Equipment and methods for testing repeatability accuracy

Abstract

This application provides a device and method for detecting repeatability accuracy, relating to the field of semiconductor fabrication technology. The detection device includes a rack assembly, an image acquisition assembly, a sensing assembly, a motion assembly, and a control assembly. During the periodic movement of the wafer under test, when the sensing unit detects a first target point on the wafer, the control assembly controls the imaging unit to acquire image information of a second target point on the wafer. The control assembly determines the coordinate information of the second target point based on the image information, thereby determining the repeatability accuracy information of the device under test based on the coordinate information of multiple second target points. The repeatability accuracy detection device provided in this application features high compatibility, ease of operation, and high detection flexibility.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor fabrication, and more specifically, to a device and method for detecting repeatability accuracy. Background Technology

[0002] In semiconductor manufacturing, packaging, and testing production lines, the Sorter and EFEM (Equipment Front-End Module) are core devices responsible for the automated transfer, positioning, and exchange of wafers. Among them, the Aligner and the robotic arm are key components that determine the accuracy and reliability of wafer transfer.

[0003] Aligner needs to accurately perform wafer edge finding, positioning, and ID information reading; its rotational positioning accuracy directly affects the alignment success rate of subsequent processes. The robotic arm, on the other hand, needs to achieve extremely high repeatability in wafer pick-and-place positioning while operating at high speeds. Any tiny positioning deviation can lead to wafer breakage, process failure, or reduced product yield. Therefore, regularly testing and calibrating the rotational accuracy of the Aligner and the pick-and-place repeatability of the robotic arm is of great significance.

[0004] However, the inventors of this application have found that current methods for detecting repeatability accuracy still suffer from problems such as space limitations, low testing efficiency, lack of effective thermal error compensation mechanisms, poor stability of measurement results, heavy maintenance work, and easy introduction of human error.

[0005] The content in the background section is merely technology known to the public and does not necessarily represent existing technology in this field. Summary of the Invention

[0006] This application provides a device and method for detecting repeatability accuracy, aiming to solve at least one of the technical problems mentioned in the background art.

[0007] According to one aspect of this application, a repeatability accuracy testing device is provided, including a rack assembly, an image acquisition assembly, a sensing assembly, a motion assembly, and a control assembly. A device to be tested is mounted on the rack assembly, and a wafer to be tested is supported on the device. The image acquisition assembly includes a first position adjustment unit and an imaging unit, with the imaging unit mounted on the first position adjustment unit. The sensing assembly includes a second position adjustment unit and a sensing unit, with the sensing unit mounted on the second position adjustment unit. The motion assembly is mounted on the rack assembly, and the image acquisition assembly and the sensing assembly are mounted on the motion assembly, which drives the movement of the image acquisition assembly and the sensing assembly. The control assembly is electrically connected to the image acquisition assembly and the sensing assembly. During the periodic movement of the wafer to be tested, when the sensing unit detects a first target point on the wafer, the control assembly controls the imaging unit to acquire image information of a second target point on the wafer. The control assembly determines the coordinate information of the second target point based on the image information, thereby determining the repeatability accuracy information of the device to be tested based on the coordinate information of multiple second target points.

[0008] According to some embodiments of this application, the detection device further includes a display component electrically connected to the control component.

[0009] According to some embodiments of this application, the detection device further includes: a temperature sensing component, which collects the current temperature information at the detection device, and the temperature sensing component is electrically connected to the control component. The control component determines a target error value based on the current temperature information, the coordinate information of the imaging unit, and a preset temperature error correction model, and corrects the coordinate information of the second target point based on the target error value, so as to determine the repeatability accuracy information based on the corrected coordinate information of the second target point.

[0010] According to some embodiments of this application, the first position adjustment unit is a three-axis slide, which is used to adjust the position of the imaging unit in the first direction, the second direction and the third direction.

[0011] According to some embodiments of this application, the second position adjustment unit includes: a rotary table for adjusting the position of the sensing unit in a first direction; an arc-shaped limiting plate, in which the sensing unit is disposed, and the arc-shaped limiting plate is used to adjust the position of the sensing unit in a second direction; and a groove-shaped limiting plate, in which the arc-shaped limiting plate is disposed, and the groove-shaped limiting plate is used to adjust the position of the sensing unit in a third direction, one end of the groove-shaped limiting plate being connected to the rotary table.

[0012] According to some embodiments of this application, the motion component includes: a first direction motion unit, an image acquisition component and a sensing component disposed on the first direction motion unit; a third direction motion unit, the first direction motion unit disposed on the third direction motion unit; and a second direction motion unit, disposed on the frame assembly, the third direction motion unit disposed on the second direction motion unit.

[0013] According to some embodiments of this application, the testing device further includes: a first top plate, a third-direction motion unit disposed on a first side of the first top plate, and one end of a second side of the first top plate disposed on the second-direction motion unit; an auxiliary guide rail disposed opposite to the second-direction motion unit on the frame assembly, the auxiliary guide rail disposed at the other end of the second side of the first top plate, and the auxiliary guide rail being supported and connected to the first top plate by a support member.

[0014] According to some embodiments of this application, the testing device further includes: a guide post disposed on a first top plate; a bushing sleeve disposed on the guide post; and a protective plate disposed on the bushing sleeve.

[0015] According to some embodiments of this application, the rack assembly includes: a frame; an optical platform disposed on the frame, the optical platform being used to support the device to be tested, and the optical platform having mounting through holes; a support leveling component disposed at the bottom of the frame; and / or a movable component disposed at the bottom of the frame.

