Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and an inner electrode layer; and a plurality of external electrodes disposed on the main body, where 0 lt; d2 / D1 < = 1.2, where D1 is a pitch between two external electrodes disposed adjacent to each other in the width direction among the plurality of external electrodes, and D2 is a pitch between two external electrodes disposed adjacent to each other in the length direction among the plurality of external electrodes.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0163245, filed on November 15, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as imaging devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc., to allow them to be charged or discharged.

[0004] Such MLCCs are used as components in a variety of electronic devices due to their advantages such as compactness, guaranteed high capacitance, and ease of installation. As the size of various electronic devices (such as computers and mobile devices) has decreased and their power has increased, the demand for miniaturization and high capacitance of multilayer ceramic capacitors has increased.

[0005] In addition, MLCCs have been widely used for decoupling due to their excellent high-frequency characteristics (low equivalent series inductance (ESL)) to remove noise from electrical signals within the group.

[0006] In addition, to address the noise issues of high-speed integrated circuits (ICs), a type of multi-layer capacitor (MLCC) called a pad-side capacitor (LSC) can be placed adjacent to the IC. As is well known, LSCs need to be thin, have high-frequency characteristics, and a suitable equivalent series resistance (low ESR).

[0007] To reduce ESL, minimizing the number of magnetic flux linkages per unit current in the high-frequency range is crucial. Various methods have been employed to address this issue, such as controlling the structure in the direction that minimizes current loops, or arranging inner and outer electrode layers in the direction that eliminates the magnetic field. Furthermore, methods such as arranging inner and outer electrode layers in the direction that minimizes current loops have been applied to maintain appropriate ESL.

[0008] As mentioned above, since LSCs are typically located beneath the IC substrate, they are required to have a thin profile while maintaining low ESL and a suitable ESR. However, for multi-terminal products with three or more external electrodes, it is difficult to manufacture them with low ESL characteristics and / or a suitable ESR while maintaining a thin profile and high capacitance. Summary of the Invention

[0009] One aspect of the present disclosure is to achieve high-frequency characteristics (low ESL) of a multilayer electronic component.

[0010] Another aspect of the present disclosure is to achieve appropriate equivalent series resistance (ESR) characteristics in a multilayer electronic component.

[0011] Another aspect of the present disclosure is to reduce the thickness of a multilayer electronic component.

[0012] Another aspect of the present disclosure is to improve the capacitance characteristics of a multilayer electronic component.

[0013] However, the various problems to be solved by the present disclosure are not limited to the foregoing, and can be more easily understood during the process of describing specific embodiments of the present disclosure.

[0014] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body including a dielectric layer and an inner electrode layer, the inner electrode layer being alternately arranged with the dielectric layer in a first direction, the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface, the second surface, the third surface, and the fourth surface; and an external electrode including a first electrode layer provided on the main body and a second electrode layer provided on the first electrode layer and connected to the inner electrode layer, wherein the external electrode includes a first external electrode, a second external electrode, and a third external electrode provided on a part of the first surface, a part of the second surface, and a part of the fifth surface, and a fourth external electrode, a fifth external electrode, and a sixth external electrode provided on another part of the first surface, another part of the second surface, and a part of the sixth surface, and 0 < D2 / D1 ≤ 1.2, where D1 is the distance between two adjacent external electrodes in the third direction among the first external electrode to the sixth external electrode, and D2 is the distance between two adjacent external electrodes in the second direction among the first external electrode to the sixth external electrode.

[0015] According to another aspect of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer and an inner electrode layer, the inner electrode layer being alternately disposed with the dielectric layer in a first direction, the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface, the second surface, the third surface, and the fourth surface; and a plurality of external electrodes including a first electrode layer disposed on the main body and a second electrode layer disposed on the first electrode layer and connected to the inner electrode layer, where 0 < D2 / D1 ≤ 1.2, where D1 is the distance between two adjacent external electrodes among the plurality of external electrodes in the third direction, and D2 is the distance between two adjacent external electrodes among the plurality of external electrodes disposed adjacent to each other in the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an embodiment of the present disclosure; Figure 2A and Figure 2B is a cross-sectional view showing the inner electrode layer in an embodiment of the present disclosure; Figure 3A and Figure 3B is a cross-sectional view showing the inner electrode layer in another embodiment of the present disclosure; Figure 4 is a cross-sectional view taken along the line I-I' of Figure 1 ; and Figure 5 schematically shows the distance Lm measured according to the moisture-proof reliability evaluation results of the comparative example and the example. DETAILED DESCRIPTION

[0017] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. However, the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. In the drawings, for clarity, the shapes and sizes (e.g., lengths) of the elements may be exaggerated, and the same reference numerals will always be used to denote the same elements.

[0018] To clarify this disclosure, parts irrelevant to the description have been omitted, and throughout the specification, the same reference numerals refer to the same elements. Similar reference numerals may indicate similar elements that have the same composition and similar structure, and in the drawings, the thickness of layers, films, panels, regions, etc., has been exaggerated for clarity. Furthermore, although the same reference numerals are shown in different drawings, they refer to the same elements. Throughout the specification, unless explicitly stated otherwise, the word "comprising" and variations such as "including" and "having" shall be understood to imply inclusion of the stated elements but not exclusion of any other elements.

[0019] In the accompanying drawings, the first direction can be defined as the Z direction, the stacking direction, or the thickness direction; the second direction can be defined as the X direction or the length direction; and the third direction can be defined as the Y direction or the width direction.

[0020] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0021] Figure 2A and Figure 2B This is a cross-sectional view showing the inner electrode layer in an embodiment of the present disclosure.

[0022] Figure 3A and Figure 3B This is a cross-sectional view showing the inner electrode layer in another embodiment of the present disclosure.

[0023] Figure 4 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0024] Figure 5 The distance Lm, measured according to the moisture-proof reliability evaluation results of the comparative and example cases, is illustrated schematically.

[0025] In the following text, reference will be made to Figures 1 to 5 Multilayer electronic assemblies according to embodiments of the present disclosure are described in detail. However, while a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, multilayer electronic assemblies can also be applied to various electronic products using dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] A multi-layer electronic component 100 according to an embodiment of the present disclosure includes: a main body 110 including a dielectric layer 111 and inner electrode layers 121 and 122, the inner electrode layers 121 and 122 being alternately arranged with the dielectric layer 111 in a first direction, and the main body 110 including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction; and external electrodes 131, 132, 133, 134, 135 and 136 including first electrode layers 131a, 132a, 133a, 134a, 135a and 136a provided on the main body 110 and second electrode layers 131b, 132b, 133b, 134b, 135b and 136b provided on the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a and connected to the inner electrode layers 121 and 122, wherein the external electrodes 131, 132, 133, 134, 135 and 136 include a first external electrode 131, a second external electrode 132 and a third external electrode 133 provided on a part of the first surface 1, a part of the second surface 2 and a part of the fifth surface 5 and a fourth external electrode 134, a fifth external electrode 135 and a sixth external electrode 136 provided on another part of the first surface 1, another part of the second surface 2 and a part of the sixth surface 6, and 0<D2 / D1≤1.2, wherein D1 is the distance (width of the gap or interval width) between two externally adjacent electrodes arranged adjacent to each other in the third direction among the first external electrode 131, the second external electrode 132, the third external electrode 133, the fourth external electrode 134, the fifth external electrode 135 and the sixth external electrode 136, and D2 is the distance (width of the gap or interval width) between two externally adjacent electrodes arranged adjacent to each other in the second direction among the first external electrode 131, the second external electrode 132, the third external electrode 133, the fourth external electrode 134, the fifth external electrode 135 and the sixth external electrode 136.

