Processor for processing electronic components and tray for loading electronic components

Abstract

The invention relates to a processor for processing electronic components. According to the present invention, the present invention comprises: a first processing unit that manipulates a first loader that holds an electronic component in a bonding manner; a second processing unit that manipulates a second loader that holds the electronic component so as to be seated in the loading tank; and the moving manipulator is used for moving the electronic components on the first loader to the second loader. According to the invention, the setting cost required for testing the whole system of the electronic component can be saved.

Description

Technical Field

[0001] This invention relates to a processor for processing electronic components. Background Technology

[0002] Electronic components undergo various processes during production.

[0003] The various processing methods include testing or classification.

[0004] A processor is a device that provides the processing support required by electronic components.

[0005] For example, a processor used for testing electronic components supports the electrical connection between the electronic component to be tested and the testing machine. The processor supporting the test may also need to be additionally equipped depending on the type of test.

[0006] For example, a processor for classifying electronic components supports the following process: reconfiguring the electronic components to be classified according to classification criteria.

[0007] Generally, electronic components required to be processed are supplied to the processor in a tray-like state.

[0008] After the processor removes the electronic components loaded on the tray from the tray, it performs the necessary processing and then reloads the processed electronic components back onto the tray.

[0009] Trays are loaders that can hold electronic components, and there are many types of them.

[0010] The tray can be like Figure 1 The ring mounting base 10 is shown.

[0011] The ring loading seat 10 includes a support ring 11 and an adhesive membrane 12.

[0012] The support ring 10 is roughly circular in shape and has a notch N1 for identifying the direction.

[0013] The adhesive film 12 is fixed to the support ring 10, supporting the mounted electronic components. The electronic components are adhered to the adhesive film 12. The electronic components adhered to the adhesive film 12 can maintain their position by adhesive bonding.

[0014] Figure 2 The image shows, for example, the state in which several electronic components ED are bonded to the adhesive film 12.

[0015] The adhesive film 12 is damaged when the electronic component ED is peeled off. Therefore, it can only be used once and needs to be replaced continuously.

[0016] The pallet can be a JEDEC pallet designed and manufactured according to the standard specifications set by JEDEC.

[0017] The present invention is particularly related to the ring loading seat 10.

[0018] The ring mount 10 is mainly used to move electronic components (EDs) in a die stack state for production in the case of production of die stacks or high bandwidth memory (HBM).

[0019] In order to perform the work after the bare film, the bare film needs to be tested.

[0020] Electronic components (EDs) in their die state or die stack state can be tested by electrically connecting contact pads to a test instrument.

[0021] The more advanced the microfabrication process, the smaller the spacing between the contact pads on the die. This poses a challenge in developing a processor that supports automated testing of electronic components (EDs) in either die-state or die-stack state.

[0022] Omitting testing of electronic components (EDs) in their bare die state or bare die stack state leads to a decrease in the yield and reliability of the final product. To address this, the applicant previously disclosed Korean Patent Publication No. 10-2021-0088373 (hereinafter referred to as "Prior Art").

[0023] The processors involved in the prior art align the positions of the electronic components (EDs) through a reconfiguration process before connecting them to the test machine.

[0024] Existing technology uses a camera to scan the electronic components (EDs) on the test stage (which is referred to as a "chuck" in the prior art) to determine the position of the electronic components (EDs) and then performs a reconfiguration process to adjust them to the correct position.

[0025] Based on existing technology, the positional error range of electronic components (EDs) can be reduced, allowing for precise arrangement of EDs on the test bench. This enables automated testing of EDs in either bare die or stacked die state.

[0026] According to existing technology, when moving electronic components ED into or out of the processor, a ring-mounted carrier 10 for moving electronic components ED is used.

[0027] Electronic components (EDs) are supplied to the processor in a state of being loaded into a ring loader and are removed from the processor in a state of being loaded into a ring loader.

[0028] The electronic component ED is in a state of being adhered to the ring mounting base 10. Therefore, in order to conduct testing, the electronic component ED needs to be peeled off from the ring mounting base 10. When recycling, the electronic component ED needs to be adhered to the ring mounting base 10.

[0029] However, electronic components (EDs) require various tests and processing steps, each necessitating the use of different processing equipment. This leads to excessive waste of disposable adhesive film 12 and damage to the electronic components (EDs) during repeated bonding and separation processes.

[0030] [Existing Technical Documents] [Patent Documents] (Patent Document 0001) Korean Patent Publication No. 10-2021-0088373 Summary of the Invention

[0031] Technical issues There is a need for a technique to handle electronic components while minimizing the use of ring mounts.

[0032] Technical solution A first aspect of the present invention provides a processor for processing electronic components, comprising: a first processing unit for manipulating a first loader capable of loading electronic components; a second processing unit for manipulating a second loader capable of loading electronic components and having a structure different from that of the first loader; a stacking unit disposed in front of the first processing unit and the second processing unit for supplying or retrieving the first loader to the first processing unit and for supplying or retrieving the second loader to the second processing unit; and a moving robot for moving electronic components on the first loader to the second loader; wherein the first loader manipulated by the first processing unit has a structure in which the loaded electronic components are held in place by an adhesive manner, and the second loader manipulated by the second processing unit has a structure in which the loaded electronic components are placed in a loading slot and held in position.

[0033] The mobile robotic arm is capable of moving electronic components from the second loader to the first loader.

[0034] The first processing unit has a separator that separates the electronic components from the first loader when the mobile robot moves the electronic components loaded on the first loader to the second loader.

[0035] The first processing unit has an adhesive that is used to adhere the electronic components loaded on the second loader to the first loader when the mobile robot moves the electronic components loaded on the second loader to the first loader.

[0036] The loading capacity of the first loader is N times the loading capacity of the second loader (N is a natural number greater than 2).

[0037] The second processing unit includes: at least one support for supporting the second loader; and a base plate on which the support is mounted.

[0038] The base plate is installed in a movable manner.

[0039] The support is installed in multiple units.

[0040] The support includes: a support plate for supporting the second loader; a buffer plate for supporting the second loader and disposed below the support plate; and a lift for driving the support plate and the buffer plate to move up and down.

[0041] The second processing unit further includes a transferor that moves the second loader on the stacker unit to the support, or moves the second loader on the support to the stacker unit.

[0042] The transferor includes: a first gripper capable of gripping or releasing the second loader; a first forward / reverse mechanism driving the first gripper forward and backward; a second gripper capable of gripping or releasing the second loader, disposed below the first gripper; a second forward / reverse mechanism driving the second gripper forward and backward; and a lift mechanism driving the first gripper and the second gripper to move up and down.

[0043] Includes an opener for opening the second loader.

[0044] The stacker unit has multiple loading spaces capable of loading cartridges, the cartridges being able to carry the first loader or the second loader, and also includes a cartridge transferor capable of moving the cartridges between the multiple loading spaces.

[0045] A second aspect of the present invention provides a processor for processing electronic components, comprising: a processing unit for manipulating a loader capable of loading electronic components; a stacking unit disposed in front of the processing unit for supplying the loader to the processing unit or retrieving the loader from the processing unit; and a moving robot for moving electronic components between the loaders on the processing unit; the processing unit includes: a support for supporting the loader; and a base plate on which the support is mounted, the base plate being mounted in a movable manner.

[0046] The support includes: a support plate for supporting the loader; a buffer plate for supporting the loader and disposed below the support plate; and a lift for driving the support plate and the buffer plate to move up and down.

[0047] The processing unit further includes a transferor that moves the loader on the stacker unit to the support or the loader on the support unit to the stacker unit.

[0048] The transferor includes: a first gripper capable of gripping or releasing the loader; a first forward / reverse mechanism driving the first gripper forward and backward; a second gripper capable of gripping or releasing the loader, disposed below the first gripper; a second forward / reverse mechanism driving the second gripper forward and backward; and a lift mechanism driving the first gripper and the second gripper to move up and down.

[0049] The processing unit also includes an opener for opening the loader.

[0050] The stacker unit has multiple loading spaces capable of loading cartridges that can carry the loader, and also includes a cartridge transferor capable of moving the cartridges between the multiple loading spaces.

[0051] A third aspect of the present invention provides a processor for processing electronic components, comprising: a processing unit for manipulating a loader capable of loading electronic components; a stacking unit disposed in front of the processing unit for supplying the loader to the processing unit or retrieving the loader from the processing unit; a moving robot for moving electronic components between the loaders on the processing unit; and a transferor for transferring the loaders on the stacking unit to the processing unit, or transferring the loaders on the processing unit to the stacking unit; the transferor comprising: a first gripper capable of gripping or releasing the loader; a first forward / backward mechanism for driving the first gripper forward and backward; a second gripper capable of gripping or releasing the loader, disposed below the first gripper; a second forward / backward mechanism for driving the second gripper forward and backward; and a lifting mechanism for driving the first gripper and the second gripper to move up and down.

[0052] The processing unit also includes an opener for opening the loader.

[0053] The stacker unit has multiple loading spaces capable of loading cartridges that can carry the loader, and also includes a cartridge transferor capable of moving the cartridges between the multiple loading spaces.

[0054] A fourth aspect of the present invention provides a processor for processing electronic components, comprising: a processing unit that operates a loader capable of loading electronic components; a stacking unit disposed in front of the processing unit and having a plurality of loading spaces capable of loading cartridges, the cartridges being capable of carrying the loader, the stacking unit supplying the loader to the processing unit or retrieving the loader from the processing unit; a transferor that transfers the loader from the stacking unit to the processing unit, or transfers the loader from the processing unit to the stacking unit; and a cartridge transferor capable of moving the cartridges between the plurality of loading spaces.

[0055] A fifth aspect of the present invention provides a processor for processing electronic components, comprising: a processing unit for operating a loader capable of loading electronic components; a stacking unit disposed in front of the processing unit for supplying the loader to the processing unit or retrieving the loader from the processing unit; and a transferor for transferring the loader from the stacking unit to the processing unit, or transferring the loader from the processing unit to the stacking unit; the processing unit includes an opener for opening the loader.

[0056] The tray for loading electronic components of the present invention includes: a loading plate, wherein loading slots for loading electronic components are recessed to a predetermined depth; and a support frame for supporting the loading plate and wherein the loading plate is fixedly mounted; the outer contour of the support frame protrudes further outward than the outer contour of the loading plate.

