Dual-optical-path detection device and method for optical element gluing

Abstract

The invention discloses a dual-optical-path detection device and method for optical element gluing. The dual-optical-path detection device comprises a common objective lens, a beam splitter prism, a collimation module and a microscopic module. The common objective lens receives an optical signal of the detected glued optical element and has a bidirectional imaging capability; the beam splitter prism splits an optical signal into two different optical paths; the collimation module receives the first path of optical signal, converges the parallel light reflected by the plane, and detects space information; and the microscopic module receives the second path of optical signal, converts the spherical wave reflected by the spherical surface into parallel light, converges the parallel light, amplifies the parallel light for imaging, and detects translation position information. According to the invention, the integration of a collimation detection system and a microscopic detection system is realized through the bidirectional imaging capability of the common objective lens, the spatial position information and the translation position information of the detected glued optical element can be synchronously obtained, and the production efficiency and the data consistency are improved; the problem that detection needs to be switched among multiple sets of devices during production adjustment in a traditional method is solved.

Description

Technical Field

[0001] This invention relates to the field of optical inspection technology, and more specifically to a dual-optical-path inspection device and method for bonding optical components. Background Technology

[0002] Cemented optical elements are composite optical elements made by bonding two or more optical elements together with optical adhesives. They are widely used in optical instruments such as camera lenses, telescopes, and microscopes. During the production of cemented optical elements, it is necessary to accurately detect the spatial position (such as tilt angle and spatial orientation) and translational position (such as positional changes) of the optical elements to ensure that the product quality meets design requirements.

[0003] Currently, spatial position detection and translational position detection of cemented optical elements typically require two separate systems: a collimation system for detecting spatial position information and a microscopic system for detecting translational position information.

[0004] However, existing technologies have the following drawbacks:

[0005] First, the two testing systems operate independently, requiring gluing production personnel to switch between different devices, resulting in a cumbersome and inefficient production process. Furthermore, synchronous testing is impossible, making it difficult to guarantee data consistency.

[0006] Secondly, traditional objectives can usually only achieve high-quality imaging in one direction. The collimation system and the microscope system must be equipped with dedicated objectives, which cannot be shared, increasing the cost of the device and the complexity of the system.

[0007] Therefore, there is an urgent need in the existing technology for a dual-path optical element bonding device that can simultaneously detect the spatial position information and translational position information of the bonded optical element. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a dual-optical-path detection device and method for bonding optical components. Through innovative optical system design, it achieves synchronous detection of spatial position information and translational position information.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] This invention provides a dual-optical-path detection device for bonding optical components, comprising:

[0011] It shares an objective lens, a beam splitter, a first optical signal processing component, and a second optical signal processing component;

[0012] The shared objective lens is used to receive the light signal reflected back from the optical element to be cemented;

[0013] The beam splitter is optically connected to the common objective lens and is used to split the optical signal received by the common objective lens into an independent first optical signal and a second optical signal to achieve dual-optical-path comparison detection.

[0014] The first optical signal processing component is optically connected to the beam splitter prism and is used to receive the first optical signal and detect the first type of position parameters of the optical element to be bonded.

[0015] The second optical signal processing component is optically connected to the beam splitter prism and is used to receive the second optical signal and detect the second type of position parameters of the optical element to be bonded.

[0016] The first light processing component includes a collimating eyepiece, a reticle, and a first imaging unit connected in sequence. The first imaging unit is used to receive the first light signal processed by the collimating eyepiece and the reticle.

[0017] The first imaging unit is a CCD imaging unit.

[0018] The second optical processing component includes a tube mirror and a second imaging unit connected in sequence. The second imaging unit is used to receive a second optical signal processed by the tube mirror.

[0019] The second imaging unit is a micro-CCD imaging unit.

[0020] The first type of positional parameter is the spatial positional information of the optical element to be bonded, including three-dimensional coordinate information and / or tilt angle information; the second type of positional parameter is the translational positional information of the optical element to be bonded, including translational deviation information in the XY plane.

[0021] The present invention also provides a detection method for a dual-optical-path detection device, comprising the following steps:

[0022] S1: Place the cemented optical element to be tested on the object side of the common objective lens;

[0023] S2: Receive the light signal reflected by the cemented optical element under test through the shared objective lens;

[0024] S3: The optical signal is split into the collimation module and the microscope module by the beam splitter;

[0025] S4: The spatial position information of the cemented optical element under test is obtained through the collimation module, and the translational position information of the cemented optical element under test is obtained through the microscopy module.

