Method for manufacturing a circuit board assembly and circuit board assembly
By designing slots and grooves on the inner wall of the conductive tube in the circuit board assembly to cooperate with the pin protrusions, the problems of low production efficiency and poor soldering in wave soldering are solved, achieving efficient and low-cost soldering results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- QING DING PRECISION ELECTRONICS HUAIAN CO LTD
- Filing Date
- 2024-11-20
- Publication Date
- 2026-05-22
AI Technical Summary
In existing technologies, wave soldering of electronic components and circuit boards results in low production efficiency, poor soldering quality, and problems such as electronic components floating or wobbling, leading to a low soldering yield.
During the fabrication of circuit board assemblies, the slots and/or grooves on the inner wall of the conductive tube are designed to cooperate with the protrusions of the pins. The conductive tube, pins and outer circuit layer are connected by conductive paste to achieve fixation, avoid additional fixing equipment and improve soldering stability.
It improves welding efficiency and yield, reduces costs, alleviates pin wobble during welding, and enhances welding reliability and stability.
Smart Images
Figure CN122073776A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board soldering technology, and in particular to a method for manufacturing a circuit board assembly and the circuit board assembly itself. Background Technology
[0002] Wave soldering is a soldering method for fixing through-hole electronic components onto a circuit board. It involves forming a specific wave of molten solder, inserting the electronic components into the circuit board, and then soldering them through the solder wave. However, existing wave soldering techniques for bonding through-hole electronic components to circuit boards suffer from drawbacks such as low production efficiency and poor soldering quality. Summary of the Invention
[0003] In view of this, it is necessary to provide a method for manufacturing circuit board assemblies with high production efficiency and high product soldering yield, as well as the circuit board assembly itself.
[0004] A method for manufacturing a circuit board assembly includes: providing a circuit board, the circuit board including an outer circuit layer, sidewalls, and a first through-hole, the outer circuit layer being exposed in the first through-hole, and the sidewalls surrounding the first through-hole; fitting a conductive tube onto a fixture and placing it in the first through-hole, with a gap between the conductive tube and the sidewalls; filling the space between the conductive tube and the sidewalls with insulating adhesive; removing the fixture; inserting a pin of an electronic component into the conductive tube, the pin including a protrusion; soldering the conductive tube, the pin, and the circuit board, and connecting the conductive tube, the pin, and the outer circuit layer with conductive paste; wherein a slot is formed on the inner wall of the conductive tube, and the protrusion is located in the slot; and / or a groove is formed on the conductive tube, the groove being used for the protrusion to slide along the groove to the interior of the conductive tube.
[0005] In some possible embodiments of this application, the circuit board further includes a thermally conductive layer, the electronic component further includes a body portion, and the pins are connected to the body portion; before the step of inserting the pins into the conductive tube, the manufacturing method further includes: applying thermally conductive adhesive to the surface of the thermally conductive layer; after the step of inserting the pins into the conductive tube, the thermally conductive adhesive connects the thermally conductive layer and the body portion.
[0006] In some possible embodiments of this application, the circuit board further includes a second through-hole and a conductive layer, wherein the second through-hole penetrates the circuit board and the conductive layer is located in the second through-hole and connected to the outer circuit layer.
[0007] In some possible embodiments of this application, the conductive tube includes a first part and a second part. The first part is located in a first through hole, and a slot is formed on the first part. The second part is connected to the outer circuit layer. A receiving groove is formed on the second part, and conductive paste is also received in the receiving groove.
[0008] In some possible embodiments of this application, the fixture includes a carrier plate and a support post, with the support post fixed to the carrier plate; in the step of fitting the conductive tube onto the fixture and placing it in the first through hole: the first part is fitted onto the support post, and the carrier plate is located on the side of the outer circuit layer away from the heat-conducting layer.
[0009] In some possible embodiments of this application, a slot and a groove are provided on the inner wall of the conductive tube. The slot and the groove are connected. In the step of inserting the pin into the conductive tube, the protrusion slides along the groove into the slot.
