Wiring circuit board

Abstract

The wired circuit board (1) has a first portion (1A), a second portion (1B), and a connection portion (1C) that connects the first portion (1A) and the second portion (1B). The wired circuit board (1) is provided with a metal layer (11), a first insulating layer (12), a first circuit pattern (13), a second circuit pattern (14), and a third circuit pattern (15). The metal layer (11) is continuously disposed in the first portion (1A), the second portion (1B), and the connection portion (1C). The first circuit pattern (13) is electrically connected to the metal layer (11) of the first portion (1A). The second circuit pattern (14) is electrically connected to the metal layer (11) of the second portion (1B). The third circuit pattern (15) electrically connects the metal layer (11) of the first portion (1A) and the metal layer (11) of the second portion (1B).

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Previously, a wiring circuit board was proposed, which includes a metal support layer, a conductor layer, and a base insulating layer disposed between the metal support layer and the conductor layer, wherein the conductor layer has terminals electrically connected to the metal support layer (for example, see Patent Document 1 below).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2024-122426 Summary of the Invention The problem that the invention aims to solve In a wiring circuit board as described in Patent Document 1, where multiple terminals are electrically connected to a metal support layer, it is required to reduce the resistance between these terminals.

[0004] The present invention provides a wiring circuit board that can reduce the resistance between circuit patterns (a first circuit pattern and a second circuit pattern) electrically connected to a metal layer.

[0005] Technical solutions for solving the problem The present invention [1] includes a wiring circuit board having a first portion, a second portion disposed separately from the first portion, and a connection portion connecting the first portion and the second portion, wherein the wiring circuit board comprises: a metal layer continuously disposed on the first portion, the second portion and the connection portion; an insulating layer disposed on one side surface of the metal layer in the thickness direction; a first circuit pattern disposed on one side surface of the insulating layer of the first portion in the thickness direction and electrically connected to the metal layer of the first portion; a second circuit pattern disposed independently of the first circuit pattern on one side surface of the insulating layer of the second portion in the thickness direction and electrically connected to the metal layer of the second portion; and a third circuit pattern electrically connecting the metal layer of the first portion to the metal layer of the second portion, or electrically connecting the metal layer of the first portion to the metal layer of the connection portion.

[0006] According to this structure, through the third circuit pattern, the metal layer of the first part is electrically connected to the metal layer of the second part, or the metal layer of the first part is electrically connected to the metal layer of the connecting part.

[0007] Therefore, in addition to forming a conductive path through the metal layer of the connecting portion, a conductive path through the third circuit pattern is also formed between the first circuit pattern and the second circuit pattern.

[0008] As a result, the resistance between the first circuit pattern and the second circuit pattern can be reduced.

[0009] The present invention [2] includes the wiring circuit board of [1] above, wherein the first circuit pattern has a first connection portion connected to the metal layer of the first portion, and the third circuit pattern has: a first end portion connected to the metal layer of the first portion; and a second end portion connected to the metal layer of the second portion or the metal layer of the connection portion, wherein the distance between the first connection portion of the first circuit pattern and the first end portion of the third circuit pattern is shorter than the distance between the first connection portion of the first circuit pattern and the metal layer of the connection portion.

[0010] According to this structure, the conduction path through the third circuit pattern is shorter than the conduction path through the metal layer of the connecting portion. That is, between the first circuit pattern and the second circuit pattern, a conduction path (the conduction path through the third circuit pattern) is formed that is shorter than the conduction path through the metal layer of the connecting portion.

[0011] Therefore, the resistance between the first circuit pattern and the second circuit pattern can be reliably reduced.

[0012] The present invention [3] includes the wiring circuit board of [2] above, wherein the second circuit pattern has a second connection portion connected to the metal layer of the second portion, the second end of the third circuit pattern is connected to the metal layer of the second portion, and the distance between the second connection portion of the second circuit pattern and the second end of the third circuit pattern is shorter than the distance between the second connection portion of the second circuit pattern and the metal layer of the connection portion.

