Intelligent quality monitoring method and system for carbonized wafer

Abstract

The invention discloses an intelligent carbonized wafer quality monitoring method and system, and relates to the field of carbonized wafer monitoring, and the system comprises a box body, the top of the box body is provided with a display screen, and the bottom of the inner surface of the box body is provided with a power distribution cabinet; a detection mechanism; the detection mechanism is arranged in an inner cavity of the box body and comprises a support frame mounted at the bottom of the inner surface of the box body; the turnover mechanism is arranged in an inner cavity of the box body, the turnover mechanism comprises a U-shaped frame installed on the top of the inner surface of the box body, and a lifting plate is movably installed in the U-shaped frame. According to the invention, under the action of the turnover mechanism, the carbonized wafer clamped by the clamping cylinder is driven to complete the turnover action, the monitoring surface of the wafer can be switched without manual intervention, the problem that the back surface of the wafer cannot be covered by single-direction monitoring is solved, the wafer monitoring process forms an automatic closed loop of clamping, detection, turnover and re-detection, and the detection efficiency is improved. The monitoring period of a single wafer is shortened, and the production efficiency of batch monitoring is improved.

Description

Technical Field

[0001] This invention relates to the field of carbonized wafer monitoring technology, and in particular to an intelligent quality monitoring method and system for carbonized wafers. Background Technology

[0002] As the core substrate of third-generation semiconductors, carbon wafers are widely used in high-end fields such as new energy vehicles, 5G communications, and aerospace due to their excellent high temperature resistance, high breakdown field strength, and high frequency characteristics. However, minor scratches, impurities, defects, and lattice distortions on the wafer surface can directly affect the performance stability and lifespan of subsequent devices. Therefore, quality monitoring is crucial in the production process of carbon wafers.

[0003] First, the carbonized wafer is placed on a fixed support platform by manual labor or a robotic arm. The positioning component initially limits the wafer's position. Then, the monitoring head is activated, and its own sensing function is used to collect data on one side of the wafer's surface, achieving a linear scan of the wafer's surface. Finally, the collected data is transmitted to the terminal for analysis to complete the quality assessment.

[0004] Existing intelligent quality monitoring systems for carbonized wafers rely on manual wafer flipping operations, which are not only inefficient but also prone to causing secondary contamination or physical damage to the wafer surface during the operation, affecting the accuracy of the detection data. Therefore, this paper proposes an intelligent quality monitoring method and system for carbonized wafers. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention provides a method and system for intelligent quality monitoring of carbonized wafers.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a smart quality monitoring system for carbonized wafers, comprising: The enclosure has a display screen mounted on its top and a power distribution cabinet mounted on the bottom of its inner surface. The detection mechanism is located inside the cavity of the box. The detection mechanism includes a support frame installed at the bottom of the inner surface of the box. A limit plate a is provided on the top of the support frame. A cross slider a is movably installed inside the limit plate a. A shim plate is provided on the top of the cross slider a. A limit plate b is provided on the top of the cross slider a. A cross slider b is movably installed inside the cavity of the limit plate b. An adjustment plate is provided on the top of the cross slider b. A monitoring head is installed inside the adjustment plate. A flipping mechanism is provided in the inner cavity of the box. The flipping mechanism includes a U-shaped frame installed on the top of the inner surface of the box. A lifting plate is movably installed inside the U-shaped frame. A mounting plate is provided on one side of the lifting plate. A rotating disk is provided on one side of the mounting plate. A clamping cylinder is provided on one side of the rotating disk. An adjusting slider is installed at the center of the other side of the lifting plate. A lead screw c is provided on one side of the U-shaped frame. The insertion mechanism is symmetrically arranged in the inner cavity of the box. The insertion mechanism includes a support plate that is bolted to the top of the inner surface of the box. A shelf is provided on one side of the support plate. Insert rods are evenly distributed and installed on one side of the shelf. Multiple limiting pins that are adapted to the insert rods are evenly distributed and movably installed inside the support plate.

