Inlaying method for small-specification bar direct-reading spectrum analysis

Abstract

The invention discloses an inlaying method for small-specification bar direct-reading spectral analysis, and relates to the technical field of spectral analysis, the inlaying method comprises the following steps: S1, sample selection and early-stage pretreatment; s2, flattening the sample; s3, performing arch bending forming on the sample; s4, preparing an inlaying mold and an inlaying material; s5, embedding and forming; s6, curing the inlaid sample; and S7, polishing the inlaid sample. According to the method, through the complete process of sample selection and pretreatment, flattening, arch-shaped bending, inlaying forming, curing and polishing and grinding, flattening and arch-shaped bending are conducted on a small-specification bar firstly, then the to-be-polished and ground face is controlled to sink into an inlaying material by 1-2 mm, foam discharging and filling are conducted layer by layer, and it is guaranteed that the inlaying material and the sample are tightly combined; after curing, the sample and the inlay are coplanar through polishing and grinding, so that the small-specification bar can be directly detected on a machine, the problem that the small-specification bar cannot be directly subjected to direct-reading spectrum analysis is solved, and the accuracy and the reliability of component analysis are improved.

Description

Technical Field

[0001] This invention relates to the field of spectral analysis technology, specifically to an inlay method for direct-reading spectral analysis of small-sized rods. Background Technology

[0002] A direct-reading spectrometer is a rapid metal composition analysis instrument based on the principle of atomic emission spectroscopy. During detection, it can directly convert the characteristic spectral signals of elements in the sample into content values ​​and display them directly.

[0003] In the prior art, when performing elemental analysis with a direct-reading spectrometer, sufficient sealing between the sample and the excitation stage is required. However, small-sized rods with dimensions less than 14 mm cannot meet the detection size requirements of the spark excitation stage of the direct-reading spectrometer due to their inability to form an effective sealing structure with the excitation stage. This makes it impossible to guarantee the sealing and stability of the excitation during detection, thus preventing the direct component detection of such small-sized rods on the direct-reading spectrometer. Summary of the Invention

[0004] The purpose of this invention is to provide an embedding method for direct-reading spectral analysis of small-sized rods, so as to solve the problem mentioned in the background art that the size of the small-sized rods themselves cannot meet the detection size adaptation requirements of the spark excitation stage of the direct-reading spectrometer, and the excitation sealing and stability during detection cannot be guaranteed.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a mosaic method for direct-reading spectral analysis of small-diameter rods, specifically comprising the following steps: S1. Sample selection and pretreatment: Select small-sized bars to be tested, remove impurities from the surface of the bars, and ensure that the sample surface is clean and free of obvious adhering substances. S2. Sample flattening treatment: The small-sized bars after cleaning are flattened using a press, ensuring that the sample is subjected to uniform force during the flattening process. S3. Sample bow-shaped bending: The flattened sample is bent using a special bending tool to form a bow-shaped structure. S4. Preparation of inlay mold and inlay material: Select a suitable mold box and special inlay material, and inspect the materials; S5, Inlaying and Molding: Place the sample into the inlay box and fill the inlay box with inlay material; S6. Curing treatment of inlaid samples: Perform curing operation according to the selected inlay material type, and judge the completion of curing according to the judgment criteria. S7. Polishing of the inlaid specimen: Remove the fully cured inlay from the inlay box and polish the surface of the specimen to be polished.

[0006] Preferably, in step S3, after bending, the lower part of the sample forms a flat planar structure. This planar structure must be flat and free of warping, and in close contact with the bottom surface of the subsequent mounting box.

[0007] Preferably, in step S4, the preparation of the mounting mold and mounting material specifically includes the following: the mold is a circular mounting box, the mounting material is a special mounting material adapted to direct-reading spectral analysis, impurities on the inner wall of the mounting box are cleaned, and the mounting equipment is checked for normal operation.

