Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a thickness direction; an external electrode disposed on the main body; and a side edge portion disposed on the body wherein the side edge portion includes a first edge layer disposed to contact the body and a second edge layer disposed on the first edge layer, and wherein the first edge layer is disposed to contact the body and the second edge layer is disposed to contact the body. The first edge layer and the second edge layer differ in at least one of an average size and a dielectric composition of a die.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0163277, filed on November 15, 2024, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2025-0038170, filed on March 25, 2025, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) can be chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices (including liquid crystal displays (LCDs), plasma display panels (PDPs)), computers, smartphones, mobile phones, etc.), for charging or discharging from them.

[0004] Multilayer ceramic capacitors are used as components in various electronic devices due to their small size, high capacitance, and ease of installation. As electronic devices such as computers and mobile devices have become miniaturized and achieve high output, the demand for miniaturized and high-capacitance multilayer ceramic capacitors has increased.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to maximize the effective electrode area (increasing the effective volume fraction required to achieve capacitance). To achieve small size and high capacitance in multilayer ceramic capacitors, the inner electrodes can be manufactured to expose the width of the body, thereby maximizing the width dimension of the inner electrodes through a borderless design. In this case, a method can be used to prevent the inner electrodes from being exposed to the outside by individually attaching ceramic green sheets for the side edges to the exposed surface of the inner electrodes in the width direction and then sintering them.

[0006] Since the side edge portion is formed by attaching ceramic green sheets separately for the side edge portion, the capacitance per unit volume of the capacitor can be improved. However, problems such as shortened sheet life and defects may occur due to external moisture penetration through the interface joint between the body and the side edge portion, and plating solution penetration during the plating process. Summary of the Invention

[0007] One of the problems this disclosure aims to solve is to provide a multilayer electronic component with excellent moisture resistance and reliability.

[0008] One of the various problems this disclosure aims to solve is to provide a multilayer electronic assembly with reduced porosity.

[0009] One of the problems this disclosure aims to solve is to provide a multilayer electronic component with excellent toughness and resistance to bending cracks.

[0010] The problems to be solved by this disclosure are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0011] A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and an inner electrode, the inner electrode and the dielectric layer being alternately disposed in a thickness direction, and the body including a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a width direction; a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface; a first side edge portion disposed on the fifth surface and extending to a portion of the first surface and a portion of the second surface; and a second side edge portion disposed on the sixth surface and extending to a portion of the first surface and a portion of the second surface, wherein the first side edge portion and the second side edge portion each include a first edge layer and a second edge layer, the first edge layer being configured to contact the body, the second edge layer being disposed on the first edge layer, and wherein the first edge layer and the second edge layer differ in at least one aspect of the average grain size and dielectric composition.

[0012] A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a capacitor forming portion and having a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in the width direction; and a first side edge portion and a second side edge portion respectively disposed on the fifth surface and the sixth surface, extending to a portion of the first surface and a portion of the second surface, and each including a first edge layer in contact with the body and a second edge layer disposed on the first edge layer, wherein the first side edge portion and the second side edge portion are configured to extend to a portion of the third surface and a portion of the fourth surface, and wherein the first edge layer and the second edge layer are separated from each other by a boundary surface between the first edge layer and the second edge layer.

[0013] A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a capacitor forming portion and having a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and opposite to each other in the width direction; and a first side edge portion and a second side edge portion respectively disposed on the fifth surface and the sixth surface, extending to a portion of the first surface and a portion of the second surface, and each including a first edge layer in contact with the body and a second edge layer disposed on the first edge layer, wherein the average size of the grains in the first edge layer is larger than the average size of the grains in the second edge layer, wherein the portion of the first side edge portion disposed on the first surface and the portion disposed on the second surface both include a region substantially recessed toward the fifth surface, and the portion of the second side edge portion disposed on the first surface and the portion disposed on the second surface both include a region substantially recessed toward the sixth surface. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0015] Figure 2 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component with its external electrodes removed.

[0016] Figure 3 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component with its outer electrodes and side edges removed.

[0017] Figure 4 schematically shown Figure 1 A cross-sectional view taken along line I-I' of a multilayer electronic component.

[0018] Figure 5 schematically shown Figure 2 A plan view of a multilayer electronic assembly in its current state.

[0019] Figure 6 schematically shown Figure 2 A side view of a multilayer electronic assembly in its current state.

[0020] Figure 7 schematically shown Figure 1A cross-sectional view taken along line II-II' of the multilayer electronic component.

[0021] Figure 8 schematically shown Figure 7 A magnified view of region M.

[0022] Figure 9A This is an image of a portion of the first side edge of the embodiment, taken using a scanning electron microscope (SEM). Figure 9B This is an image of a portion of the second side edge of the same embodiment, taken using a scanning electron microscope (SEM). Figure 9C This is an image of another portion of the second side edge of the same embodiment, taken using a scanning electron microscope (SEM).

[0023] Figure 10A The images are taken using a scanning electron microscope (SEM) and show the grains in the first and second edge layers, including the second side edge portion of the embodiment. Figure 10B Through the program Figure 10A Images of grains distinguished in the image.

[0024] Figure 11A The thickness of each region of the first electrode layer in the comparative example is shown in a color palette, and the percentage of each thickness is shown in a bar chart. Figure 11B The thickness of each region of the first electrode layer of the invention is shown in a color scheme, and the percentage of each thickness is shown in a bar chart. Detailed Implementation

[0025] In the following description, embodiments of the present disclosure will be described with reference to specific examples and accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, for clarity of description, the shape, size, etc., of elements in the drawings may be exaggerated, and elements denoted by the same reference numerals in the drawings are the same elements.

[0026] Additionally, in the accompanying drawings, for clarity of illustration, parts unrelated to the description will be omitted to clarify the disclosure, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to denote the same components having the same reference numerals. Furthermore, throughout the specification, unless explicitly stated otherwise, when an element is referred to as "comprising" or "including" another element, it means that the element may also include other elements, without excluding other elements.

[0027] In the accompanying drawings, the Z direction can be defined as the thickness direction or a first direction, the X direction can be defined as the length direction or a second direction, and the Y direction can be defined as the width direction or a third direction.

[0028] In addition, the stacking direction can be either the thickness direction or the width direction.

[0029] Multilayer electronic components Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0030] Figure 2 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component with its external electrodes removed.

[0031] Figure 3 schematically shown Figure 1 A three-dimensional view of a multilayer electronic component with its outer electrodes and side edges removed.

[0032] Figure 4 schematically shown Figure 1 A cross-sectional view taken along line I-I' of a multilayer electronic component.

[0033] Figure 5 schematically shown Figure 2 A plan view of a multilayer electronic assembly in its current state.

[0034] Figure 6 schematically shown Figure 2 A side view of a multilayer electronic assembly in its current state.

[0035] Figure 7 schematically shown Figure 1 A cross-sectional view taken along line II-II' of the multilayer electronic component.

[0036] Figure 8 schematically shown Figure 7 A magnified view of region M.

[0037] In the following text, refer to Figures 1 to 8 The present disclosure will describe in detail multilayer electronic components according to embodiments thereof. However, while a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present disclosure is also applicable to various electronic products utilizing dielectric compositions, such as inductors, piezoelectric elements, rheostats, thermistors, etc.

[0038] A multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122, the inner electrodes 121 and 122 being alternately disposed with the dielectric layer 111 in the thickness direction, and the body 110 including a first surface 1 and a second surface 2 opposite to each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the length direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in the width direction; a first external electrode 131 and a second external electrode 132 respectively disposed on the third surface 3 and the fourth surface 4; and a first side edge portion 114 disposed thereon. On the fifth surface 5 and extending to a portion of the first surface 1 and a portion of the second surface 2; and a second side edge portion 115, disposed on the sixth surface 6 and extending to a portion of the first surface 1 and a portion of the second surface 2, wherein the first side edge portion 114 and the second side edge portion 115 include first edge layers 114a and 115a and second edge layers 114b and 115b, the first edge layers 114a and 115a being configured as contact bodies 110, the second edge layers 114b and 115b being disposed on the first edge layers 114a and 115a, and wherein the first edge layers 114a and 115a and the second edge layers 114b and 115b are different in at least one aspect of the average grain size and dielectric composition.

[0039] In the body 110, dielectric layer 111 and internal electrodes 121 and 122 may be stacked alternately.

[0040] More specifically, the body 110 may include a capacitor forming portion Ac disposed in the body 110 and including a first inner electrode 121 and a second inner electrode 122 alternately arranged opposite each other, and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122 to form a capacitor.

[0041] Although there are no particular restrictions on the specific shape of the main body 110, such as Figure 2 As shown, the body 110 may have a hexahedral shape or the like. Due to the shrinkage of the ceramic particles included in the body 110 during the sintering process, the body 110 may not have a perfect regular hexahedral shape, but may have a roughly hexahedral shape.

[0042] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in the thickness direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction.

[0043] The multiple dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to distinguish the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0044] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained using it. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. The barium titanate-based materials may include BaTiO3-based ceramic powders. Examples of BaTiO3-based ceramic powders may include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0045] Furthermore, for the purposes of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) which are raw materials for forming the dielectric layer 111.

[0046] In order to distinguish the dielectric layer included in the capacitance forming portion Ac from the dielectric layers included in the covering portions 112 and 113 and the side edge portions 114 and 115 which will be described later, the dielectric layer included in the capacitance forming portion Ac can be defined as the first dielectric layer, the dielectric layers included in the covering portions 112 and 113 can be defined as the second dielectric layer (not clearly shown in the figure), and the dielectric layers included in the side edge portions 114 and 115 can be defined as the third dielectric layer.

[0047] Furthermore, the first dielectric layer to the third dielectric layer can be formed using a dielectric material such as barium titanate (BaTiO3), and thus may include a dielectric microstructure after sintering. The dielectric microstructure may include multiple grains, grain boundaries provided between adjacent grains, and triple points provided at points where three or more grain boundaries meet, and may respectively include multiple grains, multiple grain boundaries, and multiple triple points.

