Camera and installation method

Abstract

The invention relates to a camera (1) for a vehicle. The invention relates to an image sensor, comprising a housing (2) which forms a housing cavity, an image sensor circuit board (3) which is arranged in the housing cavity and divides the housing cavity into a first housing region and a second housing region, an image sensor (4) which is arranged on a first side of the image sensor circuit board (3), and a structural assembly which is fixedly arranged on the housing (2) and / or the image sensor circuit board (3), the invention relates to a component, comprising an optical device (5), an electronic component, and an electrical connection line (7) which is connected to the electronic component (6), the connecting line (7) is guided in the housing cavity through the image sensor circuit board (3) or along the image sensor circuit board (3), and the connecting line (7) is contacted on a second side of the image sensor circuit board (3) or by a housing cover or a contact circuit board (9) arranged in the second housing region.

Description

Technical Field

[0001] This disclosure relates to a camera for vehicles, particularly commercial vehicles, having a housing with a cavity, an image sensor circuit board arranged in the cavity dividing the cavity into a first and a second cavity, an image sensor mounted on a first side of the image sensor circuit board, and a structural assembly fixedly mounted on the housing and / or the image sensor circuit board, the structural assembly having optical devices, electronic components, and electrical connection lines connected to the electronic components. Background Technology

[0002] For example, such a camera is known from EP 2 884 736 A1. In particular, it discloses a camera for use in vehicles, especially commercial vehicles, comprising a housing, at least one optical element disposed in or on the housing, a circuit board assembly disposed in the housing and having at least one circuit board, each circuit board assembly having at least one active circuit for implementing direct camera functionality, at least one heating element disposed and adapted to heat the circuit board assembly, the optical element, and / or the housing, wherein the at least one heating element is directly mounted on one of the circuit boards of the circuit board assembly, and at least one heat-conducting element disposed and adapted between the at least one heating element and the housing to transfer heat from the heating element and / or the circuit board assembly to the housing. Here, the heating element is directly disposed on the circuit board, so that the optical element can be heated via thermal contact connections on the circuit board. However, such a structure is only suitable for smaller optical elements, because in the case of larger optical elements, the heating power may be insufficient.

[0003] Furthermore, such cameras are known from EP 3 035 665 A1. Specifically, it discloses a camera system for a vehicle, comprising a lens; a first circuit board having an image sensor for detecting image information obtained through the lens; and at least one additional circuit board providing predetermined basic functions for the camera system. Each of the first circuit board and the at least one additional circuit board has at least one connection unit, via which the circuit boards can be modularly and interchangeably electrically connected to each other to adapt the functional range of the camera system according to the predetermined basic functions. The at least one connection unit has multiple sets of electrical connectors through which the first circuit board can be connected to the at least one additional circuit board to provide the predetermined basic functions for the camera system.

[0004] A lens assembly for a camera module is also known from US11 086 092 B2. This lens assembly has a lens and a heating assembly disposed on the lens, wherein the heating assembly is configured to generate heat when an electric current flows through it. Here, the heating assembly is in contact with an image sensor circuit board by means of a wire connecting the heating assembly to the side of the image sensor circuit board facing the lens.

[0005] In such cameras, the crucial element is the precise arrangement or orientation of the optics relative to the image sensor to ensure focus and thus sharp image capture. Here, the optics are positioned or fixed via an adhesive connection to the image sensor. However, a persistent drawback of existing technology is that during camera assembly, forces can act on the adhesive connection due to the structural arrangement of the individual camera components. This adhesive connection, especially before it has fully cured, has a decisive impact on the positioning of the optics relative to the image sensor. In particular, any voltage on the image sensor circuit board can cause loss of optimal focus.

[0006] In particular, when the connecting lines that connect to the electronic components are fixed to the image sensor circuit board, the stretching or squeezing of the connecting lines can cause slight movement of the optical device relative to the image sensor circuit board and thus relative to the image sensor, which in turn can lead to a loss of focus. Summary of the Invention

[0007] Therefore, the objective of this disclosure is to avoid or at least reduce the disadvantages of the prior art. In particular, a camera should be provided in which the precise orientation of the optical device relative to the image sensor can be ensured, and such precise orientation is particularly unaffected by the adverse effects of contact of the connecting lines.