[0008] Preferably, in step S5, the inlay forming specifically includes the following steps: S51. Place the bent and formed bow-shaped sample into a Φ25-30mm inlay box, so that the flat surface of the lower part of the sample is in complete and tight contact with the bottom surface of the inlay box, and initially fix the position of the sample. S52. Adjust the spatial position of the sample so that the upper surface of the sample to be polished faces the opening of the mounting box, ensuring that the surface to be polished is sunk into the preset position of the mounting material. S53. Fill the inlay box with inlay material, and pay attention to removing air bubbles layer by layer during the filling process to ensure that the inlay material completely covers the sample. S54. After filling, check the sample position again to confirm that the depth of the surface to be polished is still 1-2mm, and that the sample is not offset or tilted. Fill the inlay material to the specified scale of the inlay box.

[0009] Preferably, in step S6, the curing treatment of the embedded sample specifically includes the following steps: S61. Select curing method: Select the corresponding curing method according to the characteristics of the inlay material; S62. Hot pressing curing: Place the mounting box containing the sample and mounting material into the hot mounting machine, set the heating temperature and pressure parameters, and carry out hot pressing curing; S63, Cold mounting material: Place the mounting box containing the sample and mounting material in a room temperature environment and wait for it to solidify completely according to the curing time requirements of the mounting material. S64. Criteria for determining completion of curing: The insert is completely hardened and bonded to the sample as a whole. There are no cracks, bulges, or missing materials on the surface of the insert, and the sample does not fall off or shift.

[0010] Preferably, in step S7, the polishing treatment of the embedded sample specifically includes the following steps: S71. Equipment selection: Use a grinding device to gradually perform grinding and polishing; S72. Polishing operation: During the polishing process, keep the insert under uniform force and the polishing direction consistent to ensure that the polishing is always directed at the surface of the sample to be polished. S73. Precision requirements: After polishing, ensure that the surface of the sample and the surface of the insert are on the same plane, and the surface roughness Ra of the sample surface to be tested is ≤3.2μm; S74. Post-polishing cleaning: After polishing, wipe the polished surface with anhydrous ethanol to remove impurities, and let it dry for later use. S75. Final Verification: After polishing and cleaning, the inlaid sample is inspected to confirm that the surface to be tested is flat, without scratches or pores, the roughness meets the requirements, the sample is tightly bonded to the inlay material, there are no pores or gaps around the sample, no inlay material falls off, and the size of the effective test surface of the sample meets the size requirements after flattening.

[0011] Preferably, the grinding device includes a support frame, an adjustment mechanism, a grinding mechanism, and a positioning mechanism. The adjustment mechanism is installed inside the support frame, the positioning mechanism is installed on one side of the support frame, and the grinding mechanism is positioned above the positioning mechanism. The grinding mechanism includes a mounting plate and a belt assembly. A fixed plate is fixedly connected to the top of the mounting plate, and a second motor is fixedly connected to the top side of the fixed plate. A rotating bar is fixedly connected to the output end of the second motor through the fixed plate. A rotating plate is fixedly connected to one side of the rotating bar, and a first electric push rod is fixedly connected to one side of the rotating plate. A moving plate is fixedly connected to one end of the first electric push rod, and a third motor is fixedly connected to one side of the moving plate. A rotating rod is mounted to the output end of the third motor via the belt assembly. The rotating rod is rotatably connected to one side of the moving plate, and a grinding roller is fixedly connected to the other end of the rotating rod.

[0012] Preferably, a second guide rail is slidably connected to the other side of the movable plate, one side of the second guide rail is fixedly connected to the rotating plate, and a guide groove is provided on the inner ring surface of the mounting plate, and the end of the rotating bar is slidably connected to the inner side of the guide groove.

[0013] Preferably, the adjustment mechanism includes a first motor and a threaded rod. The output end of the first motor is fixedly connected to one end of the threaded rod. One side of the first motor is fixedly connected to one side of the support frame. The other end of the threaded rod is rotatably connected to the bottom side of the support frame. A sliding plate is threadedly connected to the outside of the threaded rod. One side of the sliding plate is fixedly connected to one end of the mounting plate. A first guide rail is slidably connected to the other side of the sliding plate. The other side of the first guide rail is fixedly connected to one side of the support frame.