[0010] A circuit board assembly includes a circuit board, a conductive tube, insulating adhesive, electronic components, and conductive paste. The circuit board includes an outer circuit layer, a first through-hole, and sidewalls. The outer circuit layer is exposed in the first through-hole, and the sidewalls surround the first through-hole. The conductive tube is located in the first through-hole and has a gap between it and the sidewalls. The insulating adhesive fills the space between the conductive tube and the sidewalls. The electronic components include leads, each lead including a protrusion, and the leads pass through the conductive tube. The conductive paste connects the outer circuit layer, the conductive tube, and the leads. The conductive tube has a slot, and the protrusion is located in the slot. And / or the conductive tube has a groove, the groove allowing the protrusion to slide along the groove into the interior of the conductive tube.
[0011] In some possible embodiments of this application, the circuit board assembly further includes thermally conductive adhesive; the circuit board further includes a thermally conductive layer; the electronic component further includes a body portion, pins and the body portion are connected; the thermally conductive adhesive connects the thermally conductive layer and the body portion.
[0012] In some possible embodiments of this application, the thermally conductive layer includes a first thermally conductive portion and a second thermally conductive portion, the thermally conductive adhesive connects the body portion and the first thermally conductive portion, and the second thermally conductive portion is located on the end face of the circuit board.
[0013] In some possible embodiments of this application, the conductive tube includes a first part and a second part. The first part is located in a first through hole, and a slot is formed on the first part. The second part is connected to the outer circuit layer. A receiving groove is formed on the second part, and conductive paste is also received in the receiving groove.
[0014] The circuit board assembly manufacturing method provided in this application involves designing protrusions on the pins and setting slots and / or grooves in the conductive tube that cooperate with the protrusions. Before the soldering step, the conductive tube and the pins are fixed to each other, which helps to improve the problem of pins shaking in the conductive tube during the soldering process and can improve the soldering yield. Moreover, no additional fixing equipment is required for fixing, resulting in high soldering efficiency and low cost. Attached Figure Description
[0015] Figure 1 A schematic diagram of the structure of soldered electronic components and circuit boards provided by existing technology.
[0016] Figure 2A schematic diagram of the structure of a soldered electronic component and circuit board provided for another prior art.
[0017] Figure 3 This is a cross-sectional schematic diagram of an inner circuit layer formed on the surface of a dielectric layer, provided as an embodiment of this application.
[0018] Figure 4 In order to be in Figure 3 The diagram shows a cross-sectional view of the substrate intermediate obtained after forming a dielectric layer and an outer circuit layer on the surface of the inner circuit layer.
[0019] Figure 5 In order to be in Figure 4 The diagram shows a cross-sectional view of the first and second through holes formed on the intermediate body of the substrate.
[0020] Figure 6 In order to be in Figure 5 The diagram shows a cross-sectional view of a conductive layer formed in the second through-hole and a thermally conductive layer formed on the end face of the substrate intermediate.
[0021] Figure 7 To fit the guide tube onto the fixture and place it in... Figure 6 A schematic diagram of the cross-section of the first through hole is shown.
[0022] Figure 8 In order to be in Figure 7 The diagram shows a cross-sectional view of the insulating adhesive filling the space between the conductive tube and the sidewall of the circuit board.
[0023] Figure 9 To remove Figure 8 The jig shown is a cross-sectional schematic diagram of the solder mask formed on the surface of the outer circuit layer.
[0024] Figure 10 To insert the pins of electronic components Figure 9 A schematic diagram of the cross-section of the conductive tube is shown.
[0025] Figure 11 For welding Figure 10 The diagram shows the conductive tube, pins, and circuit board, resulting in a cross-sectional schematic of the circuit board assembly.
[0026] Figure 12 This is a cross-sectional schematic diagram of the conductive tube and pin provided in some embodiments of this application.
[0027] Figure 13 This is a cross-sectional schematic diagram of the conductive tube and pin provided in other embodiments of this application.
[0028] Figure 14 A schematic cross-sectional view of the conductive tube provided in some embodiments of this application.
[0029] Figure 15A cross-sectional schematic diagram of pins provided for other embodiments of this application.
