Hemispherical harmonic oscillator polishing device and polishing method

Abstract

According to the polishing device and method for the hemispherical harmonic oscillator, the clamping precision of the harmonic oscillator is guaranteed through cooperation of the main shaft assembly and the measuring system, and the measuring system can measure parameters of the hemispherical harmonic oscillator on line; magnetorheological polishing of the spherical surface and the lip edge of the hemispherical resonator can be controllably achieved through the lip edge polishing mechanism and the inner and outer spherical surface polishing mechanism, the roughness and the surface quality of the hemispherical resonator are greatly improved, the comprehensive performance of the resonator is improved, the energy loss of the resonator is reduced, and technical support is provided for improvement of the performance of the hemispherical resonator gyroscope. According to the technical scheme, the technical problem that the roughness and the surface appearance of the lip edge and the spherical surface of the hemispherical resonator cannot be effectively improved in the prior art can be solved.

Description

Technical Field

[0001] This invention relates to the field of resonator manufacturing technology, and more particularly to a polishing device and polishing method for a hemispherical resonator. Background Technology

[0002] Hemispherical resonator gyroscopes have attracted widespread attention in recent years due to their significant advantages such as high precision, small size, and low cost. They have been successfully and widely applied in the field of inertial technology both domestically and internationally, particularly in defense applications such as space science exploration, satellite attitude and stability control, long-range missile guidance, and deep-sea submarine navigation. This success is primarily attributed to the performance optimization of the hemispherical resonator, with isotropic materials forming the basis for high-quality hemispherical resonators. The core technology lies in fabricating high-precision spherical shell structures for hemispherical resonators.

[0003] The hemispherical resonator, as the core sensitive component of the hemispherical resonant gyroscope, is precision-machined from quartz glass. The surface roughness of the resonator has a significant impact on the performance of the shell-vibrating gyroscope. Researching methods to improve surface quality and roughness, and analyzing the influence of the resonator's surface morphology, is of great significance for improving gyroscope performance.

[0004] As crucial components of the resonator, the fabrication and polishing methods for the spherical surface and lip have been extensively studied. Typical methods include plastic grinding, chemical polishing, float polishing, elastic emission processing, particle beam polishing, and jet polishing. However, these methods suffer from drawbacks such as low polishing efficiency, the formation of large subsurface damage layers, or difficulty in controlling the polishing process. They also tend to reduce the perpendicularity and flatness of the resonator lip, as well as the roughness of the spherical surface. A few techniques utilize magnetohydrodynamic polishing, but their head structures are only suitable for polishing the spherical surface of the resonator. Further research is needed to improve the roughness and surface morphology of the resonator lip and spherical surface while maintaining parameters such as perpendicularity, flatness, coaxiality, and roundness.

[0005] The perpendicularity, flatness, coaxiality, and roundness of the lip of a hemispherical harmonic oscillator can greatly affect its accuracy, but in the current technology, there is no online measurement device for hemispherical harmonic oscillators. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0007] According to one aspect of the present invention, a hemispherical resonator polishing apparatus is provided. The apparatus includes a base, a cleanroom protection system, a spindle assembly, a measuring system, a lip-edge grinding mechanism, an inner and outer spherical surface polishing mechanism, a polishing system lifting mechanism, a polishing system translation mechanism, and a magnetic fluid circulation filtration system. The base includes a housing and a worktable. The worktable, spindle assembly, measuring system, lip-edge polishing mechanism, inner and outer spherical surface polishing mechanism, polishing system lifting mechanism, polishing system translation mechanism, and magnetic fluid circulation filtration system are located within the housing. The cleanroom protection system is used to purify the working environment inside the housing. The spindle assembly is used to clamp the hemispherical resonator for installation and positioning. The measuring system is located on the worktable. The upper part is used to measure the radial runout of the rotation of the hemispherical resonator clamped in the spindle assembly, the end face runout of the lip, and the parameters of the inner and outer spherical surfaces; the lip polishing mechanism is fixed on the lifting mechanism and the translation mechanism of the polishing system, and is used to polish the lip; the inner and outer spherical polishing mechanisms are rotatably connected to the lifting mechanism and the translation mechanism of the polishing system, and the inner and outer spherical polishing mechanisms use inner and outer spherical magnetic heads to achieve magnetorheological spherical polishing of the inner and outer spherical surfaces of the hemispherical resonator; the lifting mechanism and the translation mechanism of the polishing system are used to adjust the position of the lip polishing mechanism and the inner and outer spherical polishing mechanism; the magnetorheological fluid circulation filtration system is fixed on the worktable for continuous supply of magnetorheological polishing fluid.

