Laser direct writing imaging system and method based on OIS array

Abstract

The embodiment of the invention provides a laser direct-writing imaging system and method based on an OIS array, which are used for realizing laser direct-writing imaging of an uneven exposure surface and improving the precision of laser direct-writing imaging. The method comprises the following steps: acquiring 3D surface topography model data of a substrate, and generating Z-axis target coordinates of each photoetching head at each position on a scanning path; according to the arrangement of the OIS array, generating X and Y installation reference coordinates of each moving magnet type OIS unit as an initial position reference origin of each photoetching head; before constant-speed scanning exposure, acquiring corresponding X and Y parasitic offsets of each moving-magnetic OIS unit in a Z-axis focus tracking stroke, and solidifying the X and Y parasitic offsets into a three-dimensional position look-up table to be stored in a local edge computing node; and entering a high-speed constant-speed scanning exposure stage, controlling the edge computing nodes connected with the moving magnetic OIS units to compute in real time and reversely apply compensation electric signals on the X / Y axis to offset parasitic offset according to the physical coordinates, and controlling the laser light source to expose the position of the exposure point.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, and in particular to a laser direct-write imaging system and method based on an OIS array. Background Technology

[0002] Laser direct writing imaging devices in related technologies (such as the laser direct plate-making device for planar screen printing plates disclosed in application number: 201310084860.3) control the laser array to scan the photosensitive coating on the exposure surface back and forth in a preset horizontal direction in the plane containing the X and Y axes.

[0003] The applicant discovered that in the relevant technology, the distance between each laser in the laser array and the vertical direction of the exposure surface is fixed. If the exposure surface is uneven, or the exposure surface itself is uneven, the size of the light spot on the exposure surface will change due to the change in object distance, resulting in a loss of exposure accuracy. Alternatively, existing laser direct writing imaging equipment cannot be used for exposure imaging on uneven exposure surfaces at all. Summary of the Invention

[0004] This invention provides a laser direct-write imaging system and method based on an OIS array, which is used to realize laser direct-write imaging of uneven exposure surfaces and improve the accuracy of laser direct-write imaging.

[0005] The first aspect of this invention provides a laser direct-write imaging system based on an OIS array, which may include:

[0006] The OIS array comprises multiple arrayed moving magnet OIS units, which can adjust the position of the focusing lens of the laser source in mutually perpendicular X, Y, and Z axis directions.

[0007] A distributed edge computing module containing multiple edge computing nodes; each moving magnet OIS unit or each group of OIS units is connected to a configured independent edge computing node;

[0008] The edge computing node is configured to: receive the Z-axis target coordinates and X and Y mounting reference coordinates from the host computer; during the uniform scanning exposure phase, based on the physical coordinates of the current moving magnet OIS unit, query the locally stored three-dimensional position lookup table in real time. The three-dimensional position lookup table stores the X and Y parasitic offsets corresponding to the exposure point positions of the moving magnet OIS unit at various depths along the Z-axis; and, based on the query results and the X and Y mounting reference coordinates, calculate and control the injection of reverse compensation drive signals into the X and Y axes of the moving magnet OIS unit, and control the laser source to expose the position of the exposure point.

[0009] Optionally, as a possible implementation, the laser direct-write imaging system based on an OIS array in this embodiment of the invention may further include: a host computer, which is configured to:

[0010] Before uniform scanning exposure, acquire 3D surface morphology model data of the substrate;

[0011] Based on the 3D surface morphology model data, the Z-axis target coordinates of each lithography head at each position on the scanning path are generated;

[0012] Based on the physical layout of the OIS array, the X and Y mounting reference coordinates of each moving magnet OIS unit are generated, which serve as the initial position reference origin for each moving magnet OIS unit.

[0013] Optionally, as a possible implementation, in this embodiment of the invention, a composite anti-magnetic isolation structure is provided between adjacent units of the OIS array. The composite anti-magnetic isolation structure includes a rigid non-magnetic limiting layer and a high magnetic permeability layer. The rigid non-magnetic limiting layer is used to construct a physical air gap space with gaps to avoid hard adsorption of the mover. The high magnetic permeability layer is used to block magnetic line crosstalk between adjacent motors.