[0026] S5: Synchronously outputs spatial position information and translation position information to complete integrated detection;

[0027] The spatial position information includes the tilt angle and spatial orientation of the bonded optical element under test, and the translational position information includes the positional changes on the surface of the bonded optical element under test.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] (1) Achieve synchronous detection: Through the integrated optical system design, the present invention integrates the collimation module and the microscopic module into the same device, which can simultaneously acquire the spatial position information and translation position information of the cemented optical element, greatly simplifying the detection process and improving the detection efficiency.

[0030] (2) Solving the objective lens compatibility problem: The shared objective lens of the present invention has bidirectional imaging capability and can simultaneously adapt to the optical path requirements of the collimation module and the microscopic module, realizing objective lens sharing, reducing device cost and simplifying system structure. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of a dual-optical-path detection device for bonding optical components according to an embodiment of this application. Detailed Implementation

[0032] The present application will be further described in detail below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention, but the embodiments described are not intended to limit the present invention.

[0033] Example: Figure 1 As shown, a dual-optical-path detection device for bonding optical components is disclosed. This device can simultaneously acquire the spatial position information and translational position information of the optical components to be bonded.

[0034] In this embodiment, the dual-optical-path detection device mainly includes a common objective lens 1, a beam splitter prism 2, a first optical signal processing component, and a second optical signal processing component.

[0035] A common objective lens 1 is positioned on the object side of the cemented optical element (not shown) under test to receive the light signal reflected from the surface of the optical element. This common objective lens 1 has low aberration characteristics, ensuring high-quality collection of the reflected light signal. Preferably, the common objective lens 1 employs an infinity-corrected optical system to ensure good matching with subsequent optical elements.

[0036] Beam splitter 2 is coaxially optically connected to common objective lens 1 and is located near the image-side focal plane of common objective lens 1. Beam splitter 2 is a cubic beam splitter or a flat beam splitter with a 50:50 beam splitting ratio, used to proportionally split the reflected light signal received by common objective lens 1 into two independent optical signals: a first optical signal L1 and a second optical signal L2. The first optical signal L1 is transmitted along the first optical axis to the first optical signal processing component, and the second optical signal L2 is transmitted along the second optical axis to the second optical signal processing component, thereby achieving parallel detection of dual optical paths.

[0037] The first optical signal processing component is used to detect a first type of position parameter of the optical element to be bonded, namely spatial position information, including three-dimensional coordinate information (X, Y, Z) and / or tilt angle information (tilt angle around the X-axis and Y-axis). The first optical signal processing component includes a collimating eyepiece 31, a reticle 32 and a first imaging unit 33 connected in sequence.

[0038] Collimating eyepiece 31 is used to collimate the first optical signal L1 into a parallel beam;

[0039] The reticle 32 is provided with precision engraving lines or cross-shaped reference marks, which are used to superimpose with the reflected image to facilitate the recognition of relative pose by subsequent image processing algorithms.

[0040] The first imaging unit 33 is a CCD imaging unit used to receive the first optical signal processed by the collimating eyepiece 31 and the reticle 32, and convert it into a digital image signal for output to the image processing system. By analyzing the relative positional relationship between the reference mark and the reflected image of the optical element in the image, the three-dimensional orientation and tilt angle of the optical element to be bonded in space can be calculated.

[0041] The second optical signal processing component is used to detect the second type of position parameters of the optical element to be bonded, namely translational position information, mainly referring to translational deviation information in the XY plane. The second optical signal processing component includes a tube lens 41 and a second imaging unit 42 that are optically connected in sequence.

[0042] The tube lens 41 is used to image and amplify the second optical signal L2, and its focal length is set according to the detection resolution requirements.

[0043] The second imaging unit 42 is a microscopic CCD imaging unit with high pixel density and high sensitivity, suitable for micrometer-level displacement detection. By acquiring high-resolution images of local areas on the surface of the optical element and processing them with cross-correlation or edge matching algorithms with a reference image, translational deviations in the XY directions can be accurately extracted.

[0044] In this embodiment, the first type of position parameter and the second type of position parameter reflect the state of the optical element to be bonded in two dimensions: macroscopic spatial attitude and microscopic local position. The two complement each other and together constitute a complete evaluation basis for bonding alignment.

