Thermal defect diagnosis system and method for existing building elevator installation area

Abstract

The invention discloses a thermal defect diagnosis system and method for an existing building elevator adding area, and relates to the technical field of thermal defect diagnosis. The thermal defect diagnosis system comprises a visual twin control terminal, a hot-cold double-loop heat exchanger, a hot-cold double-loop heat exchanger, a hot-cold double-loop heat exchanger, a hot-cold double-loop heat exchanger and a hot-cold double-loop heat exchanger, the hot-cold double-loop heat exchanger is suitable for generating hot-cold energy and cold energy according to instructions of the visual twin control terminal, the heat exchange modules are connected with the hot-cold double-loop heat exchanger through a circulation pipeline a or a circulation pipeline b to form a heat energy loop or a cold energy loop, thermal excitation is conducted on the temperature change loading area, and the detection device is used for detecting the temperature change loading area. According to the invention, controllable heat energy or cold energy is applied to the interior wall elevator installation area, and the heat response data is acquired at the corresponding position of the outer wall for analysis, so that the purpose of automatically analyzing the positions of the heat bridge and the cold bridge to judge whether thermal defects exist in construction or not can be achieved.

Description

Technical Field

[0001] This invention relates to the field of thermal defect diagnosis technology, specifically to a system and method for diagnosing thermal defects in elevator retrofitting areas of existing buildings. Background Technology

[0002] With the acceleration of urbanization, a large number of existing buildings face the need for renovation and elevator installation. Elevator installation typically involves partial modifications to the original building's structural walls or connections to new structural components. During the renovation process, the original insulation structure is inevitably damaged, leading to serious thermal problems.

[0003] 1. Formation of structural thermal bridges: Cold bridges (or thermal bridges) are formed at the connection between the elevator shaft and the existing wall, causing a large amount of indoor heat to be lost in winter and condensation and mold to form at the connection joints; in summer, outdoor heat seeps in, increasing the air conditioning load.

[0004] 2. Offsetting energy-saving effects: Studies have shown that the energy loss caused by thermal bridging in the elevator installation area can even offset 15%-25% of the energy loss from completed external insulation energy-saving renovations.

[0005] 3. Significant hidden dangers in construction quality: During on-site construction, insulation materials need to be manually cut and spliced ​​at the junctions, resulting in poor sealing and many gaps, which further aggravates the problem of thermal defects.

[0006] Existing detection methods generally use equipment such as infrared thermal imagers to detect the heat flow distribution of the wall to identify cold bridges (or thermal bridges). However, these methods rely on the temperature difference between the external and indoor environments, which limits their accuracy. Therefore, there is an urgent need for a detection method that can accurately assess the thermal performance of the elevator installation area, locate thermal / cold bridge areas, and determine whether there are construction defects. Summary of the Invention

[0007] This invention provides a system and method for diagnosing thermal defects in elevator installation areas of existing buildings. By applying controllable heat or cold energy to the elevator installation area on the inner wall and collecting and analyzing thermal response data at the corresponding location on the outer wall, the system can automatically analyze the location of thermal bridges and cold bridges to determine whether thermal defects exist during construction.

[0008] A diagnostic system for thermal defects in elevator retrofitting areas of existing buildings includes the following steps:

[0009] The visual twin control terminal is configured to: construct a corresponding digital twin model based on the parameters of the building and elevator; and determine the location of data acquisition points and temperature change loading zones on the inner wall based on the digital twin model.

[0010] A dual-loop heat exchanger for hot and cold circuits is connected to a visual twin control terminal for communication, and is suitable for generating hot and cold energy according to the instructions of the visual twin control terminal.

[0011] At least one heat exchange module is connected to a dual-loop heat exchanger via circulation pipe a or circulation pipe b to form a thermal or cold energy loop, thereby providing thermal excitation to the temperature-changing loading zone.

[0012] The detection equipment is suitable for acquiring thermal response data at building exterior walls based on data acquisition points;

[0013] Visualized twin control is also used to determine the spatial acquisition location of the testing equipment; control the operation of the hot and cold dual-loop heat exchanger and the testing equipment; identify and diagnose thermal defects using thermal response data; and obtain the location of the heat exchange module to detect its installation position.

[0014] Furthermore, the visual twin control terminal includes a control unit, a display unit, a depth camera b, and an inertial measurement unit b, which are communicatively connected to the control unit.