[0057] The support frame has notches for identifying direction.

[0058] The loading plate is detachably mounted to the support frame.

[0059] The support frame has: an outer edge rib, which is ring-shaped; and a reinforcing rib, which is located inside the outer edge rib, for maintaining rigidity; the loading plate is integrally formed and combined with the reinforcing rib.

[0060] It also includes a cover to prevent electronic components from detaching from the loading slot.

[0061] It also includes a retainer for detachably securing the cover to the loading plate.

[0062] The cover is separated from the electronic components disposed in the loading slot by a predetermined distance.

[0063] The loading slot is formed at a depth lower than the height of the electronic component.

[0064] The loading slot is wider at the top than at the bottom, allowing a predetermined portion of the pickup holding the electronic component to be inserted into the loading slot, wherein the lower end of the pickup is wider than the upper end of the electronic component.

[0065] Beneficial effects According to the present invention, the following effects can be achieved.

[0066] First, it significantly reduces the use of ring-mounted supports, thereby reducing the waste of adhesive film.

[0067] Secondly, it can prevent damage to electronic components during the bonding and separation process.

[0068] Third, it can save the cost of setting up the processing system required in the overall processing technology. Attached Figure Description

[0069] Figure 1 and Figure 2 This is a reference diagram used to illustrate a ring-shaped mounting base that can be used to load electronic components.

[0070] Figures 3 to 8 This is a reference diagram illustrating the ring tray, which is a processor-operable loader for processing electronic components according to the present invention.

[0071] Figures 9 to 28 This is a reference diagram used to illustrate the first type of processor of the present invention.

[0072] Figure 29 and Figure 30 This is a reference diagram used to illustrate the second type of processor of the present invention.

[0073] Figure 31 This is a reference diagram used to illustrate the third type of processor of the present invention.

[0074] Figure 32 This is a reference diagram used to illustrate the fourth type of processor of the present invention.

[0075] Figure 33 This is a reference diagram used to illustrate the fifth type of processor of the present invention.

[0076] Figure 34 and Figure 35 This is a reference diagram used to illustrate the sixth type of processor of the present invention.

[0077] Figures 36 to 40 This is a reference diagram illustrating an example of a combination of various processors according to the present invention. Detailed Implementation

[0078] The preferred embodiments of the present invention will be described below with reference to the drawings. For the sake of convenience, descriptions of well-known or repetitive configurations will be omitted or shortened as much as possible.

[0079] <Instructions for using a ring tray> When electronic components are moved into or out of a processing machine (H, hereinafter referred to as the "processor") for handling electronic components, a ring frame or ring tray may be used.

[0080] Ring pallets are the latest type of loaders designed for handling manufactured electronic components (EDs).

[0081] When the production personnel of electronic components (ED) use ring loaders, they manufacture ring trays, which are then used as loaders in subsequent processing as alternatives to the ring loaders.

[0082] Figure 3 This is a plan view of the ring tray 20 according to an embodiment of the present invention. Figure 4 yes Figure 3 A plan view of the ring tray 20 with the cover removed. Figure 5 It is Figure 3 The ring tray 20 is conceptually simplified and then exaggerated to present a highly conceptual side sectional view.

[0083] The ring pallet 20 includes a loading plate 21, a support frame 22, a cover 23, a fixing device 24, etc.

[0084] The loading plate 21 is fixedly mounted on the support frame 22.

[0085] The loading plate 21 is attached to the support frame 22 by means of a fastening tool F such as screws or bolts.

[0086] The loading plate 21 has a loading slot 21a for loading electronic components ED.

[0087] The loading groove 21a is open to the top and is formed recessed to a predetermined depth.

[0088] Loading plate 21 is formed by cutting loading groove 21a on a metal plate, and it is integrally formed.

[0089] The loading slot 21a is formed in accordance with the specifications of the electronic component ED.

[0090] In the event of a change in the electronic component ED to be processed, the operator removes the loading plate 21 and attaches the new loading plate 21 to the support frame 22. Therefore, the loading plate 21 is detachably mounted to the support frame 22.

[0091] The loading plate 21 has a mounting groove 21b for mounting the retainer 24, and the outer contour area of ​​the mounting groove 21b has an inwardly recessed recess 21c.

[0092] The support frame 22 is positioned below the loading plate 21.

[0093] The support frame 22 supports the loading plate 21.

[0094] The loading plate 21 is fixedly mounted on the support frame 22.

[0095] The outer contour of the support frame 22 protrudes further outward than the outer contour of the loading plate 21.

[0096] The support frame 22 has an outer edge rib 22a and a reinforcing rib 22b.

[0097] The outer edge rib 22a is annular and forms the outline of the support frame 22.

[0098] The outer edge rib 22a has a notch N2 for identifying the direction of the support frame 22. The position of the notch N2 is the same as the position of the notch N1 on the ring mounting seat 10.

[0099] The width and outline of the outer edge rib 22a are the same as the width and outline of the support ring 11 of the ring loading seat 10. Therefore, tools that can manipulate the ring loading seat 10 (such as gripping tools, moving tools, and storage tools) can manipulate the ring tray 20.

[0100] The reinforcing rib 22b is formed on the inner side of the outer edge rib 22a and maintains the rigidity of the inner part of the support frame 22.

[0101] The loading plate 21 is attached to the reinforcing rib 22b by means of the fixing tool F.

[0102] When viewed in a planar view, the outer edge rib 22a is exposed on the outside of the loading plate 21.

[0103] The area other than the outer edge rib 22a and the reinforcing rib 22b is penetrated in the vertical direction.

[0104] Cover 23 prevents electronic component ED from detaching from loading slot 21a.

[0105] The cover 23 has a snap-fit ​​rod 23a.

[0106] Preferably, the cover 23 is spaced apart from the electronic component ED disposed in the loading slot 21a by a predetermined distance. Because they are spaced apart, the cover 23 and the electronic component ED can be prevented from coming into contact with each other due to factors such as slight shaking, thereby preventing damage to the electronic component ED.

[0107] The retainer 24 detachably secures the cover 23 to the loading plate 21.

[0108] The retainer 24 is installed in the mounting slot 21b.

[0109] like Figure 6 As shown in the enlarged view, the retainer 24 includes a retainer 24a and a spring 24b.

[0110] A snap-fit ​​groove JH is formed on the fastener 24a.

[0111] Card connector 23a can be inserted into card connector slot JH.

[0112] With the cover 23 engaged, the snap-fit ​​rod 23a is inserted into the snap-fit ​​slot JH.

[0113] Spring 24b is directed to one side. Figure 6 In the example, the elastic member that applies elastic force to the fixing member 24a is the one on the right side.

[0114] With the locking rod 23a inserted into the locking slot JH, if no external force is applied, the fixing member 24a is kept moving outward by the elastic force of the spring 24b.

[0115] With the fastener 24a moving outward, the locking rod 23a is engaged by the locking part JJ. In this state, the cover 23 remains attached to the loading plate 21.

[0116] If an external force lifts the cover 23 upwards, the locking rod 23a applies an external force to the fixing member 24a in the inward direction, causing the fixing member 24a to retract inwards. This removes the cover 23 from the loading plate 21, opening the ring tray 20.

[0117] The opening of the ring pallet 20 means that the loading slot 21a is open.

[0118] With loading slot 21a open, electronic component ED can enter loading slot 21a or can exit loading slot 21a.

[0119] When attaching the cover 23 to the loading plate 21 or removing the cover 23 from the loading plate 21, it is only necessary to lower or raise the cover 23, thus simplifying the structure of the open dead-loop tray 20.

[0120] Please compare Figure 3 and Figure 4The outer contour of the cover 23 protrudes further outward than the outer contour of the loading plate 21. Therefore, during the opening and closing of the ring tray 20, interference between the gripping tool holding the cover 23 and the loading plate 21 can be prevented when the cover 23 is raised or lowered. Furthermore, the loading plate 21 has a recessed groove 21c, allowing the gripping tool to hold the cover 23 in the area where the recessed groove 21c exists, thereby further preventing interference between the gripping tool and the loading plate 21.

[0121] Although electronic components ED can be loaded very closely together on the ring loading seat 10, the ring tray 20, due to its structure, results in a relatively large spacing between the electronic components ED. Therefore, the loading capacity of the ring loading seat 10 is greater than that of the ring tray 10. Preferably, to accommodate throughput, it is preferable that the loading capacity of the ring loading seat 10 is N times the loading capacity of the ring tray 10 (N is a natural number).

[0122] For example, the ring loading seat 10 can hold 512 electronic components ED, while the ring tray 10 can hold 128 electronic components ED. At least one of the aforementioned loading plate 21, support frame 22, and cover 23 may have an identifier (barcode, identification number, identification symbol, etc.) for identifying the ring tray 20.

[0123] On the other hand, such as Figure 7 As shown, the electronic component ED can be loaded onto the ring mount 20 in a dead bug state with the terminals (contact pads, T) facing upwards. In this case, the lower width w2 of the pickup P can be wider than the upper width w1 of the electronic component ED.

[0124] exist Figure 7 A structure is needed to enable the pickup P to properly hold the electronic components ED loaded on the loading slot 21a.

[0125] For example, such as Figure 8 As shown in (a), a structure can be formed in which the depth d1 of the loading slot 21a is less than the height d2 of the electronic component ED.

[0126] For example, such as Figure 8 As shown in (b), a structure can be adopted in which the upper width w4 of the loading slot 21a is wider than the lower width w3 of the loading slot 21a, so that a predetermined portion of the pickup P can be inserted into the loading slot 21a.

[0127] Various processors H can be implemented using the aforementioned ring tray 20. The following describes representative types of processors.

[0128] <Explanation of the first type of processor> Figure 9 This is a conceptual plan view of the first processor, H1.

[0129] The first type of processor H1 can be divided into a moving part MP, a loading and unloading part LU, an arranging part AP, and a connecting part CP, including a transport shuttle 100, a first moving robot 210, a second moving robot 220, a test table 300, a vacuum device 400, a reconfiguration mechanism 500, a moving mechanism 600, a connector 700, and a controller 800.

