Wide-temperature high-precision optical acceleration sensitive chip and acceleration sensor based on microcavity interferometer principle
The optical acceleration sensing chip based on the microcavity interferometer principle, using a three-wafer double-sprayed ultra-flat silicon wafer silicon-silicon bonding process and FP optical interferometer cavity structure, solves the accuracy and reliability problems of fiber optic accelerometers over a wide temperature range, achieving high-precision and shock-resistant acceleration measurement, suitable for inertial navigation and vibration measurement.
Patent Information
- Application Number
- CN202510467676.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2026-05-26
AI Technical Summary
Existing fiber optic accelerometers lack accuracy over a wide temperature range, suffer from significant temperature cross-effects, and exhibit poor measurement repeatability and consistency, making industrial mass production impossible. Furthermore, optical accelerometers lack long-term reliability and tolerance at high temperatures.
The optical acceleration sensing chip, which adopts the principle of microcavity interferometer, uses three double-polished ultra-flat silicon wafers connected by silicon-silicon bonding to form an FP optical interferometer cavity. It uses a single-mode fiber optic assembly and a precision-ground cavity mirror structure, combined with laser interferometric signal demodulation, to achieve high-precision acceleration measurement. Furthermore, it suppresses nonlinear phenomena and improves stability by adjusting the depth of the upper and lower gaps and the optical anti-reflection coating.
It achieves high-precision acceleration measurement over a wide temperature range of -50℃ to 500℃, with a linear accuracy of 0.01% and a high resolution of 0.05%, reducing production costs, improving the sensor's shock resistance and consistency, and ensuring long-term reliability.