit boards above and below the suspension line have the same structure, forming a cavity in the middle, corresponding to the suspension line; each layer of printed circuit board has a pre-made self-sealing hole.

8. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 1, characterized in that, The low-profile multi-channel transmission line topology network is constructed using multilayer printed circuit boards. The multilayer printed circuit boards are fixed by fasteners or press-fit connections. The multilayer printed circuit boards integrate N coaxial-like structure combined media integrated suspension lines and / or double-layer interconnected media integrated suspension lines.

9. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 1, characterized in that, The multi-channel system circuit includes at least a backtracking antenna array, which is connected to internal suspension lines located on different layers via a coaxial-like structure.

10. The layout and routing method for a low-profile multi-channel transmission line topology network based on dielectric integrated suspension lines according to claim 9, characterized in that, There are cavities above and / or below the suspension lines located in different layers inside.

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