[0130] In the moving section MF, the electronic components ED can be moved between the loading / unloading section LU and the arranging section AP for exchanging electronic components ED. For this purpose, a transport shuttle 100 for carrying the electronic components ED is installed on the moving section MP.

[0131] The transport shuttle 100 is equipped for transporting electronic components ED between the loading / unloading section LU and the arranging section AP.

[0132] The transport shuttle 100 has a movable transport platform 110.

[0133] The transport shuttle 100 has one or more transport tables 110.

[0134] The transport table 110 can reciprocate along one axial direction ss. Figure 9 In the example, the transport table 110 reciprocates in the X-axis direction.

[0135] When there are multiple transport tables 110, the multiple transport tables 110 can be arranged side by side in the Y-axis direction and can move back and forth independently in the X-axis direction.

[0136] The transfer table 110 can move between the first area A1 on the loading / unloading section LU side and the second area A2 on the arranging section AP side. The first area A1 and the second area A2 are separated from each other.

[0137] Electronic components ED can be mounted on the transfer table 110.

[0138] The transfer table 110 is not a pocket-shaped structure with a mounting slot for electronic components ED, but a vacuum structure that uses vacuum pressure to fix the electronic components ED placed on a flat surface.

[0139] as Figure 10 The schematic plan view shows that the transfer stage 110 has a vacuum hole VH for using a vacuum adsorption electronic component ED and a vacuum groove VG connected to the vacuum hole VH.

[0140] A vacuum vent VH is paired with a vacuum tank VG.

[0141] On a plane, the vacuum groove VG surrounds the vacuum hole VH.

[0142] The vacuum pressure entering through the vacuum port VH is evenly distributed in all directions through the vacuum tank VG and applied to the electronic component ED. For example, the vacuum port VH applies vacuum pressure near the center of the electronic component ED, while the vacuum tank VG applies vacuum pressure near the edge of the electronic component ED.

[0143] The electronic component ED can be fixed to the transport stage 110 by vacuum pressure, so the electronic component ED does not move during the process of being loaded on the transport stage 110 and moving along the X-axis. Therefore, when the electronic component ED is precisely placed on the transport stage 110, the operation error caused by the positional deviation of the electronic component ED can be minimized during the movement of the transport stage 110.

[0144] According to one embodiment, the vacuum hole VH and vacuum tank VG can be arranged in a 2x8 row and column configuration, but the loading capacity of the transfer table 110 can be increased or decreased without restriction.

[0145] The electronic component ED to be tested is moved into the first type of processor H1 through the loading and unloading section LU, and the electronic component ED after testing is moved out of the first type of processor H1 through the loading and unloading section LU.

[0146] The electronic component ED is supplied to the first processor H1 in a state of being loaded in the ring loading seat 10, and can be recovered from the first processor H1 in a state of being loaded in the ring tray 20.

[0147] The ring loading seat 10 or ring pallet 20 can be moved into or out of the loading / unloading section LU by automated logistics devices (overhead hoist transport or automated guided vehicle).

[0148] The loading and unloading unit LU includes a first processing unit 910 that operates a ring loading seat 10 as a first loader and a second processing unit 20 that operates a ring tray 920 as a second loader.

[0149] The loading and unloading section LU is equipped with a first moving robot arm 210.

[0150] The electronic component ED to be tested, loaded on the ring loading seat 10, is moved by the first mobile robot arm 210 to the transfer table 110 on the first area A1.

[0151] The tested electronic components ED, which are carried on the transfer table 110 in the first area A1, are moved to the ring tray 20 by the first mobile robot arm 210.

[0152] In order to use the first mobile robot 210 for loading and unloading operations, the transfer table 110 needs to be moved to the loading and unloading section LU and located in the first area A1.

[0153] The first mobile robotic arm 210 has one or more pickups P that can grasp or release electronic components ED.

[0154] The pickup P can hold the electronic component ED by vacuum pressure.

[0155] The first mobile robotic arm 210 may be equipped with multiple pickups P to increase the workload in a single operation.

[0156] For example, such as Figure 11 As shown in the schematic diagram, the first mobile robot 210 may have four pickers P arranged in a 2x2 row and column configuration. The number of pickers P in the first mobile robot 210 may be increased or decreased.

[0157] The first mobile robotic arm 210 may have a lift E that can drive each pickup P to rise and fall independently. The lift E can be used to position the pickup P at a height where it can selectively hold or release the electronic component ED.

[0158] The position of the electronic components ED, which are moved by the first moving robot 210 to the transport table 110, can be individually and precisely adjusted and can be individually placed on the transport table 110.

[0159] Electronic components ED, which are unloaded from the transport table 110 by the first mobile robot 210, can be classified according to their test level and loaded onto the ring tray 20.

[0160] The first mobile robotic arm 210 may also include a camera C.

[0161] The first moving robotic arm 210 can be controlled to accurately calculate the position of the electronic component ED after analyzing the image captured by the camera C, and then grasp the electronic component ED using the pickup P. The pickup P can grasp the electronic component ED more precisely, and can accordingly place the electronic component ED in the correct position on the transport table 110.

[0162] The pickup P can be controlled by holding electronic components ED at various heights.

[0163] For example, the lifting height of the pickup P can be determined based on the height of the electronic component ED, which is preset by the administrator.

[0164] For example, the height of the electronic component ED can be calculated from the image captured by the camera C to determine the lifting height of the pickup P used to hold or release the electronic component ED.

[0165] The first mobile robotic arm 210 may also include a rotary machine R.

[0166] Rotary machine R such Figure 12 As shown, the electronic component ED is rotated in the θ-axis direction using the vertical line in the Z-axis direction as the rotation axis.

[0167] The rotating machine R can rotate each pickup P individually.

[0168] The first mobile robot 210 can not only move the electronic components ED in the X, Y, and Z axis directions, but also rotate the electronic components ED individually along the θ axis.

[0169] A rotating mechanism R is provided so that the first moving robot arm 210 corrects the deflection of the electronic component ED that is deviating from the gripping position as captured by the camera C, and then places it on the transport table 110.

[0170] The electronic components ED, which are placed in precise positions on the transport table 110 by the first mobile robot 210, are fixed in position by vacuum pressure.

[0171] During the process of the first mobile robot 210 driving the electronic component ED to move, the position of the electronic component ED in the X, Y, Z, and θ axis directions can be precisely adjusted and maintained.

[0172] The rotating tool for rotating electronic components ED can also be equipped separately without using the first moving manipulator 210.

[0173] For example, when the first mobile robot 210 holds the electronic component ED from the ring loading seat 10 and supplies it to the rotary tool, the rotary tool can use vacuum pressure to fix the electronic component ED and then rotate it to correct its deflection. The electronic component ED, whose deflection has been corrected by the rotary tool, can be re-held by the first mobile robot 210 and moved to the transport table 110.

[0174] Figure 11 In the example shown, the first mobile robotic arm 210 is provided with four pickers P. In the case where multiple pickers P are provided as described above, the objects held by each picker P can be different.

[0175] Some pickups P can hold electronic components ED in a live state (terminals facing down), while the remaining pickups P can hold electronic components ED in a dead state (terminals facing up). In this case, all electronic components ED can be processed regardless of their loading state when loaded onto the ring loading seat 10 and supplied to the first processor H1, thus improving the usability of the first processor H1.

[0176] For reference, if the electronic component ED is supplied to the first processor H1 in a live insect state, it is also necessary to further equip it with an additional flipping tool for converting the live insect state electronic component ED into a dead insect state.

[0177] The loading and unloading LU will be explained in more detail later.

[0178] In the arrangement section AP, the electronic components ED to be tested are unloaded from the transport table 110 and arranged.

[0179] According to this embodiment, two APs are symmetrically arranged on both sides, separated by a connecting portion CP. As mentioned above, having two APs increases the processing capacity of the first processor H1 and the test machine.

[0180] The AP section is equipped with a second moving robot arm 220.

[0181] The second mobile robot 220 unloads the electronic component ED to be tested from the transport table 110 or loads the tested electronic component ED onto the transport table 110.

[0182] In order to use the second mobile robot 220 for loading and unloading operations, the transfer table 110 needs to move to the arrangement section AP and then to the second area A2.

[0183] The second mobile robot 220 unloads the electronic component ED to be tested from the transfer table 110 on the second area A2 or loads the tested electronic component ED from the transfer table 110 on the second area A2.

[0184] Similarly, the second mobile robot 220 has one or more pickers P that can grip or release the electronic component ED. Preferably, the second mobile robot 220 may have multiple pickers P to increase the work capacity in a single operation.

[0185] For example, the second mobile robot 220 may have four pickers P arranged in a 2x2 row and column configuration. The number of pickers P in the second mobile robot 220 may be increased or decreased.

[0186] The second mobile robotic arm 220 can also be equipped with its pick-up device P, which can be raised and lowered independently to selectively grasp or release the electronic component ED.

[0187] The second mobile robot 220 can be equipped with the same operating structure as the first mobile robot 210.

[0188] The number of pickers P provided on the first mobile robot 210 and the number of pickers P provided on the second mobile robot 220 can be different. However, in order to reduce the production cost of the second mobile robot 220, the second mobile robot 220 may not employ individual lifting or rotating tools for the pickers P.

[0189] The second mobile robotic arm 220's pickup P is equipped entirely with electronic components capable of holding dead insects.

[0190] Test table 300 is equipped for loading electronic components ED that are unloaded from transport table 110 by second mobile robot 220. The electronic components ED to be tested are arranged onto test table 300 by second mobile robot 220.

[0191] The second mobile robot 220 unloads the electronic components ED to be tested from the transport table 110 on the second area A2 and arranges them on the test table 300 that moves to the arrangement section AP.

[0192] The second mobile robot 220 loads the tested electronic components ED, which are mounted on the test bench 300, onto the transfer table 110 on the second area A2.

[0193] like Figure 13 As shown in the schematic enlarged view, the upper surface of the test stage 300 is formed flat. Therefore, the electronic component ED is mounted on the test stage 300 in a manner that places it on the flat upper surface of the test stage 300.

[0194] When viewed on a flat surface, such as Figure 13 As shown in (a), the test stand 300 can be in the form of a disk, such as... Figure 13 As shown in (b), it can also be in the form of a four-corner plate.