[0016] According to another aspect of this application, a method for detecting repeatability accuracy is provided, comprising: placing a wafer to be tested on a rack assembly using a device under test; adjusting the positions of an image acquisition component and a sensing component using a motion component to position the image acquisition component and the sensing component at an initial position; adjusting the position of an imaging unit using a first position adjustment unit to position a second target point at the center of the field of view of the imaging unit; adjusting the position of the sensing unit using a second position adjustment device to transmit a sensing signal from the sensing unit to the first target point; controlling the wafer to be tested to move using the device under test, and after one movement cycle, triggering the imaging unit to acquire image information of the second target point on the wafer to be tested when the sensing unit detects the first target point, so that a control component determines the coordinate information of the second target point in the current movement cycle based on the image information; controlling the wafer to be tested to move for multiple movement cycles, so that the control component determines the coordinate information of multiple second target points; and determining the repeatability accuracy information of the device under test based on the coordinate information of the multiple second target points.

[0017] According to some embodiments of this application, the control component determines the repeatability accuracy information of the device to be detected based on the coordinate information of multiple second target points, including: constructing a three-dimensional mesh model including multiple mesh nodes based on the target detection area of ​​the imaging unit; determining the coordinate information of each mesh node and the mesh temperature information at the mesh node to construct a target database; determining a temperature error database based on the reference database and the target database; constructing a temperature error correction model based on the temperature error database; determining the target error value based on the current temperature information, the coordinate information of the imaging unit, and the temperature error correction model; and correcting the coordinate information of the second target points based on the target error value to determine the repeatability accuracy information based on the corrected coordinate information of the second target points.

[0018] Beneficial effects This application provides a device for detecting repeatability accuracy, which includes a frame assembly, an image acquisition assembly, a sensing assembly, a motion assembly, and a control assembly.

[0019] This application integrates the frame assembly, image acquisition assembly, sensing assembly, motion assembly, and control assembly into a single unit, resulting in a compact testing device that can perform repeatability testing of devices (such as Aligners or robotic arms) within confined maintenance spaces. The repeatability testing device provided in this application features high compatibility (compatible with various devices such as Aligners or robotic arms), ease of operation (suitable for testing within maintenance spaces), and high testing flexibility (can be moved at any time). Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the front structure of the detection device according to an embodiment of this application; Figure 2 This diagram shows the rear structure of the detection device according to an embodiment of this application; Figure 3 A schematic diagram illustrating Aligner detection according to an embodiment of this application is shown; Figure 4 A schematic diagram illustrating robotic arm detection according to an embodiment of this application is shown; Figure 5 A partial schematic diagram of the detection device according to an embodiment of this application is shown; Figure 6A schematic diagram showing the target point of the detection device according to an embodiment of this application; Figure 7 This diagram illustrates the structure of the first position adjustment unit according to an embodiment of this application. Figure 8 This application shows a schematic diagram of the structure of a sensing component according to an example embodiment. Figure 9 A front structural schematic diagram of the motion component according to an embodiment of this application is shown; Figure 10 A schematic diagram of the rear structure of the motion component according to an embodiment of this application is shown; Figure 11 This diagram illustrates the structure of a rack assembly according to an embodiment of this application. Figure 12 This diagram illustrates the structure of the control component according to an embodiment of the present application. Figure 13 A flowchart illustrating the detection method according to an embodiment of this application is shown. Figure 14 This illustration shows yet another flowchart of the detection method according to an embodiment of this application; Figure 15 A schematic diagram of the structure of a three-dimensional mesh model according to an embodiment of this application is shown.

[0022] Explanation of reference numerals in the attached figures: Rack assembly 10; Image acquisition assembly 20; Sensing assembly 30; Motion assembly 40; Control assembly 50; Display assembly 60; Frame 11; Optical platform 12; Support and leveling component 13; Moving component 14; Mounting through hole 121; Optical platform support 122; First position adjustment unit 21; Imaging unit 22; Camera 221; Imaging lens 222; Light source 223; Light source fixing plate 224; First fixing plate 23; Second position adjustment unit 31; sensing unit 32; rotary table 311; arc-shaped limiting plate 312; groove-shaped limiting plate 313; second fixing plate 33; First direction motion unit 41; Second direction motion unit 42; Third direction motion unit 43; Robotic arm 61; First base plate 71; First top plate 72; Auxiliary guide rail 73; Support component 74; Second base plate 75; Guide column 81; bushing 82; protective plate 83; First cable chain 91; Second cable chain 92; First cable chain fixing plate 910; Second cable chain fixing plate 920; Temperature sensing component 100. Detailed Implementation

[0023] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The inventors of this application have discovered that current methods for detecting repeatability accuracy still have at least the following problems: 1. Space constraints and low testing efficiency: Semiconductor manufacturing workshops are compactly laid out, with maintenance distances between machines typically only around 1 meter. Traditional testing solutions generally employ fixed gantry-type repeatability accuracy testing platforms. These platforms require X, Y, and Z-axis movement devices and corresponding drive and communication systems, resulting in a bulky structure that is difficult to deploy flexibly within the narrow spacing between machines. Furthermore, during testing, the robot arm or Aligner under test must be disassembled from the machine, moved below the platform for installation, wiring, and testing. After testing one device, the wiring must be disconnected and the next device reinstalled, a cumbersome process that consumes significant manpower and time, resulting in low testing efficiency.

