Bonding glue conveying control system

Abstract

The invention relates to a bonding glue conveying control system. The system comprises a glue tank; a buffer tank; a gluing module; a vacuum module; a glue discharging module; a voltage stabilizing module; the buffer tank selectively communicates with at least one of the glue tank, the gluing module, the vacuum module, the glue outlet module and the pressure stabilizing module so as to have a first state, a second state and a third state; in the first state, a liquid inlet of the buffer tank is communicated with a conveying port of the glue tank, a second gas inlet of the buffer tank is communicated with a negative pressure source, and a first gas inlet of the glue tank is communicated with a nitrogen source through a vacuum module; in the second state, the liquid outlet of the buffer tank is communicated with the gluing module, and the second gas inlet of the buffer tank is communicated with the nitrogen source through the glue outlet module; and when the buffer tank is in the third state, the second gas inlet of the buffer tank is communicated with the nitrogen source through the pressure stabilizing module, so that the conveying process of the glue solution is optimized, bubbles in the glue solution are effectively removed, and the purity and uniformity of the glue solution are improved.

Description

Technical Field

[0002] This application relates to the field of wafer bonding processing technology, specifically to a bonding adhesive delivery control system. Background Technology

[0003] In fields such as electronic packaging and chip manufacturing, the delivery and control of bonding adhesive has a significant impact on product quality and production efficiency. However, traditional bonding adhesive delivery systems lack control over adhesive replenishment, coating, and voltage stabilization, limiting the improvement of wafer production efficiency and the optimization of product quality.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0005] In view of this, embodiments of this application provide a bonding adhesive delivery control system to solve at least one problem existing in the prior art, comprising:

[0006] A glue container for storing bonding adhesive includes a first air inlet and a delivery port, wherein the first air inlet is used to connect to a nitrogen source;

[0007] A buffer tank includes a liquid inlet, a liquid outlet, and a second air inlet, wherein the liquid inlet is connected to the delivery port;

[0008] The adhesive application module is connected to the liquid outlet.

[0009] The vacuum module is connected to a vacuum source at one end and to a buffer tank at the other end via a second air inlet.

[0010] The dispensing module is connected to a nitrogen source at one end and to a buffer tank at the other end via a second air inlet.

[0011] The voltage regulator module is connected to a nitrogen source at one end and to a buffer tank at the other end via a second air inlet.

[0012] The buffer tank can be selectively connected to at least one of the glue tank, glue application module, vacuum module, glue dispensing module and voltage stabilizing module to have a first state, a second state and a third state;

[0013] When in the first state, the liquid inlet of the buffer tank is connected to the delivery port of the glue tank, the second air inlet of the buffer tank is connected to the negative pressure source, and the first air inlet of the glue tank is connected to the nitrogen source through the vacuum module;

[0014] When in the second state, the liquid outlet of the buffer tank is connected to the glue coating module, and the second air inlet of the buffer tank is connected to the nitrogen source through the glue outlet module;

[0015] When in the third state, the second air inlet of the buffer tank is connected to the nitrogen source through the pressure stabilizing module.

[0016] Optionally, the bonding adhesive delivery control system described above further includes a pneumatic valve connected between the buffer tank and the adhesive application module, and a first switching valve connected to the pneumatic valve, wherein the first switching valve is used to control the opening or closing of the pneumatic valve.

[0017] Optionally, the above-mentioned bonding adhesive delivery control system further includes a first bidirectional flow valve and a second bidirectional flow valve. The first bidirectional flow valve is connected to the first switching valve and the pneumatic valve through a first pipeline, and the second bidirectional flow valve is connected to the first switching valve and the pneumatic valve through a second pipeline. The first bidirectional flow valve is configured to shut off the pneumatic valve, and the second bidirectional flow valve is configured to back-suction after the pneumatic valve shuts off.

[0018] Optionally, in the above-mentioned bonding adhesive delivery control system, the pneumatic valve includes an inlet and an outlet, a first valve core disposed in a first chamber and a second valve core disposed in a second chamber, a first opening communicating with the first chamber and a second opening communicating with the second chamber, a first bidirectional flow valve communicating with the first opening, and a second bidirectional flow valve communicating with the second opening. The first valve core and the second valve core can move relative to the inlet under the action of an external force to make the inlet communicate with or shut off from the outlet.

[0019] Optionally, the bonding adhesive delivery control system described above further includes a clean gas source connected to the first switching valve.