[0015] Furthermore, the heat exchange module includes a heat-insulating shell with a concave cavity, a heat exchanger c is provided in the concave cavity, and a heat-conducting plate a is disposed at the opening of the concave cavity and forms a tight thermal coupling with the heat exchanger c to thermally excite the temperature-changing loading zone.

[0016] Furthermore, the hot and cold dual-loop heat exchanger includes a semiconductor heat pump module, which has a cold end and a hot end. Corresponding pump-type circulation components a and b are provided at the cold end and the hot end, respectively. Pump-type circulation components a and b are connected to the heat exchanger c through circulation pipes a and b to perform heat circulation.

[0017] Furthermore, the semiconductor heat pump module includes a semiconductor cooling chip and heat exchangers a and b thermally coupled to the cold and hot ends of the semiconductor cooling chip. Heat exchanger a can be connected to heat exchanger c through circulation pipe a, with a pump-type circulation component a installed on the pipe for a first heat cycle, or connected to heat exchanger c through circulation pipe b, with a pump-type circulation component b installed on the pipe for a second heat cycle.

[0018] Furthermore, a temperature sensor a is provided on the pipeline of the first thermal cycle, and a temperature sensor b is provided on the pipeline of the second thermal cycle. The pump-type circulation assembly a, the pump-type circulation assembly b, the semiconductor cooling chip, the temperature sensor a, and the temperature sensor b are respectively connected to the control unit in communication.

[0019] Furthermore, it also includes a support, which includes a base, a damping telescopic frame hinged to the top of the base, a damping telescopic rod hinged between a segment of the damping telescopic frame near the base and the base, and the end of another segment of the damping telescopic frame detachably hinged to the side of the heat insulation shell away from the heat-conducting plate a.

[0020] Furthermore, the detection equipment includes a mobile carrier, on which a depth camera a, an inertial measurement unit a, and an infrared imaging sensor are mounted. The mobile carrier, the depth camera a, the inertial measurement unit a, and the infrared imaging sensor are all communicatively connected to the control unit.

[0021] A method for diagnosing thermal defects in elevator retrofitting areas of existing buildings includes the following steps:

[0022] The visualized twin control terminal constructs a digital twin model based on data of building structure and elevator structural components;

[0023] Based on the digital twin model, the locations of several temperature-changing loading zones that need to be detected on the interior wall, as well as the corresponding detection points of the detection equipment, are determined.

[0024] The visual twin control terminal divides several temperature-varying loading zones into heating and cooling groups based on wall temperature and generates execution processes.

[0025] Based on the execution process, staff obtain the installation location of the heat exchange module through the visual twin control terminal, and install the heat exchange module in the corresponding heating or cooling group. The visual twin control terminal identifies and prompts the installation location during the installation process until it coincides with the installation location.

[0026] The visual twin control terminal controls the dual-loop heat exchanger to deliver heat and cold energy to the corresponding heat exchange modules to thermally stimulate the interior wall.

[0027] After the temperature loading is completed, the visual twin control terminal controls the detection equipment to move to the detection point, collects thermal response data of the corresponding exterior wall area, and transmits the data back to the visual twin control terminal;

[0028] The visual twin control terminal identifies the location of thermal or cold bridge defects in the wall based on the returned heat transfer data.

[0029] Furthermore, it also includes determining spatial positioning points on the wall based on the digital twin model, setting positioning marks on the spatial positioning points, and enabling the visual twin control terminal and detection equipment to determine the spatial position in the digital twin model based on the positioning marks.

[0030] The beneficial effects of the above-described technical solutions provided in the embodiments of the present invention include at least the following:

[0031] 1. The visual twin control terminal can construct a corresponding digital twin based on building and elevator parameters to confirm the location of the temperature-changing loading zone, achieving precise thermal excitation. Compared with existing equipment such as infrared thermal imagers, this greatly improves the accuracy of thermal defect detection. Simultaneously, it allows for free adjustment of the wall temperature, avoiding the limitations of existing technologies that rely on ambient temperature differences for detection.

[0032] 2. The visual twin control terminal can automatically divide the inner wall area into heating and cooling groups based on the wall temperature change, so that the thermal excitation method matches the position of the corresponding area of ​​the wall, improving the efficiency and accuracy of detection, and further improving the accuracy of thermal defect identification.

[0033] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings.

[0034] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0035] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0036] Figure 1 This is a schematic diagram of the thermal defect diagnosis system disclosed in an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the thermal defect diagnosis system disclosed in an embodiment of the present invention deployed in a building;

[0038] Figure 3 This is a schematic diagram of a heat exchange module fixed to an inner wall temperature-varying loading zone using a bracket, as disclosed in an embodiment of the present invention.