[0007] In a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the support frame is connected to the housing by bolts, a lead screw a is movably mounted inside the limiting plate a via a bearing seat, a shim plate is provided on the top of the cross slider a, and a lead screw b is movably mounted inside the limiting plate b via a bearing seat.

[0008] In a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the cross slider a and the cross slider b are respectively movably mounted on the outside of the lead screw a and the lead screw b via threaded sleeves. The shim plate is connected to the limiting plate b. One end of the lead screw a extends to the outside of the limiting plate a and is equipped with a motor a. One end of the lead screw b extends to the outside of the limiting plate b and is equipped with a motor b.

[0009] As a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the limiting plate a and the limiting plate b are respectively provided with limiting grooves adapted to the cross slider a and the cross slider b, and the cross slider a and the cross slider b are slidably connected inside the limiting grooves.

[0010] As a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the inner surface of the U-shaped frame is symmetrically provided with slides adapted to the lifting plate. The lifting plate is slidably connected inside the slide groove. The lead screw c is connected to the U-shaped frame and the housing respectively through bearing seats. The adjusting slider is movably installed on the outside of the lead screw c through a threaded sleeve. A motor c is installed on one side of the mounting plate, and the output end of the motor c passes through the mounting plate and is connected to the rotating disk.

[0011] As a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, limit bearings are evenly distributed and installed on one side of the mounting plate, a limit ring adapted to the limit bearings is installed on one side of the rotating disk, a motor d is installed at one end of the lead screw c extending to the top of the U-shaped frame, and push cylinders are symmetrically arranged on the top of the lifting plate.

[0012] In a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the two pusher cylinder output ends are mounted on one side of the mounting plate, the limiting bearing is slidably connected to the limiting ring, and the motor c is located at the top of the lifting plate without contact.

[0013] As a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, a force-bearing plate is installed on the outer surface of the limiting pin, a spring is provided at the bottom of the force-bearing plate, an extension plate is installed at the bottom of the limiting pin, and a pressure strip is installed at one end of the extension plate extending to the outside of the support plate.

[0014] In a preferred embodiment of the intelligent quality monitoring system for carbonized wafers described in this invention, the outer surface of the insertion rod is provided with an insertion hole adapted to the limiting pin, the limiting pin is movably inserted into the insertion hole, and the extension plate is slidably connected to the inside of the support plate.

[0015] The present invention also provides a monitoring method.

[0016] This invention provides the following technical solution: a monitoring method, including the aforementioned intelligent quality monitoring system for carbonized wafers, the method comprising the following steps: S1: Replace the two shelves with sizes that match the size of the carbide wafer, and place the carbide wafer on top of the two shelves; S2: Control motors a and b to move the monitoring head horizontally along the longitudinal and transverse directions, and detect the carbonized wafer through the monitoring head; S3: Place the clamping arms of the clamping cylinder on the upper and lower sides of the carbonized wafer, clamp the carbonized wafer and lift it to a certain height, then rotate the carbonized wafer, and finally put the carbonized wafer back on top of the two storage plates. S4: Finally, by coordinating motors a and b, the position of the monitoring head in the horizontal direction is adjusted again to inspect the other side of the carbonized wafer.

[0017] This invention provides a method and system for intelligent quality monitoring of carbonized wafers. It offers the following advantages: 1. Through the action of the detection mechanism, the monitoring head can be driven to move in both directions along the horizontal direction. This design breaks through the limitations of traditional fixed-point detection and can perform full-coverage scanning detection on the surface of the carbonized wafer, significantly reducing the probability of missed detection and ensuring the comprehensiveness of quality monitoring. The components are connected by standardized connecting parts such as bearing seats and threaded sleeves, resulting in less shaking and deviation during the transmission process, ensuring the stability of the detection element monitoring head during the movement process and improving the reliability of quality monitoring data.