[0014] Optionally, as a possible implementation, in this embodiment of the invention, the high magnetic permeability layer is a permalloy layer, and the composite antimagnetic isolation structure is arranged in a stepped composite shielding grid.

[0015] Optionally, as a possible implementation, this embodiment of the invention also includes a thermal drift water-cooled base integrated into the bottom of the system; the thermal drift water-cooled base includes a constant temperature water-cooled circulation channel and a composite anti-vibration base, used to control the microenvironment and equipment temperature fluctuations within a preset range, and eliminate the cumulative thermal drift caused by the long-term operation of the moving magnet type OIS unit.

[0016] Optionally, as a possible implementation, in this embodiment of the invention, the edge computing node is further configured to perform edge soft splicing jitter: at the physical splicing edge of two adjacent exposure planes, the moving magnet type OIS unit is driven to superimpose a high-frequency micro oscillation signal in an axial direction perpendicular to the scanning direction, so as to achieve a gradual and smooth transition of the spot energy at the seam.

[0017] Optionally, as a possible implementation, in this embodiment of the invention, the edge computing node is implemented using an MCU or an FPGA.

[0018] A second aspect of this invention provides a laser direct-write imaging method based on an OIS array, which may include:

[0019] Obtain 3D surface topography model data of the substrate;

[0020] Based on the 3D surface morphology model data, the Z-axis target coordinates of each lithography head at each position on the scanning path are generated;

[0021] Based on the physical layout of the OIS array, the X and Y mounting reference coordinates of each moving magnet OIS unit are generated as the initial position reference origin of each lithography head.

[0022] Before uniform scanning exposure, the X and Y parasitic offsets of each moving magnet OIS unit within the Z-axis focusing stroke are obtained and solidified into a three-dimensional position lookup table stored in the local edge computing node;

[0023] Entering the high-speed uniform scanning exposure stage, the edge computing nodes connected to each moving magnet OIS unit are controlled to calculate in real time according to their physical coordinates and apply compensation electrical signals in reverse on the X / Y axis to cancel parasitic offset, and the laser light source is controlled to expose the position of the exposure point.

[0024] Optionally, as a possible implementation, the laser direct-write imaging method based on an OIS array according to embodiments of the present invention may further include:

[0025] As adjacent moving magnet OIS units travel and cross the splicing seam, when the current coordinates are identified as being at the edge of the scanning strip, a high-frequency micro-oscillation signal is superimposed on the control signal of the laser source, so that the spot energy forms a continuous and gradual distribution at the splicing seam, achieving a smooth transition of exposure energy between adjacent areas.

[0026] Optionally, as a possible implementation, in this embodiment of the invention, obtaining the 3D surface topography model data of the substrate includes:

[0027] The substrate surface is pre-scanned using a laser displacement sensor or a confocal sensor to obtain 3D surface topography model data of the substrate.

[0028] As can be seen from the above technical solutions, the embodiments of the present invention have the following advantages:

[0029] In this embodiment of the invention, in the OIS array-based laser direct-write imaging system, the array composed of moving-magnetic OIS units can adjust the position of the focal point (i.e., laser spot) of the laser source array in mutually perpendicular X, Y, and Z axis directions. During the uniform scanning exposure stage, based on the physical coordinates of the current moving-magnetic OIS unit, a locally stored three-dimensional position lookup table is queried in real time. This three-dimensional position lookup table stores the X and Y parasitic offsets corresponding to the exposure point positions of the moving-magnetic OIS units at various depths along the Z axis. Based on the query results and the X and Y mounting reference coordinates, reverse compensation drive signals are injected into the X and Y axes of the moving-magnetic OIS units to achieve decoupling and active physical cancellation of parasitic motion. Therefore, the OIS array-based laser direct-write imaging system in this embodiment can dynamically adapt the position of the focal point (i.e., laser spot) of the laser source array according to the 3D surface morphology of the substrate surface of the exposure surface, avoiding the loss of exposure accuracy caused by changes in the spot size of the exposure surface due to changes in object distance. It can perform exposure imaging on uneven exposure surfaces, expanding the application range of laser direct-write imaging. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of one embodiment of a laser direct-write imaging system based on an OIS array according to the present invention;