[0008] The task of this disclosure is solved by the camera or installation method according to the present invention.

[0009] Therefore, the objective of this disclosure is to address the issue through cameras. Cameras are particularly useful in vehicles, especially commercial vehicles. For example, a camera can be a component of a camera monitoring system, such as a mirror replacement system.

[0010] The camera has a housing with a cavity. That is, the components of the camera can be arranged inside the housing or at least partially surrounded by the housing.

[0011] The camera has an image sensor circuit board disposed within a housing cavity. This image sensor circuit board can also be referred to as a sensor head circuit board. The image sensor circuit board divides the housing or housing cavity into a first housing region and a second housing region. That is, the cross-sectional plane of the image sensor circuit board separates the housing cavity into two housing regions. Here, "separated" does not refer to a sealed or closed boundary, but rather that the housing regions can be connected to each other, for example, through free space. The first housing region can also be referred to as the front housing region, and the second housing region can be referred to as the rear housing region.

[0012] The camera has an image sensor mounted on a first side of an image sensor circuit board. This first side of the image sensor circuit board can also be referred to as the front side, and the second side of the image sensor circuit board opposite to the first side can also be referred to as the rear side. Here, the first side of the image sensor circuit board is arranged in or facing the first housing region, and the second side of the image sensor circuit board is arranged in or facing the second housing region. That is, the image sensor is arranged in or facing the first housing region.

[0013] The camera has a structural assembly fixedly mounted on a housing and / or an image sensor circuit board. That is, the structural assembly has a fixed or defined position relative to the housing and / or the image sensor circuit board. The structural assembly has optical elements, electronic components, and electrical connection lines connected to the electronic components. The optical elements may also be referred to as lenses or lens assemblies. The connection lines are specifically used to supply current / voltage and / or data to the electronic components. Here, the data may, for example, include data / signals for manipulation. The optical elements may be arranged, in particular, in or in a first housing region. That is, a first side of the image sensor circuit board may face the optical elements. Accordingly, the first side of the image sensor circuit board may be referred to as the optical element side. Furthermore, the arrangement in the first housing region or in a region located on the other side / first side of the image sensor circuit board may also be referred to as (laying flat) on the optical element side. The electronic components may be arranged, in particular, in the region of the optical elements, or in the first housing region, or on the optical element side. That is, a first side of the image sensor circuit board may face the electronic components.

[0014] According to one aspect of this disclosure, the connecting lines pass through or are guided along the image sensor circuit board within the housing cavity. In other words, the connecting lines extend along the image sensor circuit board from a first housing region to a second housing region. Here, "passing through or along the image sensor circuit board" is specifically understood to mean that the connecting lines are not integrated into the image sensor circuit board, but are independent of the image sensor circuit board and are not part of it. In particular, this is also understood to mean guiding the connecting lines through and / or through them (as far as possible) without force, or guiding them through them without electrical contact with the image sensor circuit board. That is, the first end or contact element of the connecting lines is located on the other side of the first side of the image sensor circuit board (i.e., on the optical device side or on the front or front side of the image sensor circuit board), and the second end or contact element of the connecting lines is located on the other side of the second side of the image sensor circuit board (i.e., on the rear or rear side of the image sensor circuit board). The (first or second) contact element may in particular be configured as a plug and / or contact spring and / or spring contact. Here, the first contact element is used for (direct) contact with electronic components. The first contact element can also be integrated into the electronic components, for example, constructed as an encapsulated wire that transitions into a heater, such as the heating film of the heater. The first contact element can also be used to contact multiple electronic components or to construct multiple contact portions through (multi-piece) electronic components. In particular, the through-connection line should not be construed as meaning that the first line is connected, for example, to the front side of the image sensor circuit board, the line (between the layers of the image sensor circuit board) is constructed within the image sensor circuit board, and the rear side of the image sensor circuit board is connected to a second line, which in turn is used for contact in the second housing region. However, the connection line is not limited to being constructed as a single piece between the first and second contact elements.