[0014] Preferably, the positioning mechanism includes a mounting platform, one side of which is fixedly connected to one side of the support frame. A placement platform is fixedly connected to the top side of the mounting platform, and a second electric push rod is fixedly connected to the bottom side of the placement platform. There are four second electric push rods, which are evenly distributed in a circular array around the center line of the placement platform. A moving block is fixedly connected to one end of each second electric push rod. One side of the moving block is slidably connected to the bottom side of the placement platform, and a clamping block is fixedly connected to one end of the moving block.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention employs a complete process involving sample selection and pretreatment, flattening, bow bending, inlay molding, curing, and polishing. First, small-sized rods are flattened and bow-bent to create an effective detection surface that meets the size requirements of the excitation stage of a direct-reading spectrometer. Simultaneously, the flat lower surface ensures stable positioning during inlay. Next, by precisely controlling the surface to be polished to sink 1-2 mm into the inlay material and progressively de-bubbling and filling, a tight, pore-free bond between the inlay material and the sample is ensured. After curing, graded polishing ensures that the sample and inlay material are coplanar with a roughness Ra≤3.2μm, ultimately allowing small-sized rods to be directly tested. This solves the problem of small-sized rods being unable to undergo direct-reading spectral analysis and, through a stable inlay structure and high-precision polishing surface, effectively avoids problems such as air leakage and sample displacement during excitation, thus improving the accuracy and reliability of component analysis. Attached Figure Description

[0016] Figure 1 This is a flowchart of an mosaic method for direct-reading spectral analysis of small-diameter bars according to the present invention; Figure 2 This is a three-dimensional structural diagram of the grinding device in the mosaic method for direct reading spectral analysis of small-sized rods according to the present invention; Figure 3 This is a schematic diagram of the adjustment mechanism and the disassembled structure of the grinding mechanism in the embedding method for direct reading spectral analysis of small-sized rods according to the present invention; Figure 4 This is a schematic diagram showing the disassembled structure of the grinding mechanism in the grinding device of the embedding method for direct reading spectral analysis of small-sized rods according to the present invention. Figure 5 This is a schematic diagram showing the disassembled structure of the positioning mechanism of the grinding device in the inlay method for direct reading spectral analysis of small-sized rods according to the present invention.

[0017] Legend: 1. Support frame; 2. Adjustment mechanism; 21. First motor; 22. First guide rail; 23. Sliding plate; 24. Threaded rod; 3. Grinding mechanism; 31. Second motor; 32. First electric push rod; 33. Fixed plate; 34. Mounting plate; 35. Guide groove; 36. Rotating bar; 37. Rotating plate; 38. Second guide rail; 39. Moving plate; 310. Third motor; 311. Grinding roller; 312. Rotating rod; 313. Belt assembly; 4. Positioning mechanism; 41. Placement platform; 42. Clamping block; 43. Moving block; 44. Mounting platform; 45. Second electric push rod. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: According to Figure 1 This invention provides a technical solution: a mosaic method for direct-reading spectral analysis of small-diameter rods, specifically including the following steps: Step 1: Sample Selection and Pre-treatment: Select small-sized bars to be tested, specifically round steel bars with an outer diameter of less than 14mm that cannot be directly matched to the excitation stage of a direct-reading spectrometer. Use sandpaper polishing, ultrasonic cleaning, or special degreasing agent to thoroughly remove oxide scale, oil, rust, burrs, and attached impurities from the surface of the bars. Surface impurities will affect the subsequent flattening and bending forming effect, and will also cause problems such as pores and loose bonding after embedding, ultimately affecting the accuracy of spectral excitation detection. Therefore, after cleaning, it is necessary to ensure that the sample surface is clean and free of obvious attachments. Step 2, Sample flattening treatment: Use a press to flatten the cleaned small-sized bars evenly. During the flattening process, ensure that the sample is subjected to uniform force and there is no local cracking or severe deformation. The dimensions of the flattened sample must meet the following requirements: The width 'a' of the flat sample should be no less than the diameter of the excitation stage opening of the direct-reading spectrometer + 1 mm, and is typically controlled at 13 mm to ensure that the effective detection surface of the sample is larger than the opening of the excitation stage during subsequent testing. The length b of the flat sample should be no less than the opening diameter of the excitation stage of the direct-reading spectrometer + 3mm to ensure that the sample has sufficient force and space for mounting and fixing. The thickness h of the flat sample should be no less than 2.0 mm to prevent the sample from deforming during subsequent bending, embedding and excitation processes, which would affect the test results.

