Welding spot defect detection and report generation system and method

Abstract

The invention discloses a welding spot defect detection and report generation system and method, and the method comprises the steps: controlling an objective table to move through a control device, enabling each welding spot on a to-be-detected circuit board to be sequentially located in a shooting region of an image unit, controlling a moving unit to move the image unit, and enabling the image unit to sequentially shoot a to-be-detected image of each welding spot, and finally, the control device can identify whether each welding spot has a defect according to the to-be-detected image of each welding spot, so that automatic defect detection of the welding spots on the to-be-detected circuit board is realized. Therefore, automatic defect detection of the welding spots is achieved through the welding spot defect detection and report generation system, the efficiency and accuracy of defect detection can be improved, and missing detection of the defects can be prevented. The defect detection data packet of the to-be-detected circuit board can be obtained through the report generation device, and then the defect detection report of the to-be-detected circuit board is generated according to the defect detection data packet, so that automatic and rapid generation of the report is realized, report generation steps are effectively simplified, and the efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board inspection technology, and in particular to a system and method for detecting solder joint defects and generating reports. Background Technology

[0002] Defect detection in printed circuit board assemblies (PCBAs) is a core and critical step in the electronic product manufacturing process. Currently, the red ink test method is used to detect solder joint defects on PCBs. The PCB is immersed in red ink, dried, and then forcibly separated from the electronic components. The immersion status of each solder joint is then manually observed, and the color of the interface at the crack is used to determine whether the solder joint is broken. This manual visual inspection method is affected by subjective factors and struggles to observe micron-level defects, resulting in low efficiency and accuracy in solder joint defect detection, and a high rate of missed detections. Furthermore, after manually determining whether a solder joint is broken, the inspection data must be manually recorded, and then the recorded data must be manually processed to generate an inspection report—a cumbersome and inefficient process. Summary of the Invention

[0003] The main objective of this application is to provide a system and method for detecting and generating reports on solder joint defects, aiming to solve the problems of low detection efficiency and accuracy, high missed detection rate, and cumbersome and inefficient report generation process in the prior art.

[0004] The first aspect of this application provides a solder joint defect detection and report generation system, including: The imaging device includes a stage, a moving unit, and an imaging unit; The stage is used to place the circuit board to be tested, which has been pre-treated by color immersion and separation; the moving unit is connected to the imaging unit, and the moving unit is used to move the imaging unit; the imaging unit is arranged opposite to the side of the stage where the circuit board to be tested is placed, and the imaging unit is used to acquire the image of the solder joints in the circuit board to be tested. A control device, connected to the moving unit and the imaging unit, is configured to control the stage to move each solder joint on the circuit board under test sequentially to the imaging area of ​​the imaging unit, control the moving unit to move the imaging unit, control the imaging unit to capture the image under test, receive the image under test for each solder joint on the circuit board under test, and identify whether a defect exists on the corresponding solder joint based on the image under test. The control device is also configured to store the defect identification data of the circuit board under test to form a defect detection data package. A report generation device is connected to the control device. The report generation device is used to acquire the defect detection data packet and generate a defect detection report of the circuit board under test based on the defect detection data packet.

[0005] In this way, the control device can control the movement of the stage, so that each solder joint on the circuit board under test is sequentially positioned in the imaging area of ​​the imaging unit. Then, it controls the moving unit to move the imaging unit so that the imaging unit can sequentially capture images of each solder joint under test. Finally, the control device can identify whether each solder joint has defects based on the images, achieving automated defect detection of solder joints on the circuit board under test. Therefore, by using a solder joint defect detection and report generation system to achieve automated defect detection of solder joints, the efficiency and accuracy of defect detection can be improved, and missed defects can be prevented. The report generation device can acquire the defect detection data package of the circuit board under test, and then generate a defect detection report based on the defect detection data package, achieving automated and rapid report generation, effectively simplifying the report generation process and improving efficiency.

[0006] As an optional implementation of the first aspect, the report generation device includes a data input unit, a core business unit, and a report generation unit. The data input unit is connected to the control device and the core business unit, and the core business unit is communicatively connected to the report generation unit. The data input unit is used to retrieve the defect detection data packet from the control device and send it to the core business unit. The core business unit is used to parse the defect detection data packet to obtain the defect identification data of each of the solder joints and send the defect identification data to the report generation unit. The report generation unit is used to generate the defect detection report based on the defect identification data.

[0007] As an optional implementation of the first aspect, the data input unit is further configured to receive solder joint data input from the outside and send the solder joint data to the core business unit.

[0008] As an optional implementation of the first aspect, the weld joint defect detection and report generation system further includes a data processing unit, which is connected to the data input unit, the core business unit, and the control device; the data processing unit is used for: Acquire low-magnification and high-magnification images of the circuit board under test; Calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate an annotated image based on the coordinate mapping relationship; The labeled image is sent to the core business unit; The core business unit is also used to send the labeled image to the report generation unit, and the report generation unit is also used to generate the defect detection report based on the labeled image and the defect identification data.

[0009] As an optional implementation of the first aspect, the control device is also used to control the stage to move horizontally and to control the imaging unit to acquire a complete visual image of the circuit board under test.

[0010] As an optional implementation of the first aspect, the imaging unit includes a first objective lens and a second objective lens, wherein the magnification of the first objective lens is less than that of the second objective lens; the first objective lens is used to scan and capture images of the circuit board under test to obtain the complete visual image; the second objective lens is used to capture images of each solder joint in the circuit board under test along a vertical direction.

[0011] As an optional implementation of the first aspect, the imaging device further includes an optical diffraction unit, which is disposed opposite to the side of the stage on which the circuit board under test is placed, and the optical diffraction unit is used to provide a color light source for the circuit board under test.

[0012] As an alternative implementation of the first aspect, the imaging device further includes a smart light source for providing illumination to the imaging unit.

[0013] As an optional implementation of the first aspect, the imaging unit is further configured to capture multiple images of the same solder joint under test; the control device includes an AI vision processing unit, which is configured to: Image synthesis processing is performed on multiple images of the same solder joint to obtain the image to be identified corresponding to the solder joint. Defect identification is performed on the image to be identified to confirm the cross-sectional area and stained area of ​​the weld point; The staining ratio of the solder joint is calculated based on the area of ​​the cross-sectional area and the area of ​​the staining region.

[0014] As an optional implementation of the first aspect, the weld joint defect detection and report generation system further includes: A quality tracking device is connected to the control device or the report generation device. The quality tracking device is used to acquire the defect identification data and generate a quality tracking report based on the defect identification data and quality standards.

[0015] As an optional implementation of the second aspect, the quality tracking device includes a matching unit and a quality tracking unit, wherein the matching unit is connected to the quality tracking unit; the matching unit is used to acquire a defect detection data packet and search from a quality standard database for a quality standard that matches the defect detection data packet; if a quality standard matches, the matching unit sends the defect detection data packet to the quality tracking unit; wherein the defect detection data packet contains the defect identification data; the quality tracking unit is used to parse the defect detection data packet to obtain the defect identification data, and generate a quality tracking report based on the parsed defect identification data and the quality standard.

[0016] The second aspect of this application provides a solder joint defect detection and report generation system, comprising: An imaging device includes a stage, a moving unit, and an imaging unit. The stage is used to place a circuit board to be tested that has undergone color immersion and separation treatment beforehand. The moving unit is connected to the imaging unit and is used to move the imaging unit. The imaging unit is positioned opposite to the side of the stage where the circuit board to be tested is placed, and the imaging unit is used to acquire a test image of the solder joints in the circuit board to be tested. A control device, connected to the moving unit and the imaging unit, is configured to control the stage to move each solder joint on the circuit board under test sequentially to the imaging area of ​​the imaging unit, control the moving unit to move the imaging unit, control the imaging unit to capture the image under test, receive the image under test for each solder joint on the circuit board under test, and identify whether a defect exists on the corresponding solder joint based on the image under test. The control device is also configured to store the defect identification data of the circuit board under test to form a defect detection data package. A quality tracking device is connected to the control device. The quality tracking device is used to acquire the defect identification data and generate a quality tracking report based on the defect identification data and quality standards.

