Flexible circuit board assembly, electronic equipment and electronic equipment manufacturing method

Abstract

The invention provides a flexible circuit board assembly, electronic equipment and an electronic equipment manufacturing method, the electronic equipment comprises the flexible circuit board assembly, the flexible circuit board assembly comprises a first device, a flexible circuit board, a first connecting layer, a first reinforcing plate, a second connecting layer and a second reinforcing plate, the first connecting layer is connected with the first reinforcing plate and the flexible circuit board, and the second connecting layer is connected with the second reinforcing plate. The first connecting layer is connected with the first reinforcing plate and the second reinforcing plate, the second connecting layer is connected with the first reinforcing plate and the second reinforcing plate, and the first device is fixedly connected to the surface, opposite to the first reinforcing plate, of the flexible circuit board; the positioning groove is recessed from the surface, provided with the first device, of the flexible circuit board to the surface, back to the flexible circuit board, of the second reinforcing plate, the positioning groove at least penetrates through the flexible circuit board, the first connecting layer, the first reinforcing plate and the second connecting layer, at least part of the positioning piece is formed in the positioning groove, and the positioning piece is at least connected with the peripheral wall of the positioning groove.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a flexible circuit board assembly, electronic equipment, and a method for manufacturing electronic equipment. Background Technology

[0002] In existing mobile phones and other terminal devices, optical components such as lasers, flashlights, and color temperature lamps need to be placed close to the battery cover. To achieve this, these optical components need to be placed even closer to the battery cover to improve installation accuracy and stability. These components are usually mounted on flexible circuit boards, which are electrically connected to the motherboard. The flexible circuit board is then supported to the rear cover. However, the continuous stress on the supported flexible circuit board may cause deformation or displacement, directly affecting the installation accuracy and use of the optical components. Therefore, ensuring the installation stability of optical components is an urgent problem to be solved in the industry. Summary of the Invention

[0003] This application provides a flexible circuit board assembly, an electronic device, and a method for manufacturing the electronic device, which can ensure the installation stability of optical devices and flexible circuit boards.

[0004] One embodiment of this application provides an electronic device, the electronic device comprising:

[0005] The middle frame and the back shell are provided. The back shell is installed on one side of the middle frame in the thickness direction. The back shell includes a light-transmitting hole. A bracket is provided on the middle frame.

[0006] A flexible circuit board assembly includes a first device, a flexible circuit board, a first connecting layer, a first reinforcing plate, a second connecting layer, and a second reinforcing plate. The first connecting layer connects the first reinforcing plate and the flexible circuit board, and the second connecting layer connects the first reinforcing plate and the second reinforcing plate. The first connecting layer, the first reinforcing plate, the second connecting layer, and the second reinforcing plate are stacked with the flexible circuit board. The first device is fixedly connected to the surface of the flexible circuit board facing away from the first reinforcing plate.

[0007] The flexible circuit board assembly further includes a positioning element and a positioning groove. Along the thickness direction of the flexible circuit board assembly, the positioning groove is recessed from the surface of the flexible circuit board on which the first device is located toward the surface of the second reinforcing plate opposite to the surface of the flexible circuit board. The positioning groove at least penetrates the flexible circuit board, the first connecting layer, the first reinforcing plate and the second connecting layer. The positioning element is at least partially formed in the positioning groove and is at least connected to the peripheral wall of the positioning groove.

[0008] The second reinforcing plate of the flexible circuit board assembly is connected to the surface of the bracket facing the rear shell, and the first device abuts against the rear shell and is opposite to the light-transmitting hole.

[0009] In related technologies, optical devices such as lasers, flashlights, and color temperature lamps in mobile phones and other terminal devices need to be located close to the battery cover. Spatially, these optical devices need to be placed even closer to the battery cover to improve installation accuracy and stability. These devices are usually mounted on flexible circuit boards, which are electrically connected to the motherboard. The flexible circuit board is then supported to the rear cover. However, the load-bearing strength of the continuously stressed flexible circuit board is insufficient, which can cause deformation or displacement, directly affecting the installation accuracy of the optical devices. Therefore, how to ensure the installation accuracy of optical devices while keeping them closer to the battery cover is an urgent problem to be solved in the industry.

[0010] In view of the prior art, the embodiments of this application use a first reinforcing plate and a second reinforcing plate to raise the flexible circuit board, so as to raise the first device when the first device is mounted in the first part. The first reinforcing plate and the second reinforcing plate support the flexible circuit board, increase the structural strength of the flexible circuit board, and prevent the flexible circuit board from being subjected to continuous force and causing deformation or displacement changes when the first device is mounted on the flexible circuit board, thus ensuring the installation accuracy and stability of the first device.

[0011] In this embodiment, a positioning element is used to fix the first reinforcing plate, the second reinforcing plate, and the flexible circuit board. This secures the first and second reinforcing plates to the flexible circuit board, preventing displacement of the first reinforcing plate or unstable installation of the second reinforcing plate, or even failure to install, due to the second connecting layer. For example, grooves or holes are cut into the first and second reinforcing plates to form positioning grooves, and the positioning element is at least partially formed in the positioning grooves. The positioning element can connect to the first and second reinforcing plates and the flexible circuit board, ensuring the reliability of the connection between the first and second reinforcing plates and the flexible circuit board, thereby ensuring the installation accuracy of the first device.

[0012] In addition, the positioning element can prevent the second connecting layer from creeping and causing relative displacement between the first and second reinforcing plates, thereby improving the assembly stability of the flexible circuit board assembly and thus improving the installation accuracy of the first device.

[0013] In one embodiment, the positioning groove includes a bottom wall connected to the peripheral wall of the groove, the bottom wall being formed in the second reinforcing plate.

[0014] The positioning element includes a first end face, which connects the peripheral wall of the groove and the bottom wall of the groove, and the first end face faces and is connected to the bottom wall of the groove.

[0015] It can be understood that the positioning groove is a blind groove, with one end of the positioning component in the height direction connected to the bottom wall of the positioning groove, and the outer periphery of the positioning component connected to the peripheral wall of the positioning groove. This achieves the connection between the positioning component and the first reinforcing plate, the first connecting layer, the second connecting layer, the second reinforcing plate, and the flexible circuit board. Furthermore, the positioning component can effectively prevent relative misalignment of the first and second reinforcing plates under continuous stress on the flexible circuit board assembly, further improving the reliability of the connection between the first and second reinforcing plates and the flexible circuit board.

[0016] There are various structural forms for blind positioning slots. In one possible implementation, the flexible circuit board includes through holes, a first connecting layer has a first via hole, a first reinforcing plate has a first through hole, a second connecting layer has a second via hole, and a second reinforcing plate has an assembly slot. The assembly slot is a blind slot. The through hole, the first via hole, the first through hole, the second through hole, and the assembly slot are interconnected and constitute the positioning slot. The bottom wall of the assembly slot is the bottom wall of the positioning slot. The walls of the through hole, the first via hole, the first through hole, the second through hole, and the peripheral wall of the assembly slot together form the peripheral wall of the positioning slot.

[0017] In one possible implementation, the flexible circuit board includes through holes, a first connecting layer has a first via hole, a first reinforcing plate has a first through hole, and a second connecting layer has a second via hole. The through hole, the first via hole, the first through hole, and the second via hole are interconnected and form a positioning groove. The surface of the second reinforcing plate facing the flexible circuit board is the surface of the bottom wall of the positioning groove. A first end face of the positioning member is connected to the surface of the second reinforcing plate facing the flexible circuit board. The walls of the through holes, the first via holes, the first through hole, and the second via holes together form the peripheral wall of the positioning groove.

[0018] In one embodiment, the positioning groove also extends through the surface of the second reinforcing plate facing away from the flexible circuit board.

[0019] The positioning element includes a first end face, which is connected to the surface of the second reinforcing plate facing away from the flexible circuit board.

[0020] It is understood that the positioning groove is a through groove. The first end face connects to the surface of the second reinforcing plate facing away from the flexible circuit board, meaning the first end face can be exposed in the positioning groove. Specifically, the flexible circuit board includes through holes, the first connecting layer has a first via hole, the first reinforcing plate has a first through hole, the second connecting layer has a second via hole, and the second reinforcing plate has an assembly groove. The assembly groove is a through groove. The through hole, the first via hole, the first through hole, the second through hole, and the assembly groove are connected and constitute the positioning groove. The hole wall of the through hole, the hole wall of the first via hole, the hole wall of the first through hole, the hole wall of the second through hole, and the groove peripheral wall of the assembly groove together form the groove peripheral wall of the positioning groove.

[0021] The positioning groove is a through groove, which can increase the contact area between the positioning component and the groove wall, further increasing the connection stability between the positioning component and the second reinforcing plate, further reducing the possibility of relative displacement between the first and second reinforcing plates, ensuring the installation accuracy and stability of the first and second reinforcing plates, improving the connection reliability between the first and second reinforcing plates and the flexible circuit board, thereby improving the assembly stability of the flexible circuit board assembly and thus improving the installation accuracy of the first component.

[0022] In one embodiment, the second reinforcing plate includes a first surface and a second surface, the first surface and the second surface are disposed opposite to each other along the thickness direction of the second reinforcing plate, the second surface faces away from the first reinforcing plate, the groove peripheral wall is connected to the first surface, and the first surface constitutes the surface of the bottom wall of the positioning groove.

[0023] Alternatively, the second reinforcing plate may further include an assembly groove, which is a recessed groove and is recessed into the first surface. The bottom wall of the assembly groove is the bottom wall of the positioning groove, and the peripheral wall of the assembly groove is part of the peripheral wall of the positioning groove. The positioning element is connected to the bottom wall and peripheral wall of the assembly groove.

[0024] It can be understood that the positioning groove is a blind groove. The first end face of the positioning component is connected to the bottom wall of the assembly groove. The outer peripheral surface of the positioning component is connected to the hole wall of the through hole, the hole wall of the first through hole, the hole wall of the first through hole, the hole wall of the second through hole, and the peripheral wall of the assembly groove, so as to realize that the positioning component stably connects the first reinforcing plate and the second reinforcing plate to the flexible circuit board.

[0025] The assembly slot is designed as a blind slot, so that the positioning component will not overflow onto the second surface of the second reinforcing plate during the forming process, thus ensuring the flatness of the second surface of the second reinforcing plate and facilitating the bonding of the second reinforcing plate to the bracket.

[0026] In one embodiment, along the thickness direction of the flexible circuit board assembly, the length of the positioning element is less than or equal to the depth of the positioning groove.