[0020] Optionally, in the above-mentioned bonding adhesive delivery control system, the vacuum module includes a vacuum connecting pipe, a first solenoid valve disposed on the vacuum connecting pipe, and a main connecting pipe. One end of the vacuum connecting pipe is connected to a vacuum source, and the other end is connected to the main connecting pipe. The other end of the main connecting pipe is connected to the second air inlet of the buffer tank. The first solenoid valve is used to connect or disconnect the buffer tank from the vacuum source.

[0021] Optionally, in the above-mentioned bonding adhesive delivery control system, the dispensing module includes a dispensing connection pipe, a second solenoid valve disposed on the dispensing connection pipe, a pressure regulating valve with gauge, and a first branch pipe. One end of the dispensing connection pipe is connected to the nitrogen source, and the other end is connected to the first branch pipe, and the other end of the first branch pipe is connected to the main connection pipe. The second solenoid valve is used to connect or disconnect the nitrogen source from the buffer tank.

[0022] Optionally, in the above-mentioned bonding adhesive delivery control system, the pressure stabilizing module includes a pressure stabilizing connecting pipe, a third solenoid valve disposed on the pressure stabilizing connecting pipe, a pressure regulating valve, and a speed regulating valve. One end of the pressure stabilizing connecting pipe is connected to the nitrogen source, and the other end is connected to the first branch pipe.

[0023] Optionally, in the above-described bonding adhesive delivery control system, the adhesive tank further includes an exhaust port and a ball valve disposed on the exhaust port.

[0024] Optionally, the above-mentioned bonding adhesive delivery control system further includes a liquid level detection module, which includes a first liquid level detection element, a second liquid level detection element, a third liquid level detection element, and a fourth liquid level detection element arranged sequentially from top to bottom on the buffer tank.

[0025] Compared with existing technologies, this application has the following beneficial effects: By incorporating a glue tank, a buffer tank, a glue application module, a vacuum module, a glue dispensing module, and a pressure stabilizing module, and by controlling the buffer tank to selectively connect with at least one of these modules to work collaboratively in multiple states, the glue delivery process is optimized, air bubbles in the glue are effectively removed, and the purity and uniformity of the glue are improved. Furthermore, the system design emphasizes cost control, reducing reliance on complex equipment and lowering manufacturing and maintenance costs. Simultaneously, its efficient glue delivery and flexible process switching capabilities significantly shorten the production cycle and improve production efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a bonding adhesive delivery control system as shown in this embodiment.

[0027] Figure label:

[0028] 1-Glue container, 11-First air inlet, 12-Conveying port, 13-Exhaust port, 14-Ball valve;

[0029] 2-Buffer tank, 21-Liquid inlet, 22-Liquid outlet, 23-Second air inlet, 24-First liquid level detection element, 25-Second liquid level detection element, 26-Third liquid level detection element, 27-Fourth liquid level detection element;

[0030] 3-Glue application module;

[0031] 4-Vacuum module, 41-Vacuum connection pipe, 42-First solenoid valve, 43-Main connection pipe;

[0032] 5-Dispensing module, 51-Dispensing connecting pipe, 52-Second solenoid valve, 53-Pressure regulating valve with gauge, 54-First branch pipe;

[0033] 6-Voltage regulator module, 61-Voltage regulator connector, 62-Third solenoid valve, 63-Pressure regulator valve, 64-Speed ​​regulator valve;

[0034] 7-Pneumatic valve, 71-Inlet, 72-Outlet;

[0035] 8-First switching valve;

[0036] 9-First bidirectional flow valve, 91-First pipeline;

[0037] 10 - Second bidirectional flow valve, 101 - Second pipeline. Detailed Implementation

[0038] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0039] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0040] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0041] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0042] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0043] Please refer to Figure 1 As shown in the preferred embodiment of this application, a bonding adhesive delivery control system includes a glue tank 1 for storing bonding adhesive, a buffer tank 2 for temporarily storing bonding adhesive, a coating module 3, a vacuum module 4, a dispensing module 5, and a voltage stabilizing module 6. The glue tank 1 stores the bonding adhesive, the buffer tank 2 temporarily stores the bonding adhesive flowing out of the glue tank 1, allowing it to be deposited and defoamed before being delivered to the wafer, thus reducing the risk of defects and improving wafer bonding performance. The coating module 3 applies the defoamed bonding adhesive from the buffer tank 2 onto the wafer. The vacuum module 4 is able to pass through the buffer tank 2 to remove air bubbles generated by the bonding adhesive, achieving defoaming.

[0044] Specifically, the glue tank 1 includes a first air inlet 11, a delivery port 12, an exhaust port 13, and a ball valve 14 disposed on the exhaust port 13. The first air inlet 11 is used to connect to a nitrogen source, the delivery port 12 is used to connect to a buffer tank 2, and the exhaust port 13 is used to properly discharge the gas in the glue tank 1 to balance the pressure in the glue tank 1 and prevent the bonding glue from overflowing due to excessive pressure.

