Printed circuit board assembly, circuit board module and electronic equipment

Abstract

The invention discloses a printed circuit board assembly, a circuit board module and electronic equipment, and belongs to the technical field of electronics. The printed circuit board assembly comprises a substrate used for installing an electronic device, the substrate is provided with a shielding cover bonding pad, and the shielding cover bonding pad is provided with a plurality of first signal pins; the shielding cover is arranged on the shielding cover bonding pad, and the shielding cover is used for surrounding an electronic device arranged on the substrate; and the flexible printed circuit board is provided with a plurality of second signal pins, the flexible printed circuit board is arranged between the shielding case bonding pad and the shielding case, and the plurality of second signal pins are correspondingly connected with the plurality of first signal pins.

Description

Printed circuit board assemblies, circuit board modules and electronic devices Technical Field

[0001] This application belongs to the field of electronic technology, specifically relating to a printed circuit board assembly, a circuit board module, and an electronic device. Background Technology

[0002] As the functional requirements of smart devices increase, the number of electronic components that need to be housed on the PCB (Printed Circuit Board) within these devices is also increasing. Simultaneously, as consumers demand more performance and greater diversity from smart devices, it is necessary to add BTB (Board to Board) connectors to the PCB, or to accommodate additional pins on existing BTB connectors.

[0003] When installing BTB connectors on a PCB, sufficient space must be reserved around the connector due to waterproofing requirements and assembly limitations to prevent interference between the BTB connector and surrounding shielding or electronic components. Furthermore, at least two additional screw holes are typically added to both ends of the BTB connector for locking.

[0004] Thus, considering the space occupied by the BTB connector body, assembly gaps, and surrounding screw holes, setting up a BTB connector will occupy a large amount of PCB layout space, reducing the PCB space utilization rate. Summary of the Invention

[0005] The purpose of this application is to provide a printed circuit board assembly, a circuit board module, and an electronic device that can save layout space on the printed circuit board and improve the space utilization rate of the printed circuit board.

[0006] In a first aspect, embodiments of this application provide a printed circuit board assembly, comprising: a substrate for mounting electronic devices, wherein a shielding pad is provided on the substrate and a plurality of first signal pins are provided on the shielding pad; a shielding pad is disposed on the shielding pad and is used to surround the electronic devices disposed on the substrate; and a flexible printed circuit board having a plurality of second signal pins, wherein the flexible printed circuit board is disposed between the shielding pad and the shielding pad, and the plurality of second signal pins are correspondingly connected to the plurality of first signal pins.

[0007] Secondly, embodiments of this application provide a circuit board module, including: a shielding cover; a support plate connected to the edge of the shielding cover; and a flexible printed circuit board connected to the support plate, wherein the flexible printed circuit board is provided with a plurality of second signal pins.

[0008] Thirdly, embodiments of this application provide a printed circuit board assembly, including: a substrate having a shield pad, a groove being provided at any position of the shield pad, and a first signal pin being provided in the groove; a circuit board module as in the second aspect, connected to the substrate, with a support plate covering the groove, a flexible printed circuit board being disposed in the groove, and the first signal pin being connected to a second signal pin.

[0009] Fourthly, embodiments of this application provide an electronic device, including: a printed circuit board assembly as described in the first aspect; or, a printed circuit board assembly as described in the third aspect.

[0010] The printed circuit board assembly provided in this application includes a substrate, a shielding cover, and a flexible printed circuit board. The substrate is used to mount electronic devices, and the shielding cover surrounds the electronic devices mounted on the substrate. The substrate has shielding cover pads with multiple first signal pins, and the flexible printed circuit board has multiple second signal pins. The shielding cover is disposed on the shielding cover pads, and the flexible printed circuit board is disposed between the shielding cover pads and the shielding cover, with the multiple second signal pins corresponding to the multiple first signal pins. The printed circuit board assembly provided in this application provides first signal pins on the shielding cover pads that correspond to the second signal pins on the flexible printed circuit board. By connecting the second signal pins and the first signal pins, the signals on the flexible printed circuit board are connected to the signals on the substrate. In this way, the shielding cover pads are reused as signal pins, eliminating the need for additional board-to-board connectors, saving space occupied by the board-to-board connector body, assembly gaps, and surrounding screw holes, thus saving layout space on the printed circuit board and improving its space utilization. Attached Figure Description

