Cooling plate with non-periodic organic mesh cooling channel pattern

Abstract

Cooling plates are described that include an aperiodic organic mesh cooling channel segment pattern that provides more uniform and more efficient cooling performance than in cooling plates having a more regular geometric pattern of cooling channel segments.

Description

[0001] By incorporating via reference The PCT application forms are filed together with this specification as part of this application. Each application identified in the concurrently filed PCT application forms that claims a benefit or priority under this application is incorporated herein by reference in its entirety for all purposes. Background Technology

[0002] Semiconductor manufacturing processes are typically performed in a chamber, where one or more semiconductor wafers are supported on a pedestal during wafer processing operations. Such a pedestal can be positioned below a corresponding gas distribution system (e.g., a nozzle) that can distribute process gases across the entire exposed side of the semiconductor wafer supported by the pedestal. In some examples, such components may require active cooling, for example, via a cooling plate that can be attached to such a component and used to direct heat away from it. Novel cooling plate designs are disclosed herein that provide more efficient and effective cooling performance compared to more conventional designs. Summary of the Invention

[0003] Details of one or more implementations of the subject matter described in this specification are illustrated in the accompanying drawings and the following description. Other features, aspects, and advantages will become apparent from the specification, drawings, and claims.

[0004] In some implementations, an apparatus may be provided comprising: a cooling plate having an inlet, an outlet, a first side, a second side opposite to the first side, and a plurality of first channel segments located between the first side and the second side and within the cooling plate. Each first channel segment may be fluidly connected at a corresponding first end to at least two other first channel segments, and at a corresponding second end opposite to the first end to at least two more fluidly connected to the other first channel segments. The plurality of first channel segments may form a non-periodic organic mesh pattern, providing a plurality of fluid flow paths distributed throughout the cooling area of ​​the cooling plate, the plurality of fluid flow paths being located within the cooling plate and fluidly connecting the inlet and outlet of the cooling plate.

[0005] In some implementations, the cooling plate may also include one or more second channel segments, each second channel segment having a first end that is fluidly connected to one or more of the first channel segments and a second end that is not connected to any other channel segment.

[0006] In some implementations, most of the first channel segment may be located in a first annular region having a first plurality of irregularly shaped pillars distributed therethrough. Each of the first plurality of irregularly shaped pillars may extend between a first inner surface and a second inner surface of the cooling plate, and each first channel segment may be defined by the first inner surface and the second inner surface, and may be located between two of the first plurality of irregularly shaped pillars.

[0007] In some such implementations, at least some of the irregularly shaped columns in the first plurality of irregularly shaped columns may be located only partially within the first annular region.

[0008] In some implementations, the portion of the cooling plate within the first annular region and defined by the first inner surface and the second inner surface may have an average porosity between 40% and 70%.

[0009] In some implementations, the inlet and the outlet may be located in the same quadrant of the first annular region, with a partition wall inserted between the inlet and the outlet, and the partition wall may provide a continuous fluid flow barrier and may extend between the inner periphery and the outer periphery of the first annular region.

[0010] In some such implementations, the inlet may be located near the inner periphery of the first annular region and the outlet may be located near the outer periphery of the first annular region.

[0011] In some implementations, the partition wall may extend radially relative to the central axis of the first annular region.

[0012] In some such implementations, the plurality of first channel segments may comprise a first group of first channel segments, and the first channel segments in the first group of first channel segments may be arranged radially, may extend from the inlet to the outer periphery of the first annular region, and may be adjacent to the partition wall.

[0013] In some such implementations, the plurality of first channel segments may comprise a second group of first channel segments, wherein the first channel segments in the second group may be arranged along one or more paths that may extend at least 50% or more around the area defined by the inner periphery of the first annular region, and the average cross-sectional width of the first channel segments in the second group may be at least 50% greater than the average cross-sectional width of the first channel segments located between the outer periphery of the first annular region and the outermost of the first channel segments in the second group.

[0014] In some such implementations, the cooling plate may include a plurality of first holes extending from the first side, through the cooling plate, and to the second side, and each first hole may extend through one of the first plurality of irregularly shaped columns.

[0015] In some further implementations, the cooling plate may have a cylindrical inner surface surrounding the first annular region and having a diameter larger than the first annular region. The second annular region may be defined by the cylindrical inner surface and the outer periphery of the first annular region. The cylindrical inner surface may also define the outer periphery of a third annular region. The inner periphery of the third annular region may be radially offset inward from the outer periphery of the third annular region by a distance X. At least 70% of the total inner periphery of the third annular region may not intersect with any irregularly shaped column, and X may be greater than 0.25 inches.

[0016] In some such additional implementations, the second annular region may include a second plurality of irregularly shaped pillars, and the cooling plate may include a plurality of second holes extending from the first side, through the cooling plate, and to the second side, and each second hole may be located within one of the second plurality of irregularly shaped pillars.

[0017] In some implementations, the cooling plate may have an opening extending from the first side, through the cooling plate, and reaching the second side.

[0018] In some such implementations, the apparatus may further include: a semiconductor processing chamber; a wafer support positioned within an internal volume of the semiconductor processing chamber; and a nozzle positioned within the internal volume of the semiconductor processing chamber and configured to direct one or more processing gases supplied thereto toward the wafer support. In some such implementations, a cooling plate may contact the surface of the nozzle, and the nozzle may include one or more processing gas inlets positioned within the orifice.

[0019] In some implementations, the apparatus may further include: a semiconductor processing chamber; a wafer support positioned within an internal volume of the semiconductor processing chamber; a nozzle configured to direct one or more processing gases supplied thereto toward the wafer support; and a support column connected to the wafer support and supporting the wafer support within the internal volume of the semiconductor processing chamber. In such an implementation, the support column may pass through the orifice and the cooling plate may contact the wafer support.

[0020] In some implementations, the cooling plate may be circular and may have a diameter of at least 30 cm.

[0021] In some such implementations, the cooling plate may be a continuous part manufactured via additive manufacturing.

[0022] In some implementations, the cooling plate may be assembled from at least two separate layers connected together, wherein at least one of the layers has a plurality of open channels, and when the cooling plate is assembled together, the plurality of open channels are covered by one of the other layers to form the first channel segment.

[0023] In some such implementations, the aperiodic organic network pattern can be defined generatively. Attached Figure Description

[0024] The following figures are referenced in the discussion below; the figures are not intended to limit the scope, but are provided merely for the convenience of the discussion.

