Notebook computer cooling system

Abstract

The invention discloses a notebook computer heat dissipation system which comprises a heat dissipation module in heat conduction contact with a CPU chip and a GPU chip, the heat dissipation module is arranged in a containing area formed by a notebook computer upper shell and a notebook computer lower shell, the CPU chip and the GPU chip are installed on the notebook computer lower shell, and the CPU chip and the GPU chip are in heat conduction contact with the CPU chip and the GPU chip. The notebook computer further comprises two heat dissipation cavities formed in the lower shell of the notebook computer, the heat absorption ends of the two L-shaped heat dissipation cavities are adjacently arranged in the central area, where the CPU chip and the GPU chip are installed, of the lower shell of the notebook computer, and the heat dissipation ends of the two heat dissipation cavities are oppositely away from each other and located on the edges of the two sides of the lower shell of the notebook computer respectively. Medium flow channels are formed between the adjacent blocking strips and between the blocking strips and the side walls of the adjacent heat dissipation cavities. The heat conduction area and efficiency can be greatly increased by fully utilizing the notebook computer shell, the heat dissipation efficiency of the CPU chip and the GPU chip is improved, and the design requirement for light weight is met.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in electronic products, and more particularly to a heat dissipation system for laptops. Background Technology

[0002] In the laptop industry, especially for business laptops designed for mobile office work, "thinness and lightness" has become a core design direction. To improve portability and grip, manufacturers continue to reduce the thickness of the device body, which directly leads to the continuous compression of the space between the device's bottom shell and the internal heat dissipation module. In some models, this gap has even been reduced to the millimeter level, severely limiting the layout space of traditional heat dissipation structures.

[0003] Meanwhile, the arrival of the AI ​​era is driving upgrades in laptop functionality: whether it's local AI computing, intelligent multi-task scheduling, or high-load AI application operation, all of these factors are causing the power consumption of chips (CPU, GPU, and AI accelerator chips) to continue to rise. The instantaneous power consumption of some business laptops has already exceeded the capacity limits of traditional heat dissipation designs. The compressed D-shell space not only fails to provide installation conditions for larger heat dissipation modules (such as multiple heat pipes and large fins), but also makes it difficult for heat to be quickly conducted between the D-shell and the modules, resulting in a large amount of heat accumulating on the inside of the D-shell. On the one hand, this can cause a sudden increase in the local temperature of the D-shell, posing a risk of burning the user's hands; on the other hand, the inability to dissipate heat in time will be conducted back to the chip, causing the chip to frequently reduce its frequency. This not only affects the smoothness of AI computing and multi-tasking, but also accelerates the aging of the D-shell and internal components due to long-term high temperatures, shortening the lifespan of the device.

[0004] Therefore, there is an urgent need for an efficient active cooling solution that is compatible with the thin and light structure of business laptops, can meet the high power consumption requirements of the AI ​​era, and is not limited by the space of the D-shell, so as to resolve the contradiction between the compression of the D-shell space and the high power consumption heat dissipation requirements, and avoid the risks of D-shell overheating and device performance degradation. Summary of the Invention

[0005] The purpose of this invention is to provide a laptop cooling system that can make full use of the laptop casing to greatly increase the area and efficiency of heat conduction, improve the heat dissipation efficiency of CPU chips and GPU chips, and meet the requirements of lightweight design.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a laptop cooling system, comprising: a cooling module that makes thermal contact with a CPU chip and a GPU chip respectively, the cooling module being disposed within an accommodating area formed by an upper and lower casing of the laptop, the CPU chip and GPU chip being mounted on the lower casing, and further comprising two cooling cavities respectively formed inside the lower casing, the heat absorption ends of the two L-shaped cooling cavities being adjacently disposed in the central region of the lower casing where the CPU chip and GPU chip are mounted, the heat dissipation ends of the two cooling cavities being opposite to each other and located at the edges of the lower casing on both sides, and each of the two cooling cavities having an insulating strip inside to dissipate heat. The heat dissipation cavity is divided into an outlet channel and an inlet channel located on both sides of the isolation strip. One end of the isolation strip is connected to the inner wall of the heat absorption end of the heat dissipation cavity, and the other end of the isolation strip extends to the heat dissipation end of the heat dissipation cavity and is spaced apart from the inner wall of the heat dissipation end, so that the outlet channel and the inlet channel of the heat dissipation cavity are interconnected at their heat dissipation ends. The laptop shell is provided with two pumps corresponding to the heat dissipation cavity. The outlet end of the pump located outside the heat absorption end of the heat dissipation cavity is connected to the outlet channel, and the inlet end of the pump is connected to the inlet channel. Several parallel and spaced baffles are provided in both the outlet channel and the inlet channel of the heat dissipation cavity, thereby forming a medium flow channel between adjacent baffles and between the baffles and the side wall of the adjacent heat dissipation cavity.

