Pre-aligner based on Bernoulli wafer adsorption mode

Abstract

The invention discloses a pre-aligner based on a Bernoulli wafer adsorption mode, and the pre-aligner comprises a rack body, the upper end part of the rack body is provided with a working table top, the working table top is fixedly provided with a correction mechanism, a size adjustment movement mechanism and a jacking movement mechanism, and the correction mechanism and the jacking movement mechanism cooperate to carry out a wafer sequence turning action. A mechanism composed of a servo motor, a gear rack, a motor lead screw sliding rail and the like is controlled through an editable logic module to achieve automatic action, information such as the position of a product is recognized through a sensor while movement is conducted, the servo motor lead screw is controlled through the editable logic module to push a connecting rod mechanism to move left and right and front and back, and the motor controls a Z-axis to move up and down; and meanwhile, the functions of taking and placing wafers by fingers, holding and conveying the wafers can be achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a pre-aligner based on Bernoulli adsorption wafer method. Background Technology

[0002] In the semiconductor integrated circuit manufacturing process, the wafer pre-alignment device, as a core component of the transmission system, primarily functions to center the wafer and orient the notch, correcting wafer center offset and notch deflection. As semiconductor process technology continues to shrink, the requirements for wafer pre-alignment accuracy are increasing.

[0003] The pre-alignment device involves multiple components such as a motion platform, a rotating shaft system, and sensors. Due to limitations in the machining accuracy of the parts and the level of manual assembly, there is often an axial deviation and distance error between the detection center of the sensor and the physical center of the rotating platform. Although the error can be reduced through high-precision mechanical calibration, this is not only costly and time-consuming, but also makes it difficult to ensure the consistency of each device.

[0004] The existing Chinese patent CN121310950A describes a wafer pre-alignment device and method, which mentions correction. However, based on the wafer's center coordinates and the precise notch orientation angle, the rotating platform is controlled to rotate to achieve orientation, and the XY motion platform is controlled to translate to compensate for eccentricity, thus completing the wafer pre-alignment. This is still achieved through calculation and correction via rotation. However, during the wafer adsorption process, existing wafers have different shapes and thicknesses, which increases the risk of deformation during the correction process. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a pre-aligner based on Bernoulli adsorption wafer method, which solves the problem of automatic operation for wafer notch angle error correction.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a pre-aligner based on Bernoulli adsorption wafer method, comprising a frame body, a worktable surface at the upper end of the frame body, a correction mechanism, a size adjustment movement mechanism, and a lifting movement mechanism fixedly mounted on the worktable surface, the worktable surface having slots for the correction mechanism, the size adjustment movement mechanism, and the lifting movement mechanism to move, the correction mechanism, the size adjustment movement mechanism, and the lifting movement mechanism all being mounted on the lower end face of the worktable surface via fixed seats; the correction mechanism and the lifting movement mechanism cooperate to perform wafer transfer operations; The correction mechanism includes a Bernoulli adsorption module, a first servo motor, and a first coupling assembly. One end of the first coupling assembly is connected to the first servo motor, and the other end is connected to the Bernoulli adsorption module through a first connecting seat. The size adjustment motion mechanism includes a pre-alignment scanning module, a second servo motor, and a second coupling assembly. One end of the second coupling assembly is connected to the second servo motor, and the other end is connected to the pre-alignment scanning module through a second connecting seat. The pre-alignment scanning module is driven by the second servo motor and the second coupling assembly to perform reciprocating linear motion and perform positioning scanning action on the wafer above the Bernoulli adsorption module. The lifting mechanism includes a support module and a lifting module for lifting the wafer. The support module includes several support columns, a support frame, and a connecting block. The lifting module includes a third servo motor, a third connecting seat, a cam drive module, and a lifting slide rail. The cam drive module and the lifting slide rail are respectively located on the side wall of the third connecting seat. The cam drive module includes a main cam mounted on the third connecting seat and a driven wheel mounted on the lower end of the connecting block. The main cam is fixed to the front end of the main shaft of the third servo motor by a key. Several support columns are located around the Bernoulli adsorption module. When not lifting, the upper end of the support column is lower than the horizontal plane of the high point of the Bernoulli adsorption module. After lifting, the upper end of the support column is higher than the horizontal plane of the high point of the Bernoulli adsorption module.

[0007] Furthermore, the first connecting seat, the second connecting seat, and the third connecting seat are all equipped with limit switches for limiting the travel.

[0008] Furthermore, the support column and support frame are provided with airflow channels, which, together with the suction head provided at the upper end of the support column, perform auxiliary adsorption action on the wafer.