[0039] Figure 4 This is a schematic diagram of a radiator fixed to an inner wall temperature-varying loading zone using a bracket, as disclosed in an embodiment of the present invention.

[0040] Figure 5 This is a schematic diagram of a visual twin control terminal controlling a detection device to capture thermal response data at a building exterior wall at a data acquisition point, as disclosed in an embodiment of the present invention.

[0041] Figure 6 This is a flowchart of the thermal defect diagnosis method disclosed in an embodiment of the present invention.

[0042] Figure label:

[0043] 1. Wall; 11. Interior wall; 12. Exterior wall; 2. Dual-loop heat exchanger; 21. Semiconductor heat pump module; 211. Semiconductor cooling chip; 212. Heat exchanger a; 213. Heat exchanger b; 214. Pump-type circulation assembly a; 215. Pump-type circulation assembly b; 216. Temperature sensor a; 217. Temperature sensor b; 3. Circulation pipeline a; 4. Circulation pipeline b; 5. Heat exchange module; 51. Insulated shell; 52. Heat exchanger c; 53. Heat-conducting plate a; 6. Radiator; 61. Heat-conducting plate b; 62. Fins; 7. Bracket; 71. Base; 72. Damped telescopic frame; 73. Damped telescopic rod; 8. Detection equipment; 81. Depth camera a; 82. Inertial measurement unit a; 83. Infrared imaging sensor; 84. Mobile carrier; 9. Visual twin control terminal; 91. Display unit; 92. Depth camera b; 93. Inertial measurement unit b; 94. Control unit; 10. Elevator; 12. Positioning marker. Detailed Implementation

[0044] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0045] Figure 1 The structure of the thermal defect diagnosis system disclosed in the embodiment of the present invention is shown. The diagnosis system mainly consists of a dual-loop heat exchanger 2 (heat and cold energy generation device), a heat exchange module 5 (heat and cold energy release device), a detection device 8 (acquiring thermal response data at data acquisition points on the exterior wall of the building 12), and a visual twin control terminal 9 (data analysis and device control terminal).

[0046] like Figure 1 As shown, the visual twin control terminal 9 includes a control unit 94 and a display unit 91, a depth camera b92, and an inertial measurement unit b93 that are communicatively connected to the control unit 94. It can be understood that the control unit 94, the display unit 91, the depth camera b92, and the inertial measurement unit b93 are integrated into a single housing. The display unit 91 is used for human-machine interaction with the operator. The display unit 91 has a human-machine interface on which the operator can receive information and send manual control commands, such as controlling the detection device 8 to move to the data acquisition point and to acquire data, and controlling the hot and cold dual-loop heat exchanger 2 to start or stop. The depth camera b92 is used to capture three-dimensional structural data on the inner wall 11, and the inertial measurement unit b93 is used to acquire motion attitude data of the visual twin control terminal 9.

[0047] During the positioning of the heat exchange module 5: the visual twin control terminal 9 uses the depth camera b92 to acquire the three-dimensional structural data on the inner wall 11. By identifying the features of the three-dimensional structure and the distance between the current position and each structure of the wall 1, the spatial position of the visual twin control terminal 9 in the digital twin model is realized. The data acquired by the inertial measurement unit b93 is used to determine the attitude of the visual twin control terminal 9 in the digital twin model.

[0048] The core technology of the entire solution lies in using active thermal excitation (heating or cooling) to achieve the temperature difference between the inside and outside of the wall, thereby avoiding the limitations of existing detection methods that only use the ambient temperature difference to obtain analytical data.

[0049] In this process, precise thermal excitation is crucial, as it determines the accuracy of the final data acquired by the entire scheme. To achieve this goal, this invention proposes a scheme for constructing a corresponding digital twin model based on the parameters of the building and elevator 10; and for determining the location of data acquisition points and the temperature-changing loading zone on the inner wall 11 of wall 1 based on the digital twin model, as follows:

[0050] Construction parameters are used to obtain parameters of the building and elevator 10, and a digital twin model that can accurately reflect the building and elevator 10 is constructed based on these parameters. This model is used to determine the temperature change loading zone on the inner wall 11 of the wall 1 and to determine the corresponding data acquisition points, so as to accurately perform thermal excitation and data acquisition. The data acquisition location has a corresponding temperature change loading zone location, which can achieve the purpose of accurately acquiring thermal excitation-thermal response data. Compared with the existing detection methods using infrared thermal imagers and other equipment, it not only has greater versatility but also has an accuracy that cannot be achieved by existing technologies.