[0007] The following are further improvements to the above technical solution: 1. In the above scheme, the heat dissipation module is set as a liquid-cooled heat dissipation module.

[0008] 2. In the above solution, the lower casing of the laptop is provided with heat dissipation holes that cooperate with the heat dissipation module.

[0009] 3. In the above scheme, the isolation strip further includes: an L-shaped main body with its two ends respectively spaced from the inner walls of the heat absorption end and the heat dissipation end of the heat dissipation cavity, and a bent part located at the heat absorption end of the heat dissipation cavity and perpendicularly intersecting one end of the main body; the other end of the bent part, which is connected to the main body, is connected to the side wall of one side of the heat dissipation cavity.

[0010] 4. In the above scheme, the side wall of the heat dissipation cavity connected to the bent part of the isolation strip and the isolation strip form the liquid inlet channel, and the width of the liquid inlet channel is smaller than the width of the liquid outlet channel.

[0011] 5. In the above scheme, a draining strip is provided in the liquid outlet channel, one end of which is connected to the main body of the isolation strip, and the other end of the draining strip, which is collinear with the bent part of the isolation strip, is spaced apart from the side wall of the other side of the heat dissipation cavity to form a liquid outlet.

[0012] 6. In the above scheme, a flow equalization zone is formed between the end of each of the baffles near the heat absorption end and the guide strip in the liquid outlet channel. A number of guide strips perpendicular to the guide strip are arranged in the flow equalization zone. Among the several guide strips that are evenly distributed along the width direction of the liquid outlet channel, the middle guide strip has an inclined part extending towards the liquid outlet at the end near the guide strip.

[0013] 7. In the above scheme, the distance between adjacent guide strips is greater than the distance between adjacent baffles that are evenly distributed in the liquid outlet channel.

[0014] 8. In the above scheme, the outlet end and inlet end of the pump body are respectively connected to the two sides of the bent part of the isolation strip away from the main body.

[0015] 9. In the above scheme, the pump body is a piezoelectric ceramic micropump.

[0016] Due to the application of the above technical solution, the present invention has the following advantages and effects compared with the prior art: This invention relates to a laptop cooling system, which further includes two cooling cavities respectively located inside the lower casing of the laptop. The two L-shaped cooling cavities have their heat-absorbing ends adjacent to each other in the central area of ​​the lower casing where the CPU chip and GPU chip are installed. Their heat-dissipating ends face away from each other and are located at the edges of the lower casing. Each cooling cavity has an internal partition strip dividing it into an outlet channel and an inlet channel located on either side of the partition strip. One end of the partition strip connects to the inner wall of the heat-absorbing end of the cooling cavity, and the other end extends to the heat-dissipating end of the cooling cavity, spaced apart from the inner wall of the heat-dissipating end. This allows the outlet and inlet channels of the cooling cavity to communicate with each other at their heat-dissipating ends. Two pumps corresponding to the cooling cavities are installed on the laptop casing. The outlet end of one pump located outside the heat-absorbing end of the cooling cavity connects to the outlet channel, and the inlet end connects to the inlet channel. The liquid outlet and inlet channels of the heat dissipation cavity are equipped with several parallel and spaced baffles, forming medium flow channels between adjacent baffles and between the baffles and the side walls of adjacent heat dissipation cavities. While ensuring heat dissipation for the CPU and GPU chips, this design fully utilizes the laptop casing to significantly increase the area and efficiency of heat conduction, improving the heat dissipation efficiency for the CPU and GPU chips and meeting lightweight design requirements. Furthermore, the baffles in the liquid outlet channel each form a flow equalization zone between their end near the heat absorption end and the guide strip. Within this flow equalization zone, several guide strips perpendicular to the guide strips are arranged. Among the guide strips evenly spaced along the width of the liquid outlet channel, the middle guide strip has an inclined portion extending towards the liquid outlet at its end near the guide strip. This improves the uniformity and stability of the medium distribution and flow rate within the liquid outlet channel, thereby further enhancing heat dissipation efficiency. Attached Figure Description