[0018] 2. Through the action of the flipping mechanism, the carbide wafer held by the clamping cylinder is driven to complete the flipping action. The wafer monitoring surface can be switched without manual intervention, which solves the problem that unidirectional monitoring cannot cover the back of the wafer. When the rotating disk rotates, it effectively suppresses the slight shaking of the rotating disk and prevents the wafer from being displaced or bumped due to centrifugal force or vibration during flipping. This ensures the safety of precision wafer inspection and makes the wafer monitoring process form an automated closed loop of "clamping-inspection-flipping-re-inspection". This shortens the monitoring cycle of a single wafer and improves the production efficiency of batch monitoring.

[0019] 3. The plug-in mechanism enables quick fixing and flexible replacement of the placement plate, improving the system's adaptability and maintenance efficiency. It prevents the placement plate from shifting or shaking after installation, ensuring the positional stability of related components during subsequent wafer inspection and indirectly improving inspection accuracy. It can also adapt to the monitoring of carbonized wafers of different sizes. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is an exploded schematic diagram of the detection mechanism of the present invention.

[0023] Figure 3 This is a partial cross-sectional schematic diagram of the testing mechanism of the present invention.

[0024] Figure 4 This is an exploded schematic diagram of the flipping mechanism of the present invention.

[0025] Figure 5 This is a partial cross-sectional schematic diagram of the flipping mechanism of the present invention.

[0026] Figure 6 This is the present invention. Figure 5Enlarged diagram of point A in the middle.

[0027] Figure 7 This is a partial exploded view of the insertion mechanism of the present invention.

[0028] Figure 8 This is a partial cross-sectional schematic diagram of the insertion mechanism of the present invention.

[0029] In the diagram, 1. Box body; 2. Detection mechanism; 201. Support frame; 202. Limiting plate a; 203. Lead screw a; 204. Cross slider a; 205. Elevation plate; 206. Limiting plate b; 207. Lead screw b; 208. Cross slider b; 209. Adjusting plate; 210. Monitoring head; 211. Motor a; 212. Motor b; 3. Tilting mechanism; 301. U-shaped frame; 302. Lifting plate; 303. Mounting plate; 304. 305. Limit bearing; 306. Rotary disk; 307. Clamping cylinder; 308. Limit ring; 309. Motor c; 310. Push cylinder; 311. Lead screw c; 312. Motor d; 313. Adjusting slider; 4. Insertion mechanism; 401. Support plate; 402. Storage plate; 403. Insert rod; 404. Limit pin; 405. Force plate; 406. Extension plate; 407. Lower pressure bar; 408. Spring; 5. Display screen; 6. Power distribution cabinet. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Example

[0031] Reference Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 This is the first embodiment of the present invention, which provides a smart quality monitoring system for carbonized wafers, comprising: Box 1, with a display screen 5 installed on the top of box 1 and a power distribution cabinet 6 installed on the bottom of the inner surface of box 1; The detection mechanism 2 is located inside the housing 1. The detection mechanism 2 includes a support frame 201 installed at the bottom of the inner surface of the housing 1. A limit plate a202 is provided on the top of the support frame 201. A cross slider a204 is movably installed inside the limit plate a202. A shim plate 205 is provided on the top of the cross slider a204. A limit plate b206 is provided on the top of the cross slider a204. A cross slider b208 is movably installed inside the cavity of the limit plate b206. An adjustment plate 209 is provided on the top of the cross slider b208. A monitoring head 210 is installed inside the adjustment plate 209.

[0032] The insertion mechanism 4 is symmetrically arranged in the inner cavity of the box 1. The insertion mechanism 4 includes a support plate 401 that is bolted to the top of the inner surface of the box 1. A shelf 402 is provided on one side of the support plate 401. Insert rods 403 are evenly distributed and installed on one side of the shelf 402. Multiple limiting pins 404 that are adapted to the insert rods 403 are evenly distributed and movably installed inside the support plate 401.