[0013] According to this structure, the conduction path through the third circuit pattern is even shorter than the conduction path through the metal layer of the connecting portion.

[0014] Therefore, the resistance between the first circuit pattern and the second circuit pattern can be reduced more reliably.

[0015] The present invention [4] includes a wiring circuit board according to any one of [1] to [3] above, wherein the wiring circuit board further comprises a fourth circuit pattern, the fourth circuit pattern being disposed independently on one side surface of the insulating layer in the thickness direction relative to the first circuit pattern and the second circuit pattern, and not electrically connected to the metal layer, the fourth circuit pattern comprising: a first terminal disposed in the first portion; a second terminal disposed in the second portion; and wiring disposed in the first portion, the second portion and the connecting portion, and electrically connecting the first terminal and the second terminal.

[0016] The present invention [5] includes the wiring circuit board described above [4], wherein the first part has a first terminal configuration portion for configuring the first terminal and a first wiring configuration portion for configuring a portion of the wiring, the second part has a second terminal configuration portion for configuring the second terminal and a second wiring configuration portion for configuring a portion of the wiring, and the third circuit pattern electrically connects the metal layer of the first wiring configuration portion to the metal layer of the second wiring configuration portion.

[0017] The present invention [6] includes the wiring circuit board described above [4], wherein the first part has a first terminal configuration portion for configuring the first terminal and a first wiring configuration portion for configuring a portion of the wiring, the second part has a second terminal configuration portion for configuring the second terminal and a second wiring configuration portion for configuring a portion of the wiring, and the third circuit pattern electrically connects the metal layer of the first terminal configuration portion to the metal layer of the second terminal configuration portion.

[0018] The present invention [7] includes the wiring circuit board described above [4], wherein the first part has a first terminal configuration portion for configuring the first terminal and a first wiring configuration portion for configuring a portion of the wiring, the second part has a second terminal configuration portion for configuring the second terminal and a second wiring configuration portion for configuring a portion of the wiring, and the third circuit pattern electrically connects the metal layer of the first wiring configuration portion to the metal layer of the second terminal configuration portion, or electrically connects the metal layer of the first terminal configuration portion to the metal layer of the second wiring configuration portion.

[0019] The present invention [8] includes a wiring circuit board of any one of [1] to [7] above, wherein the third circuit pattern is made of the same material as the metal layer.

[0020] The present invention [9] includes a wiring circuit board of any one of [1] to [7] above, wherein the third circuit pattern is made of the same material as the first circuit pattern, and the wiring circuit board further has a support layer made of the same material as the insulating layer to support the third circuit pattern.

[0021] The present invention

[10] includes a wiring circuit board of any one of [1] to [9] above, wherein the third circuit pattern has: a first end connected to the metal layer of the first portion; and a second end connected to the metal layer of the second portion or the metal layer of the connecting portion, wherein the length of the third circuit pattern is longer than the straight-line distance between the first end and the second end.

[0022] According to this structure, the length of the third circuit pattern is longer than the straight-line distance between the first end and the second end, thus allowing the second part to move relative to the first part.

[0023] Invention Effects According to the wiring circuit board of the present invention, the resistance between circuit patterns (first circuit pattern and second circuit pattern) electrically connected to the metal layer can be reduced. Attached Figure Description

[0024] Figure 1 This is a top view (viewed from the thickness direction) of a wiring circuit board according to one embodiment of the present invention.

[0025] Figure 2A yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board. Figure 2B yes Figure 1 The diagram shows a BB cross-sectional view of the wiring circuit board.

[0026] Figure 3 yes Figure 1 The rear view of the wiring circuit board shown (viewed from the other side in the thickness direction).

[0027] Figure 4 This is a top view of the wiring circuit board of variant example (1).

[0028] Figure 5 yes Figure 4 The shown is a CC cross-sectional view of the wiring circuit board.