[0017] Appendix Figure 1 This is an exploded view of the laptop cooling system of the present invention; Appendix Figure 2 This is a schematic diagram of the lower casing of the laptop in the laptop cooling system of the present invention; Appendix Figure 3 for Figure 2 Enlarged view of a local structure in the image; Appendix Figure 4 This is a cross-sectional view of the lower casing of the laptop in the laptop cooling system of the present invention; Appendix Figure 5 This is a cross-sectional view of a portion of the lower casing of the laptop in the laptop cooling system of the present invention.

[0018] In the attached diagrams: 100, heat dissipation module; 200, upper casing of the laptop; 300, lower casing of the laptop; 301, heat dissipation hole; 1, heat dissipation cavity; 2, isolation strip; 21, main body; 22, bending part; 3, liquid outlet channel; 4, liquid inlet channel; 5, pump body; 6, baffle; 7, medium flow channel; 8, sealing adhesive layer; 91, FPC circuit board; 92, drive control board; 10, flow guide strip; 11, liquid outlet; 12, flow equalization zone; 13, flow guide strip; 131, inclined part. Detailed Implementation

[0019] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0020] Example 1: A laptop cooling system includes: a cooling module 100 that makes thermal contact with a CPU chip and a GPU chip respectively. The cooling module 100 is disposed within an accommodating area formed by an upper laptop shell 200 and a lower laptop shell 300. The CPU chip and GPU chip are mounted on the lower laptop shell 300. The system also includes two cooling cavities 1 respectively formed inside the lower laptop shell 300. The heat-absorbing ends of the two L-shaped cooling cavities 1 are adjacent to each other in the central region of the lower laptop shell 300 where the CPU chip and GPU chip are mounted. The heat-dissipating ends of the two cooling cavities 1 are opposite each other and located at the edges of the lower laptop shell 300 on both sides. Each of the two cooling cavities 1 has an insulating strip 2 inside, dividing the cooling cavity 1 into sections. The liquid outlet channel 3 and liquid inlet channel 4 are located on both sides of the isolation strip 2. One end of the isolation strip 2 is connected to the inner wall of the heat absorption end of the heat dissipation cavity 1, and the other end of the isolation strip 2 extends to the heat dissipation end of the heat dissipation cavity 1 and is spaced apart from the inner wall of the heat dissipation end, so that the liquid outlet channel 3 and liquid inlet channel 4 of the heat dissipation cavity 1 are interconnected at their heat dissipation ends. Two pump bodies 5 are provided on the notebook shell 100, which are correspondingly arranged with the heat dissipation cavity 1. The liquid outlet end of the pump body 5 located outside the heat absorption end of the heat dissipation cavity 1 is connected to the liquid outlet channel 3, and the liquid inlet end of the pump body 5 is connected to the liquid inlet channel 4. Several parallel and spaced baffles 6 are provided in both the liquid outlet channel 3 and the liquid inlet channel 4 of the heat dissipation cavity 1, so as to form a medium flow channel 7 between adjacent baffles 6 and between the baffles 6 and the side wall of the adjacent heat dissipation cavity 1.

[0021] The aforementioned heat dissipation module 100 is configured as a liquid cooling heat dissipation module; the aforementioned lower casing 300 of the notebook is provided with heat dissipation holes 301 that cooperate with the heat dissipation module 100; the aforementioned pump body 5 is a piezoelectric ceramic micro pump. The pump body 5 is mounted on the surface of the lower casing 300 of the notebook facing the upper casing 200 of the notebook by a sealing layer 8 provided at its four edges, and also has a drive control board 92 connected to the pump body 5 by an FPC circuit board 91.