[0027] In the main body 110, the dielectric layer 111 and the inner electrode layers 121 and 122 may be alternately stacked.

[0028] More specifically, the main body 110 may include a capacitance forming portion including a first inner electrode layer 121 and a second inner electrode layer 122 provided inside the main body 110 and alternately arranged opposite to each other, and the dielectric layer 111 is interposed between the first inner electrode layer 121 and the second inner electrode layer 122.

[0029] Although the specific shape of the main body 110 is not particularly limited, as Figure 1As shown in the figure, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic particles included in the main body 110 during the sintering process, the main body 110 does not have a completely straight hexahedral shape but may generally have a hexahedral shape.

[0030] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0031] The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated such that it is not easy to distinguish the boundary between them without using a scanning electron microscope (SEM).

[0032] There is no limitation on the material used to form the dielectric layer 111 as long as sufficient electrostatic capacitance can be obtained using it. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and the BaTiO3-based ceramic powder may include BaTiO3 and / or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0033] In addition, for the purpose of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) as materials for forming the dielectric layer 111.

[0034] Furthermore, in order to distinguish the dielectric layer included in the capacitance forming portion from the dielectric layers included in the covering portions 112 and 113 described below, the dielectric layer 111 included in the capacitance forming portion may be defined as the first dielectric layer, and the dielectric layers included in the covering portions 112 and 113 may be defined as the second dielectric layer, and the first dielectric layer and the second dielectric layer may be the same or different, and there is no particular limitation.

[0035] Furthermore, since the first and second dielectric layers can be formed using dielectric materials such as barium titanate (BaTiO3), they can include dielectric microstructures after firing. The dielectric microstructures can include multiple dielectric grains, grain boundaries disposed between adjacent dielectric grains, and n-bifurcation points / n-focus points disposed at points where three or more grain boundaries contact each other.

[0036] The length of the dielectric layer 111 in the first direction does not need to be particularly limited.

[0037] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the first direction length of the dielectric layer 111 may be less than or equal to 3.0 μm, less than or equal to 2.0 μm, less than or equal to 1.0 μm, less than or equal to 0.8 μm, less than or equal to 0.6 μm, less than or equal to 0.5 μm, or less than or equal to 0.4 μm.

[0038] Here, the first directional length of the dielectric layer 111 may refer to the first directional length of the dielectric layer 111 disposed between adjacent first inner electrode layers 121 and second inner electrode layers 122.

[0039] Furthermore, the first direction length of dielectric layer 111 may refer to the length, distance, or size of dielectric layer 111 in the first direction, or it may refer to the thickness of dielectric layer 111.

[0040] Here, the first directional length of dielectric layer 111 may represent the first directional length of at least one dielectric layer 111 among a plurality of dielectric layers 111, or may represent the first directional length of each of all dielectric layers 111.

[0041] In addition, the first direction length of dielectric layer 111 may refer to the average first direction length of a dielectric layer 111, the average first direction length of each of a plurality of dielectric layers 111, or the average first direction length of at least one of a plurality of dielectric layers 111.

[0042] The average length of the dielectric layer 111 in the first direction can be measured by scanning an image of the first and third direction sections of the body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the average length of a dielectric layer 111 in the first direction can be defined as the average value calculated by measuring the length of the dielectric layer 111 in the first direction at five equally spaced points in the third direction in the scanned image. The five equally spaced points can be specified in the capacitor forming section. Furthermore, if this average value measurement is extended to three dielectric layers 111, the average length of the first direction of multiple dielectric layers 111 can be more generalized.

[0043] The inner electrode layers 121 and 122 may be stacked alternately with the dielectric layer 111.

[0044] The inner electrode layers 121 and 122 may include a first inner electrode layer 121 and a second inner electrode layer 122, and the first inner electrode layer 121 and the second inner electrode layer 122 may be alternately arranged opposite each other, and a dielectric layer 111 is disposed between the first inner electrode layer 121 and the second inner electrode layer 122. The first inner electrode layer 121 and the second inner electrode layer 122 may be electrically separated from each other by the dielectric layer 111 disposed between them in a first direction.

[0045] The main body 110 can be formed by alternately stacking a first ceramic green sheet on which a first inner electrode layer pattern is printed and a second ceramic green sheet on which a second inner electrode layer pattern is printed, and then firing them. Here, the first inner electrode layer pattern and the second inner electrode layer pattern can be formed by coating a conductive paste for the inner electrode layer, and after firing, the first inner electrode layer pattern and the second inner electrode layer pattern can become the first inner electrode layer 121 and the second inner electrode layer 122, respectively.

[0046] Hereinafter, a multilayer electronic assembly 100 according to an embodiment of the present disclosure is described. However, unless there are particularly contradictory or different descriptions, the description of the multilayer electronic assembly 100 according to the embodiment can also be applied to a multilayer electronic assembly (200, not shown) according to another embodiment, and those skilled in the art will be able to understand it appropriately by referring to the different reference numerals.

[0047] The inner electrode layer may include a main portion forming a capacitor and a lead-out portion or floating portion connected to the outer electrode.

[0048] Reference Figure 2A and Figure 2B The multilayer electronic assembly 100 according to embodiments of the present disclosure will be described in more detail. For example... Figure 2AAs shown, the first inner electrode layer 121 may include: a first main portion 121-0, spaced apart from at least one of the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the body 110 at a distance Lm and forming a capacitor; and first leads 121-1, 121-2, and 121-3, connected to the first main portion 121-0 and not forming a capacitor. The first leads 121-1, 121-2, and 121-3 may be spaced apart from each other and may include a 1-1 lead 121-1 connected to the first outer electrode 131, a 1-2 lead 121-2 connected to the third outer electrode 133, and a 1-3 lead 121-3 connected to the fifth outer electrode. Here, the 1-1 lead 121-1 may contact a portion of at least one of the third surface 3 and the fifth surface 5, and preferably, may contact a portion of the third surface 3 and a portion of the fifth surface 5. 1-2 The lead-out portion 121-2 may contact a portion of at least one of the fourth surface 4 and the fifth surface 5, and preferably, may contact a portion of the fourth surface 4 and a portion of the fifth surface 5. Furthermore, 1-3 The lead-out portion 121-3 may contact a portion of the sixth surface 6.