[0011] Figure 1 is a schematic diagram of one of the printed circuit board assemblies provided in the embodiments of this application;

[0012] Figure 2 is a schematic diagram of the flexible printed circuit board provided in an embodiment of this application;

[0013] Figure 3 is one of the schematic diagrams showing the distribution of the first signal pins provided in an embodiment of this application;

[0014] Figure 4 is a schematic diagram of PCB layout in related technologies;

[0015] Figure 5 is a second schematic diagram of the printed circuit board assembly provided in the embodiments of this application;

[0016] Figure 6 is a third schematic diagram of the printed circuit board assembly provided in the embodiments of this application;

[0017] Figure 7 is a second schematic diagram of the distribution of the first signal pins provided in an embodiment of this application;

[0018] Figure 8 is a third schematic diagram of the distribution of the first signal pins provided in the embodiments of this application;

[0019] Figure 9 is a structural block diagram of the circuit board module provided in an embodiment of this application;

[0020] Figure 10 is a structural block diagram of the printed circuit board assembly provided in an embodiment of this application;

[0021] Figure 11 is a structural block diagram of the electronic device provided in an embodiment of this application.

[0022] Figure label:

[0023] 100 Printed circuit board assembly, 102 Substrate, 104 Electronic device, 106 Shielding pad, 108 First signal pin, 110 Shielding cover, 112 Flexible printed circuit board, 114 Second signal pin, 116 Covering film, 118 Window, 120 Reinforcing steel sheet, 122 Notch, 124 Groove, 126 Support plate, 200 Circuit board module, 300 Electronic device. Detailed Implementation

[0024] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] The printed circuit board assembly, circuit board module, and electronic device of the present application will now be described in detail with reference to the accompanying drawings.

[0028] As shown in Figures 1, 5, and 6, this application embodiment provides a printed circuit board assembly 100. The printed circuit board assembly 100 includes a substrate 102, a shielding cover 110, and a flexible printed circuit board 112.

[0029] As shown in Figures 1 and 6, the substrate 102 is used to mount the electronic device 104, and the shield 110 is used to surround the electronic device 104 disposed on the substrate 102 to block interference from other devices to the electronic device 104 surrounded by the shield 110.

[0030] Optionally, as shown in FIG2, the flexible printed circuit board 112 is provided with a plurality of second signal pins 114, such as SIG1, SIG2 and SIG3, and different second signal pins 114 are used to transmit different signals.

[0031] Optionally, as shown in Figure 3, a shielding pad 106 is provided on the substrate 102. The shielding pad 106 has multiple first signal pins 108, such as SIG1, SIG2, and SIG3, which are used to transmit different signals. GND represents the ground pin.

[0032] Optionally, a plurality of first signal pins 108 correspond one-to-one with a plurality of second signal pins 114.

[0033] Optionally, as shown in Figures 1 and 6, a shielding cover 110 is disposed on a shielding cover pad 106, a flexible printed circuit board 112 is disposed between the shielding cover pad 106 and the shielding cover 110, and a plurality of second signal pins 114 are correspondingly connected to a plurality of first signal pins 108.

[0034] Optionally, the second signal pin 114 and the first signal pin 108 are connected by soldering to ensure the reliability of signal transmission.

[0035] As shown in Figure 4, when placing a BTB connector on a PCB, sufficient space needs to be reserved around the connector due to waterproofing requirements and assembly limitations to prevent interference between the BTB connector and surrounding shielding or electronic components. Furthermore, at least two additional screw holes are typically added to both ends of the BTB connector for locking. Therefore, considering the space occupied by the BTB connector body, assembly gaps, and surrounding screw holes, placing a single BTB connector occupies a significant amount of PCB layout space, reducing PCB space utilization.