[0022] Example 2: A laptop cooling system includes: a cooling module 100 that makes thermal contact with a CPU chip and a GPU chip respectively. The cooling module 100 is disposed within an accommodating area formed by an upper laptop shell 200 and a lower laptop shell 300. The CPU chip and GPU chip are mounted on the lower laptop shell 300. The system also includes two cooling cavities 1 respectively formed inside the lower laptop shell 300. The heat-absorbing ends of the two L-shaped cooling cavities 1 are adjacent to each other in the central region of the lower laptop shell 300 where the CPU chip and GPU chip are mounted. The heat-dissipating ends of the two cooling cavities 1 are located away from each other and at the edges of the lower laptop shell 300 on both sides. Each of the two cooling cavities 1 has an insulating strip 2 inside, dividing the cooling cavity 1 into sections. The liquid outlet channel 3 and liquid inlet channel 4 are located on both sides of the isolation strip 2. One end of the isolation strip 2 is connected to the inner wall of the heat absorption end of the heat dissipation cavity 1, and the other end of the isolation strip 2 extends to the heat dissipation end of the heat dissipation cavity 1 and is spaced apart from the inner wall of the heat dissipation end, so that the liquid outlet channel 3 and liquid inlet channel 4 of the heat dissipation cavity 1 are interconnected at their heat dissipation ends. Two pump bodies 5 are provided on the notebook shell 100, which are correspondingly arranged with the heat dissipation cavity 1. The liquid outlet end of the pump body 5 located outside the heat absorption end of the heat dissipation cavity 1 is connected to the liquid outlet channel 3, and the liquid inlet end of the pump body 5 is connected to the liquid inlet channel 4. Several parallel and spaced baffles 6 are provided in both the liquid outlet channel 3 and the liquid inlet channel 4 of the heat dissipation cavity 1, so as to form a medium flow channel 7 between adjacent baffles 6 and between the baffles 6 and the side wall of the adjacent heat dissipation cavity 1.

[0023] The aforementioned isolation strip 2 further includes: an L-shaped main body 21 with its two ends spaced apart from the inner walls of the heat absorption end and heat dissipation end of the heat dissipation cavity 1, respectively, and a bent part 22 located at the heat absorption end of the heat dissipation cavity 1 and perpendicularly intersecting one end of the main body 21, wherein one end of the bent part 22 is connected to the main body 21 and the other end is connected to the side wall of one side of the heat dissipation cavity 1. The side wall of the heat dissipation cavity 1, which is connected to the bent portion 22 of the isolation strip 2, and the isolation strip 2 form the liquid inlet channel 4. The width of the liquid inlet channel 4 is smaller than the width of the liquid outlet channel 3. The above-mentioned liquid outlet channel 3 is provided with a draining strip 10, one end of which is connected to the main body 21 of the isolation strip 2. The other end of the draining strip 10, which is collinear with the bending part 22 of the isolation strip 2, is spaced apart from the side wall of the heat dissipation cavity 1 and forms a liquid outlet 11. A flow equalization zone 12 is formed between the end of each of the baffles 6 near the heat absorption end and the guide strip 10 in the liquid outlet channel 3. A number of guide strips 13 perpendicular to the guide strip 10 are provided in the flow equalization zone 12. Among the several guide strips 13 that are evenly distributed along the width direction of the liquid outlet channel 3, the middle guide strip 13 has an inclined portion 131 extending towards the liquid outlet 11 at the end near the guide strip 10. The distance between adjacent guide strips 13 is greater than the distance between adjacent baffles 6 that are evenly distributed within the liquid outlet channel 3; The outlet and inlet ends of the pump body 5 are respectively connected to the two sides of the bent portion 22 of the isolation strip 2 away from the main body 21.

[0024] The aforementioned cooling system is compatible with portable electronic devices such as laptops and mobile workstations. Integrated within the device's chassis, it centers on a "built-in liquid cooling module + piezoelectric ceramic micropump microchannel" system, coupled with a cooling control module, forming a dual-drive cooling closed loop. The piezoelectric ceramic micropump microchannel system is embedded within the D-shell layout, without occupying additional lateral space, meeting the requirements of a thin and light design. The built-in liquid cooling module focuses on absorbing heat generated by the core chip, while the piezoelectric ceramic micropump microchannel component focuses on dissipating heat from the D-shell. Working collaboratively under the control of the cooling control module, they achieve a complete cooling process of "heat control at the source + heat dissipation at the end."

