Packaging device based on electronic component processing

Abstract

The invention relates to the technical field of chip packaging, in particular to a packaging device based on electronic component processing. Comprising a packaging table which is sequentially provided with a feeding and discharging station, a glue injection station, a cover plate feeding station and a press fitting station in the clockwise direction, a rotating frame rotationally connected to the packaging table, and four packaging assemblies installed on the packaging table in an array mode, and each packaging assembly comprises a coupling shaft rotationally connected to the rotating frame, a driven shaft and a material bearing frame slidably connected to the rotating frame; the coupling shaft is rotationally sleeved with a sleeve shaft, the coupling shaft is provided with a swing assembly for driving the driven shaft to swing in a reciprocating mode, the sleeve shaft is in transmission connection with a first synchronous belt, the first synchronous belt is in transmission connection with the driven shaft, the rotating frame is further rotationally connected with a first wheel shaft, an eccentric cam is fixedly installed on the first wheel shaft, and the first wheel shaft is rotationally connected with a second wheel shaft. The method has the beneficial effects that through a three-dimensional collaborative disturbance mechanism, the problems of non-uniform glue filling, vacant corners and bubble residues in traditional chip packaging are solved.

Description

A packaging device based on electronic component fabrication Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a packaging device based on electronic component processing. Background Technology

[0002] In the packaging process of electronic components, encapsulation and pressing are the core steps affecting packaging quality. Traditional packaging equipment often uses static encapsulation or unidirectional vibration-assisted encapsulation during the encapsulation process. The adhesive mainly relies on gravity flow, which makes it difficult to fully fill the micron-level gaps, corners, and pin gaps between the chip and the cover plate. This easily leads to uneven adhesive layer distribution and empty corners. At the same time, air bubbles inside the adhesive are not easy to expel and remain in the packaging layer, which will lead to a decrease in mechanical strength and poor sealing. In the long-term use, this can easily cause chip performance degradation or failure. In the pressing stage, traditional equipment mostly uses pure axial pressure to achieve initial bonding between the cover plate and the chip. Although this can achieve initial bonding between the cover plate and the chip, the adhesive lacks radial driving force and is difficult to penetrate the fine interface. The adhesive layer is not fully extended, which can easily lead to localized missing adhesive or inconsistent adhesive thickness. In addition, since the dispensing and pressing processes are often performed separately, the adhesive may have already undergone localized curing or uneven flow before pressing, further affecting the integrity and reliability of the encapsulation layer. Although there are encapsulation devices with vibration or rotation functions in the prior art, their movement modes are mostly unidirectional or fixed in amplitude, which cannot provide differentiated and coordinated dynamic action fields according to the process requirements of different stages of dispensing and pressing. As a result, the adhesive filling effect, air bubble removal efficiency, and encapsulation layer uniformity are still significantly limited. Based on this, the present invention provides an encapsulation device based on electronic component processing to solve the problems mentioned in the background art. Summary of the Invention

[0003] This invention addresses the technical problems existing in the prior art by providing a packaging device based on electronic component processing. This solves the problem that traditional packaging equipment often uses static dispensing or unidirectional vibration-assisted dispensing during the dispensing process. The adhesive mainly relies on gravity flow, which makes it difficult to fully fill the micron-level gaps, corners, and pin gaps between the chip and the cover plate, easily resulting in uneven adhesive layer distribution and empty corners.

[0004] The technical solution of this invention to solve the above-mentioned technical problems is as follows: A packaging device based on electronic component processing includes a packaging stage, on which, in a clockwise direction, are sequentially arranged loading and unloading stations, a glue injection station, a cover plate loading station, and a pressing station; a rotating frame rotatably connected to the packaging stage; and four packaging components arrayed on the packaging stage. Each packaging component includes a coupling rotatably connected to the rotating frame, a driven shaft, and a material support frame slidably connected to the rotating frame. A sleeve shaft is rotatably sleeved on the coupling, and a swinging component driving the driven shaft to reciprocate is provided on the coupling. A first synchronous belt is drively connected to the sleeve shaft and is drively connected to the driven shaft. A first wheel shaft is also rotatably connected to the rotating frame, and an eccentric cam is fixedly mounted on the first wheel shaft. A second wheel shaft is rotatably connected to the first wheel shaft. A wheel is fixedly mounted on the second wheel shaft. Three guide protrusions are arrayed on the wheel along the circumference. A driven roller is rotatably connected to the material support frame. The second wheel shaft and the guide protrusions are adapted to the driven roller, and the three guide protrusions have different driving strokes for the driven roller. A return spring is installed between the material support frame and the rotating frame. An electric heating platform driven by the driven shaft is rotatably connected to the material support frame. A chip positioning slot is opened on the electric heating platform. The transmission system drives the rotating frame to rotate intermittently, drives the driven shaft to oscillate back and forth at the dispensing station and the wheel to rotate, and drives the driven shaft and the wheel to rotate unidirectionally at the pressing station. The top frame is raised and lowerable and is set on the packaging platform. Dispensing components are set on the top frame at the position corresponding to the dispensing station, and pressing components are set at the position corresponding to the cover plate loading station.