[0049] like Figure 2B As shown, the second inner electrode layer 122 may include: a second main portion 122-0, spaced apart from at least one of the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the body 110 at a distance Lm and forming a capacitor; and second leads 122-1, 122-2, and 122-3, connected to the second main portion 122-0 and not forming a capacitor. The second leads 122-1, 122-2, and 122-3 may be spaced apart from each other and may include a 2-1 lead 122-1 connected to the fourth outer electrode 134, a 2-2 lead 122-2 connected to the sixth outer electrode 136, and a 2-3 lead 122-3 connected to the second outer electrode 132. Here, the 2-1 lead 122-1 may contact a portion of at least one of the third surface 3 and the sixth surface 6, and preferably, may contact a portion of both the third surface 3 and the sixth surface 6. 2-2 The lead-out portion 122-2 may contact a portion of at least one of the fourth surface 4 and the sixth surface 6, and preferably, may contact a portion of the fourth surface 4 and a portion of the sixth surface 6. Furthermore, 2-3 The lead-out portion 122-3 may contact a portion of the fifth surface 5.

[0050] Here, the second direction length of the 2-3 lead-out portion 122-3 in contact with the fifth surface 5 can satisfy that it is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 1-1 lead-out portion 121-1 and the 1-2 lead-out portion 121-2 in contact with the fifth surface 5, and the second direction length of the 1-3 lead-out portion 121-3 in contact with the sixth surface 6 can satisfy that it is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 2-1 lead-out portion 122-1 and the 2-2 lead-out portion 122-2 in contact with the sixth surface 6.

[0051] Since the second direction length of the 2-3 lead-out portion 122-3 in contact with the fifth surface 5 is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 1-1 lead-out portion 121-1 and 1-2 lead-out portions 121-2 in contact with the fifth surface 5, and the second direction length of the 1-3 lead-out portion 121-3 in contact with the sixth surface 6 is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 2-1 lead-out portion 122-1 and 2-2 lead-out portions 122-2 in contact with the sixth surface 6, high-frequency characteristics (low ESL) and suitable ESR can be achieved. The length in the second direction can be obtained using an optical microscope or an electron microscope. Even if not described in this disclosure, other methods and / or other tools that are understood by one of ordinary skill in the art may be used.

[0052] Reference Figure 3A and Figure 3B This section will describe a multilayer electronic component according to another embodiment of the present disclosure. Descriptions of the parts identical to those in the multilayer electronic component 100 described above (e.g., dielectric layer 211 is the same as dielectric layer 111) will be omitted below, and the differences will be primarily described. Figure 3AAs shown, the first inner electrode layer 221 may include: a first main portion 221-0, spaced apart from at least one of the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the body at a distance Lm and forming a capacitor; and first leads 221-1, 221-2, and 221-3, connected to the first main portion 221-0 and not forming a capacitor. The first leads 221-1, 221-2, and 221-3 may be spaced apart from each other and may include a 1-1 lead 221-1 connected to the first outer electrode 231, a 1-2 lead 221-2 connected to the third outer electrode 233, and a 1-3 lead 221-3 connected to the fifth outer electrode 235. Here, the 1-1 lead 221-1 may contact a portion of at least one of the third surface 3 and the fifth surface 5, and preferably, may contact a portion of the third surface 3 and a portion of the fifth surface 5. 1-2 The lead-out portion 221-2 may contact a portion of at least one of the fourth surface 4 and the fifth surface 5, and preferably, may contact a portion of the fourth surface 4 and a portion of the fifth surface 5. Furthermore, 1-3 The lead-out portion 221-3 may contact a portion of the sixth surface 6.

[0053] like Figure 3B As shown, the second inner electrode layer 222 may include: a second main portion 222-0, spaced apart from at least one of the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 of the body 110 at a distance Lm and forming a capacitor; and second floating portions 222-1, 222-2, and 222-3, spaced apart from the second main portion 222-0 and not forming a capacitor. The second floating portions 222-1, 222-2, and 222-3 may be spaced apart from each other and may include a 2-1 floating portion 222-1 connected to the fourth outer electrode 234, a 2-2 floating portion 222-2 connected to the sixth outer electrode 236, and a 2-3 floating portion 222-3 connected to the second outer electrode 232. Here, the 2-1 floating portion 222-1 may contact a portion of at least one of the third surface 3 and the sixth surface 6, and preferably, may contact a portion of the third surface 3 and a portion of the sixth surface 6. 2-2 The floating portion 222-2 may contact a portion of at least one of the fourth surface 4 and the sixth surface 6, and preferably, may contact a portion of both the fourth surface 4 and the sixth surface 6. Furthermore, 2-3 the floating portion 222-3 may contact a portion of the fifth surface 5.

[0054] Here, the second direction length of the floating part 222-3 in contact with the fifth surface 5 can be greater than or equal to 1.25 times the second direction length of each of the 1-1 lead-out parts 221-1 and 1-2 lead-out parts 221-2 in contact with the fifth surface 5 and less than or equal to 2.75 times the second direction length of each of the 1-1 lead-out parts 221-1 and 1-2 lead-out parts 221-2 in contact with the fifth surface 5, and the second direction length of the floating part 221-3 in contact with the sixth surface 6 can be greater than or equal to 1.25 times the second direction length of each of the 2-1 floating part 222-1 and 2-2 floating part 222-2 in contact with the sixth surface 6 and less than or equal to 2.75 times the second direction length of each of the 2-1 floating part 222-1 and 2-2 floating part 222-2 in contact with the sixth surface 6.

[0055] Since the second direction length of the floating portion 222-3 in contact with the fifth surface 5 is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 1-1 lead-out portion 221-1 and 1-2 lead-out portion 221-2 in contact with the fifth surface 5, and the second direction length of the floating portion 221-3 in contact with the sixth surface 6 is greater than or equal to 1.25 times and less than or equal to 2.75 times the second direction length of each of the 2-1 floating portion 222-1 and 2-2 floating portion 222-2 in contact with the sixth surface 6, high-frequency characteristics (low ESL) and suitable ESR can be achieved.

[0056] In this disclosure, Lm can satisfy greater than or equal to 3 μm or less than or equal to 30 μm. Preferably, Lm can satisfy greater than or equal to 3 μm, and more preferably, Lm can satisfy greater than or equal to 3 μm and less than or equal to 30 μm. That is, 3 μm ≤ Lm can be satisfied, and preferably, 3 μm ≤ Lm ≤ 30 μm can be satisfied. Here, Lm can refer to the width of the area in which no lead-out portion or floating portion is provided. Lm can be obtained using an optical microscope or an electron microscope. Even if not described in this disclosure, other methods and / or other tools understood by those skilled in the art can be used.

[0057] If Lm is less than 3 μm (Lm < 3 μm), there may be a problem of short - circuit of the inner electrode layer caused by external moisture penetration, weakening the moisture - proof reliability. If Lm is greater than 30 μm (30 μm < Lm), external moisture penetration can be prevented, so the moisture - proof reliability can be excellent. However, since the area where the main part of the capacitor is formed is insufficient, there may be a problem that the target dielectric capacitance cannot be satisfied. However, in order to achieve various dielectric capacitances, Lm can also be greater than 30 μm (30 μm < Lm).

