Efficient heat dissipation router for network communication
By coordinating the design of the base and motherboard components and employing structures such as fans and heat sinks, the problem of poor router heat dissipation has been solved, achieving efficient heat dissipation and a stable structure, extending the device's lifespan and improving network coverage.
Patent Information
- Application Number
- CN202610141547.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-05-26
AI Technical Summary
Traditional routers have poor heat dissipation, which leads to increased device temperature, affecting operating speed and stability, increasing the probability of failure, and may even damage components.
It adopts a collaborative design of base assembly, shell assembly and motherboard assembly, including counterweight, fan, heat sink fins, VC heat conduction plate and other structures. The fan guides airflow for efficient heat dissipation, and the thermally conductive silicone and copper powder sintering structure are used to quickly conduct heat.
It achieves efficient heat dissipation for the router, maintains a stable temperature environment, reduces performance degradation and component damage, extends service life, and provides a robust structure and multi-frequency network coverage.
Smart Images

Figure CN122093313A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of communication equipment technology, and in particular to a high-efficiency heat dissipation router for network communication. Background Technology
[0002] During daily use of a router, the internal electronic components inevitably generate heat. If this heat cannot be dissipated in time, the device temperature will rise. High temperatures will slow down the operation of electronic components, causing data transmission delays, packet loss, and other problems. In severe cases, it may even damage components, causing the router to malfunction. In addition, prolonged exposure to high temperatures will accelerate the aging of the router's internal circuitry and increase the probability of failure. Therefore, in order to ensure the stable operation of the router and extend its lifespan, efficient heat dissipation is necessary.
[0003] For example, CN202311452194.4 proposes a heat dissipation placement mechanism and a smart router device. The aforementioned heat dissipation placement mechanism is used to support and connect to the router body. The mechanism includes a support and fixing component, a cooling fan, and a heat dissipation mounting plate assembly. The support and fixing component includes a rotating ring and multiple suction cups, which are spaced apart and installed at one end of the rotating ring. The heat dissipation mounting plate assembly includes a thermally conductive connecting plate, a heat dissipation fin assembly, a first fixing post, a second fixing post, and a mounting ring. Multiple heat dissipation fins are spaced apart on the thermally conductive connecting plate, and the first and second fixing posts are located on opposite sides of the heat dissipation fin assembly. Since the cooling fan is located within the rotating mounting slot and connected to the mounting ring, and the fan faces the heat dissipation fin assembly, it can effectively dissipate heat from the fins. Furthermore, the router body and the placement position have a predetermined height, allowing air to pass well through the heat dissipation fin assembly, thus improving the heat dissipation performance of the heat dissipation placement mechanism. However, this does not solve the aforementioned problem.
[0004] This invention achieves efficient heat dissipation through the coordinated operation of the base assembly, housing assembly, and motherboard assembly, ensuring that the router operates in a stable temperature environment, reducing performance degradation and component damage caused by high temperatures, and extending the router's service life. Summary of the Invention
[0005] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a high-efficiency heat dissipation router for network communication, solving the problem of poor heat dissipation performance in traditional routers.
[0006] Technical solution To achieve the above objectives, the present invention is implemented through the following technical solution: a high-efficiency heat dissipation router for network communication, comprising a base assembly, a housing assembly and a motherboard assembly, wherein the base assembly is placed on the site of use, the housing assembly is installed on top of the base assembly, and the motherboard assembly is fixed on the base assembly.
[0007] Furthermore, the base assembly includes a counterweight and an anti-slip pad. The counterweight is made of metal and has a square mounting slot in the center. A fan is mounted through the square mounting slot. The upper edge of the square mounting slot has a notch. A first heat dissipation fin is provided below the counterweight. A connecting post is provided on the counterweight and is connected to the upper housing assembly through the connecting post. The guide cone is pyramidal in shape.
[0008] Furthermore, the bottom of the square mounting slot is provided with a guide cone, and there is a certain gap between the guide cone and the fan. Ventilation openings are provided around the bottom of the square mounting slot.