[0027] It is understandable that as long as the first and second reinforcing plates can be effectively and firmly connected to the positioning components, the manufacturing cost of the flexible circuit board assembly can also be controlled by controlling the amount of material in the positioning components.

[0028] In one embodiment, the positioning element includes a positioning body and a positioning protrusion, and the positioning protrusion is connected to the positioning body along the height direction of the positioning element.

[0029] The positioning body is formed in the positioning groove, the positioning protrusion is located outside the positioning groove, and the positioning protrusion protrudes and is connected to the surface of the flexible circuit board on which the first device is located.

[0030] The positioning protrusion can improve the stability of the connection between the positioning component and the flexible circuit board. If the second surface of the second reinforcing plate has requirements for flatness or the positioning groove is a blind groove, the positioning protrusion protrudes and connects to the first mounting surface of the flexible circuit board.

[0031] In one embodiment, the flexible circuit board includes a first mounting surface and a second mounting surface disposed opposite to the first mounting surface.

[0032] The flexible circuit board also has a through hole penetrating the first mounting surface and the second mounting surface. The through hole constitutes part of the positioning groove. The through hole includes a first sub-through hole and a second sub-through hole that are connected. The first sub-through hole penetrates the first mounting surface. The diameter of the first sub-through hole is larger than the diameter of the second sub-through hole, and a step is formed between the first sub-through hole and the second sub-through hole. The positioning protrusion is located in the first sub-through hole and connected to the step.

[0033] It can be understood that the through holes of the flexible circuit board are stepped holes. Specifically, the first sub-through hole exposes a portion of the flexible circuit board body, and the first sub-through hole and the second sub-through hole form a step. The positioning protrusion connects to the step, that is, the positioning protrusion connects to the body exposed in the first sub-through hole. Since the body is made of copper, if the positioning element is made of solder paste, the positioning element can be better connected and fixed to the first connecting layer, the first reinforcing plate, the second connecting layer, and the second reinforcing plate. This prevents relative displacement between the first reinforcing plate and the flexible circuit board, and between the first reinforcing plate and the second reinforcing plate, ensuring the reliability of the connection between the flexible circuit board and the first and second reinforcing plates. This, in turn, ensures the installation accuracy and stability of the first and second reinforcing plates, thereby improving the assembly stability of the flexible circuit board assembly and increasing the installation accuracy of the first component.

[0034] In one embodiment, the positioning element is made of solder paste, and a metal layer is provided on the wall of the positioning groove. The metal layer is made of a solder-affinity material, and the positioning element is formed in the positioning groove and connected to the metal layer.

[0035] It is understandable that, since the positioning component is made of solder paste, a metal layer made of solder-affinity material is set between the positioning groove wall and the positioning component, which allows the solder paste to accumulate better inside the positioning groove, increases the connection stability between the first and second reinforcing plates and the positioning component, and thus ensures the connection reliability between the flexible circuit board and the first and second reinforcing plates.

[0036] In one embodiment, the positioning member includes a positioning protrusion and a positioning body, wherein the positioning protrusion is connected to the positioning body.

[0037] The positioning groove also penetrates the surface of the second reinforcing plate facing away from the flexible circuit board. The positioning element includes a first end face.

[0038] The positioning body is formed in the positioning groove, and the positioning protrusion is located outside the positioning groove and connected to the side of the second reinforcing plate facing away from the first reinforcing plate.

[0039] It is understandable that when there is only one positioning protrusion and the positioning groove is a through groove, if the first mounting surface of the flexible circuit board has a flatness requirement and the second surface of the second reinforcing plate does not have a flatness requirement, the positioning protrusion of the positioning member can also be located outside the positioning groove and connected to the second surface of the second reinforcing plate.

[0040] In one embodiment, the positioning element includes two positioning protrusions and a positioning body, wherein the two positioning protrusions are respectively connected to opposite ends of the positioning body in the height direction.

[0041] The positioning groove also penetrates the surface of the second reinforcing plate facing away from the flexible circuit board. The positioning body is formed in the positioning groove, and both positioning protrusions are formed outside the positioning groove, connecting the flexible circuit board and the second reinforcing plate.

[0042] It is understandable that the two positioning protrusions are connected to opposite ends in the height direction of the positioning body, and both are located outside the positioning groove, which increases the connection area between the positioning component and the flexible circuit board and the second reinforcing plate.

[0043] In one embodiment, the positioning element is made of resin or colloid.

[0044] It is understandable that the positioning component is directly formed in the positioning groove. Compared with the screw and screw hole combination, it will not damage the flexible circuit board. Moreover, the positioning component and the flexible circuit board have a high degree of tightness. Furthermore, the process of drilling holes or grooves in the first and second reinforcing plates is simpler than that of screw holes. Compared with the prior art, fixing the flexible circuit board, the first reinforcing plate, the second reinforcing plate, the first connecting layer and the second connecting layer by the positioning component after filling and curing through the holes or grooves not only improves the connection stability, but also does not cause damage to the first and second reinforcing plates during the process, and reduces the process difficulty, achieving unexpected results.

[0045] Furthermore, since the positioning element formed after the glue and resin have cured has a certain hardness, even if the second connecting layer melts when heated for the second time, the positioning element can still prevent the second reinforcing plate from displacing relative to the first reinforcing plate, thus ensuring the installation accuracy and stability of the first and second reinforcing plates, improving the connection reliability between the first and second reinforcing plates and the flexible circuit board, and enhancing the installation accuracy of the first device.

[0046] Furthermore, compared to glue, resin is easier to cure and mold, and the positioning parts formed by resin are easier to grind with a scraper, making the processing of electronic devices faster and easier.

[0047] In one embodiment, the first connecting layer is made of thermosetting adhesive, and the second connecting layer is made of pressure-sensitive adhesive.

[0048] In this embodiment, the second connecting layer is made of pressure-sensitive adhesive to ensure that the second reinforcing plate can be mounted on the first reinforcing plate. The pressure-sensitive adhesive is a pressure-sensitive adhesive that has surface tack at room temperature. However, because the pressure-sensitive adhesive itself exhibits creep at room temperature, when the flexible circuit board is under continuous stress, the first and second reinforcing plates will experience relative displacement due to the stress. This reduces the mounting accuracy and stability of the first and second reinforcing plates on the flexible circuit board, thereby affecting the assembly stability of the flexible circuit board assembly and reducing the mounting accuracy of the first device.

[0049] In one embodiment, the flexible circuit board includes a first portion, a second portion, and a connecting portion connecting the first portion and the second portion, wherein the extension direction of the first portion is opposite to the extension direction of the second portion, and the first device is connected to a surface of the first portion.

[0050] The electronic device further includes a second device, and the flexible circuit board assembly further includes a third reinforcing plate and a third connecting layer. The third connecting layer connects the third reinforcing plate and the second portion, and the second device is connected to the surface of the second portion facing away from the third reinforcing plate. Both the first device and the second device are electrically connected to the flexible circuit board.

[0051] It is understood that the flexible circuit board assembly includes a first device and a second device, located on two opposing surfaces of the assembly. The first device abuts against the back cover and faces the light-transmitting hole; it can be a laser, flash, or similar device. The second device connects to the main circuit board of the electronic device, thus establishing a connection between the flexible circuit board and the main circuit board. For example, the second device could be a connector capable of plugging into the main circuit board, or a device with electrical connection capabilities, thereby achieving an electrical connection between the first device and the main circuit board.

[0052] This application also provides a flexible circuit board assembly for use in electronic devices. The flexible circuit board assembly includes a first device, a flexible circuit board, a first connecting layer, a first reinforcing plate, a second connecting layer, and a second reinforcing plate. The first connecting layer connects the first reinforcing plate and the flexible circuit board, and the second connecting layer connects the first reinforcing plate and the second reinforcing plate. The first connecting layer, the first reinforcing plate, the second connecting layer, and the second reinforcing plate are stacked with the flexible circuit board.

[0053] The flexible circuit board further includes a first part, a second part, and a connecting part connecting the first part and the second part. The extension direction of the first part is opposite to the extension direction of the second part. The first device is connected to a surface of the first part. The first reinforcing plate is fixedly connected to the surface of the flexible circuit board facing away from the first device.

[0054] The electronic device further includes a second device, and the flexible circuit board assembly further includes a third reinforcing plate and a third connecting layer. The third connecting layer connects the third reinforcing plate and the second portion, and the second device is connected to the surface of the second portion facing away from the third reinforcing plate. Both the first device and the second device are electrically connected to the flexible circuit board.

[0055] The flexible circuit board assembly further includes a positioning element and a positioning groove. Along the thickness direction of the flexible circuit board assembly, the positioning groove is recessed from the surface of the flexible circuit board on which the first device is located toward the surface of the second reinforcing plate opposite to the surface of the flexible circuit board. The positioning groove at least penetrates the flexible circuit board, the first connecting layer, the first reinforcing plate and the second connecting layer. The positioning element is at least partially formed in the positioning groove and is at least connected to the peripheral wall of the positioning groove.

[0056] This application also provides a method for manufacturing an electronic device, used to manufacture the aforementioned electronic device, characterized in that the method includes,

[0057] The first reinforcing plate is connected to one surface of the flexible circuit board, and the third reinforcing plate is connected to another surface of the flexible circuit board, wherein the first reinforcing plate and the third reinforcing plate are located at both ends of the flexible circuit board;

[0058] The second device is soldered to the surface of the flexible circuit board, and the second device and the third reinforcing plate are opposite each other along the thickness direction of the flexible circuit board;

[0059] The first device is soldered to the surface of the circuit board, with the first device facing the first reinforcing plate, wherein the first device and the second device are located at both ends of the flexible circuit board and on two opposing surfaces.

[0060] The second reinforcing plate is connected to the side of the first reinforcing plate that faces away from the flexible circuit board;

[0061] The molten positioning material is filled into the positioning grooves formed in the flexible circuit board, the first reinforcing plate and the second reinforcing plate and solidified to form the positioning element connecting the flexible circuit board, the first reinforcing plate and the second reinforcing plate.