[0036] Therefore, the printed circuit board assembly 100 provided in this application embodiment has a first signal pin 108 on the shielding pad 106 that corresponds to the second signal pin 114 on the flexible printed circuit board 112. By connecting the second signal pin 114 and the first signal pin 108, the signals on the flexible printed circuit board 112 are connected to the signals on the substrate 102. In this way, the shielding pad 106 is reused as a signal pin, eliminating the need for additional board-to-board connectors. This saves space occupied by the board-to-board connector body, assembly gaps, and the space occupied by surrounding screw holes. The space originally occupied by the screw holes on both sides can be used for layout, improving the space utilization of the PCB. Furthermore, eliminating the need for additional board-to-board connectors facilitates a reduction in overall weight, contributing to a thinner and lighter design.

[0037] A printed circuit board assembly 100 according to an embodiment of this application includes a substrate 102, a shielding cover 110, and a flexible printed circuit board 112. The substrate 102 is used to mount electronic devices 104, and the shielding cover 110 is used to surround the electronic devices 104 disposed on the substrate 102. A shielding cover pad 106 is disposed on the substrate 102, and a plurality of first signal pins 108 are disposed on the shielding cover pad 106. The flexible printed circuit board 112 is disposed between the shielding cover pad 106 and the shielding cover 110, and the plurality of second signal pins 114 are correspondingly connected to the plurality of first signal pins 108. The printed circuit board assembly 100 provided in this application embodiment has a first signal pin 108 on the shielding pad 106 that corresponds to the second signal pin 114 on the flexible printed circuit board 112. By connecting the second signal pin 114 and the first signal pin 108, the signals on the flexible printed circuit board 112 are connected to the signals on the substrate 102. In this way, the shielding pad 106 is reused as a signal pin, eliminating the need for additional board-to-board connectors, saving space occupied by the board-to-board connector body, assembly gaps, and surrounding screw holes, thus saving layout space on the printed circuit board and improving its space utilization.

[0038] According to some embodiments of this application, optionally, as shown in Figures 1 and 6, the flexible printed circuit board 112 includes a cover film 116 and a reinforcing steel sheet 120.

[0039] Optionally, the flexible printed circuit board 112 can be soldered onto the shielding pad 106 on the substrate 102 based on SMT (Surface Mount Technology).

[0040] As shown in Figures 1 and 6, the cover film 116 has a window 118 at the position of the second signal pin 114, and the second signal pin 114 is connected to the first signal pin 108 through the window 118.

[0041] Optionally, a reinforcing steel sheet 120 is disposed between the second signal pin 114 and the shielding cover 110. The reinforcing steel sheet 120 is used to provide rigid support for the second signal pin 114, so as to improve the mechanical strength at the position of the second signal pin 114 while ensuring the overall flexibility of the flexible printed circuit board 112, thereby protecting the second signal pin 114, facilitating the assembly convenience of the flexible printed circuit board 112, and extending the service life of the flexible printed circuit board 112.

[0042] According to the printed circuit board assembly 100 of this application embodiment, the flexible printed circuit board 112 includes a cover film 116 and a reinforcing steel sheet 120. The cover film 116 has a window 118 at the location of the second signal pin 114, through which the second signal pin 114 is connected to the first signal pin 108. The reinforcing steel sheet 120 is disposed between the second signal pin 114 and the shielding cover 110. In this way, the signals on the flexible printed circuit board 112 are connected to the signals on the substrate 102, saving PCB layout space while improving the mechanical reliability and assembly convenience of the flexible printed circuit board 112.

[0043] According to some embodiments of this application, optionally, as shown in FIG5, a notch 122 is provided on the edge of the shield 110.

[0044] Based on this, when the flexible printed circuit board 112 is placed between the shielding pad 106 and the shielding cover 110, the flexible printed circuit board 112 is snapped into the notch 122, so that the edge of the shielding cover 110 contacts the shielding pad 106.

[0045] According to the printed circuit board assembly 100 of this application embodiment, a notch 122 is provided on the edge of the shielding cover 110, and the flexible printed circuit board 112 is fitted into the notch 122. In this way, the edge of the shielding cover 110 is designed with a concave shape at the position where the shielding cover 110 contacts the flexible printed circuit board 112, which does not increase the height of the shielding cover 110, thereby not increasing the overall height and volume of the machine, which is conducive to achieving a thin and light design of the whole machine.