[0015] According to one aspect of this disclosure, the connection line contact is made on a second side of the image sensor circuit board or by a housing cover or contact circuit board arranged in the second housing region. That is, the second contact element is used to (directly / indirectly) contact the second side of the image sensor circuit board (i.e., at the rear side of the image sensor circuit board) or the housing cover (towards the rear side of the image sensor circuit board) or the contact circuit board (towards the rear side of the image sensor circuit board). In other words, the connection location for the second contact element is arranged in the second housing region and is formed, for example, by the rear side of the image sensor circuit board itself, the housing components, especially the housing cover or contact circuit board. The second contact element is particularly used as a voltage connector and / or data connector for electronic components. In other words, voltage and / or data are supplied to the electronic components via the image sensor circuit board, the housing cover, or the contact circuit board.

[0016] Therefore, the core of this disclosure is that electronic components arranged in the area of ​​the optical device, and thus in the front area of ​​the housing or camera, are accessible via connecting lines in the rear area of ​​the housing or camera. These connecting lines (physically / structurally / technically / mechanically, or in the absence of electrical contact with the image sensor circuit board) are guided through or along the image sensor circuit board (which separates the front and rear areas). In other words, in the camera, a connection point for supplying voltage and / or data to the electronic components is abutted against the electronic components in another housing area, wherein the connection between the electronic components and the connection point is achieved via connecting lines passing through the image sensor circuit board or between the image sensor circuit board and the inner wall of the housing.

[0017] The advantage of this is that the contact of the connecting lines is no longer achieved on the front side of the image sensor circuit board. During the installation process, contact must be made on the front side of the image sensor circuit board to orient the optics relative to the image sensor, since the front side of the image sensor circuit board is no longer accessible. However, forces are applied to the connecting lines during contact or when the camera (also after installation) moves, and these forces affect the orientation of the optics relative to the image sensor and can cause loss of focus. By passing the connecting lines through the image sensor circuit board or running alongside the image sensor circuit board, contact of the connecting lines can be made from the rear side of the housing and after the installation process to orient the optics relative to the image sensor. Therefore, after the adhesive bond has cured, this contact can be established by connecting the connecting lines to the rear side of the image sensor circuit board, the housing cover, or the contact circuit board. Accordingly, the orientation of the optics relative to the image sensor can be improved or ensured.

[0018] According to one implementation, the connection lines can be flexibly constructed, for example, as cables or wires or flexible printed connections, or rigidly constructed.

[0019] According to one embodiment, the component constructing the connection location, i.e., the image sensor circuit board, housing cover, or contact circuit board, can have a connector, particularly a plug-in connector, for connection with another component, particularly a plug-in connection. That is, the component constructing the connection location itself does not necessarily ensure the supply of voltage and / or data, but is supplied only via the component constructing the connection location, although downstream contact is possible.

[0020] According to a preferred embodiment, a void can be formed inside the image sensor circuit board or between the inner wall of the housing and the image sensor circuit board, through which connecting lines extend. Here, additional components, such as cable guides connected to the housing, can also be arranged between the inner wall of the housing and the image sensor circuit board, or in the void thus formed. The void can be formed, for example, through a (through-hole) hole along the thickness direction of the circuit board. Alternatively, the void can be constructed by matching the cross-sections of the image sensor circuit board and the housing in the region of the image sensor circuit board, particularly by designing the cross-section of the image sensor circuit board to be smaller than or less filled (completely filled) than the cross-section of the housing, thus creating a void between the inner wall of the housing and the image sensor circuit board. This means that the void can be constructed inside the image sensor circuit board and can be completely surrounded / enclosed by the image sensor circuit board material on the circumferential side. In other words, the void is constructed between the inner wall of the housing and the image sensor circuit board and can be partially surrounded / enclosed by the inner wall of the housing and partially by the image sensor circuit board on the circumferential side. In other words, the image sensor circuit board can have a smaller cross-section than the housing (in the region of the image sensor circuit board). In other words, the open section allows the connecting lines (perpendicular to the cross-section of the image sensor circuit board) to extend longitudinally / pass longitudinally through the image sensor circuit board or along the image sensor circuit board.

[0021] According to an improved embodiment of the preferred method, the clearance portion can have a larger cross-section than the connecting lines. In particular, the connecting lines can be arranged, or may be arranged, mostly or completely spaced apart from the housing and / or image sensor circuit board on the circumferential side. This has the advantage of enabling the connecting lines to be guided with minimal force.

