Curing oven and heating system
By introducing temperature sensors and control systems into the curing oven, personalized adjustment of heating temperature is achieved, solving the problem of the single temperature range in existing curing ovens and improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN JT AUTOMATION EQUIP CO LTD
- Filing Date
- 2026-01-23
- Publication Date
- 2026-05-08
AI Technical Summary
Existing curing ovens have a relatively fixed heating and curing temperature that is difficult to adjust, resulting in poor adaptability to different process requirements and affecting production efficiency and product quality.
A curing oven and heating system were designed, including a chassis, heating element, flow guiding component, temperature sensor and control system. The temperature sensor detects the airflow temperature and the control system adjusts the heating temperature of the heating element to achieve personalized temperature control for different products to be cured.
It improves the adaptability of curing ovens, reduces the impact on product production efficiency and quality, and enhances the adaptability to different products.
Smart Images
Figure CN121994023A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of SMT equipment technology, and in particular to a curing oven and heating system. Background Technology
[0002] With the increasing penetration of SMT (Surface Mount Technology) into various products in production and daily life, the demand for PCB (Printed Circuit Board) products is also increasing, requiring PCB production equipment to have high production efficiency, low operating costs, simple maintenance, and small footprint. A curing oven is a device that raises the product temperature according to a specific heating curve to cure the adhesive. It can be used in the power electronics industry for curing, baking, drying, and aging PCBA adhesives.
[0003] The inventors of this application have discovered that different products require different heating and curing temperatures. Existing curing ovens have relatively uniform heating and curing temperatures that are difficult to adjust, resulting in poor adaptability to different process requirements, which can easily affect production efficiency and product quality. Summary of the Invention
[0004] In view of the above problems, embodiments of the present invention provide a curing oven and heating system that overcome or at least partially solve the above problems.
[0005] According to one aspect of this application, a curing oven is provided, comprising: a chassis with a heating chamber, the chassis further having a curing chamber communicating with the heating chamber, the curing chamber being used to accommodate a product to be cured; a heating element disposed within the heating chamber, the heating element being used to heat airflow within the heating chamber; a flow guiding assembly at least partially disposed within the heating chamber, the flow guiding assembly being used to guide airflow within the heating chamber to the curing chamber, the flow guiding assembly having a flow guiding outlet facing the curing chamber; a first rectifier disposed within the chassis, the first rectifier being located between the curing chamber and the heating chamber, the first rectifier having a first flow passage, the first flow passage being at least partially opposite to the flow guiding outlet; a temperature sensor disposed on the first rectifier, the temperature sensor being at least partially opposite to the flow guiding outlet; and a control system connected to the temperature sensor, the flow guiding assembly, and the heating element, the control system being used to control the temperature sensor, the flow guiding assembly, and the heating element.
[0006] In one optional embodiment, there are multiple heating chambers arranged along a first direction, each heating chamber being independently configured, and each heating chamber containing a heating element; there are multiple flow guiding components, one flow guiding component corresponding to one heating chamber; there are multiple temperature sensors, all disposed on the first rectifier, with each temperature sensor at least partially opposite to one flow guiding outlet; the chassis also has multiple return grooves disposed on two inner walls of the chassis along a second direction, spaced apart along the first direction, one end of each return groove connecting to the heating chamber, and the other end connecting to the curing chamber; the flow guiding outlet faces the curing chamber along a third direction, wherein the airflow from the flow guiding outlet flows towards the curing chamber along the third direction and at least partially returns from the multiple return grooves to the heating chamber.
[0007] In one alternative embodiment, the flow guiding assembly includes a fan, an impeller, and a volute. The volute is disposed within the heating chamber, the flow guiding outlet is located on the volute, the impeller is disposed within the volute, the fan is fixed relative to the casing, the output end of the fan is connected to the impeller, the fan is used to drive the impeller to rotate, and the impeller is used to guide the hot airflow in the heating chamber to the flow guiding outlet.