[0051] Therefore, the installation position of the heat exchange module 5 is particularly important. After determining the location of the temperature-changing loading zone on the inner wall 11, the visual twin control terminal 9 marks this location. During the installation process, the visual twin control terminal 9 uses data collected by the depth camera b92 and attitude data obtained by the inertial measurement unit b93 to identify whether the heat exchange module 5 is correctly installed in the determined temperature-changing loading zone. This can be understood as the depth camera b92 and the inertial measurement unit b93 working together during the installation of the heat exchange module 5 to monitor and provide feedback on the spatial position of the heat exchange module 5 in real time. This helps the staff see the virtual temperature-changing loading zone through the human-machine interface on the display unit 91, thereby adjusting the position of the heat exchange module 5. This real-time feedback mechanism ensures that the heat exchange module 5 is in the correct position and fits against the surface of the wall 1.

[0052] To further improve the spatial positioning accuracy of the visual twin control terminal 9 and the detection device 8, the system also includes determining spatial positioning points on the wall 1 based on the digital twin model. Positioning markers 12 are set at these spatial positioning points. The visual twin control terminal 9 and the detection device 8 can determine their spatial positions in the digital twin model based on the positioning markers 12. The spatial positioning points are distributed on the inner wall 11 and the outer wall 12, and they have spatial coordinates corresponding to the digital twin model. Positioning markers 12 are set at these spatial positioning points. During the data acquisition process, depth cameras a81 and b92 further enhance the accuracy of their spatial positions by identifying the positions of the positioning markers 12.

[0053] like Figures 2-3 As shown, the heat exchange module 5 needs to be installed on the inner wall 11 and fixed to the inner wall 11 by means of the bracket 7. The bracket 7 includes a base 71, and a damping telescopic frame 72 is hinged to the top of the base 71. A damping telescopic rod 73 is hinged between the segment of the damping telescopic frame 72 near the base 71 and the base 71. The end of the other segment of the damping telescopic frame 72 is detachably hinged to the side of the heat insulation shell 51 of the heat exchange module 5 away from the heat conduction plate a53. The damping telescopic frame 72, the damping telescopic rod 73 and the detachable hinge method adopt existing technology, such as setting hooks on the heat insulation shell 51 and setting corresponding hanging holes at the end of the damping telescopic frame 72 to achieve both hinge and detachable connection. The damping telescopic frame 72 and the damping telescopic rod 73 are used to adjust any length and achieve positioning through their damping result, which facilitates the installation and fixing of the heat exchange module 5. Those skilled in the art can also use other similar or dissimilar but equivalent structures to achieve this process.

[0054] Another key technical point is that this solution also proposes to use different thermal excitation schemes, such as heating or cooling, based on the temperature distribution of wall 1. The advantage of adopting such a scheme is that it can fit the actual temperature state of wall 1, better control the temperature difference of wall 1, achieve the maximum temperature difference, and facilitate the identification of the location of thermal defects.

[0055] In this process, the temperature distribution of the inner wall 11 body 1 and the outer wall 12 body 1 can be obtained by detection device 8 or other devices that can capture the temperature distribution of the wall 1. Based on the set of temperature change loading zones, the temperature change loading zones are divided into heating groups and cooling groups. It can be understood that the heating group and cooling group that have not yet been thermally excited can change dynamically, which is determined based on the real-time temperature distribution of the inner wall 11 body 1 and the outer wall 12 body 1. The frequency of this adjustment process can be controlled by adjusting the acquisition frequency of the temperature distribution data.

[0056] Figure 6A method for diagnosing thermal defects in the elevator retrofit area of ​​an existing building is shown, including the following steps:

[0057] S1, the visual twin control terminal 9 constructs a digital twin model based on the building structure and elevator 10 structural component data.

[0058] S2, based on the digital twin model, determine the location of several temperature-changing loading zones on the inner wall 11 that need to be detected, as well as the corresponding detection points of the detection equipment 8.

[0059] The process of determining the location of the temperature-dependent loading zone includes:

[0060] Based on the building structural component data and elevator 10 structural component data in the digital twin model;

[0061] Identify all areas that may form geometric thermal bridges, including: joint gaps, such as geometric lines at the junction of old and new structural walls 1, floors, doors and windows, penetration points, such as the location where elevator 10 guide rails, supporting structural components or embedded parts penetrate the insulation layer of wall 1, and geometric abrupt changes, such as corners and edges where the thickness or material of wall 1 changes drastically, forming a set of high-risk structural feature points;

[0062] Based on the material thermal conductivity, density, and specific heat capacity of each component in the digital twin model, all regions that may form material thermal bridges are identified.