[0022] According to a preferred embodiment, the optical device can be bonded to the housing and / or the image sensor circuit board, particularly in the region on the first side of the image sensor circuit board. In other words, the lens assembly is connected to the housing and / or the sensor head circuit board via at least one bonding location. This ensures precise positioning of the optical device relative to the image sensor. In particular, the optical device is positioned or oriented with respect to the spacing and / or tilt relative to the image sensor to ensure focused imaging. Here, the optical device can be centered relative to the image sensor or oriented with axial offset.

[0023] According to a preferred embodiment, the image sensor circuit board can be fixedly connected to the housing, particularly through a slit and / or screwing and / or bonding. This ensures a fixed positioning between the image sensor circuit board and the housing. This precise positioning is particularly crucial when the optical device is also bonded to the image sensor circuit board. Alternatively, the image sensor circuit board may not be fixedly connected to the housing, but rather the optical device may be fixedly connected to the housing. In this case, the image sensor circuit board can be oriented relative to the optical device. That is, the image sensor circuit board is connected to the housing only indirectly through the optical device.

[0024] According to a preferred embodiment, the housing may have a (cable) guide for connecting the wiring. This guide may be constructed, for example, in the form of a clip or a frame.

[0025] According to a preferred embodiment, the electronic components may be heaters and / or focusing devices and / or cleaning elements and / or control elements for operating electric motors and / or light sources. The heater may be constructed, for example, as described in US11 086 092 B2 and connected to an image sensor circuit board. The focusing device may be used for focusing and / or replacing filters or apertures. The light source may be, in particular, an infrared light source. The electronic components may be arranged, in particular, in the area of ​​the optical device. Here, the electronic components are preferably, but not necessarily, connected to the optical device. The electronic components are particularly used to provide additional functionality to the optical device. That is, the electronic components may be functionally associated with the optical device and / or may be arranged spatially near the optical device or are not entirely arbitrary electronic components.

[0026] According to a preferred embodiment, the connection line can be directly connected to a connection position constructed on the second side of the image sensor circuit board, the housing cover, or the contact circuit board, wherein the connection between the connection line and the connection position is constructed as a floating connection. In other words, when the connection line is in contact, a flexible connection exists, for example, through a spring, thereby reducing the force applied to the overall system. That is, a certain gap can exist between the connection line or (second) contact element and the connection position. This has the advantage of reducing the force generated by the connection between the (second) contact element and the connection position, which may act on the orientation of the optical device relative to the image sensor.

[0027] According to a preferred embodiment, the camera may have a voltage source or a voltage connector for connecting to an external voltage source. According to a preferred embodiment, the voltage source or voltage connector may be arranged within a housing cavity and connected to electronic components via connecting lines. That is, the component constructing the connection location may directly contain the voltage source and be used as a direct voltage supply unit for the electronic components, or the component constructing the connection location may itself serve as a direct connector to voltage and be used for an indirect voltage supply to the electronic components. In other words, the voltage source may be installed within the camera or an external voltage source may be used for voltage supply, wherein the external voltage source may be powered via, for example, a coaxial cable, a data cable, or a separate connecting line.

[0028] According to a preferred embodiment, the connection line may be connected to or has been connected to a microcontroller or control element of the vehicle communication network, such as a CAN bus (Controller Area Network Bus), when it is used to supply data to electronic components.

[0029] According to a preferred embodiment, the housing cover may be partially constructed of plastic. According to a preferred embodiment, the housing cover may have (metallic) contact elements. The contact elements of the housing cover are particularly useful as connection points, that is, as second contact elements for contacting connection lines. The contact elements are preferably injection molded, especially constructed as inserts. Therefore, a free shape design of the housing cover can be achieved while maintaining electrical contact.

[0030] Therefore, the objective of this disclosure is also achieved through a mounting method for a camera, particularly the described camera. This mounting method comprises the following steps:

[0031] - The structural components are connected to the housing and / or the image sensor circuit board via adhesive bonding, such that the optical device is oriented relative to the image sensor or the image sensor is oriented relative to the optical device.