[0025] 2. Lack of an effective thermal error compensation mechanism results in poor measurement stability. Temperature fluctuations are unavoidable in semiconductor workshops. Traditional repeatability accuracy testing platforms have complex mechanical structures, are highly integrated, and have multiple coupled components, making it difficult to independently and accurately establish a systematic thermally induced error model using image acquisition units or local structural parameters.

[0026] Changes in ambient temperature cause thermal expansion and contraction of the platform structure, which in turn causes drift in the testing reference, resulting in uncontrollable and unpredictable errors in the measurement results. For example, a system calibrated in the morning may experience out-of-tolerance test data in the afternoon due to increased workshop temperature, making it impossible to guarantee the reliability and long-term stability of the test results.

[0027] 3. Maintenance work is arduous and prone to human error: To address the accuracy degradation caused by changes in ambient temperature and ensure the validity of test data, operators must frequently recalibrate the repeatability accuracy testing platform (e.g., daily or before each shift). This frequent calibration not only increases equipment maintenance workload and downtime, reducing the availability of the testing equipment, but the repetitive manual operation process may also introduce new calibration errors, further affecting the accuracy of the final test results.

[0028] According to one aspect of this application, this application provides a repeatability accuracy testing device for detecting the repeatability accuracy of the device to be tested.

[0029] Figure 1 This diagram illustrates the structure of the detection device according to an embodiment of this application. Figure 2 This diagram shows the rear structure of the detection device according to an embodiment of this application; Figure 3 A schematic diagram illustrating Aligner detection according to an embodiment of this application is shown; Figure 4 This diagram illustrates the robotic arm detection method according to an embodiment of this application.

[0030] According to the example embodiment, such as Figure 1 or Figure 2 As shown, the repeatability accuracy detection device may include a frame assembly 10, an image acquisition assembly 20, a sensing assembly 30, a motion assembly 40, and a control assembly 50.

[0031] According to the example embodiment, the device to be tested is disposed on the rack assembly 10, and the device to be tested carries the wafer to be tested.

[0032] For example, such as Figure 1 As shown, the rack assembly 10 is used to support other components, providing an operating platform and stable support for them. The device under test can carry the wafer to be tested by adsorption or clamping and move the wafer to be tested onto the rack assembly 10.

[0033] Optionally, the device to be detected can be an Aligner (such as...) Figure 3 (as shown) or robotic arm (such as Figure 4 (As shown), this application does not impose any restrictions on this.

[0034] Figure 5 A partial schematic diagram of the detection device according to an embodiment of this application is shown; Figure 6 A schematic diagram showing the target point of the detection device according to an embodiment of this application.

[0035] According to the example embodiment, such as Figure 5 As shown, the image acquisition component 20 includes a first position adjustment unit 21 and an imaging unit 22, with the imaging unit 22 disposed on the first position adjustment unit 21.

[0036] For example, the first position adjustment unit 21 is used to adjust the position of the imaging unit 22, which is used to acquire image information of the first target point on the wafer under test multiple times during the periodic movement of the wafer under test. The control component 50 is electrically connected to the imaging unit 22, and the control component 50 can receive the image information of the first target point and determine the coordinates of the first target point based on the image information.

[0037] For example, the first target point is a custom setting by the user based on actual needs.

[0038] Optionally, such as Figure 5As shown, the imaging unit 22 may include a camera 221, an imaging lens 222, and a light source 223. The camera 221, imaging lens 222, and light source 223 can all be fixedly mounted on the light source mounting plate 224. The imaging unit 22 can acquire the second target point B (e.g., ...) through the camera 221 and imaging lens 222 under the illumination of the light source 223. Figure 6 Image information at (shown).

[0039] According to the example embodiment, such as Figure 5 As shown, the sensing component 30 includes a second position adjustment unit 31 and a sensing unit 32, with the sensing unit 32 disposed on the second position adjustment unit 31.

[0040] For example, the second position adjustment unit 31 is used to adjust the position of the sensing unit 32, which is used to emit sensing signals to the wafer under test during the periodic movement of the wafer. The sensing unit 32 can detect the first target point A (e.g., ...) based on the returned sensing signals. Figure 6 (As shown).

[0041] For example, the sensing unit 32 can be a diffuse reflection sensor. A diffuse reflection sensor can determine the presence or absence of an object by detecting the intensity of light emitted by itself reflected back from the target object. Based on this detection principle, the sensing unit 32 can detect the first target point A.

[0042] According to the example embodiment, such as Figure 1 As shown, the motion component 40 is mounted on the frame assembly 10, and the image acquisition component 20 and the sensing component 30 are mounted on the motion component 40. The motion component 40 is used to drive the movement of the image acquisition component 20 and the sensing component 30.

[0043] For example, the motion component 40 can move on the rack component 10. Since the image acquisition component 20 and the sensing component 30 are mounted on the motion component 40, when the motion component 40 moves in a specific direction, the motion component 40 will drive the image acquisition component 20 and the sensing component 30 to move, so that the motion component 40 can adjust the initial position of the image acquisition component 20 and the sensing component 30.

[0044] It can be understood here that the motion component 40 can be used for the initial adjustment of the positions of the image acquisition component 20 and the sensing component 30, and the first position adjustment unit 21 and the second position adjustment unit 31 are used for the secondary adjustment (i.e., fine adjustment) of the positions of the image acquisition component 20 and the sensing component 30.

[0045] With this configuration, this application can precisely control the positions of the image acquisition component and the sensing component by making initial and secondary adjustments to their positions, thereby ensuring measurement accuracy.