[0058] In cases other than the embodiments of the present disclosure, when Lm is greater than or equal to 3 μm (3 μm ≤ Lm), the moisture - proof reliability may deteriorate due to external moisture penetration. However, in the embodiments of the present disclosure, for example, when the distance between two adjacent outer electrodes among multiple outer electrodes in the third direction is D1 and the distance between two adjacent outer electrodes among multiple outer electrodes in the second direction is D2, when 0 < D2 / D1 ≤ 1.2, when Lm is greater than or equal to 3 μm (3 μm ≤ Lm), deterioration of the moisture - proof reliability due to external moisture penetration can be avoided. That is, in the embodiments of the present disclosure, in order to improve the moisture - proof reliability, when 0 < D2 / D1 ≤ 1.2, Lm being greater than or equal to 3 μm (3 μm ≤ Lm) is sufficient.

[0059] In addition, the main body 110 can be formed by alternately stacking a first ceramic green sheet printed with a conductive paste for forming the first inner electrode layer 121 and a second ceramic green sheet printed with a conductive paste for forming the second inner electrode layer 122, and then firing them. The screen printing method or the gravure printing method can be used as the method for printing the conductive paste for forming the inner electrode layer, but the present disclosure is not limited thereto.

[0060] The materials for forming the inner electrode layers 121 and 122 are not particularly limited and may include conductive metals with excellent conductivity. For example, the inner electrode layers 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0061] In addition, the length of the inner electrode layers 121 and 122 in the first direction may not be particularly limited.

[0062] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the length of the inner electrode layers 121 and 122 in the first direction may be less than or equal to 2.0 μm, less than or equal to 1.0 μm, less than or equal to 0.8 μm, less than or equal to 0.6 μm, less than or equal to 0.5 μm, or less than or equal to 0.4 μm.

[0063] Here, the first direction length of the inner electrode layers 121 and 122 may refer to the length, distance or size of the inner electrode layers 121 and 122 in the first direction, or it may refer to the thickness of the inner electrode layers 121 and 122.

[0064] Here, the first directional length of the inner electrode layers 121 and 122 may represent the first directional length of at least one of the plurality of inner electrode layers 121 and 122, or may represent the first directional length of each of the two inner electrode layers 121 and 122.

[0065] In addition, the first directional length of the inner electrode layers 121 and 122 may refer to the average first directional length of one inner electrode layer, the average first directional length of each of the plurality of inner electrode layers 121 and 122, or the average first directional length of at least one of the plurality of inner electrode layers 121 and 122.

[0066] The average length of the inner electrode layers 121 and 122 in the first direction can be measured by scanning an image of the first and third direction sections of the body 110 at 10,000x magnification using a scanning electron microscope (SEM). More specifically, the average length of the first direction of an inner electrode layer can be calculated as the average value of the length of the first direction of an inner electrode layer at five equally spaced points in the third direction in the scanned image. The five equally spaced points can be specified in the capacitor forming section. Furthermore, if this average value measurement is extended to three inner electrode layers, the average length of the first direction of multiple inner electrode layers can be more generalized.

[0067] In addition, the main body 110 may also include covering portions 112 and 113 disposed on two surfaces of the capacitor forming portion in the first direction.

[0068] Specifically, the covers 112 and 113 may include a first cover 112 disposed on one surface of the capacitor forming portion in the first direction and a second cover 113 disposed on another surface of the capacitor forming portion in the first direction. More specifically, for example, the covers 112 and 113 may include an upper cover (i.e., the first cover 112) disposed on the upper surface of the capacitor forming portion in the first direction and a lower cover (i.e., the second cover 113) disposed on the lower surface of the capacitor forming portion in the first direction.

[0069] The first cover portion 112 and the second cover portion 113 can be formed by arranging or stacking a single second dielectric layer or two or more second dielectric layers on the upper and lower surfaces of the capacitor forming portion in the first direction, respectively, and can mainly serve to prevent damage to the inner electrode layers 121 and 122 due to physical stress and / or chemical stress.

[0070] The first cover portion 112 and the second cover portion 113 do not include the inner electrode layers 121 and 122, and may include the same dielectric material as the dielectric material of the first dielectric layer 111 of the capacitor forming portion. That is, the first cover portion 112 and the second cover portion 113 may include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0071] Furthermore, the first directional length of the covering portions 112 and 113 is not particularly limited, and the first directional length of the covering portions 112 and 113 may refer to the first directional length of each of the first covering portion 112 and the second covering portion 113.

[0072] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the first direction length of the covers 112 and 113 may be less than or equal to 100 μm, less than or equal to 50 μm, less than or equal to 30 μm, or less than or equal to 20 μm.

[0073] Here, the first direction length of the covering portions 112 and 113 may refer to the length, distance or size of the covering portions 112 and 113 in the first direction, or it may refer to the thickness of the covering portions 112 and 113.

[0074] In addition, the first directional length of the covering portions 112 and 113 may refer to the first directional average length of each of the first covering portion 112 and the second covering portion 113, or may refer to the first directional average length of one of the first covering portion 112 and the second covering portion 113.

[0075] The average length of the covers 112 and 113 in the first direction can be measured by scanning images of the first and third direction sections of the body 110 using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average length of the covers 112 and 113 in the first direction can refer to the average value calculated by measuring the first direction dimension of a cover at five equally spaced points in the third direction in the scanned image.

[0076] In embodiments of this disclosure, a structure is described in which the multilayer electronic component 100 has six external electrodes 131, 132, 133, 134, 135 and 136, but the number or shape of the external electrodes may be changed depending on the shape of the inner electrode layer or for other purposes.

[0077] External electrodes 131, 132, 133, 134, 135 and 136 may be disposed on the main body 110 and may be connected to the inner electrode layers 121 and 122.

[0078] Here, the lead-out portion or floating portion of the inner electrode layer may be exposed to and in contact with at least one surface of the body, and the outer electrode may be configured to cover the exposed lead-out portion or floating portion. The fact that the outer electrode is configured to cover the lead-out portion or floating portion of the inner electrode layer indicates that when the multilayer electronic assembly is observed or measured from the outside, the lead-out portion or floating portion of the inner electrode layer is not exposed to the outside and is not visible.

[0079] The external electrodes 131, 132, 133, 134, 135 and 136 may include a first external electrode 131, a second external electrode 132 and a third external electrode 133 disposed on a portion of the fifth surface 5, a portion of the first surface 1 and a portion of the second surface 2, and a fourth external electrode 134, a fifth external electrode 135 and a sixth external electrode 136 disposed on a portion of the sixth surface 6 and another portion of the first surface 1 and another portion of the second surface 2.

[0080] More specifically, the first external electrode 131 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the fifth surface 5, and may also be disposed on a portion of the third surface 3, and preferably, may be continuously disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the third surface 3, and a portion of the fifth surface 5. The second external electrode 132 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the fifth surface 5. The third external electrode 133 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the fifth surface 5, and may also be disposed on a portion of the fourth surface 4, and preferably, may be continuously disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fourth surface 4, and a portion of the fifth surface 5. For example, in the second direction, the first external electrode 131 may be disposed at a corner of the body 110, and the length of contact between the second external electrode 132 and the fifth surface 5 may be longer than the length of contact between the first external electrode 131 and the fifth surface 5.