[0048] The thickness td of the dielectric layer 111 is not particularly limited.

[0049] To facilitate the miniaturization and high capacitance of multilayer electronic components, the thickness td of dielectric layer 111 can be 1.5 μm or less, 1.2 μm or less, 1.0 μm or less, 0.8 μm or less, or 0.6 μm or less. Furthermore, to achieve ultra-miniaturization, the thickness td of dielectric layer 111 can be 0.5 μm or less, or 0.4 μm or less.

[0050] In this case, the thickness td of the dielectric layer 111 can represent the thickness td of the dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0051] In this case, the thickness td of dielectric layer 111 can be the concept of the thickness td of one of the plurality of dielectric layers 111, or it can be the concept of the thickness td of each of all dielectric layers 111.

[0052] Furthermore, the thickness td of dielectric layer 111 can represent the average thickness td of a dielectric layer 111, the average thickness td of each of a plurality of dielectric layers 111, or the average thickness td of a plurality of dielectric layers 111.

[0053] The average thickness td of dielectric layer 111 can be measured by scanning an image of the cross-section of the body 110 in the length and thickness directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of a dielectric layer 111 can be represented as the average value calculated by measuring the thickness of a dielectric layer 111 at five (5) equally spaced points in the length direction in the scanned image. These five (5) equally spaced points can be specified in the capacitor forming section Ac. Furthermore, the average thickness td of multiple dielectric layers 111 can be more generalized when the average value measurement is extended to three dielectric layers 111 and the average value is calculated.

[0054] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0055] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite each other, and a dielectric layer 111 is located between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0056] More specifically, the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body 110 and may be connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 and may be connected to the second inner electrode 122.

[0057] For example, the first inner electrode 121 may be connected to the first outer electrode 131 but not to the second outer electrode 132, and the second inner electrode 122 may be connected to the second outer electrode 132 but not to the first outer electrode 131. In this case, the first inner electrode 121 and the second inner electrode 122 may be electrically isolated from each other by a dielectric layer 111 disposed between them.

[0058] The body 110 can be formed by alternately stacking a first ceramic green sheet on which a conductive paste for a first internal electrode (which will become the first internal electrode 121) is printed and a second ceramic green sheet on which a conductive paste for a second internal electrode (which will become the second internal electrode 122) is printed, and then sintering the stacked sheets. The method of printing the conductive paste for the internal electrode may include screen printing, gravure printing, etc., and this disclosure is not limited thereto.

[0059] There are no particular limitations on the materials used to form the internal electrodes 121 and 122, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0060] The thickness te of the inner electrodes 121 and 122 does not need to be specifically limited. The following description of the thickness te of the inner electrodes 121 and 122 can represent the thickness te of each of the first inner electrode 121 and the second inner electrode 122.

[0061] To achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness te of the inner electrodes 121 and 122 can be 1.5 μm or less, 1.2 μm or less, 1.0 μm or less, 0.8 μm or less, or 0.6 μm or less. Furthermore, to achieve ultra-miniaturization, the thickness te of the inner electrodes 121 and 122 can be 0.5 μm or less, or 0.4 μm or less.

[0062] In this case, the thickness te of the inner electrodes 121 and 122 can be the concept of the thickness te of at least one of the multiple inner electrodes 121 and 122, or it can be the concept of the thickness te of all the inner electrodes 121 and 122.

[0063] In addition, the thickness te of the inner electrodes 121 and 122 may represent the average thickness te of one inner electrode 121 and 122, or the average thickness te of each of a plurality of inner electrodes 121 and 122, or the average thickness te of a plurality of inner electrodes 121 and 122.

[0064] The average thickness *te* of the inner electrodes 121 and 122 can be measured by scanning an image of the body 110 at 10,000x magnification using a scanning electron microscope (SEM) to scan cross-sections in both the length and thickness directions. More specifically, the average thickness *te* of one inner electrode 121 and 122 can be the average value calculated by measuring the thickness of one inner electrode at five (5) equally spaced points in the length direction in the scanned image. These five (5) equally spaced points can be specified in the capacitor forming section *Ac*. Furthermore, the average thickness *te* of multiple inner electrodes 121 and 122 can be more generalized when this average value measurement is extended to three inner electrodes 121 and 122 and their average values ​​are calculated.

[0065] The main body 110 may include cover portions 112 and 113 disposed on two surfaces of the capacitor forming portion Ac in the thickness direction.

[0066] Specifically, the covers 112 and 113 may include: a first cover 112 disposed on one surface of the capacitor forming portion Ac in the thickness direction; and a second cover 113 disposed on another surface of the capacitor forming portion Ac in the thickness direction. More specifically, the covers 112 and 113 may include a first cover 112 disposed below the capacitor forming portion Ac in the thickness direction, and a second cover 113 disposed above the capacitor forming portion Ac in the thickness direction.

[0067] The first cover portion 112 and the second cover portion 113 can be formed by providing or stacking a single second dielectric layer or two or more second dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and can substantially prevent the inner electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0068] The first cover portion 112 and the second cover portion 113 do not include the inner electrodes 121 and 122, and may include the same dielectric material as the dielectric material of the first dielectric layer 111 of the capacitor forming portion Ac. For example, the first cover portion 112 and the second cover portion 113 may include dielectric materials, and may include a dielectric material such as barium titanate (BaTiO3) based dielectric material.

[0069] The thickness tc of the covering portions 112 and 113 does not need to be particularly limited, and the thickness tc of the covering portions 112 and 113 described below can represent the thickness tc of each of the first covering portion 112 and the second covering portion 113.

[0070] To more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness tc of the covers 112 and 113 can be 100 μm or less or 50 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in ultra-small products.

[0071] In this case, the thickness tc of the covers 112 and 113 can represent the average thickness of the covers 112 and 113.

[0072] In addition, the average thickness tc of the covering portions 112 and 113 may represent the average thickness tc of each of the first covering portion 112 and the second covering portion 113, or may represent the average thickness tc of the first covering portion 112 and the second covering portion 113.

[0073] The average thickness tc of the covers 112 and 113 can be measured by scanning images of the body 110 in the length and thickness directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness tc can be expressed as the average value calculated by measuring the thickness of a cover 112 and 113 at five (5) equally spaced points in the length direction in the scanned image.

[0074] Furthermore, the average thickness tc of the covering portions 112 and 113 measured by the above method can have a value that is substantially the same as the average thickness of the covering portions 112 and 113 in the cross-section of the body 110 in the width and thickness directions.

[0075] The multilayer electronic assembly 100 may include side edges 114 and 115 disposed on two surfaces of the body 110 in the third-direction orientation.

[0076] More specifically, the side edge portions 114 and 115 may include: a first side edge portion 114 disposed on the fifth surface 5 of the body 110; and a second side edge portion 115 disposed on the sixth surface 6 of the body 110.

[0077] The side edge portions 114 and 115 can be formed as follows, but are not particularly limited thereto. First, conductive paste can be applied to the portion of the ceramic green sheet used for capacitor forming portion Ac, excluding the portion where the side edge portions 114 and 115 will be formed, thereby forming the inner electrodes 121 and 122. In this case, in order to suppress the step difference caused by the inner electrodes 121 and 122, a cutting can be performed after stacking to expose the inner electrodes 121 and 122 from the fifth surface 5 and the sixth surface 6 of the body 110, and then a single dielectric layer or two or more dielectric layers can be arranged or stacked along a third direction on the fifth surface 5 and the sixth surface 6 of the body 110.

[0078] The side edges 114 and 115 can essentially prevent the inner electrodes 121 and 122 from being damaged by physical and / or chemical stress.

[0079] Furthermore, the side edges 114 and 115 do not include the inner electrodes 121 and 122, and may include the same material as the first dielectric layer 111. For example, the first side edge 114 and the second side edge 115 may include a dielectric material, such as a barium titanate (BaTiO3) based dielectric material.

[0080] More specifically, the side edges 114 and 115 may include the main and auxiliary components of a dielectric material (e.g., a barium titanate (BaTiO3)-based dielectric material).

[0081] The auxiliary components included in the side edge portions 114 and 115 may include, but are not particularly limited to, at least one of calcium (Ca), magnesium (Mg), silicon (Si), aluminum (Al), manganese (Mn), tin (Sn), zirconium (Zr), gallium (Ga) and phosphorus (P), and the specific content or amount of the auxiliary components will be described later.

[0082] In this disclosure, "major component" may refer to a component that occupies a relatively high weight percentage, a relatively high atomic percentage, or a relatively high molar percentage compared to other components. For example, the total weight of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) accounts for 50 wt% or more of the component, the total number of atoms of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) accounts for 50 at% or more of the component, or the total molar number of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) accounts for 50 mol% or more of the component.

[0083] Furthermore, in this disclosure, "auxiliary component" may refer to a component that occupies a relatively low weight ratio, a relatively low atomic ratio, or a relatively low molar ratio compared to other components. For example, the total weight of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) may be less than 50 wt%, the total number of atoms of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) may be less than 50 at%, or the total molar number of the component based on the multilayer electronic component 100 (e.g., dielectric layer 111) may be less than 50 mol%.

[0084] Furthermore, as an example of a more specific method for measuring the amount of elements included in each structure of the multilayer electronic assembly 100, the composition can be analyzed using the energy-dispersive X-ray spectroscopy (EDS) mode of a scanning electron microscope (SEM), the EDS mode of a transmission electron microscope (TEM), or the EDS mode of a scanning transmission electron microscope (STEM). First, a thinned analytical sample can be prepared in the area to be measured using a focused ion beam (FIB) device. The thinned analytical sample can be milled with Xe or Ar ions to remove a damaged layer on the surface, and then the various components to be measured can be mapped from the images obtained using SEM-EDS, TEM-EDS, or STEM-EDS for qualitative / quantitative analysis. In this case, the qualitative / quantitative analysis maps of the various components can be expressed by converting them to mass percentages (wt%), atomic percentages (at%), or molar percentages (mol%) of the various elements, and can also be expressed by converting / transforming the amount of one particular component relative to the amount of another particular component.