[0063] By using existing finite element heat conduction simulations, the regions with the highest heat flux density or the most abnormal surface temperature gradient on the inner wall 11 are identified, and these regions are designated as the final temperature-varying loading zones.

[0064] The process of determining the detection points of detection equipment 8 includes:

[0065] Extract the coordinates of the center point of the temperature-changing loading zone and determine the coordinates of the corresponding source point on the outer wall 12;

[0066] Based on the determined size of the temperature-varying loading zone and the inherent field-of-view parameters of the infrared imaging sensor 83, the minimum detection distance required to completely and clearly cover the area is calculated. At the same time, the optimal normal alignment angle relative to the 12 sides of the outer wall is calculated to avoid spatial resolution and thermal radiation measurement errors caused by large-angle tilt shooting.

[0067] S3, the visual twin control terminal 9 divides several temperature-varying loading zones into heating and cooling groups based on the temperature of the wall 1, and generates an execution process.

[0068] The process of dividing the temperature-variable loading zone into a heating group and a cooling group includes:

[0069] The visual twin control terminal 9 first acquires the real-time surface temperature T of the inner wall 11 corresponding to the temperature-changing loading zone to be detected.内 Real-time surface temperature of exterior wall 12 T 外 ;

[0070] Based on the preset heating target temperature T3 and cooling target temperature T4, the visual twin control terminal 9 calculates the final temperature difference potential T5 and T6 that the heating excitation and cooling excitation may reach for each temperature change loading zone.

[0071] The visual twin control terminal 9 divides the temperature-varying loading zone into the excitation group (heating group or cooling group) that can provide the maximum potential final temperature difference, and generates the corresponding execution process.

[0072] Specifically, the core of this allocation method is to maximize the target temperature difference. That is, the basis for judgment is: after applying the excitation, which operation can make the temperature difference between the inner wall 11 and the outer wall 12 in the target area reach the maximum value.

[0073] The grouping of the temperature-varying loading zone is dynamic. The frequency of the adjustment process can be controlled by adjusting the acquisition frequency of the temperature distribution data, based on the real-time temperature distribution of the inner wall 11 body 1 and the outer wall 12 body 1.

[0074] S4. Based on the execution process, the staff obtains the installation position of the heat exchange module 5 through the visual twin control terminal 9, and installs the heat exchange module 5 in the corresponding heating or cooling group position. The visual twin control terminal 9 identifies and prompts the installation position during the installation process until it coincides with the installation position.

[0075] S5, the visual twin control terminal 9 controls the hot and cold dual-loop heat exchanger 2 to deliver heat and cold energy to the corresponding heat exchange module 5 to thermally stimulate the inner wall 11.

[0076] like Figures 1-3As shown, the heat exchange module 5 includes a heat-insulating outer shell 51 with a concave cavity. A heat exchanger c52 is disposed in the concave cavity. A heat-conducting plate a53 is disposed at the opening of the concave cavity and forms a tight thermal coupling with the heat exchanger c52 to provide thermal excitation for the temperature-changing loading zone. The dual-loop heat exchanger 2 includes a semiconductor heat pump module 21, which has a cold end and a hot end. Corresponding pump-type circulation components a214 and b215 are provided at the cold end and the hot end, respectively. Pump-type circulation components a214 and b215 are connected to the heat exchanger c52 through circulation pipes a3 and b4, respectively, for thermal circulation. The semiconductor heat pump module 21 includes a semiconductor cooling chip 211 and a semiconductor cooling chip 212. The refrigeration chip 211 has heat exchangers a212 and b213 with its cold and hot ends thermally coupled. Heat exchanger a212 can be connected to heat exchanger c52 through circulation pipe a3, and a pump-type circulation assembly a214 is installed on the pipe for a first thermal cycle, or it can be connected to heat exchanger c52 through circulation pipe b4, and a pump-type circulation assembly b215 is installed on the pipe for a second thermal cycle. A temperature sensor a216 is installed on the pipe for the first thermal cycle, and a temperature sensor b217 is installed on the pipe for the second thermal cycle. The pump-type circulation assembly a214, the pump-type circulation assembly b215, the semiconductor refrigeration chip 211, the temperature sensor a216, and the temperature sensor b217 are respectively connected to the control unit 94 for communication.