[0020] After flattening, the sample thickness must be checked to ensure it is uniform, without obvious depressions or protrusions, and the forming dimensions meet the above parameter requirements. Step 3: Bow-shaped bending of the sample: The flattened sample is bent using a special bending tool to form a bow-shaped structure.

[0021] After bending, the lower part of the sample forms a flat planar structure. This planar structure must be flat and free of warping, and can be in complete and tight contact with the bottom surface of the subsequent mounting box. The purpose is to prevent the sample from shifting or moving during the mounting and solidification process, and to provide stable support for the subsequent polishing operation. The arc of the bend is moderate to avoid excessive bending that could cause cracks in the sample, and to ensure that the upper surface of the sample to be polished remains flat without wrinkles or protrusions caused by bending, thus ensuring the validity of the surface to be tested. During the bending process, apply light pressure and bend slowly to ensure the integrity of the overall structure of the sample, without any damage such as chipping or cracking.

[0022] Step 4: Preparation of inlay mold and inlay material: Select a suitable mold box and special inlay material, and inspect the materials.

[0023] The preparation of inlay molds and inlay materials specifically includes the following: The mold is a circular inlay box with a specification of Φ25-30mm, which is compatible with the excitation stage detection size of the direct reading spectrometer. The mold must ensure that the inner wall is smooth, free from deformation and impurity residue. The mounting material is selected from special mounting materials suitable for direct reading spectral analysis, such as thermosetting phenolic resin mounting material and cold mounting epoxy resin material. The mounting material must be non-porous, have high hardness after curing, and have good adhesion to the metal sample to avoid air leakage and sample detachment during subsequent excitation. Clean the inside of the setting box of oil, dust and other impurities, check whether the setting equipment is working properly, and ensure that the setting process proceeds smoothly.

[0024] Step 5, Setting and Molding: Place the sample into the setting box and fill the setting box with setting material; The inlay molding process specifically includes the following steps: 51. Place the bent and shaped bow-shaped sample smoothly into the prepared Φ25-30mm inlay box, so that the flat surface of the lower part of the sample is in complete and tight contact with the bottom surface of the inlay box, to initially fix the position of the sample and prevent it from shifting when filling the inlay material. 52. Adjust the spatial position of the sample so that the upper surface of the sample to be polished faces the opening of the mounting box, and ensure that the surface to be polished is accurately sunk into the preset position of the mounting material, with the sinking depth strictly controlled to be 1-2 mm. 53. Slowly fill the inlay box with inlay material, paying attention to removing air bubbles layer by layer during the filling process. You can gently tap the outer wall of the inlay box to ensure that the inlay material completely covers the sample and that there are no air bubbles or gaps between the sample and the inlay material. 54. After filling, check the sample position again to confirm that the depth of the surface to be polished is still 1-2 mm, the sample is not offset or tilted, and the inlay material is filled to the specified scale of the inlay box, with no missing or overflowing material.

[0025] Step 6: Curing of the inlay sample: Depending on the type of inlay material selected, hot pressing or constant temperature curing is used. The criteria for completion of curing are that the inlay material is completely hardened and bonded to the sample as a whole, and there are no cracks, bulges, or missing materials on the surface of the inlay, and the sample does not fall off or shift.