[0009] Furthermore, the housing assembly includes an outer shell, a cover plate, a dustproof plate, a mounting rod, a connecting rod, a sleeve rod, and a first antenna assembly. The outer shell is mounted on the base assembly. The outer shell has concentrated covers on both sides, and an air inlet is opened on the top of the outer shell. The cover plate is mounted on the top of the outer shell. The mounting rod is rotatably mounted on the side of the outer shell. The connecting rod is rotatably mounted on the mounting rod. The sleeve rod is mounted on the connecting rod. The first antenna assembly is housed inside the connecting rod. The first antenna assembly includes at least two different frequencies. The mounting rod has multiple slots at different angles. The connecting rod has protrusions. A diffuser and an LED assembly are located on the inner side of the outer shell. The LED assembly is located behind the diffuser and is connected to the main board assembly via wires to control the light display.
[0010] Furthermore, the central hood is funnel-shaped, with one end larger than the other. One end of the central hood is provided with a dustproof plate, and the other end of the central hood is provided with a diversion plate.
[0011] Furthermore, the dustproof plate is made of metal material, and the dustproof plate is provided with ventilation dustproof holes. The inner side of the outer shell is provided with a permanent magnet for adsorbing and fixing the dustproof plate. The inner side of the dustproof plate is provided with annular protrusions that fit the concentrator cover.
[0012] Furthermore, the diverter plate is a streamlined shape with one end larger than the other, which can reduce wind resistance and divide the airflow into upper and lower layers.
[0013] Furthermore, the motherboard assembly includes a circuit board and a support spring. The circuit board is slidably mounted on the counterweight via a connecting post. The support spring is located between the circuit board and the outer casing. The upper and lower ends of the support spring are provided with pads. The outer casing is provided with mounting slots corresponding to the support spring. The circuit board is provided with a second antenna assembly. A VC heat-conducting plate is provided below the circuit board. Thermally conductive silicone is provided between the circuit board and the VC heat-conducting plate for heat conduction. A second heat dissipation fin is provided below the VC heat-conducting plate. The second heat dissipation fin is slidably mounted on the counterweight via a connecting post. A notch is provided in the middle of the second heat dissipation fin. Multiple interfaces are provided at the rear end of the circuit board. A groove is provided at the rear end of the outer casing, and a through hole is provided in the groove.
[0014] Furthermore, the second antenna assembly is a "spring" antenna, with different pitches on the top and bottom, and the housing has mounting slots corresponding to the second antenna assembly.
[0015] Furthermore, the outer side of the VC heat-conducting plate is a copper plate made of oxygen-free copper, and the inner side of the copper plate is a flow-guiding layer. The flow-guiding layer is a dense porous structure formed by sintering copper powder. The inner side of the copper plate has a cavity, and the cavity contains a liquid working fluid. The VC heat-conducting plate can quickly conduct and spread heat.
[0016] Beneficial effects The present invention has the following beneficial effects: (1) High-efficiency heat dissipation: This router uses a combination of heat dissipation structures, such as the fan and first heat dissipation fins of the base assembly, and the VC heat conduction plate and second heat dissipation fins of the motherboard assembly, to quickly dissipate the heat generated by the router. The airflow generated by the fan is guided by the guide cone and blown to the heat dissipation fins through the vents, accelerating the dissipation of heat. The VC heat conduction plate can quickly conduct and spread the heat generated by the circuit board onto the second heat dissipation fins, further improving the heat dissipation efficiency. This effectively solves the problem of poor heat dissipation of traditional routers, ensures that the router operates in a stable temperature environment, reduces data transmission delay and packet loss caused by high temperature, reduces the probability of component damage and line aging, and extends the service life of the router.
[0017] (2) Stable structure: The counterweight of the base component is made of metal, which increases the overall weight of the router and makes it more stable. The anti-slip pad further enhances the friction between the router and the site of use, preventing the router from sliding or tipping over. At the same time, the components are connected and fixed by connecting columns, ensuring the stability of the overall structure of the router. Shock absorption and protection are provided by the support spring and the second antenna component.