[0046] According to some embodiments of this application, optionally, as shown in FIG6, a groove 124 is provided on the substrate 102.

[0047] Specifically, using Cavity (magnetic levitation gravity feeding) technology, the shielding pads 106 on the substrate 102 are sunk to form a groove 124.

[0048] The first signal pin 108 is provided in the groove 124.

[0049] Based on this, with the flexible printed circuit board 112 positioned between the shielding pad 106 and the shielding cover 110, the flexible printed circuit board 112 is located within the groove 124, and the height difference between the surface of the flexible printed circuit board 112 and the surface of the substrate 102 is less than a preset threshold. Thus, by further optimizing the stacking method between the substrate 102, the flexible printed circuit board 112, and the shielding cover 110, a tight contact between the shielding cover 110 and the substrate 102 is achieved, ensuring the shielding performance of the shielding cover 110 without increasing its height, which is beneficial for achieving a thinner and lighter overall design.

[0050] The preset threshold is a small value close to 0, and the preset threshold can also be 0, so that the surface of the flexible printed circuit board 112 is flush with the surface of the substrate 102.

[0051] In practical applications, those skilled in the art can set the specific value of the preset threshold according to the actual situation, and no specific restrictions are imposed here.

[0052] Optionally, the surface height of the flexible printed circuit board 112 is lower than the surface height of the substrate 102, so that the entire flexible printed circuit board 112 is located within the groove 124.

[0053] According to the printed circuit board assembly 100 of this application embodiment, a recess 124 is provided on the substrate 102, and a first signal pin 108 is provided in the recess 124. A flexible printed circuit board 112 is disposed in the recess 124, and the height difference between the surface of the flexible printed circuit board 112 and the surface of the substrate 102 is less than a preset threshold. In this way, the stacking method between the substrate 102, the flexible printed circuit board 112 and the shielding cover 110 is further optimized, so that the shielding cover 110 and the substrate 102 can be in tight contact, ensuring the shielding performance of the shielding cover 110, and without increasing the height of the shielding cover 110, which is conducive to achieving a thinner and lighter design of the whole machine.

[0054] According to some embodiments of this application, optionally, as shown in FIG6, the printed circuit board assembly 100 further includes a support plate 126.

[0055] The support plate 126 covers the groove 124 and is connected to the shielding cover 110. That is, the support plate 126 is used to support the shielding cover 110 and to cover the groove 124 to ensure tight contact between the shielding cover 110 and the substrate 102, thereby improving the shielding performance of the shielding cover 110.

[0056] Optionally, multiple edges of the support plate 126 are fixedly connected to the substrate 102, such as by welding, to stably fix the support plate 126 above the groove 124, thereby preventing the support plate 126 from collapsing into the groove 124 and causing pressure on the flexible printed circuit board 112.

[0057] In practical applications, the aforementioned support plate 126 can be made of rigid materials such as steel sheets, and no specific restrictions are imposed here.

[0058] The printed circuit board assembly 100 according to an embodiment of this application further includes a support plate 126. The support plate 126 covers the groove 124 and is connected to the shielding cover 110. This ensures tight contact between the shielding cover 110 and the substrate 102, thereby improving the shielding performance of the shielding cover 110.

[0059] According to some embodiments of this application, the first signal pin 108 may optionally be located at any position on the shield pad 106.

[0060] Specifically, the distribution of the first signal pin 108 in the shielding pad 106 can be designed based on the distribution of the second signal pin 114 on the flexible printed circuit board 112. It can also be combined and arranged according to actual needs to avoid the first signal pin 108 being concentrated on one side of the shielding cover 110.

[0061] For example, as shown in FIG7, a shielding pad 106 is provided on the substrate 102. The shielding pad 106 includes four boundaries: top, bottom, left, and right. First signal pins 108, such as SIG1, SIG2, and SIGN, are concentrated at the bottom boundary of the shielding pad 106. The left, right, and top boundaries of the shielding pad 106 are only provided with GND (ground) pins. Furthermore, at the bottom boundary of the shielding pad 106, the first signal pins 108 and GND pins are spaced apart.