[0062] This method improves the connection stability between the first reinforcing plate, the second reinforcing plate, and the flexible circuit board by using positioning components. Moreover, by soldering the first and second components before connecting the second reinforcing plate, the flexible circuit board will not be damaged due to the first reinforcing plate being too thick when soldering the second component. Furthermore, soldering the second component first will not cause secondary reflow problems to the first component. The superposition of the second and first reinforcing plates ensures that the first component has sufficient height to correspond with the back cover after the flexible circuit board is installed in the electronic device, ensuring the fit between the first component and the back cover and guaranteeing its relevant performance. Attached Figure Description

[0063] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0064] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0065] Figure 2a This is a schematic diagram of the structure of a flexible circuit board assembly for an electronic device provided in an embodiment of this application;

[0066] Figure 2b This is a partial structural schematic diagram of the electronic device provided in the embodiments of this application;

[0067] Figure 3 for Figure 1 A schematic diagram of a portion of the structure of the first embodiment of the electronic device shown;

[0068] Figure 4 for Figure 3 An exploded structural diagram of a portion of the structure of a first embodiment of the electronic device shown in the diagram.

[0069] Figure 5 for Figure 1 A schematic diagram of a portion of the structure of a second embodiment of the first embodiment of the electronic device shown;

[0070] Figure 6 for Figure 5 An exploded structural diagram of a portion of the structure of a second embodiment of the first embodiment of the electronic device shown;

[0071] Figure 7 for Figure 1 A schematic diagram of a portion of the structure of a third embodiment of the first embodiment of the electronic device shown;

[0072] Figure 8 for Figure 1 A schematic diagram of a portion of the structure of the second embodiment of the electronic device shown;

[0073] Figure 9 for Figure 1 A schematic diagram of a portion of the structure of a second embodiment of the electronic device shown in the diagram;

[0074] Figure 10 for Figure 1 A schematic diagram of a portion of the structure of the third embodiment of the electronic device shown;

[0075] Figure 11 for Figure 10 An exploded structural diagram of a portion of the structure of the first embodiment of the third embodiment of the electronic device shown.

[0076] Figure 12 for Figure 1 A schematic diagram of a portion of the structure of the second embodiment of the third embodiment of the electronic device shown;

[0077] Figure 13 for Figure 1 A schematic diagram of a portion of the structure of the fourth embodiment of the electronic device shown;

[0078] Figure 14 for Figure 1 The flowchart shown illustrates the manufacturing process of the electronic device. Detailed Implementation

[0079] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0080] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. References to "embodiment" or "implementation" herein mean that a specific feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0081] Please see Figure 1 , Figure 2a and Figure 2b , Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Figure 2a This is a schematic diagram of the structure of the flexible circuit board assembly of the electronic device provided in the embodiments of this application. Figure 2b A partial structural schematic diagram of the electronic device provided in the embodiments of this application.

[0082] The electronic device 1000 in this embodiment can be a handheld wireless communication device, a desktop computer, a laptop computer, a tablet computer, a personal digital assistant, or the like. This application uses a mobile phone as an example for detailed description. For ease of description, definitions are provided. Figure 1 The length direction of the electronic device 1000 is the X-axis direction, the width direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are all perpendicular to each other.

[0083] Electronic device 1000 includes a screen 200, a mid-frame 300, a circuit board assembly, and a rear cover 400. The screen 200 is mounted on one side of the mid-frame 300 along its thickness direction, and the rear cover 400 is mounted on the other side of the mid-frame 300 along its thickness direction. The circuit board assembly is connected to the side of the mid-frame 300 facing the rear cover 400 and is located between the mid-frame 300 and the rear cover 400. The screen 200 has a display area capable of displaying image information. When powered on, the screen 200 can display corresponding image information. Electronic device 1000 also includes a camera module 500 and multiple electronic components. The camera module 500 is connected to the surface of the mid-frame 300 facing the rear cover 400 and is located between the mid-frame 300 and the rear cover 400.

[0084] The circuit board assembly includes a main circuit board D, a secondary circuit board, and a flexible circuit board 10 with connectivity capabilities. Most of the electronic components that enable the phone's functionality are located on the main circuit board D, such as the processor, radio frequency devices, and other major electronic components; the power supply is also connected to the main circuit board D. The secondary circuit board can be connected to the main circuit board D and is used to connect devices such as speakers and antennas located away from the main circuit board D. The flexible circuit board 10 with connectivity capabilities is used for electrical connections such as between the camera module and the main circuit board D, between the power supply and the main circuit board D, and between the screen 200 and the main circuit board D; it can also be used for connections between electronic components and the main circuit board D. These connections include necessary physical connections and electrical connections. In this embodiment, the main circuit board D can be a PCB board, and the flexible circuit board 10 can be an FPC.

[0085] For example, electronic devices such as optical sensors, lasers, and flashlights can be mounted on the flexible circuit board 10. These optical devices are connected to the main circuit board D via the flexible circuit board 10. Typically, the optical devices are positioned close to the back cover 400 or the screen 200 to allow light to pass through the light-transmitting holes in the back cover 400 or the screen 200. The flexible circuit board 10 is supported by the mid-frame 300 or the bracket B to ensure its proximity to the back cover 400. However, the flexible circuit board 10 itself lacks sufficient strength; therefore, the stability of this type of flexible circuit board 10 directly affects the mounting accuracy and stability of the optical devices.

[0086] This application provides a flexible circuit board assembly 100, which has sufficient strength and can be stably connected to the middle frame 300 to ensure the installation accuracy and stability of optical devices.

[0087] The rear shell 400 has a light-transmitting hole and a camera window. The middle frame 300 includes a middle plate and a frame. The main circuit board D is mounted on the middle plate. The camera module and the main circuit board D are fixed to the middle plate via a bracket B. The camera module is opposite to the camera window. The flexible circuit board assembly 100 is located between the bracket B and the rear shell 400. The flexible circuit board assembly 100 has a first device a and a second device b, which are located on two opposite surfaces of the flexible circuit board assembly 100. The first device a abuts against the rear shell 400 and is opposite to the light-transmitting hole. It can be a laser, flash, or other device.

[0088] It should be noted that the flexible circuit board assembly 100 may also include multiple electronic devices in addition to the first device a and the second device b. Specific examples of these multiple electronic devices may include a third device, a fourth device, a fifth device, etc. This application does not impose any limitations in this regard.

[0089] The flexible circuit board assembly 100 of this application embodiment will now be described in detail with reference to the specific accompanying drawings.

[0090] Please see Figure 2a and Figure 2b .

[0091] The flexible circuit board assembly 100 includes a flexible circuit board 10, a first connecting layer 30, and a first reinforcing plate 40. The first connecting layer 30 and the first reinforcing plate 40 are located on the same side of the flexible circuit board 10, and the first connecting layer 30 connects the flexible circuit board 10 and the first reinforcing plate 40. The flexible circuit board 10 also includes a first mounting surface 11 and a second mounting surface 12. The first mounting surface 11 and the second mounting surface 12 are two surfaces of the flexible circuit board 10 in the thickness direction, respectively.

[0092] The first device a is fixedly connected to the surface of the flexible circuit board 10 facing away from the first reinforcing plate 40 and is electrically connected to the flexible circuit board 10. The first device a is fixed to the flexible circuit board 10 by means of soldering. The first reinforcing plate 40 can improve the strength of the flexible circuit board 10 and ensure the stability of the installation of the first device.

[0093] like Figure 2b As shown, the first device a is easily affected by or can affect surrounding electronic devices. Therefore, the first device a typically needs to be isolated from surrounding electronic devices by a shield A to protect it. In this embodiment, the shield A can be considered as part of the first device a, and the shield A is usually soldered onto the flexible circuit board 10. The second device b is used to connect to the main circuit board D of the electronic device 1000 to achieve the connection between the flexible circuit board 10 and the main circuit board D. For example, the second device b is a connector that can be plugged into the main circuit board D, or a device with electrical connection performance, such as BTB, ZIF, and spring contacts.

[0094] In this embodiment, the flexible circuit board 10 includes a first part 101, a second part 102, and a connecting part 103. The connecting part 103 connects the first part 101 and the second part 102. The extending direction of the first part 101 is opposite to that of the second part 102. Along the Z-axis direction (i.e., the thickness direction of the flexible circuit board 10), the first part 101 and the second part 102 are not on the same plane, and the connecting part 103 is inclined in the Z-axis direction. It can be understood that the connecting part 103 is set at an angle to both the first part 101 and the second part 102. A first device a is fixedly connected to one surface of the first part 101. A second device b is fixedly connected to one surface of the second part 102. It should be noted that the first part 101, the second part 102, and the connecting part 103 are actually integrally formed, but are divided for the convenience of describing the flexible circuit board 10; moreover, the flexible circuit board 10 is a flat structure before bending after forming, that is, there is no angle between the first part 101, the second part 102, and the connecting part 103.

[0095] like Figure 2a As shown, so that the first part 101 and the second part 102 of the flexible circuit board 10 can be clearly described later, the first mounting surface 11 located in the first part 101 can be referred to as the first mounting surface 11 of the first part 101, the second mounting surface 12 located in the first part 101 can be referred to as the second mounting surface 12 of the first part 101, the first mounting surface 11 located in the second part 103 can be referred to as the first mounting surface 11 of the second part 102, and the second mounting surface 12 located in the second part 103 can be referred to as the second mounting surface 12 of the second part 102.

[0096] The flexible circuit board assembly 100 also includes a third reinforcing plate 70 and a third connecting layer 80, the third connecting layer 80 connecting the third reinforcing plate 70 and the flexible circuit board 10. The third reinforcing plate 70 is located on the surface of the flexible circuit board 10, and the third reinforcing plate 70 and the first device a are located on the same side of the thickness direction of the flexible circuit board 10. The second device b is fixedly connected to the surface of the flexible circuit board 10 facing away from the third reinforcing plate 70, and the second device b is soldered to the flexible circuit board 10 and electrically connected to the flexible circuit board 10. The first device a and the second device b are located on opposite sides of the thickness direction (i.e., the Z-axis direction) of the flexible circuit board 10.

[0097] The second device b and the third reinforcing plate 70 are located on opposite sides of the second portion 102 in the thickness direction. The third reinforcing plate 70 is used to reinforce the second portion 102 of the flexible circuit board 10. Specifically, the second device b is connected to the second mounting surface 12 of the second portion 102 by solder. The third connecting layer 80 is connected between the first mounting surface 11 of the second portion 102 and the third reinforcing plate 70. The third reinforcing plate 70 not only supports the second portion 102 mounted on the flexible circuit board 10, increasing the structural strength of the second portion 102 of the flexible circuit board 10, but also supports the second device b mounted on the second portion 102, preventing the flexible circuit board 10 from being continuously stressed and deformed or displaced due to the second device b being mounted on it, thus ensuring the mounting accuracy and stability of the second device b.