[0031] Figure 2 This is a schematic diagram of a specific application embodiment of a moving magnet type OIS unit in a laser direct-write imaging system based on an OIS array according to an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of one embodiment of a laser direct-write imaging method based on an OIS array according to the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0034] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] In the description of this application, unless otherwise stated, "a plurality of" means two or more. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" shall be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; as a direct connection or an indirect connection through an intermediate medium; or as a connection within two components.

[0036] For ease of understanding, the specific processes in the embodiments of the present invention are described below. Please refer to [link / reference]. Figure 1 An embodiment of a laser direct-write imaging system based on an OIS array in this invention may include: a moving magnet OIS (Optical Image Stabilization) array 10 and a distributed edge computing module 20.

[0037] The OIS array 10 may contain multiple arrayed moving-magnetic OIS units 101. For example, such as... Figure 2 As shown, each moving magnet type OIS unit can adjust the position of the focusing lens of the laser source in the mutually perpendicular X, Y, and Z axis directions.

[0038] It is understandable that the way the moving magnet type OIS unit adjusts the position of the focusing lens of the laser source in the X, Y, and Z axes can refer to existing technologies, such as the optical image stabilization OIS technology in existing mobile phones. It uses a built-in gyroscope to detect the slight movement of the device, transmits the signal to the microprocessor, calculates the amount of displacement that needs to be compensated, and then drives the floating lens or sensor in the lens to perform reverse displacement compensation, thereby correcting the offset of the focusing lens.

[0039] The distributed edge computing module 20 may contain multiple edge computing nodes 201. These edge computing nodes are implemented using MCUs or FPGAs and are used to independently complete high-frequency computations. Each moving-magnet OIS unit or group of moving-magnet OIS units (combining multiple moving-magnet OIS units) is connected to a configured independent edge computing node. Each edge computing node is configured to: receive the Z-axis target coordinates and X and Y mounting reference coordinates from the host computer; during the uniform scanning exposure phase, based on the current physical coordinates of the moving-magnet OIS unit, query the locally stored three-dimensional position lookup table in real time. This table stores the X and Y parasitic offsets corresponding to the exposure point positions of the OIS unit at various depths along the Z-axis; and, based on the query results and the X and Y mounting reference coordinates, calculate and control the X and Y axis injection reverse compensation drive signals of the OIS unit, and control the laser source to expose the exposure point positions.

[0040] As disclosed above, in the laser direct-write imaging system based on an OIS array in this application embodiment, the array composed of moving-magnetic OIS units can adjust the position of the focal point (i.e., the laser spot) of the laser source array in mutually perpendicular X, Y, and Z axis directions. During the uniform scanning exposure stage, based on the physical coordinates of the current moving-magnetic OIS unit, a locally stored three-dimensional position lookup table is queried in real time. The three-dimensional position lookup table stores the X and Y parasitic offsets corresponding to the exposure point positions of the OIS unit at various depths along the Z axis. Based on the query results and the X and Y mounting reference coordinates, reverse compensation drive signals are injected into the X and Y axes of the OIS unit to achieve decoupling and active physical cancellation of parasitic motion. Therefore, the OIS array-based laser direct-write imaging system in this embodiment can dynamically adapt the position of the focal point (i.e., laser spot) of the laser source array according to the 3D surface morphology of the substrate (exposure surface), avoiding the loss of exposure accuracy caused by changes in the spot size of the exposure surface due to changes in object distance. It also achieves decoupling and active physical cancellation of the parasitic motion of the moving-magnetic OIS unit, improving imaging accuracy. Furthermore, the OIS array-based laser direct-write imaging system in this embodiment can control the exposure imaging of the OIS array on uneven exposure surfaces, expanding the application range of laser direct-write imaging.