[0032] -Cure the adhesive bond,

[0033] - Contact the connection line, wherein the connection is made after the adhesive bond has cured.

[0034] In other words, the optical device is oriented relative to the image sensor (or the image sensor relative to the optical device) via at least one adhesive location on the housing and / or the image sensor circuit board (to ensure focus), wherein the connecting lines are connected to the connecting locations after the adhesive at the adhesive locations has cured.

[0035] According to the preferred embodiment, no external force can be applied to the bonding site before the adhesive cures. This means that only the weight of the adhesive itself and the setting aids during the installation process can apply force.

[0036] According to a preferred embodiment, the contact of the connecting lines can be achieved within the second housing region.

[0037] According to a preferred embodiment, the adhesive bond can be fixed by UV light before curing. Therefore, (slight) fixation can be achieved before curing.

[0038] According to a preferred embodiment, complete curing of the adhesive bond can be carried out in a temperature range of 25°C to 200°C, particularly 60°C to 100°C, preferably 80°C to 90°C, and even more preferably 85°C. This means that curing occurs at elevated temperatures, thus increasing strength. Attached Figure Description

[0039] Figures 1 to 5 Different perspective views of a camera or individual component thereof according to this disclosure are shown.

[0040] Figure 6 and Figure 7 The image shows the cameras at different points in time during installation.

[0041] Figure 8 A side view of the camera is shown, and

[0042] Figure 9 Showing the camera along the edge according to this disclosure Figure 8 The longitudinal section view taken by line IX in the middle.

[0043] Wherein: 1-Camera; 2-Housing; 2a-First housing area; 2b-Second housing area; 3-Image sensor circuit board; 4-Image sensor; 5-Optical device; 6-Electronic component; 7-Connecting line; 7a-Front section; 7b-Rear section; 8-Open space; 9-Contact circuit board; 10-Plug-in connector; 11-Adhesive position; 12-Hole; 13-Pin; 14-Adhesive position; 15-Circumferential gap; E-Plane. Detailed Implementation

[0044] Figures 1 to 5 A perspective view is shown of a camera 1 and its components according to the present disclosure. The camera 1 is intended for use with vehicles, particularly commercial vehicles. For example, the camera 1 may be a component of a camera monitoring system, such as a mirror replacement system.

[0045] Camera 1 has a housing 2. Housing 2 constructs or defines a housing cavity. A first side of housing 2 may be referred to as the front side of housing 2, and a second side of housing 2 opposite to the first side may be referred to as the rear side of housing 2.

[0046] The camera 1 has an image sensor circuit board 3 disposed within a cavity in the housing. The image sensor circuit board 3 is enclosed by the housing 2 on its circumferential side. Here, the image sensor circuit board 3 can be directly abutted against the housing 2, at least in sections, on its edge side, or with a circumferential gap 15 (see...). Figure 9 The image sensor circuit board 3 is spaced apart from the housing 2. It is particularly capable of being fixedly connected to the housing 2, especially to the housing 2.

[0047] The image sensor circuit board 3 divides the housing 2 or housing cavity into a first housing region 2a and a second housing region 2b. The first housing region 2a is located on a first side of the image sensor circuit board 3. The second housing region 2b is located on a second side of the image sensor circuit board 3 (opposite to the first side). The first housing region 2a can also be referred to as the front housing region. The first side of the image sensor circuit board 3 can also be referred to as the front side. The second housing region 2b can also be referred to as the rear housing region. The second side of the image sensor circuit board 3 can also be referred to as the rear side. Figure 1 and Figure 2 The rear view of the housing and the rear view of the image sensor circuit board 3 are shown.

[0048] In the illustrated embodiment, the front housing region 2a has a front opening. That is, the housing 2 can be accessed from the front side of the housing to insert a component into the housing 2. In the illustrated embodiment, the rear housing region has a rear opening. That is, the housing 2 can be accessed from the rear side of the housing to insert a component into the housing 2. At least one of the two openings (the rear opening in the illustrated embodiment) is larger than the image sensor circuit board 3 so that the image sensor circuit board 3 can be inserted into the housing 2.