[0046] According to the example embodiment, the control component 50 is electrically connected to the image acquisition component 20 and the sensing component 30. During the periodic movement of the wafer under test, when the sensing unit 32 detects a first target point on the wafer under test, the control component 50 controls the imaging unit 22 to acquire image information of a second target point on the wafer under test. The control component 50 determines the coordinate information of the second target point based on the image information, so that the control component 50 determines the repeatability accuracy information of the device under test based on the coordinate information of multiple second target points.

[0047] For example, when the sensing unit 32 detects a first target point on the wafer to be inspected via a sensing signal, the sensing unit 32 sends a feedback signal to the control component 50. Upon receiving the feedback signal, the control component 50 controls the imaging unit 22 to acquire image information of the second target point, thereby obtaining image information of the second target point of the wafer to be inspected in the current motion cycle. Furthermore, the control component 50 can determine the coordinate information of the second target point in the current motion cycle based on the image information of the second target point in the current motion cycle.

[0048] By repeatedly performing the above operations, the control component 50 can determine the coordinate information of all the second target points corresponding to the wafer under test in multiple motion cycles. Based on the coordinate information of all the second target points, the control component 50 can determine the maximum and minimum coordinate values ​​of the second target points, and thus determine the deviation of the wafer under test under repeated periodic motion based on the maximum and minimum values, thereby determining the repeatability accuracy information of the current testing device.

[0049] For example, the periodic motion can be either periodic rotation or periodic movement. When the device to be detected is an Aligner, the periodic motion is periodic rotation; when the device to be detected is a robotic arm, the periodic motion is periodic movement.

[0050] Optionally, the overall size of the repeatability testing equipment can be controlled within a space of 600cm*600cm.

[0051] Through the above embodiments, this application provides a repeatability testing device, which includes a frame assembly, an image acquisition assembly, a sensing assembly, a motion assembly, and a control assembly. By integrating the frame assembly, image acquisition assembly, sensing assembly, motion assembly, and control assembly into a single unit, this application achieves a compact structure for the testing device, enabling the testing of the repeatability of devices (such as Aligners or robotic arms) within confined maintenance spaces. The repeatability testing device provided by this application features high compatibility (compatible with the testing of various devices such as Aligners or robotic arms), ease of operation (suitable for testing within maintenance spaces), and high testing flexibility (can be moved at any time).

[0052] Optionally, such as Figure 1 As shown, the detection device may also include a display component 60, which is electrically connected to the control component 50 and is used to display repeatability accuracy information.

[0053] For example, such as Figure 1 or Figure 2 As shown, the display component 60 has a rotating structure, and the display component 60 can be electrically connected to the control component 50 via the robotic arm 61.

[0054] This configuration allows the display component to rotate flexibly under the action of the robotic arm and the pivot structure, thus adapting to operation in different spaces. Through the display component design, this application can provide users with real-time visual inspection results, offering both convenience and flexibility.

[0055] Optionally, the detection device may also include a temperature sensing component 100. The temperature sensing component 100 collects the current temperature information at the detection device and is electrically connected to the control component 50.

[0056] The control component 50 determines the target error value based on the current temperature information, the coordinate information of the imaging unit 22 and the preset temperature error correction model, and corrects the coordinate information of the second target point based on the target error value, so as to determine the repeatability accuracy information based on the corrected coordinate information of the second target point.

[0057] For example, the specific description of the error compensation of the coordinate information of the second target point by the control component 50 is described in detail below, and will not be repeated here.

[0058] Optionally, such as Figure 10 As shown, the temperature sensing component 100 can be mounted on the first top plate 72.

[0059] Figure 7 This diagram illustrates the structure of the first position adjustment unit according to an embodiment of this application. Figure 8A schematic diagram of the structure of a sensing component according to an example embodiment of this application is shown.

[0060] Optionally, such as Figure 7 As shown, the first position adjustment unit 21 is a three-axis slide. The three-axis slide is used to adjust the position of the imaging unit 22 in the first direction, the second direction, and the third direction.

[0061] For example, a three-axis slide is a precision mechanical modular platform that integrates three independent linear motion axes (such as X, Y, and Z axes). Exemplarily, in the XYZ coordinate system, the first direction can be the direction of the X-axis, the second direction can be the direction of the Y-axis, and the third direction can be the direction of the Z-axis.

[0062] This application can adjust the position of the imaging unit in the first, second, and third directions by controlling the three independent linear motion axes of the triaxial slide, thereby achieving the adjustment of the imaging unit's position.

[0063] Optionally, such as Figure 5 or Figure 8 As shown, the second position adjustment unit 31 may include a rotary table 311, an arc-shaped limiting plate 312, and a groove-shaped limiting plate 313.

[0064] The rotary table 311 is used to adjust the position of the sensing unit 32 in the first direction. The sensing unit 32 is disposed in the arc-shaped groove of the arc-shaped limiting plate 312, which is used to adjust the position of the sensing unit 32 in the second direction. The arc-shaped limiting plate 312 is disposed in the groove-shaped limiting plate 313, which is used to adjust the position of the sensing unit 32 in the third direction. One end of the groove-shaped limiting plate 313 is connected to the rotary table 311.

[0065] For example, in the XYZ coordinate system, the first direction can be the direction of the X-axis, the second direction can be the direction of the Y-axis, and the third direction can be the direction of the Z-axis.