[0008] In one alternative embodiment, the curing oven further includes a second rectifier disposed at the flow outlet, the second rectifier having a second flow hole, the projection of the second flow hole along the third direction at least partially coinciding with the projection of the flow outlet.
[0009] In one alternative approach, along the third direction, the projections of the temperature sensor, the second flow orifice, and the flow outlet at least partially overlap.
[0010] In one alternative embodiment, the outer wall of the chassis is provided with a maintenance port communicating with the heating chamber, and the projection of the maintenance port at least partially coincides with the projection of the heating element along the second direction.
[0011] In one alternative embodiment, the chassis includes an inner shell and an outer shell, the outer shell covering the inner shell, the outer shell and the inner shell being spaced apart by a predetermined distance, and the curing chamber, the heating chamber and the reflux groove being located within the inner shell.
[0012] In an alternative embodiment, the chassis further includes a partition plate disposed on the inner shell, the partition plate being located between the curing chamber and the heating chamber, the flow guide outlet on the flow guide assembly being located on the partition plate, the partition plate and the first rectifier being provided with a buffer space spaced apart along the third direction upward, and the flow guide outlet and the first flow passage being connected to the buffer space.
[0013] In one alternative embodiment, the top of the chassis is further provided with an exhaust gas outlet, which is connected to the curing chamber, and the side wall of the chassis is further provided with an air inlet, which is connected to the heating chamber.
[0014] According to another aspect of this application, a heating system is provided, including a curing oven as described above.
[0015] The beneficial effects of this invention are as follows: Unlike existing technologies, this invention provides a chassis, a heating element, a flow guiding assembly, a first rectifier, a temperature sensor, and a control system. The chassis includes a heating chamber and a curing chamber connected to the heating chamber. The curing chamber contains the product to be cured. The heating element is located within the heating chamber and heats the airflow within it. The flow guiding assembly is at least partially located within the heating chamber and directs the airflow into the curing chamber. The flow guiding assembly has a flow outlet facing the curing chamber. The first rectifier is located within the chassis, between the curing chamber and the heating chamber. The first rectifier has a first flow-through hole, which is at least partially opposite to the flow outlet. The temperature sensor is located on the first rectifier and is at least partially opposite to the flow outlet. The control system is connected to... Connected to a temperature sensor, a flow guiding component, and a heating element, the control system can be used to control the temperature sensor, the flow guiding component, and the heating element. Compared to the relatively simple heating and curing temperature of curing ovens in related technologies, in this embodiment, the product to be cured is placed in the curing chamber. The user can use the control system to control the heating temperature of the heating element according to the curing temperature required for different products, and use the temperature sensor to detect the temperature of the airflow from the flow guiding outlet to the curing chamber. This allows for the adjustment of the heating temperature of the heating element to obtain different curing temperatures for different products, thereby improving the adaptability of the curing oven and reducing the impact on product production efficiency and product quality. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in specific embodiments of the present invention or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the overall structure of the curing oven according to an embodiment of the present invention from an angle; Figure 2 This is another schematic diagram of the overall structure of the curing oven according to an embodiment of the present invention; Figure 3 This is a side sectional view of the overall structure of the curing oven according to an embodiment of the present invention; Figure 4 This is another side sectional view of the overall structure of the curing oven in an embodiment of the present invention; Figure 5 This is a cross-sectional view of the overall structure of the curing oven in an embodiment of the present invention from another side. Figure 6 yes Figure 4 Enlarged schematic diagram of the structure at point A in the middle; Figure 7 This is a partial structural diagram of the curing oven according to an embodiment of the present invention; Figure 8 This is a schematic diagram of another part of the structure of the curing oven in an embodiment of the present invention; Figure 9 This is a schematic diagram of a portion of the curing oven structure according to an embodiment of the present invention from another angle. Detailed Implementation
[0018] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.