[0025] Figure 1 An exemplary cooling plate is depicted according to this disclosure.

[0026] Figure 2 The top surface was removed to allow visibility of the internal configuration. Figure 1 An example cooling plate.

[0027] Figure 3 Depicting Figure 2 The top view of the cross-section shown in the image.

[0028] Figure 4 Depicting Figure 1 A side cross-sectional view of an example cooling plate.

[0029] Figure 5 Depicting Figure 3 A detailed view of the area marked "Detail 5".

[0030] Figure 6 Depicting Figure 3 Detailed view of the area marked "Detail 6".

[0031] Figure 7 Describe and mark different annular areas Figure 3 Top view.

[0032] Figure 8 A schematic diagram depicting a semiconductor processing tool including a cooling plate for cooling the nozzle.

[0033] Figure 9 A schematic diagram depicting a semiconductor processing tool including a cooling plate for cooling wafer supports.

[0034] The accompanying drawings are provided to facilitate understanding of the concepts discussed in this disclosure and to depict some implementations that fall within the scope of this disclosure, but are not intended to be restrictive – implementations that conform to this disclosure but are not depicted in the drawings are still considered to fall within the scope of this disclosure. Detailed Implementation

[0035] As described above, semiconductor wafer processing operations are typically performed on a semiconductor wafer supported in a processing chamber on a pedestal (e.g., a structure typically designed to support the semiconductor wafer from below in a uniformly distributed manner). Processing gases typically flow through a nozzle and are then distributed across the entire semiconductor wafer supported on the wafer support via gas distribution ports distributed across the bottom surface of the nozzle.

[0036] Variations in gas flow rate, temperature, density, and other parameters across the entire surface of a semiconductor wafer during processing can cause corresponding variations in the processing uniformity across the wafer's surface. For example, a decrease or increase in gas flow rate in different regions of the nozzle can result in a decrease or increase in the deposition or etching rate. In another example, depending on the process, variations in the temperature of the processing gas flowing across the entire surface of the semiconductor wafer can also cause variations in the deposited film thickness or etching depth.

[0037] Furthermore, in some semiconductor processing tools, different components may experience high temperatures during wafer processing operations due to processing conditions. For example, in some semiconductor processing tools, processing conditions can be performed at high temperatures and / or generate heat, causing the nozzle and / or wafer support to heat up. In order to maintain the temperature of such components at a desired level, some nozzles and / or wafer supports can be connected to (or include integrated cooling plates), which can be configured to cool the nozzle or wafer support connected thereto (or integrated thereto).

[0038] A typical cooling plate design may have a single channel arranged in a spiral or serpentine pattern, such that all coolant flowing through such a cooling plate traverses a single path across the area to be cooled. However, such a cooling plate may not cool the component requiring cooling in a uniform manner. For example, the portion of the component being cooled may be hotter in areas of the component between adjacent segments of the channels compared to the portion directly beneath them. Such variations in cooling effectiveness can result in uneven temperatures of the cooled component, leading to undesirable variations in processing conditions and consequently, wafer inhomogeneity.

[0039] To address this problem, the inventors of this case designed a novel cooling plate that differs from conventional cooling plate designs. Instead of a single coolant channel following a relatively identifiable path (e.g., a spiral or switch-back pattern), this cooling plate has a large number of first channel segments arranged in a non-periodic organic mesh pattern. Each of these first channel segments may have a first end and a second end opposite to that first end, each of which may be fluidly connected to either the first or second end of another channel segment.

[0040] As implied by the use of the term "organic" above, such patterns may resemble natural network structures or patterns, such as the veins in a leaf, the lighter-colored fur on a giraffe's hide, or the lighter-colored scales on some species of python. Network patterns are those in the form of a net or web, for example, with branching components that may rejoin. Like many naturally occurring patterns, such patterns are typically irregular, non-periodic, or non-repeating. For example, unlike rectangular, circular, or other regular geometric patterns that have repeating instances of the same pattern units and support rotation or tiling, non-periodic patterns cannot form repeating patterns.

[0041] By avoiding the use of one or more cooling channels with regular geometry or arranged in a regular geometric pattern, and instead employing a more "organic" arrangement of cooling channels, cooling plates (such as those discussed here) can provide a more uniform temperature across the entire surface of the cooling plate in contact with the part to be cooled, compared to the temperature in cooling plates with more conventional coolant channel designs (e.g., spiral or serpentine channels). For example, a finite element analysis of a cooling plate similar to the one depicted in the figures can be compared to a similar analysis of a cooling plate with a coolant channel arrangement having a more regular geometry (e.g., a single coolant channel arranged along four concentric circular paths, where the paths slope outward at the ends of each circular path to connect with the starting point of the next larger circular path). In both types of cooling plates, the cooling channels extend across the same area of ​​each cooling plate, and the thickness, diameter, and mounting configuration of the two cooling plates are similar. The dimensions of the area of ​​the cooling plate containing the coolant channels (e.g., the cooling zone) are set to correspond to the area of ​​the part to be cooled.

[0042] This analysis reveals that the maximum temperature variation across the entire cooling area and on the surface in contact with the part being cooled, using a cooling plate (with cooling channels arranged in an organic, non-periodic mesh pattern), is approximately 8°C, while a cooling plate with concentric circular cooling channels exhibits a temperature variation of approximately 15°C in the same area. Therefore, the cooling plate employing this organic arrangement demonstrates approximately 45% better temperature uniformity compared to a cooling plate using a more regular geometric pattern of cooling channels. Furthermore, this organic arrangement of coolant channels in a cooling plate can significantly reduce the pressure drop experienced by the coolant flowing through the cooling channels. For example, the pressure drop of coolant (water) in a cooling plate with an organic coolant channel pattern is more than 73% lower than that in a nested circular coolant channel pattern. This significant improvement in pressure drop compared to more conventional designs allows for a significant reduction in the amount of power required to pump coolant through a cooling plate with such an organically arranged coolant channel. The organic arrangement of cooling channels in the exemplary cooling plate results in a much lower peak temperature in the cooling plate compared to a cooling plate with a more conventional nested circular coolant channel design. For example, the peak temperature in a newer cooling plate design using an organically arranged coolant channel is nearly 44% lower than that of a conventional coolant channel design.