[0033] like Figure 2 and Figure 3 As shown, in this embodiment, the support frame 201 is connected to the housing 1 by bolts. A lead screw a203 is movably installed inside the limiting plate a202 through a bearing seat. A shim plate 205 is provided on the top of the cross slider a204. A lead screw b207 is movably installed inside the limiting plate b206 through a bearing seat. With the assistance of the support frame 201, the limiting plate a202 can be installed at a certain height to facilitate the subsequent placement of the carbonized wafer at the bottom of the monitoring head 210, which facilitates the detection of the carbonized wafer. With the assistance of the lead screws a203 and b207, the position of the monitoring head 210 can be changed in the horizontal direction to perform all-round quality detection of the carbonized wafer.

[0034] like Figure 2 and Figure 3 As shown, in this embodiment, the cross sliders a204 and b208 are movably mounted on the outside of the lead screws a203 and b207 respectively through threaded sleeves. The shim plate 205 is connected to the limiting plate b206. One end of the lead screw a203 extends to the outside of the limiting plate a202 and is equipped with a motor a211. One end of the lead screw b207 extends to the outside of the limiting plate b206 and is equipped with a motor b212. Under the action of the motors a211 and b212, and with the assistance of the corresponding lead screws a203 and b207, a certain power is provided to the cross sliders a204 and b208. Therefore, the adjusting plate 209 can be driven to move horizontally in both longitudinal and transverse directions, thereby adjusting the position of the monitoring head 210.

[0035] like Figure 2 and Figure 3 As shown, in this embodiment, limiting plates a202 and b206 are respectively provided with limiting grooves that are adapted to cross sliders a204 and b208. Cross sliders a204 and b208 are slidably connected inside the limiting grooves. Under the action of the limiting grooves, when cross sliders a204 and b208 move, the limiting grooves restrict their rotation and only allow cross sliders a204 and b208 to move in the opposite direction horizontally.

[0036] like Figure 7 and Figure 8As shown, in this embodiment, a force-bearing plate 405 is mounted on the outer surface of the limiting pin 404, a spring 408 is provided at the bottom of the force-bearing plate 405, and an extension plate 406 is mounted at the bottom of the limiting pin 404. One end of the extension plate 406 extends to the outside of the support plate 401 and a lower pressure strip 407 is mounted thereon. Under the action of the spring 408, an upward force is applied to the force-bearing plate 405, which keeps the limiting pin 404 under an upward force. Under the action of the lower pressure strip 407, a downward force is provided to the limiting pin 404.

[0037] like Figure 7 and Figure 8 As shown, in this embodiment, the outer surface of the insertion rod 403 is provided with an insertion hole adapted to the limiting pin 404. The limiting pin 404 is movably inserted into the insertion hole. The extension plate 406 is slidably connected to the inside of the support plate 401. The limiting pin 404 is inserted into the insertion hole of the insertion rod 403. After multiple insertion rods 403 are fixed in the support plate 401, the placement plate 402 is fixed to one side of the support plate 401. The limiting pin 404 is pulled out from the insertion rod 403, which makes it easy to replace the placement plate 402 to adapt it to the monitoring of carbonized wafers of different sizes.

[0038] Furthermore, the monitoring head 210 is connected to the display screen 5 and the power distribution cabinet 6 via wiring harnesses. First, the carbide wafer is placed at the bottom of the monitoring head 210. The monitoring head 210 is then controlled to operate, initially detecting a single point on the carbide wafer. Then, the motor a211 is controlled to operate. The output of motor a211 drives the lead screw a203, which in turn drives the cross slider a204 to move within the limiting plate a202. The cross slider a204, through the shim plate 205, drives the limiting plate b206 to move. With the assistance of the cross slider b208 and the adjusting plate 209, the limiting plate b206 drives the monitoring head 210 to move along the direction of the limiting plate a202, adjusting the lateral position of the monitoring head 210. Then, the motor b212 is controlled to run, and the output end of the motor b212 drives the lead screw b207 to rotate. The lead screw b207 drives the cross slider b208 to move, and the cross slider b208 drives the adjusting plate 209 to move, thereby changing the longitudinal position of the monitoring head 210. The motor a211 and the motor... With the cooperation of b212, the position of the monitoring head 210 is changed to monitor the quality of the carbide wafer. Finally, the monitoring head 210 sends the monitoring data to the display screen 5 through the wiring harness. The monitoring result is read from the display screen 5. When monitoring carbide wafers of different sizes, a downward force is applied to the lower pressure bar 407, pressing multiple extension plates 406 downward. The extension plates 406 drive the limit pins 404 to move, and the force plate 405 applies pressure to the spring 408, causing it to deform. 06. Move the limiting pin 404 out of the insertion rod 403. After all the limiting pins 404 have moved out of the corresponding insertion rods 403, pull the shelf 402 away from the lower pressure bar 407 in the opposite direction. Using the above method, remove the shelf 402 on the opposite side and replace it with a shelf 402 of a different size. Insert the insertion rod 403 into the support plate 401, release the force on the lower pressure bar 407, and under the action of multiple springs 408, push the limiting pin 404 into the corresponding insertion rod 403. Example