[0017] A third aspect of this application provides a method for detecting and generating solder joint defects, applied to a system for detecting and generating solder joint defects. The system includes an imaging device, a control device, and a report generation device. The imaging device includes a stage, a moving unit, and an image unit. The stage is used to place a circuit board to be tested, which has undergone pre-color immersion and separation treatment. The moving unit is connected to the image unit and is used to move the image unit. The control device is connected to the moving unit and the image unit, and the control device and the report generation device are used to execute the method for detecting and generating solder joint defects. The method for detecting and generating solder joint defects includes: The stage is controlled to move so that each solder joint on the circuit board under test is moved sequentially to the imaging area of ​​the imaging unit; The moving unit is controlled to move the imaging unit and the imaging unit is controlled to capture the image of the solder joint under test. Based on the image under test, identify whether there are defects in the solder joints and store the defect identification data of the circuit board under test to form a defect detection data package; Obtain the defect detection data packet; A defect detection report for the circuit board under test is generated based on the defect identification data in the defect detection data package.

[0018] As an optional implementation of the third aspect, generating a defect detection report for the circuit board under test based on the defect detection data packet includes: The defect detection data packet is parsed to obtain the defect identification data of each solder joint on the circuit board under test; The defect detection report is generated based on the defect identification data of each of the weld points.

[0019] As an optional implementation of the third aspect, the weld joint defect detection and report generation method further includes: Acquire low-magnification and high-magnification images of the circuit board under test; Calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate a labeled image based on the coordinate mapping relationship.

[0020] As an optional implementation of the third aspect, the weld joint defect detection and report generation method further includes: Control the stage to move horizontally; During the movement of the stage, the imaging unit is controlled to capture images of the circuit board under test in order to obtain a complete visual image of the circuit board under test. The position coordinates of each solder joint in the circuit board under test are obtained based on the complete visual image. The control of the stage movement to sequentially move each solder joint on the circuit board under test to the imaging area of ​​the imaging unit includes: The stage is controlled to move each solder joint sequentially to the imaging area of ​​the imaging unit according to the position coordinates of each solder joint.

[0021] As an optional implementation of the third aspect, controlling the moving unit to move the imaging unit and controlling the imaging unit to capture the image of the solder joint to be tested includes: The moving unit moves the image unit in a preset step along the vertical direction; Each time the imaging unit is moved, the imaging unit is controlled to automatically focus on the solder joint and capture multiple images of the solder joint to be tested.

[0022] As an optional implementation of the third aspect, the step of identifying whether the solder joint has defects based on the image to be tested includes: The number of steps taken when the image unit is successfully focused; The fracture level of the solder joint is determined based on the number of steps.

[0023] As an optional implementation of the third aspect, the step of identifying whether the solder joint has defects based on the image to be tested further includes: The image to be identified is obtained by performing image synthesis processing on multiple images to be tested corresponding to the solder joint; Defect identification is performed on the image to be identified to confirm the cross-sectional area and stained area of ​​the weld point; The staining ratio of the solder joint is calculated based on the area of ​​the cross-sectional region and the area of ​​the staining region. The presence of defects in the solder joint is confirmed based on the infiltration ratio and the fracture level.

[0024] As an optional implementation of the third aspect, during the movement of the stage, controlling the imaging unit to capture an image of the circuit board under test to obtain a complete visual image of the circuit board under test includes: During the movement of the stage, the imaging unit is controlled to scan and capture images of the circuit board under test, thereby obtaining multiple visual images. The complete visual image is obtained by fusing and stitching together multiple visual images.

[0025] As an optional implementation of the third aspect, the solder joint defect detection and report generation method may further include: Preliminary defect identification is performed on the solder joints on the circuit board under test based on the complete visual image. The solder joints that were confirmed to be defect-free in the initial defect identification were excluded.

[0026] As an optional implementation of the third aspect, the weld joint defect detection and report generation method further includes: A quality tracking report is generated based on the defect identification data and quality standards.

[0027] The fourth embodiment of this application provides a method for detecting and generating solder joint defects, applied to a solder joint defect detection and report generation system. The defect detection and report generation system includes an imaging device, a control device, and a quality tracking device. The imaging device includes a stage, a moving unit, and an image unit. The stage is used to place a circuit board to be tested that has undergone pre-color immersion and separation treatment. The moving unit is connected to the image unit and is used to move the image unit. The control device is connected to the moving unit and the image unit, and the control device and the quality tracking device are used to execute the solder joint defect detection and report generation method. The solder joint defect detection and report generation method includes: The stage is controlled to move so that each solder joint on the circuit board under test is moved sequentially to the imaging area of ​​the imaging unit; The moving unit is controlled to move the imaging unit and the imaging unit is controlled to capture the image of the solder joint under test. Identify whether the solder joint has defects based on the image to be tested; A quality tracking report is generated based on the defect identification data and quality standards of each solder joint on the circuit board under test. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the modules of the weld joint defect detection and report generation system provided in the embodiments of this application.

[0029] Figure 2 This is a schematic diagram of the imaging device provided in an embodiment of this application.

[0030] Figure 3 This is a schematic diagram of the movement path of the stage that drives the circuit board under test to move, as provided in an embodiment of this application.

[0031] Figure 4 This is a schematic diagram of a complete visual image obtained from an embodiment of this application.

[0032] Figure 5 This is a schematic diagram of the solder joint hierarchy in the embodiments of this application.

[0033] Figure 6 This is a schematic diagram of a weld joint defect detection and report generation system provided in another embodiment of this application.

[0034] Figure 7 The image to be identified for a weld joint provided in this application embodiment is the cross-sectional area and the stained area after defect identification.

[0035] Figure 8 A schematic diagram illustrating the annotation of defect identification data for multiple weld points provided in the embodiments of this application.

[0036] Figure 9 This is a schematic diagram of the modules of the weld joint defect detection and report generation system provided in the embodiments of this application.

[0037] Figure 10 A schematic diagram of the report generation apparatus provided in the embodiments of this application.

[0038] Figure 11 These are schematic diagrams of the annotated images and high-magnification images provided in the embodiments of this application.

[0039] Figure 12 A schematic diagram of the core business unit and report generation device provided in the embodiments of this application.

[0040] Figure 13 This is a flowchart illustrating the solder joint defect detection and report generation method provided in an embodiment of this application.

[0041] Figure 14 for Figure 13 Detailed flowchart of step S150.

[0042] Figure 15 for Figure 13 Detailed flowchart of step S160.

[0043] Figure 16 A detailed flowchart of step S160 in another example.

[0044] Figure 17 This is a partial flowchart illustrating a method for detecting and generating reports of weld defects according to an embodiment of this application.

[0045] Figure 18 This is a partial flowchart illustrating a method for detecting and generating reports of weld defects, provided in another embodiment of this application.

[0046] Figure 19 for Figure 18 Detailed flowchart of step S220.

[0047] Figure 20 This is a partial flowchart illustrating the solder joint defect detection and report generation method provided in an embodiment of this application.

[0048] Figure 21 This is a partial flowchart illustrating a method for detecting and generating weld joint defects according to another embodiment of this application.