[0009] Furthermore, both the first coupling assembly and the second coupling assembly include a coupling body and a lead screw.

[0010] As can be seen from the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages: The programmable logic module controls the servo motor lead screw to drive the linkage mechanism to move left and right and forward and backward, as well as control the Z-axis to move up and down, to perform functions such as identification, correction and positioning of wafer products, and can also achieve the function of picking up and placing wafers by hand and transferring them.

[0011] Reduce adsorption during wafer transportation to prevent wafer deformation. Attached Figure Description

[0012] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a side view of the present invention; Figure 3This is a three-dimensional structural diagram of the correction mechanism of the present invention; Figure 4 This is a three-dimensional structural diagram of the other side of the correction mechanism of the present invention; Figure 5 This is a schematic diagram of the bottom structure of the correction mechanism of the present invention; Figure 6 This is a three-dimensional structural diagram of the adjustment size motion mechanism of the present invention; Figure 7 This is a schematic diagram of the bottom structure of the size adjustment mechanism of the present invention; Figure 8 This is a three-dimensional structural diagram of the lifting mechanism of the present invention; Figure 9 This is a partial structural diagram of the bottom of the lifting mechanism of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Example

[0014] refer to Figure 1 and Figure 2 A pre-aligner based on Bernoulli adsorption wafer method includes a frame body 1, a worktable 2 at the upper end of the frame body 1, a correction mechanism 3, a size adjustment movement mechanism 4 and a lifting movement mechanism 5 fixedly installed on the worktable 2, and slots for the correction mechanism 3, the size adjustment movement mechanism 4 and the lifting movement mechanism 5 to move on the worktable 2. The correction mechanism 3, the size adjustment movement mechanism 4 and the lifting movement mechanism 5 are all installed on the lower end face of the worktable 2 through a fixing seat 27. The correction mechanism 3 and the lifting mechanism 5 work together to perform the wafer transfer operation; refer to Figure 3 , Figure 4 and Figure 5 The correction mechanism 3 includes a Bernoulli adsorption module 6, a first servo motor 7 and a first coupling assembly 8. One end of the first coupling assembly 8 is connected to the first servo motor 7, and the other end is connected to the Bernoulli adsorption module 6 through a first connecting seat 9. refer to Figure 6 and Figure 7The size adjustment motion mechanism 4 includes a pre-alignment scanning module 10, a second servo motor 11, and a second coupling assembly 12. One end of the second coupling assembly 12 is connected to the second servo motor 11, and the other end is connected to the pre-alignment scanning module 10 through a second connecting seat 13. The pre-alignment scanning module 10 is driven by the second servo motor 11 and the second coupling assembly 12 to perform reciprocating linear motion and perform positioning scanning action on the wafer above the Bernoulli adsorption module 6. refer to Figure 8 and Figure 9 The lifting mechanism 5 includes a support module and a lifting module for lifting the wafer. The support module includes several support columns 14, a support frame 15, and a connecting block 16. The lifting module includes a third servo motor 17, a third connecting seat 18, a cam transmission module 20, and a lifting slide rail 19. The cam transmission module 20 and the lifting slide rail 19 are respectively located on adjacent side walls of the third connecting seat 18. The support columns 14 and the support frame 15 are provided with airflow channels 23, which cooperate with the suction head 24 at the upper end of the support column to perform auxiliary suction action on the wafer. The cam transmission module includes a main cam 25 installed on the third connecting seat and a driven wheel 26 installed at the lower end of the connecting block. The main cam 25 is fixed to the front end of the main shaft of the third servo motor 17 by a key. Several support columns 14 are located around the Bernoulli adsorption module 6; when not being lifted, the upper end of the support column 14 is lower than the horizontal plane of the high point of the Bernoulli adsorption module 6; after being lifted, the upper end of the support column 14 is higher than the horizontal plane of the high point of the Bernoulli adsorption module 6.

[0015] The first connecting seat 9, the second connecting seat 13, and the third connecting seat 18 are all equipped with limit switches 22 for limiting the travel.

[0016] Both the first coupling assembly 8 and the second coupling assembly 12 include a coupling body and a lead screw.