[0049] The camera 1 has an image sensor 4. The image sensor 4 is fixedly mounted on the front side of the image sensor circuit board 3. Figure 3 A view of the front side of the image sensor circuit board 3 is shown.

[0050] The camera 1 has an optical device 5. The optical device 5 is fixedly mounted on the housing 2 and / or the image sensor circuit board 3. In particular, the optical device 5 can be bonded to the housing 2 and / or the image sensor circuit board 3. The optical device 5 is arranged in or at the front housing region 2a. In particular, the optical device 5 can close the front opening of the housing 2 or the front housing region 2a. The optical device 5 can be partially arranged inside the housing cavity and partially arranged outside the housing cavity. In particular, the front side of the image sensor circuit board 3 can face the optical device 5, or the optical device 5 can be arranged in or at the front side of the housing. Figure 4 This shows a view of the optical device 5 connected to the image sensor circuit board 3.

[0051] Camera 1 has an electronic component 6. The electronic component 6 is arranged in the region of the optical device 5, or in the region on the front side of the housing. Here, the optical device 5 can, for example, be constructed with a cavity containing the electronic component 6. In the illustrated embodiment, the electronic component 6 is configured as a heater for the optical device 5. Alternatively, the electronic component 6 can be configured as a focusing device. Alternatively, the electronic component 6 can be configured as a cleaning element. Alternatively, the electronic component 6 can be configured as a control element for operating an electric motor and / or a light source. Camera 1 may also have multiple electronic components 6. Multiple electronic components 6 can have different functions, especially the aforementioned functions.

[0052] The camera 1 has an electrical connection line 7. The connection line 7 is connected to the electronic component 6. In particular, the connection line 7 may have a first contact element (at its first end) for contacting the electronic component 6. Furthermore, the connection line 7 may have a second contact element (at its second end) for contacting the connection points of the camera 1 for voltage supply and / or data supply.

[0053] According to this disclosure, the connection line 7 passes through or is guided along the image sensor circuit board 3 within the housing cavity. The connection line 7 (or the second contact element) contacts the rear side of the image sensor circuit board 3 / by that rear side (not shown), or by a housing cover (not shown) arranged in the second housing region 2b, or by a contact circuit board 9 arranged in the second housing region 2b (see [link to contact circuit board 9]). Figure 5 Contact. That is, the electronic component 6 and the connection position for the connecting line 7 are arranged in different housing regions, namely, the electronic component 6 is arranged in the first housing region 2a and the connection position is arranged in the second housing region 2b.

[0054] For this purpose, the camera 1 has a recess 8, which is formed inside the image sensor circuit board 3 (not shown) or between the inner wall of the housing and the image sensor circuit board 3 (see [reference]). Figure 1 and Figure 2 The connecting line 7 extends through the recess 8. The recess 8 can be constructed, for example, by a recess that extends inward relative to the edge of the image sensor circuit board 3 (see...). Figure 1 The empty space 8 can also be formed, for example, by adapting or reducing the cross-section of the image sensor circuit board 3, so that there is free space or an unfilled cross-section between the edge of the image sensor circuit board 3 and the inner wall of the housing.

[0055] In addition, Figure 2As can be seen, in particular, a plug connector 10 in the form of a plug-in connector, such as a stacked plug connector, can be constructed on the rear side of the image sensor circuit board 3 to electrically connect the image sensor circuit board 3 to another circuit board, such as a contact circuit board 9 or another component.

[0056] In addition, Figure 3 As can be seen, an adhesive position 11, particularly in the form of (circular) adhesive tape, can be applied to the front side of the image sensor circuit board 3 to secure the optical device 5 thereto. The adhesive position 11 is placed around the image sensor 4.

[0057] In addition, Figures 1 to 5 As can be seen, the image sensor circuit board 3 has a hole 12 and the housing 2 has pins 13, through which the image sensor circuit board 3 can be connected to the housing 2.

[0058] Figure 6 and Figure 7 The image shows cameras installed at different times. Figure 6 As shown, the image sensor circuit board 3 is inserted into the housing 2 from the rear side of the housing. An adhesive position 11 is constructed on the front side of the image sensor circuit board 3. Adhesive positions 14, particularly in the form of (circular) adhesive tape, are also constructed on the end side of the housing 2 or housing member to secure the optical device 5 thereto.