[0098] It should be noted that in terminal devices such as mobile phones, optical devices such as lasers, flashlights, and color temperature lamps are placed close to the light-transmitting holes on the back cover 400 to achieve light transmission and reception. If the optical devices are directly soldered to the main circuit board D, the distance from the light-transmitting holes would be too great, making it impossible to achieve the function of the optical devices. In this embodiment, such devices, such as the first device a, are placed on a flexible circuit board 10. The flexible circuit board 10 is fixed to a bracket B that is close to the back cover 400. That is, the bracket B connected to the main circuit board D has a certain height so that the first device a and the light-transmitting hole of the back cover 400 are at a suitable distance. The other end of the flexible circuit board 10 is electrically connected to the main circuit board D via a second device b. The first device a and the second device b are located on opposite sides of the flexible circuit board 10. In the thickness direction of the electronic device 1000, when the height of the bracket B relative to the back cover 400 is limited, it is necessary to increase the height of the flexible circuit board 10 relative to the back cover 400 to achieve a suitable distance between the first device a and the light-transmitting hole.

[0099] Increasing the thickness of the first reinforcing plate 40 increases the thickness of the flexible circuit board 10. The first device a and the second device b are located on opposite sides of the flexible circuit board 10. The first reinforcing plate 40 and the third reinforcing plate 70 support the soldering of the first device a and the second device b, respectively. The thickness of the first reinforcing plate 40 typically requires a height greater than 0.2 mm. According to the flexible board processing route, the shield A of the first device a cannot undergo secondary reflow (which may generate a large number of bubbles or soldering failure), so the second device b needs to be soldered first. If the second device b is soldered first, there is a thicker first reinforcing plate 40 on the same side as the second device b. The first reinforcing plate 40 has a micro-connection at an angle corresponding to the flexible circuit board 10. If tin is applied to the position of the second device b, the first reinforcing plate 40, i.e., the first part 101, needs to be lowered to avoid the misalignment. If it is not lowered to avoid the misalignment, the micro-connection will be broken, and the first device a cannot be soldered.

[0100] The flexible circuit board assembly 100 in this embodiment further includes a second connecting layer 50 and a second reinforcing plate 60. The first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 are located on the same side of the flexible circuit board 10. The first connecting layer 30 connects the flexible circuit board 10 and the first reinforcing plate 40, and the second connecting layer 50 connects the first reinforcing plate 40 and the second reinforcing plate 60. The second reinforcing plate 60 is connected to the bracket B. In this embodiment, the distance between the first device a and the rear shell 400 is reduced by adding the second reinforcing plate 60 to accommodate the distance between the first device a and the light-transmitting hole, ensuring normal light transmission and reception. In this process, after the first reinforcing plate 40 and the third reinforcing plate are connected to the flexible circuit board, the second device b is welded. The first reinforcing plate 40 is relatively thin and will not break with the flexible circuit board 10 when it is lowered, thus not affecting the welding of the second device b. Then, the first device a and the shielding cover A are welded. The first reinforcing plate 40 can support the flexible circuit board and ensure the welding stability of the first device a and the shielding cover A. Finally, the second reinforcing plate 60 is connected to the first reinforcing plate 40 to ensure that the reinforcing plate corresponding to the first part 101 has sufficient thickness.

[0101] In this embodiment, the first device a, the first reinforcing plate 40, and the second reinforcing plate 60 are located on opposite sides of the thickness direction of the first portion 101. The first reinforcing plate 40 and the second reinforcing plate 60 are used to reinforce the first portion 101 of the flexible circuit board 10 and to elevate the first device a to be closer to the back cover 400. Specifically, the first device a is connected to the first mounting surface 11 of the first portion 101 by solder. The first connecting layer 30 is connected between the second mounting surface 12 of the first portion 101 and the first reinforcing plate 40. The second reinforcing plate 60 is connected to the first reinforcing plate 40 by the second connecting layer 50. The first portion 101, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 of the flexible circuit board 10 are stacked sequentially; however, it is not excluded that other layer structures are provided between every two layers, but this is not specifically limited here. The first reinforcing plate 40 and the second reinforcing plate 60 also support the first part 101 of the flexible circuit board 10, increasing the structural strength of the first part 101 of the flexible circuit board 10, preventing the first device a from being continuously subjected to force on the flexible circuit board 10 and causing deformation or displacement, thus ensuring the installation accuracy and stability of the first device a.

[0102] In this application, the first reinforcing plate 40, the second reinforcing plate 60, and the third reinforcing plate 70 can be made of plastic or metal materials, such as stainless steel, aluminum foil, polyester, polyimide, glass fiber, polytetrafluoroethylene, polycarbonate, etc. This application does not impose strict limitations on these aspects.

[0103] In this embodiment, the first connecting layer 30 is made of, but is not limited to, thermosetting adhesive. The second connecting layer 50 is made of, but is not limited to, pressure-sensitive adhesive. The third connecting layer 80 is made of, but is not limited to, thermosetting adhesive.

[0104] Thermosetting adhesives require heating to a certain temperature to achieve good adhesion, and they will remelt upon heating after cooling and curing. If the second connecting layer 50 is made of thermosetting adhesive, when the second reinforcing plate 60 is mounted on the first reinforcing plate 40 via the second connecting layer 50, the second connecting layer 50 needs to be heated to bond the second reinforcing plate 60 to the first reinforcing plate 40. The high temperature of the second connecting layer 50 will be transferred to the first connecting layer 30 through the first reinforcing plate 40. The first connecting layer 30 will remelt due to the high temperature. The first connecting layer 30 has creep properties, therefore, the first reinforcing plate 40 is easily displaced, making it difficult to install the second reinforcing plate 60 onto the first reinforcing plate 40 and compromising installation accuracy.

[0105] For example, the second connecting layer 50 is made of pressure-sensitive adhesive to ensure that the second reinforcing plate 60 can be mounted on the first reinforcing plate 40. The pressure-sensitive adhesive is a pressure-sensitive adhesive that has surface tack at room temperature. However, because the pressure-sensitive adhesive itself exhibits creep at room temperature, when the flexible circuit board 10 is under continuous stress, the first reinforcing plate 40 and the second reinforcing plate 60 will experience relative displacement due to the stress. This increases the tolerance between the optical components and the entire assembly, reduces the mounting accuracy and stability of the first and second reinforcing plates 40 and 60 on the flexible circuit board 10, thereby affecting the assembly stability of the flexible circuit board assembly 100 and reducing the mounting accuracy of the first device a.

[0106] Please see Figure 3 , Figure 3 for Figure 1 A schematic diagram of a portion of the structure of the first embodiment of the electronic device shown.

[0107] The flexible circuit board assembly 100 of this application also includes a positioning member 20. The positioning member 20 connects the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50 and the second reinforcing plate 60, and fixes the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50 and the second reinforcing plate 60 to the flexible circuit board 10.

[0108] The following describes the connection and fixation method between the first reinforcing plate 40 and the second reinforcing plate 60 through three embodiments.

[0109] The flexible circuit board 10 includes a first protective film layer 13, a second protective film layer 14, and a body 15. Along the Z-axis, the first protective film layer 13 and the second protective film layer 14 are stacked and connected to two opposing surfaces in the thickness direction of the body 15. The two opposing surfaces of the first protective film layer 13 and the second protective film layer 14 are a first mounting surface 11 and a second mounting surface 12, respectively. A first device a is located on the first mounting surface 11, and a second device b is located on the second mounting surface 12. In this embodiment, the first portion 101 and the second portion 102 have the same layer structure, having the same first protective film layer 13, the second protective film layer 14, and the body 15, as well as the commonly formed first mounting surface 11 and second mounting surface 12. In other embodiments, the layer structures of the first portion 101 and the second portion 102 may be different.

[0110] The materials of the first protective film layer 13 and the second protective film layer 14 can be, but are not limited to, polyimide film and polyester film. Both the first protective film layer 13 and the second protective film layer 14 are used to protect the body 15 and insulate it. The material of the body 15 can be, but is not limited to, flexible copper clad laminate (FCCL). The body 15 has conductive lines for conducting current.

[0111] In this embodiment, the first reinforcing plate 40 and the second reinforcing plate 60 are fixedly connected by the positioning member 20 to fix the first reinforcing plate 40 and the second reinforcing plate 60 onto the flexible circuit board 10; this avoids the first reinforcing plate 40 from shifting or the second reinforcing plate 60 from being unstable or even unable to be installed due to the second connecting layer 50.

[0112] For example, holes or grooves are drilled in the first reinforcing plate 40 and the second reinforcing plate 60, and the positioning element 20 is formed by filling the holes or grooves with glue, solder paste, or resin. The positioning element 20 is mounted on the first part 101 of the flexible circuit board 10, and the first reinforcing plate 40 and the second reinforcing plate 60 are fixed to the first part 101 of the flexible circuit board 10. The positioning element 20 can prevent the relative displacement between the first reinforcing plate 40 and the second reinforcing plate 60 caused by the creep of the second connecting layer 50 itself, thus avoiding affecting the tolerance of the optical device to the whole machine, ensuring the installation accuracy and stability of the first reinforcing plate 40 and the second reinforcing plate 60 on the flexible circuit board 10, improving the assembly stability of the flexible circuit board assembly 100, and thus improving the installation accuracy of the first device a and the back shell 400.

[0113] Meanwhile, the positioning element 20 is directly formed in the hole or groove. Compared with the screw and screw hole, it will not damage the flexible circuit board 10. Moreover, the positioning element 20 and the flexible circuit board 10 have a high tightness. In addition, the process of drilling holes or grooves in the thinner first reinforcing plate 40 and second reinforcing plate 60 is simpler than that of screw holes. Compared with the prior art, fixing the flexible circuit board 10, the first reinforcing plate 40, the second reinforcing plate 60, the first connecting layer 30 and the second connecting layer 50 by combining the hole or groove with the filled and cured positioning element 20 not only improves the connection stability, but also avoids damage to the first reinforcing plate 40 and the second reinforcing plate 60 during the process, and reduces the process difficulty, achieving unexpected results.

[0114] Please see Figure 3 and Figure 4 , Figure 4 for Figure 3 An exploded structural diagram of a portion of the structure of a first embodiment of the electronic device shown.

[0115] In this embodiment, the positioning element 20 is formed by filling with glue, and the first reinforcing plate 40 and the second reinforcing plate 60 are connected and fixed to the flexible circuit board 10. The specific structure will be described through the following three implementation methods.