[0049] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] It should be noted that "multiple" in the embodiments of this application refers to two or more. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0052] It should be understood that, unless otherwise stated, " / " in this application means "or". For example, A / B can mean A or B. "A and / or B" in this application is merely a description of the relationship between related objects, indicating that there can be three relationships: only A exists, only B exists, and A and B exist.

[0053] It should be noted that in the embodiments of this application, the terms "first," "second," etc., are used only for descriptive purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order. Features specified as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0054] It should be noted that in the embodiments of this application, the terms "upper", "vertical", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0055] Please see Figure 1 The present application provides a solder joint defect detection and report generation system 100, which includes an imaging device 110 and a control device 120.

[0056] Please see Figure 2 , Figure 2A schematic diagram of the imaging device 110 provided in this application is shown. Figure 2 As shown, the imaging device 110 includes a stage 111, a moving unit 112, and an imaging unit 113. The stage 111 is used to place the circuit board to be tested, which has undergone pre-treatment with color immersion and separation. The circuit board to be tested can be pre-placed in a red dye (e.g., red ink), and after drying, the electronic components on the circuit board are forcibly separated from the circuit board substrate. The forcibly separated circuit board is then placed on the stage 111 to facilitate subsequent defect detection. It is understood that when solder joint defects exist, the cracks created by the forced separation of the electronic components from the circuit board are the defective areas, and the dye will penetrate into these cracks. When there are no solder joint defects, the cracks created by the forced separation of the electronic components from the circuit board will not be stained by dye.

[0057] The moving unit 112 is connected to the imaging unit 113, and the moving unit 112 is used to move the imaging unit 113. The imaging unit 113 is positioned opposite the side of the stage 111 where the circuit board under test is placed; that is, the imaging unit 113 faces the placement area of ​​the circuit board under test. The imaging unit 113 is used to acquire images of the solder joints in the circuit board under test. The moving unit 112 can move the imaging unit 113 vertically, which is the separation direction between the electronic components and the circuit board.

[0058] The control device 120 is connected to the stage 111, the moving unit 112, and the imaging unit 113. The control device 120 is used to control the movement of the stage 111 so that each solder joint on the circuit board under test is sequentially located in the imaging area of ​​the imaging unit 113, the moving unit 112 to move the imaging unit 113, and the imaging unit 113 to capture the image under test, as well as to receive the image under test of each solder joint on the circuit board under test. Thus, the control device 120 can identify whether there are defects in the solder joints based on the image under test.

[0059] It is understood that the control device 120 can control the movement of the stage 111, so that each solder joint on the circuit board under test is sequentially located in the imaging area of ​​the imaging unit 113. The control device 120 can also control the movement unit 112 to move the imaging unit 113, so that the imaging unit 113 can sequentially capture the image of each solder joint under test. Finally, the control device 120 can identify whether each solder joint has defects based on the image of each solder joint under test, thereby realizing automated defect detection of solder joints on the circuit board under test. Thus, by realizing automated defect detection of solder joints through the solder joint defect detection and report generation system 100, the efficiency and accuracy of defect detection can be improved, and missed defects can be prevented.

[0060] In some embodiments, such as Figure 2As shown, the imaging device 110 may further include an optical diffraction unit 114 and an intelligent light source 115. The optical diffraction unit 114 is mounted above the stage 111. The optical diffraction unit 114 can provide a color-developing light source for the circuit board under test to highlight the stained area of ​​the solder joints. Consequently, the stained area is more obvious in the image captured by the imaging unit 113, facilitating the identification of cracks. For example, when the circuit board under test is stained with red dye, the optical diffraction unit 114 can increase the transmittance of red wavelength light, distinguishing red wavelengths that are not recognizable under ordinary light, thereby highlighting the stained area of ​​the solder joints.

[0061] The intelligent light source 115 is used to provide illumination for the imaging unit 113, thereby improving the shooting effect of the imaging unit 113.

[0062] In some embodiments, the control device 120 can also control the stage 111 to move horizontally. For example... Figure 3 As shown, the control device 120 can also control the stage 111 to perform Z-shaped movement in the horizontal direction, so that different areas of the circuit board under test (e.g., Figure 3 The small squares shown in the image unit 113 move sequentially to the center of the field of view of the image unit 113, so that the image unit 113 can sequentially capture visual images of different areas of the circuit board under test. The control device 120 can receive multiple visual images captured by the image unit 113 and perform fusion and stitching processing on the multiple captured visual images to obtain a complete visual image (e.g., Figure 4 (As shown). It can be understood that the bottom of the stage 111 can be provided with a slide rail and a driving component (not shown in the figure). The control device 120 can control the driving component to drive the stage 111 to move on the slide rail, so as to control the movement in the horizontal direction. The movement accuracy of the stage 111 can reach 0.39μm.

[0063] In this embodiment, the control device 120 can also identify each solder joint on the circuit board under test based on a complete visual image and determine the coordinates of each solder joint. Thus, the image unit 113 can capture each solder joint on the circuit board under test, effectively reducing the missed solder joint detection rate.

[0064] Furthermore, the control device 120 can confirm the position coordinates of each solder joint on the circuit board under test based on the complete visual image. Then, based on the position coordinates of the solder joint in the horizontal direction, the control device 120 first controls the stage 111 to move the solder joint to the position of the image unit 113, then controls the moving unit 112 to move the image unit 113 in the vertical direction, and finally controls the image unit 113 to capture the image of the solder joint in the vertical direction.

[0065] In some embodiments, the control device 120 can also preliminarily identify completely unstained solder joints in the circuit board under test based on the complete visual image, exclude completely unstained solder joints, and then no longer further detect defects in completely unstained solder joints, so as to save defect detection time and further improve detection efficiency.

[0066] In some embodiments, the imaging unit 113 may include a first objective lens (not shown) and a second objective lens (not shown), wherein the magnification of the first objective lens is less than that of the second objective lens. The first objective lens is used to scan and capture images of the circuit board under test to obtain a complete visual image. The second objective lens is used to capture images of the solder joints under test in a vertical direction.

[0067] In some specific examples, the imaging device 110 can be configured as a microscope, such as a metallurgical microscope with a magnification of 25X to 50X, wherein a 10X eyepiece is paired with a 2.5X objective and a 5X objective. The first objective can be a 2.5X objective, and the second objective can be a 5X objective. When a complete visual image is required, the first objective scans and captures the circuit board under test. When it is necessary to capture an image of the circuit board under test, the second objective is used to capture the solder joints.

[0068] The moving unit 112 can be configured as a motorized Z-axis, which can drive the second objective lens to move in the vertical direction. In this embodiment, the moving accuracy of the motorized Z-axis relative to the image unit 113 can reach 0.39 μm, enabling high-precision identification of solder joints.

[0069] In this embodiment, the control device 120 can first control the first objective lens to sequentially capture multiple visual images of the circuit board under test. The control device 120 then fuses and stitches the multiple visual images to obtain a complete visual image of the circuit board under test. The control device 120 then obtains the position coordinates of each solder joint based on the complete visual image. At this time, the control device 120 can control the image unit 113 to switch the first objective lens to the second objective lens, so that the second objective lens can capture the image of each solder joint under test.

[0070] The imaging unit 113 can employ a multi-point autofocus method, whereby the second objective lens first focuses on the substrate surface of the circuit board under test. Using the substrate surface as a reference, the control device 120 moves the stage 111 according to the position coordinates of the solder joints, moving the solder joints to the center of the field of view of the second objective lens. Then, the second objective lens is controlled to focus on the solder joints in a preset step along the vertical direction, and one image is captured each time the focus is achieved. The control device 120 can also control the moving unit 112 to move the second objective lens in a preset step along the vertical direction, and one image is captured each time the second objective lens moves, thus achieving layered scanning and imaging of the solder joints.