[0008] According to another aspect of the present invention, a method for polishing a hemispherical harmonic oscillator is provided, wherein the method employs the hemispherical harmonic oscillator polishing apparatus described above to achieve magnetorheological polishing of the spherical surface and lip of the hemispherical harmonic oscillator.

[0009] The present invention provides a polishing device and method for a hemispherical resonator. This device ensures the clamping accuracy of the resonator through the collaborative operation of a spindle assembly and a measurement system. The measurement system can measure the parameters of the hemispherical resonator online. The lip polishing mechanism and the inner and outer spherical surface polishing mechanism enable controllable magnetorheological polishing of the spherical surface and lip of the hemispherical resonator, significantly improving the roughness and surface quality of the hemispherical resonator, enhancing its overall performance, and reducing energy loss. This provides technical support for improving the performance of hemispherical resonator gyroscopes. Compared with existing technologies, the present invention solves the technical problem that existing technologies cannot effectively improve the roughness and surface morphology of the lip and spherical surface of a hemispherical resonator. Attached Figure Description

[0010] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0011] Figure 1 A schematic diagram of a hemispherical resonator polishing apparatus according to a specific embodiment of the present invention is shown;

[0012] Figure 2 A schematic diagram of some components of a hemispherical harmonic oscillator polishing apparatus according to a specific embodiment of the present invention is shown;

[0013] Figure 3 A front view of a spindle assembly provided according to a specific embodiment of the present invention is shown;

[0014] Figure 4 A bottom view of a spindle assembly provided according to a specific embodiment of the present invention is shown;

[0015] Figure 5 A schematic diagram of a lip grinding mechanism according to a specific embodiment of the present invention is shown;

[0016] Figure 6 A schematic diagram of an inner and outer spherical polishing mechanism according to a specific embodiment of the present invention is shown;

[0017] Figure 7 A schematic diagram of the lifting mechanism of the polishing system according to a specific embodiment of the present invention is shown;

[0018] Figure 8 A schematic diagram of the translation mechanism of the polishing system according to a specific embodiment of the present invention is shown;

[0019] Figure 9 A front view of a lip-polished magnetic head according to a specific embodiment of the present invention is shown;

[0020] Figure 10 A bottom view of a lip-polished magnetic head according to a specific embodiment of the present invention is shown;

[0021] Figure 11 A schematic diagram of an inner spherical magnetic head structure according to a specific embodiment of the present invention is shown;

[0022] Figure 12 A schematic diagram of an outer spherical magnetic head structure according to a specific embodiment of the present invention is shown.

[0023] The above figures include the following reference numerals:

[0024] 10. Equipment base; 11. Housing; 12. Foot; 20. Cleanroom protection system; 30. Spindle assembly; 40. Measurement system; 41. R-axis sensor; 42. Horizontal arm; 43. Column; 50. Lip polishing mechanism; 51. Lip head; 52. Lip head drive motor; 53. Drive shaft system; 54. Lip grinding head translation motor; 55. X-adjustment translation slide; 56. Cam mechanism; 57. Linear guide rail; 60. Inner and outer spherical polishing mechanism; 61. Inner spherical head; 62. Outer spherical head; 63. Head drive servo motor; 64. XY slide; 70. Polishing system lifting mechanism and polishing system translation mechanism; 80. Magnetofluid circulation filtration system; 90. Control system. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0027] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0028] Theoretical analysis of the influence of surface morphology and roughness on key indicators such as the quality factor and frequency difference of a hemispherical resonator reveals that the surface morphology of the hemispherical resonator must be free of scratches and the roughness must meet a requirement of 10 nm. Furthermore, the resonator's performance is closely related to its mass uniformity, which significantly affects the frequency difference. Therefore, the wall thickness uniformity of the sphere should be better than 1 μm to keep the frequency difference below a threshold. Simultaneously, the lip, as the core structure of the capacitor for signal detection, must be flat, with perpendicularity and flatness better than 1 μm. Appropriate coating processes should be applied to improve the lip, resulting in a thicker film to ensure the continuity of the capacitor plates.