[0116] The flexible circuit board 10 also includes a through-hole 16. The through-hole 16 extends through the first mounting surface 11 and the second mounting surface 12 of the flexible circuit board 10. That is, the through-hole 16 extends through the first protective film layer 13, the second protective film layer 14, and the body 15 of the flexible circuit board 10. The through-hole 16 is used to accommodate part of the positioning member 20.

[0117] In this embodiment, the first reinforcing plate 40 is generally a rectangular plate. The first reinforcing plate 40 includes a first connecting surface 41 and a second connecting surface 42. The first connecting surface 41 and the second connecting surface 42 are arranged opposite to each other along the thickness direction of the first reinforcing plate 40. The first reinforcing plate 40 also includes a first through hole 43. Along the Z-axis direction, the first through hole 43 penetrates through the first connecting surface 41 and the second connecting surface 42. The first through hole 43 is used to accommodate a portion of the positioning member 20.

[0118] In this embodiment, the second reinforcing plate 60 is generally a rectangular plate. The second reinforcing plate 60 includes a first surface 61 and a second surface 62. The first surface 61 and the second surface 62 are disposed opposite to each other along the thickness direction of the second reinforcing plate 60. The second reinforcing plate 60 also includes an assembly groove 63. Along the Z-axis direction, the assembly groove 63 is recessed in the first surface 61, and the assembly groove 63 is recessed from the first surface 61 towards the second surface 62. The assembly groove 63 is used to accommodate a portion of the positioning member 20. In this embodiment, the assembly groove 63 is a blind groove, that is, the assembly groove 63 has a bottom wall of a certain thickness, and the bottom wall of the assembly groove 63 is opposite to the opening of the assembly groove 63. It can be understood that the bottom wall of the assembly groove 63 is formed in the second reinforcing plate 60.

[0119] The first connecting layer 30 connects the first connecting surface 41 of the first reinforcing plate 40 and the second mounting surface 12 of the flexible circuit board 10. The first connecting layer 30 includes a first through hole 31. The first through hole 31 extends through both surfaces of the first connecting layer 30 in the thickness direction. The first through hole 31 is used to accommodate a portion of the positioning member 20.

[0120] The second connecting layer 50 connects the first surface 61 of the second reinforcing plate 60 and the second connecting surface 42 of the first reinforcing plate 40. The second connecting layer 50 includes a second through hole 51. The second through hole 51 extends through both surfaces of the second connecting layer 50 in the thickness direction. The second through hole 51 is used to accommodate a portion of the positioning member 20.

[0121] It should be noted that, along the thickness direction of the flexible circuit board 10, the through hole 16 of the flexible circuit board 10, the first through hole 31 of the first connecting layer 30, the first through hole 43 of the first reinforcing plate 40, and the second through hole 51 of the second connecting layer 50 are connected and communicate with the mounting groove 63 to form a positioning groove M. The positioning groove M is used to accommodate part of the positioning member 20. It can be understood that the flexible circuit board assembly 100 has a positioning groove M, which is recessed in the flexible circuit board 10 and recessed towards the second reinforcing plate 60. The positioning groove M can be a through groove or a blind groove. In this embodiment, the through groove is through the thickness direction and has two openings, while the blind groove is partially recessed on the second reinforcing plate 60 and only forms an opening on one surface of the flexible circuit board 10. In this embodiment, the positioning groove M is a recess. The positioning groove M is recessed from the first mounting surface 11 of the flexible circuit board 10 towards the second surface 62 of the second reinforcing plate 60. The bottom wall of the assembly groove 63 is the bottom wall of the positioning groove M. The peripheral wall of the positioning groove M is formed by the hole wall of the through hole 16, the hole wall of the first through hole 31, the hole wall of the first through hole 43, the hole wall of the second through hole 51, and the peripheral wall of the assembly groove 63.

[0122] like Figure 3 and Figure 4 As shown, in this embodiment, the cross-section of the positioning member 20 is approximately "T"-shaped. The positioning member 20 includes a positioning body 21 and a positioning protrusion 22. Along the Z-axis direction, the positioning protrusion 22 is connected to one end of the positioning body 21 in the height direction. The cross-sections of both the positioning protrusion 22 and the positioning body 21 can be rectangular. In this embodiment, the positioning member 20 is formed by injecting molten adhesive into the positioning groove M and then cooling and solidifying it.

[0123] The positioning body 21 includes a first end face 211 and an outer peripheral face 212. The outer peripheral face 212 is disposed around the periphery of the first end face 211. The first end face 211 is located away from the positioning protrusion 22. The positioning protrusion 22 includes a second end face 221 and a first face 222. The second end face 221 and the first face 222 are disposed opposite to each other along the height direction (i.e., the Z-axis direction) of the positioning protrusion 22. The second end face 221 faces away from the positioning body 21. The first face 222 is connected to the outer peripheral face 212 of the positioning body 21. The orientation of the first face 222 is the same as the orientation of the first end face 211. It can be understood that the positioning member 20 includes a first end face 211 and a second end face 221, which are disposed opposite to each other along the height direction of the positioning member 20.

[0124] In this embodiment, the positioning body 21 is formed in the positioning groove M. The first end face 211 of the positioning body 21 is connected to the bottom wall of the positioning groove M. The outer peripheral face 212 of the positioning body 21 is connected to the peripheral wall of the positioning groove M. That is, the positioning body 21 is formed in the through hole 16 of the flexible circuit board 10, the first through hole 31 of the first connecting layer 30, the first through hole 43 of the first reinforcing plate 40, the second through hole 51 of the second connecting layer 50, and the assembly groove 63 of the second reinforcing plate 60. The outer peripheral face 212 is connected to the hole wall of the through hole 16, the hole wall of the first through hole 31, the hole wall of the first through hole 43, the hole wall of the second through hole 51, and the peripheral wall of the assembly groove 63. The first end face 211 is connected to the bottom wall of the assembly groove 63. The positioning protrusion 22 protrudes and is connected to the surface of the flexible circuit board 10 where the first device a is provided. The first surface 222 of the positioning protrusion 22 is connected to the first mounting surface 11 of the flexible circuit board 10.

[0125] Understandably, glue is filled into the positioning groove M, and after the glue cures, a positioning component 20 with a "rivet" structure is formed. That is, the part of the glue that overflows from the positioning groove M cures to form the positioning protrusion 22 of the positioning component 20, and the other part of the glue located in the positioning groove M cures to form the positioning body 21 of the positioning component 20.

[0126] In the flexible circuit board assembly 100 of this embodiment, the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 are bonded together by the positioning member 20 to fix the first reinforcing plate 40 and the second reinforcing plate 60 onto the flexible circuit board 10. Since the positioning member 20, formed after the adhesive has cured, has a certain degree of hardness, even if the second connecting layer 50 melts during the second heating, the positioning member 20 can still prevent the second reinforcing plate 60 from displacing relative to the first reinforcing plate 40, ensuring the installation accuracy and stability of the first reinforcing plate 40 and the second reinforcing plate 60, improving the connection reliability between the first reinforcing plate 40 and the second reinforcing plate 60 and the flexible circuit board 10, and enhancing the installation accuracy of the first device a. Furthermore, the positioning member 20 can effectively prevent the first reinforcing plate 40 and the second reinforcing plate 60 from misaligning relative to each other when the flexible circuit board assembly 100 is under continuous stress, further improving the connection reliability between the first reinforcing plate 40 and the second reinforcing plate 60 and the flexible circuit board 10. Furthermore, the second reinforcing plate 60 is provided with an assembly groove 63, which prevents glue from overflowing onto the second surface 62 of the second reinforcing plate 60, thereby ensuring the flatness of the second surface 62 of the second reinforcing plate 60 and facilitating the bonding of the second reinforcing plate 60 to the bracket B.

[0127] Please see Figure 5 and Figure 6 , Figure 5 for Figure 1 A schematic diagram of a portion of the structure of a second embodiment of the first embodiment of the electronic device shown. Figure 6for Figure 5 An exploded view of a portion of the structure of a second embodiment of the first embodiment of the electronic device shown.

[0128] Unlike the first embodiment described above, in this embodiment, the positioning groove M is a through groove, and the structure of the second reinforcing plate 60 is different. In this embodiment, the assembly groove 63 of the second reinforcing plate 60 is a through groove. The assembly groove 63 extends through the first surface 61 and the second surface 62 of the second reinforcing plate 60. The assembly groove 63 is used to accommodate part of the positioning member 20.

[0129] Along the Z-axis, the assembly groove 63 communicates with the through hole 16 of the flexible circuit board 10, the first through hole 31 of the first connecting layer 30, the first through hole 43 of the first reinforcing plate 40, the second through hole 51 of the second connecting layer 50, and the assembly groove 63 of the second reinforcing plate 60, forming a positioning groove M. It can be understood that the positioning groove M penetrates through the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60. The peripheral wall of the positioning groove M is formed by the walls of the through hole 16, the first through hole 31, the first through hole 43, the second through hole 51, and the peripheral wall of the assembly groove 63. The positioning groove M is used to accommodate part of the positioning component 20.

[0130] The positioning member 20 in this embodiment has the same structure as the positioning member 20 in the first embodiment described above, and it also has a positioning body 21 and a positioning protrusion 22. In this embodiment, the first surface 222 of the positioning protrusion 22 is connected to the first mounting surface 11 of the flexible circuit board 10. The positioning body 21 is formed in the positioning groove M. The outer peripheral surface 212 of the positioning body 21 is connected to the groove peripheral wall of the positioning groove M. The first end face 211 of the positioning body 21 is exposed in the positioning groove M and is flush with the second surface 62 of the second reinforcing plate 60 to ensure the flatness of the second surface 62 of the second reinforcing plate 60, which is beneficial for the second reinforcing plate 60 to be bonded to the bracket B. That is, the positioning body 21 is formed in the through hole 16 of the flexible circuit board 10, the first through hole 31 of the first connecting layer 30, the first through hole 43 of the first reinforcing plate 40, the second through hole 51 of the second connecting layer 50, and the assembly groove 63 of the second reinforcing plate 60. The outer peripheral surface 212 of the positioning body 21 is connected to the wall of the through hole 16, the wall of the first through hole 31, the wall of the first through hole 43, the wall of the second through hole 51, and the peripheral wall of the assembly groove 63. The first end face 211 exposes the assembly groove 63 of the second reinforcing plate 60.

[0131] Understandably, adhesive is injected into the positioning groove M. Part of the adhesive cures within the positioning groove M to form the positioning body 21 of the positioning element 20, while the remaining adhesive overflows from the positioning groove M and cures to form the positioning protrusion 22 of the positioning element 20. The positioning element 20 is bonded to the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 to fix the first reinforcing plate 40 and the second reinforcing plate 60 onto the flexible circuit board 10.