[0195] The planar shape of the test platform 300 belongs to the planar shape of the test board TB, which will be described later.

[0196] The test platform 300 can move along the X-axis and Y-axis.

[0197] The test bench 300 can rotate and move along the θ-axis with the vertical line V passing through the center of the test bench 300 in the Z-axis direction as the axis of rotation.

[0198] The test stage 300 can be raised and lowered by the connector 700 described later.

[0199] Generally, during the movement of the electronic component ED towards the test bench 300, there will be impacts or inertia that follow the movement.

[0200] Impacts or inertia can disrupt the position of the electronic components ED mounted on the test bench 300. To prevent this problem, a vacuum hole h is formed in the area of ​​the test bench 300 where the electronic components ED are mounted.

[0201] When vacuum pressure is applied to the vacuum hole h, the electronic component ED can be fixed to the test stage 300.

[0202] When the electronic component ED is placed on the test stage 300 by the second moving robot 220, the electronic component ED can be directly placed in the designated position due to the vacuum pressure.

[0203] The vacuum structure of the test stage 300 can be the same as that of the transfer stage 110.

[0204] Vacuum device 400 provides vacuum pressure to vacuum port h located on test stage 300 through vacuum circuit (not shown).

[0205] The vacuum pressure provided by vacuum unit 400 is transmitted to electronic component ED through vacuum port h.

[0206] The position of the electronic component ED mounted on the test bench 300 is fixed by vacuum pressure.

[0207] The vacuum port h can be selectively opened or closed according to the control status of the vacuum circuit.

[0208] Electronic components ED can be selectively mounted onto or detached from test bench 300 in a fixed manner.

[0209] The electronic components (EDs) to be tested, mounted on the test bench 300, are precisely reconfigured in the arrangement section (AP).

[0210] An electrical connection is established between the electronic component ED mounted on the test bench 300, which is moved to the connection part CP, and the test machine.

[0211] To enable electrical connection between the electronic component (ED) and the testing machine, the testing machine is equipped with a test board (TB).

[0212] The test board TB is integrated with the first processor TH1. More specifically, the test board TB is integrated with the connection section CP.

[0213] The electronic component ED mounted on the test bench 300 is electrically connected to the test board TB. The electronic component ED can ultimately be electrically connected to the test machine via the test board TB.

[0214] The following is a brief description of the test board TB.

[0215] as Figure 14 The bottom view shows that the test board TB has test areas TZ, each corresponding to one electronic component ED. The test areas TZ correspond one-to-one with the electronic components ED mounted on the test bench 300.

[0216] In one test area TZ, there is a test pin t that is electrically connected to one electronic component ED.

[0217] The test pins on a test zone TZ are arranged in a cluster to form the test zone TZ, and are electrically connected to the electronic components ED.

[0218] The test area TZ and the electronic component ED should be aligned with each other.

[0219] If the coordinates of the electronic component ED on the test stage 300 in the XY plane are inconsistent with the coordinates of the test area TZ, then the electrical connection between the electronic component ED and the test machine is faulty.

[0220] as Figure 15 As a conceptual example, when the electronic component ED on the test bench 300 is in an angular position with a torsional rotation angle θ1 relative to the test area TZ along the θ axis, the electrical connection between the electronic component ED and the test machine is faulty.

[0221] All test areas TZ on the test board TB and all electronic components ED on the test bench 300 should be in completely consistent positions.

[0222] The reconfiguration mechanism 500 is provided to achieve precise alignment between the test area TZ and the electronic components ED. If the second moving robot 220 can precisely align the electronic components ED during the arrangement of the electronic components ED on the test table 300, the additional reconfiguration mechanism 500 may not be necessary.

[0223] Electronic component ED is moved from transport table 110 to test table 300 by second mobile robot 220. During this process, the position of electronic component ED may be incorrect due to factors such as the operation error or impact of the second mobile robot 220. Therefore, the position or angular position of electronic component ED loaded onto test table 300 by the second mobile robot 220 may be different, that is, the electronic component ED loaded on test table 300 and the test area TZ of test board TB may not be consistent.

[0224] Of course, if the tolerance range between the electronic component ED and the test area TZ is wide, the reconfiguration mechanism 500 can be omitted. However, in practice, the packaged electronic component ED is required to have a tolerance of 30. Precision within 5, while bare die or high-bandwidth memory is required. To address this issue, the present invention arranges the electronic components ED in a temporary area when the second moving robot 220 moves the electronic components ED from the transport table 110 to the test table 300. Then, the reconfiguration mechanism 500 subsequently reconfigures the electronic components ED from the temporary area to the correct position area, thereby enabling the electronic components ED to be precisely arranged on the test table 300.

[0225] The temporary area is not the default location; it can be any location on the test table 300 where the electronic component ED is placed by the second mobile robot arm 220.

[0226] The temporary area is not set or fixed by the controller 900, but can be any location determined arbitrarily by the electronic component ED being loaded onto the test table 300 by the second mobile robot 220. For example, when the second mobile robot 220 places the electronic component ED onto the test table 300, the area where the electronic component ED is placed becomes the temporary area BZ.

[0227] Exaggerated presentation Figure 16 An example of a temporary region BZ on test bench 300 is shown.

[0228] The correct location area refers to the position where the electronic component (ED) and the test area (TZ) are aligned. (This is an exaggeration.) Figure 17 The relationship between the temporary region BZ and the correct position region RZ on the test bench 300 is shown.

[0229] Although the correct position area RZ can be preset, it can also be set in a way that makes the position and configuration of the test area TZ on the test board TB consistent with the position of the electronic component ED to be tested after it is loaded onto the test stage 300.

[0230] The reconfiguration mechanism 500 is equipped to reconfigure the position of the electronic component ED, which will be loaded onto the test stand 300 by the second mobile robot 220, from the temporary area BZ to the correct position area RZ.

[0231] According to this embodiment, the second mobile robot 220 loads the electronic component ED to be tested, which is unloaded from the transport table 110, into a temporary area BZ. Then, the reconfiguration mechanism 500 operates to move the electronic component ED from the temporary area BZ to the correct position area RZ.

[0232] The temporary region BZ includes not only the position in the X and Y axis directions, but also the angular position in the θ axis direction based on the rotational state of the electronic component ED.

[0233] like Figure 18 As shown in the schematic diagram, the reconfiguration mechanism 500 includes a reconfiguration pickup 510, a reconfiguration camera 520, a lift 530, and a buffer 540, etc.

[0234] The reconfiguration mechanism 500 can be fixed in position. For example, the reconfiguration mechanism 500 can be installed in a manner that fixes it to the frame that constitutes the skeleton of the first processor H1.

[0235] The reconfigurable pickup 510 can hold or release the electronic component ED. The reconfigurable pickup 510 can hold the electronic component ED by vacuum pressure.

[0236] In this embodiment, the pickup 510 is reconfigured and fixed in the horizontal direction, which serves as the X-axis and Y-axis.

[0237] The camera 520 is reconfigured separately from the pickup 510.

[0238] The camera 520 was reconfigured for shooting electronic components (ED). Specifically, such as... Figure 19 As illustrated, the camera 520 is reconfigured to capture either the first identification mark D1 or the second identification mark D2 near the four corners of the electronic component ED. Here, the first identification mark D1 and the second identification mark D2 are diagonally opposite each other.

[0239] According to a preferred embodiment of the present invention, the spacing between the reconfigured camera 520 and the electronic component ED is closer than in the prior art. Therefore, as Figure 20 As illustrated, assuming the camera 520 is reconfigured to shoot with the center O of the electronic component ED as the shooting center, then the entire edge or at least a portion of the edge of the electronic component ED will be out of the frame.

[0240] The reconfigured camera 520 is installed in such a way that the electronic components ED cannot be completely contained within the image I captured by the reconfigured camera 520.

[0241] The focal distance of the reconfigured camera 520 is set to the distance between the lens of the reconfigured camera 520 and the electronic component ED. Therefore, the first identification mark D1 and the second identification mark D2 of the electronic component ED can be distinguished more clearly in the image captured by the reconfigured camera 520 than in the prior art.

[0242] Figure 21 (a) shows an image I1 captured by a prior art camera. Figure 21 (b) and (c) show images I2 and I3 captured by the reconfigured camera 520 to which the present invention is applicable. Figure 22 (b) is an image I2 of the first identification mark D1 of the electronic component ED. Figure 22 (c) is an image I3 of the second identification mark D2 of the electronic component ED.

[0243] exist Figure 22 When the number of pixels in each image I1, I2, and I3 of (a), (b), and (c) is the same, compared with the captured image I1 of (a), the captured images I2 and I3 of (b) and (c) can more clearly distinguish the identification marks D1, D2 and edges of the electronic component ED.

[0244] According to the present invention, the processing and analysis of images I2 and I3 are easy and the time spent can be shortened.

[0245] According to the present invention, the processing and analysis of images I2 and I3 can be performed more precisely.

[0246] According to the present invention, the current position (coordinates and angular position on the XY plane) of the electronic component ED on the temporary region BZ can be more precisely determined.

[0247] Identification marks D1 and D2 are formed during the production stage of electronic component ED. Therefore, the relative positions of identification marks D1 and D2 are accurately set.

[0248] The positions and offset of identification marks D1 and D2 can be accurately determined through the captured images I2 and I3, thus enabling accurate correction of the position of electronic component ED.

[0249] The identification marks D1 and D2, which are used to identify the subjects of the reconfigured camera 520, can be replaced by the corner of the electronic component ED, a specially shaped identification pad on the electronic component ED, or a specially shaped identification pattern on the electronic component ED.

[0250] Preferably, the reconfiguration pickup 510 and the reconfiguration camera 520 are bundled together as a single module.

[0251] The relative positions of the reconfigured pickup 510 and the reconfigured camera 520 are fixed.

[0252] The lift 530 drives the reconfiguration of the pickup 510 to lift.

[0253] The reconfigured pickup 510 can be raised and lowered by the lift 530.

[0254] According to this example, the position of the reconfigured pickup 510 is fixed in the horizontal direction, but can be raised and lowered in the vertical direction by means of the elevator 530.