[0005] Based on the above technical solution, the present invention can be further improved as follows.

[0006] As a preferred technical solution of the present invention, the swing assembly includes two incomplete gears rotatably connected to the rotating frame, a swing gear is fixedly installed on the driven shaft, the two incomplete gears are alternately meshed with the swing gear, a second synchronous belt is drivenly connected to the driven shaft, and both incomplete gears are drivenly connected to the second synchronous belt.

[0007] As a preferred technical solution of the present invention, the center angles corresponding to the effective meshing tooth segments on the two incomplete gears are both 60°, and the two incomplete gears are symmetrically arranged with the horizontal plane containing the axis of the driven shaft as the axis.

[0008] As a preferred technical solution of the present invention, the driven shaft is provided with a transmission groove with an open top, and the bottom surface of the electric heating platform is fixedly installed with a support shaft. The cross-section of the support shaft and the transmission groove are both regular hexagonal.

[0009] As a preferred technical solution of the present invention, it also includes a central control unit fixedly installed on the packaging platform. CCD vision sensors are installed on the top frame at positions corresponding to the loading / unloading station and the cover plate loading station. The data terminals of the two CCD vision sensors are connected to the central control unit. Two electric push rods are installed between the packaging platform and the top frame. A heating element is integrated inside the electric heating tray.

[0010] As a preferred embodiment of the present invention, the transmission system includes two servo motors fixedly mounted on the packaging platform. A gear shaft is rotatably sleeved on the rotating frame. Two third synchronous belts are drivenly connected to the output shafts of the servo motors. The two third synchronous belts are respectively drivenly connected to the gear shaft and the rotating frame. A transmission gear ring is fixedly mounted on the gear shaft. Guide shafts are rotatably connected to the packaging platform at positions corresponding to the dispensing and pressing stations. Driven gears are fixedly mounted on both guide shafts, and both driven gears mesh with the transmission gear rings. Next, upper gears are fixedly installed on both the coupling and the guide shaft in the glue injection station, and the two upper gears mesh in the glue injection station. Lower gears are fixedly installed on both the sleeve shaft and the guide shaft in the press-fitting station, and the two lower gears mesh in the press-fitting station. First bevel gears are fixedly installed on both the second wheel axle and the guide shaft in the glue injection station, and the two first bevel gears mesh orthogonally in the glue injection station. Second bevel gears are fixedly installed on both the first wheel axle and the guide shaft in the press-fitting station, and the two second bevel gears mesh orthogonally in the press-fitting station.

[0011] As a preferred technical solution of the present invention, the pressing assembly includes a pressure plate, a guide rail and an elastic pressure rod are fixedly installed on the top surface of the pressure plate, the guide rail and the elastic pressure rod are slidably connected to the top frame, the cross-section of the elastic pressure rod is T-shaped, a silicone pressure head is rotatably connected to the bottom surface of the pressure plate, and a compression spring is sleeved on the elastic pressure rod at a position corresponding to the position between the pressure plate and the top frame.

[0012] As a preferred technical solution of the present invention, the glue injection assembly includes a glue tank fixedly mounted on the top frame, the top of the glue tank is connected to a glue pump and a glue replenishment valve, the glue pump outlet port is connected to a glue injection pipe, and the glue injection pipe is fixedly connected to the top frame.

[0013] As a preferred technical solution of the present invention, an arc-shaped UV lamp is fixedly installed on the top frame at a position corresponding to the pressing station and the loading / unloading station, and the central angle of the arc-shaped UV lamp is 65°.

[0014] As a preferred technical solution of the present invention, a chip to be packaged is movably installed in the chip positioning slot, and a cover plate mounting slot is opened on the chip to be packaged.

[0015] The beneficial effects of this invention are as follows: 1. This invention solves the problems of uneven glue filling, empty corners, and residual bubbles in traditional chip packaging through a three-dimensional collaborative perturbation mechanism. Specifically, at the glue dispensing station, the oscillating component drives the heated tray to rotate back and forth, while the three guide protrusions with different lift on the wheel drive the material holder to vibrate vertically. The two work together to form a three-dimensional dynamic perturbation field, so that the glue can fully wet the chip surface, corners, and micron-level gaps under the combined action of centrifugal force and vibration. This linkage design not only significantly improves the uniformity of the glue layer and the coverage of the corners, but also accelerates the rise and breakage of bubbles through directional vibration, effectively avoiding the decrease in the strength of the encapsulation layer and the failure of sealing caused by bubbles. Compared with traditional single vibration or static glue dispensing, it achieves a leapfrog improvement in filling effect and reliability.