[0030] Explanation of main component symbols
[0031] Circuit board assembly: 100; Circuit board: 10, 10'; Dielectric layer: 11; Inner circuit layer: 12; Outer circuit layer: 13; Thermal conductive layer: 14; First thermal conductive part: 142; Second thermal conductive part: 144; First through hole: 15; Sidewall: 152; Second through hole: 16; Conductive layer: 162; Solder resist layer: 17; Substrate intermediate: 18; Conductive tube: 20; First part: 21; Slot: 212; Slide: 214; Second Part: 22; Receiving slot: 222; Fixture: 30; Carrier plate: 31; Support column: 32; Insulating adhesive: 40; Thermally conductive adhesive: 42; Electronic components: 50, 50'; Body part: 51; Pins: 52, 52'; Protrusion: 522; Conductive paste: 60, 60'; First direction: L1; Second direction: L2; Third direction: L3; First inner diameter: D1; Second inner diameter: D2; Width: W1, W2, W3, W4, W5. Detailed Implementation
[0032] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.
[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.
[0034] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.
[0035] Please see Figure 1In existing technologies, when wave soldering an electronic component 50' with pins 52' onto a circuit board 10', additional fixing equipment is required to fix the electronic component 50', or machinery is used to thin the circuit board 10' to achieve the specified pin extension length. For example... Figure 1 As shown, when using wave soldering, the thickness of a portion of the circuit board 10' needs to be reduced to achieve the specified pin extension length 52', resulting in low production efficiency.
[0036] Please see Figure 2 If the circuit layer in the area containing pin 52' on circuit board 10' has too many layers, heat will dissipate faster during soldering, and the conductive paste 60' (e.g., solder paste) will not be sufficiently wetted, resulting in insufficient solder on pin 52' and poor soldering. Furthermore, during wave soldering, electronic components 50' on circuit board 10' may float or wobble, severely impacting production efficiency and reducing yield. Figure 2 As shown, during the soldering process, the shaking of pin 52' caused uneven soldering on both sides, with the conductive paste on the right side 60' being severely insufficient.
[0037] Please see Figures 3 to 11 This application provides a method for manufacturing a circuit board assembly 100. The method for manufacturing the circuit board assembly 100 provided by this application has high production efficiency and high soldering yield. The manufacturing method may include the following steps:
[0038] Step S1: Provide a circuit board 10. (See also...) Figures 3 to 6 The circuit board 10 can be formed by the following steps:
[0039] Step S11: Please refer to Figure 3 The circuitry is fabricated on the double-sided copper clad laminate (not shown in the figure), forming an inner circuit layer 12 on the two opposite surfaces of the dielectric layer 11.
[0040] Step S12: Please refer to Figure 4 A single-sided copper-clad laminate (not shown) is covered on the surface of the inner circuit layer 12, and circuits are fabricated on the single-sided copper-clad laminate to obtain the substrate intermediate 18.
[0041] Each single-sided copper clad laminate includes a dielectric layer 11 and a copper layer (not shown). The copper layer of one single-sided copper clad laminate is fabricated to form an outer circuit layer 13. A portion of the copper layer of another single-sided copper clad laminate is fabricated to form an outer circuit layer 13, while the other portion is not etched and serves as a large-area heat-conducting layer 14.
[0042] Step S13: Please refer to Figure 5 A first through hole 15 and a second through hole 16 are formed on the substrate intermediate 18.
[0043] Each first through hole 15 and each second through hole 16 penetrates the two opposite surfaces of the substrate intermediate body 18 along the first direction L1. The first through hole 15 penetrates the thermal conductive layer 14, the dielectric layer 11, the inner circuit layer 12 and the outer circuit layer 13, and the second through hole 16 penetrates the outer circuit layer 13, the dielectric layer 11 and the inner circuit layer 12.
[0044] Step S14: Please refer to Figure 6 A conductive layer 162 is formed in the second through hole 16 to obtain the circuit board 10.
[0045] The conductive layer 162 can be formed by electroplating. The conductive layer 162 is used to electrically connect the circuit layers located in different layers (i.e., the inner circuit layer 12 and the outer circuit layer 13). In other embodiments, the circuit layers located in different layers can also be electrically connected by other conductive methods, such as forming a via between two adjacent circuit layers. In this case, the step of forming the conductive layer 162 in the second via 16 can also be omitted.
[0046] In the step of forming the conductive layer 162, a thermally conductive layer 14 may be further formed on the end face of the substrate intermediate 18. The thermally conductive layer 14 is equivalent to having two parts: a first thermally conductive part 142 and a second thermally conductive part 144. The first thermally conductive part 142 and the second thermally conductive part 144 are generally L-shaped together.