[0085] In another method, the sheet can be shredded to select the area to be measured, and the composition of the selected area, including the dielectric microstructure, can be analyzed using devices such as inductively coupled plasma optical emission spectrometry (ICP-OES) or inductively coupled plasma mass spectrometry (ICP-MS).

[0086] The thickness WM0 of the side edge portions 114 and 115 does not need to be specifically limited, and the following description of the thickness WM0 of the side edge portions 114 and 115 can represent the thickness WM0 of each of the first side edge portion 114 and the second side edge portion 115.

[0087] To more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness WM0 of the side edges 114 and 115 may be 50 μm or less, preferably 40 μm or less, and the thickness WM0 may be 5 μm or more, preferably 10 μm or more.

[0088] In this case, the thickness of the side edge portions 114 and 115 can be the concept of the (average) thickness WM0 or the (average) width direction length WM0 of each of the first main side edge portion 114-0 disposed on the fifth surface 5 and the second main side edge portion 115-0 disposed on the sixth surface 6, but is not particularly limited thereto. The thickness of the side edge portions 114 and 115 can be the concept of the (average) thickness or the (average) thickness direction length of each of the first extensions 114-1, 114-2, 115-1 and 115-2 of the first and second side edge portions described below, and the (average) thickness or the (average) length direction length of each of the second extensions 114-3, 114-4, 115-3 and 115-4 of the first and second side edge portions described below. A detailed description of the various regions of the side edge portions 114 and 115 will be described later.

[0089] In this case, the thickness WM0 of the side edges 114 and 115 can represent the average thickness WM0 of the side edges 114 and 115.

[0090] Furthermore, the average thickness WM0 of the side edge portions 114 and 115 may represent the average thickness WM0 of each of the first side edge portion 114 and the second side edge portion 115, or may represent the average thickness WM0 of the first side edge portion 114 and the second side edge portion 115.

[0091] The average thickness WM0 of the side edges 114 and 115 can be measured by scanning an image of the body 110 in both the width and thickness directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness WM0 of the side edges 114 and 115 can be represented as the average value calculated by measuring the length in the width direction of one side edge 114 and 115 at five (5) equally spaced points in the thickness direction in the scanned image.

[0092] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to maximize the effective electrode area (increasing the effective volume fraction required to achieve capacitance). To achieve small size and high capacitance in multilayer ceramic capacitors, the inner electrodes can be manufactured to expose the width of the body, thereby maximizing the width dimension of the inner electrodes through a borderless design. In this case, a method can be used to prevent the inner electrodes from being exposed to the outside by individually attaching ceramic green sheets for the side edges to the exposed surface of the inner electrodes in the width direction and then sintering them.

[0093] Since the side edge portion is formed by attaching ceramic green sheets separately for the side edge portion, the capacitance per unit volume of the multilayer ceramic capacitor can be improved. However, problems such as shortened sheet life and defects may occur due to external moisture penetration through the interface joint between the main body and the side edge portion, and plating solution penetration during the plating process.

[0094] This disclosure improves the aforementioned problems by forming the side edge portion to extend longer than a conventional side edge portion to cover the body, thereby blocking or isolating the penetration path of external moisture or plating solution that may penetrate through the interface joint formed at the boundary between the body and the side edge portion.

[0095] Therefore, in the multilayer electronic assembly 100 according to embodiments of the present disclosure, side edge portions 114 and 115 may include a first side edge portion 114 and a second side edge portion 115. The first side edge portion 114 is disposed on the fifth surface 5 and extends to a portion of the first surface 1 and a portion of the second surface 2, and the second side edge portion 115 is disposed on the sixth surface 6 and extends to a portion of the first surface 1 and a portion of the second surface 2. Furthermore, the first side edge portion 114 may be configured to extend to a portion of the third surface 3 and a portion of the fourth surface 4, and the second side edge portion 115 may be configured to extend to a portion of the third surface 3 and a portion of the fourth surface 4. The specific structures of the first side edge portion 114 and the second side edge portion 115 will be described later.

[0096] The first side edge portion 114 and the second side edge portion 115 may include first edge layers 114a and 115a configured to contact the body 110 and second edge layers 114b and 115b disposed on the first edge layers 114a and 115a.

[0097] First edge layers 114a and 115a and second edge layers 114b and 115b may be disposed on the fifth surface 5 and the sixth surface 6, and may be configured to extend into a portion of the first surface 1 and a portion of the second surface 2. Furthermore, first edge layers 114a and 115a and second edge layers 114b and 115b may be configured to extend into a portion of the third surface 3 and a portion of the fourth surface 4.

[0098] In this disclosure, the first edge layer 114a of the first side edge portion may also be referred to as 1-1 edge layer 114a, the first edge layer 115a of the second side edge portion may also be referred to as 1-2 edge layer 115a, the second edge layer 114b of the first side edge portion may also be referred to as 2-1 edge layer 114b, and the second edge layer 115b of the second side edge portion may also be referred to as 2-2 edge layer 115b.

[0099] Furthermore, unless specifically contradicted in this disclosure, it will be readily understood by those skilled in the art that the description of the first edge layers 114a and 115a corresponds to the description of edge layer 114a 1-1 and edge layer 115a 1-2, and the description of the second edge layers 114b and 115b corresponds to the description of edge layer 114b 2-1 and edge layer 115b 2-2, and vice versa.

[0100] Reference Figures 9A to 9C This makes it easier to understand this disclosure. Figure 9A This is an image of a portion of the first side edge of the embodiment, taken using a scanning electron microscope (SEM). Figure 9B This is an image of a portion of the second side edge of the same embodiment, taken using a scanning electron microscope (SEM). Figure 9C This is an image of another portion of the second side edge of the same embodiment, taken using a scanning electron microscope (SEM).

[0101] Edge layer 114a (1-1) may be disposed on the fifth surface 5, and may extend to a portion of the first surface 1 and a portion of the second surface 2, and may also extend to a portion of the third surface 3 and a portion of the fourth surface 4. Edge layer 114b (2-1) may be disposed on edge layer 114a (1-1). More specifically, edge layer 114b may be disposed on edge layer 114a (1-1) disposed on the fifth surface 5 and edge layer 114a (1-1) extending to a portion of the first surface 1 and a portion of the second surface 2, and edge layer 114b may also be disposed on edge layer 114a (1-1) extending to a portion of the third surface 3 and a portion of the fourth surface 4. In this case, preferably, edge layer 114b is configured to cover edge layer 114a (1-1) to improve moisture resistance reliability, but is not particularly limited thereto; as long as edge layer 114b can be disposed on edge layer 114a (1-1), moisture resistance reliability can be improved.

[0102] Similarly, edge layer 115a can be disposed on the sixth surface 6 and can extend to a portion of the first surface 1 and a portion of the second surface 2, and can also be configured to extend to a portion of the third surface 3 and a portion of the fourth surface 4. Edge layer 115b can be disposed on edge layer 115a. More specifically, edge layer 115b can be disposed on edge layer 115a disposed on the sixth surface 6 and edge layer 115a extending to a portion of the first surface 1 and a portion of the second surface 2, and edge layer 115b can also be disposed on edge layer 115a extending to a portion of the third surface 3 and a portion of the fourth surface 4. In this case, preferably, edge layer 115b is configured to cover edge layer 115a to improve moisture resistance reliability, but it is not particularly limited thereto; as long as edge layer 115b can be disposed on edge layer 115a, moisture resistance reliability can be improved.

[0103] The first edge layers 114a and 115a and the second edge layers 114b and 115b may differ in at least one aspect of the average grain size and dielectric composition, and the first edge layers 114a and 115a and the second edge layers 114b and 115b may have boundary surfaces to be distinguished as different layers.

[0104] For example, edge layers 1-1 and 2-1 may differ in at least one aspect of the average grain size and dielectric composition, and a boundary surface may be provided between edge layers 1-1 and 2-1 to distinguish them from each other. Furthermore, edge layers 1-2 and 2-2 may differ in at least one aspect of the average grain size and dielectric composition, and a boundary surface may be provided between edge layers 1-2 and 2-2 to distinguish them from each other.

[0105] In this context, a "distinguishing boundary surface" can refer to two layers that are distinguished by physical, chemical, and / or simple optical differences, and although not particularly limited thereto, the distinction between layers can be made by the presence or absence of a "boundary surface." A boundary surface can refer to a surface that allows two layers in contact to be distinguished from each other, and for example, a boundary surface can refer to a state distinguishable by the average size difference of grains analyzed by equipment such as scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM), or compositional differences analyzed by EDS.

[0106] In this case, "different in terms of average grain size" in the first edge layers 114a and 115a and the second edge layers 114b and 115b can mean that the difference in average grain size between the first edge layers 114a and 115a and the second edge layers 114b and 115b can be 25 μm or greater, preferably 50 μm or greater, and more preferably 100 μm or greater.

[0107] The average size of the grains included in the first edge layers 114a and 115a and the second edge layers 114b and 115b can be obtained by the following method, but is not particularly limited thereto. First, the width and thickness cross-sections of the side edge segment can be imaged using a scanning electron microscope (SEM), a transmission electron microscope (TEM), or a scanning transmission electron microscope (STEM). Then, the grains can be distinguished using an image analysis program, and the size of each grain can be obtained using a size analysis program. Finally, the average size of the grains can be obtained by averaging the grain sizes. In this case, the image analysis program and / or the size analysis program can be a program built into a scanning electron microscope (SEM), a transmission electron microscope (TEM), or a scanning transmission electron microscope (STEM), but is not particularly limited thereto.

[0108] More specifically, for example, the size of a dielectric grain (grain size) can be represented as the arithmetic mean of the maximum and minimum Feret diameters of the dielectric grain. The Feret diameter can be the distance between two parallel lines that completely encompass the dielectric grain when its outer surface is projected in a particular direction (i.e., the distance between the two boundary parallel lines of the grain's projected profile measured along a certain direction). Among the Feret diameter values ​​measured in all possible directions of the dielectric grain, the maximum value can be the maximum Feret diameter, and the minimum value can be the minimum Feret diameter. Furthermore, the average size of 50 or more dielectric grains can be used as the average size of the dielectric grain.