[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0020] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0021] Please see Figures 1-3The curing oven 1000 includes a chassis 10, a heating element 20, a flow guiding assembly 30, a first rectifier 40, a temperature sensor 50, and a control system. The heating element 20 is disposed within the heating chamber 10a of the chassis 10. The flow guiding assembly 30 directs the airflow within the heating chamber 10a to the curing chamber 10b of the chassis 10. The temperature sensor 50 is disposed on the first rectifier 40, which is located between the heating chamber 10a and the curing chamber 10b. The control system connects the heating element 20, the flow guiding assembly 30, and the temperature sensor 50. The chassis 10, the heating element 20, the flow guiding assembly 30, the first rectifier 40, the temperature sensor 50, and the control system are described in detail below.
[0022] To better explain the structure of the curing oven 1000, the structure of the curing oven 1000 will be described in conjunction with the X, Y, and Z axes. The X, Y, and Z axes are perpendicular to each other. The first direction (vertical direction) is along the Z axis, the second direction is along the X axis, and the third direction is along the Y axis.
[0023] For the aforementioned chassis 10 and heating element 20, such as Figure 2 and Figure 3 As shown, the chassis 10 is provided with a heating chamber 10a and a curing chamber 10b communicating with the heating chamber 10a. A heating element 20 is disposed within the heating chamber 10a and is used to heat the airflow within the heating chamber 10a. The heated airflow is guided into the curing chamber 10b by a flow guide assembly 30 to cure the product to be cured within the curing chamber 10b. It can be understood that the heating method of the heating element 20 includes, but is not limited to, heating wires, heating tubes, etc.
[0024] In some embodiments, please refer to the following: Figure 4 There are multiple heating chambers 10a, arranged along the first direction Z. These chambers are independently configured, and each chamber 10a contains a heating element 20. It is understood that the heating temperatures in different heating chambers 10a can be the same or different, and the user can set them according to actual needs. The hot airflow in each heating chamber 10a flows along the third direction Y towards the product to be cured in the curing chamber 10b under the action of the flow guiding component 30.
[0025] In some embodiments, the number of curing chambers 10b can be multiple, and the multiple curing chambers 10b are arranged along the first direction Z. The multiple curing chambers 10b are independently arranged, and each curing chamber 10b is connected to a heating chamber 10a. The same or different products to be cured can be placed in each curing chamber 10b.
[0026] In some embodiments, the chassis 10 is further provided with a return groove 10c, which is disposed on the two inner walls of the chassis 10 along the second direction X. One end of the return groove 10c is connected to the heating chamber 10a, and the other end of the return groove 10c is connected to the curing chamber 10b. The hot airflow in the heating chamber 10a flows towards the curing chamber 10b along the third direction Y, and at least partially flows back from the return groove 10c into the heating chamber 10a. Compared to the double-sided airflow method in the prior art, this embodiment uses a single-sided airflow method, which can reduce the impact of the opposing airflow from both sides. The single-sided airflow method requires fewer components, reduces the number of failure points, and can reduce maintenance difficulty and cost.
[0027] In some embodiments, the number of reflux grooves 10c is multiple, and the multiple reflux grooves 10c are disposed on two inner walls of the housing 10 along the second direction X, and the multiple reflux grooves 10c are arranged at intervals along the first direction Z. It can be understood that the reflux grooves 10c are used to realize the return of airflow in the curing chamber 10b to the heating chamber 10a. The number of reflux grooves 10c configured in a single curing chamber 10b is not specifically limited in this application. For example, a single curing chamber 10b is configured with two reflux grooves 10c, one reflux groove 10c is disposed on one inner wall of the housing 10 along the second direction X, and the other reflux groove 10c is disposed on the other inner wall of the housing 10 along the second direction X. Alternatively, a single curing chamber 10b is configured with four reflux grooves 10c, wherein two reflux grooves 10c are disposed on one inner wall of the housing 10 along the second direction X, and the other two reflux grooves 10c are disposed on the other inner wall of the housing 10 along the second direction X.