[0047] The circuit board 10 includes a dielectric layer 11, an inner circuit layer 12, and an outer circuit layer 13. The number of inner circuit layers 12 and dielectric layers 11 can be set as needed.
[0048] The circuit board 10 may further include a thermally conductive layer 14, which is located on the surface of the dielectric layer 11 and is the outermost layer of the circuit board 10. The thermally conductive layer 14 includes a first thermally conductive portion 142 and a second thermally conductive portion 144. The first thermally conductive portion 142 and one of the outer circuit layers 13 are located on opposite surfaces of the circuit board 10, and the second thermally conductive portion 144 is located on an end face of the circuit board 10. In some embodiments, the thermally conductive layer 14 may be omitted.
[0049] The circuit board 10 has a first through hole 15, which penetrates the first heat-conducting part 142 of the heat-conducting layer 14, the dielectric layer 11, the inner circuit layer 12, and the outer circuit layer 13. The circuit board 10 also includes a sidewall 152, which surrounds the first through hole 15, and the inner circuit layer 12 and the outer circuit layer 13 can be exposed through the first through hole 15.
[0050] Step S2: Please refer to Figure 7 The guide tube 20 is fitted onto the fixture 30 and placed in the first through hole 15, with a gap between the guide tube 20 and the side wall 152.
[0051] The fixture 30 includes a carrier plate 31 and a support post 32, with the support post 32 fixed to the carrier plate 31. A conductive tube 20 is fitted onto the support post 32. The conductive tube 20 and the support post 32 are placed together in the first through hole 15, with the carrier plate 31 located on the side of the outer circuit layer 13 opposite to the first heat-conducting part 142. The carrier plate 31 serves to support the support post 32 and the conductive tube 20, while the support post 32 supports the conductive tube 20, creating a gap between the conductive tube 20 and the side wall 152.
[0052] The conductive tube 20 is made of metal. The interior of the conductive tube 20 is hollow. The conductive tube 20 may include a first part 21 and a second part 22. The first part 21 is fixed to the second part 22. The cross-section of the second part 22 and the first part 21 along one direction is approximately "T" shaped. The first part 21 is located in the first through hole 15. The second part 22 is connected to the carrier board 31 and the outer circuit layer 13.
[0053] The first part 21 has a slot 212, which is formed on the inner wall of the first part 21, that is, the slot is formed on the surface where the first part 21 and the support column 32 are connected. The second part 22 has a receiving groove 222, which is formed by the recess of the surface of the second part 22 away from the first part 21.
[0054] Step S3: Please refer to Figure 8 Insulating adhesive 40 is filled between the conductive tube 20 and the side wall 152.
[0055] The insulating adhesive 40 can be made of epoxy resin. The insulating adhesive 40 connects to the first part 21 and the sidewall 152, and one end of the insulating adhesive 40 connects to the second part 22. The insulating adhesive 40 also connects to the inner circuit layer 12 and the outer circuit layer 13 exposed in the first through-hole 15. The insulating adhesive 40 serves as insulation, reducing the electrical connection between the conductive tube 20 and the inner circuit layer 12 and the outer circuit layer 13.
[0056] In some embodiments, the card slot 212 can penetrate the conductive tube 20 along the second direction L2. To prevent the insulating adhesive 40 from being poured into the conductive tube 20, the card slot 212 can be sealed in advance.
[0057] Step S4: Please refer to Figure 9 Remove the fixture 30 and perform solder resist treatment on the surface of the outer circuit layer 13.
[0058] After the fixture 30 is removed, the inner wall of the conductive tube 20 and the slot 212 are exposed. In the solder resist treatment step, a solder resist layer 17 is formed on the surface of the outer circuit layer 13.
[0059] Step S5: Please refer to Figure 10 Insert pin 52 of electronic component 50 into conductive tube 20.
[0060] The electronic component 50 may also include a body portion 51, with pins 52 disposed on the surface of the body portion 51 and extending to one side. The pins 52 are inserted from the side of the first portion 21 away from the second portion 22 and protrude from the second portion 22. That is, the pins 52 are inserted into the conductive tube 20 from the side where the first heat-conducting portion 142 is located. After the pins 52 are inserted into the conductive tube 20, the ends of the pins 52 protrude from the outer circuit layer 13, and the body portion 51 is located on the side where the first heat-conducting portion 142 is located.