[0016] 2. This invention introduces a combined action mode of radial centrifugal force and axial pressure in the pressing stage, overcoming the defect of insufficient radial penetration of adhesive in traditional pure axial pressing. During pressing, the transmission system drives the driven shaft and the wheel to rotate unidirectionally, causing the heated platform to rotate continuously. Under the action of centrifugal force, the adhesive extends radially along the chip interface. At the same time, the eccentric cam and the pressing assembly provide controllable axial pressure. The two work together to force the adhesive into the tiny gap between the cover plate and the chip, achieving filling without dead corners. This collaborative pressing mechanism not only ensures that the thickness of the encapsulation layer is highly consistent, but also directionally discharges the trace air bubbles remaining in the dispensing stage during the pressing process. Thus, the process continuity of dispensing and pressing is achieved in terms of structure, avoiding the problem of uneven interlayer caused by adhesive pre-curing. Attached Figure Description

[0017] Figure 1 is a schematic diagram of a packaging device based on electronic component processing; Figure 2 is a schematic diagram of the heated platform and CCD vision sensor; Figure 3 is a partially enlarged schematic diagram of section A in Figure 2; Figure 4 is a partially enlarged schematic diagram of section B in Figure 2; Figure 5 is a schematic diagram of the top frame and guide rail; Figure 6 is a schematic diagram of the chip to be packaged and the cover plate mounting slot; Figure 7 is a cross-sectional schematic diagram of the heated platform and lower gear; Figure 8 is a partially enlarged schematic diagram of section C in Figure 7; Figure 9 is a schematic diagram of the eccentric cam and the second wheel shaft; The list of components represented by each number is as follows: 1. Packaging platform; 2. Rotating frame; 3. Coupling; 4. Driven shaft; 5. Material holder; 6. Sleeve shaft; 7. First wheel shaft; 8. Eccentric cam 9. Second wheel axle; 10. Gear; 11. Guide protrusion; 12. Driven roller; 13. Return spring; 14. Heated support platform; 15. Chip positioning slot; 16. Top frame; 17. Incomplete gear; 18. Swing gear; 19. Support shaft; 20. Central control unit; 21. CCD vision sensor; 22. Electric push rod; 23. Servo motor; 24. Gear shaft; 25. Transmission gear ring; 26. Guide shaft; 27. Driven gear; 28. Upper gear; 29. ​​Lower gear; 30. Pressure plate; 31. Guide rail; 32. Elastic pressure rod; 33. Silicone pressure head; 34. Compression spring; 35. Glue box; 36. Arc-shaped UV lamp; 37. Chip to be packaged; 38. Cover plate mounting slot; 39. Glue injection tube. Detailed Implementation

[0018] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0019] The present invention provides the following preferred embodiments, as shown in Figures 1-9, a packaging device based on electronic component processing, including a packaging stage 1, on which, in a clockwise direction, are sequentially arranged a loading and unloading station, a glue injection station, a cover plate loading station, and a pressing station; the loading and unloading station is used for automatic unloading of the pressed chip and automatic loading of the blank chip 37 to be packaged; multi-axis robotic arms are provided at both the loading and unloading station and the cover plate loading station; the multi-axis robotic arm at the loading and unloading station is used for automatic unloading of the pressed chip and automatic loading of the chip 37 to be packaged; the multi-axis robotic arm at the cover plate loading station is used for automatic loading of the chip packaging cover, and the cover is made of transparent material; the loading and unloading station is equipped with a continuous loading machine for the chip 37 to be packaged and an automatic unloading machine for the packaged finished chip; the cover plate loading station is equipped with an automatic loading machine for the transparent cover; the multi-axis robotic arm at the cover plate loading station can accurately pick up the transparent cover and move it to a designated position, precisely aligned with the cover plate mounting slot 38 of the chip.