[0028] In some embodiments, please refer to the following: Figure 5 and Figure 6 The chassis 10 includes an inner shell 101 and an outer shell 102. The outer shell 102 covers the inner shell 101, and a preset distance is maintained between the outer shell 102 and the inner shell 101. The curing chamber 10b, the heating chamber 10a, and the reflux groove 10c are all located within the inner shell 101. The chassis 10, composed of the inner shell 101 and the outer shell 102, features a double-layer insulation structure to reduce heat loss and ensure normal heating of the product. It is understood that the distance between the outer shell 102 and the inner shell 101 is not specifically limited in this application, and users can set it according to their actual needs.
[0029] In some embodiments, the chassis 10 further includes a partition plate 103 disposed on the inner shell 101, located between the curing chamber 10b and the heating chamber 10a. A flow outlet 30a on the flow guiding assembly 30 is located on the partition plate 103. A buffer space 103a is provided between the partition plate 103 and the first rectifier 40 along a third direction Y. The flow outlet 30a and the first flow passage 40a are both connected to the buffer space 103a. Hot air flowing from the flow outlet 30a enters the buffer space 103a, and then flows from the buffer space 103a through the first flow passage 40a into the curing chamber 10b. The buffer space 103a can buffer the airflow flowing from the flow outlet 30a.
[0030] In some embodiments, the chassis 10 further includes a first side plate 108 and a second side plate 109 disposed opposite to each other along the second direction X. The inner shell 101 includes a first side wall 1011 and a second side wall 1012 disposed opposite to each other along the second direction X. The first side plate 108 and the second side plate 109 are both disposed inside the inner shell 101. The first side plate 108 and the first side wall 1011 of the inner shell 101 are spaced apart along the second direction X to form a first mounting channel 108a. The second side plate 109 and the second side wall 1012 of the inner shell 101 are spaced apart along the second direction X to form a second mounting channel 109a. The first mounting channel 108a and the second mounting channel 109a are both connected to the curing chamber 10b and the heating chamber 10a.
[0031] In some embodiments, please refer to the following: Figure 7 The chassis 10 also includes a return plate 104, and return grooves 10c are all located on the return plate 104. A portion of the return plate 104 is disposed in the first mounting channel 108a, and another portion of the return plate 104 is disposed in the second mounting channel 109a. In some embodiments, there are multiple return plates 104, which are arranged at intervals along the first direction Z. Each return plate 104 is provided with a return groove 10c. In the case of multiple return plates 104, multiple return grooves 10c are formed accordingly. It is understood that the return grooves 10c can be formed in other ways besides the above-described method, such as directly recessing the return grooves 10c on the first sidewall 1011 and / or the second sidewall 1012.
[0032] In some embodiments, the outer wall of the chassis 10 is provided with a maintenance port 105 communicating with the heating chamber 10a. Along the second direction X, the projection of the maintenance port 105 at least partially overlaps with the projection of the heating element 20. Users can replace or repair the heating element 20 through the maintenance port 105. In some embodiments, a cover plate 1051 is provided on the maintenance port 105. The cover plate 1051 is detachably connected to the chassis 10 and can be used to open or close the maintenance port 105. The cover plate 1051 can reduce the entry of external dust and impurities into the heating chamber 10a, thereby ensuring the normal operation of the heating element 20.
[0033] In some embodiments, the top of the chassis 10 is further provided with an exhaust gas outlet 106, which connects to the curing chamber 10b. The exhaust gas outlet 106 can be used to discharge volatile organic compounds, powders, etc., generated during the curing process from the chassis 10. Optionally, a suction assembly is connected to the exhaust gas outlet 106 to accelerate the emission efficiency of the exhaust gas at the outlet 106. It is understood that in some embodiments, the exhaust gas outlet 106 may be omitted, and the user can configure it according to actual needs.