[0045] Furthermore, the present invention also provides a detection method based on the above-mentioned dual-optical-path detection device, specifically including the following steps:

[0046] S1: Place the cemented optical element to be tested 5 within the object-side working distance range of the common objective lens 1 to ensure that its surface is within the effective field of view and depth of field of the common objective lens 1;

[0047] S2: Turn on the illumination source (which can be a ring LED or coaxial illumination) to allow light to shine on the surface of the cemented optical element under test and reflect back to the common objective lens 1;

[0048] S3: The reflected light is converged by the common objective lens 1 and then incident on the beam splitter prism 2. The beam splitter prism 2 splits the light signal into the first optical signal L1 and the second optical signal L2, which are transmitted to the first optical signal processing component and the second optical signal processing component, respectively.

[0049] S4: The CCD imaging unit 33 in the first optical signal processing component acquires a composite image containing the reticle reference mark and the reflected image of the optical element, and calculates the spatial position information of the optical element, including the height in the Z direction and the tilt angle around the X / Y axis, through the image processing algorithm.

[0050] The microscopic CCD imaging unit 42 in the second optical signal processing component acquires high-magnification images of local areas of optical elements and obtains translational deviations in the XY plane through displacement detection algorithms (such as phase correlation method or template matching).

[0051] S5: Output the two types of position information simultaneously to complete the integrated position parameter detection of the optical components to be bonded. The detection results can be used to determine whether the current bonding alignment meets the process requirements, or as a basis for subsequent adjustments.

[0052] In summary, this invention constructs a dual-optical-path architecture by sharing an objective lens and a beam splitter prism, and respectively configures optical signal processing components suitable for macroscopic attitude detection and microscopic displacement detection. This enables synchronous, efficient, and high-precision detection of multidimensional position parameters of the optical elements to be bonded, significantly improving the precision control capability and production efficiency of the optical bonding process.

[0053] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A dual-optical-path detection device for bonding optical components, characterized in that, include: It shares an objective lens, a beam splitter, a first optical signal processing component, and a second optical signal processing component; The shared objective lens is used to receive the light signal reflected back from the optical element to be cemented; The beam splitter is optically connected to the common objective lens and is used to split the optical signal received by the common objective lens into an independent first optical signal and a second optical signal to achieve dual-optical-path comparison detection. The first optical signal processing component is optically connected to the beam splitter prism and is used to receive the first optical signal and detect the first type of position parameters of the optical element to be bonded. The second optical signal processing component is optically connected to the beam splitter prism and is used to receive the second optical signal and detect the second type of position parameters of the optical element to be bonded.

2. The dual-optical-path detection device for bonding optical components according to claim 1, characterized in that, The first light processing component includes a collimating eyepiece, a reticle, and a first imaging unit connected in sequence. The first imaging unit is used to receive the first light signal processed by the collimating eyepiece and the reticle.

3. The dual-optical-path detection device for bonding optical components according to claim 2, characterized in that, The first imaging unit is a CCD imaging unit.

4. The dual-optical-path detection device for bonding optical components according to claim 1, characterized in that, The second optical processing component includes a tube mirror and a second imaging unit connected in sequence. The second imaging unit is used to receive a second optical signal processed by the tube mirror.

5. A dual-optical-path detection device for bonding optical components according to claim 4, characterized in that, The second imaging unit is a micro-CCD imaging unit.

6. The dual-optical-path detection device for bonding optical components according to claim 1, characterized in that, The first type of positional parameter is the spatial positional information of the optical element to be bonded, including three-dimensional coordinate information and / or tilt angle information; the second type of positional parameter is the translational positional information of the optical element to be bonded, including translational deviation information in the XY plane.

7. The detection method of a dual-optical-path detection device for bonding optical components according to any one of claims 1-6, characterized in that: Includes the following steps: S1: Place the cemented optical element to be tested on the object side of the common objective lens; S2: Receive the light signal reflected by the cemented optical element under test through the shared objective lens; S3: The optical signal is split into the collimation module and the microscopic module by the beam splitter; S4: The spatial position information of the cemented optical element under test is obtained through the collimation module, and the translational position information of the cemented optical element under test is obtained through the microscopy module. S5: Synchronously outputs spatial position information and translation position information to complete integrated detection; The spatial position information includes the tilt angle and spatial orientation of the bonded optical element under test, and the translational position information includes the positional changes on the surface of the bonded optical element under test.

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