[0255] When the pickup 510 is reconfigured and lowered, the electronic component ED can be held from the test bench 300 or placed on the test bench 300.

[0256] In the arrangement section AP, the vertical position of the test stage 300 is fixed, and the reconfiguration pickup 510 is lowered to enable the exchange of electronic components ED between the test stage 300 and the reconfiguration pickup 510.

[0257] Alternatively, the elevator 530 can be omitted and the test bench 300 can be raised and lowered to exchange electronic components ED between the test bench 300 and the reconfigured pickup 510.

[0258] The buffer 540 can buffer the stress experienced by the electronic component ED held or to be held by the reconfigured pickup 510.

[0259] The buffer 540 can be equipped with springs or pneumatic cylinders, etc.

[0260] When exchanging electronic components (EDs) between the pickup 510 and the test bench 300, the electronic components (EDs) must not be damaged or misaligned due to excessive pressure.

[0261] Even if the reconfigured pickup 510 is subjected to some excessive descent force, a portion of the pressure applied to the electronic component ED will be absorbed due to the compression of the buffer 530. Therefore, the electronic component ED can be exchanged without changing the position between the reconfigured pickup 510 and the test stage 300, while minimizing damage to the electronic component ED at the same time.

[0262] For reference, the reconfiguration mechanism 500 may further include a rotating mechanism that drives the reconfiguration pickup 510 to rotate. In this case, the angular position of the electronic component ED held by the reconfiguration pickup 510 can be adjusted by the rotating mechanism.

[0263] Refer again Figure 9 The moving mechanism 600 is equipped to move the test station 300 between the arrangement area AD and the test area TD.

[0264] The permutation region AD is formed in the space of the permutation portion AP, and the test region TD is formed in the space of the connection portion CP. Therefore, the permutation region AD and the test region TD are separated from each other.

[0265] In this embodiment, the moving mechanism 600 can make the test stage 300 rotate and move along the θ axis.

[0266] The moving mechanism 600 in this embodiment can move the test platform 300 horizontally.

[0267] like Figure 22 As shown in the schematic enlarged partial view, the moving mechanism 600 includes a rotary mover 610 and a horizontal mover 620.

[0268] The rotary mover 610 can rotate the test stage 300 in both directions using a vertical line V passing through the center of the test stage 300 in the Z-axis direction as the rotation axis.

[0269] The reason for rotating and moving the test stage 300 is to compensate for the angular position of the electronic component ED in the θ-axis direction in the temporary area BZ and reconfigure it to the correct position area RZ.

[0270] The reconfigurable pickup 510 is fixed in the θ-axis direction, so the angular position of the electronic component ED held by the reconfigurable pickup 510 is compensated by the rotation of the test stage 300 driven by the rotary mover 610.

[0271] The horizontal mover 620 moves the test stage 300 horizontally in the XY plane.

[0272] The horizontal mover 620 can be divided into an X-axis mover 621 and a Y-axis mover 622.

[0273] The X-axis mover 621 can move the test stage 300 horizontally along the X-axis direction.

[0274] Y-axis mover 622 can move the test stage 300 horizontally along the Y-axis.

[0275] According to the present invention, the moving mechanism 600 has two functions.

[0276] The primary function of the moving mechanism 600 is to drive the test station 300 to move horizontally in order to selectively position the test station 300 in the arrangement area AD of the arrangement portion AP and the test area TD of the connecting portion CP.

[0277] The second function of the moving mechanism 600 is to move the test stage 300 to reconfigure the electronic components ED using the reconfiguration mechanism 500. In this second function, the moving mechanism 600 moves the test stage 300 along the X-axis, Y-axis, and θ-axis.

[0278] The second function of the moving mechanism 600 allows the electronic component ED of the temporary area BZ to be moved to the correct position area RZ.

[0279] Connector 700 will move to the test bench 300 of the connection part CP to connect the electronic component ED loaded with the test machine.

[0280] Connector 700 can pressurize the test board TB above the test bench 300. Therefore, the electronic component ED mounted on the test bench 300 is electrically connected to the test board TB, ultimately connecting the electronic component ED to the test machine.

[0281] Testing of the electronic component ED is performed with the connector 700 electrically connecting the electronic component ED to the testing machine.

[0282] In this embodiment, the test stage 300 is located below the test board TB. Therefore, the connector 700 is provided to drive the test stage 300 to move up and down.

[0283] According to this embodiment, the connector 700 raises the test stage 300 toward the test board TB above, thereby electrically connecting the electronic component ED on the test stage 300 to the test board TB.

[0284] The electronic components ED are electrically connected in their corresponding test areas TZ and test board TB.

[0285] The lifting height of the test stage 300 is preset according to the type of electronic component ED to be tested.

[0286] Connector 700 drives test bench 300 to rise and fall according to the preset lifting height.

[0287] Connector 700 operates when the electronic component ED on test bench 300 is electrically connected to or disconnected from the test machine.

[0288] If the elevator 530 is omitted in the reconfiguration mechanism 500, the connector 700 will also operate during the reconfiguration of the electronic component ED, causing the test bench 300 to rise and fall.

[0289] The reconfiguration process for the electronic components (ED) is explained further below.

[0290] In order to reconfigure the electronic component ED, firstly, the test stage 300 is moved horizontally so that the reconfiguration camera 510 can capture the electronic component ED on the temporary area BZ.

[0291] The camera 520 is reconfigured to photograph the electronic components ED on the test stand 300. At this time, in order to photograph the two identification marks D1 and D2 in two steps, the test stand 300 can be moved horizontally at a preset distance.

[0292] When the reconfigured camera 520 finishes filming, the test stage 300 moves horizontally so that the electronic component ED on the temporary area BZ can be held by the reconfigured pickup 510. Then, the reconfigured pickup 510 is driven down by the elevator 530 to hold the electronic component ED on the temporary area BZ.

[0293] With the reconfigured pickup 510 holding the electronic component ED, the lift 530 drives the reconfigured pickup 510 to rise, and the moving mechanism 600 operates to move the test stage 300 horizontally and rotate so that the electronic component ED held by the reconfigured pickup 510 is aligned with the correct position area RZ. Once the electronic component ED held by the reconfigured pickup 510 is aligned with the correct position area RZ, the lift 530 then drives the reconfigured pickup 510 to descend, allowing the reconfigured pickup 510 to place the electronic component ED in the correct position area RZ of the test stage 300.

[0294] With the electronic component ED supported by the test stage 300, the vacuum pressure provided by the vacuum port h fixes the electronic component ED to the test stage 300, and then the pickup 510 is reconfigured to release the electronic component ED from the holding state.

[0295] When the reconfiguration pickup 510 is released from the state of holding the electronic component ED, the elevator 530 drives the reconfiguration pickup 510 to rise.

[0296] As shown in this embodiment, production costs can be reduced by moving the test stage 300 horizontally instead of reconfiguring the pickup 510 during the process of moving the electronic component ED from the temporary area BZ to the correct location area RZ.

[0297] When the lift 530 is omitted, the test bench 300 is raised and lowered by the connector 700 during the reconfiguration process.

[0298] The controller 800 controls elements necessary for the proper operation of the first processor H1, such as the transport shuttle 100, the first moving robot 210, the second moving robot 220, the vacuum device 400, the reconfiguration mechanism 500, the moving mechanism 600, and the connector 700.

[0299] On the other hand, like Figure 23 The enlarged view shows that the loading and unloading section LU also includes a first processing unit 910, a second processing unit 920, a stacker unit 930, an opener 940, and a cartridge transferor 950.

[0300] The first processing unit 910 manipulates the ring loading seat 10, which serves as the first loader.

[0301] The first processing unit 910 includes a separator 911 and a loading carrier transfer unit 913.

[0302] When the first mobile robot 210 moves the electronic component ED adhered to the ring loading seat 10 to the transfer table 110, the separator 911 helps to peel the electronic component ED adhered to the adhesive film 12.

[0303] According to one example, the separator 911 can be implemented by heating the area where the electronic component ED to be moved is located, thereby weakening the adhesive force of the adhesive film 12.

[0304] Loader transferor 913 moves the ring loader 10 on the stacker unit 930 to the upper side of the separator 911 or moves the ring loader 10 on the upper side of the separator 911 to the stacker unit 930.

[0305] The second processing unit 920 manipulates the ring tray 20, which serves as the second loader.

[0306] The second processing unit 920 includes six supports 921, a base plate 922, and a transfer unit 923.

[0307] Support 921 support ring tray 20.

[0308] Preferably, multiple supports 921 are provided to increase processing capacity.

[0309] as Figure 24 The concept diagram shows that the support includes a support plate 921a, a buffer plate 921b, and a lift 921c.

[0310] Support plate 921a support ring tray 20.

[0311] The first mobile robot 210 moves the tested electronic component ED, which has been unloaded from the transport table 110, to the ring tray 20 supported by the support plate 921a.

[0312] The buffer plate 921b is positioned below the support plate 921a.

[0313] The ring tray 20 is temporarily stored in a supported state on the buffer plate 921b.

[0314] The elevator 921c drives the support plate 921a and the buffer plate 921b to rise and fall.

[0315] When the elevator 921c raises the support plate 921a and the buffer plate 921b, the support frame 22 of the ring tray 20 supported by the support plate 921a is clamped between the base plate 922 and the support plate 921a and fixed.

[0316] The base plate 922 is provided for mounting the support 921.

[0317] Support 921 is mounted on base plate 922.

[0318] The base plate 922 has an exposure hole EH in the area where the support 921 is located.

[0319] The cover 23 of the ring tray 20 supported by the support plate 921a and the loading plate 21 are exposed upward through the exposure hole EH.

[0320] The support 921 has a buffer plate 921b, which allows the first processor H1 to accommodate more ring trays 20, thereby increasing the processing capacity.

[0321] The support 921 may have more than one buffer plate 921b in the vertical direction.

[0322] like Figure 25 As shown, the base plate 922 can be installed in a way that allows it to be moved backward.

[0323] With the base plate 922 moved rearward, it is convenient to repair or replace many elements such as the support 921 installed on the base plate 922.

[0324] Transfer unit 923 moves the ring tray 20 on stacker unit 930 to support unit 921 or moves the ring tray 20 on support unit 921 to stacker unit 930.