[0109] The average size of the grains in the first edge layers 114a and 115a may be different from the average size of the grains in the second edge layers 114b and 115b.

[0110] Since the average size of the grains in the first edge layers 114a and 115a may be different from the average size of the grains in the second edge layers 114b and 115b, some areas of the first side edge portion 114 and the second side edge portion 115 may have excellent moisture resistance, and other areas may have excellent impact resistance, thereby effectively protecting the capacitor forming portion Ac from external impact and improving the problem of cracking caused by installation.

[0111] For example, more specifically, if the average grain size of the grains in the first edge layers 114a and 115a is Gs1 and the average grain size of the grains in the second edge layers 114b and 115b is Gs2, then the average grain size Gs1 of the grains in the first edge layers 114a and 115a can be greater than the average grain size Gs2 of the grains in the second edge layers 114b and 115b (Gs2 < Gs1).

[0112] Since the average grain size (Gs1) of the grains in the first edge layers 114a and 115a can be greater than the average grain size (Gs2) of the grains in the second edge layers 114b and 115b (Gs2 < Gs1), the moisture-proof reliability of the first edge layers 114a and 115a adjacent to the capacitor formation part Ac can be improved, so that the internal electrodes 121 and 122 can be effectively prevented from short-circuiting due to external moisture penetration, and the impact resistance of the second edge layers 114b and 115b adjacent to the outside can be improved, so that the capacitor formation part Ac can be effectively protected from external impact, and the problem of cracks caused by installation can be improved.

[0113] Refer to Figure 10A and Figure 10B This disclosure will be more easily understood. Figure 10A is an image of the grains in the regions of the first edge layer 115a and the second edge layer 115b of the second side edge part of an embodiment of this disclosure taken by a scanning electron microscope (SEM), Figure 10B is for Figure 10A an image of the grains distinguished by a program built into the scanning electron microscope (SEM). Refer to Figure 10A and Figure 10B , it can be seen that the average grain sizes of the grains in the first edge layer 115a and the second edge layer 115b of the second side edge part can be different.

[0114] In this case, the average grain size (Gs1) of the grains in the first edge layers 114a and 115a can satisfy 200 μm ≤ Gs1 ≤ 300 μm, but it is not particularly limited thereto.

[0115] Since the average grain size (Gs1) of the grains in the first edge layers 114a and 115a satisfies 200 μm ≤ Gs1 ≤ 300 μm, the densification of the first edge layers 114a and 115a can be excellent and the pores can be small pores, so that excellent moisture-proof reliability can be achieved.

[0116] When the average grain size Gs1 of the grains in the first edge layers 114a and 115a exceeds 300 μm (300 μm < Gs1), it may be difficult to control the uniform growth of the grains, raising concerns that the direct current (DC) capacitance may not be excellent. When the average grain size (Gs1) of the grains in the first edge layers 114a and 115a is less than 200 μm (Gs1 < 200 μm), the grain growth may be insufficient, resulting in insufficient densification and concerns that the moisture-proof reliability may not be excellent due to the presence of many pores.

[0117] The average grain size (Gs2) of the grains in the second edge layers 114b and 115b can satisfy 75 μm ≤ Gs2 ≤ 175 μm, but is not particularly limited thereto.

[0118] Since the average grain size (Gs2) of the grains in the second edge layers 114b and 115b satisfies 75 μm ≤ Gs2 ≤ 175 μm, the grain sizes of the second edge layers 114b and 115b can be small, thus improving the impact resistance.

[0119] When the average grain size (Gs2) of the grains in the second edge layers 114b and 115b exceeds 175 μm (175 μm < Gs2), there may be concerns about a reduction in impact resistance. When the average grain size (Gs2) of the grains in the second edge layers 114b and 115b is less than 75 μm (Gs2 < 75 μm), there may be concerns that the grain growth is overly inhibited and sintering cannot proceed sufficiently.

[0120] In addition, the dielectric compositions of the first edge layers 114a and 115a may be different from those of the second edge layers 114b and 115b.

[0121] In this case, "being different in dielectric composition" between the first edge layers 114a and 115a and the second edge layers 114b and 115b may mean that at least one of the main component and the auxiliary component includes different elements. Even if the same elements are included, it may also mean that the average mole number of a specific element based on 100 moles of titanium (Ti) is different. More specifically, it may mean that the difference in the average mole number of a specific element based on 100 moles of titanium (Ti) is 0.5 mole or more.

[0122] As described above, the side edge portions 114 and 115 may include the main component and the auxiliary component of the dielectric material. The first edge layers 114a and 115a and the second edge layers 114b and 115b may also include the main component and the auxiliary component of the dielectric material, and the first edge layers 114a and 115a and the second edge layers 114b and 115b may have different dielectric compositions.

[0123] In addition, unless there may be special circumstances below, the number of moles of a specific element can represent the average number of moles of the specific element and can be represented as the number of moles based on 100 moles of titanium (Ti).

[0124] More specifically, for example, if the average number of moles of gallium (Ga) in the first edge layers 114a and 115a relative to 100 moles of titanium (Ti) is Ga1, and the average number of moles of gallium (Ga) in the second edge layers 114b and 115b relative to 100 moles of titanium (Ti) is Ga2, then Ga2 < Ga1 can be satisfied.

[0125] Specifically, the first edge layers 114a and 115a may include gallium (Ga), and preferably include an amount of gallium (Ga) of 1 mole or less (Ga1 ≤ 1 mole). The second edge layers 114b and 115b may not include gallium (Ga) (Ga2 = 0), but are not particularly limited thereto, and the second edge layers 114b and 115b may also include gallium (Ga) (0 ≤ Ga2 < Ga1).

[0126] Gallium (Ga) can be a low-temperature sintering aid, and gallium (Ga) can inhibit the formation of pores by inducing densification of the dielectric microstructure before the growth of the grains is completed. Therefore, it is possible to prevent the breakdown voltage (BDV) from decreasing due to the electric field concentration phenomenon, or it can play a role in improving the moisture-proof reliability by blocking the moisture penetration path.

[0127] By satisfying Ga2 < Ga1, the grain growth and densification of the first edge layers 114a and 115a can be improved, and the grain size can be controlled to inhibit the formation of pores, thereby improving the moisture-proof reliability. For example, compared with the second edge layers 114b and 115b, the first edge layers 114a and 115a may have a lower porosity, a higher density, and a larger average grain size.

[0128] For another example, if the average number of moles of phosphorus (P) in the first edge layers 114a and 115a relative to 100 moles of titanium (Ti) is P1, and the average number of moles of phosphorus (P) in the second edge layers 114b and 115b relative to 100 moles of titanium (Ti) is P2, then P2 < P1 can be satisfied.

[0129] Specifically, the first edge layers 114a and 115a may include phosphorus (P), and preferably include an amount of phosphorus (P) of 1 mole or less (P1 ≤ 1 mole). The second edge layers 114b and 115b may not include phosphorus (P) (P2 = 0), but are not particularly limited thereto, and the second edge layers 114b and 115b may also include phosphorus (P) (0 ≤ P2 < P1).

[0130] Phosphorus (P) can be a low-temperature sintering aid like gallium (Ga), and phosphorus (P) can help form grains of uniform size. In addition, densification of the dielectric microstructure can be induced before the growth of the grains is completed, thereby suppressing the formation of pores, and preventing the breakdown voltage (BDV) from decreasing due to the electric field concentration phenomenon, or improving the moisture-proof reliability by blocking the moisture penetration path.

[0131] By satisfying P2 < P1, the grain growth and densification of the first edge layers 114a and 115a can be improved, and the grain size can be controlled to suppress the formation of pores, thereby improving the moisture-proof reliability. For example, compared with the second edge layers 114b and 115b, the first edge layers 114a and 115a can have a lower porosity, a higher density, and a larger average grain size.

[0132] For another example, if the average molar number of zirconium (Zr) in the first edge layers 114a and 115a relative to 100 moles of titanium (Ti) is Zr1, and the average molar number of zirconium (Zr) in the second edge layers 114b and 115b relative to 100 moles of titanium (Ti) is Zr2, then Zr1 < Zr2 can be satisfied.

[0133] Specifically, the second edge layers 114b and 115b can include zirconium (Zr), and preferably include zirconium (Zr) in an amount of 1 mole or less (Zr2 ≤ 1 mole). The first edge layers 114a and 115a may not include zirconium (Zr) (Zr1 = 0), but is not particularly limited thereto, and the second edge layers 114b and 115b may also include zirconium (Zr) (0 ≤ Zr1 < Zr2).

[0134] Zirconium (Zr) can play a role in suppressing grain growth. In addition, zirconium (Zr) can improve the mechanical strength of the dielectric material by reducing the internal stress when entering the lattice of the main component of the dielectric material (e.g., BaTiO3), and can improve the toughness.

[0135] By satisfying Zr1 < Zr2, the grain growth of the second edge layers 114b and 115b can be suppressed, thereby controlling the grain size, and improving the impact resistance and toughness. For example, compared with the first edge layers 114a and 115a, the second edge layers 114b and 115b can have excellent mechanical strength and toughness, or the average grain size of the grains can be smaller.

[0136] The average thickness of the first edge layers 114a and 115a of each of the first side edge portions 114 and the second side edge portions 115 can be greater than or equal to 1 μm and less than or equal to 5 μm, and the average thickness of the second edge layers 114b and 115b of each of the first side edge portions 114 and the second side edge portions 115 can be greater than or equal to 9 μm and less than or equal to 35 μm.

[0137] Moisture resistance can be significantly improved by ensuring that the average thickness of the first edge layers 114a and 115a is greater than or equal to 1 μm and less than or equal to 5 μm, and impact resistance can be significantly improved by ensuring that the average thickness of the second edge layers 114b and 115b is greater than or equal to 9 μm and less than or equal to 35 μm.