[0029] Figure 6 This is a top view of the wiring circuit board of variant example (2).

[0030] Figure 7 yes Figure 6 The rear view of the wiring circuit board shown.

[0031] Figure 8 This is a top view of the wiring circuit board of variant example (3).

[0032] Figure 9 yes Figure 8 The rear view of the wiring circuit board shown.

[0033] Figure 10 This is a top view of the wiring circuit board of variant example (4).

[0034] Figure 11 yes Figure 10 The rear view of the wiring circuit board shown.

[0035] Figure 12 This is a top view of the wiring circuit board of variant example (5).

[0036] Figure 13 yes Figure 12 The rear view of the wiring circuit board shown.

[0037] Figure 14 This is a top view of the wiring circuit board of variant example (6).

[0038] Figure 15 yes Figure 14 The rear view of the wiring circuit board shown. Detailed Implementation

[0039] 1. Wiring circuit board like Figure 1 As shown, the wiring circuit board 1 has a first part 1A, a second part 1B, and a connection part 1C.

[0040] The first portion 1A has a width in a first direction and extends along a second direction. The second direction is orthogonal to the first direction. The first portion 1A has a first terminal arrangement portion 101A and a first wiring arrangement portion 102A. A first terminal 161, described later, is arranged in the first terminal arrangement portion 101A. The first terminal arrangement portion 101A extends along both the first and second directions. The first terminal arrangement portion 101A has a generally rectangular shape. A portion of the wiring 163, described later, is arranged in the first wiring arrangement portion 102A. The first wiring arrangement portion 102A extends from the first terminal arrangement portion 101A along the second direction.

[0041] The second portion 1B is disposed separately from the first portion 1A in a first direction. The second portion 1B has a width in the first direction and extends along a second direction. The second portion 1B has a second terminal configuration portion 101B and a second wiring configuration portion 102B. The second terminal configuration portion 101B is disposed separately from the first terminal configuration portion 101A in the first direction. A second terminal 162 (described later) is configured on the second terminal configuration portion 101B. The second terminal configuration portion 101B extends along both the first and second directions. The second terminal configuration portion 101B has a generally rectangular shape. The second wiring configuration portion 102B is disposed separately from the first wiring configuration portion 102A in the first direction. A portion of a wiring 163 is configured on the second wiring configuration portion 102B. The second wiring configuration portion 102B extends from the second terminal configuration portion 101B along the second direction.

[0042] Connecting portion 1C connects first portion 1A and second portion 1B. Connecting portion 1C is disposed between first portion 1A and second portion 1B in a first direction. Connecting portion 1C has a width in a second direction and extends along the first direction. One end of connecting portion 1C is connected to first portion 1A. The other end of connecting portion 1C is connected to second portion 1B.

[0043] like Figure 2A as well as Figure 2B As shown, the wiring circuit board 1 includes a metal layer 11, a first insulating layer 12 as an example of an insulating layer, and a first circuit pattern 13 (see reference). Figure 1 Second circuit pattern 14 (refer to) Figure 1 ), Third circuit pattern 15 (refer to) Figure 1 ), fourth circuit pattern 16 (refer to) Figure 1 ), and the second insulating layer 17 (refer to Figure 2B ).

[0044] (1) Metal layer like Figure 3 As shown, the metal layer 11 is continuously disposed on the first portion 1A, the second portion 1B, and the connecting portion 1C. Figure 2A as well as Figure 2B As shown, the metal layer 11 supports the first insulating layer 12, the first circuit pattern 13, the second circuit pattern 14, the fourth circuit pattern 16, and the second insulating layer 17. Examples of materials for the metal layer 11 include stainless steel and copper alloys. The metal layer 11 is preferably made of a copper alloy.

[0045] It should be noted that the metal layer 11 may also consist of multiple layers. For example, the metal layer 11 may also have a metal support layer, a conductor layer, and a protective metal layer.