[0045] The buffer tank 2 includes a liquid inlet 21, a liquid outlet 22, and a second air inlet 23. The liquid inlet 21 is connected to the delivery port 12, and the liquid outlet 22 is connected to the adhesive coating module 3 to output bonding adhesive to the adhesive coating module 3. The second air inlet 23 is used to connect the vacuum module 4, the adhesive dispensing module 5, and the voltage stabilizing module 6. The specific connection can be adjusted according to the actual situation.

[0046] In this embodiment, the buffer tank 2 is also equipped with a liquid level detection module, which includes a first liquid level detection element 24, a second liquid level detection element 25, a third liquid level detection element 26, and a fourth liquid level detection element 27 arranged sequentially from top to bottom on the buffer tank 2. When the first liquid level detection element 24 is full, the second liquid level detection element 25 is upper liquid level detection, the third liquid level detection element 26 is replenishment detection, and the fourth liquid level detection element 27 is lower liquid level detection.

[0047] The adhesive application module 3 is connected to the liquid outlet 22; one end of the vacuum module 4 is connected to the vacuum source, and the other end is connected to the buffer tank 2 through the second air inlet 23; one end of the adhesive dispensing module 5 is connected to the nitrogen source, and the other end is connected to the buffer tank 2 through the second air inlet 23; one end of the pressure stabilizing module 6 is connected to the nitrogen source, and the other end is connected to the buffer tank 2 through the second air inlet 23.

[0048] In this embodiment, the buffer tank 2 can be selectively connected to at least one of the glue tank 1, glue application module 3, vacuum module 4, glue dispensing module 5, and voltage stabilizing module 6, so that multiple modules can work together to have multiple states, thereby realizing the delivery control of multiple bonding adhesives, improving the delivery of bonding adhesives and the ability to flexibly switch processes.

[0049] The system has several states, including a first state, a second state, and a third state. In the first state, the liquid inlet 21 of the buffer tank 2 is connected to the delivery port 12 of the glue tank 1, the second air inlet 23 of the buffer tank 2 is connected to a negative pressure source, and the first air inlet 11 of the glue tank 1 is connected to a nitrogen source through a vacuum module 4. This allows nitrogen to be introduced into the glue tank 1 to compress the bonding adhesive in the glue tank 1 into the buffer tank 2. Simultaneously, the buffer tank 2 is connected to the negative pressure source through the vacuum module 4, allowing the negative pressure source to remove air bubbles generated when the bonding adhesive falls into the buffer tank 2, preventing bonding adhesive containing air bubbles from being delivered to the wafer and reducing the bonding effect. It should be noted that in the first state, i.e., the glue replenishment state, the glue dispensing module 5, the voltage stabilizing module 6, and the glue coating module 3 are all inactive.

[0050] In the second state, the outlet 22 of the buffer tank 2 is connected to the coating module 3, and the second air inlet 23 of the buffer tank 2 is connected to the nitrogen source through the coating module 5. This allows nitrogen from the nitrogen source to enter the buffer tank 2 through the coating module 5 and compress the bonding adhesive temporarily stored inside the buffer tank 2, enabling the bonding adhesive to be transported from the outlet 22 to the coating module 3, thus achieving wafer coating. It should be noted that in the second state, both the vacuum module 4 and the voltage regulator module 6 are inactive.

[0051] In the third state, the second air inlet 23 of the buffer tank 2 is connected to the nitrogen source through the pressure stabilizing module 6, allowing the nitrogen source to input nitrogen into the buffer tank 2 through the pressure stabilizing module 6. This ensures that the buffer tank 2 is always in a nitrogen environment when it is under normal pressure for sedimentation and bubble elimination. It should be noted that in the third state, both the dispensing module 5 and the vacuum module 4 are inactive.

[0052] Furthermore, the control system also includes a pneumatic valve 7 connected between the buffer tank 2 and the glue application module 3, and a first switching valve 8 connected to the pneumatic valve 7. The first switching valve 8 is used to control the opening or closing of the pneumatic valve 7.