[0138] When the average thickness of the first edge layers 114a and 115a exceeds 5 μm, it may be difficult to achieve miniaturization of the multilayer electronic component 100, and when the average thickness of the first edge layers 114a and 115a is less than 1 μm, there may be concerns that the moisture-proof reliability cannot be adequately improved.

[0139] When the average thickness of the second edge layers 114b and 115b exceeds 35 μm, it may be difficult to achieve miniaturization of the multilayer electronic component 100. When the average thickness of the second edge layers 114b and 115b is less than 9 μm, the impact resistance may not be sufficiently improved, and there may be concerns about cracking due to external impacts, etc.

[0140] The structure of the side edges 114 and 115 will be described in more detail below.

[0141] The side edge portions 114 and 115 may include main side edge portions 114-0 and 115-0 disposed on the fifth surface 5 and the sixth surface 6, and first extension portions 114-1, 114-2, 115-1, and 115-2 disposed extending to a portion of the first surface 1 and a portion of the second surface 2. Additionally, in this disclosure, the first side edge portion 114 and the second side edge portion 115 may be spaced apart from each other.

[0142] The side edge portions 114 and 115 may include first extension portions 114-1, 114-2, 115-1 and 115-2, which are configured to extend to a portion of the first surface 1 and the second surface 2 of the body to effectively prevent the penetration of external moisture or plating solution, thereby improving moisture resistance reliability.

[0143] More specifically, the first side edge portion 114 may include a first main side edge portion 114-0 disposed on the fifth surface 5, and first extension portions 114-1 and 114-2 configured to extend to a portion of the first surface 1 and a portion of the second surface 2. The first extension portions 114-1 and 114-2 of the first side edge portion may include a 1-1 extension portion 114-1 configured to extend to a portion of the first surface 1 and a 1-2 extension portion 114-2 configured to extend to a portion of the second surface 2.

[0144] The second side edge portion 115 may include a second main side edge portion 115-0 disposed on the sixth surface 6, and first extension portions 115-1 and 115-2 configured to extend to a portion of the first surface 1 and a portion of the second surface 2. The first extension portions 115-1 and 115-2 of the second side edge portion may include a 1-1 extension portion 115-1 configured to extend to a portion of the first surface 1 and a 1-2 extension portion 115-2 configured to extend to a portion of the second surface 2.

[0145] Unless otherwise stated in this disclosure, the description of the first extensions 114-1, 114-2, 115-1, and 115-2 of the first and second side edge portions is equally applicable to the first extensions 114-1 and 114-2 of the first side edge portion and the first extensions 115-1 and 115-2 of the second side edge portion. Furthermore, the description of the first extensions 114-1 and 114-2 of the first side edge portion is equally applicable to the 1-1 extension 114-1 and the 1-2 extension 114-2, and the description of the first extensions 115-1 and 115-2 of the second side edge portion is equally applicable to the 1-1 extension 115-1 and the 1-2 extension 115-2.

[0146] At least some regions of the first extensions 114-1, 114-2, 115-1, and 115-2 may have curvature; for example, they may include generally curved or generally concave regions. In this case, generally curved or generally concave regions may mean imperfect curves and may include the concept of having a shape that approximates a curve.

[0147] A first side edge portion 114 disposed on at least one of the first surface 1 and the second surface 2 may include a region that is substantially recessed toward the fifth surface 5, and a second side edge portion 115 disposed on at least one of the first surface 1 and the second surface 2 may include a region that is substantially recessed toward the sixth surface 6.

[0148] For example, the first extensions 114-1 and 114-2 of the first side edge portion may include a region that is generally recessed toward the fifth surface 5, and the first extensions 115-1 and 115-2 of the second side edge portion may include a region that is generally recessed toward the sixth surface 6.

[0149] In this case, the radius of curvature R1 of the substantially concave regions of the first extensions 114-1, 114-2, 115-1, and 115-2 can satisfy 500μm ≤ R1 ≤ 700μm. For example, the curvature κ1 of the substantially concave regions of the first extensions 114-1 and 114-2 of the first side edge portion and the first extensions 115-1 and 115-2 of the second side edge portion can satisfy 1.4mm. -1 ≤κ1≤2.0mm-1 In this case, the curvature κ1 can be the reciprocal of the radius of curvature R1 (κ1 = 1 / R1).

[0150] Since the radius of curvature R1 of the approximately recessed areas of the first extensions 114-1, 114-2, 115-1 and 115-2 satisfies 500μm≤R1≤700μm, the interface between the main body 110 and the first main side edge 114-0 and the second main side edge 115-0 can be fully covered, thereby extending the external moisture penetration path and improving the moisture-proof reliability.

[0151] When R1 < 500 μm, there may be concerns that burr defects may occur, with the first extensions 114-1, 114-2, 115-1 and 115-2 protruding and extending from the body 110. When R1 > 700 μm, there may be concerns that the interface between the body 110 and the first main side edge 114-0 and the interface between the body 110 and the second main side edge 115-0 may be exposed to the outside, thereby reducing the moisture-proof reliability.

[0152] The method for measuring the radius of curvature R1 or curvature κ1 of the first extensions 114-1, 114-2, 115-1, and 115-2 can be as follows. The description will use the 1-2 extension 114-2 of the first side edge as an example; however, it will be readily understood by those skilled in the art that the same applies to the 1-1 extension 114-1 of the first side edge and the 1-1 extensions 115-1 and 1-2 extensions 115-2 of the second side edge.

[0153] First, based on a plan view of the main body 110 excluding the external electrodes 131 and 132 (e.g., facing the second surface 2), the point P1 where the 1-2 extension 114-2 of the first side edge contacts the extended surface of the third surface 3 and the point P2 where the 1-2 extension 114-2 of the first side edge contacts the extended surface of the fourth surface 4 can be marked. Then, the midpoint P3 between P1 and P2 can be marked along the concave end line of the 1-2 extension 114-2 of the first side edge. Furthermore, assuming the concave end line (dashed line) of P1-P3-P2 is part of an imaginary circle, the radius of this imaginary circle can be obtained, thus obtaining the radius of curvature R1. Moreover, by taking the reciprocal of the radius of curvature R1, the curvature κ1 (=1 / R1) can be obtained.

[0154] The width length of at least a portion of the first extensions 114-1, 114-2, 115-1 and 115-2 may increase from the central portion in the length direction to both ends.

[0155] For example, if the width-direction length at the central portion in the length direction of the first extension portions 114-1, 114-2, 115-1, and 115-2 is WM1, and the width-direction length at the end portions in the length direction of the first extension portions 114-1, 114-2, 115-1, and 115-2 is WM1', then WM1 < WM1' can be satisfied. In this case, WM1 can correspond to the minimum value among the width-direction lengths of the first extension portions 114-1, 114-2, 115-1, and 115-2, and WM1' can correspond to the maximum value among the width-direction lengths of the first extension portions 114-1, 114-2, 115-1, and 115-2, but it is not particularly limited thereto.

[0156] Since the first extension portions 114-1, 114-2, 115-1, and 115-2 satisfy WM1 < WM1′, the interfacial adhesiveness between the main body 110 and the side edge portions 114 and 115 can be excellent. Specifically, the moisture penetration at the corner portions where external moisture of the main body 110 easily penetrates, or the interfacial regions between the main body 110 and the first main side edge portion 114-0 and between the main body 110 and the second main side edge portion 115-0 can be further suppressed, so that the moisture-proof reliability of the multilayer electronic component 100 can be further improved.

[0157] In the multilayer electronic component 100 according to an embodiment of the present disclosure, the first side edge portion 114 and the second side edge portion 115 may include second extension portions 114-3, 114-4, 115-3, and 115-4, and the second extension portions 114-3, 114-4, 115-3, and 115-4 may be provided to extend to a part of the third surface 3 and a part of the fourth surface 4.

[0158] The second extension portions 114-3, 114-4, 115-3, and 115-4 may be included and provided to extend to a part of the third surface 3 and a part of the fourth surface 4 of the main body to effectively prevent the penetration of external moisture or plating solution, thereby improving the moisture-proof reliability.

[0159] More specifically, the first side edge portion 114 may include second extension portions 114-3 and 114-4 provided to extend to a part of the third surface 3 and a part of the fourth surface 4. The second extension portions 114-3 and 114-4 of the first side edge portion may include a 2-1 extension portion 114-3 provided to extend to a part of the third surface 3 and a 2-2 extension portion 114-4 provided to extend to a part of the fourth surface 4.

[0160] The second side edge portion 115 may include second extensions 115-3 and 115-4 configured to extend into a portion of the third surface 3 and a portion of the fourth surface 4. The second extensions 115-3 and 115-4 of the second side edge portion may include a 2-1 extension 115-3 configured to extend into a portion of the third surface 3 and a 2-2 extension 115-4 configured to extend into a portion of the fourth surface 4.

[0161] Unless otherwise stated in this disclosure, the descriptions of the second extensions 114-3, 114-4, 115-3, and 115-4 of the first and second side edge portions are equally applicable to the second extensions 114-3 and 114-4 of the first side edge portion and the second extensions 115-3 and 115-4 of the second side edge portion. Furthermore, the descriptions of the second extensions 114-3 and 114-4 of the first side edge portion are equally applicable to the 2-1 extension 114-3 and the 2-2 extension 114-4, and the descriptions of the second extensions 115-3 and 115-4 of the second side edge portion are equally applicable to the 2-1 extension 115-3 and the 2-2 extension 115-4.

[0162] At least some regions of the second extensions 114-3, 114-4, 115-3, and 115-4 may have curvature; for example, they may include generally curved or generally concave regions. In this case, generally curved or generally concave regions may mean imperfect curves and may include the concept of having a shape that approximates a curve.

[0163] A first side edge 114 disposed on at least one of the third surface 3 and the fourth surface 4 may include a region that is substantially recessed toward the fifth surface 5, and a second side edge 115 disposed on at least one of the third surface 3 and the fourth surface 4 may include a region that is substantially recessed toward the sixth surface 6.