[0325] The transferor 923 moves the ring tray 20 on the stacker unit 930 to the support plate 921a or the buffer plate 921b, or moves the ring tray 20 supported by the support plate 921a or the buffer plate 921b to the stacker unit 930. Furthermore, the transferor 923 can remove the ring tray 20 supported by the support plate 921a and then move the ring tray 20 supported by the buffer plate 921b to the support plate 921a.

[0326] During the transfer of the ring tray by the transferor 923, the support 921 should be in a state where the support plate 921a and the buffer plate 921b are lowered.

[0327] like Figure 26 As shown in the conceptual diagram, the transferor 923 includes a first gripper 922a, a first forward / reverse mechanism 922b, a second gripper 922c, a second forward / reverse mechanism 922d, an elevator 922e, and a horizontal mover 922f.

[0328] The first gripper 922a can grip the ring tray 20 or release it from the gripping state.

[0329] The first forward / reverse mechanism 922b drives the first gripper 922a to move forward and backward.

[0330] The second gripper 922c is positioned below the first gripper 922a.

[0331] The second gripper 922c can grip the ring tray 20 or release it from the gripping state.

[0332] The second forward / reverse mechanism 922d drives the second gripper 922c to move forward and backward.

[0333] With the first gripper 922a and the second gripper 922c fully retracted, the first gripper 922a and the second gripper 922c are located on the same plane.

[0334] like Figure 27 As shown, in only one of the forward-moving states of the first gripper 922a and the second gripper 922c, the positions of the first gripper 922a and the second gripper 922c on the plane are different.

[0335] The planar positions of the first gripper 922a and the second gripper 922c can change as the ring tray 20 is moved.

[0336] The elevator 922e drives the first gripper 922a, the first forward / reverse mechanism 922b, the second gripper 922c, and the second forward / reverse mechanism 922d to rise and fall.

[0337] The operation of the elevator 922e enables the transferor 922 to hold or release the ring tray at multiple heights.

[0338] The horizontal mover 922f causes the first gripper 922a, the first forward / reverse mechanism 922b, the second gripper 922c, the second forward / reverse mechanism 922d, and the elevator 922e to move in the X-axis and Y-axis directions.

[0339] The stacker unit 930 houses the ring loading seat 10 and the ring tray 20.

[0340] The stacker unit 930 is positioned in front of the first processing unit 910 and the second processing unit 920.

[0341] The ring loading seat 10 or ring tray 20 can be transported in a cassette-like state.

[0342] The ring loading seat 10 and the ring tray 20 have the same outer dimensions, so the cassette that houses the ring loading seat 10 and the ring tray 20 has the same specifications and structure.

[0343] A cartridge moved from the outside of the first type of processor H1 holds a ring-mounted base 10 containing the electronic components ED to be tested and is housed in a stacker unit 930.

[0344] The empty ring tray 20 is carried in from the outside of the first type of processor H1 and stored in the stacker unit 930.

[0345] After being retrieved from the second processing unit 920, the ring tray 20 containing the tested electronic components ED is housed in the stacker unit 930 and then moved to the outside of the first processor H1.

[0346] like Figure 28 As shown, the stacker unit 930 has a stacker 931 that is multi-layered in the vertical direction and arranged in multiple columns in the X-axis direction.

[0347] Each stacker 931 has a loading space that can accommodate cartridges CS.

[0348] The stacker 931 can move forward or backward in the Y-axis direction.

[0349] While the stacker 931 is in the forward position, the cartridge CS can be moved in or out by an external automated logistics device.

[0350] The opener 940 either removes the cover 23 from the ring tray 20 to open the ring tray 20 or attaches the cover 23 to the ring tray 20 to close the ring tray 20.

[0351] With only one support 921, the opener 940 can continue to hold the removed cover 23.

[0352] With support 921, the cover 23, after the opener 940 is removed, is stacked into additional space. The additional space may be provided with a shelf for stacking, or may be equipped with a dedicated stacking machine for the cover, or may be equipped with a dedicated cassette for the cover.

[0353] The cartridge transferor 950 transfers cartridges CS between the various stackers 931. The cartridges CS are moved between multiple loading spaces by the cartridge transferor 950.

[0354] The cartridge transferor 950 can transfer empty cartridges CS to other stackers 931.

[0355] The cassette transferor 950 can transfer cassettes CS that have been moved in by automated logistics equipment to other stacker CS.

[0356] The cassette transferor 950 can transfer cassettes CS that are to be moved out by automated logistics equipment to other stacker CS.

[0357] When equipped with a cartridge transferor 950, the movement control of the transferor 922 or the movement control of the automated logistics device becomes simpler.

[0358] The operation of the first type of processor H1, as described above, is explained below.

[0359] While the stacker 931 is moving forward, the automated logistics device moves the cassette CS containing the ring loading seat 10 or the cassette CS containing the empty ring pallet 20 into the stacker 931.

[0360] As the stacker 931 retracts, the load transferor 913 moves the ring loader 10 to the upper side of the separator 911.

[0361] The separator 911 and the first mobile robot 210 operate to move the electronic component ED to be tested, which is attached to the ring loading seat 10, to the transfer table 110 on the first area A1.

[0362] With the electronic component ED fully supported on the transport table 110, the transport shuttle 100 operates, causing the transport table 110 to move to the second area A2. Then, the second mobile robot 220 unloads the electronic component ED from the transport table 110 and moves it to the test table 300 on the arrangement section AP. At this time, the electronic component ED loaded onto the test table 300 by the second mobile robot 220 is located in the temporary area BZ.

[0363] With all the electronic components ED to be tested loaded onto the test bench 300, the controller 900 drives the reconfiguration mechanism 500 and the moving mechanism 600 to reconfigure the electronic components ED from the temporary area BZ to the correct position area RZ.

[0364] After the electronic component ED is reconfigured on the test bench 300, the moving mechanism 600 operates to move the test bench 300 to the connection section CP. Then, the connector 700 raises the test bench 300 towards the test board TB side, electrically connecting the electronic component ED to the test equipment.

[0365] When the test of the electronic component ED is completed, the connector 700 drives the test stage 300 to descend, and the moving mechanism 600 drives the test stage 300 to move to the arrangement section AP.

[0366] Then, the second mobile robot 220 moves the tested electronic component ED to the transfer table 110 on the second area A2, and the transfer table 110, filled with the tested electronic component ED, moves to the first area A1.

[0367] After unloading the tested electronic component ED from the transport table 110, the first mobile robot 210 loads it onto the empty ring tray 20 supported by the support 921.

[0368] When the tested electronic components ED are filled in the ring tray 20, the support 921 drives the support plate 921a and the buffer plate 921b to descend.

[0369] The transferor 922 holds the ring tray 20 supported by the descending support plate 921a, moves the empty ring tray 20 supported by the buffer plate 921b to the support plate 921a, and then moves the held ring tray 20 to the empty cartridge CS.

[0370] To support smooth logistics, whenever there is no downtime, the transferor 923 moves the empty ring pallet 20 on the stacker unit 930 to the support 921, while the cassette transferor 950 moves the cassettes CS between the stackers 931.

[0371] When the cartridge CS is filled with the ring tray 20 containing the tested electronic components ED, the stacker 931 containing the cartridge CS moves forward and the automated logistics device removes the cartridge CS from the first processor H1.

[0372] <Explanation of the second type of processor> Figure 29 This is a conceptual plan view of the second type of processor, H2.

[0373] The second type of processor H2 can be divided into a moving part MP, a loading and unloading part LU, an arrangement part AP, and a connecting part CP.

[0374] The configuration and functions of the moving part MP, the arranging part AP, and the connecting part CP of the second type of processor H2 can be the same as those of the first type of processor H1.

[0375] In the second type of processor H2, the electronic component ED to be tested is moved in with its load on the ring tray 20, and the electronic component ED after testing is moved out with its load on the ring mounting base 10.

[0376] as Figure 30 The enlarged view shows that the loading and unloading section LU of the second type of processor H2 includes a first mobile robot 210, a first processing unit 910, a second processing unit 920, a stacker unit 930, an opener 940, and a cartridge transferor 950.

[0377] The first mobile robot 210 moves the electronic component ED to be tested, which is loaded on the ring tray 20, to the transfer table 110 on the first area A1.

[0378] The first mobile robot 210 moves the tested electronic component ED, which is carried on the transfer table 110 in the first area A1, to the ring loading seat 10.

[0379] The first processing unit 910 manipulates the ring loading seat 10, which serves as the first loader.

[0380] The first processing unit 910 includes an adhesive 912 and a loading seat transferor 913.

[0381] As the first mobile robot 210 moves the electronic component ED from the transport table 110 to the ring loading seat 10, the adhesive 912 helps the electronic component ED adhere to the adhesive film 12.

[0382] According to one example, the adhesive 912 can be implemented to support the adhesive film 12 so that the electronic component ED can be well adhered to the adhesive film 12.

[0383] The second processing unit 920, stacker unit 930, opener 940, and cartridge transferer 950 are the same as those of the first processor H1.

[0384] The main operation of the second type of processor H2, as described above, is explained below.

[0385] While the stacker 931 is moving forward, the automated logistics device moves the cassette CS containing the empty ring loading seat 10 or the cassette CS containing the ring tray 20 containing the electronic components to be tested into the stacker 931.

[0386] As the stacker 931 retracts, the load transferor 913 moves the empty ring loader 10 to the upper side of the adhesive 912.

[0387] The transferor 923 moves the ring tray 20, which contains the electronic components ED to be tested, to the support 921.

[0388] The first mobile robot arm 210 operates to move the electronic component ED to be tested, loaded on the ring tray 20, to the transfer table 110 on the first area A1.

[0389] Subsequently, after the tested electronic component ED is carried on the transport table 110 and moved to the first area A1, the first moving robot arm 210 unloads the tested electronic component ED from the transport table 110 and then attaches it to the ring loading seat 10.

[0390] When the ring loader 10 is filled with the tested electronic components ED, the loader transferor 913 transfers the ring loader 10 to the empty cartridge CS on the stacker unit 930.

[0391] When the cartridge CS is filled with the ring loading seat 10 containing the tested electronic components ED, the stacker 931 containing the cartridge CS moves forward and the cartridge CS is removed from the second type of processor H2 by an automated logistics device.