[0081] The fourth external electrode 134 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the sixth surface 6, and may also be disposed on a portion of the third surface 3. Preferably, it may be continuously disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the third surface 3, and a portion of the sixth surface 6. The fifth external electrode 135 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the sixth surface 6. The sixth external electrode 136 may be disposed on a portion of the first surface 1, a portion of the second surface 2, and a portion of the sixth surface 6, and may also be disposed on a portion of the fourth surface 4. Preferably, it may be continuously disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fourth surface 4, and a portion of the sixth surface 6.

[0082] Here, the second direction length of the second external electrode 132 contacting the fifth surface 5 can satisfy a condition that is greater than or equal to 1.25 times the second direction length of each of the first external electrode 131 and the third external electrode 133 contacting the fifth surface 5 and less than or equal to 2.75 times the second direction length of each of the first external electrode 131 and the third external electrode 133 contacting the fifth surface 5, and the second direction length of the fifth external electrode 135 contacting the sixth surface can satisfy a condition that is greater than or equal to 1.25 times the second direction length of each of the fourth external electrode 134 and the sixth external electrode 136 contacting the sixth surface 6 and less than or equal to 2.75 times the second direction length of each of the fourth external electrode 134 and the sixth external electrode 136 contacting the sixth surface 6. Furthermore, in the second direction, the length of the second external electrode 132 contacting the fifth surface 5 can be longer than the length of each of the first external electrode 131 and the third external electrode 133 contacting the fifth surface 5. In the second direction, the length of the fifth outer electrode 135 in contact with the sixth surface 6 may be longer than the length of each of the fourth outer electrode 134 and the sixth outer electrode 136 in contact with the sixth surface 6.

[0083] Since the second direction length of the second external electrode 132 in contact with the fifth surface 5 is greater than or equal to 1.25 times the second direction length of each of the first external electrode 131 and the third external electrode 133 in contact with the fifth surface 5 and less than or equal to 2.75 times the second direction length of each of the first external electrode 131 and the third external electrode 133 in contact with the fifth surface 5, and the second direction length of the fifth external electrode 135 in contact with the sixth surface is greater than or equal to 1.25 times the second direction length of each of the fourth external electrode 134 and the sixth external electrode 136 in contact with the sixth surface and less than or equal to 2.75 times the second direction length of each of the fourth external electrode 134 and the sixth external electrode 136 in contact with the sixth surface, high-frequency characteristics (low ESL) and suitable ESR can be achieved.

[0084] The first external electrode 131, the second external electrode 132, the third external electrode 133, the fourth external electrode 134, the fifth external electrode 135 and the sixth external electrode 136 can be arranged at intervals from each other.

[0085] More specifically, based on the fifth surface 5, the first external electrode 131, the second external electrode 132 and the third external electrode 133 may be arranged at intervals in the second direction, with the second external electrode located between the first external electrode 131 and the third external electrode 133; and based on the sixth surface 6, the fourth external electrode 134, the fifth external electrode 135 and the sixth external electrode 136 may be arranged at intervals in the second direction, with the fifth external electrode 135 located between the fourth external electrode 134 and the sixth external electrode 136.

[0086] In addition, based on the first surface 1 and the second surface 2, the first outer electrode 131 and the fourth outer electrode 134 may be disposed at intervals from each other in the third direction, the second outer electrode 132 and the fifth outer electrode 135 may be disposed at intervals from each other in the third direction, and the third outer electrode 133 and the sixth outer electrode 136 may be disposed at intervals from each other in the third direction.

[0087] Here, when the distance between two adjacent outer electrodes among the first outer electrode 131, the second outer electrode 132, the third outer electrode 133, the fourth outer electrode 134, the fifth outer electrode 135, and the sixth outer electrode 136 disposed adjacent to each other in the third direction is D1 and the distance between two adjacent outer electrodes among the first outer electrode 131, the second outer electrode 132, the third outer electrode 133, the fourth outer electrode 134, the fifth outer electrode 135, and the sixth outer electrode 136 disposed adjacent to each other in the second direction is D2, 0 < D2 / D1 ≤ 1.2 may be satisfied.

[0088] Here, D1 may refer to the third direction length (dimension) in a direction parallel to the third direction, and D2 may refer to the second direction length (dimension) in a direction parallel to the second direction, but is not particularly limited thereto.

[0089] More specifically, for example, the distance (e.g., the third direction length) between the first outer electrode 131 and the fourth outer electrode 134 disposed adjacent to the first outer electrode 131 in the third direction may be referred to as D1. In addition, the distance (e.g., the second direction length) between the fourth outer electrode 134 and the fifth outer electrode 135 disposed adjacent to the fourth outer electrode 134 in the second direction may be referred to as D2. However, the present disclosure is not particularly limited thereto.

[0090] Since D1 and D2 satisfy 0 < D2 / D1 ≤ 1.2, high-frequency characteristics (low ESL) and / or appropriate equivalent series resistance (ESR) characteristics can be achieved. That is, the number of magnetic flux linkages per unit current in the high-frequency range can be minimized and / or the current loop current can be minimized, so that low ESL and / or appropriate ESR can be achieved while the capacitance is excellent.

[0091] The lower limit of D2 / D1 is not particularly limited, but due to process limitations, D2 / D1 may be greater than or equal to 0.6 (0.6 ≤ D2 / D1), and in this case, D1 and D2 may satisfy 0.6 ≤ D2 / D1 ≤ 1.2.

[0092] In addition, in the case of 1.2 < D2 / D1, it may be difficult to achieve low ESL or it may be difficult to achieve appropriate ESR.

[0093] Additionally, D1 may be greater than or equal to 70 μm (70 μm ≤ D1), but this is only due to process limitations and is not specifically limited thereto. D1 and D2 can be obtained using an optical microscope or an electron microscope. Other methods and / or other tools, as understood by those skilled in the art, may be used even if not described in this disclosure.

[0094] The external electrodes 131, 132, 133, 134, 135 and 136 can be formed using any conductive material (such as metal), and the specific material can be determined by taking into account electrical properties, structural stability and other factors. Furthermore, the external electrodes 131, 132, 133, 134, 135 and 136 can also have a multilayer structure.

[0095] For example, external electrodes 131, 132, 133, 134, 135, and 136 may include a first electrode layer disposed on the body 110 and a second electrode layer disposed on the first electrode layer. External electrodes 131, 132, 133, 134, 135, and 136 may also include a third electrode layer disposed on the second electrode layer. Preferably, the first to third electrode layers correspond to layers that are distinct from each other. However, this is not a limitation; the first to third electrode layers may be distinguished according to the manufacturing process sequence, and at least a portion of the first to third electrode layers may not be distinguishable from each other and may be observed as a single layer.

[0096] In this disclosure, "distinction" can refer to two layers being distinguishable due to physical differences, chemical differences, and / or purely optical differences, and the layers can be distinguished from each other by, but not limited to, the presence or absence of an "interface." An interface can refer to a surface through which two layers in contact with each other can be distinguished from one another. For example, the ability of two layers to be distinguished from each other can refer to a state in which differences in composition detected by instruments such as scanning electron microscopy (SEM) can distinguish the two layers.