[0066] For example, the sensing unit 32 is disposed in the groove of the arc-shaped limiting plate 312, enabling approximately 180° position adjustment in the Y-axis direction. The arc-shaped limiting plate 312 can move in the Z-axis direction through the slotted hole on the slotted limiting plate 313. Since the sensing unit 32 is disposed on the arc-shaped limiting plate 312, its position can be adjusted in the Z-axis direction. One end of the slotted limiting plate 313 is connected to the rotary table 311, so that both the sensing unit 32 and the arc-shaped limiting plate 312 are connected to the rotary table 311. By controlling the rotation of the rotary table 311, the position of the sensing unit 32 can be adjusted in the X-axis direction.

[0067] Through the above embodiments, this application can achieve flexible adjustment of the position of the sensing unit in the first direction, the second direction, and the third direction by setting a rotating turntable, an arc-shaped limiting plate, and a groove-shaped limiting plate, thereby ensuring the accuracy of the sensing signal transmission and reception of the sensing unit.

[0068] Figure 9 A front structural schematic diagram of the motion component according to an embodiment of this application is shown; Figure 10 A schematic diagram of the rear structure of the motion component according to an embodiment of this application is shown; Optionally, such as Figure 1 or Figure 9 As shown, the motion component 40 may include a first direction motion unit 41, a third direction motion unit 43, and a second direction motion unit 42.

[0069] like Figure 1 As shown, the image acquisition component 20 and the sensing component 30 are mounted on the first direction motion unit 41.

[0070] For example, such as Figure 5 As shown, the image acquisition component 20 also includes a first fixing plate 23. The image acquisition component 20 can be fixedly mounted on the first direction motion unit 41 via the first fixing plate 23. Figure 5 As shown, the sensing component 30 also includes a second fixing plate 33. The sensing component 30 can be fixedly mounted on the first direction motion unit 41 via the second fixing plate 33.

[0071] For example, the first direction motion unit 41 can move in the first direction, thus driving the image acquisition component 20 and the sensing component 30 to move in the first direction. Exemplarily, in the XYZ coordinate system, the first direction can be the X-axis direction.

[0072] like Figure 9 As shown, the first direction motion unit 41 is mounted on the third direction motion unit 43.

[0073] For example, the third-direction motion unit 43 can move in the third direction, thus driving the image acquisition component 20 and the sensing component 30 to move in the third direction. Exemplarily, in the XYZ coordinate system, the third direction can be the Z-axis direction.

[0074] like Figure 1 and Figure 9 As shown, the second direction motion unit 42 is mounted on the frame assembly 10, and the third direction motion unit 43 is mounted on the second direction motion unit 42.

[0075] For example, the second direction motion unit 42 can move in the second direction, thus driving the image acquisition component 20 and the sensing component 30 to move in the second direction. Exemplarily, in the XYZ coordinate system, the second direction can be the Y-axis direction.

[0076] Optionally, such as Figure 9 As shown, the testing equipment may further include a first base plate 71, which is fixedly mounted on the surface of the frame assembly 10. A second directional motion unit 42 is mounted on the first base plate 71, so as to mount the second directional motion unit 42 on the frame assembly 10 via the first base plate 71.

[0077] Optionally, such as Figure 9 As shown, the detection device may further include a first top plate 72. A third-direction motion unit 43 is disposed on a first side of the first top plate 72, and a second side of the first top plate 72 is fixedly disposed on the second-direction motion unit 42. With this configuration, the third-direction motion unit 43 can be disposed on the second-direction motion unit 42 via the first top plate 72.

[0078] Optionally, the first direction motion unit 41, the second direction motion unit 42, and the third direction motion unit 43 are all hand-cranked modules, and the movement of the first direction motion unit 41, the second direction motion unit 42, and the third direction motion unit 43 in the corresponding directions can be realized by rotating the handwheel.

[0079] Optionally, each of the first direction motion unit 41, the second direction motion unit 42, and the third direction motion unit 43 is equipped with a grating ruler, which can be used to detect the position information of the image acquisition component 20.

[0080] Through the above embodiments, this application, by setting up a first-direction motion unit, a third-direction motion unit, and a second-direction motion unit, can achieve position adjustment of the image acquisition component and the sensing component in at least three different directions, thereby enabling initial adjustment of the positions of the image acquisition component and the sensing component. Optionally, such as Figure 9 As shown, the testing equipment also includes an auxiliary guide rail 73 and a support member 74. The auxiliary guide rail 73 is disposed on the frame assembly 10 opposite to the second direction movement unit 42. The auxiliary guide rail 73 is disposed at the other end of the second side of the first top plate 72, and the auxiliary guide rail 73 is supported and connected to the first top plate 72 by the support member 74.

[0081] For example, to ensure smooth movement of the second direction motion unit 42 in the second direction, an auxiliary guide rail 73 is provided on the opposite side of the second direction motion unit 42. The auxiliary guide rail 73 can ensure smooth movement and guidance of the second direction motion unit 42.

[0082] Optionally, the testing equipment also includes a second base plate 75. The second base plate 75 is mounted on the frame assembly 10, and one side of the auxiliary guide rail 73 is mounted on the second base plate 75, while the other side is connected to the first top plate 72 via a support member 74 (e.g., by fixing with screws).

[0083] Optionally, such as Figure 10 As shown, the detection device also includes a guide post 81, a bushing 82, and a protective plate 83. The guide post 81 is disposed on the first top plate 72, the bushing 82 is sleeved on the guide post 81, and the protective plate 83 is disposed on the bushing 82.