[0164] For example, the second extensions 114-3 and 114-4 of the first side edge may include a region that is generally recessed toward the fifth surface 5, and the second extensions 115-3 and 115-4 of the second side edge may include a region that is generally recessed toward the sixth surface 6.

[0165] In this case, the radius of curvature R2 of the substantially concave regions of the second extensions 114-3, 114-4, 115-3, and 115-4 can satisfy 1000μm≤R2≤1200μm. For example, the curvature κ2 of the substantially concave regions of the second extensions 114-3 and 114-4 of the first side edge and the second extensions 115-3 and 115-4 of the second side edge can satisfy 0.8mm. -1 ≤κ2≤1.0mm -1In this case, the curvature κ2 can be the reciprocal of the radius of curvature R2 (κ2 = 1 / R2).

[0166] Since the radius of curvature R2 of the approximately recessed areas of the second extensions 114-3, 114-4, 115-3 and 115-4 satisfies 1000μm≤R2≤1200μm, they can fully cover the interface between the main body 110 and the first main side edge 114-0 and the interface between the main body 110 and the second main side edge 115-0, thereby extending the external moisture penetration path and improving moisture-proof reliability.

[0167] When R2 < 1000 μm, there may be concerns that burr defects may occur, with the second extensions 114-3, 114-4, 115-3 and 115-4 protruding and extending from the body 110. When R2 < 1200 μm, there may be concerns that the interface between the body 110 and the first main side edge 114-0 and the interface between the body 110 and the second main side edge 115-0 may be exposed to the outside, thereby reducing the moisture-proof reliability.

[0168] The method for measuring the radius of curvature R2 or curvature κ2 of the second extensions 114-3, 114-4, 115-3, and 115-4 can be as follows. The 2-1 extension 114-3 of the first side edge will be described as an example; however, it will be readily understood by those skilled in the art that the same applies to the 2-2 extension 114-4 of the first side edge and the 2-1 extensions 115-3 and 2-2 extensions 115-4 of the second side edge.

[0169] First, based on a side view of the main body 110 excluding the external electrodes 131 and 132 (e.g., observing the third-direction side), the point P4 where the extension 114-3 of the first side edge 2-1 contacts the extended surface of the first surface 1 and the point P5 where the extension 114-3 of the first side edge 2-1 contacts the extended surface of the second surface 2 can be marked. Then, the midpoint P6 between P4 and P5 can be marked along the concave end line of the extension 114-3 of the first side edge 2-1. Furthermore, assuming the concave end line (dashed line) of P4-P6-P5 is part of an imaginary circle, the radius of this imaginary circle can be obtained, thus obtaining the radius of curvature R2. Moreover, by taking the reciprocal of the radius of curvature R2, the curvature κ2 (=1 / R2) can be obtained.

[0170] The width length of at least a portion of the second extensions 114-3, 114-4, 115-3 and 115-4 may increase from the center portion in the thickness direction to both ends.

[0171] For example, if the widthwise length at the central portion in the thickness direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 is WM2, and the widthwise length at the end portion in the thickness direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 is WM2', then WM2 < WM2' can be satisfied. In this case, WM2 can correspond to the minimum value among the widthwise lengths of the second extension portions 114-3, 114-4, 115-3, and 115-4, and WM2' can correspond to the maximum value among the widthwise lengths of the second extension portions 114-3, 114-4, 115-3, and 115-4, but it is not particularly limited thereto.

[0172] Since the second extension portions 114-3, 114-4, 115-3, and 115-4 satisfy WM2 < WM2′, the interfacial adhesiveness between the main body 110 and the side edge portions 114 and 115 can be excellent. Specifically, the moisture penetration at the corner portion where external moisture of the main body 110 easily penetrates, or the interfacial regions between the main body 110 and the first main side edge portion 114-0 and between the main body 110 and the second main side edge portion 115-0 can be further suppressed, thereby further improving the moisture-proof reliability of the multilayer electronic component 100.

[0173] In the embodiment of the present disclosure, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is shown, but the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0174] The external electrodes 131 and 132 can be provided on the main body 110 and connected to the internal electrodes 121 and 122.

[0175] More specifically, the external electrodes 131 and 132 can include a first external electrode 131 and a second external electrode 132. The first external electrode 131 and the second external electrode 132 are respectively provided on the third surface 3 and the fourth surface 4 of the main body 110, and are respectively connected to the first internal electrode 121 and the second internal electrode 122. For example, the first external electrode 131 can be provided on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be provided on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0176] Additionally, the external electrodes 131 and 132 may be configured to extend onto a portion of the first surface 1 and a portion of the second surface 2 of the body 110, or they may be configured to extend onto a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110. For example, the first external electrode 131 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110, and the second external electrode 132 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110.

[0177] The external electrodes 131 and 132 may include connecting portions disposed on the third surface 3 and the fourth surface 4 of the body 110, and strip portions extending from the connecting portions to a portion of the first surface 1 and a portion of the second surface 2 of the body 110. In this case, the connecting portions and the strip portions may refer to regions corresponding to different surfaces.

[0178] More specifically, the first external electrode 131 may include a first connecting portion disposed on the third surface 3 of the body 110 and a first strip portion extending from the first connecting portion to a portion of the first surface 1 and a portion of the second surface 2, and the second external electrode 132 may include a second connecting portion disposed on the fourth surface 4 of the body 110 and a second strip portion extending from the second connecting portion to a portion of the first surface 1 and a portion of the second surface 2.

[0179] The first belt portion may include a 1-1 belt portion extending from the first connecting portion to a portion of the first surface 1 and a 1-2 belt portion extending from the first connecting portion to a portion of the second surface 2, and the second belt portion may include a 2-1 belt portion extending from the second connecting portion to a portion of the first surface 1 and a 2-2 belt portion extending from the second connecting portion to a portion of the second surface 2.

[0180] In this disclosure, unless there is a particular contradiction, the description of the belt section may correspond to the description of each of the first belt section and the second belt section, and may further correspond to the description of each of the 1-1 belt section, the 1-2 belt section, the 2-1 belt section and the 2-2 belt section.

[0181] The external electrodes 131 and 132 may be formed using specific materials (such as metals) that are conductive, and the specific materials may be determined taking into account electrical properties, structural stability, etc., and the external electrodes 131 and 132 may also have a multilayer structure.

[0182] For example, external electrodes 131 and 132 may include first electrode layers 131a and 132a disposed on the body 110 and second electrode layers 131b and 132b disposed on the first electrode layers 131a and 132a. In addition, external electrodes may include third electrode layers 131c and 132c disposed on the second electrode layers 131b and 132b.

[0183] In this case, preferably, the first electrode layers 131a and 132a, the second electrode layers 131b and 132b, and the third electrode layers 131c and 132c correspond to different layers. However, this is not particularly limited to this, and they can be distinguished according to the order of the manufacturing process, and at least two adjacent layers among the first electrode layers 131a and 132a, the second electrode layers 131b and 132b, and the third electrode layers 131c and 132c may not be distinguished from each other and can be observed as a single layer.

[0184] In this disclosure, "distinction" can mean that two layers can be distinguished due to physical differences, chemical differences and / or simple optical differences, and is not particularly limited thereto, and can be distinguished by the presence or absence of an "interface". An interface can mean a surface on which two layers in contact with each other are distinguishable from each other, and can mean a state in which two layers are distinguishable, for example, by compositional differences analyzed by EDS in an apparatus such as a scanning electron microscope (SEM).

[0185] The first electrode layers 131a and 132a can be formed by transferring a sheet including conductive metal onto the body 110 and then sintering it, or by coating the body 110 with a conductive paste including conductive metal for the external electrode and then sintering it, or by immersing the body 110 in a conductive paste including conductive metal for the external electrode and then sintering it, but are not specifically limited to these methods.

[0186] For a more specific example of the first electrode layers 131a and 132a, the first electrode layers 131a and 132a may be sintered electrodes comprising conductive metal and glass.

[0187] Materials with excellent electrical conductivity can be used as conductive metals included in the first electrode layers 131a and 132a. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but are not particularly limited thereto.

[0188] Furthermore, the glass included in the first electrode layers 131a and 132a can improve the bonding with the body 110.

[0189] In embodiments of this disclosure, the average thickness of the first electrode layers 131a and 132a may be greater than or equal to 1 μm and less than or equal to 8 μm.

[0190] The method for measuring the thickness or average thickness of the first electrode layers 131a and 132a can be as follows, and it will be readily understood by those skilled in the art that the thickness or average thickness of the second electrode layers 131b and 132b or the third electrode layers 131c and 132c can be measured in the same manner. Hereinafter, a method for measuring the thickness or average thickness of the first electrode layer 132a of the second outer electrode will be described; however, it will be readily understood by those skilled in the art that the same method can be applied to methods for measuring the thickness or average thickness of other electrode layers including the first electrode layer 131a of the first outer electrode.

[0191] First, a scanning electron microscope (SEM) can be used to image cross-sections of the multilayer electronic assembly 100 in both the thickness and width directions, including the second cover portion 113, the second side edge portion 115, and the second external electrode 132. In this case, in addition to a scanning electron microscope (SEM), a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) can also be used. In the image captured by the scanning electron microscope (SEM), the first electrode layer 132a covering the second cover portion 113 and the second side edge portion 115 of the second external electrode can be observed, and layer classification can be performed. In this case, when the second external electrode 132 is formed as a multilayer structure, the boundary surfaces of each layer can be distinguished, and when it is difficult to distinguish them, energy-dispersive X-ray spectroscopy (EDS) can be used for layer classification based on the main components included in each layer. Subsequently, the thickness of the first electrode layer 132a of the second external electrode can be measured at 3000 points, and the thickness of the first electrode layer 132a of the second external electrode can be measured using a program built into the scanning electron microscope (SEM). Furthermore, the average thickness at 3000 points measured by the above method can correspond to the average thickness of the first electrode layer 132a of the second outer electrode.