[0097] In other words, although not all are shown in the accompanying drawings, for ease of description, the first external electrode 131, the second external electrode 132, the third external electrode 133, the fourth external electrode 134, the fifth external electrode 135, and the sixth external electrode 136 may respectively include first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a disposed on the main body 110, and second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b disposed on the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a, and also include third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c disposed on the second electrode layers 131c, 132b, 133b, 134b, 135b, and 136b. Although the structure and reference numerals of the first electrode layers 131a, 133a, 134a and 136a, the second electrode layers 131b, 133b, 134b and 136b, and the third electrode layers 131c, 133c, 134c and 136c of the outer electrodes 131, 133, 134 and 136 are not shown in detail in the accompanying drawings, their composition and arrangement are the same as or similar to the composition and arrangement of the first electrode layers 132a and 135a, the second electrode layers 132b and 135b, and the third electrode layers 132c and 135c of the outer electrodes 132 and 135.

[0098] Here, the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a may be disposed on the first surface 1 and the second surface 2, and more preferably, may be disposed only on the first surface 1 and the second surface 2.

[0099] Since the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a are disposed only on the first surface 1 and the second surface 2, the second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b can be disposed more uniformly and easily, and the shape of the external electrode intended to be formed by this disclosure can be easily manufactured. Furthermore, since the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a are not disposed on the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6, the size of the external electrode can be reduced, thereby reducing the size of the multilayer electronic assembly. This facilitates mounting the multilayer electronic assembly on or inside a substrate and further improves the dielectric capacitance.

[0100] Here, the first directional average length t1 of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a can be greater than or equal to 1 μm and less than or equal to 9 μm, and based on the first directional average length, the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a can have a uniform first directional length within ±10% error.

[0101] Here, since the average length t1 of the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a satisfies greater than or equal to 1 μm and less than or equal to 9 μm, the dielectric capacitance and electrical properties can be excellent.

[0102] If the average length t1 of the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a is less than 1 μm, it may be difficult to control the shape of the external electrodes 131, 132, 133, 134, 135 and 136 including the second electrode layers 131b, 132b, 133b, 134b, 135b and 136b. And if the average length t1 of the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a is greater than 9 μm, there may be a problem of deterioration of dielectric capacitance characteristics compared with multilayer electronic components of the same size.

[0103] Here, the first directional length or first directional average length of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a can refer to the first directional length or first directional average length of the corresponding first electrode layers 131a, 132a, 133a, 134a, 135a and 136a of the first outer electrode 131, the second outer electrode 132, the third outer electrode 133, the fourth outer electrode 134, the fifth outer electrode 135 and the sixth outer electrode 136.

[0104] The first-direction average length t1 of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a can be measured by scanning images of the first and third-direction cross sections of the multilayer electronic assembly using a scanning electron microscope (SEM). More specifically, the first-direction average length of a first electrode layer can refer to the average value calculated by measuring the first-direction length of an electrode layer at three equally spaced points in the third-direction direction in the scanned image, and the first-direction length measured at the three points may have an error within ±10% based on the first-direction average length. Other methods and / or other tools understood by those skilled in the art may be used even if not described in this disclosure.

[0105] The first electrode layers 131a, 132a, 133a, 134a, 135a and 136a can be formed by printing a conductive paste for the first electrode layers, including a first conductive metal, onto the body 110. The second electrode layers 131b, 132b, 133b, 134b, 135b and 136b can be formed by forming a plating layer including a second conductive metal. The third electrode layers 131c, 132c, 133c, 134c, 135c and 136c can be formed by forming a plating layer including a third conductive metal.

[0106] However, this disclosure is not particularly limited thereto, and the first electrode layer, the second electrode layer and the third electrode layer may be formed by transferring a sheet formed of conductive paste for external electrodes including conductive metal, or by coating conductive paste for external electrodes including conductive metal and then firing it.

[0107] The first conductive metal included in the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a may be a material with excellent conductivity, for example, it may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof. Preferably, it may include nickel (Ni), and more preferably, it may include nickel (Ni) as the main component of the first electrode layers 131a, 132a, 133a, 134a, 135a and 136a.

[0108] In addition, the term "principal component" in this disclosure may refer to a component that accounts for a relatively large weight or atomic ratio compared with other components, and may refer to a component that accounts for more than 50 wt% of the total weight of all materials based on the corresponding structure, a component that accounts for more than 50 at% of the total number of atoms of all materials based on the corresponding structure, or a component that accounts for more than 50 mol% of the total number of moles of all materials based on the corresponding structure.

[0109] The second electrode layers 131b, 132b, 133b, 134b, 135b and 136b can improve the installation characteristics.

[0110] The second conductive metal included in the second electrode layers 131b, 132b, 133b, 134b, 135b and 136b can be a material with excellent conductivity, for example, it can include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof. Preferably, it can include copper (Cu), and more preferably, it can include copper (Cu) as the main component of the second electrode layers 131b, 132b, 133b, 134b, 135b and 136b.

[0111] The third electrode layers 131c, 132c, 133c, 134c, 135c and 136c can improve the installation characteristics.

[0112] The third conductive metal included in the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c can be a material with excellent conductivity, for example, it can include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. Preferably, it can include at least one of nickel (Ni), tin (Sn), copper (Cu), and alloys thereof, and more preferably, it can include at least one of nickel (Ni), tin (Sn), copper (Cu), and alloys thereof as the main component of the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c. However, it is not limited thereto, and the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c can include multiple layers containing the third conductive metal.

[0113] Furthermore, the dimensions of the multilayer electronic component 100 are not particularly limited. The first-direction length (e.g., thickness) of the multilayer electronic component 100 may be referred to as T, the second-direction length (e.g., length) of the multilayer electronic component 100 may be referred to as L, and the third-direction length (e.g., width) of the multilayer electronic component 100 may be referred to as W. Here, the first-direction length may refer to the maximum length (e.g., maximum thickness) of the multilayer electronic component in the first direction, the second-direction length may refer to the maximum length (e.g., maximum length) of the multilayer electronic component in the second direction, and the third-direction length may refer to the maximum length (e.g., maximum width) of the multilayer electronic component in the third direction. The first-direction length, the second-direction length, and the third-direction length are not particularly limited thereto and may refer to commonly used values.

[0114] Here, the multilayer electronic component 100 can satisfy T 30 μm ≤ T ≤ 3 / 5 × W, W can satisfy W ≤ 750 μm, and W and L can satisfy 1.75 ≤ L / W ≤ 2.25. T, L, and W can be obtained using an optical microscope or an electron microscope. Even if not described in this disclosure, other methods and / or other tools understood by those skilled in the art can be used.

[0115] Since the T, L and W of the multilayer electronic component 100 meet the above conditions, the noise of the high-speed integrated circuit (IC) can be reduced, and the multilayer electronic component 100 can be used for pad-side capacitors (LSC).