[0025] The laptop's bottom shell (D-shell) serves as the system's basic support and heat dissipation carrier, and is made of a high thermal conductivity alloy material through a single-piece molding process. Its inner surface undergoes precision milling, with pre-drilled mounting slots for compatibility with microchannels and piezoelectric ceramic micropumps. At the same time, areas corresponding to the laptop's core heat-generating components such as the CPU and GPU are locally thickened and have optimized thermal conductivity to ensure that core heat can be quickly conducted to the D-shell body and subsequent heat dissipation structures. This approach retains the D-shell's protective function for internal components while maximizing its thermal conductivity and structural support capabilities.

[0026] The piezoelectric ceramic micropump driver circuit board, serving as the system's "control center," employs a miniaturized, low-power PCB design, integrating a microcontroller (MCU), power drive chip, voltage regulation module, and temperature detection unit. This circuit board is electrically connected to the laptop motherboard and piezoelectric ceramic micropump via a flexible ribbon cable. On one hand, it can collect real-time temperature data from the laptop's core components, allowing the MCU to dynamically adjust drive signal parameters based on temperature changes. On the other hand, it can convert the DC voltage provided by the laptop motherboard into a high-frequency drive voltage suitable for the piezoelectric ceramic micropump's operation, precisely controlling the micropump's start / stop and operating frequency, achieving intelligent adjustment of heat dissipation power, and avoiding unnecessary energy consumption.

[0027] The piezoelectric ceramic micropump is the core power source for the system's active cooling. Employing a miniaturized patch-type structure with an overall thickness less than 1mm, it can be tightly embedded into a pre-drilled slot in the laptop's D-shell. This micropump operates based on the inverse piezoelectric effect of piezoelectric ceramics. High-frequency voltage drives a piezoelectric oscillator to produce periodic deformation, creating an alternating negative and positive pressure environment within the pump chamber. This allows for precise delivery of the cooling medium (such as deionized water or thermally conductive silicone oil). It boasts advantages such as small size, low noise (operating noise ≤25dB), controllable flow rate (maximum flow rate up to 50mL / min), and fast response speed (only 0.3s from start-up to rated flow). It can adjust the circulation speed of the cooling medium in real time according to temperature changes in core components, ensuring dynamic matching between cooling efficiency and heat generation power.

[0028] The microchannels (medium flow channels 7), serving as the circulation path and core heat exchange area for the heat dissipation medium, are etched onto the inner surface of the laptop's D-shell using micro-nano fabrication technology. The channels are 0.5-1 mm wide and 0.3-0.5 mm deep, exhibiting a serpentine or grid-like distribution that perfectly overlaps with the projected areas of the laptop's core heat-generating components such as the CPU and GPU. The inner walls of the microchannels are hydrophilically treated to reduce the flow resistance of the heat dissipation medium. Both ends of the microchannels are connected to the inlet and outlet of a piezoelectric ceramic micropump via micro-sealed interfaces, forming a closed circulation loop. Driven by the piezoelectric ceramic micropump, the heat dissipation medium flows at high speed along the microchannels, rapidly carrying away heat generated by the core components through convection heat transfer and transferring it to the laptop's D-shell body. Finally, heat dissipation is achieved through natural convection and radiation heat transfer between the D-shell and the external environment.

[0029] When using the above-mentioned laptop cooling system, while ensuring the cooling of the CPU chip and GPU chip, it makes full use of the laptop casing to greatly increase the heat conduction area and efficiency, thereby improving the cooling efficiency of the CPU chip and GPU chip and meeting the lightweight design requirements. Furthermore, a flow equalization zone is formed between the end of each of the baffles near the heat absorption end and the guide strip in the liquid outlet channel. Several guide strips perpendicular to the guide strip are arranged in the flow equalization zone. Among the several guide strips evenly distributed along the width direction of the liquid outlet channel, the middle guide strip has an inclined part extending towards the liquid outlet at the end near the guide strip. This can improve the uniformity and stability of the medium distribution and flow velocity in the liquid outlet channel, thereby further improving the heat dissipation efficiency.