[0043] Cooling plates, such as those discussed here, can be designed generatively, for example, using human guidance coupled with artificial intelligence, where the AI ​​is based on human guidance. Numerous potential designs are iterated and optimized based on core design / design constraints defined by a human designer to arrive at a solution that meets (or most closely approximates) the requirements set by the human designer. In the context of the cooling plates discussed here, specific properties of such designs are discussed below with reference to figures; however, it is understood that specific details of the designs described (e.g., the specific shape of the individual coolant channels, or the actual arrangement of different island or columnar structures between such channels) may vary from design to design—even when the critical conditions and constraints for two such cooling plates are very similar.

[0044] Figure 1 An isometric view of an example cooling plate 212 is depicted according to the disclosure. Figure 2 An exemplary cooling plate 212 is depicted with one side of the cooling plate removed to allow internal features (including numerous irregularly shaped columns and coolant channel segments formed between them) to be visible. Figure 3 An example cooling plate 212 (like) is depicted. Figure 3 A top view (with one side of the cooling plate removed), and Figure 4 Depicting Figure 2 A side cross-sectional view of the cooling plate. Figure 5 and Figure 6 Depicting Figure 3 Detailed view of the corresponding area of ​​the cooling plate 212 indicated in the middle.

[0045] like Figure 1 and 2 As shown, the cooling plate 212 may have an overall shape in the form of a large disk and may have a first side 214 and a second side 216 opposite to the first side 214. The first side 214 and the second side 216 may define the body of the cooling plate. The cooling plate 212 may have an internal volume 202 located between the first side 214 and the second side 216 and at least partially with respect to the first inner surface 218 and the second inner surface 220 (see...). Figure 4 The internal volume 202 can also be defined by a cylindrical inner surface 222 provided by an outer wall 224, and in some examples by another cylindrical inner surface provided by an inner wall 226 (in some implementations, the cooling plate 212 may be circular and non-annular, in which case the cooling plate 212 may not have an inner wall 226). Coolant can be supplied to the internal volume 202 of the cooling plate 212 via inlet 228 and flow out of the internal volume 202 via outlet 230.

[0046] As by Figure 5 and6 As can be seen, the internal volume of the cooling plate 212 may have a large number of irregularly shaped pillars 254 distributed throughout it. Each of the irregularly shaped pillars 254 may extend between the first inner surface 218 and the second inner surface 220 of the cooling plate 212. Figure 5 and 6 In the middle, the irregularly shaped column 254 is indicated by an area with a medium gray dot shadow surrounded by a black solid line boundary.

[0047] Some irregularly shaped pillars 254 may have one or more holes passing through them, for example, holes extending from one side of the cooling plate 212 to the opposite side of the cooling plate 212. A number of first channel segments 232 may be defined in the gaps between adjacent irregularly shaped pillars 254. Each first channel segment may be bounded by the first inner surface and the second inner surface and may be positioned between two of the irregularly shaped pillars 254.

[0048] Each first channel segment 232 may have a first end 232a and a second end 232b opposite to the first end. Figure 5 and 6 In the middle, the first channel segment 232 is indicated by a lighter gray dashed line area bounded by a black dashed line. Figure 5 and 6 In each of the many first channel segments 232 shown, the first ends 232a and the second ends 232b of two of them are referenced using marks. However, to avoid excessive interference, they are not individually marked. Figure 5 and 6 The remaining first channel segment 232 in each of them has a first end 232a and a second end 232b. However, it should be understood that such a first channel segment 232 may still each similarly include a corresponding first end 232a and a corresponding second end 232b.

[0049] Some first channel segments 232 may be quite short, for example, those defined on one or both sides by smaller irregularly shaped pillars 254 or multiple irregularly shaped pillars 254, while others may be much longer, for example, those defined on both sides by larger irregularly shaped pillars. A first end 232a of each first channel segment 232 may be fluidly connected to at least two other first channel segments 232, and a second end 232b may similarly be fluidly connected to at least two other first channel segments 232. As can be seen, the dimensions of the irregularly shaped pillars 254 may vary considerably throughout the interior of the cooling plate 212. Additionally, the gap dimensions between adjacent irregularly shaped pillars 254 may also vary significantly—in some cases, by as much as 200% or 300%.

[0050] As can be seen, the first channel segments 232 can form an interconnected non-periodic organic mesh pattern, which is distributed throughout the cooling area 248 of the cooling plate 212. Figure 4 Clearly, the pattern of the first channel segments 232 is non-repeating and has a unique organic appearance, for example, resembling the way roots might grow, the possible orientation of blood vessels, or the boundaries between skin cells. The network of first channel segments 232 can form multiple fluid flow paths that fluidly connect the inlet 228 to the outlet 230 of the cooling plate 212. A coolant, such as water, perfluorinated compound, inert polyether fluid, or other suitable heat transfer medium, can flow into the cooling plate 212 via the inlet 228 and from the inlet 228 to the first channel segment 232 adjacent to the inlet 228. As the coolant flows through the cooling plate 212 and to the outlet 230, different portions of the coolant can then continue flowing through the remaining first channel segments 232, from one first channel segment 232 to the next.

[0051] In some implementations, there may also be one or more second channel segments 234, each having a first end 234a and a second end 234b. The first end 234a of each second channel segment 234 may be fluidly connected to one or more first channel segments 232. However, the second end 234b of each second channel segment 234 is not connected to any other channel segment. Therefore, each second channel segment 234 is effectively a dead-end channel. Such a second channel segment 234 can be considered a small, localized reflux zone—there may be no net fluid transport through such a second channel segment 234, but despite this, there may still be localized turbulent mixing in such a second channel segment 234, which causes an increase in heat transfer from the cooling plate 212 to the cooling fluid. Figure 5 and 6 In the middle, the second channel segment 234 is indicated by a darker gray dashed line area bounded by a black dashed line. Figure 5 and 6 In each of the second channel segments 234 shown, the first end 234a and the second end 234b are referenced using marks. However, like the first channel segment 232, Figure 5 and 6 The first ends 234a and 234b of the remaining second channel segments 234 in each of them are not individually labeled. However, it is understood that such second channel segments 234 may still each similarly include a corresponding first end 234a and a corresponding second end 234b.

[0052] The discussion below explores specific areas or zones of this cooling plate. Figure 7 repeat Figure 3However, the discussion below refers to several annular regions. Figure 7 As can be seen, a first annular region 240 comprising a plurality of irregularly shaped pillars 254 can be defined. This first annular region can be defined by an inner periphery 240a and an outer periphery 240b.