[0029] Based on this, the present invention proposes a hemispherical resonator polishing device, which includes: a base 10, an ultra-clean protection system 20, a spindle assembly 30, a measuring system 40, a lip polishing mechanism 50, an inner and outer spherical polishing mechanism 60, a polishing system lifting mechanism and a polishing system translation mechanism, and a magnetohydrodynamic circulation filtration system 80.

[0030] The equipment base 10 includes a housing 11 and a worktable. The worktable, spindle assembly 30, measuring system 40, lip polishing mechanism 50, inner and outer spherical polishing mechanism 60, grinding and polishing system lifting mechanism, grinding and polishing system translation mechanism and magnetic fluid circulation filtration system 80 are located inside the housing 11.

[0031] The ultra-clean protection system 20 is used to purify the working environment inside the enclosure 11;

[0032] The spindle assembly 30 is used to clamp the hemispherical resonator, thereby achieving the installation and positioning of the hemispherical resonator;

[0033] The measuring system 40 is located on the worktable and is used to measure the rotational radial runout and end face runout of the hemispherical harmonic oscillator clamped in the spindle assembly 30, as well as the inner and outer spherical parameters.

[0034] The lip polishing mechanism 50 is fixed on the lifting mechanism and the translation mechanism 70 of the polishing system. The lip polishing mechanism 50 is used to polish the lip.

[0035] The inner and outer spherical polishing mechanism 60 is rotatably connected to the lifting and translation mechanism of the polishing system. The inner and outer spherical polishing mechanism 60 uses the inner spherical magnetic head 61 and the outer spherical magnetic head 62 respectively to achieve magnetorheological spherical polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator.

[0036] The lifting mechanism and translation mechanism 70 of the polishing system are used to adjust the positions of the lip polishing mechanism 50 and the inner and outer spherical polishing mechanism 60.

[0037] The magnetorheological fluid circulation filtration system 80 is fixed on the worktable for continuous supply of magnetorheological polishing fluid.

[0038] This configuration provides a hemispherical resonator polishing device. The device ensures the clamping accuracy of the resonator through the joint cooperation of the spindle assembly 30 and the measurement system 40. The measurement system 40 can measure the parameters of the hemispherical resonator online. The lip polishing mechanism 50 and the inner and outer spherical polishing mechanism 60 can controllably realize the magnetorheological polishing of the spherical surface and lip of the hemispherical resonator, which greatly improves the roughness and surface quality of the hemispherical resonator.

[0039] As a specific embodiment of the present invention, the equipment base 10 is the outer frame of the machine. The configurable equipment base 10 also includes feet 12, and the outer box 11 of the equipment contacts the ground through the feet 12.

[0040] Furthermore, in this invention, the ultra-clean protection system 20 can be configured as a Class 100 ultra-clean working sealing cover, which is connected to the outer casing 11 of the equipment by fastening screws. The air inside the sealing cover is purified by a filter element, ensuring that the hemispherical resonator is in a Class 100 ultra-clean working environment during the magnetohydrodynamic polishing process, preventing dust from falling into the working environment, avoiding affecting the processing, and preventing the surface roughness of the hemispherical resonator from deteriorating.

[0041] Furthermore, in this invention, the measurement system 40 includes: an R-axis sensor 41, a horizontal arm 42, a column 43, and a probe. The probe and the R-axis sensor 41 are mounted on the front section of the horizontal arm 42. The horizontal arm 42 is connected to the column 43, and the column 43 is fixed on the worktable.

[0042] In a specific embodiment of the present invention, the column 43 can be a high-speed hybrid precision column, placed on a marble workbench, and after adjusting the angle with the marble surface using a level, it is secured with screws. The horizontal arm 42 can be a high-speed precision horizontal arm, connected to the high-speed hybrid precision column via a slide rail slider, and positioned using a high-precision, highly sensitive grating ruler. The R-axis sensor 41 can be clamped to the front end of the high-speed precision horizontal arm using a quick-release screw, and a ruby ​​probe is mounted at the end of the R-axis.

[0043] Furthermore, in this invention, the spindle assembly 30 includes an air-bearing spindle and a tooling fixture. The air-bearing spindle is connected to an air supply pipe below the worktable surface through a pre-drilled hole inside the worktable. The tooling fixture is responsible for clamping the workpiece (hemispherical resonator) and placing it in a pre-set position. The spindle assembly 30 is mainly responsible for ensuring that the repeatability of the hemispherical resonator installation is no more than 1 μm. It works together with the measurement system 40. The spindle assembly 30 is responsible for clamping the workpiece, achieving workpiece installation and positioning, and adjusting the turntable speed, the horizontal and vertical position of the workpiece, etc. The measurement system 40 is responsible for the workpiece self-alignment and leveling. The spindle assembly 30 and the measurement system 40 work together to ensure the clamping accuracy of the resonator. Moreover, the measurement system 40 can measure relevant parameters such as perpendicularity, flatness, coaxiality, and roundness after the polishing process without disassembling the resonator, and continuously adjust the process according to the parameter accuracy requirements to improve polishing efficiency.