[0192] Reference Figure 11A and Figure 11B This makes it easier to understand this disclosure. Figure 11A A comparative example involving a conventional second side edge structure (the first side edge also having the same structure) is provided only on the sixth surface 6, instead of extending to the first and second surfaces of the body. Figure 11B The present invention relates to an example having a second side edge structure (the first side edge also having the same structure), which is disposed on the sixth surface 6 of the body and is configured to extend to the first and second surfaces. The thickness of the first electrode layer in the comparative example and the inventive example can be measured using the method described above. For example, it can be as follows: Figure 11A and Figure 11BThe thickness can be measured at 3000 points, as shown in the image, and the thickness at each measurement location can be represented by a color palette. Furthermore, the measured thickness can be divided into 0.5 μm ranges and represented as a histogram with a total percentage sum of 100%.

[0193] When the average thickness of the first electrode layers 131a and 132a is greater than or equal to 1 μm and less than or equal to 8 μm, the (ultra) miniaturization of the multilayer electronic component 100 can be achieved while achieving excellent electrical connectivity.

[0194] When the average thickness of the first electrode layers 131a and 132a is less than 1 μm, the electrical connectivity may be insufficient, and the disconnection area of ​​the first electrode layers 131a and 132a may increase. When the average thickness of the first electrode layers 131a and 132a exceeds 8 μm, it may be difficult to miniaturize the multilayer electronic component 100.

[0195] In the first electrode layers 131a and 132a, the region with a thickness of less than 1 μm can be less than 5%, preferably less than 2%.

[0196] When the area with a thickness of less than 1 μm in the first electrode layers 131a and 132a is less than 5%, the connectivity of the first electrode layers 131a and 132a can be excellent, which can improve electrical connectivity and enable miniaturization of the multilayer electronic component 100.

[0197] When the area with a thickness of less than 1 μm in the first electrode layers 131a and 132a is 5% or more, the disconnected area of ​​the first electrode layers 131a and 132a may increase and the electrical connectivity may be insufficient.

[0198] In addition, the area with a thickness greater than or equal to 1 μm and less than or equal to 5 μm in the first electrode layers 131a and 132a can be 95% or more, preferably greater than 98%.

[0199] When the area with a thickness greater than or equal to 1 μm and less than or equal to 5 μm in the first electrode layers 131a and 132a is 95% or greater, the connectivity of the first electrode layers 131a and 132a can be excellent, which can improve electrical connectivity and enable miniaturization of the multilayer electronic component 100.

[0200] When the area with a thickness greater than or equal to 1 μm and less than or equal to 5 μm in the first electrode layers 131a and 132a is less than 95%, the electrical connectivity may be insufficient or there may be concerns about short-circuit defects, and it may be difficult to achieve miniaturization of the multilayer electronic component 100.

[0201] In this disclosure, since the side edge portions 114 and 115 have a structure that extends to at least a portion of the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4, for example, including first extension portions 114-1, 114-2, 115-1 and 115-2 and / or second extension portions 114-3, 114-4, 115-3 and 115-4, a first electrode layer 131a and 132a with a thin thickness and uniformity can be formed.

[0202] When the external electrode paste (e.g., the paste that will become the first electrode layers 131a and 132a) is formed on the body 110 and the side edge portions 114 and 115, the external electrode paste can suppress the flow at the corner of the body 110 by forming vortexes by the first extensions 114-1, 114-2, 115-1 and 115-2 and / or the second extensions 114-3, 114-4, 115-3 and 115-4 of the side edge portions, thereby forming an external electrode with a thin and uniform thickness.

[0203] In a conventional side edge structure without the first and second extensions, the flow of the external electrode paste may increase (or speed up) in corners where the curvature of the main body is small (when the radius of curvature is relatively small), making it difficult to form an external electrode with a constant thickness, or even making it almost impossible to form an external electrode. Furthermore, in the central region where the flow of the external electrode paste in the main body is relatively slow, the external electrode may form thicker due to surface tension. Conversely, in a conventional side edge structure without the first and second extensions, the flow of the external electrode paste may decrease (or slow down) in corners where the curvature of the main body exists (when the radius of curvature is relatively large), making the overall thickness of the external electrode thinner, but potentially unevenly formed.

[0204] In addition, in embodiments of this disclosure, the average thickness of the first electrode layers 131a and 132a may be thinner than the average thickness of the second electrode layers 131b and 132b or the average thickness of the third electrode layers 131c and 132c described below.

[0205] Since the average thickness of the first electrode layers 131a and 132a can be thinner than the average thickness of the second electrode layers 131b and 132b or the average thickness of the third electrode layers 131c and 132c, miniaturization of the multilayer electronic component 100 can be achieved while achieving excellent electrical connectivity.

[0206] When the average thickness of the first electrode layers 131a and 132a is greater than the average thickness of the second electrode layers 131b and 132b or the average thickness of the third electrode layers 131c and 132c, it may be difficult to miniaturize the multilayer electronic component 100.

[0207] The second electrode layers 131b and 132b and the third electrode layers 131c and 132c can improve mounting characteristics and can be plating layers formed on the first electrode layers 131a and 132a by plating methods, but are not particularly limited thereto. The types of the second electrode layers 131b and 132b and the third electrode layers 131c and 132c are not particularly limited and can include at least one of, for example, nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof.

[0208] The size of the multilayer electronic component 100 does not require special restrictions.

[0209] To achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes should be reduced to increase the number of layers. Therefore, the effects of this disclosure are more pronounced in multilayer electronic components 100 with dimensions of 2012 (length × width: 2.0 mm × 1.2 mm, with length and width within ±10% tolerance, the same below), 1005 (length × width: 1.0 mm × 0.5 mm) or smaller, 0603 (length × width: 0.6 mm × 0.3 mm) or smaller, 0402 (length × width: 0.4 mm × 0.2 mm) or smaller, or 0201 (length × width: 0.2 mm × 0.1 mm) or smaller.

[0210] In addition, the multilayer electronic component 100 may have a width greater than its length.

[0211] Hereinafter, a method for manufacturing a first side edge portion 114 and a second side edge portion 115 including first edge layers 114a and 115a and second edge layers 114b and 115b will be described, but is not particularly limited thereto.

[0212] Except for the side edges 114 and 115, this disclosure is the same as conventional manufacturing methods. Therefore, its description will be omitted.

[0213] Furthermore, the first edge portion green sheet, which will become the first side edge portion 114, will be described below. However, it will be readily understood by those skilled in the art that, unless there are special circumstances, the description of the first edge portion green sheet can be applied to the second edge portion green sheet.

[0214] In addition, the 1-1 edge layer green sheet can become the 1-1 edge layer of the first side edge portion, and the 2-1 edge layer green sheet can become the 2-1 edge layer of the first side edge portion.

[0215] First, the first process conditions can be applied in the width direction of the green body on which ceramic green sheets and internal electrode patterns are stacked.

[0216] The first process conditions may include at least one of a pressure condition greater than or equal to 0.1 tons and less than or equal to 1.2 tons and a temperature condition greater than or equal to 60°C and less than or equal to 120°C, and preferably, both the pressure condition and the temperature condition are applied to the first process conditions.

[0217] 1-1 The edge layer green sheet can be attached under the first process conditions to have a structure in which the edge layer green sheet extends on at least one of the thickness direction surface (first surface 1 and second surface 2) or the length direction surface (third surface 3 and fourth surface 4) of the green body. In this case, the edge layer green sheet disposed on the thickness direction surface can be the first extensions 114-1 and 114-2, and the edge layer green sheet disposed on the length direction surface can be the second extensions 114-3 and 114-4.

[0218] The first heating and pressurizing member can be used to attach the 1-1 edge layer green sheet.

[0219] For example, the 1-1 edge layer green sheet can be placed between the 1-1 heating and pressurizing member and the 1-2 heating and pressurizing member, and a green body can be placed on it. Then, the heating and pressurizing member can be pressed to attach the 1-1 edge layer green sheet to the green body.

[0220] In this case, when heating and pressurizing are applied to attach the 1-1 edge layer green sheet to the green body, the green body can be pushed together with the 1-1 edge layer green sheet into the first elastic member in the direction toward the first elastic member, so that the 1-1 edge layer green sheet can be attached to the width direction surface and other surfaces of the green body (including the two surfaces in the thickness direction and the two surfaces in the length direction of the green body).

[0221] 1-1 The heating and pressurizing component may include a first lower steel plate and a first elastic member disposed on the upper surface of the first lower steel plate. 1-2 The heating and pressurizing component may include a first upper steel plate and a first adhesive sheet disposed on the lower surface of the first upper steel plate.

[0222] In this case, the first elastic member may include a soft elastomer.

[0223] In this case, preferably, the soft elastomer may have an elastic modulus greater than 50 MPa, and more specifically, for example, may include at least one of natural rubber, chloroprene rubber, silicone rubber, polyurethane, ethylene propylene diene monomer (EPDM), styrene-butadiene rubber (SBR), polybutadiene, and thermoplastic elastomers, but is not particularly limited thereto.

[0224] Next, a stamping process can be performed on the green body with the 1-1 edge layer green sheet attached under the second process conditions.

[0225] The second process conditions may include at least one of a pressure condition of 5 tons or more and 12 tons or less, and a temperature condition of 20°C or more and 60°C or less, and preferably, both the pressure condition and the temperature condition are applied to the second process conditions.

[0226] The stamping process can be performed under the second process conditions, and the remaining 1-1 edge layer green sheet that extends and remains on at least one of the thickness direction surface and the length direction surface of the green body can be easily separated and removed.

[0227] The stamping process can be carried out using a second heating and pressurizing component.

[0228] For example, a green body with the 1-1 edge layer green sheet attached can be placed between the 2-1 heating and pressing member and the 2-2 heating and pressing member, and then stamped by pressing.

[0229] 2-1 The heating and pressurizing component may include a second lower steel plate and a second elastic member disposed on the upper surface of the second lower steel plate. 2-2 The heating and pressurizing component may include a second upper steel plate and a second adhesive sheet disposed on the lower surface of the second upper steel plate.