[0020] A rotating frame 2 is rotatably connected to a packaging platform 1. Four packaging components are arrayed on the packaging platform 1. Each packaging component includes a coupling 3 rotatably connected to the rotating frame 2, a driven shaft 4, and a material support 5 slidably connected to the rotating frame 2. A sleeve shaft 6 is rotatably sleeved on the coupling 3, and a swinging component that drives the driven shaft 4 to reciprocate is provided on the coupling 3. A first synchronous belt is drivenly connected to the sleeve shaft 6, and the first synchronous belt is drivenly connected to the driven shaft 4. A first wheel shaft 7 is also rotatably connected to the rotating frame 2, and an eccentric cam 8 is fixedly mounted on the first wheel shaft 7. A second wheel shaft 9 is rotatably connected to the first wheel shaft 7. A wheel 10 is fixedly mounted on the second axle 9. Three guide protrusions 11 are arrayed on the wheel 10 along the circumference. A driven roller 12 is rotatably connected to the support frame 5. Both the second axle 9 and the guide protrusions 11 are adapted to the driven roller 12, and the three guide protrusions 11 have different driving strokes for the driven roller 12. A return spring 13 is installed between the support frame 5 and the rotating frame 2. A heated platform 14 driven by a driven shaft 4 is rotatably connected to the support frame 5. A chip positioning slot 15 is formed on the heated platform 14, and a chip to be packaged is movably installed in the chip positioning slot 15. Chip 37, the chip to be packaged has a cover plate mounting groove 38; in a preferred embodiment, the eccentric cam 8 drives the support frame 5 with a stroke of 7mm; the three guide protrusions 11 drive the support frame 5 with strokes of 2mm, 3.5mm and 5mm respectively; in the packaging process, the eccentric cam 8 and the three guide protrusions 11 can work together according to the operation requirements of different stations: at the glue dispensing station, the three guide protrusions 11 alternately drive the support frame 5 to reciprocate and vibrate, and generate different strokes; when the cover plate is pressed, it switches to a fixed stroke; the three guide protrusions 11 Differential lifts of 2mm, 3.5mm, and 5mm are provided respectively. When the material carrier 5 is driven to reciprocate vertically, a gradient disturbance is formed in the chip positioning groove 15. Low-lift vibration achieves a flat surface of adhesive, medium-lift vibration pushes the adhesive to penetrate into the side wall of the cover plate mounting groove 38, and high-lift vibration causes the adhesive to fill the corners and tiny gaps of the groove. Compared with the traditional fixed-station adhesive injection, which relies solely on gravity flow and is prone to accumulating in the center of the groove and leaving the corners empty, this structure can improve the coverage of adhesive in the chip packaging area and avoid the problems of incomplete or missing seals.

[0021] During reciprocating vibration, air bubbles inside the adhesive rise rapidly and burst due to vibration inertia, reducing the residual rate of air bubbles and effectively avoiding potential problems such as insufficient mechanical strength of the encapsulation layer and moisture intrusion caused by air bubbles. At the same time, the vibration amplitude of the differentiated lift is strictly controlled between the effective filling and overflow threshold values. Combined with the constant temperature heating of the electric heating stage 14, it ensures that the adhesive fully wets the chip surface without overflowing the positioning groove due to excessive vibration, eliminating the need for subsequent cleaning processes and improving processing efficiency. The pressing stage adopts a fixed lift design. Compared with the traditional pressure feedback pressing, this structure can ensure that the cover plate pressing depth of each chip is completely achieved. Consistency is significantly improved, enhancing product consistency in mass production. In fixed-lift mode, the eccentric cam 8 provides stable downward pressure support, working in conjunction with the silicone pressure head 33, clamping spring 34, and elastic pressure rod 32 in the pressing assembly to form a composite pressing structure that combines rigid positioning with elastic buffering. When the material carrier 5 moves the chip upward to adhere to the cover plate at a fixed lift, the elastic force of the clamping spring 34 can be adaptively adjusted according to the contact resistance between the cover plate and the adhesive, preventing cover plate breakage or chip pin deformation caused by rigid pressing. At the same time, the fixed lift limits the maximum pressing stroke, preventing damage to the core chip components due to excessive pressing, thus improving the workpiece qualification rate.

[0022] The fixed lift during press-fitting is precisely matched with the adhesive spreading thickness during the dispensing stage. After dispensing, the adhesive layer thickness is adjusted by vibration to complement the press-fitting gap during the fixed lift. During the cover plate pressing process, the adhesive layer can be evenly squeezed to every contact point between the chip and the cover plate interface, forming a gapless bonding. Furthermore, the stable state after press-fitting can be maintained until the chip enters the curing area of ​​the curved UV lamp 36, avoiding bonding offset caused by adhesive flow after press-fitting, and ensuring the structural stability and sealing of the encapsulation layer.