[0039] Reference Figure 4 , Figure 5 and Figure 6 This is the second embodiment of the present invention, which is based on the previous embodiment. The flipping mechanism 3 is disposed in the inner cavity of the box 1. The flipping mechanism 3 includes a U-shaped frame 301 installed on the top of the inner surface of the box 1. A lifting plate 302 is movably installed inside the U-shaped frame 301. A mounting plate 303 is provided on one side of the lifting plate 302. A rotating disk 305 is provided on one side of the mounting plate 303. A clamping cylinder 306 is provided on one side of the rotating disk 305. An adjusting slider 312 is installed at the center of the other side of the lifting plate 302. A lead screw c310 is provided on one side of the U-shaped frame 301.

[0040] like Figure 4 , Figure 5 and Figure 6As shown, in this embodiment, the inner surface of the U-shaped frame 301 is symmetrically provided with slides adapted to the lifting plate 302. The lifting plate 302 is slidably connected inside the slide groove. The lead screw c310 is connected to the U-shaped frame 301 and the housing 1 respectively through bearing seats. The adjusting slider 312 is movably installed on the outside of the lead screw c310 through a threaded sleeve. A motor c308 is installed on one side of the mounting plate 303. The output end of the motor c308 passes through the mounting plate 303 and is connected to the rotating disk 305. The output end is installed at the center of one side of the rotating disk 305. Through the action of the motor c308, the rotating disk 305 rotates, which drives the clamping cylinder 306 to rotate, flipping the carbide wafer held by the clamping cylinder 306. The other end is monitored. With the cooperation of the lead screw c310 and the adjusting slider 312, the lifting plate 302 is driven to be lifted to the moving height inside the U-shaped frame 301, lifting the carbide wafer held by the clamping cylinder 306 to the moving height, so that it has a certain rotation space.

[0041] like Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment, limit bearings 304 are evenly distributed on one side of the mounting plate 303, and a limit ring 307 adapted to the limit bearings 304 is installed on one side of the rotating disk 305. One end of the lead screw c310 extends to the top of the U-shaped frame 301 and a motor d311 is installed thereon. Push cylinders 309 are symmetrically arranged on the top of the lifting plate 302. Under the action of the two push cylinders 309, the mounting plate 303 can be pushed laterally, and the clamping cylinder 306 can be pushed to the side of the carbonized wafer, so that the clamping cylinder 306 can smoothly clamp the carbonized wafer. After the carbonized wafer is flipped, the clamping cylinder 306 can also be retracted so as not to hinder the monitoring of the carbonized wafer.

[0042] like Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment, the output ends of the two push cylinders 309 are installed on one side of the mounting plate 303. The limit bearing 304 is slidably connected to the limit ring 307. The motor c308 is located on the top of the lifting plate 302 and does not contact it. With the assistance of multiple limit bearings 304, when the motor c308 drives the rotating disk 305 to rotate, the limit ring 307 rotates accordingly. At this time, multiple limit bearings 304 apply a moving force to the limit ring 307, which plays a role in stabilizing the rotating disk 305 when it rotates, preventing the rotating disk 305 from shaking slightly and damaging the carbonized wafer, which would ultimately affect the monitoring accuracy.