[0071] Furthermore, the control device 120 can also confirm the number of steps when the image unit 113 is successfully focused, and then determine the fracture level of the solder joint based on the number of steps.

[0072] In some specific examples, such as Figure 5 As shown, each solder joint on the circuit board under test can be divided into multiple layers from bottom to top. The first layer is between the circuit board and the board pads; the second layer is between the board pads and the solder balls; the third layer is between the solder balls and the BGA (Ball Grid Array) pads; and the fourth layer is between the BGA pads and the BGA base surface. Of course, the layer division of solder joints in this embodiment is not limited to this, and the layer of solder joints can be set according to actual application requirements.

[0073] The imaging unit 113 can start from the circuit board of the circuit board under test and sequentially focus and capture images of the solder joints from bottom to top with preset steps to obtain the image under test. The image under test captured when the imaging unit 113 successfully focuses has the best clarity. Therefore, the clarity of multiple images under test can be identified and judged to determine which step the image with the best clarity was captured at. Then, the level at which the solder joint is broken can be determined based on the number of steps and the preset step distance.

[0074] For example, the imaging unit 113 can focus and capture images of the solder joints sequentially upwards from the circuit board in 30-micrometer steps. If the first image captured has the best clarity, it confirms that the solder joint has broken between the circuit board and the board pad, and the fracture level of the solder joint is the first level. If the second image captured has the best clarity, it confirms that the solder joint has broken between the board pad and the solder ball, and the fracture level of the solder joint is the second level. If the third image captured has the best clarity, it confirms that the solder joint has broken between the BGA pad and the solder ball, and the fracture level of the solder joint is the third level. If the fourth image captured has the best clarity, it confirms that the solder joint has broken between the BGA pad and the BGA board, and the fracture level of the solder joint is the fourth level. The number of images captured corresponds one-to-one with the number of steps taken by the imaging unit 113. It can be understood that when a defect exists in the solder joint, the fracture location is the defect location. When there is no defect in the solder joint, the fracture location is random.

[0075] Of course, the preset step size in this embodiment is not limited to 30 micrometers, and can be set according to actual needs, such as 50 micrometers, 80 micrometers, etc. The correspondence between the number of shots and the layer is also not limited to the above embodiment, and can be set according to actual needs.

[0076] In some specific examples, such as Figure 6As shown, the imaging device 110 may further include a control unit 116, which can be connected to the moving unit 112, the imaging unit 113, and the control device 120. The control device 120 can indirectly control the moving unit 112 and the imaging unit 113 through the control unit 116. The control device 120 can send a first shooting command to the control unit 116, and the control unit 116 controls the stage 111 according to the first shooting command. Figure 3 The movement trajectory of the device causes each area of ​​the circuit board under test to move sequentially to the center of the field of view of the imaging unit 113. The control unit 116, according to the first shooting command, controls the imaging unit 113 to sequentially capture images of each area of ​​the circuit board under test that has moved to the center of its field of view, obtaining multiple visual images. The control unit 116 sends the captured multiple visual images to the control device 120, which then performs fusion and stitching processing on the multiple visual images to obtain a complete visual image, and obtains the position coordinates of each solder joint based on the complete visual image.

[0077] The control device 120 can send a second shooting command to the control unit 116. The second shooting command may include the position coordinates of the solder joint. The control unit 116 can then switch the shooting magnification according to the second shooting command (e.g., switch the first objective lens to the second objective lens). First, it controls the stage 111 to move so that the corresponding solder joint is moved to the center of the field of view of the image unit 113. Then, it controls the moving unit 112 to move the image unit 113 vertically by a preset step to focus on the solder joint and capture the image to be tested. The captured image to be tested is then sent to the control unit 116, which in turn sends it to the control device 120. The control unit 116 can also obtain the number of steps taken when the image unit 113 is successfully focused and send the number of steps to the control device 120, so that the control device 120 can determine the fracture level based on the number of steps.

[0078] In this embodiment, the control unit 116 can confirm whether the image unit 113 has successfully focused after capturing an image. If the focus is successful, the control unit 113 can be controlled to stop capturing the image. At this time, the control unit 116 can confirm whether the focus was successful based on whether the captured image is clear.

[0079] It is understood that in this embodiment of the application, the control unit 116 can confirm the focus sharpness based on the sharpness evaluation function (such as grayscale gradient function, entropy function, etc.) and the search algorithm, and thus confirm whether the image unit 113 has successfully focused.

[0080] Furthermore, the control device 120 may also include an AI vision processing unit 121. The AI ​​vision processing unit 121 is used to perform image synthesis processing on multiple images to be tested corresponding to the same solder joint to obtain an image to be identified of the solder joint, and then perform defect identification on the image to be identified to confirm the cross-sectional area T1 and the stained area T2 (e.g., Figure 7 (As shown in the blue area in the figure), the staining ratio of the weld joint is calculated based on the area of ​​the cross-sectional area T1 and the staining area T2. The presence of defects in the weld joint is then confirmed based on the staining ratio and the fracture level.

[0081] The AI ​​vision processing unit 121 can choose to perform image synthesis processing on all test images corresponding to the solder joint to obtain the image to be recognized, or it can select the test image that has been successfully focused and the previous test image that has been successfully focused to perform image synthesis processing to obtain the image to be recognized. Specifically, the AI ​​vision processing unit 121 can perform depth-of-field synthesis processing on multiple test images corresponding to the solder joint to obtain the image to be recognized.

[0082] It is understandable that after the circuit board under test is dyed, the electronic components and circuit board need to be separated. Therefore, the breakage of the solder joint may be due to separation alone, or it may be due to defects in the solder joint. If the solder joint is defect-free, even if it breaks, the break will not be dyed. Therefore, the presence of defects in the solder joint can be confirmed based on the dye penetration ratio and the fracture level. Specifically, when the AI ​​vision processing unit 121 identifies a dyed area in the solder joint, it can confirm that the solder joint is defective.

[0083] The AI ​​vision processing unit 121 can use a semantic segmentation model to process the image to be recognized, dividing the image into a cross-sectional region T1 and a stained region T2. ​​Then, it calculates the area S1 of the cross-sectional region T1 and the area S2 of the stained region T2, and calculates the solder joint penetration ratio S2 / S1 based on these areas. This enables pixel-level recognition of the image to be recognized, accurately distinguishing the cross-sectional region T1 and the stained region T2, and achieving accurate defect identification.

[0084] The AI ​​vision processing unit 121 in the control device 120 can identify defects in each solder joint on the circuit board under test using the aforementioned method. The control device 120 can then store the defect identification data of all solder joints on the circuit board under test into a detection database for easy retrieval at any time. The defect identification data may include the location coordinates, fracture level, and contamination ratio of each solder joint.

[0085] In this embodiment, the control device 120 can be a software program built into an electronic device. The electronic device can be equipped with a software display interface, and the operator can start the defect detection operation on the software display interface, so that the control device 120 can start executing the defect identification software program.

[0086] In some embodiments, there may be solder joints on the circuit board under test that cannot be identified as defective by the control device 120. Therefore, the control device 120 can display the location coordinates of these unidentifiable solder joints on the interface of the electronic device, allowing operators to manually inspect the solder joints for defects based on the displayed coordinates.

[0087] In some embodiments, the control device 120 can also combine the images to be identified of each solder joint on the circuit board under test with defect identification data, and annotate the defect identification data of each solder joint onto the corresponding image to be identified. The control device 120 can be configured with a pre-trained data-driven model to annotate the defect identification data onto the images of the solder joints to be identified. See also... Figure 8 , Figure 8 A schematic diagram illustrating the annotation of defect identification data for multiple weld points is shown. Figure 8 In the diagram, Level 1 represents the first fracture level, Level 2 represents the second fracture level, and percentage data such as 11%, 0%, and 12% represent the solder joint penetration ratio. (1, D) indicates that the solder joint is located in the fourth column of the first row of the circuit board under test, (2, E) indicates that the solder joint is located in the fifth column of the second row of the circuit board under test, and the position coordinates of other solder joints are deduced accordingly.