[0132] In this embodiment, the contact area between the outer peripheral surface 212 of the positioning member 20 and the second reinforcing plate 60 is increased, which increases the connection stability between the positioning member 20 and the second reinforcing plate 60, thereby increasing the connection reliability between the first reinforcing plate 40 and the second reinforcing plate 60 and the positioning member 20. This further reduces the possibility of relative displacement between the first reinforcing plate 40 and the second reinforcing plate 60, ensuring the installation accuracy and stability of the first reinforcing plate 40 and the second reinforcing plate 60, and improving the connection reliability between the first reinforcing plate 40 and the second reinforcing plate 60 and the flexible circuit board 10, thereby improving the assembly stability of the flexible circuit board assembly 100 and thus improving the installation accuracy of the first device a.

[0133] In addition, the assembly slot 63 of the second reinforcing plate 60 is directly through, which reduces the manufacturing cost and process difficulty of setting the assembly slot 63 as a blind slot.

[0134] It should be noted that, in this embodiment, since the adhesive has a certain fluidity, when the adhesive is injected into the positioning groove M, the adhesive will overflow onto the second surface 62 of the second reinforcing plate 60. If the second surface 62 requires flatness, when the adhesive overflows onto the second surface 62, tools such as scrapers can be used to clean, grind and flatten the adhesive that has overflowed onto the second surface 62 to ensure the flatness of the second surface 62, that is, the first end face 211 can be flush with the second surface 62 of the second reinforcing plate 60, thereby facilitating the bonding of the second reinforcing plate 60 to the bracket B.

[0135] In some other embodiments, when the flatness of the second surface 62 of the second reinforcing plate 60 is not required, adhesive can overflow onto the second surface 62 of the second reinforcing plate 60 and form a positioning protrusion 22. It is understood that the number of positioning protrusions 22 of the positioning member 20 can be one or two. When there is only one positioning protrusion 22, if the first mounting surface 11 of the flexible circuit board 10 has a flatness requirement, and the second surface 62 of the second reinforcing plate 60 does not have a flatness requirement, the positioning protrusion 22 of the positioning member 20 can also be located outside the positioning groove M and connected to the second surface 62 of the second reinforcing plate 60. When there are two positioning protrusions 22, that is, when neither the first mounting surface 11 of the flexible circuit board 10 nor the second surface 62 of the second reinforcing plate 60 has a flatness requirement, the two positioning protrusions 22 are respectively connected to opposite ends in the height direction of the positioning body 21 and are both located outside the positioning groove M. One positioning protrusion 22 has its first surface 222 connected to the first mounting surface 11 of the flexible circuit board 10, and the other positioning protrusion 22 has its first surface 222 connected to the second surface 62 of the second reinforcing plate 60. The structures of the two positioning protrusions 22 may be the same or different. This application does not impose any restrictions on this.

[0136] In this embodiment, the contents that are the same as those in the first embodiment described above will not be repeated.

[0137] Please see Figure 7 , Figure 7 for Figure 1 A schematic diagram of a portion of the structure of a third embodiment of the first embodiment of the electronic device shown.

[0138] Unlike the second embodiment described above, the structure of the positioning member 20 is different in this embodiment. In this embodiment, the positioning member 20 is a column. The positioning member 20 includes a first end face 211, an outer peripheral surface 212, and a second end face 221. The second end face 221 and the first end face 211 are arranged opposite to each other along the height direction of the positioning member 20. The outer peripheral surface 212 connects the second end face 221 and the first end face 211.

[0139] The positioning element 20 is fully formed in the positioning groove M and connects at least the first reinforcing plate 40 and the second reinforcing plate 60. Along the Z-axis, the first end face 211 of the positioning element 20 protrudes from the mounting groove 63 of the second reinforcing plate 60 and is flush with the second surface 62. The second end face 221 of the positioning element 20 is located within the positioning groove M. Along the Z-axis, the second end face 221 of the positioning element 20 is located between the first mounting surface 11 of the flexible circuit board 10 and the first connecting surface 41 of the first reinforcing plate 40. That is, the length of the positioning element 20 is less than the depth of the positioning groove M. The length of the positioning element 20 provides sufficient contact area between the first and second reinforcing plates 40 and the outer peripheral surface 212 of the positioning element 20, ensuring that the positioning element 20 can firmly connect the first and second reinforcing plates 40 and 60, thus avoiding relative displacement between the first and second reinforcing plates 40 and 60, thereby improving the assembly stability of the flexible circuit board assembly 100 and enhancing the installation accuracy of the first device a.

[0140] Understandably, adhesive is injected into the positioning groove M, and the amount of adhesive injected is controlled so that the adhesive cures to form the positioning element 20. Along the thickness direction of the flexible circuit board 10, the height of the positioning element 20 can be greater than or equal to the straight-line distance from the first connecting surface 41 of the first reinforcing plate 40 to the second surface 62 of the second reinforcing plate 60. In this embodiment, by controlling the amount of adhesive injected, the manufacturing cost of the flexible circuit board assembly 100 can be controlled while effectively ensuring a firm connection between the first reinforcing plate 40 and the second reinforcing plate 60 and the positioning element 20.

[0141] It should be noted that in this embodiment, if the first mounting surface 11 of the flexible circuit board 10 and the second surface 62 of the second reinforcing plate 60 require flatness, when adhesive overflows onto the first mounting surface 11 and / or the second surface 62, tools such as scrapers can be used to clean, grind, or perform other flattening treatments to ensure the flatness of the first mounting surface 11 and / or the second surface 62. In this embodiment, the content identical to that in the second embodiment described above will not be repeated.

[0142] In some other embodiments, the structure of the second reinforcing plate 60 may be the same as that of the second reinforcing plate 60 in the first embodiment, and the positioning groove M is a blind groove. A positioning member 20 is formed in the positioning groove M, with its first end face 211 connected to the bottom wall of the positioning groove M and its outer peripheral surface 212 connected to the peripheral wall of the positioning groove M. The second end face 221 of the positioning member 20 is located within the positioning groove M and protrudes along the Z-axis direction from the first connecting surface 41 of the first reinforcing plate 40. In this embodiment, details identical to those in the first embodiment will not be repeated.

[0143] Please see Figure 8 , Figure 8 for Figure 1 A schematic diagram of a portion of the structure of the second embodiment of the electronic device shown.

[0144] In the second embodiment, unlike the first embodiment, the positioning member 20 is formed by filling with resin, and its structure is different. In this embodiment, the structure of the positioning member 20 is different from... Figure 7 The positioning member 20 of the third embodiment of the first embodiment shown has the same structure, but the material of the positioning member 20 is the same as that of the positioning member 20. Figure 7 The positioning element 20 shown is made of a different material. Compared to glue, resin is easier to cure and mold, and the positioning element 20 formed by resin is easier to grind with a scraper, making the processing of the electronic device 1000 faster and easier.

[0145] The specific structure in this embodiment will be described through the following two implementation methods, and the content that is the same as in the first embodiment above will not be repeated.

[0146] like Figure 8 As shown, in this embodiment, the structure of the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 is similar to... Figure 3 The flexible circuit board 10, first connecting layer 30, first reinforcing plate 40, second connecting layer 50, and second reinforcing plate 60 in the first embodiment shown have the same structure. The structure of the positioning groove M is the same as... Figure 3 The positioning groove M in the first embodiment shown has the same structure as the positioning groove in the first implementation of the first embodiment, and it is a blind groove.

[0147] The difference is that the positioning member 20 is made of resin material. The positioning member 20 is a cylinder. The positioning member 20 is formed in the positioning groove M, and its outer peripheral surface 212 is connected to the groove wall of the positioning groove M to ensure reliable connection between the first reinforcing plate 40 and the second reinforcing plate 60 and the flexible circuit board 10. The first end face 211 of the positioning member 20 is connected to the bottom wall of the positioning groove M, and the second end face 221 of the positioning member 20 protrudes from the positioning groove M and is flush with the first mounting surface 11 of the flexible circuit board 10. That is, the second end face 221 of the positioning member 20 protrudes from the through hole 16 of the flexible circuit board 10. The first end face 211 of the positioning member 20 is connected to the bottom wall of the positioning groove M. The outer peripheral surface 212 of the positioning member 20 is connected to the peripheral wall of the positioning groove M. Since the positioning groove M is a blind groove, the resin will not overflow to the second surface 62 of the second reinforcing plate 60 when filling, thus ensuring the flatness of the second surface 62 of the second reinforcing plate 60, which is conducive to the bonding of the second reinforcing plate 60 and the bracket B.

[0148] In some possible implementations, because resin has a certain fluidity, if a large amount of resin is filled into the positioning groove M, the resin may overflow onto the first mounting surface 11 of the flexible circuit board 10. If the first mounting surface 11 requires flatness, when resin overflows onto the first mounting surface 11, tools such as scrapers can be used to clean, grind, or perform other flattening treatments to ensure the flatness of the first mounting surface 11.

[0149] Please see Figure 9 , Figure 9 for Figure 1 A schematic diagram of a portion of the structure of a second embodiment of the electronic device shown.

[0150] With the above Figure 8 The second embodiment shown differs from the first implementation in that the structure of the second reinforcing plate 60 is different in this embodiment; its assembly groove 63 is a through groove. The assembly groove 63 penetrates the first surface 61 and the second surface 62 of the second reinforcing plate 60, meaning the positioning groove M is a through groove. The positioning member 20 is completely formed in the positioning groove M.

[0151] Specifically, the second end face 221 of the positioning member 20 protrudes from the through hole 16 of the flexible circuit board 10 and is flush with the first mounting surface 11 of the flexible circuit board 10. The first end face 211 of the positioning member 20 protrudes from the mounting groove 63 of the second reinforcing plate 60 and is flush with the second surface 62 of the second reinforcing plate 60. In this embodiment, the sum of the thicknesses of the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 is equal to the height of the positioning member 20, that is, the height of the positioning member 20 is equal to the depth of the positioning groove M. The positioning member 20 can be well connected to the flexible circuit board 10, the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60, thereby ensuring the reliability of the connection between the first reinforcing plate 40 and the second reinforcing plate 60 and the flexible circuit board 10.