[0043] Furthermore, motor d311, push cylinder 309, and push cylinder 309 are all connected to display screen 5 and power distribution cabinet 6 via wiring harnesses, enabling them to be controlled to operate. When it is necessary to monitor the other side of the carbide wafer, motor d311 is first controlled to run. The output end of motor d311 drives lead screw c310 to rotate. The rotation of lead screw c310 drives adjusting slider 312 to move vertically, adjusting the height of lifting plate 302 in U-shaped frame 301. With the assistance of push cylinder 309, mounting plate 303, and rotating disk 305, clamping cylinder 306 is adjusted to a clamping position suitable for the carbide wafer. Then, motor c308 is controlled to run. The output end of motor c308 drives rotating disk 305 to rotate. 5. Drive the clamping cylinder 306 to rotate, rotate the two clamping arms of the clamping cylinder 306 to the up and down position, and then control the two push cylinders 309 to run simultaneously, push the mounting plate 303 laterally, so that the rotating disk 305 moves accordingly, push the clamping arms of the clamping cylinder 306 to the upper and lower sides of the carbonized wafer, and then control the clamping cylinder 306 to run to clamp the carbonized wafer. Control the lead screw c310 to rotate in the opposite direction, the principle is the same as above, lift the clamping cylinder 306 to a certain height, lift the carbonized wafer to the moving height, control the motor c308 to rotate, the principle is the same as above, and rotate the clamping cylinder 306 through the rotating disk 305 until the carbonized wafer is flipped over. The principle is the same as above, and the carbonized wafer can be sent back to the monitoring area. Example

[0044] Reference Figures 1 to 8 This is the third embodiment of the present invention, which, based on the previous embodiment, provides a monitoring method comprising the following steps: S1: According to the size of the carbonized wafer, replace the two placement plates 402 with sizes that are suitable for it, and place the carbonized wafer on top of the two placement plates 402. S2: Control motors a211 and b212 to move the monitoring head 210 horizontally along the longitudinal and transverse directions, and detect the carbonized wafer through the monitoring head 210; S3: Place the clamping arms of the clamping cylinder 306 on the upper and lower sides of the carbonized wafer, clamp the carbonized wafer and lift it to a certain height, then rotate the carbonized wafer, and finally put the carbonized wafer back on top of the two storage plates 402. S4: Finally, by cooperating with motors a211 and b212, the position of the monitoring head 210 in the horizontal direction is adjusted to inspect the other side of the carbonized wafer.

[0045] Furthermore, by cooperating with motors a211 and b212, the monitoring head 210 is moved horizontally to monitor the carbonized wafer from all angles. After monitoring one side is completed, the carbonized wafer is flipped over by the flipping mechanism 3 to monitor the other side. Depending on the size of the carbonized wafer, two matching storage plates 402 are replaced.