[0053] The first annular region 240 may encompass most of the cooling area of ​​the cooling plate 212, and therefore the first plurality of irregularly shaped pillars 254 may encompass most of the irregularly shaped pillars 254. Furthermore, most of the first channel segment 232 may also be located within the first annular region 240. It should be understood that some of the irregularly shaped pillars 254 within the first annular region 240 may only be partially located within the first annular region 240.

[0054] The majority of the fluid flow through the cooling plate 212 can occur in the first annular region 240. Therefore, different characteristics of the first channel segment 232 in the first annular region 240 can influence the majority of the fluid flow through the cooling plate 212. Different aspects of such characteristics are discussed below.

[0055] As can be seen, the cooling plate 212 may exhibit a relatively porous structure, for example, having a large number of small channels or flow paths through it. Therefore, the portion of this cooling plate between the first inner surface 218 and the second inner surface 220 and within the first annular region 240 may have an average porosity, which in some implementations is between 40% and 70%. In some implementations, such porosity can be distributed relatively uniformly throughout the cooling area of ​​the cooling plate 212; for example, the cooling plate 212 may exhibit an average porosity within this range per cubic inch.

[0056] The first annular zone 240 may also include (refer to again) Figure 3 The partition wall 256 (see example) is located in quadrant 250 of the first annular zone 240, which also includes entrance 228 and exit 230. Figure 2 , 3 (and 6). The baffle wall 256 may be inserted between the inlet 228 and the outlet 230 and may provide a continuous barrier for fluid flow in the first annular region 240. For example, the baffle wall 256 may extend between the inner periphery 240a and the outer periphery 240b of the first annular region 240. In some implementations, as depicted, the baffle wall 256 may extend radially relative to the central axis 252 of the first annular region 240.

[0057] In some implementation schemes, such as Figure 3As shown, inlet 228 is located near the inner periphery 240a of the first annular region 240, and outlet 230 is located near the outer periphery 240b of the first annular region 240. This positioning, combined with partition wall 256, allows coolant flowing in through inlet 228 to flow circumferentially through cooling plate 212, and also at least partially radially outward, thereby distributing coolant throughout the entire internal volume 202 of cooling plate 212.

[0058] In some implementations, the first channel segment 232 may comprise a first group 236 of first channel segments 232 arranged radially, extending from the inlet 228 to the outer periphery 240b of the first annular region 240, and adjacent to the partition wall 256. Figure 3 The shaded area with a black dashed border indicates the region where the first channel segment 232 of the first group 236 is located in the example cooling plate 212. The first channel segment 232 is not... Figure 3 It shows, but Figure 6 The image shows a portion of the first channel segment 232 of the first group 236, wherein the first channel segment 232 is individually indicated. The first channel segment 232 of the first group 236 may, for example, have a width greater than most (if not all) of the width of the first channel segment 232 in the first annular region 240, and may be used to provide a radial channel that allows a portion of the coolant flowing in from the inlet 228 to flow easily radially outward to reach the first channel segment 232 near the outer periphery 240b of the first annular region 240.

[0059] In some such implementations, there may also be a second group of 238 with a first channel segment 232. Figure 3 The shaded area with a black dashed border indicates the region where the first channel segment 232 of the second group 238 is located in the example cooling plate 212. As mentioned above, the first channel segment 232 is not in... Figure 3 As shown in the image, but part of the first channel segment 232 of the second group 238 is... Figure 6 As shown in the image, the first channel segment 232 is indicated separately within it.

[0060] The first channel segment 232 in the second group 238 may be arranged along one or more paths that extend around at least 50% or more of the area defined by the inner periphery 240a of the first annular region 240. For example... Figure 3As can be seen, the first channel segment 232 of the second group 238 extends along a slightly irregular but generally arcuate path, which begins at the entrance 228, extends around the center of the first annular region 240, and sometimes splits around the inner periphery 240a of the first annular region 240 (and sometimes rejoins). The first channel segment 232 of the second group 238 may have an average cross-sectional width that is at least 50% larger than the average cross-sectional width of the first channel segment 232 located between the outer periphery 240b of the first annular region 240 and the outermost of the first channel segment 232 of the second group 238. The first channel segment 232 in the second group 238 can be used to provide a main flow channel, which functions similarly to the first channel segment 232 in the first group 236 in terms of radial flow, and provides a flow path with reduced flow resistance, which allows a portion of the coolant introduced into the inlet 228 to flow radially inward or outward for a certain distance before flowing into the first channel segment 232 in the second group 238, circumferentially around the interior of the first annular region 240.

[0061] As described above, in some implementations, irregularly shaped posts 254 may have through holes therein. Threaded fasteners such as socket-head cap screws can be inserted into such through holes and can be used, for example, to clamp the cooling plate 212 to, for example, a nozzle or wafer support to maintain good thermal contact with the nozzle or wafer support and maximize the heat transferred from such components to the cooling plate 212.

[0062] For example, the first annular region 240 may have a plurality of first holes 260 extending from the first side 214, through the cooling plate 212, and to the second side 216. Each first hole 260 may extend through one of the first plurality of irregularly shaped pillars 254. The first holes 260 may be arranged, for example, in a pattern of circular holes (e.g., 8, 10, 12 (as shown), 14, 16 holes, etc.). In some cases, there may be a pattern of multiple circular holes 260. For example, there may be a first circular pattern of first holes 260 located approximately in the middle of the first annular region 240, and a second plurality of first holes 260 located near the inner periphery 240a of the first annular region 240. Such an implementation provides a large number of attachment points from the cooling plate 212 to the component to be cooled, thereby helping to ensure a more uniform heat transfer between the component to be cooled and the cooling plate 212.

[0063] like Figure 7As shown, the cooling plate 212 may also have a second annular region 242 having an inner periphery 242a defined by the outer periphery 240b of the first annular region 240. The second annular region 242 may also have an outer periphery 242b defined by the cylindrical inner surface 258 of the cooling plate 212. This cylindrical inner surface 258 may surround the first annular region 240 and generally define the outermost inner wall of the internal volume 202.