[0044] Furthermore, in this invention, the lip polishing mechanism 50 includes a lip head 51, a lip head drive motor 52, a drive shaft system 53, a lip grinding head translation motor 54, an X-adjustment translation slide 55, a cam mechanism 56, and a miniature precision linear guide 57. The lip grinding head's grinding motion is driven by the lip head drive motor 52, and the lip grinding head translation motor 54 drives the lip grinding head to reciprocate along a linear feed path.

[0045] As a specific embodiment of the present invention, the entire lip polishing mechanism 50 can be connected to the polishing system lifting mechanism and polishing system translation mechanism 70 by screws.

[0046] Furthermore, in this invention, the inner and outer spherical polishing mechanism 60 includes an inner spherical magnetic head 61, an outer spherical magnetic head 62, a spherical shaft, a magnetic head drive servo motor 63, and an XY precision slide 64. The spherical pendulum shaft is driven by the servo motor to move up and down. The spherical pendulum shaft swings around the center of the sphere, working together with the main shaft assembly 30 to complete the spherical surface development. The magnetic head mechanism is mounted on the spherical pendulum shaft and swings with the shaft. The magnetic head mechanism includes a magnetic head drive servo motor 63, an inner spherical magnetic head 61, and an outer spherical magnetic head 62. The inner and outer magnetic heads are respectively mounted on their corresponding magnetic head servo motors and rotate at high speed, driving the magnetorheological polishing fluid to sweep across the surface of the hemispherical harmonic oscillator, forming a magnetorheological ribbon to complete the magnetorheological spherical polishing.

[0047] As a specific embodiment of the present invention, the inner and outer spherical polishing mechanism 60 can be connected to the polishing system lifting mechanism and polishing system translation mechanism 70 through cross roller bearings.

[0048] Furthermore, in this invention, the lifting mechanism and the translation mechanism of the polishing system include a linear guide rail, a grating ruler, and a lifting and translation servo motor. The grating ruler is directly fixed on the linear guide rail by a mounting bracket, and the servo motor and the linear guide rail are connected together by a coupling.

[0049] In a specific embodiment of the present invention, the lifting mechanism and the translation mechanism of the polishing system are fastened to the worktable with screws. The lifting and translation mechanism uses a grating ruler to ensure the accuracy of the lifting position.

[0050] Furthermore, in this invention, the magnetorheological fluid circulation filtration system 80 extracts the magnetorheological fluid from the storage tank through pipelines and transports it above the workpiece, and then draws it back through the recovery pipelines and places it in the storage tank through a filter screen, thus completing the continuous supply of magnetorheological polishing fluid.

[0051] As a specific embodiment of the present invention, the magnetofluid circulating filtration system 80 is similar to the air-bearing spindle and is fixed to the worktable by screws.

[0052] Furthermore, in this invention, the hemispherical resonator polishing device also includes a cleaning and drying system, which is connected to the polishing system lifting mechanism and the polishing system translation mechanism, and is used for cleaning the hemispherical resonator on the spindle after polishing to prevent changes in accuracy after secondary mounting.

[0053] As a specific embodiment of the present invention, the cleaning and drying system can be connected to the polishing system via a universal bamboo-joint tube.

[0054] Furthermore, in this invention, the hemispherical harmonic oscillator polishing device also includes a control system 90, which is connected to the housing 11 and is used to set the parameters of the spindle assembly 30, the lip polishing mechanism 50 and the inner and outer spherical polishing mechanism 60, and to collect, analyze and process data to finally generate a processing report.

[0055] As a specific embodiment of the present invention, the control system 90 may be connected to the housing 11 of the equipment base 10 via a rotating robotic arm.

[0056] The hemispherical resonator polishing device of the present invention can measure parameters such as the perpendicularity of the resonator lip, flatness, coaxiality of the inner and outer spherical surfaces, and roundness online. It can complete the relevant parameter measurement without disassembling the resonator after completing one process step, and can repeat the polishing process if the relevant accuracy requirements are not met, thereby reducing the positioning error caused by repeatedly clamping the resonator.