[0392] <Explanation of the third type of processor> Figure 31 This is a conceptual plan view of the third type of processor, H3.

[0393] The third type of processor, H3, does not have a moving part (MP), an arrangement part (AP), or a connection part (CP).

[0394] The third type of processor H3 is implemented such that the electronic component ED to be tested is moved in while loaded in the ring loading seat 10, and the electronic component ED after testing is moved out while loaded in the ring tray 20.

[0395] The third type of processor H3 includes a first mobile robotic arm 210, a first processing unit 910, a second processing unit 920, a stacker unit 930, an opener 940, and a cassette transferor 950.

[0396] The first mobile robot arm 210 moves the electronic component ED to be tested, which is loaded on the ring loading seat 10, to the ring tray 20.

[0397] The first processing unit 910, the second processing unit 920, the stacker unit 930, the opener 940, and the cartridge transferer 950 of the third processor H3 are the same as those of the first processor H1.

[0398] The operation of the third type of processor H3, as described above, is explained below.

[0399] While the stacker 931 is moving forward, the automated logistics device moves the cassette CS containing the ring loading seat 10 or the cassette CS containing the empty ring pallet 20 into the stacker 931.

[0400] As the stacker 931 retracts, the load transferor 913 moves the ring loader 10 to the upper side of the separator 911.

[0401] The separator 911 and the first moving robot 210 operate to transfer the electronic components ED to be tested, which are adhered to the ring loading seat 10, to the ring tray 10.

[0402] When the ring tray 20 is filled with the electronic components ED to be tested, the support 921 drives the support plate 921a and the buffer plate 921b to descend.

[0403] The transferor 922 holds the ring tray 20 supported by the descending support plate 921a, moves the empty ring tray 20 supported by the buffer plate 921b to the support plate 921a, and then moves the held ring tray 20 to the empty cartridge CS.

[0404] When the cartridge CS is filled with the ring tray 20 containing the electronic components ED to be tested, the stacker 931 containing the cartridge CS moves forward and the cartridge CS is removed from the third processor H3 by an automated logistics device.

[0405] <Explanation of the fourth type of processor> Figure 32 This is a conceptual plan view of the fourth processor, H4.

[0406] The fourth type of processor, H4, does not have a moving part (MP), an arrangement part (AP), or a connection part (CP).

[0407] The fourth type of processor H4 is implemented such that the electronic component ED to be tested is moved in while loaded on the ring tray 20, and the electronic component ED after testing is moved out while loaded on the ring loading seat 10.

[0408] The fourth type of processor H4 includes a first mobile robot 210, a first processing unit 910, a second processing unit 920, a stacker unit 930, an opener 940, and a cassette transferer 950.

[0409] The first mobile robot 210 moves the tested electronic components ED, which are loaded on the ring tray 20, to the ring loading seat 10.

[0410] The first processing unit 910, the second processing unit 920, the stacker unit 930, the opener 940, and the cartridge transferer 950 of the fourth type of processor H4 are the same as those of the second type of processor H2.

[0411] The main operation of the fourth type of processor H4, as described above, is explained below.

[0412] While the stacker 931 is moving forward, an automated logistics device moves either the cassette CS containing the empty ring loading seat 10 or the cassette CS containing the ring tray 20 loaded with the tested electronic components into the stacker 931.

[0413] As the stacker 931 retracts, the load transferor 913 moves the empty ring loader 10 to the upper side of the adhesive 912.

[0414] The transferor 923 moves the ring tray 20, which contains the tested electronic components ED, to the support 921.

[0415] The first mobile robot arm 210 operates to move the tested electronic components ED loaded on the ring tray 20 to the ring loading seat 10.

[0416] When the ring loader 10 is filled with tested electronic components ED, the loader transferor 913 transfers the ring loader 10 to the empty cartridge CS on the stacker unit 930.

[0417] When the cartridge CS is filled with the ring loading seat 10 containing the tested electronic components ED, the stacker 931 containing the cartridge CS moves forward and the automated logistics device removes the cartridge CS from the fourth type of processor H2.

[0418] <Explanation of the fifth type of processor> Figure 33 This is a conceptual floor plan of the fifth processor, H5.

[0419] The fifth type of processor, H5, does not have a moving part (MP), an arrangement part (AP), or a connection part (CP).

[0420] The fifth type of processor H5 is implemented such that the electronic component ED to be tested is moved in while loaded in the ring loading seat 10, and the electronic component ED after testing is moved out while loaded in the ring tray 20.

[0421] Furthermore, in the fifth type of processor H5, the electronic component ED to be tested is moved in with the ring tray 20 loaded, and the electronic component ED after testing is moved out with the ring loading seat 10 loaded.

[0422] The fifth type of processor H4 includes a first mobile robotic arm 210, a first processing unit 910, a second processing unit 920, a stacker unit 930, an opener 940, and a cartridge transferor 950.

[0423] The first mobile robot arm 210 moves the electronic component ED to be tested, which is loaded on the ring loading seat 10, to the ring tray 20.

[0424] Furthermore, the first moving robot 210 moves the tested electronic components ED loaded on the ring tray 20 to the ring loading seat 10.

[0425] The first processing unit 910 of the fifth type of processor H5 includes a separator 911, an adhesive 912, and a loading seat transferor 913.

[0426] The separator 911 is the same as the separator of the first type of processor H1, and the adhesive 912 is the same as the adhesive of the second type of processor H2.

[0427] Loader transferor 913 moves the ring loader 10 on the stacker unit 930 to the upper side of separator 911 or adhesive 912, or moves the ring loader 10 on the upper side of separator 911 or adhesive 912 to stacker unit 930.

[0428] The second processing unit 920, stacker unit 930, opener 940, and cartridge transferer 950 of the fifth type of processor H5 are the same as those of the second type of processor H2.

[0429] As mentioned above, the fifth type of processor, H5, performs two main operations.

[0430] The first major operation of the fifth processor H5 moves the electronic components ED to be tested, which are loaded on the ring loading seat 10, to the empty ring tray 20.

[0431] The second main operation of the fifth type of processor H5 is to move the tested electronic components ED loaded on the ring tray 20 to the empty ring loading seat 10.

[0432] <Explanation of the sixth type of processor> Figure 34 This is a conceptual plan view of the sixth processor, H6.

[0433] The sixth type of processor H6 can be divided into a moving part MP, a loading and unloading part LU, an arrangement part AP, and a connecting part CP.

[0434] The configuration and function of the moving part MP, the arranging part AP, and the connecting part CP of the sixth processor H6 can be the same as those of the first processor H1.

[0435] In the sixth type of processor H2, the electronic component ED to be tested is moved in while loaded onto the ring tray 20, and the electronic component ED after testing is moved out while loaded onto the ring tray 20. like Figure 35 As shown in the enlarged view, the loading and unloading section LU of the sixth type of processor H6 includes a first moving robot 210, a second processing unit 920, a stacker unit 930, an opener 940, and a cartridge transferor 950.

[0436] The sixth type of processor H6 does not have a first processing unit 910 with a control ring loading seat 10.

[0437] The first mobile robot 210 moves the electronic component ED to be tested, which is loaded on the ring tray 20, to the transfer table 110 on the first area A1.

[0438] The first mobile robot 210 moves the tested electronic component ED, which is carried on the transfer table 110 in the first area A1, to the empty ring tray 20.

[0439] The following describes the main operation of the sixth processor, H6, as previously mentioned.

[0440] While the stacker 931 is moving forward, the automated logistics device moves the cassette CS containing the empty ring pallet 20 or the cassette CS containing the ring pallet 20 containing the electronic components to be tested into the stacker 931.

[0441] As the stacker 931 retracts, the transferor 923 moves the ring tray 20 loaded with the electronic components ED to be tested, along with the empty ring tray, to the support 921.

[0442] The first mobile robot arm 210 operates to move the electronic component ED to be tested, loaded on the ring tray 20, to the transfer table 110 on the first area A1.

[0443] Subsequently, after the tested electronic component ED is carried on the transport table 110 and moved to the first area A1, the first mobile robot arm 210 unloads the tested electronic component ED from the transport table 110 and moves it to the empty ring tray 20.

[0444] When the empty ring tray 20 is filled with tested electronic components ED, the transferor 923 moves the ring tray 20 to the empty cassette CS of the stacker unit 90.

[0445] The cartridges CS, filled with the tested electronic components ED in the ring tray 20, are then removed from the sixth processing unit H6 by an automated logistics device.

[0446] Next, several applicable examples of combinations of the various processors H1, H2, H3, H4, H5, and H6 as described above will be explained.

[0447] 1. First applicable example exist Figure 36 M sixth processors H6 are configured between the first processor H1 and the second processor H2.

[0448] If the ring loading seat 10, which is loaded with the electronic components ED to be processed, is supplied to the first type of processor H1, and the ring tray 20, which is loaded with the processed electronic components ED, is removed from the first type of processor H1, then only the ring tray 20 is moved in and out of the M sixth type of processors H6.

[0449] The ring tray 20, which contains electronic components ED that have undergone various processes by M sixth-type processors H6, is moved into the second-type processor H2 for final processing.

[0450] The second type of processor H2 removes the finally processed electronic component ED in a state where it is loaded onto the ring loading seat 10.

[0451] 2. Second applicable example exist Figure 37 M sixth processors H6 are configured between the third processor H3 and the second processor H2.

[0452] When the ring loading seat 10, which is loaded with electronic components ED to be processed, is supplied to the third type of processor H3, the third type of processor H3 moves the electronic components ED to be processed from the ring loading seat 10 to the ring tray 20 and then removes the ring tray 20 filled with electronic components ED to be processed.

[0453] The ring tray 20, which is moved out of the third type of processor H3, is moved into the second type of processor H2 after being moved in and out of M sixth type of processors H6 in sequence for final processing.

[0454] The second type of processor H2 removes the final processed electronic component ED from the ring loading seat 10.

[0455] 3. Third applicable example exist Figure 38 M sixth processors H6 are configured between the first processor H1 and the fourth processor H4.

[0456] When the ring loading seat 10, which is loaded with the electronic components ED to be processed, is supplied to the first processor H1, the first processor H1 loads the processed electronic components ED onto the ring tray 20 and then removes them.