[0046] The metal support layer supports the conductor layer and the protective metal layer. The metal support layer is, for example, made of the material of the metal layer 11 described above.

[0047] A conductor layer is disposed on one side surface of the metal support layer in the thickness direction of the metal layer 11. The conductor layer is disposed between the metal support layer and the protective metal layer in the thickness direction. The conductor layer is made of metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and their alloys. The conductor layer is preferably made of copper. The conductor layer may be, for example, a plating layer.

[0048] A protective metal layer is disposed on one side surface of the conductor layer in the thickness direction. The protective metal layer covers the conductor layer. The protective metal layer is disposed between the conductor layer and the first insulating layer 12. The protective metal layer protects the conductor layer. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof. The protective metal layer is preferably made of chromium. The protective metal layer may be, for example, a sputtered layer.

[0049] (2) First insulating layer A first insulating layer 12 is disposed on one side surface of the metal layer 11 in the thickness direction. The first insulating layer 12 is disposed in the thickness direction between the metal layer 11 and the first circuit pattern 13, between the metal layer 11 and the second circuit pattern 14, and between the metal layer 11 and the fourth circuit pattern 16. The first insulating layer 12 insulates the metal layer 11 relative to the first circuit pattern 13, the second circuit pattern 14, and the fourth circuit pattern 16. The first insulating layer 12 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 12 is preferably made of polyimide. The first insulating layer 12 has a first through-hole 12A and a second through-hole 12B. The first through-hole 12A is disposed in a first portion 1A. The second through-hole 12B is disposed in a second portion 1B.

[0050] (3) First circuit pattern A first circuit pattern 13 is disposed on one side surface of the first insulating layer 12 of the first portion 1A in the thickness direction. The first circuit pattern 13 has a terminal 131. In this embodiment, the first circuit pattern 13 is composed only of the terminal 131. The terminal 131 has a first connection portion 131A. In other words, the first circuit pattern 13 has a first connection portion 131A. The first connection portion 131A is disposed within a first through hole 12A of the first insulating layer 12. The first connection portion 131A is connected to the metal layer 11 of the first portion 1A through the first through hole 12A. More specifically, the first connection portion 131A is connected to the metal layer 11 of the first terminal placement portion 101A through the first through hole 12A. Thus, the first circuit pattern 13 is electrically connected to the metal layer 11 of the first portion 1A.

[0051] It should be noted that the first circuit pattern 13 may also have wiring connected to the terminal 131. In this case, the wiring may also have a first connection portion 131A.

[0052] Materials for the first circuit pattern 13 include, for example, copper, silver, gold, iron, aluminum, chromium, and their alloys. The first circuit pattern 13 is preferably made of copper.

[0053] The first circuit pattern 13 may also consist of multiple layers. For example, the first circuit pattern 13 may also have a protective metal layer and a conductor layer.

[0054] A protective metal layer is disposed on one side surface of the first insulating layer 12 in the thickness direction. The protective metal layer is disposed between the first insulating layer 12 and the conductor layer of the first circuit pattern 13. The protective metal layer protects the conductor layer of the first circuit pattern 13. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof. The protective metal layer is preferably made of chromium. The protective metal layer may be, for example, a sputtered layer.

[0055] A conductor layer is disposed on one side surface of the protective metal layer in the thickness direction. The conductor layer is, for example, made of the material of the first circuit pattern 13 described above. The conductor layer is, for example, a plating layer.

[0056] (4) Second circuit pattern The second circuit pattern 14 is disposed on one side surface of the first insulating layer 12 of the second portion 1B in the thickness direction. The second circuit pattern 14 is independent of the first circuit pattern 13. The second circuit pattern 14 has a terminal 141. In this embodiment, the second circuit pattern 14 is composed only of the terminal 141. The terminal 141 has a second connection portion 141A. In other words, the second circuit pattern 14 has a second connection portion 141A. The second connection portion 141A is disposed in the second through hole 12B of the first insulating layer 12. The second connection portion 141A is connected to the metal layer 11 of the second portion 1B through the second through hole 12B. Specifically, the second connection portion 141A is connected to the metal layer 11 of the second terminal placement portion 101B through the second through hole 12B. Thus, the second circuit pattern 14 is electrically connected to the metal layer 11 of the second portion 1B.