[0034] In some embodiments, the side wall of the chassis 10 is also provided with an air inlet 107, which is connected to the heating chamber 10a. External airflow can enter the heating chamber 10a from the air inlet 107 and heat the heating element 20 located in the heating chamber 10a.
[0035] Regarding the aforementioned flow guiding component 30 and first rectifier 40, as Figure 3 and Figure 5 As shown, the flow guiding component 30 is at least partially disposed within the heating chamber 10a. The flow guiding component 30 guides the airflow within the heating chamber 10a to the curing chamber 10b. The flow guiding component 30 has a flow outlet 30a facing the curing chamber 10b. A first rectifier 40 is disposed within the housing 10, located between the curing chamber 10b and the heating chamber 10a. The first rectifier 40 has a first flow passage 40a, which is at least partially opposite to the flow outlet 30a. The hot airflow within the heating chamber 10a flows out from the flow outlet 30a under the action of the flow guiding component 30. The hot airflow passes through the first flow passage 40a and, under the rectifying effect of the first flow passage 40a, flows from the first flow passage 40a to the corresponding position in the curing chamber 10b. In this embodiment, the first rectifier 40 has a plate-like structure, and the first flow passage 40a passes through the first rectifier 40. It is understood that: the number of first flow holes 40a can be multiple, the multiple first flow holes 40a can be arranged in an array or other shapes, the multiple first flow holes 40a form a flow area, the first rectifier 40 can be provided with multiple flow areas, the multiple flow areas are arranged at intervals along the first direction Z, and each flow area is connected to a curing cavity 10b and a buffer space 103a on both sides.
[0036] In some embodiments, please refer to the following: Figure 8 The flow guiding assembly 30 includes a fan 301, an impeller 302, and a volute 303. The volute 303 is disposed within the heating chamber 10a, and the flow guiding outlet 30a is located on the volute 303. The impeller 302 is disposed within the volute 303. The fan 301 is relatively fixed to the casing 10, and the output end of the fan 301 is connected to the impeller 302. The fan 301 drives the impeller 302 to rotate, and the impeller 302 guides the hot airflow in the heating chamber 10a to the flow guiding outlet 30a. Specifically, the fan 301 drives the impeller 302 to rotate, and the rotating impeller 302 drives the airflow in the heating chamber 10a into the volute 303, and from the flow guiding outlet 30a on the volute 303 to the curing chamber 10b. Optionally, there are two flow guiding outlets 30a, which are arranged at intervals along the second direction X, and both flow guiding outlets 30a are located on the volute 303.
[0037] In some embodiments, the flow outlet 30a faces the curing chamber 10b along the third direction Y, and the airflow from the flow outlet 30a flows towards the curing chamber 10b along the third direction Y, and at least partially flows back to the heating chamber 10a from the plurality of return grooves 10c. Compared with the double-sided airflow method in the prior art, the single-sided airflow method in this embodiment can reduce the impact of the opposing airflow from both sides. The single-sided airflow method requires fewer components, reduces the number of failure points, and can reduce maintenance difficulty and cost.
[0038] It is understandable that when there are multiple heating chambers 10a, each heating chamber 10a requires a flow guiding component 30 to guide the airflow. Therefore, there can be multiple flow guiding components 30, with one flow guiding component 30 corresponding to one heating chamber 10a.
[0039] In some embodiments, please refer to the following: Figure 9 The curing oven also includes a second rectifier 60, which is disposed at the flow outlet 30a. The second rectifier 60 has a second flow-through hole 60a, and its projection along the third direction Y at least partially overlaps with the projection of the flow outlet 30a. The second rectifier 60 can rectify the hot airflow from the flow outlet 30a, preventing the hot airflow from directly impacting the first rectifier 40 and flowing into the curing chamber 10b. The second rectifier 60 can guide the hot airflow from the flow outlet 30a to the buffer space 103a, where the hot airflow converges, improving the uniformity of the hot airflow temperature. In some embodiments, the hot airflow from both flow outlets 30a converges in the buffer space 103a to improve the uniformity of the hot airflow temperature.