[0084] For example, the bearing sleeve 82 can be locked or released using a wrench. When the bearing sleeve 82 is locked, it will lock the guide post 81; when the bearing sleeve 82 is released, it will release the guide post 81.

[0085] When the third-party motion unit 43 moves to the target position, the guide post 81 can be locked by the bushing 82 to fix the protective plate 83 in a specific position, so that the protective plate 83 can support the bottom of the third-party motion unit 43. This setting can provide stable support for the third-party motion unit 43 and prevent the third-party motion unit 43 from falling and causing damage to optical instruments such as the image acquisition component 20 and the sensing component 30.

[0086] Optionally, such as Figure 9 As shown, the motion cable can move through the first cable chain 91 and the second cable chain 92. The first cable chain 91 can be set on the first cable chain fixing plate 910, and the second cable chain 92 can be set on the second cable chain fixing plate 920.

[0087] For example, the first cable chain 91 can be a Z-axis cable chain, and the second cable chain 92 can be a Y-axis cable chain.

[0088] Optionally, such as Figure 11 As shown, the rack assembly 10 may include a frame 11, an optical platform 12, a support and leveling component 13, and a moving component 14. The optical platform 12 is mounted on the frame 11 and is used to support the device to be tested. The optical platform 12 is provided with a mounting through hole 121. The support and leveling component 13 is located at the bottom of the frame 11, and the moving component 14 is located at the bottom of the frame 11.

[0089] For example, the frame 11 can be welded from a metal material (such as a square steel pipe). The optical platform 12 can be supported on the frame 11 by the optical platform support 122. The optical platform 12 is provided with multiple mounting through holes 121 (such as threaded holes), through which it can be fixedly connected to other devices (such as Aligner). The first base plate 71 and the second base plate 75 can be connected to the optical platform 12 through the mounting through holes 121.

[0090] As an example, such as Figure 11 As shown, the testing device may include four optical platform supports 122, four support leveling components 13, and four moving components 14.

[0091] Optionally, such as Figure 12 As shown, the control component 50 may include a mounting plate 51, a controller 52, an electrical control component 53, and a moving component 54.

[0092] For example, the controller 52 can be placed on the mounting plate 51, and the electrical control component 53 can be placed in the movable component 54. With this arrangement, the electrical control component 53 can be moved out by the movable component 54 when needed, thereby ensuring sufficient maintenance space.

[0093] For example, the movable component 54 may be a pull-out drawer in which the electrical control component 53 is disposed.

[0094] According to another aspect of this application, this application provides a method for detecting repeatability accuracy, used to detect the repeatability accuracy of the device to be tested.

[0095] Figure 13 A flowchart illustrating a detection method according to an embodiment of this application is shown.

[0096] According to the example embodiment, such as Figure 13 As shown, the detection method may include steps S100-S700.

[0097] In step S100, the wafer to be tested is placed on the rack assembly using the device to be tested.

[0098] For example, when it is determined that the wafer to be inspected is within the inspection range of the inspection equipment, the inspection device (such as...) is used to... Figure 3 As shown in the Aligner, or as... Figure 4 The robotic arm shown places the wafer to be inspected at the corresponding inspection position on the rack assembly.

[0099] In step S200, the positions of the image acquisition component and the sensing component are adjusted by the motion component so that the image acquisition component and the sensing component are in their initial positions.

[0100] For example, by adjusting the approximate positions of the image acquisition component and the sensing component in the first, second, and third directions using motion components (which can be achieved through a first-direction motion unit, a second-direction motion unit, and a third-direction motion unit), the image acquisition component and the sensing component can be set to their initial positions.

[0101] For example, the initial position can be the position where the sensing signal of the sensing unit can be emitted to the wafer under test and the imaging unit can acquire the image information of the wafer under test.

[0102] In step S300, the position of the imaging unit is adjusted by the first position adjustment unit so that the second target point is located at the center of the field of view of the imaging unit.

[0103] For example, the imaging unit can be adjusted to its specific position in the first, second, and third directions using a first position adjustment unit (this can be achieved using a three-axis slide) to position it at the detection location, ensuring that the second target point is located at the center of the imaging unit's field of view and can be clearly imaged. The imaging unit is then fixed, and its imaging parameters are set.

[0104] In step S400, the position of the sensing unit is adjusted by the second position adjustment device so that the sensing signal of the sensing unit is transmitted to the first target point.

[0105] For example, the specific positions of the sensing unit in the first, second, and third directions can be adjusted by the second position adjustment unit (this can be achieved through a rotating turntable, an arc-shaped limiting plate, and an arc-shaped limiting plate) to adjust the sensing unit to the detection position so that the first target point can receive the laser signal emitted by the sensing unit. Then, the sensing unit is fixed, and the trigger distance range of the sensing unit is set (when the first target point enters this trigger distance range, the sensing unit can detect the first target point).

[0106] In step S500, the wafer to be tested is controlled to move by the device under test. After one movement cycle, when the sensing unit detects the first target point, the imaging unit is triggered to acquire the image information of the second target point on the wafer under test, so that the control component can determine the coordinate information of the second target point in the current movement cycle based on the image information.

[0107] For example, the device to be detected moves periodically (such as rotating or moving) according to a preset motion trajectory at the adjusted detection position, and stops moving after one motion cycle (such as rotating once or moving back and forth once).