[0077] It should be noted that the thermoelectric cooler 211, heat exchangers a212, b213, c52, pump-type circulation assembly a214, and pump-type circulation assembly b215 utilize existing technology. Specifically, heat exchangers a212, b213, and c52 are copper tube heat exchangers. Heat exchangers a212 and b213 are connected to the cold and hot ends of the thermoelectric cooler 211, respectively, to form a thermal coupling structure. This structure is used to transfer the heat and cold energy generated by the thermoelectric cooler 211 through circulation pipe a3 and circulation... The loop pipe b4 delivers the medium to the heat exchanger c52. Pump-type circulation components a214 and b215 are power components used to provide power for the circulation of the medium in the first and second hot circulation pipes. The medium used in the first and second hot circulation pipes can be a deionized water-ethylene glycol mixed solution or other media applicable to this solution. Temperature sensors a216 and b217 are used to acquire temperature data in the first and second hot circulation pipes and upload it to the visual twin control terminal 9.

[0078] It should be noted that the cold and hot ends of the thermoelectric cooler 211 are interchangeable, which is an existing technology. The specific working principle will not be elaborated here. The dual-loop heat exchanger 2 can be connected to one heat exchange module 5 or two heat exchange modules 5 at the same time. When one heat exchange module 5 is connected, the heat exchange module 5 heats or cools according to the current cold or hot end of the thermoelectric cooler 211. For example, if cooling is required for thermal excitation in the current temperature change loading zone, the thermoelectric cooler 211 is adjusted to cool the heat exchange module 5 according to the position of the connected heat exchange module 5. When heating is required for thermal excitation in the current temperature change loading zone, the circulation pipeline of the heat exchange module 5 can be replaced, such as replacing circulation pipeline a3 with circulation pipeline b4, or the thermoelectric cooler 211 can be directly adjusted to heat the heat exchange module 5 according to the position of the connected heat exchange module 5.

[0079] The advantage of doing this is that during the process of thermally stimulating the front temperature variable loading zone, there will be operations that require heating and cooling stimulation. For example, after the temperature difference between the inner and outer walls changes, it is necessary to adjust the current cooling scheme to heating. At this time, the above method can be used for adjustment.

[0080] This embodiment also provides another method, such as Figure 4 As shown, it also includes a radiator 6, which includes two heat-conducting plates b61 and fins 62 disposed between the two heat-conducting plates. When it is necessary to change the thermal excitation mode of the temperature-variable loading zone, the room temperature can be restored through the radiator 6, which is used to reduce the energy consumption of the hot and cold dual-loop heat exchanger 2.

[0081] The hot and cold dual-loop heat exchanger 2 can also connect two hot and cold dual-loop heat exchangers 2 at the same time, one for heating excitation and the other for cooling excitation. If the two heat exchange modules 5 need to change the temperature-changing loading area at the same time, for example, the temperature-changing loading area is changed from the heating group to the cooling group and the cooling group to the heating group, the heating and cooling ends are directly adjusted and swapped through the semiconductor cooling chip 211. If they are inconsistent, after swapping, the other unused heat exchange module 5 is applied to the inner wall 11 with the same required thermal excitation model.

[0082] The dual-loop heat exchanger 2 can simultaneously acquire both hot and cold energy, maximizing energy utilization and enabling different thermal excitation modes, which facilitates accurate identification of the location of thermal defects.

[0083] S6. After the temperature loading is completed, the visual twin control terminal 9 controls the detection device 8 to move to the detection point, collects thermal response data for the corresponding outer wall area 12, and transmits the data back to the visual twin control terminal 9.

[0084] like Figure 5As shown, the visual twin control terminal 9 controls the detection device 8 to move from its current spatial position in the digital twin model coordinate system to the spatial position of the data acquisition point based on the position of the detection device 8. The data acquired by the depth camera a81 includes the position of the positioning marker 12 and the attitude data detected by the inertial measurement unit b93. The attitude and spatial position of the detection device 8 are adjusted so that it can acquire thermal response data on the outer wall 12 at the required angle. The thermal response data is acquired by the infrared imaging sensor 83 and the acquired data is sent to the visual twin control terminal 9.

[0085] It should be noted that the detection device 8 includes a mobile carrier 84, which uses existing technologies such as drones. The mobile carrier 84 is equipped with a depth camera a81, an inertial measurement unit a82, and an infrared imaging sensor 83. The visual twin control terminal 9 is connected to the mobile carrier 84 and obtains its spatial position based on the data it acquires, such as positioning data. After moving it to the data acquisition point, its position is calibrated by the positioning marker 12 and the data captured by the depth camera b92.