[0062] For example, as shown in FIG8, two shielding pads 106 are provided on the substrate 102, each shielding pad 106 including four boundaries: top, bottom, left, and right. In one shielding pad 106, a first signal pin 108 is provided on the left and bottom boundaries of the shielding pad 106, while the right and top boundaries of the shielding pad 106 only have GND pins. In the other shielding pad 106, the first signal pin 108 is provided on the right and bottom boundaries of the shielding pad 106, while the left and top boundaries of the shielding pad 106 only have GND pins. Within the same boundary of the shielding pad 106, the first signal pin 108 and the GND pin are spaced apart.

[0063] In practical applications, the distribution of the second signal pin 114 on the flexible printed circuit board 112 can also be designed based on the design distribution of the first signal pin 108 in the shielding pad 106, so as to improve the design diversity and flexibility of the flexible printed circuit board 112. No specific restrictions are imposed here.

[0064] According to the printed circuit board assembly 100 of this application embodiment, the first signal pin 108 can be disposed at any position on the shield pad 106. This improves the diversity and flexibility of the design of the first signal pin 108.

[0065] Optionally, as shown in FIG9, according to some embodiments of this application, an embodiment of this application also provides a circuit board module 200. As shown in FIG9, the circuit board module 200 includes a shielding cover 110, a support plate 126, and a flexible printed circuit board 112.

[0066] One side of the support plate 126 is connected to the edge of the shield 110, and the other side of the support plate 126 is connected to the flexible printed circuit board 112.

[0067] In practical applications, the support plate 126 can be made of rigid materials such as steel sheets, and no specific restrictions are made here.

[0068] Optionally, the flexible printed circuit board 112 is provided with a plurality of second signal pins 114, and different second signal pins 114 are used to transmit different signals.

[0069] Optionally, when the circuit board module 200 is mounted on the PCB, the second signal pin 114 is used to connect with the signal pin on the PCB to realize the connection between the signal on the flexible printed circuit board 112 and the signal on the PCB.

[0070] The circuit board module 200 according to an embodiment of this application includes a shielding cover 110, a support plate 126, and a flexible printed circuit board 112. The flexible printed circuit board 112 is provided with a plurality of second signal pins 114. The support plate 126 is connected to the edge of the shielding cover 110, and the flexible printed circuit board 112 is connected to the support plate 126. In this way, the shielding cover 110, the support plate 126, and the flexible printed circuit board 112 are assembled into a single structure, improving the convenience of subsequent PCB assembly.

[0071] According to some embodiments of this application, optionally, the shielding cover 110, the support plate 126 and the flexible printed circuit board 112 are connected by welding, such as soldering, laser welding and ultrasonic welding.

[0072] Optionally, the shielding cover 110, the support plate 126, and the flexible printed circuit board 112 can also be connected by adhesive materials, such as acrylic glue, epoxy resin glue, silicone, and double-sided tape.

[0073] According to the circuit board module 200 of this application embodiment, the shielding cover 110, the support plate 126, and the flexible printed circuit board 112 are connected by welding; or, the shielding cover 110, the support plate 126, and the flexible printed circuit board 112 are connected by adhesive material. In this way, the various structures in the circuit board module 200 support welding or adhesive connection, which facilitates the assembly of the circuit board module 200.

[0074] Optionally, as shown in FIG10, according to some embodiments of this application, an embodiment of this application also provides a printed circuit board assembly 100. As shown in FIG10, the printed circuit board assembly 100 includes a substrate 102 and the circuit board module 200 in the above embodiments.

[0075] The printed circuit board assembly 100 provided in this application embodiment includes the circuit board module 200 in the above embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0076] The substrate 102 is provided with a shielding pad 106, and a groove 124 is provided at any position of the shielding pad 106. A first signal pin 108 is provided in the groove 124.

[0077] Optionally, the circuit board module 200 is connected to the substrate 102.

[0078] In this circuit board module 200, the support plate 126 covers the groove 124 to seal the groove 124, so that the shielding cover 110 in the circuit board module 200 is in close contact with the substrate 102, thereby improving the shielding performance of the shielding cover 110.