[0152] It should be noted that, in this embodiment, because resin has a certain fluidity, if a large amount of resin is filled into the positioning groove M, resin may overflow onto the second surface 62 of the second reinforcing plate 60 and / or the first mounting surface 11 of the flexible circuit board 10. If the second surface 62 and / or the first mounting surface 11 require flatness, when resin overflows onto the second surface 62 and / or the first mounting surface 11, tools such as scrapers can be used to clean, grind, or perform other flattening treatments on the resin overflowing onto the second surface 62 and / or the first mounting surface 11, thereby ensuring the flatness of the second surface 62 and / or the first mounting surface 11.

[0153] In this embodiment, the contents that are the same as those in the first embodiment of the second embodiment described above will not be repeated.

[0154] Please see Figure 10 and Figure 11 , Figure 10 for Figure 1 A schematic diagram of a partial structure of the third embodiment of the electronic device shown. Figure 11 for Figure 10 An exploded view of a portion of the structure of the first embodiment of the third embodiment of the electronic device shown.

[0155] In the third embodiment, the positioning element 20 is made of tin and formed by a filling method, and the structure of the positioning element 20 is different. In this embodiment, the structure of the positioning element 20 is different from that of the positioning element 20. Figure 3 The positioning member 20 in the first embodiment shown has a different structure, and the material of the positioning member 20 is different from that of the positioning member 20. Figure 3 The positioning element 20 shown is made of different materials. In this embodiment, the structure of the second reinforcing plate 60 is also different; it is a complete plate structure. In this embodiment, the structure of the through-hole 16 of the flexible circuit board 10 is also different.

[0156] In this embodiment, the process of forming the positioning element 20 using solder paste can be performed simultaneously with the soldering process of the first device a, simplifying the fabrication process of the flexible circuit board assembly 100. Furthermore, during the process of forming the positioning element 20 with solder paste, when the solder paste reaches a certain temperature, the solvents and additives inside the solder paste will evaporate. Therefore, after the solder paste cools and solidifies, the connection performance between the first reinforcing plate 40 and the second reinforcing plate 60 and the positioning element 20 is more stable and durable. This increases the connection reliability between the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 and the positioning element 20, ensuring the connection reliability of the first reinforcing plate 40 and the second reinforcing plate 60 on the flexible circuit board 10, thereby increasing the installation accuracy of the first device a.

[0157] The specific structure in this embodiment will be described through the following two implementation methods, and the content that is the same as in the first embodiment above will not be repeated.

[0158] like Figure 10 and Figure 11As shown, in this embodiment, the through-hole 16 of the flexible circuit board 10 is a stepped hole, which includes a first sub-through-hole 161 and a second sub-through-hole 162. The first sub-through-hole 161 communicates with the second sub-through-hole 162. The diameter of the first sub-through-hole 161 is larger than the diameter of the second sub-through-hole 162. The first sub-through-hole 161 penetrates two opposing surfaces in the thickness direction of the first protective film layer 13. That is, the first sub-through-hole 161 penetrates the first mounting surface 11. The first sub-through-hole 161 exposes a portion of the surface of the body 15. The second sub-through-hole 162 penetrates the body 15 and the second protective film layer 14. A step is formed between the first sub-through-hole 161 and the second sub-through-hole 162. Both the first sub-through-hole 161 and the second sub-through-hole 162 are used to accommodate a portion of the positioning member 20. In this embodiment, the hole wall of the first sub-through-hole 161, the hole wall of the second sub-through-hole 162, and the surface of the body 15 exposed above the first sub-through-hole 161 together form the hole wall of the through-hole 16.

[0159] It is understandable that the first protective film layer 13 does not completely cover the body 15, and the orthographic projection of the first protective film layer 13 in the Z-axis direction is completely within the range of the orthographic projection of the body 15 in the Z-axis direction.

[0160] The through-hole 16 of the flexible circuit board 10, the first via 31 of the first connecting layer 30, the first through hole 43 of the first reinforcing plate 40, and the second through hole 51 of the second connecting layer 50 are connected to form a positioning groove M. The bottom wall of the positioning groove M is part of the first surface 61 of the second reinforcing plate 60. The peripheral wall of the positioning groove M is formed by the hole wall of the through-hole 16, the hole wall of the first via 31, the hole wall of the first through hole 43, and the hole wall of the second through hole 51.

[0161] In this embodiment, the positioning member 20 includes a positioning body 21 and a positioning protrusion 22. The positioning member 20 is made of solder paste. The cross-section of the positioning member 20 is approximately "rivet" shaped. The cross-section of the positioning protrusion 22 of the positioning member 20 is a semi-circular surface, and the second end face 221 of the positioning protrusion 22 is an arc-shaped surface. The cross-section of the positioning body 21 of the positioning member 20 is rectangular.

[0162] A positioning element 20 is formed in the positioning groove M. The positioning protrusion 22 is at least partially located within the first sub-through hole 161 and forms a step between the first sub-through hole 161 and the second sub-through hole 162. The first surface 222 of the positioning protrusion 22 is connected to the body 15 and exposed on the surface of the first sub-through hole 161. A positioning body 21 is formed in the positioning groove M. The outer peripheral surface 212 of the positioning body 21 is connected to the groove peripheral wall of the positioning groove M. The first end face 211 of the positioning body 21 is connected to the bottom wall of the positioning groove M. That is, the positioning body 21 is formed in the through hole 16, the first through hole 31, the first through hole 43, and the second through hole 51. The outer peripheral surface 212 of the positioning body 21 is connected to the hole wall of the through hole 16, the hole wall of the first through hole 31, the hole wall of the first through hole 43, and the hole wall of the second through hole 51. The first end face 211 of the positioning body 21 is connected to the first surface 61 of the second reinforcing plate 60. The positioning member 20 is connected and fixed to the first connecting layer 30, the first reinforcing plate 40, the second connecting layer 50, and the second reinforcing plate 60 to prevent relative displacement between the first reinforcing plate 40 and the flexible circuit board 10 and between the first reinforcing plate 40 and the second reinforcing plate 60. This ensures the reliability of the connection between the flexible circuit board 10 and the first reinforcing plate 40 and the second reinforcing plate 60, thereby ensuring the installation accuracy and stability of the first reinforcing plate 40 and the second reinforcing plate 60, and thus improving the assembly stability of the flexible circuit board assembly 100 and increasing the installation accuracy of the first device a.

[0163] Understandably, solder paste is filled into the positioning groove M, reaching the first sub-through hole 161, and then cooled and solidified to form a positioning element 20 with a "rivet" structure. That is, a portion of the solder paste located in the positioning groove M cools and solidifies to form the positioning body 21 of the positioning element 20, and another portion of the solder paste overflowing into the first sub-through hole 161 cools and solidifies to form the positioning protrusion 22 of the positioning element 20.

[0164] Please see Figure 12 , Figure 12 for Figure 1 A schematic diagram of a portion of the structure of the second embodiment of the third embodiment of the electronic device shown.

[0165] With the above Figure 10The third embodiment shown differs from the first implementation in that, in this embodiment, a nickel layer is provided on the wall of the first through hole 43, the wall of the first via hole 31, the wall of the second via hole 51, and the first surface 61 of the second reinforcing plate 60. A copper layer is provided on the wall of the second sub-through hole 162 and on the surface of the body 15 exposed above the first sub-through hole 161. A positioning member 20 is formed in the positioning groove M and connected to the nickel and copper layers. Since both the copper and nickel layers are made of solder-affinity materials, when solder paste is filled into the positioning groove M, the copper and nickel layers allow the solder paste to better accumulate inside the positioning groove M, increasing the connection stability between the first reinforcing plate 40 and the second reinforcing plate 60 and the positioning member 20, thereby ensuring the connection reliability between the flexible circuit board 10 and the first reinforcing plate 40 and the second reinforcing plate 60.

[0166] This can be understood as a metallization process performed on the wall of the positioning groove M to form a metal layer 90, which is connected to the positioning component 20. In this embodiment, both the first reinforcing plate 40 and the second reinforcing plate 60 are made of metal materials and can better bond with the metal layer 90. The metal layer 90 includes the aforementioned nickel layer and the aforementioned copper layer. The metal layer 90 can also be made of tin-affinity metal materials such as copper and nickel, and can be formed on the bottom wall and part of the peripheral wall of the positioning groove M by methods not limited to physical vapor deposition (PVD) and chemical vapor deposition (CVD).

[0167] In some other embodiments, since the body 15 is made of copper, the metal layer 90 may consist of only a nickel layer. When soldering filled solder paste in the positioning groove M, the body 15 and the nickel layer enable the solder paste to better accumulate inside the positioning groove M.

[0168] The contents that are the same as those in the first embodiment of the third embodiment described above will not be repeated here.

[0169] In any of the above embodiments, the peripheral wall of the positioning groove M can be a stepped structure, that is, the aperture sizes of the multiple holes constituting the positioning groove M can be different. For example, as shown... Figure 13 , Figure 13 for Figure 1 A schematic diagram of a partial structure of the fourth embodiment of the electronic device shown. Wherein, Figure 13The positioning groove M is a through groove, and the assembly groove 63 of the second reinforcing plate 60 is a through groove. The diameter of the assembly groove 63 is larger than the diameter of the first through hole 43 of the first reinforcing plate 40. The positioning body 21 of the positioning component 20 has a trapezoidal cross section. This can increase the connection area between the first reinforcing plate 40 and the second reinforcing plate 60 and the positioning component 20, thereby improving the connection stability between the positioning component 20 and the first reinforcing plate 40 and the second reinforcing plate 60.

[0170] like Figure 14 , Figure 14 for Figure 1 The flowchart shown illustrates the manufacturing method of the electronic device. The manufacturing method of the electronic device in this embodiment includes:

[0171] Step S1: Connect the first reinforcing plate to one surface of the flexible circuit board, and connect the third reinforcing plate to another surface of the flexible circuit board.

[0172] Specifically, the first reinforcing plate 40 is mounted on the first portion 101 of the flexible circuit board 10 and connected to the second mounting surface 12 of the first portion 101 via the first connecting layer 30. Pressure can be applied to the first reinforcing plate 40 on the flexible circuit board 10 so that the first reinforcing plate 40 can be well adhered to the first portion 101 of the flexible circuit board 10.

[0173] The third reinforcing plate 70 is mounted on the second part 102 of the flexible circuit board 10 and connected to the first mounting surface 11 of the second part 102 through the third connecting layer 80. Pressure is applied to the third reinforcing plate 70 on the flexible circuit board 10 so that the third reinforcing plate 70 can be well bonded to the second part 102 of the flexible circuit board 10.

[0174] Step S2: The second device is soldered to the surface of the flexible circuit board, and the second device and the third reinforcing plate are opposite each other along the thickness direction of the flexible circuit board.