[0116] The present disclosure will be described in more detail below by way of experimental examples, but this is only to help to understand the present disclosure in detail, and the scope of the present disclosure is not limited to the preferred experimental examples.

[0117] (Experimental Example) Table 1 below shows the ESL and ESR characteristics measured based on the ratio (D2 / D1) of the distance D2 (distance in the length direction) between two adjacent external electrodes in the second direction to the distance D1 (distance in the width direction) between two adjacent external electrodes in the third direction.

[0118] In Table 1, width (W) and length (L) represent the width (W) and length (L) of the multilayer electronic components, and the unit is micrometer (μm).

[0119] The first length of the external electrode represents the length of contact between the fourth external electrode and the sixth surface, and the unit is micrometer (μm). The second length of the external electrode represents the length of contact between the fifth external electrode and the sixth surface, and the unit is micrometer (μm).

[0120] Based on the second surface, the length direction spacing D2 of the outer electrodes represents the second directional spacing between the fourth and fifth outer electrodes, and the unit is micrometers (μm). Based on the second surface, the width direction spacing D1 of the outer electrodes represents the third directional spacing between the first and fourth outer electrodes, and the unit is micrometers (μm).

[0121] ESL measurements were performed according to EIA-970 standard, and regarding the measurement method, the impedance (pH) was measured using a network analyzer while a voltage at a frequency of 1 GHz was applied to the sample wafer (MLCC), and the results are shown in Table 1 below.

[0122] ESR measurements were performed according to the EIA-970 standard, and regarding the measurement method, the resistance (mΩ) was measured using a network analyzer under the condition of applying the self-resonant frequency (SRF), and the results are shown in Table 1 below.

[0123] Manufacture a multilayer electronic assembly according to Experimental Examples 1 to 6, comprising a main body (including a first inner electrode layer containing a first lead-out portion and a second inner electrode layer containing a second lead-out portion) and a first to a sixth outer electrode disposed on the main body.

[0124] [Table 1]

[0125] For Experimental Examples 1 to 5, where D2 / D1 is less than or equal to 1.2, ESL has a value of less than or equal to 30.0 pH and ESR has a value of less than or equal to 30.0 mΩ, and specifically, the maximum value of ESR is 29.9 mΩ. Furthermore, for Experimental Example 6, where D2 / D1 equals 1.4, the value of ESL is greater than 30.0 pH and the value of ESR is greater than 30.0 mΩ, and specifically, the value of ESR is 30.1 mΩ.

[0126] Therefore, it can be seen that when D2 / D1 is less than or equal to 1.2, high-frequency characteristics (low ESL) and a suitable ESR value are obtained.

[0127] Table 2 below shows the capacitance characteristics measured based on the average thickness of the first electrode layer.

[0128] Manufacture a multilayer electronic assembly according to Experimental Examples 7 to 13, comprising a main body (including a first inner electrode layer containing a first lead-out portion and a second inner electrode layer containing a second lead-out portion) and a first to a sixth outer electrode disposed on the main body.

[0129] The first to sixth external electrodes of Experimental Example 7 do not include the first electrode layer, and only include the second electrode layer containing copper (Cu) as the main component and disposed on the body.

[0130] The first to sixth external electrodes of Experimental Examples 8 to 13 include: a first electrode layer containing nickel (Ni) as the main component and disposed only on the first and second surfaces of the body; and a second electrode layer containing copper (Cu) as the main component and disposed on the first electrode layer.

[0131] The average thickness of the first electrode layer is measured, and the average thickness of the first electrode layer is represented by measuring the average thickness of the first electrode layer disposed on the first surface and the second surface, and the unit is micrometer (μm).

[0132] Thickness (T) represents the thickness of the multilayer electronic assembly including the fourth external electrode disposed on the first and second surfaces, and is expressed in micrometers (μm).

[0133] The thickness of the outer electrode is expressed as a total thickness in micrometers (μm) by measuring the average thickness of each electrode layer of the fourth outer electrode disposed on the first and second surfaces and adding them together.

[0134] Width (W) and length (L) are represented by measuring the width (W) and length (L) of the multilayer electronic components.

[0135] The average thickness of the dielectric layer is represented by measuring the average thickness of the dielectric layer provided between the first inner electrode layer and the second inner electrode layer, and the unit is micrometers (μm).

[0136] The dielectric capacitance of each sample is a relative capacitance calculated based on the dielectric capacitance (100%) of Experimental Example 7, and is shown in the form of percentage (%).

[0137] [Table 2]

[0138] In the case of Experimental Example 7, the first to sixth outer electrodes that do not include the first electrode layer but include the second electrode layer are formed, but at least one of the first to sixth outer electrodes has an error exceeding ±10% based on the average thickness of the outer electrode, so that an outer electrode with a uniform thickness cannot be formed.

[0139] In the cases of Experimental Examples 8 to 12, the average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 9 μm and the error based on the average thickness of the outer electrode is within ±10%. It can be seen that the dielectric capacitance is improved compared with Experimental Example 7.

[0140] In the case of Experimental Example 13, the error based on the average thickness of the outer electrode is within ±10% but the average thickness of the first electrode layer is 11 μm. It can be seen that the dielectric capacitance decreases compared with Experimental Example 7.

[0141] Therefore, when the average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 9 μm, it can be seen that an outer electrode with a uniform thickness is formed while improving the dielectric capacitance.

[0142] Next, Figure 5 The distance Lm measured from the moisture-proof reliability evaluation results of the samples according to the comparative examples and examples is schematically shown.

[0143] Here, the distance Lm is the spacing measured between the main part of the inner electrode layer and one of the surfaces in the second direction.

[0144] In the evaluation of moisture-proof reliability, when a short circuit occurs when a voltage of 5Vr is applied for 100 hours under the temperature condition of 85°C and the humidity condition of 85%, it is evaluated as defective, and when no short circuit occurs, it is evaluated as normal.

[0145] More specifically, the comparative example is the distance Lm measured for a normal sample without defects in the moisture-proof reliability evaluation when the ratio (D2 / D1) of the spacing D2 between two adjacent outer electrodes arranged in the second direction to the spacing D1 between two adjacent outer electrodes arranged in the third direction is greater than 1.2 (1.2 < D2 / D1).

[0146] Furthermore, an example is the distance Lm measured on a normal sample that is not defective in the moisture-proof reliability evaluation when the ratio (D2 / D1) between two adjacent external electrodes arranged in the second direction and the distance (D2 / D1) between two adjacent external electrodes arranged in the third direction is less than or equal to 1.2 (D2 / D1≤1.2).

[0147] like Figure 5 As shown, in the comparative example, the sample that was rated as normal in the moisture-proof reliability evaluation only had a value greater than 15 μm. However, in the example, the sample that was rated as normal in the moisture-proof reliability evaluation had a value greater than or equal to 3 μm and less than or equal to 15 μm.

[0148] Therefore, it can be seen that when D2 / D1 is less than or equal to 1.2 (D2 / D1≤1.2), the moisture-proof reliability is excellent, and it can also be seen that when Lm is greater than or equal to 3μm, excellent moisture-proof reliability can be ensured.