[0040] In some embodiments, along the third direction Y, the projections of the temperature sensor 50, the second flow orifice 60a, and the guide outlet 30a at least partially overlap. With this configuration, the hot gas flow from the guide outlet 30a flows through the second flow orifice 60a to the first rectifier 40, and then flows through the temperature sensor 50 located on the first rectifier 40. The temperature sensor 50 is used to detect the temperature of the gas flow into the curing chamber 10b.
[0041] For the aforementioned temperature sensor 50 and control system, such as Figure 3 and Figure 6 As shown, a temperature sensor 50 is disposed on the first rectifier 40, and at least partially opposite the flow outlet 30a. A control system is connected to the temperature sensor 50, the flow guide assembly 30, and the heating element 20. The control system can be used to control the temperature sensor 50, the flow guide assembly 30, and the heating element 20. Specifically, the temperature sensor 50 is used to detect the temperature of the airflow exiting the flow outlet 30a. The control system can be used to control the opening or closing of the temperature sensor 50, the flow guide assembly 30, and the heating element 20. The control system can also be used to control the rotation speed of the fan 301 in the flow guide assembly 30 to increase the airflow rate of the flow guide assembly 30. The control system can also be used to adjust the heating power of the heating element 20 to correspondingly increase or decrease the heating temperature of the heating element 20. Optionally, the temperature sensor 50 is a thermocouple, which is arranged in the first flow passage 40a of the first rectifier 40. The control system can be a PID control system. It is understood that, in addition to being mounted on the first rectifier 40, in some embodiments, the temperature sensor 50 may also be mounted alone or simultaneously on the second rectifier 60.
[0042] In some embodiments, there are multiple temperature sensors 50, all of which are disposed on the first rectifier 40, and one temperature sensor 50 is at least partially disposed opposite to a flow outlet 30a. Optionally, each temperature sensor 50 is disposed in a flow region.
[0043] In this embodiment of the invention, a housing 10, a heating element 20, a flow guiding component 30, a first rectifier 40, a temperature sensor 50, and a control system are provided. The chassis 10 includes a heating chamber 10a and a curing chamber 10b connected to the heating chamber 10a. The curing chamber 10b is used to accommodate the product to be cured. A heating element 20 is disposed within the heating chamber 10a and is used to heat the airflow within the heating chamber 10a. A flow guiding component 30 is at least partially disposed within the heating chamber 10a and is used to guide the airflow within the heating chamber 10a to the curing chamber 10b. The flow guiding component 30 has a flow outlet 30a facing the curing chamber 10b. A first rectifier 40 is disposed within the chassis 10 and is located between the curing chamber 10b and the heating chamber 10a. The first rectifier 40 has a first flow passage 40a, which is at least partially opposite to the flow outlet 30a. A temperature sensor 50 is disposed on the first rectifier 40. Temperature sensor 50 is at least partially disposed opposite to flow outlet 30a. Control system is connected to temperature sensor 50, flow guide assembly 30, and heating element 20. Control system can be used to control temperature sensor 50, flow guide assembly 30, and heating element 20. Compared with the relatively simple heating and curing temperature of curing ovens in related technologies, in this embodiment, the product to be cured is placed in curing chamber 10b. The user can use the control system to control the heating temperature of heating element 20 according to the curing temperature required for different products, and use temperature sensor 50 to detect the airflow temperature from flow outlet 30a to curing chamber 10b. This allows for adjustment of the heating temperature of heating element 20 to obtain different curing temperatures for different products, thereby improving the adaptability of curing oven and reducing the impact on product production efficiency and product quality.
[0044] This application also provides an embodiment of a heating system, which includes the curing oven 1000 as described above. The function and structure of the curing oven 1000 can be found in the above embodiments, and will not be repeated here.