[0064] The cylindrical inner surface 258 may also define the outer periphery 244b of the third annular region 244. The third annular region 244 may have an inner periphery 244a that is radially offset inward from the outer periphery 244b of the third annular region 244 by a distance X (which may be greater than 0.25 inches). In some implementations, at least 70% of the total inner periphery 244a of the third annular region 244 does not intersect with any irregularly shaped pillar 254. For example, the third annular region 244 may include at least portions of a plurality of irregularly shaped pillars 254 from a second plurality of irregularly shaped pillars 254. The cooling plate 212 may also include a plurality of second holes 262, each second hole 262 extending from the first side 214, through the cooling plate 212, and reaching the second side 216. Each such second hole 262 may pass through one of the irregularly shaped pillars of the second plurality of irregularly shaped pillars 254. However, the gaps in the third annular region 244 between the multiple irregularly shaped pillars 254 through which the second hole 262 passes may not have irregularly shaped pillars 254, thus creating a flow path along the periphery of the internal volume 202, which may have lower flow resistance than the flow resistance that may be found in most of the first channel section 232. Such a flow path can also help distribute coolant throughout the internal volume 202 of the cooling plate and can also provide preferred temperature uniformity and / or a smaller pressure drop in the cooling plate 212.

[0065] Figure 7 The fourth annular region 246 is also depicted. The fourth annular region 246 has an inner periphery 246a defined by the inner wall 226 and an outer periphery 246b defined by the inner periphery 240a of the first annular region 240. In this particular example, the fourth annular region includes a small gap extending around the periphery of the inner wall 226, thereby providing a first channel segment that allows at least a small amount of fluid flow around the orifice 266, including flow through the partition wall 256. Such a gap helps ensure at least some fluid flow even near the end of the partition wall 256, thus avoiding possible flow stagnation near that end of the partition wall 256. However, such a gap may be quite small and have relatively high flow resistance, causing most of the coolant circulation to pass through the internal volume 202 rather than flowing through the network of first channel segments 232 distributed throughout the internal volume 202.

[0066] In some implementations, the cooling plate 212 may include an aperture 266 that extends from the first side 214 through the cooling plate 212 and reaches the second side 216. The aperture 266 may, for example, be used to provide access to a process gas inlet on the nozzle, or through which a support post of the wafer support can pass.

[0067] In some implementations, at least a portion of one or more flow paths in the cooling plate is dendritic, i.e., these flow paths are branched. In some cases, the downstream branches have a smaller cross-sectional area than the upstream branches. The conductivity of a portion of the flow path in a dendritic structure may decrease as the flow path branches. In some cases, the dendritic flow path has a single upstream portion that branches into multiple downstream branches, for example, three or more downstream branches. The dendritic portion of the flow path sometimes branches in a tree-like manner. The branches of the dendritic flow path can sometimes be the flow channel segments described herein.

[0068] In some implementations, the flow path within the cooling plate has islands. For example, the flow path may begin (upstream) to branch into multiple channels and then (downstream) merge. The flow exclusion area between the upstream branch point and the downstream merge point can be considered as an island.

[0069] In some implementations, the combination of all flow paths within the cooling plate results in the cooling fluid flowing in a generally spiral trajectory. For example, the fluid in the cooling plate may typically flow in a spiral direction, sometimes starting near the center of the cooling plate and spiraling outwards toward the edge of the cooling plate.

[0070] In some implementations, the cooling plate has a single inlet through which all cooling fluid flows. In other implementations, the cooling plate may also have a single outlet from which fluid exits. Between the inlet and the outlet, the flow channels may branch and recombine in a certain arrangement, which may be dendritic and / or may include one or more islands.

[0071] In some implementations, the cooling plate includes one or more structural elements through which cooling fluid cannot flow. For example, the cooling plate includes a baffle in the form of a generally radially oriented barrier. As another example, the cooling plate may include one or more plug holes. In some implementations, the cooling plate has an external exclusion region (at the periphery of the cooling plate) through which cooling fluid cannot flow. In some cases, this external exclusion region is about 0.1 to 0.4 inches wide (in the radial direction).

[0072] While corrosion-resistant materials with good thermal conductivity (e.g., stainless steel or aluminum alloys) may be preferred to facilitate efficient heat transfer and cooling via the cooling plate while resisting potential erosion effects due to the use of some fluid coolant, the cooling plates discussed herein can generally be made of any suitable material. Although the structure of such cooling plates and the arrangement of irregularly shaped columns and first channel segments (and second channel segments, if any) contained within them may make them particularly suitable for manufacture via additive manufacturing processes, such cooling plates can be manufactured by any suitable process. For example, such cooling plates can be manufactured using selective laser melting (SLM) or direct metal laser melting (DMLM), both of which can be used to manufacture metal parts.

[0073] In most additive manufacturing processes, parts are built up layer by layer by adding one horizontal layer of material at a time; such layers can be very thin, for example, 0.02 mm at a time for DMLM parts. In DMLM, for example, a platform supporting the part is gradually lowered relative to a reference plane. This platform forms the "floor" of a cavity that houses the part being manufactured. Each time the platform is lowered, powdered material is added to the cavity and then leveled to be flush with the reference plane. Next, a laser scans the entire reference plane and applies heat to the top layer of powdered material in the area where the structure needs to be formed, fusing the powder particles together with each other and with any previously fused structures below. Once a particular layer is complete, the platform can be lowered slightly, a new layer of powdered material can be applied, and the laser melting process can be repeated. This process is repeated until the part is complete, at which point the cavity of the DMLM device will be filled with unmelted powdered material, embedding the additively manufactured part.

[0074] Using such additive manufacturing techniques allows for the creation of cooling plate geometries that are difficult to achieve using only conventional machining (subtractive machining) techniques (such as milling, drilling, or turning). For example, the aforementioned cooling plate can be milled into a material plate using conventional subtractive machining operations, and the resulting part can then be joined to another plate to "cover" the open channels machined into the first plate. However, milling such channels can be time-consuming and challenging because some channels may be quite thin and their depth may be several times greater than their width, thus requiring the use of end mills with very small diameters (e.g., less than millimeters), which are prone to breakage and / or require very low feed rates (thus increasing the manufacturing cost of the part).