[0041] In the above Figure 2Based on the illustrated embodiment, optionally, as a possible implementation, the OIS array-based laser direct-write imaging system may further include a host computer, configured to: acquire 3D surface topography model data of the substrate before uniform scanning exposure; generate Z-axis target coordinates of each lithography head at each position on the scanning path based on the 3D surface topography model data; and generate X and Y mounting reference coordinates of each moving-magnetic OIS unit as the initial position reference origin of each lithography head based on the physical arrangement of the OIS array. Specifically, the host computer can pre-scan the substrate surface using a laser displacement sensor or a confocal sensor to acquire height distribution data of the substrate surface; fit the height distribution data into a continuous or discrete 3D surface topography model; map the 3D surface topography model into a Z-axis target position sequence of each lithography head at each time point during the scanning process according to the scanning path planning of the lithography head; and package and send the Z-axis target position sequence to the corresponding edge computing nodes according to timestamps or position stamps. Optionally, the edge computing node can also be configured to perform edge soft stitching jitter: at the physical stitching edge of two adjacent exposure planes, drive the OIS to superimpose a high-frequency micro oscillation signal in an axis perpendicular to the scanning direction to achieve a gradual and smooth transition of spot energy at the seam.

[0042] Optionally, as a possible implementation, the OIS array in this embodiment of the application is provided with a composite anti-magnetic isolation structure between adjacent units. The composite anti-magnetic isolation structure includes a rigid non-magnetic limiting layer and a high magnetic permeability layer. The rigid non-magnetic limiting layer is used to construct a physical air gap space with gaps to avoid hard adsorption of the mover, and the high magnetic permeability layer is used to block magnetic line crosstalk between adjacent motors. Optionally, the high magnetic permeability layer is a permalloy layer, and the composite anti-magnetic isolation structure is arranged in a stepped composite shielding grid.

[0043] Optionally, as a possible implementation, the laser direct-write imaging system based on the OIS array in this application embodiment may also include a thermal drift water-cooled base integrated at the bottom of the system; the thermal drift water-cooled base includes a constant temperature water-cooled circulation channel and a composite anti-vibration base, used to control the temperature fluctuations of the microenvironment and equipment within a preset range, and eliminate the cumulative thermal drift caused by the long-term operation of the moving magnet type OIS unit.

[0044] For ease of understanding, the specific workflow of the OIS array-based laser direct-write imaging system will be described below. The OIS array-based laser direct-write imaging method in the embodiments of this application may include:

[0045] S301: Obtain 3D surface topography model data of the substrate;

[0046] In this embodiment of the application, the laser direct writing imaging system based on the OIS array can pre-scan the substrate surface using a laser displacement sensor or a confocal sensor to obtain 3D surface morphology model data of the substrate. Alternatively, it can obtain 3D surface morphology model data of the substrate based on other modeling channels, which is not limited here.

[0047] S302: Based on the 3D surface morphology model data, generate the Z-axis target coordinates of each lithography head at each position on the scanning path;

[0048] The host computer plans the scanning path of the lithography head array on the substrate based on the lithography process requirements (such as exposure linewidth and splicing overlap rate). Typically, a raster scanning method is used, discretizing the scanning path into a sequence of target points corresponding to timestamps or position stamps. For each discrete point on the scanning path, the host computer queries the 3D surface undulation model to obtain the corresponding substrate surface height value. Combined with the nominal focal length of the lithography system, the Z-axis target coordinate of that point is calculated. The specific calculation logic is: the Z-axis target coordinate equals the mechanical zero-point reference plus the substrate surface height value plus the focal length compensation value of the optical system.