[0057] It should be noted that the second circuit pattern 14 may also have wiring connected to the terminal 141. In this case, the wiring may also have a second connection portion 141A.

[0058] The second circuit pattern 14 may be made of the same material as the first circuit pattern 13. The second circuit pattern 14 may also be made of multiple layers, just like the first circuit pattern 13.

[0059] (5) Third circuit diagram like Figure 3As shown, the third circuit pattern 15 electrically connects the metal layer 11 of the first portion 1A to the metal layer 11 of the second portion 1B. Thus, a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14, passing through the metal layer 11 of the connecting portion 1C and through the third circuit pattern 15. Therefore, compared to the case where only a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14 through the metal layer 11 of the connecting portion 1C, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced.

[0060] The third circuit pattern 15 has a first end 151 and a second end 152. The first end 151 is connected to the metal layer 11 of the first portion 1A. The second end 152 is connected to the metal layer 11 of the second portion 1B. More specifically, the third circuit pattern 15 is disposed in a first direction between the metal layer 11 of the first wiring configuration portion 102A and the metal layer 11 of the second wiring configuration portion 102B. The third circuit pattern 15 is disposed in a second direction between the connection portion 1C and the first terminal configuration portion 101A. The first end 151 is connected to the metal layer 11 of the first wiring configuration portion 102A. The second end 152 is connected to the metal layer 11 of the second wiring configuration portion 102B. Thus, the third circuit pattern 15 electrically connects the metal layer 11 of the first wiring configuration portion 102A and the metal layer 11 of the second wiring configuration portion 102B.

[0061] The distance D1 between the first connecting portion 131A of the first circuit pattern 13 and the first end portion 151 of the third circuit pattern 15 is shorter than the distance D11 between the first connecting portion 131A of the first circuit pattern 13 and the metal layer 11 of the connecting portion 1C.

[0062] Since distance D1 is shorter than distance D11, the conduction path through the third circuit pattern 15 is shorter than the conduction path through the metal layer 11 of the connection portion 1C. That is, between the first circuit pattern 13 and the second circuit pattern 14, a conduction path shorter than the conduction path through the metal layer 11 of the connection portion 1C (the conduction path through the third circuit pattern 15) is formed. Therefore, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reliably reduced.

[0063] The distance D2 between the second connecting portion 141A of the second circuit pattern 14 and the second end portion 152 of the third circuit pattern 15 is shorter than the distance D12 between the second connecting portion 141A of the second circuit pattern 14 and the metal layer 11 of the connecting portion 1C.

[0064] Since distance D1 is shorter than distance D11, and distance D2 is shorter than distance D12, the conduction path through the third circuit pattern 15 is even shorter than the conduction path through the metal layer 11 of the connection portion 1C. Therefore, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced more reliably.

[0065] In this embodiment, the third circuit pattern 15 is made of the same material as the metal layer 11 and is continuous with the metal layer 11.

[0066] (6) Fourth circuit pattern like Figure 2A as well as Figure 2B As shown, the fourth circuit pattern 16 is disposed on one side surface of the first insulating layer 12 in the thickness direction. The fourth circuit pattern 16 is independent of the first circuit pattern 13 and the second circuit pattern 14. The fourth circuit pattern 16 is not electrically connected to the metal layer 11. The fourth circuit pattern 16 is, for example, made of the same material as the first circuit pattern 13. The fourth circuit pattern 16 may also be composed of multiple layers, just like the first circuit pattern 13.

[0067] like Figure 1 As shown, the fourth circuit pattern 16 has a first terminal 161, a second terminal 162, and wiring 163.