[0053] Furthermore, the control system also includes a first bidirectional flow valve 9 and a second bidirectional flow valve 10. The first bidirectional flow valve 9 is connected to the first switching valve 8 and the pneumatic valve 7 via a first conduit 91, and the second bidirectional flow valve 10 is connected to the first switching valve 8 and the pneumatic valve 7 via a second conduit 101. The first bidirectional flow valve 9 is configured to shut off the pneumatic valve 7, and the second bidirectional flow valve 10 is configured to draw back the pneumatic valve 7 after it has shut off. The advantage of this configuration is that after the adhesive coating module 3 operates, the first bidirectional flow valve 9 first shuts off the pneumatic valve 7, and then the second bidirectional flow valve 10 draws back the pneumatic valve 7, thereby drawing back the bonding adhesive after it has shut off, preventing the bonding adhesive from dripping from the adhesive coating module 3 onto the wafer.

[0054] Specifically, the pneumatic valve 7 includes an inlet 71 and an outlet 72, a first valve core disposed in a first chamber and a second valve core disposed in a second chamber, as well as a first opening communicating with the first chamber and a second opening communicating with the second chamber. A first bidirectional flow valve 9 communicates with the first opening, and a second bidirectional flow valve 10 communicates with the second opening. The first and second valve cores can move relative to the inlet 71 under the action of external force to connect or disconnect the inlet 71 from the outlet 72. In this embodiment, the control system also includes a clean gas source connected to the first switching valve 8. The clean gas provided by the clean gas source can drive the first or second valve core to move, thereby realizing the connection or disconnection of the inlet 71 from the outlet 72.

[0055] In this embodiment, the vacuum module 4 includes a vacuum connecting pipe 41, a first solenoid valve 42 disposed on the vacuum connecting pipe 41, and a main connecting pipe 43. One end of the vacuum connecting pipe 41 is connected to a vacuum source, and the other end is connected to the main connecting pipe 43. The other end of the main connecting pipe 43 is connected to the second air inlet 23 of the buffer tank 2. The first solenoid valve 42 is used to enable or disable the connection between the buffer tank 2 and the vacuum source.

[0056] The dispensing module 5 includes a dispensing connection pipe 51, a second solenoid valve 52 disposed on the dispensing connection pipe 51, a pressure regulating valve with gauge 53, and a first branch pipe 54. One end of the dispensing connection pipe 51 is connected to a nitrogen source, and the other end is connected to the first branch pipe 54. The other end of the first branch pipe 54 is connected to the main connection pipe 43. The second solenoid valve 52 is used to connect or disconnect the nitrogen source from the buffer tank 2.

[0057] The pressure stabilizing module 6 includes a pressure stabilizing connecting pipe 61, a third solenoid valve 62 installed on the pressure stabilizing connecting pipe 61, a pressure regulating valve 63, and a speed regulating valve 64. One end of the pressure stabilizing connecting pipe 61 is connected to a nitrogen source, and the other end is connected to a first branch pipe 54. The other end of the first branch pipe 54 is connected to a main connecting pipe 43. The pressure regulating valve 63 and the speed regulating valve 64 can control the intake pressure to prevent the pressure inside the buffer tank from being too high.

[0058] In summary, the working principle of the bonding adhesive delivery control system shown in this application is as follows: When the third liquid level detector on the buffer tank detects insufficient bonding adhesive in the buffer tank, the control module controls the valve between the nitrogen source and the adhesive tank to open, allowing the nitrogen source to provide nitrogen to the adhesive tank, thus providing positive pressure to deliver the bonding adhesive from the delivery port to the buffer tank, until the second liquid level detector detects insufficient bonding adhesive and stops delivering bonding adhesive from the adhesive tank to the buffer tank. Simultaneously, the first solenoid valve of the vacuum module opens, allowing the vacuum source to connect to the second air inlet of the buffer tank through the vacuum connection pipe and the main connection pipe. The vacuum source generates negative pressure to remove air bubbles present in the buffer tank. When the coating module needs to coat the wafer, the second solenoid valve of the dispensing module opens, allowing nitrogen supplied by the nitrogen source to pass through the dispensing connection pipe and the first branch pipe, as well as... The main connecting pipe enters the buffer tank through the second air inlet to provide positive pressure, thereby conveying the bonding adhesive in the buffer tank from the outlet and pneumatic valve to the coating module to complete the coating of the wafer. When the coating module is finished, the cleaning gas provided by the cleaning gas source can move the first valve core in the pneumatic valve through the first bidirectional flow valve, thereby cutting off the inlet and outlet. Then, the cleaning gas moves the second valve core in the pneumatic valve through the second bidirectional flow valve, thereby producing a back suction effect. When the system does not need to coat or replenish adhesive, the third solenoid valve of the pressure stabilizing module opens, allowing the nitrogen provided by the nitrogen source to enter the buffer tank through the outlet pressure stabilizing connecting pipe, the first branch pipe, and the second air inlet on the main connecting pipe and the buffer tank, so as to ensure that the buffer tank is always in a nitrogen environment when the buffer tank is undergoing precipitation and defoaming.