[0088] In some embodiments, the control device 120 can store the defect identification data of each circuit board under test that has undergone defect identification testing and form a defect detection data package. When needed, the tester can call up the defect detection data package to facilitate viewing and using the defect identification data of each circuit board under test.

[0089] In this embodiment, the solder joint defect detection and report generation system 100 enables automated defect detection of solder joints on the circuit board under test. Furthermore, by means of the stage 111, the moving unit 112, and the imaging unit 113 in the solder joint defect detection and report generation system 100, the crack identification accuracy in solder joint defect detection can be improved from 150μm to 0.5μm, and the false detection rate can be reduced from 5% to zero error. This can improve the efficiency and accuracy of effective defect detection and effectively prevent missed defects.

[0090] like Figure 9As shown, in some embodiments, in order to facilitate the reading of defect identification data by staff, the solder joint defect detection and report generation system 100 may also include a report generation device 130. The report generation device 130 is connected to the control device 120. The report generation device 130 can be used to acquire defect detection data packets and then generate a defect detection report of the circuit board under test based on the defect detection data packets.

[0091] In this embodiment of the application, the report generation device 130 may also be a software program built into an electronic device.

[0092] In some embodiments, such as Figure 10 As shown, the report generation device 130 may include a data input unit 131, a core business unit 132, and a report generation unit 133. The data input unit 131 is connected to the control device 120 and the core business unit 132, and the core business unit 132 is communicatively connected to the report generation unit 133. The data input unit 131 can retrieve defect detection data packets from the detection database of the control device 120, and then send the retrieved defect detection data packets to the core business unit 132. The core business unit 132 can parse the defect detection data packets to obtain defect identification data for each solder joint, and then send the defect identification data to the report generation unit 133, enabling the report generation unit 133 to generate a defect detection report based on the defect identification data for each solder joint.

[0093] In some embodiments, the data input unit 131 can also be used to receive manually input solder joint data from staff. The data input unit 131 can send the manually input solder joint data to the core business unit 132. The solder joint data may include the location coordinates, fracture level, and contamination ratio of the solder joint. It is understood that the manually input solder joint data may be obtained by manually identifying defects in solder joints that the control device 120 cannot recognize, and then manually input by staff into the data input unit 131.

[0094] In some embodiments, the report generation device 130 may further include a data processing unit 134, which is connected to the data input unit 131, the core business unit 132, and the control device 120. The data processing unit 134 can be used to acquire low-magnification and high-magnification images of the circuit board under test, calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate a labeled image based on the coordinate mapping relationship. The labeled image is obtained by selecting and labeling the high-magnification image within the low-magnification image (e.g., ...). Figure 11 As shown in the image, the annotated image is sent to the core business unit 132, which then sends it to the report generation unit 133. The report generation unit 133 can also generate a defect detection report based on the annotated image and defect identification data. Figure 11Taking the labeled image as an example, part A is the labeled image of the circuit board under test, part B is the high-magnification image, and the box indicates the position of the high-magnification image in the low-magnification image. Thus, the high-magnification image allows users to intuitively view the contamination and fracture level of each solder joint, while the labeled image allows users to confirm the position of each solder joint on the circuit board.

[0095] In this embodiment, the data processing unit 134 can employ image registration algorithms and anomaly detection algorithms to perform bounding box annotation on a high-magnification image within a low-magnification image. After performing bounding box annotation on the high-magnification image within the low-magnification image using the image registration algorithm, anomaly detection algorithms are then used to detect anomalies in the annotated image to ensure the accuracy of the annotated image. Specifically, the image registration algorithm can be the SIFT algorithm, and the anomaly detection algorithm can be the IQR-ML algorithm. This enables sub-pixel level image registration annotation, effectively improving the accuracy of the annotated image. Of course, in this embodiment, the image registration algorithm and anomaly detection algorithm are not limited to these.

[0096] In this embodiment, the low-magnification image can be multiple visual images obtained by the imaging unit 113 when scanning and capturing the circuit board under test, and the high-magnification image can be the image of the solder joint to be identified. Of course, the low-magnification image and the high-magnification image can also be obtained by the control device 120 by controlling the imaging unit 113 to capture the circuit board under test at different magnifications, and then sent to the data input unit 131, which provides them to the data processing unit 134 for data processing and image annotation.

[0097] It is understandable that the report generation unit 133 can generate a defect detection report based on the defect identification data and labeled images of each weld point, and the defect detection report can directly display the defect identification data and labeled images of each weld point.

[0098] In this embodiment, the core business unit 132 serves as the scheduling center of the report generation device 130, uniformly scheduling and processing all data from the control device 120 and the data processing unit 134, maintaining the consistency of data sources. Specifically, the core business unit 132 can employ digital control to retrieve data from the control device 120 and the data processing unit 134, and send the retrieved data to the report generation unit 133 to generate a defect detection report.

[0099] In some embodiments, the report generation unit 133 may be based on a VSTO plugin for office software, such as the Excel VSTO plugin and the Word VSTO plugin.

[0100] Taking the Excel VSTO add-in as an example, the report generation unit 133 can generate a dynamic point map based on the Excel VSTO add-in and defect identification data obtained from the core business unit 132. Specifically, staff can pre-set a report template, which is set according to the structure of the circuit board. The report generation unit 133 maps the position coordinates of each solder joint in the defect identification data to the coordinates of the report template, fills the corresponding table positions of each solder joint with the defect identification data of each solder joint, and then adaptively fills the color according to the penetration ratio of each solder joint to generate an intuitive dynamic point map of penetration ratio. Thus, staff can intuitively see the penetration ratio of each solder joint of the tested circuit board from the dynamic point map. Of course, the tables in the dynamic point map can also be filled with the fracture level and position coordinates of the corresponding solder joints.

[0101] Taking the Word VSTO plugin as an example, the report generation unit 133 can fill the specified fields (location coordinates, fracture level, infiltration ratio, and labeled image) of the Word report file based on the defect identification data and labeled image data obtained from the core business unit 132. It can perform online marking and annotation in the Word report file and display the labeled image of the circuit board under test. The Word report file can also be pre-set with a template, which sets the fields for each data point. After obtaining the defect identification data and labeled image data, the Word VSTO plugin directly fills the corresponding fields to generate the Word report file.

[0102] In some embodiments, the report generation unit 133 can be constructed using both an Excel VSTO add-in and a Word VSTO add-in. In this case, the Word VSTO add-in can directly read data from the diffusion ratio dynamic point plot and fill it into specified fields of the Word report file.

[0103] like Figure 9 As shown, in some embodiments, the solder joint defect detection and report generation system 100 may further include a quality tracking device 140. The quality tracking device 140 is connected to the core business unit 132 in the report generation device 130. The quality tracking device 140 can obtain defect identification data through the core business unit 132, and generate a quality tracking report based on the defect identification data and quality standards. The quality tracking report can be provided to the customer to report the quality of the manufactured circuit boards. Thus, the quality tracking device 140 can realize the automated generation of quality tracking reports.

[0104] Of course, the quality tracking device 140 can also be connected to the control device 120, so that the quality tracking device 140 can directly obtain defect identification data from the control device 120.