[0068] The first terminal 161 is disposed in the first portion 1A. More specifically, the first terminal 161 is disposed in the first terminal placement section 101A. The first terminal 161 is disposed separately from the first circuit pattern 13.

[0069] The second terminal 162 is disposed in the second part 1B. Specifically, the second terminal 162 is disposed in the second terminal placement part 101B. The second terminal 162 is disposed separately from the second circuit pattern 14.

[0070] Wiring 163 electrically connects the first terminal 161 to the second terminal 162. Wiring 163 is disposed in the first part 1A, the second part 1B, and the connection part 1C.

[0071] (7) Second insulating layer like Figure 2B As shown, the second insulating layer 17 is disposed on one side surface of the first insulating layer 12 in the thickness direction. The second insulating layer 17 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The second insulating layer 17 covers the wiring 163. The second insulating layer 17 does not cover at least a portion of each of the terminals 131, 141, the first terminal 161, and the second terminal 162.

[0072] 2. Effects (1) According to the wiring circuit board 1, such as Figure 3 As shown, the metal layer 11 of the first part 1A and the metal layer 11 of the second part 1B are electrically connected using the third circuit pattern 15.

[0073] Therefore, a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14, through the metal layer 11 of the connecting portion 1C and through the third circuit pattern 15.

[0074] As a result, compared to the case where only a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14 through the metal layer 11 of the connecting portion 1C, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced.

[0075] (2) According to the wiring circuit board 1, such as Figure 3 As shown, the distance D1 between the first connecting portion 131A of the first circuit pattern 13 and the first end portion 151 of the third circuit pattern 15 is shorter than the distance D11 between the first connecting portion 131A of the first circuit pattern 13 and the metal layer 11 of the connecting portion 1C.

[0076] Therefore, the conduction path through the third circuit pattern 15 is shorter than the conduction path through the metal layer 11 of the connecting portion 1C. That is, between the first circuit pattern 13 and the second circuit pattern 14, a conduction path (through the third circuit pattern 15) shorter than the conduction path through the metal layer 11 of the connecting portion 1C is formed.

[0077] As a result, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reliably reduced.

[0078] (3) According to the wiring circuit board 1, such as Figure 3 As shown, the distance D2 between the second connecting portion 141A of the second circuit pattern 14 and the second end portion 152 of the third circuit pattern 15 is shorter than the distance D12 between the second connecting portion 141A of the second circuit pattern 14 and the metal layer 11 of the connecting portion 1C.

[0079] Therefore, the conduction path through the third circuit pattern 15 is even shorter than the conduction path through the metal layer 11 of the connecting portion 1C.

[0080] As a result, the resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced more reliably.

[0081] 3. Variations The following describes a variation. In the variation, the same symbols are used to mark the same components as in the above-described embodiment, and the description of the component is omitted.

[0082] (1) such as Figure 4 as well as Figure 5 As shown, the third circuit pattern 20 can also be made of the same material as the first circuit pattern 13. In this case, the first insulating layer 12 has a third through-hole 12C and a fourth through-hole 12D. The third through-hole 12C is disposed in the first wiring arrangement portion 102A of the first portion 1A. The fourth through-hole 12D is disposed in the second wiring arrangement portion 102B of the second portion 1B. The third circuit pattern 20 has a third connecting portion 20A and a fourth connecting portion 20B.

[0083] The third connection portion 20A is disposed within the third through hole 12C of the first insulating layer 12. The third connection portion 20A is connected to the metal layer 11 of the first wiring arrangement portion 102A through the third through hole 12C. Thus, the third circuit pattern 20 is electrically connected to the metal layer 11 of the first portion 1A.

[0084] The fourth connection portion 20B is disposed within the fourth through hole 12D of the first insulating layer 12. The fourth connection portion 20B is connected to the metal layer 11 of the second wiring arrangement portion 102B through the fourth through hole 12D. Thus, the third circuit pattern 20 is electrically connected to the metal layer 11 of the second portion 1B.