[0023] The oscillating assembly includes two incomplete gears 17 rotatably connected to the rotating frame 2. An oscillating gear 18 is fixedly mounted on the driven shaft 4. The two incomplete gears 17 alternately mesh with the oscillating gear 18. A second synchronous belt is driven and connected to the driven shaft 4, and both incomplete gears 17 are driven and connected to the second synchronous belt. The center angles corresponding to the effective meshing tooth segments on the two incomplete gears 17 are both 60°. The two incomplete gears 17 are symmetrically arranged about the horizontal plane containing the axis of the driven shaft 4. A transmission groove with an open top is opened on the driven shaft 4. A support shaft 19 is fixedly mounted on the bottom surface of the electric heating platform 14. The cross-sections of the support shaft 19 and the transmission groove are both positive. The hexagonal oscillating assembly operates by using a second synchronous belt to drive two symmetrically arranged incomplete gears 17 with an effective meshing tooth segment of 60° to rotate alternately. This, in turn, drives the oscillating gear 18 on the driven shaft 4 to oscillate reciprocally, causing the heated platform 14 to reciprocate with the chip 37 to be packaged. During the glue application process, the oscillating assembly drives the heated platform 14 to achieve a 60° tooth segment-limited reciprocating rotation. The effective meshing tooth segment of the two incomplete gears 17 is limited to 60°, allowing the reciprocating rotation angle of the heated platform 14 to be precisely controlled. During forward rotation, centrifugal force drives the glue to flow along the side wall of the tank to one side corner, utilizing the arc transition of the tank corner to achieve glue application. The wall rises and fills the corner gaps of the tank that are difficult to reach by traditional glue injection, such as the gap between the cover plate mounting slot 38 and the chip pin. When rotating in the reverse direction, the glue quickly switches the flow direction and fills the other side corner under the combined action of inertia and centrifugal force, forming a bidirectional sweeping filling trajectory. Compared with the problem that unidirectional rotation can easily cause glue to accumulate on one side of the tank and leave the other side empty, this reciprocating rotation improves the coverage of the dead corners of the tank by the glue. Due to the alternating meshing of the two incomplete gears 17, the reciprocating rotation of the electric heating platform 14 presents an intermittent rhythm of rotation, pause, reverse rotation, and pause. Moreover, the rotation speed and the glue dispensing speed of the glue injection component are precisely coordinated by the central control unit 20. At the moment the dispensing tube 39 dispenses adhesive, the heated platform 14 rotates synchronously in the forward direction. Under the action of centrifugal force, the adhesive spreads evenly along the radial direction of the chip positioning groove 15, forming an initial uniform adhesive layer. During the dispensing interval, the heated platform 14 rotates in the reverse direction to scrape the spread adhesive layer a second time, correcting the thickness deviation in the initial spreading. The 60° swing angle limitation design avoids the phenomenon of adhesive spillage caused by large-angle rotation. The centrifugal force of the adhesive is always controlled within the boundary range of the positioning groove. At the same time, through intermittent pauses, the adhesive settles naturally after the inertia disappears, ultimately forming a uniform adhesive layer with uniform thickness, providing a preliminary guarantee for the consistency of the encapsulation layer thickness in the subsequent pressing process.

[0024] The reciprocating rotation and the vertical vibration driven by the guide protrusion 11 in the packaging assembly form a three-dimensional disturbance field. The circumferential centrifugal force generated by the rotation causes the tiny bubbles inside the adhesive to gather towards the center of the tank, while the vertical vibration provides an upward driving force for the bubbles. The two work together to accelerate the bubbles to rise and burst. Compared with single vibration or single rotation, the bubble residual rate is reduced, avoiding the hidden dangers of insufficient mechanical strength of the packaging layer and moisture intrusion caused by bubbles. The adhesive flow brought by the reciprocating rotation causes the adhesive to dynamically wet the sidewall of the chip positioning groove 15 and the surface of the chip 37 to be packaged. The adhesive repeatedly washes away the micro dust or oxide layer on the chip surface during the flow, while dynamically filling the micron-level pits on the chip surface, increasing the contact area between the adhesive and the chip, and significantly enhancing the bonding strength between the packaging layer and the chip. The transmission system drives the rotating frame 2 to rotate intermittently, drives the driven shaft 4 to reciprocate and oscillate at the dispensing station and the wheel 10 to rotate, and drives the driven shaft 4 and the wheel 10 to rotate unidirectionally at the pressing station. The transmission system includes two servo motors 2 fixed on the packaging stage 1. 3. A gear shaft 24 is rotatably mounted on the rotating frame 2. Two third synchronous belts are connected to the output shaft of the servo motor 23. The two third synchronous belts are respectively connected to the gear shaft 24 and the rotating frame 2. A transmission gear ring 25 is fixedly mounted on the gear shaft 24. Guide shafts 26 are rotatably connected to the packaging platform 1 at positions corresponding to the glue injection station and the pressing station. Driven gears 27 are fixedly mounted on both guide shafts 26, and both driven gears 27 are meshed with the transmission gear ring 25. Coupling 3 and the guide shaft in the glue injection station Upper gears 28 are fixedly installed on both shafts 26, and the two upper gears 28 mesh in the glue injection station; lower gears 29 are fixedly installed on both shaft 6 and guide shaft 26 in the press-fit station, and the two lower gears 29 mesh in the press-fit station; first bevel gears are fixedly installed on both shaft 9 and guide shaft 26 in the glue injection station, and the two first bevel gears mesh orthogonally in the glue injection station; second bevel gears are fixedly installed on both shaft 7 and guide shaft 26 in the press-fit station, and the two second bevel gears mesh orthogonally in the press-fit station.