[0057] According to another aspect of the present invention, a method for polishing a hemispherical harmonic oscillator is provided, wherein the method employs the hemispherical harmonic oscillator polishing apparatus described above to achieve magnetorheological polishing of the spherical surface and lip of the hemispherical harmonic oscillator.

[0058] In this invention, the hemispherical harmonic oscillator polishing method includes a hemispherical harmonic oscillator lip polishing step and a spherical surface polishing step. Specifically, the hemispherical harmonic oscillator lip polishing step includes:

[0059] 1) Assemble the hemispherical resonator onto the hemispherical resonator fixture on the spindle of the cylindricity tester;

[0060] 2) Move the R-axis of the cylindricity gauge to the vicinity of the oscillator support column and adjust the center and level of the resonator;

[0061] 3) Measure the raw data such as the roundness, coaxiality, flatness and perpendicularity of the inner and outer spherical surfaces of the harmonic oscillator;

[0062] 4) Return the Z-axis and R-axis of the cylindricity gauge to their safe positions;

[0063] 5) In manual mode, operate the inner and outer spherical polishing mechanism to move the magnetic head to the lip edge processing position;

[0064] 6) Adjust the slide table in the Z-axis direction of the end face polishing mechanical module so that the grinding head of the end face flat grinding just contacts the lip edge end face. Use the directional slide table to adjust the distance between the grinding head and the lip edge to set the pre-pressure.

[0065] 7) Adjust the inlet and outlet pipes of the pump system. The short pipe is the magnetorheological fluid outlet pipe, which is placed above the oscillator parts to supply magnetorheological fluid to the polishing device. The long pipe is the magnetorheological fluid return pipe, which is placed above the main shaft and at the bottom of the resonator to pump the magnetorheological fluid at the bottom of the turntable back into the pump system, forming a closed loop.

[0066] 8) In the parameter settings of the control system operation interface, set the processing time, grinding head speed direction, pump system flow rate, and delay system;

[0067] 9) In lip edge mode, start the automatic polishing program;

[0068] 10) After polishing, adjust the directional slide in the end face module to move the grinding head away from the lip of the harmonic oscillator;

[0069] 11) In manual mode, restore the Z-axis to the safe position, remove the magnetic powder particles adsorbed on the grinding head, and adjust the Y-axis to restore the polishing equipment to the safe position;

[0070] 12) In manual mode, run pump number two separately to pump the magnetorheological fluid remaining in the turntable back into the pump system.

[0071] 13) Adjust the manual valve in the pump system to the cleaning position;

[0072] 14) In lip edge mode, the cleaning module in the operating system rinses the polished resonator.

[0073] 15) In manual mode, run pump number two separately to pump the remaining cleaning solution in the turntable into the waste liquid container; 16) Move the drying lamp above the resonator to dry the surface of the resonator.

[0074] 17) After machining is completed, ensure that the spindle stops rotating and run the measurement program in the measurement system to start measuring flatness and perpendicularity.

[0075] In this invention, the spherical polishing step of the hemispherical harmonic oscillator specifically includes:

[0076] 1) In manual mode, operate the polishing equipment and move the magnetic head to the spherical processing position;

[0077] 2) Adjust the swing angle slide of the outer spherical surface in the spherical polishing mechanical module so that the end face of the outer magnetic head motor is parallel to the end face of the rotating slide. Adjust the XY slide on the rotating slide so that the outer magnetic head slowly approaches the outer spherical surface of the vibrator. After contact, the slide moves back 0.5mm in the X direction. In handwheel mode, turn the handwheel switch to 4-axis and rotate the handwheel rocker. If the outer magnetic head does not interfere with the spherical surface of the vibrator, the outer spherical surface adjustment is complete.

[0078] 3) When the end face of the inner magnetic head motor is adjusted to be parallel to the table surface, adjust the XY slide connected to the inner magnetic head so that when the inner magnetic head contacts the spherical surface, the slide moves back 0.5mm in the X direction. In handwheel mode, turn the handwheel switch to 4-axis and rotate the handwheel rocker. If the inner magnetic head does not interfere with the spherical surface of the vibrator, the inner spherical surface adjustment is complete.