[0049] S303: Generate the X and Y mounting reference coordinates of each moving magnet OIS unit based on the physical layout of the OIS array;

[0050] Because the moving-magnet OIS array is composed of multiple independent devices arranged in a high density, the actual physical position of each OIS unit deviates from its theoretical design position due to machining tolerances and assembly errors. Directly using theoretical coordinates would lead to misalignment during the stitching of multiple lithography heads. Therefore, it is necessary to generate the XY mounting reference coordinates for each OIS unit:

[0051] For example, in the embodiments of this application, the origin of the global coordinate system can be the theoretical center point of the geodetic coordinate system or array of the lithography machine.

[0052] Actual position measurement: The system enters calibration mode and sequentially measures the actual center position of each OIS unit (i.e., each lithography head) using a high-precision visual positioning system (such as a host camera) or a mechanical contact probe. Assume the theoretical design coordinates of the j-th OIS unit are the theoretical X and theoretical Y values, and the measured physical coordinates are the actual X and actual Y values.

[0053] Reference coordinate calculation: Calculate the installation deviation for each OIS unit. The deviation in the X direction equals the actual X value minus the theoretical X value; the deviation in the Y direction equals the actual Y value minus the theoretical Y value. The "XY installation reference coordinates" include this deviation information, or can be directly defined as the corrected actual physical coordinates.

[0054] Solidification and Reference Origin Setting: The host computer sends out the XY mounting reference coordinates of each OIS unit and solidifies them into the non-volatile memory of the corresponding edge computing unit. During subsequent exposure processes, the edge computing unit uses these mounting reference coordinates as the "initial position reference origin" of its local control loop.

[0055] Error compensation logic: When the host computer sends out global scan coordinates, the edge computing unit first subtracts its own installation reference deviation to obtain local relative coordinates, and then drives the OIS unit to perform micro-motion. This ensures that although there are physical errors in the arrangement of the lithography heads of each OIS unit, all lithography heads are aligned with the same global grid in terms of logic control, thereby achieving seamless splicing of lithography heads with multiple OIS units.

[0056] S304: Before uniform scanning exposure, obtain the X and Y parasitic offsets of each moving magnet OIS unit within the Z-axis focusing stroke, and solidify them into a three-dimensional position lookup table stored in the local edge computing node;

[0057] To facilitate rapid adjustment of the Z-axis direction for adjusting the position of the focusing lens of the laser source, the X and Y parasitic offsets of each moving magnet OIS unit within the Z-axis focusing stroke can be pre-acquired and stored as a three-dimensional position lookup table in the local edge computing node.

[0058] S305: Entering the high-speed uniform scanning exposure stage, the host computer controls the edge computing nodes connected to each moving magnet OIS unit to execute focus tracking commands.

[0059] Entering the high-speed uniform scanning exposure stage, the host computer controls the edge computing nodes connected to each moving-magnet OIS unit to execute focus tracking commands. This allows the edge computing nodes to calculate in real time based on their physical coordinates and apply compensating electrical signals in reverse along the X / Y axes to counteract parasitic offsets. It also controls the laser source to expose the position of the exposure point.

[0060] Optionally, as a possible implementation, when adjacent moving magnet OIS units travel and cross the splicing seam, and the current coordinates are identified as being at the edge of the scanning strip, a high-frequency micro-oscillation signal is superimposed on the control signal of the laser source, so that the spot energy forms a continuous and gradual distribution at the splicing seam, achieving a smooth transition of exposure energy between adjacent areas.

[0061] In the embodiments provided in this application, it should be understood that the disclosed systems, modules, and units can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0062] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0063] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0064] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0065] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser direct-write imaging system based on an OIS array, characterized in that, include: The OIS array comprises multiple arrayed moving magnet OIS units, which can adjust the position of the focusing lens of the laser source in mutually perpendicular X, Y, and Z axis directions. A distributed edge computing module containing multiple edge computing nodes; each moving magnet OIS unit or each group of OIS units is connected to a configured independent edge computing node; The edge computing node is configured to: receive the Z-axis target coordinates and X and Y mounting reference coordinates from the host computer; during the uniform scanning exposure phase, based on the physical coordinates of the current moving magnet OIS unit, query the locally stored three-dimensional position lookup table in real time. The three-dimensional position lookup table stores the X and Y parasitic offsets corresponding to the exposure point positions of the moving magnet OIS unit at various depths along the Z-axis; and, based on the query results and the X and Y mounting reference coordinates, calculate and control the injection of reverse compensation drive signals into the X and Y axes of the moving magnet OIS unit, and control the laser source to expose the position of the exposure point.