[0175] Step S3: Solder the first device onto the surface of the circuit board, with the first device facing the first reinforcing plate.

[0176] Specifically, the first mounting surface 11 of the first part 101 and the second mounting surface 12 of the second part 102 are surface treated (such as cleaning, flattening, etc.), and solder paste is applied to the first mounting surface 11 of the first part 101 and the second mounting surface 12 of the second part 102 using surface mount technology (SMT), and the first device a and the second device b are soldered to the flexible circuit board 10.

[0177] Step S4: Connect the second reinforcing plate to the side of the first reinforcing plate facing away from the flexible circuit board.

[0178] Specifically, the second reinforcing plate 60 is mounted on the side of the first reinforcing plate 40 facing away from the flexible circuit board 10, and the second reinforcing plate 60 is connected to the first reinforcing plate 40 through the second connecting layer 50.

[0179] Step S5: Fill the molten positioning material into the positioning groove formed in the flexible circuit board, the first reinforcing plate and the second reinforcing plate and solidify it to form the positioning element connecting the flexible circuit board, the first reinforcing plate and the second reinforcing plate.

[0180] In this step, one approach is to create a positioning groove M after the second reinforcing plate 60 and the first reinforcing plate 40 are connected to the flexible circuit board 10. Another approach is to form holes in the second reinforcing plate 60 and the first reinforcing plate 40 before connecting them to the flexible circuit board 10, and then mate them.

[0181] In this embodiment, resin is used as an example for the positioning component. The shape of the positioning component can be arbitrary, such as... Figure 9 In a vacuum environment, resin is filled into the positioning groove M to form the positioning component matrix.

[0182] The protruding part of the positioning component base is surface-machined to form the positioning component 20. The positioning component 20 is connected to the peripheral wall of the positioning groove M.

[0183] In this step, if resin overflows outside the positioning groove M, such as onto the first mounting surface 11 of the flexible circuit board 10 or the second surface 62 of the second reinforcing plate 60, a scraper is used to clean, grind, or otherwise smooth the resin that has overflowed onto the first mounting surface 11 or the second surface 62, thereby ensuring the flatness of the second surface 62 and / or the first mounting surface 11.

[0184] The method also includes the steps of stamping and cutting off the structure at the edge of the flexible circuit board 10, and the step of performing functional tests to verify the functionality of the flexible circuit board assembly 100.

[0185] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The middle frame and the back shell are provided, wherein the back shell is installed on one side of the middle frame in the thickness direction, the back shell includes a light-transmitting hole, and a bracket is provided on the middle frame; A flexible circuit board assembly includes a first device, a flexible circuit board, a first connecting layer, a first reinforcing plate, a second connecting layer, and a second reinforcing plate. The first connecting layer connects the first reinforcing plate and the flexible circuit board, and the second connecting layer connects the first reinforcing plate and the second reinforcing plate. The first connecting layer, the first reinforcing plate, the second connecting layer, and the second reinforcing plate are stacked with the flexible circuit board. The first device is fixedly connected to the surface of the flexible circuit board facing away from the first reinforcing plate. The flexible circuit board assembly further includes a positioning element and a positioning groove. Along the thickness direction of the flexible circuit board assembly, the positioning groove is recessed from the surface of the flexible circuit board on which the first device is located toward the surface of the second reinforcing plate opposite to the surface of the flexible circuit board. The positioning groove at least penetrates the flexible circuit board, the first connecting layer, the first reinforcing plate and the second connecting layer. The positioning element is at least partially formed in the positioning groove and is at least connected to the peripheral wall of the positioning groove. The second reinforcing plate of the flexible circuit board assembly is connected to the surface of the bracket facing the rear shell, and the first device abuts against the rear shell and is opposite to the light-transmitting hole.

2. The electronic device according to claim 1, characterized in that, The positioning groove includes a bottom wall that connects to the peripheral wall of the groove, and the bottom wall is formed in the second reinforcing plate; The positioning element includes a first end face, which connects the peripheral wall of the groove and the bottom wall of the groove, and the first end face faces and is connected to the bottom wall of the groove.

3. The electronic device according to claim 1, characterized in that, The positioning groove also extends through the surface of the second reinforcing plate facing away from the flexible circuit board; The positioning element includes a first end face, which is connected to the surface of the second reinforcing plate facing away from the flexible circuit board.

4. The electronic device according to claim 2, characterized in that, The second reinforcing plate includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other along the thickness direction of the second reinforcing plate, the second surface faces away from the first reinforcing plate, the groove peripheral wall is connected to the first surface, and the first surface constitutes the surface of the bottom wall of the positioning groove; Alternatively, the second reinforcing plate may further include an assembly groove, which is a recessed groove and is recessed into the first surface. The bottom wall of the assembly groove is the bottom wall of the positioning groove, and the peripheral wall of the assembly groove is part of the peripheral wall of the positioning groove. The positioning element is connected to the bottom wall and peripheral wall of the assembly groove.

5. The electronic device according to any one of claims 1-4, characterized in that, Along the thickness direction of the flexible circuit board assembly, the length of the positioning element is less than or equal to the depth of the positioning groove.

6. The electronic device according to any one of claims 1-4, characterized in that, The positioning element includes a positioning body and a positioning protrusion, and the positioning protrusion is connected to the positioning body along the height direction of the positioning element; The positioning body is formed in the positioning groove, the positioning protrusion is located outside the positioning groove, and the positioning protrusion protrudes and is connected to the surface of the flexible circuit board on which the first device is located.

7. The electronic device according to claim 6, characterized in that, The flexible circuit board includes a first mounting surface and a second mounting surface disposed opposite to the first mounting surface. The flexible circuit board also has a through hole penetrating the first mounting surface and the second mounting surface. The through hole constitutes part of the positioning groove. The through hole includes a first sub-through hole and a second sub-through hole that are connected. The first sub-through hole penetrates the first mounting surface. The diameter of the first sub-through hole is larger than the diameter of the second sub-through hole, and a step is formed between the first sub-through hole and the second sub-through hole. The positioning protrusion is located in the first sub-through hole and connected to the step.

8. The electronic device according to any one of claims 1-4, characterized in that, The positioning element is made of solder paste, and the wall of the positioning groove is covered with a metal layer. The metal layer is made of a solder-affinity material, and the positioning element is formed in the positioning groove and connected to the metal layer.

9. The electronic device according to claim 1, characterized in that, The positioning component includes a positioning protrusion and a positioning body, wherein the positioning protrusion is connected to the positioning body; The positioning groove also penetrates the surface of the second reinforcing plate facing away from the flexible circuit board; the positioning element includes a first end face. The positioning body is formed in the positioning groove, and the positioning protrusion is located outside the positioning groove and connected to the side of the second reinforcing plate facing away from the first reinforcing plate.

10. The electronic device according to claim 1, characterized in that, The positioning component includes two positioning protrusions and a positioning body, wherein the two positioning protrusions are respectively connected to opposite ends of the positioning body in the height direction; The positioning groove also penetrates the surface of the second reinforcing plate facing away from the flexible circuit board; the positioning body is formed in the positioning groove, and the two positioning protrusions are formed outside the positioning groove, and the two positioning protrusions are respectively connected to the flexible circuit board and the second reinforcing plate.

11. The electronic device according to any one of claims 1-4, characterized in that, The positioning element is made of resin or colloid.

12. The electronic device according to claim 11, characterized in that, The first connecting layer is made of thermosetting adhesive, and the second connecting layer is made of pressure-sensitive adhesive.

13. The electronic device according to claim 1, characterized in that, The flexible circuit board includes a first part, a second part, and a connecting part connecting the first part and the second part. The extension direction of the first part is opposite to the extension direction of the second part, and the first device is connected to a surface of the first part. The electronic device further includes a second device, and the flexible circuit board assembly further includes a third reinforcing plate and a third connecting layer. The third connecting layer connects the third reinforcing plate and the second part, and the second device is connected to the surface of the second part facing away from the third reinforcing plate. Both the first device and the second device are connected to the flexible circuit board.

14. A flexible circuit board assembly, used in electronic devices, characterized in that, The flexible circuit board assembly includes a first device, a flexible circuit board, a first connecting layer, a first reinforcing plate, a second connecting layer, and a second reinforcing plate. The first connecting layer connects the first reinforcing plate and the flexible circuit board, and the second connecting layer connects the first reinforcing plate and the second reinforcing plate. The first connecting layer, the first reinforcing plate, the second connecting layer, and the second reinforcing plate are stacked with the flexible circuit board. The flexible circuit board further includes a first part, a second part, and a connecting part connecting the first part and the second part. The extension direction of the first part is opposite to the extension direction of the second part. The first device is connected to a surface of the first part. The first reinforcing plate is fixedly connected to the surface of the flexible circuit board facing away from the first device. The electronic device further includes a second device, and the flexible circuit board assembly further includes a third reinforcing plate and a third connecting layer. The third connecting layer connects the third reinforcing plate and the second portion, and the second device is connected to the surface of the second portion facing away from the third reinforcing plate. Both the first device and the second device are electrically connected to the flexible circuit board. The flexible circuit board assembly further includes a positioning element and a positioning groove. Along the thickness direction of the flexible circuit board assembly, the positioning groove is recessed from the surface of the flexible circuit board on which the first device is located toward the surface of the second reinforcing plate opposite to the surface of the flexible circuit board. The positioning groove at least penetrates the flexible circuit board, the first connecting layer, the first reinforcing plate and the second connecting layer. The positioning element is at least partially formed in the positioning groove and is at least connected to the peripheral wall of the positioning groove.

15. A method for manufacturing an electronic device, used to manufacture the electronic device as described in any one of claims 1-13, characterized in that, The method includes, The first reinforcing plate is connected to one surface of the flexible circuit board, and the third reinforcing plate is connected to another surface of the flexible circuit board, wherein the first reinforcing plate and the third reinforcing plate are located at both ends of the flexible circuit board; The second device is soldered to the surface of the flexible circuit board, and the second device and the third reinforcing plate are opposite each other along the thickness direction of the flexible circuit board; The first device is soldered to the surface of the circuit board, with the first device facing the first reinforcing plate, wherein the first device and the second device are located at both ends of the flexible circuit board and on two opposing surfaces. The second reinforcing plate is connected to the side of the first reinforcing plate that faces away from the flexible circuit board; The molten positioning material is filled into the positioning grooves formed in the flexible circuit board, the first reinforcing plate and the second reinforcing plate and solidified to form the positioning element connecting the flexible circuit board, the first reinforcing plate and the second reinforcing plate.

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