[0026] The curing process for the embedded specimens specifically includes the following steps: 61. Select curing method: Select the appropriate curing method based on the characteristics of the inlay material; 62. Hot pressing curing: Place the mounting box containing the sample and mounting material into the hot mounting machine, set the heating temperature and pressure parameters according to the technical requirements of the mounting material, and carry out heating and pressure curing. Avoid equipment vibration during the curing process to prevent sample displacement. 63. Cold mounting material: Place the mounting box containing the sample and mounting material in a room temperature environment and wait for it to solidify completely according to the curing time requirements of the mounting material. If it is necessary to speed up the curing, it can be cured at a constant temperature within the specified temperature range. High temperature heating is prohibited, which may cause the mounting material to crack. 64. Criteria for determining completion of curing: The inlay material is completely hardened and bonded to the sample as a whole. There are no cracks, bulges, or missing materials on the surface of the inlay. The sample does not fall off or shift.

[0027] Step 7: Polishing of the mounted sample: Remove the fully cured mount from the mounting box and perform professional polishing on the surface of the sample to be polished. The core objective of polishing is to make the surface of the sample and the surface of the mount material on the same plane and to meet the surface roughness requirements for spectral excitation.

[0028] The polishing process for mounted specimens specifically includes the following steps: 71. Abrasive selection: Grinding and polishing are performed using a grinding device; 72. Polishing operation: During the polishing process, keep the insert under uniform force and polish in the same direction to avoid deformation of the sample or detachment of the insert due to excessive force. At the same time, ensure that the polishing is always directed at the surface of the sample to be polished and does not damage other parts. 73. Precision requirements: After polishing, two core conditions must be met: first, the surface of the sample and the surface of the insert must be completely on the same plane with no height difference; second, the surface roughness Ra of the sample surface to be tested must be ≤3.2μm. 74. Post-polishing cleaning: After polishing, wipe the polished surface with anhydrous ethanol to remove polishing shavings, dust and other impurities, and let it dry for later use. 75. Final Verification: After polishing and cleaning, a comprehensive inspection of the inlaid sample is conducted to confirm that: ① the sample surface to be tested is flat, without scratches or pores, and the roughness meets the requirement of Ra≤3.2μm; ② the sample and the inlay material are tightly bonded, with no pores or gaps around the edges, and no inlay material falling off; ③ the dimensions of the effective testing surface of the sample still meet the technical requirements after flattening, and there is no dimensional insufficiency caused by excessive polishing. The qualified embedded sample is placed on the spark excitation stage of the direct-reading spectrometer. Since the sample is surrounded by embedded material and has no pores, it can make close contact with the excitation stage, avoiding air leakage during the excitation process. The composition analysis of small-sized rods can be completed by direct spark excitation.