[0075] If additively manufactured, the cooling plate can be simply printed as a single, continuous part, allowing the manufacture of such small features without relying on easily broken, small-diameter end mills. In such an implementation, the entire cooling plate can be manufactured using additive manufacturing, or alternatively, portions of the cooling plate, such as one side of the plate and irregularly shaped pillars and first channel segments, can be manufactured via additive manufacturing. In the latter case, the resulting additively manufactured part can undergo subtractive machining after additive manufacturing, such as face milling, to mill away approximately a few thousandths of an inch of thickness from the top of the surface, within which channels defining the irregularly shaped pillars and first channel segments are formed. This surface can then be bonded to a plate to cover these features and form these first channel segments, similar to the assembly process for a subtractively manufactured cooling plate. In an additively manufactured cooling plate, once additive manufacturing is complete, metal powder trapped in the cooling plate can be removed using various techniques, such as vibrating the cooling plate to cause most of the powder to drain away through the inlet and outlet. Compressed air can be flowed through the cooling plate (from inlet to outlet and / or vice versa) to flush away any powder that may remain in the cooling plate. If the cooling plate includes a second channel segment (a dead end), holes can be drilled within the cooling plate at locations corresponding to the dead ends of such a second channel segment, allowing powder in such a second channel segment to be flushed out through these holes. These holes can then be filled with plugs, such as welds or brazed bolts, to reseal the second channel segment.

[0076] As described above, the cooling plate discussed herein can be designed using a combination of human-guided and computer-guided generative design. For example, human designers can select and define various characteristics of such a cooling plate, such as the location of the through-holes, the overall dimensions of the cooling plate and the cooling area therein, the location of the inlet and / or outlet, the presence or absence of an orifice at the center of the cooling plate, etc. Human designers can define various parameters, such as the expected heat flux into the surface or region of the cooling plate, the expected flow rate of the coolant, the material properties of the coolant (e.g., density, viscosity, thermal conductivity, and specific heat), the material properties of the cooling plate itself (e.g., thermal conductivity, specific heat, etc.), the cross-sectional area of ​​the inlet and / or outlet, etc.

[0077] For example, Figures 2 to 7The cooling plate shown is specified as being made of stainless steel and defined as having a cooling zone with a diameter of approximately 21 cm. This cooling zone is defined as having a heat flux of approximately 1400 W / m² entering it, and the coolant flow rate is defined as 2 gallons per minute. The locations of the through-holes, inlets, and outlets, as well as the overall shape of the cooling plate (an annular plate of a specific thickness, e.g., a plate with a diameter greater than 30 cm, such as a plate with a diameter of approximately 40 cm, a thickness of approximately 1.25 cm to 2 cm, and a central opening with a diameter of approximately 7.5 cm to 10 cm), are also specified by a human designer.

[0078] After defining parameters such as those described above, human designers can use generative design algorithms to iterate over a large number of design variants, with each iteration involving, for example, coupled fluid-thermal computational fluid dynamics (CFD) analysis. The results of such coupled fluid-thermal CFD analysis can then be analyzed to identify design variants that, under a given set of input conditions, offer, for example, better temperature uniformity and / or lower peak temperatures and / or reduced and minimized pressure drops compared to other variants. Such algorithms can then iterate over further design variants based on previous design variants that offer better temperature uniformity and / or lower peak temperatures. These further design variants can be evaluated using the same CFD analysis, and design variants that further improve upon these parameters can be identified. The generative design algorithm can continue iterating in this manner until one or more design variants are identified that meet (or come closest to) the objectives established for the design under discussion, such as temperature uniformity throughout the cooling region within a predetermined range and / or peak temperatures below a specific target threshold and / or pressure drops below a specific target threshold or minimized pressure drops in the coolant. The process (i.e., modifying each design variant, analyzing it, and then comparing the analysis results with those for other design variants and identifying the design variant that performs best in terms of the objective defined by the generative design algorithm, and then repeating this process to explore further design variants) can be fully automated, enabling human designers to explore a larger potential design space that was previously difficult to cover in real-world situations.

[0079] It should be understood that cooling plates, such as the cooling plate discussed herein, can also be used for heating elements. For example, a nozzle coupled to such a cooling plate can be heated to a target temperature by introducing heating fluid into the inlet and through these first channel sections to the outlet. The temperature uniformity achieved during cooling operations using such a cooling plate is likely to be equally evident during heating operations using such a cooling plate. For example, for a cooling plate attached to a nozzle, heating fluid introduced at a high temperature into the inlet can flow through these first channel sections to heat the cooling plate (and nozzle) to a specific temperature required to initiate an exothermic semiconductor processing operation, but then, once the processing operation begins and the heat from the processing operation is greater than sufficient to maintain the nozzle at that high temperature, it can be replaced with a lower-temperature coolant. In such a case, the heat generated by the exothermic reaction, if left uncontrolled, could eventually cause the nozzle temperature to exceed the temperature range specified for the process. However, such a temperature can be controlled by converting the flow rate of the hot fluid flowing through the cooling plate into the flow rate of a low-temperature coolant flowing through the cooling plate.

[0080] As mentioned above, the cooling plate discussed herein can be used to cool and / or heat another component, such as a nozzle or wafer support. Figure 8 and 9 A schematic diagram of a semiconductor processing tool is depicted, which uses a cooling plate, such as the cooling plate discussed above, to cool different components of such a tool.

[0081] Figure 8 A schematic diagram of a semiconductor processing tool including a cooling plate for nozzle cooling is depicted. As can be seen, the semiconductor processing tool may include a semiconductor processing chamber 200, which can be engaged with a nozzle 204. In this case, the nozzle 204 is a flush-mounted nozzle and has one or more inflatable sections internally, each inflatable section being fluidly connected to a plurality of gas distribution ports 203. Processing gases for semiconductor processing operations can flow into the nozzle 204 via a valve manifold 205, which in turn can be fluidly connected to one or more processing gas sources (not shown). The semiconductor processing chamber 200 may also include a wafer support 208 therein, which can be supported within the semiconductor processing chamber 200 by support pillars 210. The wafer support 208 can support a semiconductor wafer 201 during wafer processing operations.

[0082] exist Figure 8In this implementation, the nozzle 204 has a top surface coupled to the cooling plate 212. For example, the nozzle 204 may have multiple threaded holes in this top surface, which can receive threaded fasteners that can be inserted into a first hole 260 and a second hole 262 for clamping the cooling plate 212 to the nozzle 204. The inlet 228 and outlet 230 of the cooling plate 212 may be coupled to a cooling fluid (and / or heating fluid) source, which may be configured to circulate heat exchange fluid through the cooling plate 212 at a specific temperature to adjust the temperature of the cooling plate 212 to a desired level.