[0079] 4) Adjust the inlet and outlet pipes of the pump system. The short pipe is the magnetorheological fluid outlet pipe, which should be placed above the oscillator parts to supply magnetorheological fluid to the polishing system. The long pipe is the magnetorheological fluid return pipe, which is placed above the main shaft and at the bottom of the resonator to pump the magnetorheological fluid at the bottom of the turntable back into the pump system to form a closed loop.

[0080] 5) In the parameter settings of the operation interface, set the processing time, grinding head rotation speed and direction, pump system flow rate, and delay system;

[0081] 6) In spherical mode, start the automatic polishing program;

[0082] 7) After polishing, in manual mode, when the end face of the inner magnetic head motor is parallel to the marble platform, adjust the XY slide of the inner spherical surface to move the inner magnetic head away from the oscillator spherical surface. Ensure that the 4-axis swing does not affect the oscillator in handwheel mode. Similarly, in handwheel mode, move the outer magnetic head away from the oscillator spherical surface.

[0083] 8) In manual mode, return the Z-axis to the safe position to remove the magnetic powder particles adsorbed on the grinding head, and adjust the Y-axis to return the polishing equipment to the safe position;

[0084] 9) In manual mode, run pump number two separately to pump the residual magnetorheological fluid in the turntable back into the pump system;

[0085] 10) Adjust the manual valve in the pump system to the cleaning position;

[0086] 11) In spherical mode, the cleaning module in the operating system rinses the polished resonator;

[0087] 12) In manual mode, run pump number two separately to pump the remaining cleaning solution in the turntable into the waste liquid container; 13) Move the drying lamp above the resonator to dry the surface of the resonator.

[0088] The hemispherical resonator polishing method of this invention increases the magnetic field strength by increasing the volume of the magnetorheological fluid between the magnetic head and the lip, thus changing point-contact or line-contact polishing to non-contact polishing. This avoids the oscillator breaking due to contact between the tool and the hemispherical resonator during polishing and improves the surface roughness of the resonator. Furthermore, the magnetic head structure is simple; the distance between the magnetic head and the lip of the resonator is adjustable, allowing for controllable lip polishing. By using a permanent magnet magnetic head and an external magnetic field to control the magnetorheological fluid, a flexible "polishing mold" conforming to the surface being processed is generated in the polishing area. This removes material and improves the surface finish of the resonator. The magnetic head used for spherical polishing can improve the surface roughness of the resonator to 10 nm, building upon existing technologies.

[0089] The hemispherical resonator polishing method of the present invention can measure parameters such as the resonator's perpendicularity, flatness, coaxiality of the inner and outer spherical surfaces, and roundness online. It can measure the relevant parameters of the resonator after completing one polishing process, and can repeat the polishing process if the relevant accuracy is not achieved, thereby reducing the positioning error caused by repeated disassembly and assembly of the resonator.

[0090] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A polishing device for a hemispherical harmonic oscillator, characterized in that, The hemispherical harmonic oscillator polishing device includes: a base (10), an ultra-clean protection system (20), a spindle assembly (30), a measuring system (40), a lip polishing mechanism (50), an inner and outer spherical polishing mechanism (60), a polishing system lifting mechanism and a polishing system translation mechanism, and a magnetic fluid circulation filtration system (80). The equipment base (10) includes a housing (11) and a worktable. The worktable, spindle assembly (30), measuring system (40), lip polishing mechanism (50), inner and outer spherical polishing mechanism (60), grinding and polishing system lifting mechanism, grinding and polishing system translation mechanism and magnetic fluid circulation filtration system (80) are located inside the housing (11). The ultra-clean protection system (20) is used to purify the working environment inside the enclosure (11); The spindle assembly (30) is used to clamp the hemispherical resonator to achieve the installation and positioning of the hemispherical resonator; The measuring system (40) is located on the worktable and is used to measure the rotational radial runout and end face runout of the hemispherical harmonic oscillator clamped in the spindle assembly (30), as well as the inner and outer spherical parameters. The lip polishing mechanism (50) is fixed on the lifting mechanism and the translation mechanism (70) of the polishing system. The lip polishing mechanism (50) is used to polish the lip. The inner and outer spherical polishing mechanism (60) is rotatably connected to the lifting and translation mechanism of the polishing system. The inner and outer spherical polishing mechanism (60) uses the inner spherical magnetic head (61) and the outer spherical magnetic head (62) respectively to achieve magnetorheological spherical polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator. The lifting mechanism and translation mechanism (70) of the polishing system are used to adjust the position of the lip polishing mechanism (50) and the inner and outer spherical polishing mechanism (60); The magnetorheological fluid circulation filtration system (80) is fixed on the worktable for continuous supply of magnetorheological polishing fluid.