[0086] S7, the visual twin control terminal 9 identifies the location of thermal or cold bridge defects in the wall 1 based on the returned heat transfer data.

[0087] First, the visual twin control terminal 9 receives the raw heat transfer data (thermal response data) containing time series and spatial information transmitted back by the detection device 8, and uses the spatial pose parameters synchronously uploaded by the detection device 8 to perform precise pixel-level registration of each pixel in the thermal response data with the three-dimensional geometric mesh of the surface of the outer wall 12 in the digital twin model through the existing spatial mapping algorithm, thereby transforming the two-dimensional thermal image data into dynamic temperature field distribution data on the surface of the three-dimensional model.

[0088] Next, the visual twin control terminal 9 extracts temporal and spatial features from the registered temperature field data. In the temporal domain, the visual twin control terminal 9 extracts the transient temperature change curve of each grid point during and after the application of thermal excitation, and calculates its temperature rise rate or decay rate. In the spatial domain, the visual twin control terminal 9 calculates the lateral temperature difference between adjacent grid points and generates a thermal contrast distribution map. Because the thermal conductivity or heat capacity of the material in the thermal bridge or cold bridge region differs significantly from that of the surrounding normal wall 1, it will exhibit a faster temperature response speed, a larger temperature fluctuation, and a clear temperature gradient boundary with the background region under thermal excitation.

[0089] Subsequently, the visual twin control terminal 9 calls the theoretical thermal parameters in the digital twin model, runs the existing heat conduction simulation algorithm to generate the standard theoretical temperature response curve under this operating condition, and compares the actual acquired transient temperature change curve with the theoretical curve point by point.

[0090] Finally, when the deviation characteristic value between the actual data and the theoretical data exceeds the preset anomaly judgment threshold, the visual twin control terminal 9 determines the grid area as a thermal defect area and marks the geometric boundary range and center three-dimensional coordinates of the defect area in the unified coordinate system of the digital twin model, thereby completing the accurate identification of the thermal defect location of the wall 1.

[0091] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process may be rearranged without departing from the scope of this disclosure. The appended method claims provide elements of various steps in an exemplary order and are not intended to limit the scope to the specific order or hierarchy described.

[0092] In the detailed description above, various features are combined together in a single embodiment to simplify this disclosure. This approach to disclosure should not be construed as reflecting an intention that embodiments of the claimed subject matter require more features than are explicitly stated in each claim. Rather, as reflected in the appended claims, the invention is presented with fewer features than all of the features in a single disclosed embodiment. Therefore, the appended claims are hereby explicitly incorporated into the detailed description, with each claim representing a separate preferred embodiment of the invention.

[0093] Those skilled in the art will also understand that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments herein can be implemented as electronic hardware, computer software, or a combination thereof. To clearly illustrate the interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps described above are generally described in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in alternative ways for each specific application; however, such implementation decisions should not be construed as departing from the scope of this disclosure.

[0094] The steps of the methods or algorithms described in conjunction with the embodiments herein can be directly embodied in hardware, software modules executed by a processor, or a combination thereof. The software modules can reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium well known in the art. An exemplary storage medium is connected to the processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. The ASIC can reside in a user terminal. Alternatively, the processor and storage medium can exist as discrete components in the user terminal.

[0095] For software implementation, the techniques described in this application can be implemented using modules (e.g., procedures, functions, etc.) that perform the functions described in this application. This software code can be stored in memory units and executed by a processor. The memory units can be implemented within the processor or outside the processor; in the latter case, they are communicatively coupled to the processor via various means, as is well known in the art.

[0096] The foregoing description includes examples of one or more embodiments. It is certainly impossible to describe all possible combinations of components or methods in order to describe the above embodiments, but those skilled in the art will recognize that the various embodiments can be further combined and arranged. Therefore, the embodiments described herein are intended to cover all such changes, modifications, and variations that fall within the scope of the appended claims. Furthermore, the term "comprising" as used in the specification or claims is interpreted in a manner similar to the term "including," as interpreted when used as a conjunction in the claims. Additionally, the use of any term "or" in the specification of the claims is intended to mean "non-exclusive or."