[0083] Figure 9 A schematic diagram of a semiconductor processing tool including a cooling plate for cooling wafer supports is depicted. Figure 9 Semiconductor processing tools and Figure 8 The semiconductor processing tools are similar, and regarding Figure 8 The descriptions of the components shown also apply to Figure 9 In addition to what is visible, the wafer support 208 also has a bottom surface coupled to the cooling plate 212. For example, the wafer support 208 may have a plurality of screw holes in the bottom surface, which receive threaded fasteners that can be inserted into the first hole 260 and the second hole 262 and are used to clamp the cooling plate 212 to the wafer support 208.

[0084] It should also be understood that the cooling plate discussed herein may also be integrally formed with the component it cools (or heats). For example, the internal volume 202 of the cooling plate 212 (and all features therein) may be integrated into the nozzle or wafer support, thereby improving the heat transfer efficiency into (or out of) the cooling plate 212 by removing the thermal contact interface.

[0085] Such semiconductor processing tools may also include (or be connected to) controllers that can be configured to control the various functionalities associated with such semiconductor processing tools. Depending on the processing requirements and / or system type, the controllers can be programmed to control any of the processes disclosed herein, such as processes for controlling the flow of coolant (or heating fluid) through a cooling plate, as well as other processes or parameters not discussed herein, such as the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer chambers and other transfer tools, and / or loading locks that are connected to or docked with a specific system.

[0086] In a broad sense, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software for receiving instructions, issuing instructions, controlling operations, enabling cleaning operations, enabling endpoint measurements, etc. Integrated circuits can include chips in the form of firmware storing program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions can be instructions sent to the controller in the form of various individual settings (or program files), which define operating parameters for performing specific processes on or for a semiconductor wafer or system. In some embodiments, operating parameters can be part of a recipe defined by a processing engineer to complete one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0087] In some implementations, the controller may be part of or coupled to a computer integrated with, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or be all or part of a fab host system, allowing remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance criteria of multiple manufacturing operations, change parameters of the current process, set processing steps to follow the current process, or initiate a new process. In some examples, a remote computer (e.g., a server) may provide processing recipes to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool to which the controller is configured to interface with or control the tool. Therefore, as described above, a controller can be distributed, for example, by comprising one or more discrete controllers networked together and operating toward a common purpose, such as the processing and control described herein. An example of a distributed controller for such a purpose is one or more integrated circuits located in a room that communicate with one or more integrated circuits remotely (e.g., at the platform level or as part of a remote computer), which together control processing in the room.

[0088] Exemplary cooling plates according to this disclosure may be installed in, but not limited to, a semiconductor processing tool or part of a semiconductor processing tool having a plasma etching chamber or module, a deposition chamber or module, a rotary rinsing chamber or module, a metal plating chamber or module, a cleaning chamber or module, a chamfering edge etching chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etching (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that may be associated with or used for the manufacture and / or preparation of semiconductor wafers.

[0089] As described above, depending on one or more processing steps to be performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the plant, a host computer, another controller, or tools used in the transport of materials to and from the tool location and / or loading port in the semiconductor manufacturing plant.

[0090] Any ordinal designations used in this disclosure and claims (if any), such as (a), (b), (c)... or (1), (2), (3)... or similar, should be understood not to express any particular order or sequence unless such order or sequence is expressly indicated. For example, if there are three steps labeled (i), (ii), and (iii), it should be understood that the steps may be performed in any order (or even simultaneously, if there are no other restrictions), unless otherwise specified. For example, if step (ii) involves the operation of an element produced in step (i), then step (ii) can be considered to occur at some point after step (i). Similarly, if step (i) involves the operation of an element produced in step (ii), it should be understood to be the opposite. It should also be understood that the use of the ordinal designation “first” (e.g., “first item”) herein should not be construed as implying or inherently suggesting that there must be a “second” case (e.g., “second item”).

[0091] It should be understood that the phrases “for each of one or more items,” “for each of one or more items,” etc., if used herein, include both single-item groups and multi-item groups; that is, the use of the phrase “for each” means that it is used in programming languages ​​to refer to each item in any group of items referenced. For example, if the group of items referenced is a single item, “each” will refer only to that single item (although the dictionary definition of “each” often defines the term as “each of two or more things”), and does not mean that there must be at least two of these items. Similarly, the terms “set” or “subset” should not be considered by themselves to necessarily cover multiple items—it should be understood that a set or subset may cover only one or more members (unless the context otherwise indicates otherwise).

[0092] Unless otherwise specified, when the term “between” is used in conjunction with a range of numbers as used herein, it should be understood to include both the beginning and end of the range. For example, “between 1 and 5” should be understood to include the numbers 1, 2, 3, 4, and 5, and not just the numbers 2, 3, and 4.

[0093] The term "operably connected" should be understood to refer to a state in which two components and / or systems are directly or indirectly connected so that, for example, at least one component or system can control the other. For example, a controller can be described as operably connected to a resistance heating unit, comprising a controller connected to a sub-controller of the resistance heating unit, the sub-controller being electrically connected to a relay configured to controllably connect or disconnect the resistance heating unit from a power source capable of supplying electrical power to the resistance heating unit to produce a desired degree of heating. Because current is involved, the controller itself may not be able to directly supply such power to the resistance heating unit, but it should be understood that the controller is still operably connected to the resistance heating unit.

[0094] For the purposes of this disclosure, the term "fluid connection" is used to describe volumes, air chambers, orifices, etc., which may be connected to each other directly or through one or more intermediate components or volumes to form a fluid connection, similar to the term "electrical connection" used to describe components connected together to form an electrical connection. However, in the context of discussing the first and second channel segments in this application, it should be understood that when referring to such a channel segment that is fluidly connected to other channel segments, such a fluid connection should be understood as a direct coupling between these channel segments, for example, the end of such a channel segment being directly connected to the end of another channel segment (rather than being connected to such other channel segments via one or more other intermediate channel segments). The term "fluid insertion" (if used) can be used to refer to a component, volume, chamber, or orifice that is fluidly connected to at least two other components, volumes, chambers, or orifices such that fluid flowing from one of those other components, volumes, chambers, or orifices to another of those components, volumes, chambers, or orifices will first flow through the "fluid-inserted" component and then reach the other of those components, volumes, chambers, or orifices. For example, if a pump is fluidly inserted between a reservoir and an outlet, fluid flowing from the reservoir to the outlet will first flow through the pump and then reach the outlet. The term "fluid adjacency" (if used) refers to the placement of one fluid element relative to another fluid element such that no possible structure could be fluidly inserted between the two elements that could interrupt the fluid flow between the two fluid elements. For example, in a flow path having a first valve, a second valve, and a third valve arranged sequentially along it, the first valve is fluid adjacent to the second valve, the second valve is fluid adjacent to both the first and third valves, and the third valve is fluid adjacent to the second valve.