[0025] The transmission system uses two servo motors 23 as power sources, which synchronously drive the gear shaft 24 and the rotating frame 2 via a third synchronous belt. The rotating frame 2 achieves intermittent rotation, rotating 90° each time, precisely switching between four workstations. The gear shaft 24 drives the guide shaft 26 of the glue injection station and the pressing station to rotate via the transmission gear ring 25. In the glue injection station, the guide shaft 26 drives the coupling 3 to rotate via the upper gear 28 and drives the second wheel shaft 9 to rotate via the first bevel gear, realizing the coordination between the reciprocating oscillation of the driven shaft 4 and the rotation of the wheel 10. In the pressing station... Positioned, the guide shaft 26 drives the sleeve shaft 6 to rotate via the lower gear 29 and drives the first wheel shaft 7 to rotate via the second bevel gear, realizing the unidirectional rotation of the driven shaft 4 and the wheel 10. The entire system uses a single power source to link multiple components, resulting in a compact structure that eliminates the need for complex multi-power source synchronous control, thus reducing equipment size and energy consumption. During the pressing stage, the cover plate is already bonded to the adhesive surface. The continuous centrifugal force generated by the unidirectional rotation and the axial pressure of the pressing components form a combined radial and axial force field. The centrifugal force drives the adhesive along the chip's fixed direction. The radial outward diffusion of the slot 15, combined with the axial pressure from the fixed lift, forces the adhesive to the micron-level gaps between the cover plate and the chip interface, such as the gap between the chip pins and the cover plate mounting slot 38, and the micron-level pits on the chip surface. This solves the problem of adhesive penetration into corner gaps caused by axial pressure alone in traditional press-fitting. The continuous unidirectional rotation ensures a stable flow trajectory for the adhesive, avoiding backflow that may occur with reciprocating oscillations, and ensuring that the adhesive forms a continuous, uninterrupted encapsulation layer between the cover plate and the chip. Tiny air bubbles remaining during the dispensing stage are directionally driven during the unidirectional rotation of the press-fitting process. Centrifugal force causes the air bubbles to gather radially towards the edge of the slot, while axial pressure squeezes the air bubbles into the gap between the cover plate and the slot. Finally, the air bubbles are directionally discharged from the tiny gaps at the edge of the cover plate, avoiding the problem of air bubbles being pressed into gaps and forming permanent residues in traditional press-fitting. The top frame 16 is height-adjustable and mounted on the encapsulation stage 1. The top frame 16 is equipped with dispensing components at the dispensing station and press-fitting components at the cover plate loading station.

[0026] It also includes a central control unit 20 fixedly installed on the packaging stage 1, and CCD vision sensors 21 installed on the top frame 16 at positions corresponding to the loading and unloading stations and the cover plate loading station. The data terminals of the two CCD vision sensors 21 are connected to the central control unit 20. Two electric push rods 22 are installed between the packaging stage 1 and the top frame 16. Heating elements are integrated in the electric heating tray 14.

[0027] The pressing assembly includes a pressure plate 30. A guide rail 31 and an elastic pressure rod 32 are fixedly installed on the top surface of the pressure plate 30. Both the guide rail 31 and the elastic pressure rod 32 are slidably connected to the top frame 16. The cross-section of the elastic pressure rod 32 is T-shaped. A silicone pressure head 33 is rotatably connected to the bottom surface of the pressure plate 30. A compression spring 34 is sleeved on the elastic pressure rod 32 at a position corresponding to the position between the pressure plate 30 and the top frame 16.

[0028] The glue dispensing assembly includes a glue tank 35 fixedly mounted on the top frame 16. A glue pump and a glue replenishment valve are connected to the top of the glue tank 35. The glue dispensing port of the glue pump is connected to a glue dispensing pipe 39, which is fixedly connected to the top frame 16.

[0029] An arc-shaped UV lamp 36 is fixedly installed on the top frame 16 at the position between the pressing station and the loading / unloading station. The central angle of the arc-shaped UV lamp 36 is 65°.

[0030] The central control unit 20 is the core control module. It receives detection data on chip position and orientation from the CCD vision sensor 21 at the loading and unloading stations, as well as positioning data on the cover plate from the CCD vision sensor 21 at the cover plate loading station. This allows for precise control of the multi-axis robotic arm to complete the loading process, solving the problem of manual positioning deviation. The electric push rod 22 drives the top frame 16 to rise and fall, adapting to the packaging requirements of chips of different thicknesses and improving the equipment's versatility. The core function of the electrically heated platform 14 is to provide a stable constant temperature environment of 50-80℃ through its built-in heating wire, which is essential for the electronic components. The entire encapsulation process works in concert with various components, specifically in two aspects: First, in the dispensing stage, a constant temperature environment reduces the viscosity of the adhesive, improving its fluidity and wettability. Combined with the vertical vibration driven by the guide protrusion 11 of the wheel 10 and the reciprocating rotation of the oscillating component, this helps the adhesive penetrate more quickly into the corners, micron-level pits, and pin gaps of the chip cover mounting slot 38. Simultaneously, it reduces the accumulation or voids caused by uneven adhesive viscosity. Furthermore, gentle heating helps air bubbles inside the adhesive rise and burst, further reducing the residual bubble rate. Second, in the pressing stage, a stable… Maintaining a constant temperature ensures the adhesive maintains suitable fluidity, guaranteeing that during press-fitting, the adhesive evenly fills the interface gap between the cover plate and the chip under axial pressure and radial centrifugal force, forming a gapless bond. This also prevents the adhesive from solidifying due to excessively low temperature, hindering proper extrusion and spreading, or overflowing due to excessively high temperature and excessive flow. The T-shaped elastic pressure bar 32 of the press-fitting assembly, in conjunction with the silicone pressure head 33, provides flexible cushioning during press-fitting, preventing damage to the chip or transparent cover plate. The dispensing assembly precisely controls the dispensing volume through an adhesive pump, and the replenishment valve automatically replenishes the adhesive, ensuring a smooth dispensing process. Continuous and stable; the 65° central angle arc-shaped UV lamp 36 irradiates the pressed chip with ultraviolet light as it moves from the pressing station to the unloading station, causing the adhesive to cure rapidly within 3-5 seconds. No additional curing station is required, shortening the packaging cycle. Moreover, UV curing is more energy-efficient and environmentally friendly than traditional thermal curing, and the cured adhesive layer has higher bonding strength. Through mechatronics integrated design, this solution achieves precise control, flexible operation, and efficient curing of the packaging process, comprehensively improving product quality, production efficiency, and equipment applicability.