[0018] (3) Comprehensive frequency coverage: The first antenna assembly includes at least two different frequencies, which can meet the network frequency requirements of different devices, providing wider network coverage and more stable signal transmission. The second antenna assembly is a "spring" antenna with different pitches, which further optimizes the signal reception and transmission capabilities. In addition, the LED assembly inside the casing is connected to the motherboard assembly through wires, which can control the light display and make it convenient for users to intuitively understand the working status of the router.
[0019] (4) Dustproof design: The dustproof plate at one end of the central cover is made of metal material and has ventilation dustproof holes, which can effectively block dust from entering the router and prevent dust accumulation from affecting the normal operation of electronic components. The permanent magnet makes it easy to install and remove the dustproof plate, and makes it easy for users to clean and maintain the dustproof plate.
[0020] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is an exploded view of the present invention; Figure 4 This is an exploded view of the outer shell and cover structure of the housing assembly of the present invention; Figure 5 This is a schematic diagram of the outer shell of the housing assembly of the present invention; Figure 6 This is an exploded view of the diffuser and LED assembly of the housing assembly of the present invention; Figure 7 This is an exploded view of the mounting rod and connecting rod of the housing assembly of the present invention; Figure 8 This is a schematic diagram of the structure of the dustproof plate of the housing assembly of the present invention; Figure 9 This is a schematic diagram of the overall structure of the motherboard assembly of the present invention; Figure 10 This is a cross-sectional view of the VC heat-conducting plate of the present invention; Figure 11 This is a cross-sectional view of the second heat dissipation fin of the present invention; Figure 12 This is an exploded view of the counterweight and anti-slip pad of the base assembly of the present invention; Figure 13 This is a schematic diagram of the structure of the counterweight block of the base assembly of the present invention; Figure 14This is a cross-sectional view of the counterweight block of the base assembly of the present invention; Figure 15 This is a schematic diagram of the heat dissipation principle of the present invention.
[0022] Reference numerals: Base assembly 1; Counterweight 101; Connecting column 102; Anti-slip pad 103; First heat dissipation fin 104; Vent 105; Guide cone 106; Housing assembly 2; Outer shell 201; Air inlet 202; Cover plate 203; Concentrated cover 204; Diverter plate 205; Permanent magnet 206; Dustproof plate 207; Soft light plate 208; LED assembly 209; Mounting rod 210; Connecting rod 211; Sleeve rod 212; First antenna assembly 213; Limiting block 214; Slot 215; Protrusion 216; Main board assembly 3; Circuit board 301; Second antenna assembly 302; Support spring 303; VC heat-conducting plate 4; Copper plate 401; Guide layer 402; Cavity 403; Thermally conductive silicone 5; Second heat dissipation fin 6; Fan 7. Detailed Implementation
[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0024] Please see Figure 1 - Figure 15 The present invention provides a technical solution: a high-efficiency heat dissipation router for network communication includes a base assembly 1, a housing assembly 2 and a motherboard assembly 3. The base assembly 1 is placed on the site of use, the housing assembly 2 is installed on top of the base assembly 1, and the motherboard assembly 3 is fixed on the base assembly 1.
[0025] like Figure 3 , Figure 12 , Figure 13 , Figure 14 and Figure 15As shown, the high-efficiency heat dissipation router for network communication includes a base assembly 1. The base assembly 1 includes a counterweight 101 and an anti-slip pad 103. The counterweight 101 is made of metal and has a square mounting slot in the center. A fan 7 is mounted through the square mounting slot. The upper edge of the square mounting slot has a notch to facilitate the installation and removal of the fan 7. A guide cone 106 is provided at the bottom of the square mounting slot. A certain gap is provided between the guide cone 106 and the fan 7. Ventilation openings 105 are provided around the bottom of the square mounting slot. A first heat dissipation fin 104 is provided below the counterweight 101 and is located at the ventilation opening 105. A connecting post 102 is provided on the counterweight 101 and is connected to the upper housing assembly 2 through the connecting post 102. The guide cone 106 is pyramidal in shape.
[0026] In a specific embodiment: during use, the fan 7 is started by an external power supply, thereby expelling the air between the base assembly 1 and the housing assembly 2 through the vent 105, thereby cooling the router.