2. The system according to claim 1, characterized in that, Also includes: The host computer is configured as follows: Before uniform scanning exposure, acquire 3D surface morphology model data of the substrate; Based on the 3D surface morphology model data, the Z-axis target coordinates of each lithography head at each position on the scanning path are generated; Based on the physical layout of the OIS array, the X and Y mounting reference coordinates of each moving magnet OIS unit are generated as the initial position reference origin of each moving magnet OIS unit.

3. The system according to claim 1, characterized in that, The adjacent units of the OIS array are provided with a composite anti-magnetic isolation structure, which includes a rigid non-magnetic limiting layer and a high magnetic permeability layer. The rigid non-magnetic limiting layer is used to construct a physical air gap space with gaps to avoid hard adsorption of the mover, and the high magnetic permeability layer is used to block the crosstalk of magnetic lines of force between adjacent motors.

4. The system according to claim 3, characterized in that, The high magnetic permeability layer is a permalloy layer, and the composite antimagnetic isolation structure is arranged in a stepped composite shielding grid.

5. The system according to any one of claims 1 to 4, characterized in that, It also includes a thermal drift water-cooled base, integrated at the bottom of the system; the thermal drift water-cooled base includes a constant temperature water-cooled circulation channel and a composite anti-vibration base, which is used to control the temperature fluctuations of the microenvironment and equipment within a preset range and eliminate the cumulative thermal drift caused by the long-term operation of the moving magnet type OIS unit.

6. The system according to any one of claims 1 to 4, characterized in that, The edge computing node is also configured to perform edge soft stitching jitter: at the physical stitching edge of two adjacent exposure planes, the moving magnet type OIS unit is driven to superimpose a high-frequency micro oscillation signal in an axis perpendicular to the scanning direction to achieve a gradual and smooth transition of spot energy at the seam.

7. The system according to any one of claims 1 to 4, characterized in that, The edge computing nodes are implemented using MCUs or FPGAs.

8. A laser direct-write imaging method based on an OIS array, applied to the system described in claim 1, characterized in that, The method includes: Obtain 3D surface topography model data of the substrate; Based on the 3D surface morphology model data, the Z-axis target coordinates of each lithography head at each position on the scanning path are generated; Based on the physical layout of the OIS array, the X and Y mounting reference coordinates of each moving magnet OIS unit are generated as the initial position reference origin of each lithography head. Before uniform scanning exposure, the X and Y parasitic offsets of each moving magnet OIS unit within the Z-axis focusing stroke are obtained and solidified into a three-dimensional position lookup table and stored in the local edge computing node; Entering the high-speed uniform scanning exposure stage, the edge computing nodes connected to each moving magnet OIS unit are controlled to calculate in real time according to their physical coordinates and apply compensation electrical signals in reverse on the X / Y axis to cancel parasitic offset, and the laser light source is controlled to expose the position of the exposure point.

9. The method according to claim 8, characterized in that, Also includes: As adjacent moving magnet OIS units travel and cross the splicing seam, when the current coordinates are identified as being at the edge of the scanning strip, a high-frequency micro-oscillation signal is superimposed on the control signal of the laser source, so that the spot energy forms a continuous and gradual distribution at the splicing seam, achieving a smooth transition of exposure energy between adjacent areas.

10. The method according to claim 8, characterized in that, The acquisition of the 3D surface topography model data of the substrate includes: The substrate surface is pre-scanned using a laser displacement sensor or a confocal sensor to obtain 3D surface topography model data of the substrate.

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