[0149] One of the various effects of this disclosure is to provide a multilayer electronic component with excellent high-frequency characteristics (low ESL).

[0150] One of the various effects of this disclosure is to provide a multilayer electronic component capable of achieving the desired equivalent series resistance (low ESR).

[0151] One of the various effects of this disclosure is to provide a thin, multilayer electronic component.

[0152] One of the various effects of this disclosure is to provide a multilayer electronic component with excellent capacitance characteristics.

[0153] However, the various advantages and effects of this disclosure are not limited to the foregoing and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0154] Although embodiments or examples of this disclosure have been described in detail above, this disclosure is not limited to the above embodiments and drawings, but is intended to be defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications and alterations without departing from the technical concept of this disclosure described in the claims, and such modifications and alterations will also be considered to fall within the scope of this disclosure.

[0155] The expressions "example embodiment or one example" used in this disclosure do not refer to the same example and are provided to emphasize the distinct features that distinguish the various examples. However, the examples provided in the above description do not preclude implementation in combination or in conjunction with features of other examples. For example, even if something described in a particular example is not described in a different example, it may be understood to be related to another example, unless otherwise stated in its description.

[0156] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular form is intended to include the meaning of the plural form as well, unless the context clearly indicates otherwise.

Claims

1. A multi-layer electronic component, comprising: A main body including a dielectric layer and an inner electrode layer, the inner electrode layer and the dielectric layer being alternately arranged in a first direction, the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface, the second surface, the third surface and the fourth surface; And An external electrode including a first electrode layer provided on the main body and a second electrode layer provided on the first electrode layer and connected to the inner electrode layer, Wherein, the external electrode includes a first external electrode, a second external electrode and a third external electrode provided on a part of the first surface, a part of the second surface and a part of the fifth surface, and a fourth external electrode, a fifth external electrode and a sixth external electrode provided on another part of the first surface, another part of the second surface and a part of the sixth surface, and 0 < D2 / D1 ≤ 1.2, wherein, D1 is the distance between two adjacent external electrodes among the first external electrode to the sixth external electrode in the third direction, and D2 is the distance between two adjacent external electrodes among the first external electrode to the sixth external electrode in the second direction.

2. The multilayer electronic component according to claim 1, wherein, D1 and D2 satisfy 0.6 ≤ D2 / D1 ≤ 1.

2.

3. The multi-layer electronic component according to claim 1, wherein, The first external electrode, the second external electrode and the third external electrode are arranged spaced apart from each other in the second direction and the second external electrode is between the first external electrode and the third external electrode, the fourth external electrode, the fifth external electrode and the sixth external electrode are arranged spaced apart from each other in the second direction and the fifth external electrode is between the fourth external electrode and the sixth external electrode, The inner electrode layer includes a first inner electrode layer and a second inner electrode layer, and The first inner electrode layer includes a first main part and a 1-1 lead-out part, a 1-2 lead-out part and a 1-3 lead-out part connected to the first main part, the 1-1 lead-out part, the 1-2 lead-out part and the 1-3 lead-out part are arranged spaced apart from each other, and are respectively connected to the first external electrode, the third external electrode and the fifth external electrode.

4. The multilayer electronic component according to claim 3, wherein, The second inner electrode layer includes a second main part and a 2-1 lead-out part, a 2-2 lead-out part and a 2-3 lead-out part connected to the second main part, the 2-1 lead-out part, the 2-2 lead-out part and the 2-3 lead-out part are arranged spaced apart from each other, and are respectively connected to the fourth external electrode, the sixth external electrode and the second external electrode.

5. The multilayer electronic component according to claim 3, wherein, The second inner electrode layer includes a second main part and 2-1 floating parts, 2-2 floating parts and 2-3 floating parts spaced apart from the second main part, the 2-1 floating parts, the 2-2 floating parts and the 2-3 floating parts are arranged spaced apart from each other, and are respectively connected to the fourth external electrode, the sixth external electrode and the second external electrode.

6. The multilayer electronic component according to claim 4, wherein, The first main part and the second main part are arranged at a distance Lm from at least one surface selected from the third surface to the sixth surface, and Lm satisfies 3μm ≤ Lm.

7. The multilayer electronic component according to claim 6, wherein, Lm satisfies 3μm ≤ Lm ≤ 30μm.

8. The multilayer electronic component according to claim 5, wherein, The first main part and the second main part are arranged at a distance Lm from at least one surface selected from the third surface to the sixth surface, and Lm satisfies 3μm ≤ Lm.

9. The multilayer electronic component according to claim 8, wherein, Lm satisfies 3μm ≤ Lm ≤ 30μm.

10. The multilayer electronic assembly according to claim 1, wherein, In the second direction: The length of contact between the second external electrode and the fifth surface satisfies being greater than or equal to 1.25 times and less than or equal to 2.75 times the length of contact between each of the first external electrode and the third external electrode and the fifth surface, and The length of contact between the fifth external electrode and the sixth surface satisfies being greater than or equal to 1.25 times and less than or equal to 2.75 times the length of contact between each of the fourth external electrode and the sixth external electrode and the sixth surface.

11. The multilayer electronic assembly according to claim 1, wherein, The first electrode layer is provided on the first surface and the second surface.

12. The multilayer electronic assembly according to claim 1, wherein, In the first direction, the average length of the first electrode layer is greater than or equal to 1μm and less than or equal to 9μm.

13. The multilayer electronic assembly according to claim 1, wherein, The external electrode further includes a third electrode layer provided on the second electrode layer.

14. The multilayer electronic assembly according to claim 1, wherein, The multi-layer electronic component satisfies 30μm ≤ T ≤ 3 / 5 × W, where T is the length of the multi-layer electronic component in the first direction, and W is the length of the multi-layer electronic component in the third direction.

15. The multilayer electronic assembly according to claim 1, wherein, In the second direction, the length of contact between the second external electrode and the fifth surface is longer than the length of contact between each of the first external electrode and the third external electrode and the fifth surface.

16. The multilayer electronic assembly according to claim 1, wherein, In the second direction, the length of contact between the fifth external electrode and the sixth surface is longer than the length of contact between each of the fourth external electrode and the sixth external electrode and the sixth surface.

17. A multi-layer electronic component, comprising: A main body, including a dielectric layer and an internal electrode layer, the internal electrode layer and the dielectric layer are alternately arranged in a first direction, the main body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface, the second surface, the third surface and the fourth surface; And A plurality of external electrodes, including a first electrode layer provided on the main body and a second electrode layer provided on the first electrode layer and connected to the internal electrode layer, Wherein, 0 < D2 / D1 ≤ 1.2, where D1 is the distance between two adjacent external electrodes among the plurality of external electrodes in the third direction, and D2 is the distance between two adjacent external electrodes among the plurality of external electrodes arranged adjacent to each other in the second direction.

18. The multilayer electronic assembly according to claim 17, wherein, The plurality of external electrodes includes a first external electrode disposed at a corner of the main body and a second external electrode spaced apart from the first external electrode, and In the second direction, the length of contact between the second external electrode and the fifth surface of the body is longer than the length of contact between the first external electrode and the fifth surface of the body.

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