[0059] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A bonding adhesive delivery control system, characterized in that, include: A glue container for storing bonding adhesive includes a first air inlet and a delivery port, wherein the first air inlet is used to connect to a nitrogen source; A buffer tank includes a liquid inlet, a liquid outlet, and a second air inlet, wherein the liquid inlet is connected to the delivery port; The adhesive application module is connected to the liquid outlet. The vacuum module is connected to a vacuum source at one end and to a buffer tank at the other end via a second air inlet. The dispensing module is connected to a nitrogen source at one end and to a buffer tank at the other end via a second air inlet. The voltage regulator module is connected to a nitrogen source at one end and to a buffer tank at the other end via a second air inlet. The buffer tank can be selectively connected to at least one of the glue tank, glue application module, vacuum module, glue dispensing module and voltage stabilizing module to have a first state, a second state and a third state; When in the first state, the liquid inlet of the buffer tank is connected to the delivery port of the glue tank, the second air inlet of the buffer tank is connected to the negative pressure source, and the first air inlet of the glue tank is connected to the nitrogen source through the vacuum module; When in the second state, the liquid outlet of the buffer tank is connected to the glue coating module, and the second air inlet of the buffer tank is connected to the nitrogen source through the glue outlet module; When in the third state, the second air inlet of the buffer tank is connected to the nitrogen source through the pressure stabilizing module.

2. The bonding adhesive delivery control system according to claim 1, characterized in that, The control system further includes a pneumatic valve connected between the buffer tank and the glue application module, and a first switching valve connected to the pneumatic valve, wherein the first switching valve is used to control the opening or closing of the pneumatic valve.

3. The bonding adhesive delivery control system according to claim 2, characterized in that, The control system further includes a first bidirectional flow valve and a second bidirectional flow valve. The first bidirectional flow valve is connected to the first switching valve and the pneumatic valve through a first pipeline. The second bidirectional flow valve is connected to the first switching valve and the pneumatic valve through a second pipeline. The first bidirectional flow valve is configured to shut off the pneumatic valve, and the second bidirectional flow valve is configured to draw back after the pneumatic valve shuts off.

4. The bonding adhesive delivery control system according to claim 3, characterized in that, The pneumatic valve includes an inlet and an outlet, a first valve core disposed in a first chamber and a second valve core disposed in a second chamber, a first opening communicating with the first chamber and a second opening communicating with the second chamber, a first bidirectional flow valve communicating with the first opening, and a second bidirectional flow valve communicating with the second opening. The first valve core and the second valve core can move relative to the inlet under the action of an external force so that the inlet communicates with or is cut off from the outlet.

5. The bonding adhesive delivery control system according to claim 4, characterized in that, The control system also includes a clean gas source connected to the first switching valve.

6. The bonding adhesive delivery control system according to claim 1, characterized in that, The vacuum module includes a vacuum connecting pipe, a first solenoid valve mounted on the vacuum connecting pipe, and a main connecting pipe. One end of the vacuum connecting pipe is connected to a vacuum source, and the other end is connected to the main connecting pipe. The other end of the main connecting pipe is connected to the second air inlet of the buffer tank. The first solenoid valve is used to connect or disconnect the buffer tank from the vacuum source.

7. The bonding adhesive delivery control system according to claim 6, characterized in that, The dispensing module includes a dispensing connection pipe, a second solenoid valve, a pressure regulating valve with gauge, and a first branch pipe. One end of the dispensing connection pipe is connected to the nitrogen source, and the other end is connected to the first branch pipe. The other end of the first branch pipe is connected to the main connection pipe. The second solenoid valve is used to connect or disconnect the nitrogen source from the buffer tank.

8. The bonding adhesive delivery control system according to claim 7, characterized in that, The voltage stabilizing module includes a voltage stabilizing connecting pipe, a third solenoid valve disposed on the voltage stabilizing connecting pipe, a pressure regulating valve, and a speed regulating valve. One end of the voltage stabilizing connecting pipe is connected to the nitrogen source, and the other end is connected to the first branch pipe.

9. The bonding adhesive delivery control system according to any one of claims 1-8, characterized in that, The glue container also includes an exhaust port and a ball valve disposed on the exhaust port.

10. The bonding adhesive delivery control system according to any one of claims 1-8, characterized in that, The control system also includes a liquid level detection module, which includes a first liquid level detection element, a second liquid level detection element, a third liquid level detection element, and a fourth liquid level detection element arranged sequentially from top to bottom on the buffer tank.

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