[0079] Optionally, the flexible printed circuit board 112 in the circuit board module 200 is disposed within the recess 124, and multiple first signal pins 108 on the substrate 102 are correspondingly connected to multiple second signal pins 114 on the flexible printed circuit board 112. In this way, on the one hand, the shielding pad 106 is reused as a signal pin, enabling the connection between signals on the flexible printed circuit board 112 and signals on the substrate 102, facilitating the elimination of board-to-board connectors on the PCB, thereby saving PCB layout space and improving PCB space utilization. On the other hand, the design of the recess 124 optimizes the stacking method between the substrate 102, the flexible printed circuit board 112, and the shielding cover 110, allowing for tight contact between the shielding cover 110 and the substrate 102, ensuring the shielding performance of the shielding cover 110, and eliminating the need to increase the height of the shielding cover 110, which is beneficial for achieving a thinner and lighter overall design.

[0080] Optionally, as shown in FIG11, according to some embodiments of this application, this application also provides an electronic device 300. The electronic device 300 includes the printed circuit board assembly 100 in any of the above embodiments. The electronic device 300 provided in this application includes the printed circuit board assembly 100 in any of the above embodiments and achieves the same technical effects; therefore, to avoid repetition, it will not be described again here.

[0081] It should be noted that the electronic device 300 in the embodiments of this application includes mobile electronic devices and non-mobile electronic devices.

[0082] In practical applications, the electronic device 300 can be a terminal or other devices besides a terminal. For example, the electronic device 300 can be a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. The embodiments of this application do not specifically limit it.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A printed circuit board assembly, characterized in that, include: A substrate for mounting electronic devices, wherein a shielding pad is provided on the substrate and a plurality of first signal pins are provided on the shielding pad; A shielding cover is disposed on the shielding cover pad, the shielding cover being used to surround electronic devices disposed on the substrate; a flexible printed circuit board is provided with a plurality of second signal pins, the flexible printed circuit board being disposed between the shielding cover pad and the shielding cover, and the plurality of second signal pins being correspondingly connected to a plurality of first signal pins.

2. The printed circuit board assembly according to claim 1, characterized in that, The flexible printed circuit board includes: a cover film with a window at the location of the second signal pin, through which the second signal pin is connected to the first signal pin; and a reinforcing steel sheet disposed between the second signal pin and the shielding cover.

3. The printed circuit board assembly according to claim 1, characterized in that, The shielding cover has a notch on its edge, and the flexible printed circuit board is fitted into the notch.

4. The printed circuit board assembly according to claim 1, characterized in that, The substrate has a groove, the first signal pin is disposed in the groove, the flexible printed circuit board is disposed in the groove, and the height difference between the surface of the flexible printed circuit board and the surface of the substrate is less than a preset threshold.

5. The printed circuit board assembly according to claim 4, characterized in that, Also includes: A support plate covers the groove and is connected to the shielding cover.

6. The printed circuit board assembly according to any one of claims 1 to 5, characterized in that, The first signal pin can be set at any position on the shield pad.

7. A circuit board module, characterized in that, include: Shielding cover; The support plate is connected to the edge of the shielding cover; A flexible printed circuit board is connected to the support plate, and the flexible printed circuit board is provided with multiple second signal pins.

8. The circuit board module according to claim 7, characterized in that, The shielding cover, the support plate, and the flexible printed circuit board are connected by welding; or, the shielding cover, the support plate, and the flexible printed circuit board are connected by an adhesive material.

9. A printed circuit board assembly, characterized in that, include: A substrate is provided with a shielding pad, and a groove is provided at any position of the shielding pad. A first signal pin is provided in the groove. A circuit board module as described in claim 7 or 8 is connected to the substrate, and a support plate covers the groove. The flexible printed circuit board is disposed in the groove, and the first signal pin is connected to a second signal pin.

10. An electronic device, characterized in that, include: Printed circuit board assembly as described in any one of claims 1 to 6; Alternatively, the printed circuit board assembly as described in claim 9.

Images