[0045] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A curing oven, characterized in that, include: The chassis is provided with a heating chamber, and the chassis is also provided with a curing chamber that communicates with the heating chamber, the curing chamber being used to accommodate the product to be cured; A heating element is disposed within the heating chamber and is used to heat the airflow within the heating chamber; A flow guiding component is at least partially disposed within the heating chamber, the flow guiding component being used to guide the airflow within the heating chamber to the curing chamber, the flow guiding component being provided with a flow guiding outlet facing the curing chamber; A first rectifier is disposed inside the chassis. The first rectifier is located between the curing chamber and the heating chamber. The first rectifier is provided with a first flow hole, which is at least partially opposite to the flow outlet. A temperature sensor is disposed on the first rectifier, and the temperature sensor is at least partially disposed opposite to the flow outlet; A control system is connected to the temperature sensor, the flow guiding assembly, and the heating element. The control system can be used to control the temperature sensor, the flow guiding assembly, and the heating element.
2. The curing oven according to claim 1, characterized in that, The number of heating chambers is multiple, the multiple heating chambers are arranged along the first direction, the multiple heating chambers are independently arranged, and each heating chamber is provided with the heating element; The number of the flow guiding components is multiple, and one flow guiding component is correspondingly disposed in one of the heating chambers; The number of temperature sensors is multiple, and all of the multiple temperature sensors are disposed on the first rectifier. At least one of the temperature sensors is disposed opposite to one of the flow outlets. The chassis is also provided with a plurality of reflux grooves, which are disposed on the two inner walls of the chassis along the second direction. The plurality of reflux grooves are arranged at intervals along the first direction. One end of the reflux groove is connected to the heating chamber, and the other end of the reflux groove is connected to the curing chamber. The flow outlet is directed toward the curing chamber in a third direction, wherein the airflow from the flow outlet flows toward the curing chamber in the third direction and at least partially flows back to the heating chamber from the plurality of return grooves.
3. The curing oven according to claim 2, characterized in that, The flow guiding assembly includes a fan, an impeller, and a volute. The volute is disposed inside the heating chamber, the flow guiding outlet is located on the volute, the impeller is disposed inside the volute, the fan is fixed relative to the casing, the output end of the fan is connected to the impeller, the fan is used to drive the impeller to rotate, and the impeller is used to guide the hot airflow in the heating chamber to the flow guiding outlet.
4. The curing oven according to claim 3, characterized in that, The curing oven further includes a second rectifier, which is disposed at the flow outlet. The second rectifier has a second flow hole, and the projection of the second flow hole along the third direction at least partially overlaps with the projection of the flow outlet.
5. The curing oven according to claim 4, characterized in that, Along the third direction, the projections of the temperature sensor, the second flow orifice, and the flow outlet at least partially overlap.
6. The curing oven according to claim 2, characterized in that, The outer wall of the chassis is provided with a maintenance port that communicates with the heating chamber. Along the second direction, the projection of the maintenance port at least partially overlaps with the projection of the heating element.
7. The curing oven according to claim 2, characterized in that, The chassis includes an inner shell and an outer shell, the outer shell covering the inner shell, and the outer shell and the inner shell are spaced apart by a preset distance. The curing chamber, the heating chamber and the reflux groove are all located in the inner shell.
8. The curing oven according to claim 7, characterized in that, The chassis also includes a partition plate disposed on the inner shell. The partition plate is located between the curing chamber and the heating chamber. The flow outlet on the flow guiding assembly is located on the partition plate. The partition plate and the first rectifier are provided with a buffer space spaced upward along the third direction. The flow outlet and the first flow passage are both connected to the buffer space.
9. The curing oven according to claim 2, characterized in that, The top of the chassis is also provided with an exhaust gas outlet, which is connected to the curing chamber; the side wall of the chassis is also provided with an air inlet, which is connected to the heating chamber.
10. A heating system, characterized in that, The curing oven includes any one of claims 1-9.