[0031] The workflow of this invention revolves around the loading / unloading station, the glue injection station, the cover plate loading station, and the pressing station arranged clockwise on the packaging platform 1. The central control unit 20 coordinates the actions of each component throughout the process: First, at the loading / unloading station, the CCD vision sensor 21 accurately positions the chip 37 to be packaged, and the multi-axis robotic arm moves it to the chip positioning slot 15 of the heating tray 14 of the packaging assembly. The heating tray 14 is connected to the driven shaft 4 via a regular hexagonal support shaft 19. Then, the rotating frame 2 rotates intermittently by 90° under the drive of the transmission system, and the packaging assembly carrying the chip switches stations in sequence. The two servo motors 23 of the transmission system provide adaptive power for different stations through structures such as synchronous belts, gear shafts 24, and guide shafts 26. After reaching the glue injection station, the upper gear 28 is linked with the first bevel gear, driving the coupling shaft 3 to drive the swing assembly to make the heating tray 14 reciprocate. At the same time, the three differentiated lift guide protrusions 11 of the circular wheel 10 drive the material support frame 5 to vibrate vertically. A three-dimensional disturbance field is formed. The glue injection component injects the glue liquid in the glue tank 35 into the chip cover plate mounting groove 38 through the glue injection tube 39 via the glue pump. Under the disturbance, the glue spreads evenly, fills the corners and removes air bubbles. Then, the rotating frame 2 rotates to the cover plate loading station. After positioning by another CCD vision sensor 21, the robotic arm accurately places the transparent cover plate on the chip after glue injection. Then, it enters the pressing station. The lower gear 29 and the second bevel gear are linked to realize the unidirectional rotation of the driven shaft 4 and the wheel 10. The eccentric cam 8, in conjunction with the fixed lift structure, drives the material support frame 5 to move upward. The silicone pressure head 33 of the pressing component completes the cover plate pressing under the flexible buffer of the compression spring 34 and the elastic pressure rod 32. Finally, during the rotation of the rotating frame 2, the arc-shaped UV lamp 36 with a 65° central angle on the top frame 16 quickly cures the pressed chip. After returning to the loading and unloading station, the robotic arm completes the unloading of finished products and the loading of a new round of chips 37 to be packaged, realizing the fully automated and precise operation of electronic component packaging.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging device based on electronic component processing, comprising a packaging stage (1), characterized in that, Along the clockwise direction, there are sequentially arranged loading and unloading stations, glue injection station, cover plate loading station and pressing station; a rotating frame (2) is rotatably connected to the packaging platform (1); four packaging components are arrayed on the packaging platform (1); the packaging components include a coupling (3) rotatably connected to the rotating frame (2), a driven shaft (4) and a material support frame (5) slidably connected to the rotating frame (2), a sleeve shaft (6) is rotatably sleeved on the coupling (3), and a swing component that drives the driven shaft (4) to swing back and forth is provided on the coupling (3). A first synchronous belt is drivenly connected to the sleeve shaft (6), and the first synchronous belt is drivenly connected to the driven shaft (4). A first wheel shaft (7) is also rotatably connected to the rotating frame (2). An eccentric cam (8) is fixedly mounted on the first wheel shaft (7). A second wheel shaft (9) is rotatably connected to the first wheel shaft (7). A round wheel (10) is fixedly mounted on the second wheel shaft (9). Three round wheels (10) are arrayed on the round wheel (10) along the circumferential direction. A driven roller (12) is rotatably connected to the guide protrusion (11) and the material support frame (5). The second wheel shaft (9) and the guide protrusion (11) are both adapted to the driven roller (12), and the three guide protrusions (11) have different driving strokes for the driven roller (12). A return spring (13) is installed between the material support frame (5) and the rotating frame (2). An electric heating platform (14) driven by the driven shaft (4) is rotatably connected to the material support frame (5). (14) has a chip positioning slot (15); the transmission system drives the rotating frame (2) to rotate intermittently, drives the driven shaft (4) to swing back and forth at the glue injection station and the wheel (10) to rotate, and drives the driven shaft (4) and the wheel (10) to rotate unidirectionally at the press-fit station; the top frame (16) is set on the packaging platform (1) in a height-adjustable manner, and the top frame (16) is provided with a glue injection component at the position corresponding to the glue injection station and a press-fit component at the position corresponding to the cover plate loading station.