[0027] During the process, the airflow is guided by the pyramidal guide cone 106, so that the airflow can be better discharged from the vent 105.
[0028] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, the high-efficiency heat dissipation router for network communication includes a housing assembly 2, which includes an outer shell 201, a cover plate 203, a dustproof plate 207, a mounting rod 210, a connecting rod 211, a sleeve rod 212, and a first antenna assembly 213. The outer shell 201 is mounted on a base assembly 1. Concentrated covers 204 are provided on both sides of the outer shell 201. An air inlet 202 is opened on the top of the outer shell 201. The cover plate 203 is installed on top of the outer shell 201, above the air inlet 202, to prevent dust from falling. The air inlet 202 is provided with a central shroud 204, which is funnel-shaped with one end larger than the other to increase airflow velocity. One end of the central shroud 204 has a dustproof plate 207, and the other end has a diverter plate 205. The dustproof plate 207 is made of metal and has ventilation holes to prevent dust from entering the router while allowing ventilation. A permanent magnet 206 is located inside the outer casing 201 to attract and fix the dustproof plate 207, facilitating its movement. 7. Disassembly and cleaning: The inner side of the dustproof plate 207 is provided with an annular protrusion that fits into the concentrator hood 204 for positioning and limiting, ensuring that the dustproof plate 207 is installed at one end of the concentrator hood 204. The diverter plate 205 is streamlined with one end larger than the other, which can reduce wind resistance and divide the airflow into upper and lower layers. The mounting rod 210 is rotatably mounted on the side of the outer shell 201. The connecting rod 211 is rotatably mounted on the mounting rod 210. The sleeve rod 212 is mounted on the connecting rod 211. The connecting rod 212... The 11 is equipped with a first antenna assembly 213, which includes at least two different frequencies to meet usage requirements. The mounting rod 210 is provided with multiple slots 215 at different angles. The connecting rod 211 is provided with protrusions 216. The inner side of the housing 201 is provided with a diffuser 208 and an LED assembly 209. The LED assembly 209 is located behind the diffuser 208. The LED assembly 209 is connected to the main board assembly 3 through wires to control the light display.
[0029] In a specific embodiment: such as Figure 15 As shown in the figure, the arrows indicate the airflow path. The fan 7 pushes the airflow to create a negative pressure inside the housing assembly 2, thereby drawing in cold air from the outside through the air intake and the central cover 204. The cold air is then diverted by the diverter plate 205 to increase the area covered by the airflow, thereby providing large-area heat dissipation for the motherboard assembly 3.
[0030] When the central cover 204 draws in cold air from the outside, the dust is isolated by the dustproof plate 207 to prevent dust from entering the router.
[0031] In use, the angle of the first antenna assembly 213 can be adjusted by inserting the protrusion 216 on the connecting rod 211 into the slot 215 on the mounting rod 210.
[0032] When in use, the working status of the router is displayed by the light of the LED component 209, and the light is made soft and not dazzling by the diffuser 208.
[0033] like Figure 3 , Figure 9 , Figure 10 and Figure 11 As shown, the high-efficiency heat dissipation router for network communication includes a motherboard assembly 3, which includes a circuit board 301 and a support spring 303. The circuit board 301 is slidably mounted on the counterweight 101 via a connecting post 102. The support spring 303 is located between the circuit board 301 and the outer casing 201. The support spring 303 has gaskets at its upper and lower ends for isolation, preventing contact friction, and providing insulation. The outer casing 201 has mounting slots corresponding to the support spring 303. The circuit board 301 has a second antenna assembly 302, which is a "spring" antenna with different pitches at the top and bottom. The outer casing 201 has mounting slots corresponding to the second antenna assembly 302. A VC heat-conducting plate 4 is located below the circuit board 301. The circuit board 301 and the VC heat-conducting plate 4... Thermally conductive silicone 5 is provided between the C heat-conducting plates 4 for heat conduction. A second heat dissipation fin 6 is provided below the VC heat-conducting plate 4. The second heat dissipation fin 6 is slidably mounted on the counterweight block 101 through the connecting post 102. The second heat dissipation fin 6 has a notch in the middle to avoid the fan 7. The rear end of the circuit board 301 has multiple interfaces. The rear end of the outer shell 201 has a groove with through holes to avoid the interfaces on the circuit board 301. The outer side of the VC heat-conducting plate 4 is a copper plate 401 made of oxygen-free copper. The inner side of the copper plate 401 is a flow guiding layer 402. The flow guiding layer 402 is a dense porous structure formed by sintering copper powder. The inner side of the copper plate 401 has a cavity 403 containing a liquid working fluid (usually pure water). The VC heat-conducting plate 4 can quickly conduct and spread heat.