[0061] In some embodiments, a thermally conductive adhesive 42 may be disposed between the body portion 51 and the first thermally conductive portion 142. The thermally conductive adhesive 42 has properties such as high thermal conductivity, insulation, and flexibility. The material of the thermally conductive adhesive 42 may be a thermally conductive PI film. The thermally conductive adhesive 42 can play a role in rapid heat conduction, transferring the heat generated by the electronic component 50 sequentially through the thermally conductive adhesive 42 and the first thermally conductive portion 142, and can also achieve rapid heat dissipation through the second thermally conductive portion 144. The thermally conductive adhesive 42 is located between the body portion 51 and the first thermally conductive portion 142, and the thermally conductive adhesive 42 can also play a buffering role, reducing damage to the electronic component 50 when it is subjected to impact, and improving the overall stability of the circuit board assembly 100.
[0062] Pin 52 includes a protrusion 522, which slides along the end of the first part 21 away from the second part 22 into the slot 212 and abuts against the conductive tube 20. The protrusion 522 and the conductive tube 20 can temporarily fix the pin, which helps to improve the problem of pin 52 shaking in the conductive tube 20 during subsequent soldering, thereby improving the soldering stability of the circuit board assembly 100. In this embodiment, the protrusion 522 is located in the slot 212.
[0063] Step S6: Please refer to Figure 11 The conductive tube 20, pin 52 and circuit board 10 are welded together to obtain circuit board assembly 100.
[0064] Conductive paste 60 is applied to the area where pin 52 protrudes from the outer circuit layer 13 and then reflow soldering is performed. The conductive paste 60 connects the second part 22 of the conductive tube 20, pin 52, and the outer circuit layer 13. The conductive paste 60 also fills the receiving groove 222 of the second part 22, which increases the connection area between the conductive paste 60 and the second part 22, increases the soldering volume of the conductive paste 60, and improves soldering reliability. Insulating adhesive 40 is filled between the conductive tube 20 and the sidewall 152, reducing heat dissipation during soldering and further increasing the proportion of conductive paste 60 covering the soldering area, thereby improving soldering strength.
[0065] After the conductive paste 60 is used to solder the conductive tube 20, the pin 52 and the circuit board 10, the end of the pin 52 protrudes from the conductive paste 60. During the soldering process, it is helpful for the user to know the soldering volume of the conductive paste 60, which helps to improve the soldering reliability.
[0066] Please see Figure 12 In this embodiment, the cross-section of the protrusion 522 along one direction is arc-shaped. When the cross-section of the protrusion 522 is arc-shaped, the contact area between the protrusion 522 and the inner wall of the conductive tube 20 is small during the process of placing the pin 52 in the conductive tube 20, which can reduce the resistance during the sliding process.
[0067] The width of the slot 212 along the first direction L1 is defined as W1, the width of the protrusion 522 along the first direction L1 is defined as W2, the width of the protrusion 522 along the second direction L2 is defined as W3, the second direction L2 is perpendicular to the first direction L1, and the first inner diameter of the conductive tube 20 is defined as D1. This satisfies the following conditions: W2 > W1, D1 > W3, so that the pin 52 can pass through the conductive tube 20 and the protrusion 522 can slide along the slot 212.
[0068] Please see Figure 13 In some other embodiments, a groove 214 may be provided on the first part 21. The groove 214 extends from one end of the first part 21 away from the second part 22 to the middle area of the first part 21. The protrusion 522 slides into the interior of the conductive tube 20 along one end of the groove 214 to fix the conductive tube 20 and the pin 52 to each other.
[0069] The first inner diameter of the area of the conductive tube 20 without the groove 214 along the second direction L2 is D1, and the second inner diameter of the area of the conductive tube 20 with the groove 214 along the second direction L2 is D2. The width of the pin 52 along the third direction L3 is W4, and the width of the groove 214 along the third direction L3 is W5. The third direction L3 is perpendicular to the first direction L1 and the second direction L2, which satisfies: D2>W3>D1, W5>W4, D1>W4, so that the pin 52 can pass through the conductive tube 20 and the protrusion 522 can slide along the groove 214.