[0108] During this process, the sensing unit emits sensing signals to the surface of the wafer under test in real time. When the first target point enters the trigger distance range of the sensing unit, the sensing unit can generate a level output signal (such as a high-level output signal) based on photoelectric principles. This level output signal can be transmitted to the trigger input port of the imaging unit's controller through a preset interface (such as a digital I / O interface), so that the imaging unit's controller can perform image acquisition in real time based on a preset exposure sequence to obtain the image information of the second target point. The control component can extract the coordinate information of the second target point from the image information based on a template matching vision algorithm.

[0109] In step S600, the wafer to be detected is controlled to move for multiple motion cycles, and the control component determines the coordinate information of multiple second target points.

[0110] In step S700, the control component determines the repeatability accuracy information of the device to be detected based on the coordinate information of multiple second target points.

[0111] For example, the control component can determine the maximum and minimum coordinates of the second target points based on the coordinate information of all the second target points. It can then determine the deviation of the wafer under test under repeated periodic motion based on the maximum and minimum values, and further determine the repeatability information of the current testing device.

[0112] This application integrates the frame assembly, image acquisition assembly, sensing assembly, motion assembly, and control assembly into a single unit, resulting in a compact testing device that can perform repeatability testing of devices (such as Aligners or robotic arms) within confined maintenance spaces. The repeatability testing method provided in this application features high compatibility (compatible with various devices such as Aligners or robotic arms), ease of operation (suitable for testing within maintenance spaces), and high testing flexibility (can be moved at any time).

[0113] Figure 14 This illustration shows yet another flowchart of the detection method according to an embodiment of this application; Figure 15 A schematic diagram of the structure of a three-dimensional mesh model according to an embodiment of this application is shown.

[0114] Optionally, such as Figure 14 As shown, step S700 may also include steps S710-S760.

[0115] In step S710, a three-dimensional mesh model including multiple mesh nodes is constructed based on the target detection area of ​​the imaging unit.

[0116] For example, the control component can construct a three-dimensional calibration system covering the target detection area (400mm*400mm*450mm) of the imaging unit, and can discretize this space into a uniform 9*9*10 three-dimensional mesh model based on the Cartesian coordinate system. Figure 15 As shown, each grid node can be the location of an imaging unit within the target detection area, and the theoretical coordinates of this location are... .

[0117] In step S720, the coordinate information of each grid node and the grid temperature information at the grid node are determined to construct the target database.

[0118] For example, the target database is associated with coordinate information and grid temperature information. The control component can collect the coordinate information of each grid node. And the real-time temperature information at that grid node (i.e., grid temperature information). ,according to and A curve showing the change between coordinate information and grid temperature information can be constructed to obtain the target database. .

[0119] In step S730, a temperature error database is determined based on the reference database and the target database.

[0120] For example, it can be based on a constant temperature range The coordinate information and grid temperature information at (e.g., 22-23℃) determine the reference database. According to the target database and reference database The temperature error database for each grid node under different temperature differences can be calculated. .

[0121] Among them, temperature error It can satisfy:

[0122]

[0123]

[0124] With this configuration, this application can obtain a corrected sparse table of temperature error for each grid node, thereby transforming the complex thermally induced error problem into a data compensation problem with adaptive characteristics.

[0125] In step S740, a temperature error correction model is constructed based on the temperature error database.

[0126] For example, coordinate errors can be constructed using a second-order response surface model. Temperature error correction model based on the position and temperature of the imaging unit:

[0127] in, These are the coefficients of the second-order response surface model. It can be obtained by fitting using the least squares method. In order to be in The error value of the lower x-axis, In order to be in The error value of the ordinate below.

[0128] In step S750, the target error value is determined based on the current temperature information, the coordinate information of the imaging unit, and the temperature error correction model.

[0129] In step S760, the coordinate information of the second target point is corrected according to the target error value, so as to determine the repeatability accuracy information of the device to be tested based on the corrected coordinate information of the second target point.

[0130] For example, the control component collects current temperature information through the temperature sensing component. Coordinate information of imaging unit (This coordinate information can be measured using a grating ruler on the motion component), and the control component uses the current temperature information. and reference temperature information The temperature difference was calculated. .

[0131] Temperature difference Coordinate information of imaging units Substituting into the temperature error correction model, we can obtain:

[0132] Therefore, the control components can calculate the current temperature difference. coordinate error The control component then uses this coordinate error as a basis. The coordinate information of the currently detected second target point Real-time compensation is performed so that the control components can output high-precision detection results that have undergone both temperature error compensation and spatial position compensation.

[0133] It is understood that the temperature error correction model can be generated offline, while the correction of the coordinate information of the second target point can be performed online. This application does not impose any restrictions on this.

[0134] Through the above embodiments, this application enables detection in non-constant temperature environments. Based on a temperature error correction model, it can compensate for the impact of temperature fluctuations on repeatability accuracy, thereby improving the accuracy and reliability of the detection results. This application can reduce the repetitive calibration work of operators on the detection equipment and improve the utilization rate of the detection equipment.

[0135] It is understood here that, in this application, the distributed modeling of space-temperature coupling can accurately describe the complex coupling relationship between measurement error and spatial location and temperature by establishing a second-order response surface model for sparse nodes in three-dimensional space.

[0136] When correcting the coordinate information of the second target point online, the corresponding local temperature error correction model is dynamically called according to the real-time position of the imaging unit. This can achieve adaptive, position-dependent, and accurate compensation, and can effectively solve the heterogeneity error problem caused by temperature gradient in large-scale measurement space.