2. The hemispherical harmonic oscillator polishing device according to claim 1, characterized in that, The measurement system (40) includes: an R-axis sensor (41), a horizontal arm (42), a column (43) and a probe. The probe and the R-axis sensor (41) are installed at the front of the horizontal arm (42). The horizontal arm (42) is connected to the column (43), and the column (43) is fixed on the worktable.

3. The hemispherical harmonic oscillator polishing device according to claim 1, characterized in that, The spindle assembly (30) includes an air-bearing spindle and a tooling fixture. The air-bearing spindle is connected to the air supply line under the worktable through a pre-reserved hole inside the worktable. The tooling fixture is responsible for clamping the hemispherical resonator and placing it in a pre-set position.

4. The hemispherical harmonic oscillator polishing device according to claim 1, characterized in that, The lip polishing mechanism (50) includes a lip head (51), a lip head drive motor (52), a drive shaft system (53), a lip grinding head translation motor (54), an X-adjustment translation slide (55), a cam mechanism (56), and a miniature precision linear guide (57). The lip grinding head grinding motion is driven by the lip head drive motor (52), and the lip grinding head translation motor (54) drives the lip grinding head to reciprocate along a linear feed.

5. The hemispherical harmonic oscillator polishing device according to claim 1, characterized in that, The inner and outer spherical polishing mechanism (60) includes an inner spherical magnetic head (61), an outer spherical magnetic head (62), a spherical shaft, a magnetic head drive servo motor (63), and an XY precision slide (64); the spherical swing shaft is driven by the servo motor to move up and down; the spherical swing shaft swings around the center of the sphere and together with the main shaft assembly (30) completes the spherical development; the magnetic head mechanism is installed on the spherical swing shaft and swings with the swing shaft; the magnetic head mechanism includes a magnetic head drive servo motor (63), an inner spherical magnetic head (61), and an outer spherical magnetic head (62). The inner and outer magnetic heads are respectively installed on the corresponding magnetic head servo motors and rotate at high speed, driving the magnetorheological polishing liquid to sweep across the spherical surface of the hemispherical harmonic oscillator, forming a magnetorheological ribbon to complete the magnetorheological spherical polishing.

6. The hemispherical harmonic oscillator polishing apparatus according to claim 1, characterized in that, The inner and outer spherical polishing mechanism (60) is connected to the polishing system lifting mechanism and polishing system translation mechanism (70) via cross roller bearings.

7. The hemispherical harmonic oscillator polishing apparatus according to claim 1, characterized in that, The hoisting mechanism and translation mechanism of the polishing system include a linear guide rail, a grating ruler, and a hoisting and translation servo motor. The grating ruler is directly fixed to the linear guide rail by a mounting bracket, and the servo motor and the linear guide rail are connected by a coupling.

8. The hemispherical harmonic oscillator polishing apparatus according to claim 1, characterized in that, The hemispherical resonator polishing device also includes a control system (90), which is connected to the housing (11) for setting the parameters of the spindle assembly (30), the lip polishing mechanism (50) and the inner and outer spherical polishing mechanism (60), and for collecting, analyzing and processing data.