[0105] It is understandable that the quality tracking device 140 can also be a software program built into an electronic device. The quality standards are pre-defined categories of quality requirements for the circuit board under test, which may include, for example, the number of defective solder joints on the circuit board, the fracture level of the defective solder joints, the contamination ratio, location coordinates, etc. Different customers may have the same or different quality requirements for the same circuit board under test. A quality tracking report can be generated by selecting the quality standards and defect identification data that meet the specific needs of each customer.

[0106] Furthermore, such as Figure 12 As shown, the quality tracking device 140 may include a matching unit 141 and a quality tracking unit 142, with the matching unit 141 connected to the quality tracking unit 142. The core business unit 132 may include a data scheduler 1321, which can send data packets to the matching unit 141 via an API interface.

[0107] The core business unit 132 may be equipped with a test database, and the quality tracking device 140 may be equipped with a quality standard database.

[0108] The core business unit 132 can store the defect detection data packet obtained from the data input unit 131 or the data processing unit 134 into the test database. The data scheduler 1321 can retrieve the defect detection data packet from the test database according to default business rules (e.g., defect detection has been completed), and send the defect detection data packet to the matching unit 141 via an API interface. The matching unit 141 searches the quality standard database for a matching quality standard. If a matching standard exists, the matching unit 141 sends the defect detection data packet to the quality tracking unit 142. The quality tracking unit 142 generates a quality tracking report based on the defect detection data packet. It can be understood that the quality tracking unit 142 can parse the defect detection data packet to obtain defect identification data of the circuit board under test, and then generate a quality tracking report based on the parsed defect identification data and quality standards.

[0109] The quality standard database can store different circuit board quality standards, which can be generated based on different customers' quality acceptance requirements for circuit boards. The matching unit 141 searches the quality standard database for a quality standard that matches the defect detection data package. Then, the quality tracking unit 142 can generate a corresponding quality tracking report based on the defect detection data package and the quality standard. Thus, corresponding quality tracking reports can be automatically generated according to different customer needs, facilitating the provision of quality tracking reports to customers. It is understood that the quality tracking report can include defect identification data for each solder joint on the circuit board under test, as well as the quality results determined according to the quality standards.

[0110] The quality tracking unit 142 can also upload the generated quality tracking report to the cloud storage platform for storage, so as to facilitate data archiving and retrieval at any time.

[0111] In some embodiments, the quality tracking device 140 may further include a data export unit 143, which is connected to a cloud storage platform. The data export unit 143 can extract quality tracking reports from the cloud storage platform and export them for user viewing or to send to customers. In some specific examples, the data export unit 143 can export the quality tracking report as an Excel spreadsheet for easy user viewing. Of course, the file format exported by the data export unit 143 is not limited to this; for example, it can also export it as a Word document, a PowerPoint presentation, etc.

[0112] In some embodiments, the solder joint defect detection and report generation system 100 can also automatically record operation logs and add timestamps for the entire process from solder joint defect detection to defect detection report generation and quality tracking report generation, so as to ensure that the entire process of solder joint defect detection is traceable.

[0113] Please see Figure 13 , Figure 13 A schematic flowchart of a solder joint defect detection and report generation method according to an embodiment of this application is shown. In at least one embodiment, the solder joint defect detection and report generation method of this application can be applied to the aforementioned control device 120 and report generation device 130. Figure 13 As shown, the method for detecting and generating reports on weld joint defects includes the following steps: S110, Control the stage to move horizontally.

[0114] The circuit board to be tested, which has undergone color immersion and separation treatment beforehand, is placed on the stage 111. The control device 120 can move different areas on the circuit board to be tested one by one to the imaging area of ​​the imaging unit 113 by controlling the movement of the stage 111.

[0115] S120. During the movement of the stage, the imaging unit is controlled to take pictures of the circuit board under test in order to obtain a complete visual image of the circuit board under test.

[0116] The control device 120 can control the image unit 113 to scan and capture images of the circuit board under test during the movement of the stage 111 via the control unit 116 in the image device 110, thereby obtaining multiple visual images of the circuit board under test. The control unit 116 then sends the multiple visual images to the control device 120, which performs fusion and stitching processing on the multiple visual images to obtain a complete visual image.

[0117] S130. Obtain the position coordinates of each solder joint in the circuit board under test based on the complete visual image.

[0118] The control device 120 can identify solder joints from the complete visual image and then obtain the position coordinates of each solder joint.

[0119] S140. Based on the position coordinates of the solder joint, control the stage to move the solder joint to the location of the image unit.

[0120] S150: Control the moving unit to move the image unit vertically and control the image unit to capture the image of the solder joint to be tested.

[0121] The image of the solder joint to be tested is obtained by the imaging unit 113 by taking a picture of each solder joint on the circuit board to be tested.

[0122] S160. Identify whether there are defects in the solder joints based on the image to be tested, and store the defect identification data of the circuit board to be tested to form a defect detection data package.

[0123] In the solder joint defect detection and report generation method of this application, the stage 111 is controlled to move horizontally by the control device 120. During the movement of the stage 111, the image unit 113 is controlled to acquire a complete visual image of the circuit board under test. The position coordinates of each solder joint in the circuit board under test are obtained based on the complete visual image. Based on the position coordinates of the solder joints, the stage 111 is controlled to move the solder joints to the shooting area of ​​the image unit 113. The moving unit 112 is controlled to move the image unit 113 vertically and to capture the image of the solder joints under test. Then, the presence of defects in the solder joints is identified based on the image. Thus, automated defect detection of solder joints on the circuit board under test is achieved, which can improve the efficiency and accuracy of defect detection and prevent missed defects.

[0124] Please see Figure 14 In this embodiment of the application, step S150 may specifically include the following steps: S151. Move the image unit vertically using a preset step control moving unit.

[0125] S152. Each time the image unit moves, the image unit is controlled to automatically focus on the solder joint and perform layered scanning of the solder joint to capture multiple images of the solder joint to be tested.

[0126] The control device 120 can move the image unit 113 in the vertical direction by a preset step control moving unit 112, and make the image unit 113 automatically focus on the solder joint each time it moves, and take multiple images of the solder joint to be tested, thereby realizing the layered scanning and shooting of the solder joint.

[0127] In some embodiments, such as Figure 15 As shown, step S160 may include: S161, Confirm the number of steps taken when the image unit is successfully focused.

[0128] The image unit 113 can be confirmed to be in focus based on whether the captured image to be tested is clear. Then, the number of steps taken when the image unit 113 captures a clear image to be tested can be determined.

[0129] S162. Determine the fracture level of the solder joint based on the number of steps.

[0130] Further, please refer to Figure 16 Step S160 may also include: S163. Perform image synthesis processing on multiple images to be tested corresponding to the solder joint to obtain the image to be identified.

[0131] S164. Perform defect identification on the image to be identified, and confirm the cross-sectional area and stained area of ​​the weld point.

[0132] S165. Calculate the staining ratio of the weld joint based on the area of ​​the cross-sectional area and the staining area.

[0133] S166. Confirm whether there are defects in the solder joint based on the infiltration ratio and fracture level.

[0134] In some embodiments, such as Figure 17 As shown, the method for detecting and generating weld joint defects may also include: S170. Based on the complete visual image, perform preliminary defect identification of solder joints on the circuit board under test.

[0135] S180. Exclude solder joints that are confirmed to be defect-free in the preliminary defect identification.

[0136] Steps S170 to S180 are executed after step S120 and before step S130 to reduce the number of solder joints to be identified in subsequent defect identification, save defect identification time, and improve detection efficiency.

[0137] In this embodiment, the control device 120 can store the defect identification data of each circuit board under test that has undergone defect identification testing and form a defect detection data package. When needed, the tester can call up the defect detection data package to facilitate viewing and using the defect identification data of each circuit board under test.