[0046] Working principle: The carbonized wafer is placed on top of the opposite side of two placement plates 402. Then, motor a211 is controlled to run, and the output of motor a211 drives lead screw a203. Lead screw a203 drives cross slider a204 to move within limiting plate a202. Cross slider a204 drives limiting plate b206 to move via shim plate 205. With the assistance of cross slider b208 and adjusting plate 209, limiting plate b206 drives monitoring head 210 to move along the direction of limiting plate a202, adjusting the lateral position of monitoring head 210. Then, motor b212 is controlled to run, and the output of motor b212 drives lead screw b207 to rotate. Lead screw b207 drives cross slider b208 to move, and cross slider b208 drives adjusting plate 209 to move. This changes the longitudinal position of the monitoring head 210. With the cooperation of motors a211 and b212, the position of the monitoring head 210 is changed to monitor the quality of the carbonized wafer. Finally, the monitoring head 210 sends the monitoring data to the display screen 5 via a wiring harness. The monitoring result can be read from the display screen 5. At this time, motor d311 is controlled to run, and the output of motor d311 drives the lead screw c310 to rotate. The rotation of the lead screw c310 drives the adjusting slider 312 to move vertically, adjusting the height of the lifting plate 302 in the U-shaped frame 301. With the assistance of the push cylinder 309, mounting plate 303, and rotating disk 305, the clamping cylinder 306 is adjusted to a clamping position suitable for the carbonized wafer. Then, motor c308 is controlled to run, and the output of motor c308... The rotating disk 305 rotates, which in turn rotates the clamping cylinder 306, causing its two clamping arms to rotate to an up-and-down position. Then, the two push cylinders 309 operate simultaneously, pushing the mounting plate 303 laterally, causing the rotating disk 305 to move accordingly. This pushes the clamping arms of the clamping cylinder 306 to the upper and lower sides of the carbonized wafer. The clamping cylinder 306 is then operated to clamp the carbonized wafer. The lead screw c310 is controlled to rotate in the opposite direction, for the same reason, raising the clamping cylinder 306 to a certain height and raising the carbonized wafer to the desired moving height. The motor c308 is then controlled to rotate, for the same reason, rotating the clamping cylinder 306 via the rotating disk 305 until the carbonized wafer is flipped over. Finally, the carbonized wafer is returned to the monitoring position. The other side of the carbonized wafer is inspected. Finally, when monitoring carbonized wafers of different sizes, a downward force is applied to the lower pressure bar 407, pressing down multiple extension plates 406. The extension plates 406 drive the limiting pins 404 to move, and the force plate 405 applies pressure to the spring 408, causing it to deform. The extension plates 406 drive the limiting pins 404 to move out of the insert rods 403. After multiple limiting pins 404 have moved out of their corresponding insert rods 403, the shelf 402 is pulled away from the lower pressure bar 407. Using the above method, the shelf 402 on the opposite side is removed and replaced with a shelf 402 of a different size. The insert rods 403 are inserted into the support plate 401, and the force on the lower pressure bar 407 is released. Under the action of multiple springs 408...Simply push the limit pin 404 into the corresponding insert 403.

[0047] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

Claims

1. A smart quality monitoring system for carbonized wafers, characterized in that, include: The enclosure (1) has a display screen (5) installed on the top of the enclosure (1) and a power distribution cabinet (6) installed on the bottom of the inner surface of the enclosure (1). The detection mechanism (2) is located inside the housing (1). The detection mechanism (2) includes a support frame (201) installed on the bottom of the inner surface of the housing (1). A limiting plate a (202) is provided on the top of the support frame (201). A cross slider a (204) is movably installed inside the limiting plate a (202). A shim plate (205) is provided on the top of the cross slider a (204). A limiting plate b (206) is provided on the top of the cross slider a (204). A cross slider b (208) is movably installed inside the limiting plate b (206). An adjusting plate (209) is provided on the top of the cross slider b (208). A monitoring head (210) is installed inside the adjusting plate (209). A flipping mechanism (3) is provided in the inner cavity of the box (1). The flipping mechanism (3) includes a U-shaped frame (301) installed on the top of the inner surface of the box (1). A lifting plate (302) is movably installed inside the U-shaped frame (301). A mounting plate (303) is provided on one side of the lifting plate (302). A rotating disk (305) is provided on one side of the mounting plate (303). A clamping cylinder (306) is provided on one side of the rotating disk (305). An adjusting slider (312) is installed at the center of the other side of the lifting plate (302). A lead screw (310) is provided on one side of the U-shaped frame (301). The insertion mechanism (4) is symmetrically arranged in the inner cavity of the box (1). The insertion mechanism (4) includes a support plate (401) that is bolted to the top of the inner surface of the box (1). A shelf (402) is provided on one side of the support plate (401). Insert rods (403) are evenly distributed and installed on one side of the shelf (402). Multiple limiting pins (404) that are adapted to the insert rods (403) are evenly distributed and movably installed inside the support plate (401).