[0029] Example 2: Please refer to Figure 2- Figure 5 The grinding device includes a support frame 1, an adjustment mechanism 2, a grinding mechanism 3, and a positioning mechanism 4. The adjustment mechanism 2 is installed inside the support frame 1, the positioning mechanism 4 is installed on one side of the support frame 1, and the grinding mechanism 3 is positioned above the positioning mechanism 4. The grinding mechanism 3 includes a mounting plate 34 and a belt assembly 313. A fixing plate 33 is fixedly connected to the top of the mounting plate 34, and a second motor 31 is fixedly connected to the top side of the fixing plate 33. The output end of the second motor 31 passes through the fixing plate 33 and is fixedly connected to a rotating bar 36. A rotating plate 37 is fixedly connected to one side of the rotating bar 36, and a first electric pusher is fixedly connected to one side of the rotating plate 37. The first electric push rod 32 has a movable plate 39 fixedly connected to one end, a third motor 310 fixedly connected to one side of the movable plate 39, and a rotating rod 312 mounted on the output end of the third motor 310 via a belt assembly 313. The rotating rod 312 is rotatably connected to one side of the movable plate 39, and a grinding roller 311 is fixedly connected to the other end of the rotating rod 312. A second guide rail 38 is slidably connected to the other side of the movable plate 39, and one side of the second guide rail 38 is fixedly connected to the rotating plate 37. A guide groove 35 is opened on the inner ring surface of the mounting plate 34, and the end of the rotating bar 36 is slidably connected to the inner side of the guide groove 35. The adjusting mechanism 2 includes a first motor 21 and a threaded rod 24. The output end of the first motor 21 is fixedly connected to one end of the threaded rod 24. One side of the first motor 21 is fixedly connected to one side of the support frame 1. The other end of the threaded rod 24 is rotatably connected to the bottom side of the support frame 1. A sliding plate 23 is threadedly connected to the outside of the threaded rod 24. One side of the sliding plate 23 is fixedly connected to one end of the mounting plate 34. A first guide rail 22 is slidably connected to the other side of the sliding plate 23. The other side of the first guide rail 22 is fixedly connected to one side of the support frame 1. Positioning mechanism. 4 includes a mounting platform 44, one side of which is fixedly connected to one side of the support frame 1. A placement platform 41 is fixedly connected to the top side of the mounting platform 44. A second electric push rod 45 is fixedly connected to the bottom side of the placement platform 41. There are four second electric push rods 45, which are evenly distributed in a circular array around the center line of the placement platform 41. A moving block 43 is fixedly connected to one end of the second electric push rod 45. One side of the moving block 43 is slidably connected to the bottom side of the placement platform 41. A clamping block 42 is fixedly connected to one end of the moving block 43.

[0030] The inlaid sample is placed at the center of the placement stage 41. Four second electric push rods 45 are simultaneously activated, pushing the moving block 43 to slide towards the center along the guide rail at the bottom of the placement stage 41. The clamping block 42, connected to the moving block 43, simultaneously moves towards the center, uniformly clamping the sample from four directions to achieve positioning and prevent displacement or tilting during grinding. The first motor 21 is activated, driving the threaded rod 24 to rotate, causing the sliding plate 23 to slide along the first guide rail 22. This allows for vertical height adjustment of the entire grinding mechanism 3 to accommodate the grinding height of the sample. The second electric push rods 45... When the machine 31 is started, it drives the rotating bar 36 to rotate. The rotating bar 36 slides in the guide groove 35, causing the rotating plate 37 and all the components below it to rotate circumferentially around the central axis, thereby adjusting the grinding position. The first electric push rod 32 extends and retracts, pushing the moving plate 39 to slide back and forth along the second guide rail 38, thereby adjusting the horizontal distance of the grinding roller 311, and then grinding multiple parts of the sample in the horizontal position. The third motor 310 is started, and the power is transmitted to the rotating rod 312 through the belt assembly 313, driving the grinding roller 311 to rotate and perform grinding operations on the sample surface.

[0031] This invention first selects rods with an outer diameter of less than 14mm, and removes surface oxide scale, oil stains, and other impurities by sanding, ultrasonic cleaning, or wiping with a degreasing agent to ensure sample cleanliness. Then, the rods are flattened evenly using a press to achieve a width ≥13mm, a length sufficient for the excitation stage opening +3mm, and a thickness ≥2.0mm, forming a flat sample that meets the testing size requirements. Next, the flattened sample is bent into an arc shape to create a flat surface at the bottom, facilitating subsequent mounting and ensuring the upper surface to be polished is flat and wrinkle-free. Finally, a circular mounting box with a diameter of Φ25-30mm is selected. Place the bow-shaped sample smoothly into the box, ensuring the lower plane is in close contact with the bottom of the box. Adjust the surface to be polished to face the opening and sink it 1-2 mm into the insert. Slowly fill the box with the special insert material and remove bubbles layer by layer to ensure there are no pores or gaps. Then, depending on the type of insert material, use hot pressing or room temperature / constant temperature curing. After the insert material has completely hardened and bonded to the sample as a whole, remove the insert and polish the sample with a polishing device to make the sample and insert material coplanar and the roughness Ra≤3.2μm. Clean with anhydrous ethanol and verify that it is qualified before it can be used for direct reading spectral analysis.