[0059] Figure 8 A side view of the camera is shown. Figure 9 Show along Figure 8 The figure shows a longitudinal cross-sectional view of camera 1 along line IX. It can be seen particularly clearly in this figure that the image sensor circuit board 3 defines a plane E dividing the housing 2 or housing cavity into two regions (i.e., the first housing region 2a and the second housing region 2b). The front section 7a of the image sensor 4, optical device 5, electronic components 6, and connecting lines 7 is arranged in the first housing region 2a, while the rear section 7b of the connecting lines 7 is arranged in the second housing region 2b. The connecting lines 7 extend through the open space 8 arranged in the plane, i.e., through or along the image sensor circuit board 3.

[0060] In addition, Figure 9 As can be seen, a circumferential gap 15 can be constructed between the inner wall of the housing and the image sensor circuit board; however, this circumferential gap is smaller than the cross-section of the connecting line 7.

[0061] exist Figure 9 The bonding position 11 can also be seen, through which the image sensor circuit board 3 and the optical device 5 are connected to each other.

Claims

1. A camera (1) for a vehicle, having Shell (2), the shell structure contains a shell cavity, An image sensor circuit board (3) is arranged in the cavity of the housing, which divides the cavity into a first housing region (2a) and a second housing region (2b). The image sensor (4) mounted on the first side of the image sensor circuit board (3), and A structural assembly fixedly mounted on the housing (2) and / or the image sensor circuit board (3), the structural assembly having an optical device (5), electronic components, and electrical connection lines (7) connected to the electronic components (6). Its features are, The connecting line (7) is guided through the image sensor circuit board (3) in the housing cavity or along the image sensor circuit board (3) and the connecting line (7) is on the second side of the image sensor circuit board (3) or is contacted by the housing cover or contact circuit board (9) arranged in the second housing region (2b).

2. The camera (1) according to claim 1, characterized in that, An opening (8) is formed inside the image sensor circuit board (3) or between the inner wall of the housing and the image sensor circuit board (3), and the connecting line (7) extends through the opening.

3. The camera (1) according to claim 1 or 2, characterized in that, The optical device is bonded to the housing (2) and / or the image sensor circuit board (3).

4. The camera (1) according to any one of claims 1 to 3, characterized in that, The image sensor circuit board (3) is fixedly connected to the housing (2), or connected to the housing (2) via the optical device (5).

5. The camera (1) according to any one of claims 1 to 4, characterized in that, The electronic component (6) is a heater and / or focusing device and / or cleaning element and / or control element for operating an electric motor and / or light source.

6. The camera (1) according to any one of claims 1 to 5, characterized in that, The connection line (7) is directly connected to a connection position constructed on the second side of the image sensor circuit board (3), the housing cover, or the contact circuit board, wherein the connection between the connection line (7) and the connection position is constructed as a floating connection.

7. The camera (1) according to any one of claims 1 to 6, characterized in that, The camera (1) has a voltage source or voltage connector for connection to an external power source, wherein the voltage source or voltage connector is arranged in the housing cavity and connected to the electronic component via the connection line (7).

8. The camera (1) according to claim 3, characterized in that, The optical device is bonded to the housing (2) and / or the image sensor circuit board (3) in the region on the first side of the image sensor circuit board (3).

9. The camera (1) according to claim 4, characterized in that, The image sensor circuit board (3) is joined to the housing (2) by seam and / or screwing and / or bonding.

10. A method for installing a camera (1) according to any one of claims 1 to 9, comprising the following steps: - The structural components are connected to the housing (2) and / or the image sensor circuit board (3) via adhesive connections (11, 14) such that the optical device (5) is oriented relative to the image sensor (4) or the image sensor (4) is oriented relative to the optical device (5). -Cure the adhesive bond (11, 14), - Contact the connecting line (7), wherein, The contact is made after the adhesive bond (11, 14) has been cured.

11. The installation method according to claim 10, wherein, The contact of the connecting line (7) is achieved within the second housing region (2b).

12. The installation method according to claim 10 or 11, wherein, The adhesive joints (11, 14) are fixed by UV light before curing.

Images