[0138] In some embodiments, such as Figure 18 As shown, the method for detecting and generating reports on weld joint defects may also include the following steps: S210. Obtain the defect detection data packet of the circuit board under test.

[0139] Specifically, the report generation device 130 can retrieve the defect detection data packet from the control device 120. More specifically, the defect detection data packet can be retrieved from the control device 120 via the data input unit 131 in the report generation device 130.

[0140] S220. Generate a defect detection report for the circuit board under test based on the defect identification data in the defect detection data package.

[0141] The report generation device 130 can generate a defect detection report for the circuit board under test based on the invoked defect detection data package.

[0142] Furthermore, such as Figure 19 As shown, S220 may include: S221. Parse the defect detection data packet to obtain defect identification data for each solder joint of the circuit board under test.

[0143] The core business unit 132 in the report generation device 130 parses the defect detection data packet to obtain defect identification data for each solder joint.

[0144] S222. Generate a defect detection report based on the defect identification data of each weld point.

[0145] The core business unit 132 sends the obtained defect identification data to the report generation unit 133, which then generates a defect detection report based on the defect identification data of each weld point.

[0146] In some embodiments, such as Figure 20 As shown, the method for detecting and generating reports on weld joint defects may also include the following steps: S230: Acquire low-magnification and high-magnification images of the circuit board under test.

[0147] S240. Calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate an annotated image based on the coordinate mapping relationship.

[0148] The low-magnification and high-magnification images of the circuit board under test can be used to calculate the coordinate mapping relationship through the data processing unit 134 of the report generation device 130. Then, based on the coordinate mapping relationship, the high-magnification image is selected and marked in the low-magnification image to form a marked image.

[0149] Among them, high-magnification images allow users to easily and intuitively view the contamination and fracture levels of each solder joint, while labeled images allow users to easily confirm the location of each solder joint on the circuit board.

[0150] In some embodiments, such as Figure 21 As shown, the method for detecting and generating reports on weld joint defects may also include the following steps: S310. Obtain defect identification data of the circuit board under test.

[0151] Among them, the quality tracking device 140 can obtain defect identification data from the core business unit 132.

[0152] In some embodiments, the matching unit 141 in the quality tracking device 140 receives defect detection data packets through an API interface to obtain defect identification data.

[0153] S320. Generate a quality tracking report based on defect identification data and quality standards.

[0154] The quality tracking device 140 generates a quality tracking report based on defect identification data and quality standards. The matching unit 141 can search the quality standard database for a quality standard that matches the defect detection data packet. If a quality standard matching the defect detection data packet exists in the database, the matching unit 141 sends the defect detection data packet to the quality tracking unit 142 of the quality tracking device 140. The quality tracking unit 142 parses the defect detection data packet to obtain defect identification data, and then generates a quality tracking report based on the defect identification data and quality standards. The quality tracking report may include defect identification data for each solder joint on the circuit board under test, as well as the quality results determined according to the quality standards. For example, a quality standard could be that if the percentage of broken solder joints on the circuit board is greater than a preset percentage, the circuit board under test is considered unqualified; otherwise, it is considered qualified.

[0155] It is understood that the specific process of the solder joint defect detection and report generation method can be referred to the description of the solder joint defect detection and report generation system 100 mentioned above, and will not be repeated here.

[0156] This application also provides an electronic device, including a processor and a memory, the memory storing executable instructions of the processor, the processor being configured to perform the aforementioned solder joint defect detection method by executing the executable instructions.

[0157] In embodiments of this application, the memory includes non-volatile computer-readable storage, such as a disk, memory, etc. It is understood that the memory may also include other non-volatile computer-readable storage, such as plug-in hard disks, smart media cards (SMCs), secure digital (SD) cards, flash cards, at least one flash memory device, and / or other non-volatile solid-state storage devices.

[0158] In this embodiment, the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor can generate a detection program using the above-described solder joint defect detection method.

[0159] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps may be performed in other orders or simultaneously.

[0160] In the embodiments provided in this application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0161] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0162] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms. Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, i.e., they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs. Additionally, the functional units in the various embodiments of this application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. Note that the above are only preferred embodiments of this application and the technical principles used.

[0163] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the preferred embodiments above, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application. Those skilled in the art can also make other changes within the spirit of this application and use them in the design of this application, as long as they do not deviate from the technical effects of this application. These changes made in accordance with the spirit of this application should all be included within the scope of protection claimed in this application.

Claims

1. A system for detecting and generating reports on weld joint defects, characterized in that, include: An imaging device includes a stage, a moving unit, and an imaging unit. The stage is used to place a circuit board to be tested that has undergone color immersion and separation treatment beforehand. The moving unit is connected to the imaging unit and is used to move the imaging unit. The imaging unit is positioned opposite to the side of the stage where the circuit board to be tested is placed, and the imaging unit is used to acquire a test image of the solder joints in the circuit board to be tested. A control device, connected to the moving unit and the imaging unit, is configured to control the stage to move each solder joint on the circuit board under test sequentially to the imaging area of ​​the imaging unit, control the moving unit to move the imaging unit, control the imaging unit to capture the image under test, receive the image under test for each solder joint on the circuit board under test, and identify whether a defect exists on the corresponding solder joint based on the image under test. The control device is also configured to store the defect identification data of the circuit board under test to form a defect detection data package. A report generation device is connected to the control device. The report generation device is used to acquire the defect detection data packet and generate a defect detection report of the circuit board under test based on the defect detection data packet.

2. The weld joint defect detection and report generation system as described in claim 1, characterized in that, The report generation device includes a data input unit, a core business unit, and a report generation unit. The data input unit is connected to the control device and the core business unit, and the core business unit is communicatively connected to the report generation unit. The data input unit is used to retrieve the defect detection data packet from the control device and send it to the core business unit. The core business unit is used to parse the defect detection data packet to obtain the defect identification data of each of the solder joints and send the defect identification data to the report generation unit. The report generation unit is used to generate the defect detection report based on the defect identification data.

3. The weld joint defect detection and report generation system as described in claim 2, characterized in that, The data input unit is also used to receive solder joint data input from the outside and send the solder joint data to the core business unit.

4. The weld joint defect detection and report generation system as described in claim 2, characterized in that, It also includes a data processing unit, which is connected to the data input unit, the core business unit, and the control device; the data processing unit is used for: Acquire low-magnification and high-magnification images of the circuit board under test; Calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate an annotated image based on the coordinate mapping relationship; The labeled image is sent to the core business unit; The core business unit is also used to send the labeled image to the report generation unit, and the report generation unit is also used to generate the defect detection report based on the labeled image and the defect identification data.

5. The weld joint defect detection and report generation system as described in claim 1, characterized in that, The control device is also used to control the stage to move horizontally and to control the imaging unit to acquire a complete visual image of the circuit board under test.

6. The weld joint defect detection and report generation system as described in claim 5, characterized in that, The imaging unit includes a first objective lens and a second objective lens, wherein the magnification of the first objective lens is less than that of the second objective lens; the first objective lens is used to scan and capture images of the circuit board under test to obtain the complete visual image. The second objective lens is used to take a vertical image of each solder joint in the circuit board under test.

7. The weld joint defect detection and report generation system as described in claim 1, characterized in that, The imaging device further includes an optical diffraction unit, which is disposed opposite to the side of the stage on which the circuit board under test is placed. The optical diffraction unit is used to provide a color light source for the circuit board under test.

8. The weld joint defect detection and report generation system as described in claim 7, characterized in that, The imaging device also includes a smart light source for providing illumination to the imaging unit.