[0457] The ring tray 20, which is moved out of the first type of processor H1, is moved in and out of M sixth type of processors H6 in sequence, and the ring tray 20, which is loaded with the electronic components ED that have completed all the processing, is moved into the fourth type of processor H4.

[0458] The fourth type of processor H4 moves the electronic component ED, which has completed all processing, from the ring tray 10 to the ring loading seat 10 and then removes it.

[0459] 4. Fourth Applicable Example exist Figure 39 M sixth processors H6 are configured between the third processor H3 and the fourth processor H2.

[0460] When the ring loading seat 10, which is loaded with electronic components ED to be processed, is supplied to the third type of processor H3, the third type of processor H3 moves the electronic components ED to be processed from the ring loading seat 10 to the ring tray 20 and then removes the ring tray 20 filled with the electronic components ED to be processed.

[0461] The ring tray 20, which is moved out of the third type of processor H3, is sequentially moved in and out of M sixth type of processors H6 to complete all the processing for electronic components ED.

[0462] The ring tray 20, which was moved from the sixth type of processor H6, which was in the last order, was moved into the fourth type of processor H4.

[0463] After the fourth type of processor H4 moves the electronic component ED on the ring tray 20 to the ring loading seat 10, it removes the ring loading seat 10 containing the electronic component ED that has completed all the processing.

[0464] 5. Fifth applicable example exist Figure 40 It is equipped with a fifth type of processor H5 and M sixth type of processor H6.

[0465] When the ring loading seat 10, which is loaded with electronic components ED to be processed, is supplied to the fifth type of processor H5, the fifth type of processor H3 moves the electronic components ED to be processed from the ring loading seat 10 to the ring tray 20 and then removes the ring tray 20 filled with electronic components ED to be processed.

[0466] The ring tray 20, which is moved out of the fifth type of processor H3, is sequentially moved in and out of M sixth type of processors H6 to complete all the processing for electronic components ED.

[0467] The ring tray 20, which was moved from the sixth type of processor H6, which was in the last order, was moved into the fifth type of processor H5.

[0468] After the fifth type of processor H5 moves the electronic component ED on the ring tray 20 to the ring loading seat 10, it removes the ring loading seat 10 containing the electronic component ED that has completed all the processing.

[0469] The foregoing embodiments are merely preferred examples of the present invention, and many other applications are possible. Therefore, the present invention should not be construed as limited to the content described above. The scope of the present invention should be interpreted as the scope of the patent application and its equivalents.

Claims

1. A processor for processing electronic components, in, include: The first processing unit operates a first loader capable of loading electronic components; The second processing unit manipulates a second loader that is capable of loading electronic components and has a structure different from that of the first loader; A stacker unit, configured in front of the first processing unit and the second processing unit, is used to supply or retrieve the first loader to the first processing unit and to supply or retrieve the second loader to the second processing unit; and The robotic arm moves the electronic components from the first loader to the second loader; The first loader operated by the first processing unit has a structure in which the loaded electronic components are held together by adhesive. The second loader operated by the second processing unit has a structure in which the loaded electronic components are placed in the loading slot and held in position.

2. The processor for processing electronic components according to claim 2, wherein, The mobile robotic arm is capable of moving electronic components from the second loader to the first loader.

3. The processor for processing electronic components according to claim 1, wherein, The first processing unit has a separator that separates the electronic components from the first loader when the mobile robot moves the electronic components loaded on the first loader to the second loader.

4. The processor for processing electronic components according to claim 1, wherein, The first processing unit has an adhesive that is used to adhere the electronic components loaded on the second loader to the first loader when the mobile robot moves the electronic components loaded on the second loader to the first loader.

5. The processor for processing electronic components according to claim 1, wherein, The loading capacity of the first loader is N times the loading capacity of the second loader, where N is a natural number greater than 2.

6. The processor for processing electronic components according to claim 1, wherein, The second processing unit includes: At least one support for supporting the second loader; and The base plate on which the support is mounted.

7. The processor for processing electronic components according to claim 6, wherein, The base plate is installed in a movable manner.

8. The processor for processing electronic components according to claim 6, wherein, The support is installed in multiple units.

9. The processor for processing electronic components according to claim 6, wherein, The support includes: Support plate, supporting the second loader; A buffer plate, supporting the second loader and disposed below the support plate; and The elevator drives the support plate and the buffer plate to rise and fall.

10. The processor for processing electronic components according to claim 6, wherein, The second processing unit further includes a transferor that moves the second loader on the stacker unit to the support, or moves the second loader on the support to the stacker unit.

11. The processor for processing electronic components according to claim 10, wherein, The transferor includes: The first gripper is capable of gripping the second loader or releasing the gripping state; The first forward and backward mechanism drives the first gripper to move forward and backward. The second gripper, capable of gripping or releasing the second loader, is disposed below the first gripper; The second forward / reverse mechanism drives the second gripper forward or backward; and The elevator drives the first gripper and the second gripper to rise and fall.

12. The processor for processing electronic components according to claim 1, wherein, Includes an opener for opening the second loader.

13. The processor for processing electronic components according to claim 1, wherein, The stacker unit has multiple loading spaces capable of accommodating cartridges, which can carry either the first loader or the second loader. It also includes a cartridge transferor that enables the cartridge to move between the plurality of loading spaces.

14. A processor for processing electronic components, in, include: The processing unit operates the loader capable of loading electronic components; A stacker unit, configured in front of the processing unit, is used to supply the loader to the processing unit or retrieve the loader from the processing unit; and The robotic arm is moved to move electronic components between loaders on the processing unit; The processing unit includes: Supporter, supporting the loader; and The base plate on which the support is mounted. The base plate is installed in a movable manner.

15. The processor for processing electronic components according to claim 14, wherein, The support includes: Support plate, supporting the loader; A buffer plate, supporting the loader, is disposed below the support plate; and The elevator (921c) drives the support plate and the buffer plate to rise and fall.

16. The processor for processing electronic components according to claim 14, wherein, The processing unit further includes a transferor that moves the loader on the stacker unit to the support, or moves the loader on the support to the stacker unit.

17. The processor for processing electronic components according to claim 16, wherein, The transferor includes: The first gripper is capable of gripping the loader or releasing it from the gripping state; The first forward and backward mechanism drives the first gripper to move forward and backward. A second gripper, capable of gripping or releasing the loader, is disposed below the first gripper; The second forward / reverse mechanism drives the second gripper to move forward and backward; and The elevator drives the first gripper and the second gripper to rise and fall.

18. The processor for processing electronic components according to claim 14, wherein, The processing unit also includes an opener for opening the loader.

19. The processor for processing electronic components according to claim 14, wherein, The stacker unit has multiple loading spaces capable of holding cartridges that can carry the loader. It also includes a cartridge transferor that enables the cartridge to move between the plurality of loading spaces.

20. A processor for processing electronic components, in, include: The processing unit operates the loader capable of loading electronic components; A stacker unit, configured in front of the processing unit, supplies the loader to the processing unit or retrieves the loader from the processing unit; The moving robotic arm allows electronic components to move between loaders on the processing unit; and A transferor that moves the loader on the stacker unit to the processing unit, or moves the loader on the processing unit to the stacker unit; The transferor includes: The first gripper is capable of gripping the loader or releasing it from the gripping state; The first forward and backward mechanism drives the first gripper to move forward and backward. A second gripper, capable of gripping or releasing the loader, is disposed below the first gripper; The second forward / reverse mechanism drives the second gripper to move forward and backward; and The elevator drives the first gripper and the second gripper to rise and fall.

21. The processor for processing electronic components according to claim 20, wherein, The processing unit includes an opener for opening the loader.

22. The processor for processing electronic components according to claim 20, wherein, The stacker unit has multiple loading spaces capable of holding cartridges that can carry the loader. It also includes a cartridge transferor that enables the cartridge to move between the plurality of loading spaces.

23. A processor for processing electronic components, in, include: The processing unit operates the loader capable of loading electronic components; A stacker unit, disposed in front of the processing unit, has multiple loading spaces capable of loading cartridges, the cartridges being able to carry the loader, the stacker unit supplying the loader to the processing unit or retrieving the loader from the processing unit; A transferor that moves the loader on the stacker unit to the processing unit, or moves the loader on the processing unit to the stacker unit; and The cartridge transferor enables the cartridge to move between the multiple loading spaces.

24. A processor for processing electronic components, in, include: The processing unit operates the loader capable of loading electronic components; A stacker unit, configured in front of the processing unit, supplies the loader to the processing unit or retrieves the loader from the processing unit; and A transferor that moves the loader on the stacker unit to the processing unit, or moves the loader on the processing unit to the stacker unit; The processing unit includes an opener for opening the loader.

25. A processor for processing electronic components, in, include: Loading plate, a loading slot for loading electronic components is formed recessed to a predetermined depth; and A support frame supports the loading plate and the loading plate is fixedly mounted; The outer contour of the support frame protrudes further outward than the outer contour of the loading plate.

26. The tray for loading electronic components according to claim 25, wherein, The support frame has notches for identifying direction.

27. The tray for loading electronic components according to claim 25, wherein, The loading plate is detachably mounted to the support frame.

28. The tray for loading electronic components according to claim 25, wherein, The support frame has: The outer edge ribs are ring-shaped; and Reinforcing ribs, located inside the outer edge ribs, are used to maintain rigidity; The loading plate is integrally formed and combined with the reinforcing rib.

29. The tray for loading electronic components according to claim 25, wherein, It also includes a cover to prevent electronic components from detaching from the loading slot.

30. The tray for loading electronic components according to claim 29, wherein, It also includes a retainer for detachably securing the cover to the loading plate.

31. The tray for loading electronic components according to claim 29, wherein, The cover is separated from the electronic components disposed in the loading slot by a predetermined distance.

32. The tray for loading electronic components according to claim 25, wherein, The loading slot is formed at a depth lower than the height of the electronic component.

33. The tray for loading electronic components according to claim 25, wherein, The loading slot is wider at the top than at the bottom, allowing a predetermined portion of the pickup holding the electronic components to be inserted into the loading slot. The lower end of the pickup is wider than the upper end of the electronic component.

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