2. The packaging device based on electronic component processing according to claim 1, characterized in that, The swing assembly includes two incomplete gears (17) rotatably connected to the rotating frame (2), and a swing gear (18) is fixedly installed on the driven shaft (4). The two incomplete gears (17) are alternately meshed with the swing gear (18). A second synchronous belt is drivenly connected to the driven shaft (4), and both incomplete gears (17) are drivenly connected to the second synchronous belt.

3. The packaging device based on electronic component processing according to claim 2, characterized in that, The center angles corresponding to the effective meshing tooth segments on the two incomplete gears (17) are both 60°, and the two incomplete gears (17) are symmetrically arranged with the horizontal plane containing the axis of the driven shaft (4) as the axis.

4. The packaging device based on electronic component processing according to claim 1, characterized in that, The driven shaft (4) has a transmission groove with an open top, and the bottom surface of the electric heating platform (14) is fixedly installed with a support shaft (19). The cross-section of the support shaft (19) and the transmission groove are both regular hexagonal.

5. The packaging device based on electronic component processing according to claim 1, characterized in that, It also includes a central control unit (20) fixedly installed on the packaging platform (1). CCD vision sensors (21) are installed on the top frame (16) at positions corresponding to the loading and unloading stations and the cover plate loading station. The data terminals of the two CCD vision sensors (21) are connected to the central control unit (20). Two electric push rods (22) are installed between the packaging platform (1) and the top frame (16). Heating elements are integrated in the electric heating tray (14).

6. The packaging device based on electronic component processing according to claim 1, characterized in that, The transmission system includes two servo motors (23) fixedly mounted on the packaging platform (1). A gear shaft (24) is rotatably sleeved on the rotating frame (2). Two third synchronous belts are driven to the output shaft of the servo motors (23). The two third synchronous belts are driven to the gear shaft (24) and the rotating frame (2) respectively. A transmission gear ring (25) is fixedly mounted on the gear shaft (24). A guide shaft (26) is rotatably connected to the packaging platform (1) at the positions corresponding to the glue injection station and the press-fit station. A driven gear (27) is fixedly mounted on each of the two guide shafts (26). The two driven gears (27) are meshed with the transmission gear ring (25). Upper gears (28) are fixedly installed on the coupling (3) and the guide shaft (26) in the glue injection station. The two upper gears (28) mesh in the glue injection station. Lower gears (29) are fixedly installed on the sleeve shaft (6) and the guide shaft (26) in the press-fit station. The two lower gears (29) mesh in the press-fit station. First bevel gears are fixedly installed on the second wheel shaft (9) and the guide shaft (26) in the glue injection station. The two first bevel gears mesh orthogonally in the glue injection station. Second bevel gears are fixedly installed on the first wheel shaft (7) and the guide shaft (26) in the press-fit station. The two second bevel gears mesh orthogonally in the press-fit station.

7. A packaging device based on electronic component processing according to claim 1, characterized in that, The pressing assembly includes a pressure plate (30), on the top surface of the pressure plate (30) a guide rail (31) and an elastic pressure rod (32) are fixedly installed, the guide rail (31) and the elastic pressure rod (32) are slidably connected to the top frame (16), the cross-section of the elastic pressure rod (32) is T-shaped, the bottom surface of the pressure plate (30) is rotatably connected to a silicone pressure head (33), and a compression spring (34) is sleeved on the elastic pressure rod (32) at the position corresponding to the position between the pressure plate (30) and the top frame (16).

8. The packaging device based on electronic component processing according to claim 1, characterized in that, The glue injection assembly includes a glue tank (35) fixedly mounted on the top frame (16). The top of the glue tank (35) is connected to a glue pump and a glue replenishment valve. The glue outlet port of the glue pump is connected to a glue injection pipe (39). The glue injection pipe (39) is fixedly connected to the top frame (16).

9. A packaging device based on electronic component processing according to claim 1, characterized in that, An arc-shaped UV lamp (36) is fixedly installed on the top frame (16) at the position between the pressing station and the loading / unloading station. The central angle of the arc-shaped UV lamp (36) is 65°.

10. A packaging device based on electronic component processing according to claim 1, characterized in that, The chip to be packaged (37) is movably installed in the chip positioning slot (15), and the chip to be packaged (37) has a cover plate mounting slot (38).

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