[0095] It should be understood that the examples and implementations described herein are for illustrative purposes only, and various modifications or variations will arise in the minds of those skilled in the art based on them. Although various details have been omitted for clarity, various design alternatives may be implemented. Therefore, the examples presented herein are to be considered illustrative rather than restrictive, and this disclosure is not limited to the details set forth herein, but rather can be modified within the scope of this disclosure.

[0096] It should be understood that while the above disclosure focuses on one or more specific exemplary implementations, it is not limited to the examples discussed, but can also be applied to similar variations and mechanisms, and such similar variations and mechanisms are also considered to fall within the scope of this disclosure.

Claims

1. An apparatus comprising: A cooling plate having an inlet, an outlet, a first side, a second side opposite to the first side, and a plurality of first channel segments located between the first side and the second side and inside the cooling plate, wherein: Each first channel segment is fluidly connected at its corresponding first end to at least two other first channel segments, and is fluidly connected at its corresponding second end, opposite to the first end, to at least two more of the other first channel segments. The plurality of first channel segments form an aperiodic organic mesh pattern, which provides a plurality of fluid flow paths distributed throughout the cooling area of ​​the cooling plate, the plurality of fluid flow paths being located in the cooling plate and fluidly connecting the inlet and outlet of the cooling plate.

2. The apparatus of claim 1, wherein the cooling plate further comprises one or more second channel segments, each second channel segment having a first end in fluid connection with one or more of the first channel segments and a second end not connected to any other channel segment.

3. The apparatus according to claim 1 or 2, wherein: Most of the first channel segment is located in the first annular region, which has a plurality of irregularly shaped pillars distributed throughout it. Each of the first plurality of irregularly shaped columns extends between the first inner surface and the second inner surface of the cooling plate, and Each first channel segment is defined by the first inner surface and the second inner surface, and is located between two of the first plurality of irregularly shaped columns.

4. The apparatus of claim 3, wherein at least some of the irregularly shaped columns of the first plurality of irregularly shaped columns are located only partially within the first annular region.

5. The apparatus of claim 3 or 4, wherein the portion of the cooling plate within the first annular region and defined by the first inner surface and the second inner surface has an average porosity between 40% and 70%.

6. The apparatus according to any one of claims 3 to 5, wherein: The entrance and the exit are located in the same quadrant of the first annular region. The partition wall is inserted between the inlet and the outlet, and The partition wall provides a continuous fluid flow barrier and extends between the inner periphery of the first annular region and the outer periphery of the first annular region.

7. The apparatus of claim 6, wherein the inlet is located near the inner periphery of the first annular region and the outlet is located near the outer periphery of the first annular region.

8. The apparatus of claim 6 or 7, wherein the partition wall extends radially relative to the central axis of the first annular region.

9. The apparatus according to claim 8, wherein: The plurality of first channel segments include the first channel segments of the first group, and The first channel segment in the first group is arranged radially, extends from the entrance to the outer periphery of the first annular area, and is adjacent to the partition wall.

10. The apparatus according to claim 9, wherein: The plurality of first channel segments includes the first channel segments of the second group. The first channel segments in the second group are arranged along one or more paths, which extend at least 50% or more around the area defined by the inner periphery of the first annular region. The average cross-sectional width of the first channel segment in the second group is at least 50% greater than the average cross-sectional width of the first channel segment located between the outer periphery of the first annular region and the outermost of the first channel segments in the second group.

11. The apparatus according to claim 10, wherein: The cooling plate includes a plurality of first holes that extend from the first side, pass through the cooling plate, and reach the second side, and Each first hole extends through one of the first plurality of irregularly shaped columns.

12. The apparatus according to claim 11, wherein: The cooling plate has a cylindrical inner surface that surrounds the first annular region and has a diameter larger than the first annular region. The second annular region is defined by the inner surface of the cylinder and the outer periphery of the first annular region. The cylindrical inner surface also defines the outer periphery of the third annular region. The inner periphery of the third annular region is radially offset inward by a distance X from the outer periphery of the third annular region. At least 70% of the inner periphery of the third annular region does not intersect with any irregularly shaped pillars, and X is greater than 0.25 inches.

13. The apparatus according to claim 12, wherein: The second annular region contains a second plurality of irregularly shaped pillars. The cooling plate includes a plurality of second holes that extend from the first side, pass through the cooling plate, and reach the second side. Each second hole is located within one of the irregularly shaped columns of the second plurality of irregularly shaped columns.

14. The apparatus according to any one of claims 1 to 13, wherein the cooling plate has an opening extending from the first side, through the cooling plate, and reaching the second side.

15. The apparatus of claim 14, further comprising: Semiconductor processing room; A wafer support, positioned within the internal volume of the semiconductor processing chamber; and A nozzle, positioned within the internal volume of the semiconductor processing chamber and configured to direct one or more processing gases supplied thereto toward the wafer support, wherein: The cooling plate is in contact with the surface of the nozzle, and The nozzle includes one or more processing gas inlets located within the orifice.

16. The apparatus of claim 14, further comprising: Semiconductor processing room; A wafer support, positioned within the internal volume of the semiconductor processing chamber; A nozzle configured to direct one or more processing gases supplied thereto toward the wafer support; and A support post, which is connected to the wafer support and supports the wafer support in the internal volume of the semiconductor processing chamber, wherein the support post passes through the orifice and the cooling plate contacts the wafer support.

17. The apparatus of claim 15 or 16, wherein the cooling plate is circular and has a diameter of at least 30 cm.

18. The apparatus according to any one of claims 1 to 17, wherein the cooling plate is a continuous part manufactured by additive manufacturing.

19. The apparatus according to any one of claims 1 to 17, wherein the cooling plate is assembled from at least two separate layers joined together, wherein at least one of the layers has a plurality of open channels, and when the cooling plate is assembled together, the plurality of open channels are covered by one of the other layers to form the first channel segment.

20. The apparatus according to any one of claims 1 to 19, wherein the aperiodic organic network pattern is defined generatively.

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