[0230] In this case, the second elastic member may include an elastic body, and preferably, the elastic body of the second elastic member has a lower elastic coefficient than the elastic coefficient of the first elastic member.

[0231] Subsequently, the 2-1 edge layer green sheet can be attached to the same width-direction side of the green body as the side to which the 1-1 edge layer green sheet is attached, and a stamping process can be performed on the 2-1 edge layer green sheet under the second process conditions. In this case, an adhesive layer, which can be used as a binder, can be provided between the 1-1 edge layer green sheet and the 2-1 edge layer green sheet to prevent adhesion failure between the 1-1 edge layer green sheet and the 2-1 edge layer green sheet during the sintering process. The adhesive layer can be removed during the sintering process.

[0232] Methods for attaching a 1-1 edge layer green sheet to a green body under a first process condition, performing a stamping process on the 1-1 edge layer green sheet under a second process condition, attaching a 2-1 edge layer green sheet under the first process condition, and performing a stamping process on the 2-1 edge layer green sheet under the second process condition have been described, but are not particularly limited thereto. For example, the 1-1 edge layer green sheet and the 2-1 edge layer green sheet can be attached together to the green body under the first process condition, and then the 1-1 edge layer green sheet and the 2-1 edge layer green sheet can be stamped together under the second process condition.

[0233] Furthermore, it will be readily understood by those skilled in the art that the 1-2 edge layer green sheets and the 2-2 edge layer green sheets can be attached to the green body by the above method.

[0234] Furthermore, the term "embodiment" as used in this specification does not imply the same embodiment and may be provided to emphasize and describe different unique features. However, the embodiments presented above are not to be excluded from implementations in combination with features of another embodiment. For example, although a particular embodiment is not described in another example, it may be understood as an interpretation relating to that other example unless otherwise described or contradicted.

[0235] The terminology used in this disclosure is for illustrative purposes only and is not intended to limit the scope of the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions.

[0236] One of the various effects of this disclosure is improved moisture resistance reliability of multilayer electronic components.

[0237] One of the various effects of this disclosure is the reduction of porosity in multilayer electronic components.

[0238] One of the various effects of this disclosure is improved toughness and resistance to bending cracks in multilayer electronic components.

[0239] The various advantages and effects of this disclosure are not limited to those described above, and can be more easily understood in the process of explaining specific embodiments of this disclosure.

[0240] While exemplary embodiments have been described and illustrated above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined in the appended claims.

Claims

1. A multilayer electronic component, comprising: A body including a dielectric layer and internal electrodes, the internal electrodes being alternately arranged with the dielectric layer in the thickness direction, and the body including a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the width direction; A first external electrode and a second external electrode respectively provided on the third surface and the fourth surface; A first side edge portion provided on the fifth surface and extending to a part of the first surface and a part of the second surface; And A second side edge portion provided on the sixth surface and extending to a part of the first surface and a part of the second surface, wherein both the first side edge portion and the second side edge portion include a first edge layer and a second edge layer, the first edge layer is arranged to contact the body, the second edge layer is provided on the first edge layer, and wherein the first edge layer and the second edge layer are different in at least one of the average grain size and the dielectric composition.

2. The multilayer electronic component according to claim 1, wherein, The first side edge portion has a boundary surface that differentiates the first edge layer and the second edge layer into different layers, and the second side edge portion has a boundary surface that differentiates the first edge layer and the second edge layer into different layers.

3. The multilayer electronic component according to claim 1, wherein, Gs2 < Gs1 is satisfied, wherein the average grain size of the grains in the first edge layer is Gs1, and the average grain size of the grains in the second edge layer is Gs2.

4. The multilayer electronic component according to claim 3, wherein, 200 μm ≤ Gs1 ≤ 300 μm is satisfied.

5. The multilayer electronic component according to claim 3, wherein, 75 μm ≤ Gs2 ≤ 175 μm is satisfied.

6. The multilayer electronic component according to claim 1, wherein, Ga2 < Ga1 is satisfied, wherein the average mole number of gallium relative to 100 moles of titanium in the first edge layer is Ga1, and the average mole number of gallium relative to 100 moles of titanium in the second edge layer is Ga2.

7. The multilayer electronic assembly according to claim 1, wherein, P2 < P1 is satisfied, wherein the average mole number of phosphorus relative to 100 moles of titanium in the first edge layer is P1, and the average mole number of phosphorus relative to 100 moles of titanium in the second edge layer is P2.

8. The multilayer electronic component according to claim 1, wherein, Zr1 < Zr2 is satisfied, wherein the average mole number of zirconium relative to 100 moles of titanium in the first edge layer is Zr1, and the average mole number of zirconium relative to 100 moles of titanium in the second edge layer is Zr2.

9. The multilayer electronic component according to claim 1, wherein, The average thickness of the first edge layer in each of the first side edge portion and the second side edge portion is greater than or equal to 1 μm and less than or equal to 5 μm, and The average thickness of the second edge layer in each of the first side edge portion and the second side edge portion is greater than or equal to 9 μm and less than or equal to 35 μm.

10. The multilayer electronic assembly according to claim 1, wherein, The portion of the first side edge disposed on the first surface and the portion disposed on the second surface each include a region that is substantially recessed toward the fifth surface, and the portion of the second side edge disposed on the first surface and the portion disposed on the second surface each include a region that is substantially recessed toward the sixth surface.

11. The multilayer electronic assembly according to claim 10, wherein, The radius of curvature R1 of the generally recessed regions of the portion disposed on the first surface and the portion disposed on the second surface of each of the first and second side edge portions satisfies 500μm≤R1≤700μm.

12. The multilayer electronic assembly according to claim 1, wherein, The first side edge and the second side edge are configured to extend into a portion of the third surface and a portion of the fourth surface.

13. The multilayer electronic assembly according to claim 12, wherein, The portions of the first side edge on the third surface and the portions on the fourth surface each include a region that is substantially recessed toward the fifth surface, and the portions of the second side edge on the third surface and the portions on the fourth surface each include a region that is substantially recessed toward the sixth surface.

14. The multilayer electronic assembly according to claim 13, wherein, The radius of curvature R2 of the generally recessed regions of the portions of the first and second side edge portions disposed on the third surface and the portions disposed on the fourth surface satisfies 1000μm≤R2≤1200μm.

15. The multilayer electronic assembly according to claim 1, wherein, Both the first external electrode and the second external electrode include a first electrode layer connected to the inner electrode and a second electrode layer disposed on the first electrode layer, and The average thickness of the first electrode layer is greater than or equal to 1 μm and less than or equal to 8 μm.

16. The multilayer electronic assembly according to claim 15, wherein, In the first electrode layer, the area with a thickness of less than 1 μm is less than 5%.

17. A multilayer electronic component, comprising: The main body includes a capacitor forming portion and has a first surface and a second surface that are opposite to each other in the thickness direction, a third surface and a fourth surface that are connected to the first surface and the second surface and are opposite to each other in the length direction, and a fifth surface and a sixth surface that are connected to the first surface and the fourth surface and are opposite to each other in the width direction. as well as The first side edge portion and the second side edge portion are respectively disposed on the fifth surface and the sixth surface, extending to a portion of the first surface and a portion of the second surface, and each includes a first edge layer in contact with the body and a second edge layer disposed on the first edge layer. Wherein, the first side edge portion and the second side edge portion are configured to extend into a portion of the third surface and a portion of the fourth surface, and The first edge layer and the second edge layer are distinguished from each other by the boundary surface between the first edge layer and the second edge layer.

18. The multilayer electronic assembly according to claim 17, wherein, The number of moles of gallium in the first edge layer relative to 100 moles of titanium is higher than the number of moles of gallium in the second edge layer relative to 100 moles of titanium.

19. The multilayer electronic assembly according to claim 17, wherein, The number of moles of phosphorus in the first edge layer relative to 100 moles of titanium is higher than the number of moles of phosphorus in the second edge layer relative to 100 moles of titanium.

20. The multilayer electronic assembly according to claim 17, wherein, The number of moles of zirconium relative to 100 moles of titanium in the first edge layer is higher than the number of moles of zirconium relative to 100 moles of titanium in the second edge layer.

21. The multilayer electronic assembly according to claim 17, further comprising a first external electrode disposed on the third surface of the body and a second external electrode disposed on the fourth surface of the body.

22. A multilayer electronic component, comprising: The main body includes a capacitor forming portion and has a first surface and a second surface that are opposite to each other in the thickness direction, a third surface and a fourth surface that are connected to the first surface and the second surface and are opposite to each other in the length direction, and a fifth surface and a sixth surface that are connected to the first surface and the fourth surface and are opposite to each other in the width direction. as well as The first side edge portion and the second side edge portion are respectively disposed on the fifth surface and the sixth surface, extending to a portion of the first surface and a portion of the second surface, and each includes a first edge layer in contact with the body and a second edge layer disposed on the first edge layer. The average size of the grains in the first edge layer is larger than the average size of the grains in the second edge layer. Wherein, the portion of the first side edge disposed on the first surface and the portion disposed on the second surface both include a region that is substantially recessed toward the fifth surface, and the portion of the second side edge disposed on the first surface and the portion disposed on the second surface both include a region that is substantially recessed toward the sixth surface.

23. The multilayer electronic assembly according to claim 22, wherein, The radius of curvature R1 of the generally recessed regions of the portion disposed on the first surface and the portion disposed on the second surface of each of the first and second side edge portions satisfies 500μm≤R1≤700μm.

24. The multilayer electronic assembly according to claim 22, wherein, The first side edge and the second side edge are configured to extend into a portion of the third surface and a portion of the fourth surface.

25. The multilayer electronic assembly according to claim 24, wherein, The radius of curvature R2 of the generally recessed regions of the portions of the first and second side edge portions disposed on the third surface and the portions disposed on the fourth surface satisfy 1000μm≤R2≤1200μm.

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