[0085] Additionally, the wiring circuit board 1 may also have a support layer 21. A third circuit pattern 20 is disposed on one side surface of the support layer 21 in the thickness direction. Thus, the support layer 21 supports the third circuit pattern 20. The support layer 21 is made of the same material as the first insulating layer 12 and is continuous with the first insulating layer 12.

[0086] (2) For example Figure 6 as well as Figure 7 As shown, the third circuit pattern 15 can also electrically connect the metal layer 11 of the first terminal configuration section 101A to the metal layer 11 of the second terminal configuration section 101B.

[0087] (3) such as Figure 8 as well as Figure 9 As shown, the third circuit pattern 15 can also electrically connect the metal layer 11 of the first wiring configuration section 102A to the metal layer 11 of the second terminal configuration section 101B.

[0088] It should be noted that, although not shown in the figure, the third circuit pattern 15 can also electrically connect the metal layer 11 of the first terminal configuration section 101A to the metal layer 11 of the second wiring configuration section 102B.

[0089] (4) such as Figure 10 as well as Figure 11As shown, the second part 1B can also be disposed on the opposite side of the first part 1A in the second direction relative to the connecting part 1C. In other words, the connecting part 1C can also be disposed between the first part 1A and the second part 1B in the second direction.

[0090] The third circuit pattern 15 can also electrically connect the metal layer 11 of the first part 1A to the metal layer 11 of the connecting part 1C. More specifically, the first end 151 of the third circuit pattern 15 can be connected to the metal layer 11 of the first part 1A, and the second end 152 of the third circuit pattern 15 can be connected to the metal layer 11 of the connecting part 1C.

[0091] (5) such as Figure 12 as well as Figure 13 As shown, the connecting portion 1C can also be disposed between the first portion 1A and the second portion 1B in the first direction. The wiring circuit board 1 can also have an S-shape when viewed from above. In this case, similarly to the above-described variation (4), the third circuit pattern 15 can also electrically connect the metal layer 11 of the first portion 1A to the metal layer 11 of the connecting portion 1C. More specifically, the first end 151 of the third circuit pattern 15 can be connected to the metal layer 11 of the first portion 1A, and the second end 152 of the third circuit pattern 15 can be connected to the metal layer 11 of the connecting portion 1C.

[0092] (6) For example Figure 14 as well as Figure 15 As shown, the length of the third circuit pattern 15 can also be longer than the straight-line distance D21 between the first end 151 and the second end 152. If the length of the third circuit pattern 15 is longer than the straight-line distance D21 between the first end 151 and the second end 152, then the movement of the second part 1B relative to the first part 1A can be permitted.

[0093] (7) In the above variations (1) to (6), the same effect as the above implementation method can also be obtained.

[0094] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that are obvious to those skilled in the art are included within the scope of protection of the technical solutions described below.

[0095] Industrial availability The wiring circuit board of the present invention can be used for the connection of electronic components.

[0096] Symbol Explanation 1: Wiring circuit board 1A: Part One 101A: First Terminal Configuration Section 102A: First Cabling Configuration Department 1B: Part Two 101B: Second Terminal Configuration Section 102B: Second Cabling Configuration Department 1C: Connection part 11: Metal layer 12: First insulating layer 13: First circuit diagram 131A: First connecting part 14: Second circuit pattern 141A: Second connecting part 15: Third circuit diagram 151: First end 152: Second end 16: Fourth circuit diagram 161: First terminal 162: Second terminal 163: Wiring 21: Support layer D1: Distance between the first connecting part and the first end part D2: Distance between the second connecting part and the second end part D11: Distance between the first connecting part and the metal layer of the connecting portion D12: Distance between the metal layer of the second connecting part and the connecting portion D21: The straight-line distance between the first end and the second end.