[0034] In a specific embodiment: the upper end of the second antenna assembly 302 has a small pitch, a large number of coil turns, a large inductance, and a long equivalent electrical length (suitable for low-frequency loading), while the lower end of the second antenna assembly 302 has a large pitch, a small inductance, and a wider bandwidth (suitable for high frequencies), thus adapting to different frequency requirements.
[0035] After the outer casing 201 is installed on the counterweight 101, the support spring 303 and the second antenna assembly 302 will be compressed by the outer casing 201, thereby pressing and limiting the circuit board 301 to a certain extent, allowing the circuit board 301 to slide on the connecting post 102, so that the circuit board 301 is tightly attached to the thermally conductive silicone 5, ensuring the efficiency of heat conduction; at the same time, due to the non-fixed connection (sliding connection) of the circuit board 301, when the router is subjected to vibration, the support spring 303 and the second antenna assembly 302 can absorb the shock (spring shock absorption principle), thereby protecting the circuit board 301. Meanwhile, the through hole at the rear end of the outer casing 201 can avoid the interface on the circuit board 301, ensuring that the circuit board 301 has enough space for shock absorption.
[0036] In use, the circuit board 301 connects to the power supply and network via the rear interface, and communicates with the first antenna assembly 213 and the second antenna assembly 302 to achieve network communication. However, the circuit board 301 generates heat during operation. This heat is conducted through the thermally conductive silicone 5, and then rapidly transferred to the second heat dissipation fins 6 via the VC heat-conducting plate 4. Figure 15 As shown, the airflow, driven by the fan 7, passes through the second heat sink 6, thereby dissipating heat from the second heat sink 6 and thus efficiently dissipating heat from the circuit board 301.
[0037] Working principle: During use, the fan 7 is started by an external power supply, creating a negative pressure inside the housing assembly 2. This draws in cool air from the outside through the air intake vents and the concentrator shroud 204. The air is then distributed by the diffuser 205, increasing the airflow coverage area and thus providing large-area heat dissipation for the motherboard assembly 3. The heat from the circuit board 301 is then rapidly transferred to the second heat sink 6 via the VC heat conduction plate 4. Driven by the fan 7, the airflow passes over the second heat sink 6, further dissipating heat and efficiently cooling the circuit board 301.
[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0039] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims
1. A high-efficiency heat dissipation router for network communication, comprising a base assembly (1), a housing assembly (2), and a motherboard assembly (3), characterized in that, The base assembly (1) is placed on the site of use, the housing assembly (2) is installed on top of the base assembly (1), and the motherboard assembly (3) is fixed on the base assembly (1).
2. The high-efficiency heat dissipation router for network communication as described in claim 1, characterized in that, The base assembly (1) includes a counterweight (101) and an anti-slip pad (103). The counterweight (101) is made of metal. A square mounting slot is provided in the middle of the counterweight (101), and a fan (7) is installed through the square mounting slot. A notch is provided on the upper edge of the square mounting slot. A first heat dissipation fin (104) is provided below the counterweight (101). A connecting post (102) is provided on the counterweight (101), and the upper housing assembly (2) is connected through the connecting post (102). The guide cone (106) is pyramidal.
3. The high-efficiency heat dissipation router for network communication as described in claim 2, characterized in that, The bottom of the square mounting slot is provided with a guide cone (106), and there is a certain gap between the guide cone (106) and the fan (7). Ventilation openings (105) are provided around the bottom of the square mounting slot.