9. A method for polishing a hemispherical harmonic oscillator, characterized in that, The hemispherical harmonic oscillator polishing method uses the hemispherical harmonic oscillator polishing device as described in any one of claims 1 to 8 to achieve magnetorheological polishing of the spherical surface of the hemispherical harmonic oscillator, and specifically includes the following steps: 1) In manual mode, operate the polishing equipment and move the magnetic head to the spherical processing position; 2) Adjust the swing angle slide of the outer spherical surface in the spherical polishing mechanical module so that the end face of the outer magnetic head motor is parallel to the end face of the rotating slide. Adjust the XY slide on the rotating slide so that the outer magnetic head slowly approaches the outer spherical surface of the vibrator. After contact, the slide moves back 0.5mm in the X direction. In handwheel mode, turn the handwheel switch to 4-axis and rotate the handwheel rocker. If the outer magnetic head does not interfere with the spherical surface of the vibrator, the outer spherical surface adjustment is complete. 3) When the end face of the inner magnetic head motor is adjusted to be parallel to the table surface, adjust the XY slide connected to the inner magnetic head so that when the inner magnetic head contacts the spherical surface, the slide moves back 0.5mm in the X direction. In handwheel mode, turn the handwheel switch to 4-axis and rotate the handwheel rocker. If the inner magnetic head does not interfere with the spherical surface of the vibrator, the inner spherical surface adjustment is complete. 4) Adjust the inlet and outlet pipes of the pump system. The short pipe is the magnetorheological fluid outlet pipe, which is placed above the oscillator parts to provide magnetorheological fluid to the polishing system. The long pipe is the magnetorheological fluid return pipe, which is placed above the main shaft and at the bottom of the resonator to pump the magnetorheological fluid at the bottom of the turntable back into the pump system, forming a closed loop. 5) In the parameter settings of the operation interface, set the processing time, grinding head rotation speed and direction, pump system flow rate, and delay system; 6) In spherical mode, start the automatic polishing program; 7) After polishing, in manual mode, when the end face of the inner magnetic head motor is parallel to the marble platform, adjust the XY slide of the inner spherical surface to move the inner magnetic head away from the oscillator spherical surface. Ensure that the 4-axis swing does not affect the oscillator in handwheel mode. Similarly, in handwheel mode, move the outer magnetic head away from the oscillator spherical surface. 8) In manual mode, return the Z-axis to the safe position to remove the magnetic powder particles adsorbed on the grinding head, and adjust the Y-axis to return the polishing equipment to the safe position; 9) In manual mode, run pump number two separately to pump the residual magnetorheological fluid in the turntable back into the pump system; 10) Adjust the manual valve in the pump system to the cleaning position; 11) In spherical mode, the cleaning module in the operating system rinses the polished resonator; 12) In manual mode, run pump number two separately to pump the remaining cleaning solution in the turntable into the waste liquid container. 13) Move the drying lamp above the resonator to dry the surface of the resonator.

10. A method for polishing a hemispherical harmonic oscillator, characterized in that, The hemispherical harmonic oscillator polishing method uses the hemispherical harmonic oscillator polishing device as described in any one of claims 1 to 8 to achieve magnetorheological polishing of the lip of the hemispherical harmonic oscillator, and specifically includes the following steps: 1) Assemble the hemispherical resonator onto the hemispherical resonator fixture on the spindle of the cylindricity tester; 2) Move the R-axis of the cylindricity gauge to the vicinity of the oscillator support column and adjust the center and level of the resonator; 3) Measure the original data of roundness, coaxiality, flatness and perpendicularity of the inner and outer spherical surfaces of the harmonic oscillator; 4) Return the Z-axis and R-axis of the cylindricity gauge to their safe positions; 5) In manual mode, operate the inner and outer spherical polishing mechanism to move the magnetic head to the lip edge processing position; 6) Adjust the slide table in the Z-axis direction of the end face polishing mechanical module so that the grinding head of the end face flat grinding just contacts the lip edge end face. Use the directional slide table to adjust the distance between the grinding head and the lip edge to set the pre-pressure. 7) Adjust the inlet and outlet pipes of the pump system. The short pipe is the magnetorheological fluid outlet pipe, which is placed above the oscillator parts to supply magnetorheological fluid to the polishing device. The long pipe is the magnetorheological fluid return pipe, which is placed above the main shaft and at the bottom of the resonator to pump the magnetorheological fluid at the bottom of the turntable back into the pump system, forming a closed loop. 8) In the parameter settings of the control system operation interface, set the processing time, grinding head speed direction, pump system flow rate, and delay system; 9) In lip edge mode, start the automatic polishing program; 10) After polishing, adjust the directional slide in the end face module to move the grinding head away from the lip of the harmonic oscillator; 11) In manual mode, restore the Z-axis to the safe position, remove the magnetic powder particles adsorbed on the grinding head, and adjust the Y-axis to restore the polishing equipment to the safe position; 12) In manual mode, run pump number two separately to pump the magnetorheological fluid remaining in the turntable back into the pump system. 13) Adjust the manual valve in the pump system to the cleaning position; 14) In lip edge mode, the cleaning module in the operating system rinses the polished resonator. 15) In manual mode, run pump number two separately to pump the remaining cleaning solution in the turntable into the waste liquid container. 16) Move the drying lamp above the resonator to dry the surface of the resonator; 17) After machining is completed, ensure that the spindle stops rotating, run the measurement program in the measurement system, and measure the flatness and perpendicularity.

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