Claims

1. A wiring circuit board having a first portion, a second portion disposed separately from the first portion, and a connection portion connecting the first portion and the second portion, the wiring circuit board comprising: A metal layer is continuously disposed on the first portion, the second portion, and the connecting portion; An insulating layer disposed on one side surface of the metal layer in the thickness direction thereof; A first circuit pattern is disposed on one side surface of the insulating layer of the first portion in the thickness direction and is electrically connected to the metal layer of the first portion. A second circuit pattern is disposed independently of the first circuit pattern on one side surface of the insulating layer of the second portion in the thickness direction and is electrically connected to the metal layer of the second portion. as well as A third circuit pattern electrically connects the metal layer of the first portion to the metal layer of the second portion, or electrically connects the metal layer of the first portion to the metal layer of the connecting portion.

2. The wiring circuit board according to claim 1, wherein, The first circuit pattern has a first connection portion that is connected to the metal layer of the first portion. The third circuit pattern has the following characteristics: A first end, which is connected to the metal layer of the first portion; and The second end is connected to the metal layer of the second portion or the metal layer of the connecting portion. The distance between the first connecting portion of the first circuit pattern and the first end of the third circuit pattern is shorter than the distance between the first connecting portion of the first circuit pattern and the metal layer of the connecting portion.

3. The wiring circuit board according to claim 2, wherein, The second circuit pattern has a second connection portion that is connected to the metal layer of the second portion. The second end of the third circuit pattern is connected to the metal layer of the second portion. The distance between the second connection portion of the second circuit pattern and the second end portion of the third circuit pattern is shorter than the distance between the second connection portion of the second circuit pattern and the metal layer of the connection portion.

4. The wiring circuit board according to claim 1, wherein, The wiring circuit board further includes a fourth circuit pattern, which is disposed independently on one side surface of the insulating layer in the thickness direction relative to the first and second circuit patterns, and is not electrically connected to the metal layer. The fourth circuit pattern has the following characteristics: A first terminal is disposed in the first portion; The second terminal is disposed in the second part; as well as Wiring is provided in the first part, the second part, and the connecting part, and electrically connects the first terminal to the second terminal.

5. The wiring circuit board according to claim 4, wherein, The first part includes a first terminal configuration section for configuring the first terminal and a first wiring configuration section for configuring a portion of the wiring. The second part includes a second terminal configuration section for configuring the second terminal and a second wiring configuration section for configuring a portion of the wiring. The third circuit pattern electrically connects the metal layer of the first wiring configuration to the metal layer of the second wiring configuration.

6. The wiring circuit board according to claim 4, wherein, The first part includes a first terminal configuration section for configuring the first terminal and a first wiring configuration section for configuring a portion of the wiring. The second part includes a second terminal configuration section for configuring the second terminal and a second wiring configuration section for configuring a portion of the wiring. The third circuit pattern electrically connects the metal layer of the first terminal configuration portion to the metal layer of the second terminal configuration portion.

7. The wiring circuit board according to claim 4, wherein, The first part includes a first terminal configuration section for configuring the first terminal and a first wiring configuration section for configuring a portion of the wiring. The second part includes a second terminal configuration section for configuring the second terminal and a second wiring configuration section for configuring a portion of the wiring. The third circuit pattern electrically connects the metal layer of the first wiring configuration portion to the metal layer of the second terminal configuration portion, or electrically connects the metal layer of the first terminal configuration portion to the metal layer of the second wiring configuration portion.

8. The wiring circuit board according to claim 1, wherein, The third circuit pattern is made of the same material as the metal layer.

9. The wiring circuit board according to claim 1, wherein, The third circuit pattern is made of the same material as the first circuit pattern. The wiring circuit board also has a support layer, which is made of the same material as the insulating layer and supports the third circuit pattern.

10. The wiring circuit board according to claim 1, wherein, The third circuit pattern has the following characteristics: A first end, which is connected to the metal layer of the first portion; and The second end is connected to the metal layer of the second portion or the metal layer of the connecting portion. The length of the third circuit pattern is longer than the straight-line distance between the first end and the second end.

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