[0070] Please see Figure 14 In some other embodiments, the first part 21 may simultaneously have a slot 212 and a slide groove 214, the slot 212 and the slide groove 214 being connected, with the slot 212 located at the end of the slide groove 214. The protrusion 522 can slide along one end of the slide groove 214 into the slot 212.
[0071] Please see Figure 15 In other embodiments, the cross-section of the protrusion 522 along one direction can be trapezoidal. The protrusion 522 and the slot 212 and / or the slide groove 214 cooperate with each other to achieve a fixing function.
[0072] The method for manufacturing the circuit board assembly 100 provided in this application embodiment involves designing a protrusion 522 on the pin 52 and setting a slot 212 and / or a sliding groove 214 in the conductive tube 20 that cooperates with the protrusion 522. Before the soldering step, the conductive tube 20 and the pin 52 are fixed to each other, which helps to improve the problem of the pin 52 shaking in the conductive tube 20 during the soldering process and can improve the soldering yield. Moreover, no additional fixing equipment is required for fixing, resulting in high soldering efficiency and low cost.
[0073] This application provides a circuit board assembly 100, which may include a circuit board 10, a conductive tube 20, an insulating adhesive 40, an electronic component 50, and a conductive paste 60. The conductive tube 20 passes through the circuit board 10, the insulating adhesive 40 is located between the conductive tube 20 and the circuit board 10, the pins 52 of the electronic component 50 pass through the conductive tube 20, and the conductive paste 60 connects the circuit board 10, the conductive tube 20, and the pins 52.
[0074] The circuit board 10 may include a dielectric layer 11, an inner circuit layer 12, and an outer circuit layer 13. The dielectric layer 11 and the circuit layers (including the inner circuit layer 12 and the outer circuit layer 13) are stacked. The inner circuit layer 12 is located inside the circuit board 10, and the outer circuit layer 13 is located outside the circuit board 10.
[0075] The circuit board 10 may also have a first through hole 15 and a sidewall 152, the first through hole 15 penetrating the circuit board 10, and the sidewall 152 surrounding the first through hole 15. The inner circuit layer 12 and the outer circuit layer 13 may be exposed through the first through hole 15.
[0076] The circuit board 10 may also include a thermally conductive layer 14, which is located on the outer surface of the circuit board 10. The thermally conductive layer 14 may include a first thermally conductive part 142 and a second thermally conductive part 144. The first thermally conductive part 142 and one of the outer circuit layers 13 are located on opposite surfaces of the circuit board 10, and the second thermally conductive part 144 is located on the end face of the circuit board 10.
[0077] The conductive tube 20 may include a first part 21 and a second part 22. The first part 21 is fixed to the second part 22. The cross-section of the second part 22 and the first part 21 along one direction is approximately "T" shaped. The first part 21 is located in the first through hole 15, and the second part 22 is connected to the outer circuit layer 13.
[0078] Insulating adhesive 40 is located between the first part 21 and the sidewall 152, with one end of the insulating adhesive 40 connected to the second part 22. The insulating adhesive 40 is also connected to the inner circuit layer 12 and the outer circuit layer 13 exposed in the first through hole 15.
[0079] Electronic component 50 may further include a body portion 51, with pins 52 disposed on the surface of the body portion 51. The body portion 51 is located on one side of the circuit board 10, and the pins 52 pass through the conductive tube 20. The end of the pins 52 facing away from the body portion 51 protrudes from the outer circuit layer 13. Conductive paste 60 is located at the end of the pins 52 facing away from the body portion 51, and the conductive paste 60 connects the second part 22 of the conductive tube 20, the pins 52, and the outer circuit layer 13.
[0080] A receiving groove 222 may be provided on the second part 22. The receiving groove 222 is formed by a recess in the surface of the second part 22 away from the first part 21. Conductive paste 60 is filled into the receiving groove 222.
[0081] The first part 21 has a slot 212, which is located on the inner wall of the first part 21. The pin 52 includes a protrusion 522, which is located in the slot 212.
[0082] In some other embodiments, a groove 214 may be provided on the first part 21, and the protrusion 522 slides through the groove 214 to the inside of the guide tube 20 and abuts against the guide tube 20.