4. The high-efficiency heat dissipation router for network communication as described in claim 1, characterized in that, The housing assembly (2) includes a housing (201), a cover plate (203), a dustproof plate (207), a mounting rod (210), a connecting rod (211), a sleeve rod (212), and a first antenna assembly (213). The housing (201) is mounted on the base assembly (1). Concentrated covers (204) are provided on both sides of the housing (201). An air inlet (202) is opened on the top of the housing (201). The cover plate (203) is mounted on the top of the housing (201). The mounting rod (210) is rotatably mounted on the side of the housing (201), and the connecting rod (211) is rotatably mounted on the mounting rod (210). The sleeve rod (212) is installed on the connecting rod (211). The connecting rod (211) is provided with a first antenna assembly (213). The first antenna assembly (213) includes at least two different frequencies. The mounting rod (210) is provided with multiple slots (215) at different angles. The connecting rod (211) is provided with a protrusion (216). The inner side of the outer shell (201) is provided with a diffuser plate (208) and an LED assembly (209). The LED assembly (209) is located behind the diffuser plate (208). The LED assembly (209) is connected to the main board assembly (3) through wires to control and display the light.
5. The high-efficiency heat dissipation router for network communication as described in claim 4, characterized in that, The central hood (204) is funnel-shaped with one end larger than the other. One end of the central hood (204) is provided with a dustproof plate (207), and the other end of the central hood (204) is provided with a diversion plate (205).
6. The high-efficiency heat dissipation router for network communication as described in claim 5, characterized in that, The dustproof plate (207) is made of metal material. The dustproof plate (207) is provided with ventilation dustproof holes. The inner side of the outer shell (201) is provided with a permanent magnet (206) for adsorbing and fixing the dustproof plate (207). The inner side of the dustproof plate (207) is provided with an annular protrusion that fits the concentrator cover (204).
7. The high-efficiency heat dissipation router for network communication as described in claim 5, characterized in that, The diverter plate (205) is a streamlined shape with one end larger than the other, which can reduce wind resistance and divide the airflow into upper and lower layers.
8. The high-efficiency heat dissipation router for network communication as described in claim 1, characterized in that, The mainboard assembly (3) includes a circuit board (301) and a support spring (303). The circuit board (301) is slidably mounted on the counterweight (101) via a connecting post (102). The support spring (303) is located between the circuit board (301) and the outer casing (201). The support spring (303) has gaskets at both ends. The outer casing (201) has mounting slots corresponding to the support spring (303). The circuit board (301) is equipped with a second antenna assembly (302). 1) A VC heat-conducting plate (4) is provided below. Thermally conductive silicone (5) is provided between the circuit board (301) and the VC heat-conducting plate (4) for heat conduction. A second heat dissipation fin (6) is provided below the VC heat-conducting plate (4). The second heat dissipation fin (6) is slidably installed on the counterweight (101) through the connecting column (102). A notch is provided in the middle of the second heat dissipation fin (6). Multiple interfaces are provided at the rear end of the circuit board (301). A groove is provided at the rear end of the outer shell (201). Through holes are provided in the groove.
9. The high-efficiency heat dissipation router for network communication as described in claim 8, characterized in that, The second antenna assembly (302) is a "spring" antenna. The pitch of the second antenna assembly (302) is different on the top and bottom. The housing (201) is provided with a mounting slot corresponding to the second antenna assembly (302).
10. The high-efficiency heat dissipation router for network communication as described in claim 8, characterized in that, The outer side of the VC heat-conducting plate (4) is a copper plate (401) made of oxygen-free copper, and the inner side of the copper plate (401) is a flow-guiding layer (402). The flow-guiding layer (402) is a dense porous structure formed by sintering copper powder. The inner side of the copper plate (401) has a cavity (403) and a liquid working medium is provided in the cavity (403). The VC heat-conducting plate (4) can quickly conduct and spread heat.
Citation Information
Patent Citations
Heat dissipation placement mechanism and intelligent router equipment
CN117560319A