Claims

1. A system for diagnosing thermal defects in elevator retrofitting areas of existing buildings, characterized in that, include: The visual twin control terminal is configured to construct a corresponding digital twin model based on the parameters of the building and elevator. The location of data collection points and temperature-varying loading zones on the inner wall of the wall was determined based on a digital twin model. A dual-loop heat exchanger for hot and cold circuits is connected to a visual twin control terminal for communication, and is suitable for generating hot and cold energy according to the instructions of the visual twin control terminal. At least one heat exchange module is connected to a dual-loop heat exchanger via circulation pipe a or circulation pipe b to form a thermal or cold energy loop, thereby providing thermal excitation to the temperature-changing loading zone. The detection equipment is suitable for acquiring thermal response data at building exterior walls based on data acquisition points; Visualized twin control is also used to determine the spatial acquisition location of the testing equipment; control the operation of the hot and cold dual-loop heat exchanger and the testing equipment; identify and diagnose thermal defects using thermal response data; and obtain the location of the heat exchange module to detect its installation position.

2. The diagnostic system as described in claim 1, characterized in that, The visual twin control terminal includes a control unit, a display unit, a depth camera b, and an inertial measurement unit b, which are connected in communication with the control unit.

3. The diagnostic system as described in claim 2, characterized in that, The heat exchange module includes a heat-insulating shell with a concave cavity, a heat exchanger c is provided in the concave cavity, and a heat-conducting plate a is disposed at the opening of the concave cavity and forms a tight thermal coupling with the heat exchanger c to thermally excite the temperature-changing loading zone.

4. The diagnostic system as described in claim 3, characterized in that, The hot and cold dual-loop heat exchanger includes a semiconductor heat pump module, which has a cold end and a hot end. The cold end and the hot end are provided with corresponding pump-type circulation components a and b. Pump-type circulation components a and b are connected to the heat exchanger c through circulation pipes a and b, respectively, for heat circulation.

5. The diagnostic system as described in claim 4, characterized in that, The semiconductor heat pump module includes a semiconductor cooling chip and heat exchangers a and b thermally coupled to the cold and hot ends of the semiconductor cooling chip. Heat exchanger a can be connected to heat exchanger c through circulation pipe a, with a pump-type circulation component a installed on the pipe for a first heat cycle, or connected to heat exchanger c through circulation pipe b, with a pump-type circulation component b installed on the pipe for a second heat cycle.

6. The diagnostic system as described in claim 5, characterized in that, Temperature sensor a is installed on the pipeline of the first thermal cycle, and temperature sensor b is installed on the pipeline of the second thermal cycle. Pump-type circulation assembly a, pump-type circulation assembly b, semiconductor cooling chip, temperature sensor a and temperature sensor b are respectively connected to the control unit for communication.

7. The diagnostic system as described in claim 3, characterized in that, It also includes a support, which includes a base, a damping telescopic frame hinged to the top of the base, a damping telescopic rod hinged between the segment of the damping telescopic frame near the base and the base, and the end of another segment of the damping telescopic frame detachably hinged to the side of the heat insulation shell away from the heat conduction plate a.

8. The diagnostic system as described in claim 2, characterized in that, The detection equipment includes a mobile carrier, on which a depth camera a, an inertial measurement unit a, and an infrared imaging sensor are mounted. The mobile carrier, the depth camera a, the inertial measurement unit a, and the infrared imaging sensor are all communicatively connected to the control unit.

9. A method for diagnosing thermal defects in elevator retrofitting areas of existing buildings, applied to the diagnostic system described in claim 1, characterized in that, Includes the following steps: The visualized twin control terminal constructs a digital twin model based on data of building structure and elevator structural components; Based on the digital twin model, the locations of several temperature-changing loading zones that need to be detected on the interior wall, as well as the corresponding detection points of the detection equipment, are determined. The visual twin control terminal divides several temperature-varying loading zones into heating and cooling groups based on wall temperature and generates execution processes. Based on the execution process, staff obtain the installation location of the heat exchange module through the visual twin control terminal, and install the heat exchange module in the corresponding heating or cooling group. The visual twin control terminal identifies and prompts the installation location during the installation process until it coincides with the installation location. The visual twin control terminal controls the dual-loop heat exchanger to deliver heat and cold energy to the corresponding heat exchange modules to thermally stimulate the interior wall. After the temperature loading is completed, the visual twin control terminal controls the detection equipment to move to the detection point, collects thermal response data of the corresponding exterior wall area, and transmits the data back to the visual twin control terminal; The visual twin control terminal identifies the location of thermal or cold bridge defects in the wall based on the returned heat transfer data.

10. The diagnostic method as described in claim 9, characterized in that, It also includes determining spatial positioning points on the wall based on the digital twin model, setting positioning marks on the spatial positioning points, and the visual twin control terminal and detection equipment can determine the spatial position in the digital twin model based on the positioning marks.

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