9. The weld joint defect detection and report generation system as described in claim 1, characterized in that, The imaging unit is also used to capture multiple images of the same solder joint under test; the control device includes an AI vision processing unit, which is used for: Image synthesis processing is performed on multiple images of the same solder joint to obtain the image to be identified corresponding to the solder joint. Defect identification is performed on the image to be identified to confirm the cross-sectional area and stained area of ​​the weld point; The staining ratio of the solder joint is calculated based on the area of ​​the cross-sectional area and the area of ​​the staining region.

10. The weld joint defect detection and report generation system as described in any one of claims 1 to 9, characterized in that, Also includes: A quality tracking device is connected to the control device or the report generation device. The quality tracking device is used to acquire the defect identification data and generate a quality tracking report based on the defect identification data and quality standards.

11. The weld joint defect detection and report generation system as described in claim 10, characterized in that, The quality tracking device includes a matching unit and a quality tracking unit, with the matching unit connected to the quality tracking unit. The matching unit is used to acquire a defect detection data packet and search the quality standard database for a quality standard that matches the defect detection data packet. If a matching standard exists, the matching unit sends the defect detection data packet to the quality tracking unit. The defect detection data packet contains the defect identification data. The quality tracking unit is used to parse the defect detection data packet to obtain the defect identification data and generate a quality tracking report based on the parsed defect identification data and the quality standard.

12. A system for detecting and generating reports on weld joint defects, characterized in that, include: An imaging device includes a stage, a moving unit, and an imaging unit. The stage is used to place a circuit board to be tested that has undergone color immersion and separation treatment beforehand. The moving unit is connected to the imaging unit and is used to move the imaging unit. The imaging unit is positioned opposite to the side of the stage where the circuit board to be tested is placed, and the imaging unit is used to acquire a test image of the solder joints in the circuit board to be tested. A control device is provided, which is connected to the moving unit and the imaging unit. The control device is used to control the stage to move so that each solder joint on the circuit board under test is sequentially moved to the shooting area of ​​the imaging unit, control the moving unit to move the imaging unit and control the imaging unit to capture the image under test, and receive the image under test of each solder joint on the circuit board under test, and identify whether there is a defect in the corresponding solder joint based on the image under test. The control device is also used to store the defect identification data of the circuit board under test to form a defect detection data package. as well as A quality tracking device is connected to the control device. The quality tracking device is used to acquire the defect identification data and generate a quality tracking report based on the defect identification data and quality standards.

13. A method for detecting and generating reports of solder joint defects, applied to a system for detecting and generating reports of solder joint defects, characterized in that, The solder joint defect detection and report generation system includes an imaging device, a control device, and a report generation device. The imaging device includes a stage, a moving unit, and an image unit. The stage is used to place the circuit board to be tested, which has undergone color immersion and separation treatment beforehand. The moving unit is connected to the image unit and is used to move the image unit. The control device is connected to the moving unit and the image unit, and the control device and the report generation device are used to execute the solder joint defect detection and report generation method. The method for detecting and generating reports on weld joint defects includes: The stage is controlled to move so that each solder joint on the circuit board under test is moved sequentially to the imaging area of ​​the imaging unit; The moving unit is controlled to move the imaging unit and the imaging unit is controlled to capture the image of the solder joint under test. Based on the image under test, identify whether there are defects in the solder joints and store the defect identification data of the circuit board under test to form a defect detection data package; Obtain the defect detection data packet; A defect detection report for the circuit board under test is generated based on the defect identification data in the defect detection data package.

14. The method for detecting and generating reports of weld joint defects as described in claim 13, characterized in that, The step of generating a defect detection report for the circuit board under test based on the defect identification data in the defect detection data packet includes: The defect detection data packet is parsed to obtain the defect identification data of each solder joint on the circuit board under test; The defect detection report is generated based on the defect identification data of each of the weld points.

15. The method for detecting and generating reports of weld defects as described in claim 13, characterized in that, Also includes: Acquire low-magnification and high-magnification images of the circuit board under test; Calculate the coordinate mapping relationship between the high-magnification image and the low-magnification image, and generate a labeled image based on the coordinate mapping relationship.

16. The method for detecting and generating reports of weld joint defects as described in claim 13, characterized in that, The method for detecting and generating reports on weld joint defects also includes: Control the stage to move horizontally; During the movement of the stage, the imaging unit is controlled to capture images of the circuit board under test in order to obtain a complete visual image of the circuit board under test. The position coordinates of each solder joint in the circuit board under test are obtained based on the complete visual image. The control of the stage movement to sequentially move each solder joint on the circuit board under test to the imaging area of ​​the imaging unit includes: The stage is controlled to move each solder joint sequentially to the imaging area of ​​the imaging unit according to the position coordinates of each solder joint.

17. The method for detecting and generating reports of weld joint defects as described in claim 16, characterized in that, The control of the moving unit to move the imaging unit and the control of the imaging unit to capture the image of the solder joint to be tested include: The moving unit moves the image unit in a preset step along the vertical direction; Each time the imaging unit is moved, the imaging unit is controlled to automatically focus on the solder joint and capture multiple images of the solder joint to be tested.

18. The method for detecting and generating reports of weld joint defects as described in claim 17, characterized in that, The step of identifying whether the solder joint has defects based on the image to be tested includes: The number of steps taken when the image unit is successfully focused; The fracture level of the solder joint is determined based on the number of steps.

19. The method for detecting and generating reports of weld joint defects as described in claim 18, characterized in that, The step of identifying whether the solder joint has defects based on the image to be tested further includes: The image to be identified is obtained by performing image synthesis processing on multiple images to be tested corresponding to the solder joint; Defect identification is performed on the image to be identified to confirm the cross-sectional area and stained area of ​​the weld point; The staining ratio of the solder joint is calculated based on the area of ​​the cross-sectional region and the area of ​​the staining region. The presence of defects in the solder joint is confirmed based on the infiltration ratio and the fracture level.

20. The method for detecting and generating reports of weld joint defects as described in any one of claims 16 to 19, characterized in that, During the movement of the stage, the imaging unit is controlled to capture images of the circuit board under test to obtain a complete visual image of the circuit board under test, including: During the movement of the stage, the imaging unit is controlled to scan and capture images of the circuit board under test, thereby obtaining multiple visual images. The complete visual image is obtained by fusing and stitching together multiple visual images.

21. The method for detecting and generating reports of weld joint defects as described in any one of claims 16 to 19, characterized in that, Also includes: Preliminary defect identification is performed on the solder joints on the circuit board under test based on the complete visual image. The solder joints that were confirmed to be defect-free in the initial defect identification were excluded.

22. The method for detecting and generating reports of weld joint defects as described in claim 13, characterized in that, The method for detecting and generating reports on weld joint defects also includes: A quality tracking report is generated based on the defect identification data and quality standards.

23. A method for detecting and generating reports of solder joint defects, applied to a system for detecting and generating reports of solder joint defects, characterized in that, The defect detection and report generation system includes an imaging device, a control device, and a quality tracking device. The imaging device includes a stage, a moving unit, and an imaging unit. The stage is used to place the circuit board to be tested, which has undergone color immersion and separation treatment beforehand. The moving unit is connected to the imaging unit and is used to move the imaging unit. The control device is connected to the moving unit and the imaging unit, and the control device and the quality tracking device are used to execute the solder joint defect detection and report generation method. The method for detecting and generating reports on weld joint defects includes: The stage is controlled to move so that each solder joint on the circuit board under test is moved sequentially to the imaging area of ​​the imaging unit; The moving unit is controlled to move the imaging unit and the imaging unit is controlled to capture the image of the solder joint under test. Identify whether the solder joint has defects based on the image to be tested; A quality tracking report is generated based on the defect identification data and quality standards of each solder joint on the circuit board under test.

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