[0032] In the polishing stage, the embedded sample is first placed in the center of the placement platform 41 of the positioning mechanism 4. Four second electric push rods 45 arranged in a ring array synchronously drive the moving block 43 and the clamping block 42 to clamp the sample evenly from four directions to prevent displacement or tilting during polishing. The first motor 21 of the adjustment mechanism 2 starts, drives the threaded rod 24 to rotate, and drives the sliding plate 23 to rise and fall along the first guide rail 22 to adjust the overall height of the polishing mechanism 3 to fit the sample. In the polishing mechanism 3, the second motor 31 drives the rotating bar 36 to slide in the guide groove 35, driving the polishing roller 311 to achieve circumferential position adjustment. The first electric push rod 32 pushes the moving plate 39 to slide along the second guide rail 38 to achieve horizontal feed adjustment. The third motor 310 drives the polishing roller 311 to rotate at high speed through the belt assembly 313, thereby performing comprehensive, stable and controllable polishing on the surface of the sample to be tested, and obtaining a high-precision sample that meets the requirements of direct reading spectral analysis.

[0033] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A mosaic method for direct-reading spectral analysis of small-diameter rods, characterized in that, Specifically, the following steps are included: S1. Sample selection and pretreatment: Select small-sized bars to be tested, remove impurities from the surface of the bars, and ensure that the sample surface is clean and free of obvious adhering substances. S2. Sample flattening treatment: The small-sized bars after cleaning are flattened using a press, ensuring that the sample is subjected to uniform force during the flattening process. S3. Sample bow-shaped bending: The flattened sample is bent using a special bending tool to form a bow-shaped structure. S4. Preparation of inlay mold and inlay material: Select a suitable mold box and special inlay material, and inspect the materials; S5, Inlaying and Molding: Place the sample into the inlay box and fill the inlay box with inlay material; S6. Curing treatment of inlaid samples: Perform curing operation according to the selected inlay material type, and judge the completion of curing according to the judgment criteria. S7. Polishing of the inlaid specimen: Remove the fully cured inlay from the inlay box and polish the surface of the specimen to be polished.

2. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 1, characterized in that: In step S3, after bending, a flat planar structure is formed at the bottom of the sample. This planar structure must be flat and free of warping, and in close contact with the bottom surface of the subsequent mounting box.

3. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 2, characterized in that: In step S4, the preparation of the inlay mold and inlay material specifically includes the following: The mold is a circular mounting box, and the mounting material is a special mounting material adapted to direct-reading spectral analysis. Impurities on the inner wall of the mounting box are cleaned, and the mounting equipment is checked to ensure it is functioning properly.

4. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 2, characterized in that: In step S5, the inlay molding process is specifically... Includes the following steps: S51. Place the bent and formed bow-shaped sample into a Φ25-30mm inlay box, so that the flat surface of the lower part of the sample is in complete and tight contact with the bottom surface of the inlay box, and initially fix the position of the sample. S52. Adjust the spatial position of the sample so that the upper surface of the sample to be polished faces the opening of the mounting box, ensuring that the surface to be polished is sunk into the preset position of the mounting material. S53. Fill the inlay box with inlay material, and pay attention to removing air bubbles layer by layer during the filling process to ensure that the inlay material completely covers the sample. S54. After filling, check the sample position again to confirm that the depth of the surface to be polished is still 1-2mm, and that the sample is not offset or tilted. Fill the inlay material to the specified scale of the inlay box.

5. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 2, characterized in that: In step S6, the curing treatment of the embedded sample specifically includes the following steps: S61. Select curing method: Select the corresponding curing method according to the characteristics of the inlay material; S62. Hot pressing curing: Place the mounting box containing the sample and mounting material into the hot mounting machine, set the heating temperature and pressure parameters, and carry out hot pressing curing; S63, Cold mounting material: Place the mounting box containing the sample and mounting material in a room temperature environment and wait for it to solidify completely according to the curing time requirements of the mounting material. S64. Criteria for determining completion of curing: The insert is completely hardened and bonded to the sample as a whole. There are no cracks, bulges, or missing materials on the surface of the insert, and the sample does not fall off or shift.

6. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 1, characterized in that: In step S7, the polishing treatment of the embedded sample specifically includes the following steps: S71. Equipment selection: Use a grinding device to gradually perform grinding and polishing; S72. Polishing operation: During the polishing process, keep the insert under uniform force and the polishing direction consistent to ensure that the polishing is always directed at the surface of the sample to be polished. S73. Precision requirements: After polishing, ensure that the surface of the sample and the surface of the insert are on the same plane, and the surface roughness Ra of the sample surface to be tested is ≤3.2μm; S74. Post-polishing cleaning: After polishing, wipe the polished surface with anhydrous ethanol to remove impurities, and let it dry for later use. S75. Final Verification: After polishing and cleaning, the inlaid sample is inspected to confirm that the surface to be tested is flat, without scratches or pores, the roughness meets the requirements, the sample is tightly bonded to the inlay material, there are no pores or gaps around the sample, no inlay material falls off, and the size of the effective test surface of the sample meets the size requirements after flattening.

7. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 6, characterized in that: The grinding device includes a support frame (1), an adjustment mechanism (2), a grinding mechanism (3), and a positioning mechanism (4). The adjustment mechanism (2) is installed inside the support frame (1), and the positioning mechanism (4) is installed on one side of the support frame (1). The grinding mechanism (3) is located above the positioning mechanism (4). The grinding mechanism (3) includes a mounting plate (34) and a belt assembly (313). A fixing plate (33) is fixedly connected to the top of the mounting plate (34), and a second motor (31) is fixedly connected to the top side of the fixing plate (33). The output end of the second motor (31) passes through the fixing plate (33) and is fixed. A rotating bar (36) is connected to a rotating plate (37) fixedly connected to one side of the rotating bar (36). A first electric push rod (32) is fixedly connected to one side of the rotating plate (37). A moving plate (39) is fixedly connected to one end of the first electric push rod (32). A third motor (310) is fixedly connected to one side of the moving plate (39). A rotating rod (312) is installed at the output end of the third motor (310) through a belt assembly (313). The rotating rod (312) is rotatably connected to one side of the moving plate (39). A grinding roller (311) is fixedly connected to the other end of the rotating rod (312).

8. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 7, characterized in that: The other side of the movable plate (39) is slidably connected to a second guide rail (38), one side of the second guide rail (38) is fixedly connected to the rotating plate (37), and the inner ring surface of the mounting plate (34) is provided with a guide groove (35), and the end of the rotating bar (36) is slidably connected to the inner side of the guide groove (35).

9. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 7, characterized in that: The adjustment mechanism (2) includes a first motor (21) and a threaded rod (24). The output end of the first motor (21) is fixedly connected to one end of the threaded rod (24). One side of the first motor (21) is fixedly connected to one side of the support frame (1). The other end of the threaded rod (24) is rotatably connected to the bottom side of the support frame (1). The threaded rod (24) is externally threaded with a sliding plate (23). One side of the sliding plate (23) is fixedly connected to one end of the mounting plate (34). The other side of the sliding plate (23) is slidably connected with a first guide rail (22). The other side of the first guide rail (22) is fixedly connected to one side of the support frame (1).

10. The mosaic method for direct-reading spectral analysis of small-diameter rods according to claim 7, characterized in that: The positioning mechanism (4) includes a mounting platform (44), one side of which is fixedly connected to one side of the support frame (1). A placement platform (41) is fixedly connected to the top side of the mounting platform (44), and a second electric push rod (45) is fixedly connected to the bottom side of the placement platform (41). There are four second electric push rods (45), which are evenly distributed in a circular array around the center line of the placement platform (41). A moving block (43) is fixedly connected to one end of the second electric push rod (45). One side of the moving block (43) is slidably connected to the bottom side of the placement platform (41), and a clamping block (42) is fixedly connected to one end of the moving block (43).

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