[0017] refer to Figures 1-9 During operation, the second servo motor 11 drives the second coupling assembly 12 to make the pre-alignment scanning module 10 perform a linear motion, moving above the Bernoulli adsorption module 6 to perform a positioning and scanning action on the wafer. At this time, the Bernoulli adsorption module 6 performs negative pressure adsorption, which can be compatible with 6-inch / 8-inch / 12-inch wafers and wafers of various thicknesses and shapes. The wafer can be rotated by the rotation action of the Bernoulli adsorption module 6, scanning out wafer notch identification and center positioning. After obtaining the data, it performs a reverse linear motion to return to the original position. After the correction mechanism 3 obtains data from the pre-aligned scanning module 10, it waits for the background data verification and center positioning. At this time, the lifting motion mechanism 5 performs a lifting action. The main cam 25 drives the driven wheel 26 to rise, thereby driving the entire support module to rise. The lifting slide rail 19 plays an auxiliary lifting role and achieves the effect of vertical lifting. The suction head on the support column 14 performs wafer adsorption to realize the transfer action. After receiving the notch position and center position from the backend data analysis, the correction mechanism 3 drives the Bernoulli adsorption module 6 to move, so that the center of the adsorption point overlaps with the center of the wafer. At this time, the center of the Bernoulli adsorption module 6 is exactly below the center of the wafer. The lifting mechanism 5 descends, so that the wafer falls onto the Bernoulli adsorption module 6 and is adsorbed by negative pressure. The rotation makes the notch position rotate to the preset position, thus completing the wafer notch finding and wafer center positioning actions. Then, the robot arm clamps the wafer to the next process.

[0018] Among them, the first connecting seat 9, the second connecting seat 13 and the third connecting seat 18 can be equipped with guide posts or guide rails to assist in the smoothness of movement.

[0019] Finally, the Bernoulli adsorption module 6 is an existing product with negative pressure adsorption capability, which can be applied to wafers of different shapes, thicknesses and sizes; it has internal rotation capability, which is effective in assisting pre-alignment.

Claims

1. A pre-aligner based on Bernoulli adsorption wafer method, comprising a frame body (1), wherein a worktable (2) is provided at the upper end of the frame body (1), characterized in that: The workbench (2) is fixedly equipped with a correction mechanism (3), a size adjustment mechanism (4) and a lifting mechanism (5). The correction mechanism (3) and the lifting mechanism (5) work together to perform wafer transfer operations. The correction mechanism (3) includes a Bernoulli adsorption module (6), a first servo motor (7) and a first coupling assembly (8). One end of the first coupling assembly (8) is connected to the first servo motor (7), and the other end is connected to the Bernoulli adsorption module (6) through a first connecting seat (9). The size adjustment motion mechanism (4) includes a pre-alignment scanning module (10), a second servo motor (11), and a second coupling assembly (12). One end of the second coupling assembly (12) is connected to the second servo motor (11), and the other end is connected to the pre-alignment scanning module (10) through a second connecting seat (13). The pre-alignment scanning module (10) is driven by the second servo motor (11) and the second coupling assembly (12) to perform reciprocating linear motion and to perform positioning scanning action on the wafer above the Bernoulli adsorption module (6). The lifting mechanism (5) includes a support module and a lifting module for lifting the wafer. The support module includes several support columns (14), a support frame (15), and a connecting block (16). The lifting module includes a third servo motor (17), a third connecting seat (18), a cam transmission module (20), and a lifting slide rail (19). The cam transmission module (20) and the lifting slide rail (19) are respectively located on the side walls adjacent to the third connecting seat (18).

2. The pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: The worktable (2) is provided with slots for the adjustment mechanism (3), the size adjustment mechanism (4) and the lifting mechanism (5) to move.

3. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: The correction mechanism (3), the size adjustment mechanism (4), and the lifting mechanism (5) are all installed on the lower end face of the worktable (2) via a fixed seat (27).

4. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: The first connector (9), the second connector (13) and the third connector (18) are all provided with limit switches (22) for limiting the travel.

5. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: The support column (14) and support frame (15) are provided with airflow channels (23), which, together with the suction head (24) provided at the upper end of the support column, perform auxiliary adsorption action on the wafer.

6. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: The cam drive module includes a main cam (25) mounted on the third connecting seat and a driven wheel (26) mounted on the lower end of the connecting block. The main cam (25) is fixed to the front end of the main shaft of the third servo motor (17) by a key.

7. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: Several of the support columns (14) are located around the Bernoulli adsorption module (6); when not lifted, the upper end of the support column (14) is lower than the horizontal plane at the top of the Bernoulli adsorption module (6); after lifting, the upper end of the support column (14) is higher than the horizontal plane at the top of the Bernoulli adsorption module (6).

8. A pre-aligner based on Bernoulli adsorption wafer method according to claim 1, characterized in that: Both the first coupling assembly (8) and the second coupling assembly (12) include a coupling body and a lead screw.

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