[0083] In some other embodiments, the first part 21 may simultaneously have a slot 212 and a slide groove 214, the slot 212 and the slide groove 214 being connected, with the slot 212 located at the end of the slide groove 214. The protrusion 522 can slide along one end of the slide groove 214 into the slot 212.
[0084] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.
Claims
1. A method for manufacturing a circuit board assembly, characterized in that, include: A circuit board is provided, the circuit board including an outer circuit layer, sidewalls and a first through-hole, the outer circuit layer being exposed to the first through-hole, and the sidewalls surrounding the first through-hole; The guide tube is fitted onto the fixture and placed in the first through hole, with a gap between the guide tube and the side wall; Insulating adhesive is filled between the conductive tube and the sidewall; Remove the fixture; Insert the pins of the electronic component into the conductive tube, the pins including protrusions; and Solder the conductive tube, the pin, and the circuit board, and connect the conductive tube, the pin, and the outer circuit layer with conductive paste; The inner wall of the conductive tube is provided with a slot, and the protrusion is located in the slot; and / or The guide tube has a groove, which is used for the protrusion to slide along the groove into the interior of the guide tube.
2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, The circuit board also includes a thermally conductive layer, and the electronic component also includes a body portion, with the pins connected to the body portion; Prior to the step of inserting the pin into the conductive tube, the manufacturing method further includes: applying thermally conductive adhesive to the surface of the thermally conductive layer; After inserting the pin into the conductive tube, the thermally conductive adhesive connects the thermally conductive layer and the body.
3. The method for manufacturing a circuit board assembly according to claim 2, characterized in that, The circuit board further includes a second through-hole and a conductive layer. The second through-hole penetrates the circuit board, and the conductive layer is located in the second through-hole and connected to the outer circuit layer.
4. The method for manufacturing a circuit board assembly according to any one of claims 1-3, characterized in that, The conductive tube includes a first part and a second part. The first part is located in the first through hole, and the slot is formed on the first part. The second part is connected to the outer circuit layer. A receiving groove is formed on the second part, and the conductive paste is also received in the receiving groove.
5. The method for manufacturing a circuit board assembly according to claim 4, characterized in that, The fixture includes a carrier plate and a support column, with the support column fixed to the carrier plate; in the step of fitting the conductive tube onto the fixture and placing it in the first through hole: the first part is fitted onto the support column, and the carrier plate is located on the side of the outer circuit layer away from the heat-conducting layer.
6. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, The inner wall of the conductive tube is provided with the slot and the slide groove, and the slot and the slide groove are connected. In the step of inserting the pin into the conductive tube, the protrusion slides along the slide groove into the slot.
7. A circuit board assembly, characterized in that, include: A circuit board includes an outer circuit layer, a first through-hole, and a sidewall, wherein the outer circuit layer is exposed to the first through-hole, and the sidewall surrounds the first through-hole; A guide tube is located in the first through hole and has a gap between it and the side wall; Insulating adhesive is filled between the conductive tube and the sidewall; An electronic component includes pins, the pins including protrusions, the pins passing through the conductive tube; as well as Conductive paste is used to connect the outer circuit layer, the conductive tube, and the pin. The conductive tube has a slot, and the protrusion is located in the slot; and / or The guide tube has a groove, which is used for the protrusion to slide along the groove into the interior of the guide tube.
8. The circuit board assembly according to claim 7, characterized in that, The circuit board assembly further includes thermally conductive adhesive; the circuit board further includes a thermally conductive layer; the electronic component further includes a body portion, the pins are connected to the body portion; the thermally conductive adhesive connects the thermally conductive layer and the body portion.
9. The circuit board assembly according to claim 8, characterized in that, The thermally conductive layer includes a first thermally conductive part and a second thermally conductive part. The thermally conductive adhesive connects the main body part and the first thermally conductive part, and the second thermally conductive part is located on the end face of the circuit board.
10. The circuit board assembly according to any one of claims 7-9, characterized in that, The conductive tube includes a first part and a second part. The first part is located in the first through hole, and the slot is formed on the first part. The second part is connected to the outer circuit layer. A receiving groove is formed on the second part, and the conductive paste is also received in the receiving groove.