2. The intelligent quality monitoring system for carbonized wafers according to claim 1, characterized in that: The support frame (201) is connected to the box (1) by bolts. The screw a (203) is movably installed inside the limiting plate a (202) through the bearing seat. The top of the cross slider a (204) is provided with a shim plate (205). The screw b (207) is movably installed inside the limiting plate b (206) through the bearing seat.

3. The intelligent quality monitoring system for carbonized wafers according to claim 2, characterized in that: The cross slider a (204) and the cross slider b (208) are respectively movably installed on the outside of the lead screw a (203) and the lead screw b (207) through threaded sleeves. The shim plate (205) is connected to the limiting plate b (206). One end of the lead screw a (203) extends to the outside of the limiting plate a (202) and is equipped with a motor a (211). One end of the lead screw b (207) extends to the outside of the limiting plate b (206) and is equipped with a motor b (212).

4. The intelligent quality monitoring system for carbonized wafers according to claim 3, characterized in that: The limiting plate a (202) and the limiting plate b (206) are respectively provided with limiting grooves that are adapted to the cross slider a (204) and the cross slider b (208). The cross slider a (204) and the cross slider b (208) are slidably connected inside the limiting grooves.

5. The intelligent quality monitoring system for carbonized wafers according to claim 4, characterized in that: The inner surface of the U-shaped frame (301) is symmetrically provided with slides adapted to the lifting plate (302). The lifting plate (302) is slidably connected inside the slide. The lead screw c (310) is connected to the U-shaped frame (301) and the housing (1) respectively through the bearing seat. The adjusting slider (312) is movably installed on the outside of the lead screw c (310) through the threaded sleeve. A motor c (308) is installed on one side of the mounting plate (303). The output end of the motor c (308) passes through the mounting plate (303) and is connected to the rotating disk (305).

6. The intelligent quality monitoring system for carbonized wafers according to claim 5, characterized in that: Limit bearings (304) are evenly distributed on one side of the mounting plate (303). A limit ring (307) adapted to the limit bearing (304) is installed on one side of the rotating disk (305). One end of the lead screw c (310) extends to the top of the U-shaped frame (301) and a motor d (311) is installed thereon. Push cylinders (309) are symmetrically arranged on the top of the lifting plate (302).

7. The intelligent quality monitoring system for carbonized wafers according to claim 6, characterized in that: The output ends of the two push cylinders (309) are installed on one side of the mounting plate (303), the limiting bearing (304) is slidably connected to the limiting ring (307), and the motor c (308) is located on the top of the lifting plate (302) and does not contact it.

8. The intelligent quality monitoring system for carbonized wafers according to claim 1, characterized in that: A force plate (405) is installed on the outer surface of the limiting pin (404), a spring (408) is provided at the bottom of the force plate (405), an extension plate (406) is installed at the bottom of the limiting pin (404), and a lower pressure strip (407) is installed at one end of the extension plate (406) extending to the outside of the support plate (401).

9. The intelligent quality monitoring system for carbonized wafers according to claim 8, characterized in that: The outer surface of the insertion rod (403) is provided with an insertion hole that is adapted to the limiting pin (404). The limiting pin (404) is movably inserted into the insertion hole, and the extension plate (406) is slidably connected to the inside of the support plate (401).

10. A monitoring method, characterized in that: The intelligent quality monitoring system for carbonized wafers as described in claims 1-9 includes the following monitoring method: S1: According to the size of the carbonized wafer, replace the two placement plates (402) with the appropriate size and place the carbonized wafer on top of the two placement plates (402); S2: Control motor a (211) and motor b (212) to run, so that the monitoring head (210) moves horizontally along the longitudinal and transverse directions, and the carbonized wafer is detected by the monitoring head (210); S3: Place the clamping arm of the clamping cylinder (306) on the upper and lower sides of the carbonized wafer, clamp the carbonized wafer and lift it to a certain height, then rotate the carbonized wafer, and finally put the carbonized wafer back on the top of the two storage plates (402). S4: Finally, by cooperating with motor a (211) and motor b (212), the position of the monitoring head (210) in the horizontal direction is adjusted to detect the other side of the carbonized wafer.

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