[0030] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A laptop cooling system, comprising: A heat dissipation module (100) is provided for thermal contact with the CPU chip and GPU chip respectively. The heat dissipation module (100) is disposed in an accommodating area formed by the upper casing (200) and the lower casing (300) of the laptop. The CPU chip and GPU chip are mounted on the lower casing (300). The heat dissipation module (1) is characterized by further comprising two heat dissipation cavities (1) respectively opened inside the lower casing (300). The heat absorption ends of the two L-shaped heat dissipation cavities (1) are arranged adjacently in the central area of ​​the lower casing (300) on which the CPU chip and GPU chip are mounted. The heat dissipation ends of the two heat dissipation cavities (1) are located away from each other and are located at the edges on both sides of the lower casing (300). Each of the two heat dissipation cavities (1) is provided with an isolation strip (2) inside, which divides the heat dissipation cavity (1) into liquid outlet channels (3) located on both sides of the isolation strip (2) and The liquid inlet channel (4) has one end of the isolation strip (2) connected to the inner wall of the heat absorption end of the heat dissipation cavity (1), and the other end of the isolation strip (2) extends to the heat dissipation end of the heat dissipation cavity (1) and is spaced apart from the inner wall of the heat dissipation end, so that the liquid outlet channel (3) and the liquid inlet channel (4) of the heat dissipation cavity (1) are connected to each other at their heat dissipation ends. The notebook shell (100) is provided with two pump bodies (5) corresponding to the heat dissipation cavity (1). The liquid outlet end of the pump body (5) located outside the heat absorption end of the heat dissipation cavity (1) is connected to the liquid outlet channel (3), and the liquid inlet end of the pump body (5) is connected to the liquid inlet channel (4). Several parallel and spaced baffles (6) are provided in the liquid outlet channel (3) and the liquid inlet channel (4) of the heat dissipation cavity (1), so that a medium flow channel (7) is formed between adjacent baffles (6) and between the baffles (6) and the side wall of the adjacent heat dissipation cavity (1).

2. The laptop cooling system according to claim 1, characterized in that: The heat dissipation module (100) is configured as a liquid-cooled heat dissipation module.

3. The laptop cooling system according to claim 1, characterized in that: The lower casing (300) of the laptop is provided with heat dissipation holes (301) that are configured to cooperate with the heat dissipation module (100).

4. The laptop cooling system according to claim 1, characterized in that: The isolation strip (2) further includes: an L-shaped main body (21) with its two ends spaced apart from the inner walls of the heat absorption end and heat dissipation end of the heat dissipation cavity (1) respectively, and a bent part (22) located at the heat absorption end of the heat dissipation cavity (1) and perpendicularly intersecting one end of the main body (21), the other end of the bent part (22) connected to the main body (21) is connected to the side wall of one side of the heat dissipation cavity (1).

5. The laptop cooling system according to claim 4, characterized in that: The side wall of the heat dissipation cavity (1) connected to the bend (22) of the isolation strip (2) forms the liquid inlet channel (4) between the isolation strip (2) and the liquid inlet channel (4), the width of the liquid inlet channel (4) being smaller than the width of the liquid outlet channel (3).

6. The laptop cooling system according to claim 5, characterized in that: The liquid outlet channel (3) is provided with a drain strip (10) with one end connected to the main body (21) of the isolation strip (2). The other end of the drain strip (10) is collinear with the bent part (22) of the isolation strip (2) and is spaced apart from the side wall of the heat dissipation cavity (1) to form a liquid outlet (11).

7. The notebook heat dissipation system according to claim 6, characterized in that: A flow equalization zone (12) is formed between the end of each of the baffles (6) near the heat absorption end and the guide strip (10) in the liquid outlet channel (3). A number of guide strips (13) perpendicular to the guide strip (10) are provided in the flow equalization zone (12). Among the several guide strips (13) that are evenly distributed along the width direction of the liquid outlet channel (3), the guide strip (13) in the middle has an inclined part (131) extending towards the liquid outlet (11) at the end near the guide strip (10).

8. The laptop cooling system according to claim 7, characterized in that: The distance between adjacent guide strips (13) is greater than the distance between adjacent baffles (6) that are evenly distributed in the liquid outlet channel (3).

9. The laptop cooling system according to claim 6, characterized in that: The outlet and inlet ends of the pump body (5) are respectively connected to the two sides of the bent part (22) of the isolation strip (2) away from the main body (21).

10. The laptop cooling system according to claim 1, characterized in that: The pump body (5) is a piezoelectric ceramic micropump.

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