[0137] Furthermore, this application is data-driven, eliminating the need for complex and difficult-to-accurate thermodynamic finite element simulations, thus lowering the barrier to engineering implementation. It also ensures the reliability and practicality of the compensation effect. This application is applicable to scenarios requiring high precision in long-term repeatable positioning of vision measurement systems in industrial environments that are not completely isothermal.

[0138] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A device for detecting repeatability accuracy, characterized in that, include: A rack assembly, on which a device to be tested is mounted, and on which a wafer to be tested is supported; An image acquisition component includes a first position adjustment unit and an imaging unit, wherein the imaging unit is disposed on the first position adjustment unit; The sensing component includes a second position adjustment unit and a sensing unit, wherein the sensing unit is disposed on the second position adjustment unit; A motion component is disposed on the frame assembly, the image acquisition component and the sensing component are disposed on the motion component, and the motion component is used to drive the movement of the image acquisition component and the sensing component; A control component is electrically connected to the image acquisition component and the sensing component; During the periodic movement of the wafer under test, when the sensing unit detects a first target point on the wafer under test, the control component controls the imaging unit to acquire image information of a second target point on the wafer under test. The control component determines the coordinate information of the second target point based on the image information, so that the control component determines the repeatability accuracy information of the device under test based on the coordinate information of multiple second target points.

2. The detection device according to claim 1, characterized in that, The detection equipment also includes: The display component is electrically connected to the control component.

3. The detection device according to claim 1, characterized in that, The detection equipment also includes: A temperature sensing component collects the current temperature information at the detection device, and the temperature sensing component is electrically connected to the control component; The control component determines the target error value based on the current temperature information, the coordinate information of the imaging unit, and a preset temperature error correction model, and corrects the coordinate information of the second target point based on the target error value, so as to determine the repeatability accuracy information based on the corrected coordinate information of the second target point.

4. The detection device according to claim 1, characterized in that, The first position adjustment unit is a three-axis slide, which is used to adjust the position of the imaging unit in the first direction, the second direction and the third direction; and / or The second position adjustment unit includes: A rotary table is used to adjust the position of the sensing unit in the first direction; An arc-shaped limiting plate is provided, and the sensing unit is disposed in the groove of the arc-shaped limiting plate. The arc-shaped limiting plate is used to adjust the position of the sensing unit in the second direction. A groove-shaped limiting plate is provided, and the arc-shaped limiting plate is disposed on the groove-shaped limiting plate. The groove-shaped limiting plate is used to adjust the position of the sensing unit in the third direction. One end of the groove-shaped limiting plate is connected to the rotary table.

5. The detection device according to claim 1, characterized in that, The motion component includes: The first direction motion unit, wherein the image acquisition component and the sensing component are disposed on the first direction motion unit; A third-direction motion unit, wherein the first-direction motion unit is disposed on the third-direction motion unit; The second direction motion unit is disposed on the frame assembly, and the third direction motion unit is disposed on the second direction motion unit.

6. The detection device according to claim 5, characterized in that, The detection equipment also includes: A first top plate, wherein the third direction motion unit is disposed on a first side of the first top plate, and one end of a second side of the first top plate is disposed on the second direction motion unit; An auxiliary guide rail is disposed on the frame assembly opposite to the second direction movement unit. The auxiliary guide rail is disposed at the other end of the second side of the first top plate and is supported and connected to the first top plate by a support member.

7. The detection device according to claim 6, characterized in that, The detection equipment also includes: Guide pillars are installed on the first top plate; A bushing is fitted onto the guide post; A protective plate is installed on the bushing.

8. The detection device according to claim 1, characterized in that, The rack assembly includes: Frame; An optical platform is mounted on the frame and is used to support the device to be tested. The optical platform is provided with mounting through holes. Support leveling components are provided at the bottom of the frame; and / or The movable component is located at the bottom of the frame.

9. A method for detecting repeatability accuracy, characterized in that, The detection method is performed by the detection device according to any one of claims 1-8, and the detection method includes: The wafer to be tested is placed on the rack assembly using the device to be tested. The positions of the image acquisition component and the sensing component are adjusted by the motion component so that the image acquisition component and the sensing component are in their initial positions. The position of the imaging unit is adjusted by the first position adjustment unit so that the second target point is located at the center of the field of view of the imaging unit; The position of the sensing unit is adjusted by the second position adjustment device so that the sensing signal of the sensing unit is transmitted to the first target point; The device under test controls the movement of the wafer under test. After one movement cycle, when the sensing unit detects the first target point, the imaging unit is triggered to acquire image information of the second target point on the wafer under test, so that the control component can determine the coordinate information of the second target point in the current movement cycle based on the image information. The control component controls the movement of the wafer under test for multiple motion cycles so that it determines the coordinate information of multiple second target points. The control component determines the repeatability accuracy information of the device to be detected based on the coordinate information of the plurality of second target points.

10. The detection method according to claim 9, characterized in that, The control component determines the repeatability accuracy information of the device to be detected based on the coordinate information of the plurality of second target points, including: Based on the target detection area of ​​the imaging unit, a three-dimensional mesh model including multiple mesh nodes is constructed; The coordinate information of each grid node and the grid temperature information at each grid node are determined to construct the target database; A temperature error database is determined based on the reference database and the target database; A temperature error correction model is constructed based on the temperature error database; The target error value is determined based on the current temperature information, the coordinate information of the imaging unit, and the temperature error correction model; The coordinate information of the second target point is corrected based on the target error value, so as to determine the repeatability accuracy information based on the corrected coordinate information of the second target point.

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