Optimized mask structure for OLED production

Abstract

The present application relates to an optimized mask structure for OLED production, including glass substrate and silicon substrate design. The mask structure is characterized by thinning the display area interval area thickness between display areas to achieve significant weight reduction, thereby improving the adsorption performance and alignment accuracy of the mask in the evaporation process. By implementing selective thinning in the display area interval area, while maintaining full thickness in the peripheral area and necessary central area, structural integrity can be maintained while reducing weight. The present application is applicable to various mask configurations, including fine metal mask (FMM), fine ceramic mask (FCM), organic metal mask (OMM), and organic ceramic mask (OCM), to meet different substrate and OLED manufacturing requirements. In addition, by adding a magnetic metal layer on the substrate, adsorption capability can be provided for non-magnetic materials, ensuring the stability and alignment accuracy of the mask in high-resolution OLED manufacturing.

Description

Technical Field

[0001] This invention relates to mask structures for display manufacturing, particularly for manufacturing processes requiring precise material deposition. It incorporates improvements in substrate design and weight optimization to enhance performance and reliability during manufacturing. These innovations are applicable to a variety of display technologies, including organic light-emitting diode (OLED) displays and other high-resolution display systems. Background Technology

[0002] In OLED display manufacturing, precise patterning of the photomask is crucial for accurate material deposition. Application No. 113209991 proposes the concept of a Glass-Substrate Fine Metal Mask (GS-FMM), which uses a rigid glass substrate as the support layer. This structure can manufacture high-precision photomasks with a resolution exceeding 2000ppi, suitable for microOLED applications, and can support the large-size photomasks required in AMOLED production. The rigid substrate of GS-FMM significantly improves the stability, precision, and alignment accuracy during the OLED evaporation process, offering a clear advantage over traditional flexible invar sheet metal masks (FMMs).

[0003] Application number 113212607 further proposes a Glass-Substrate Fine Ceramic Mask (GS-FCM), which utilizes a ceramic aperture layer on a glass substrate. The ceramic material provides higher thermal stability and aperture precision, solving the thermal expansion problem caused by invar-based masks during high-temperature processes, making GS-FCM more suitable for high-temperature OLED processes. Similar to GS-FMM, GS-FCM also supports high-resolution masks for microOLEDs and scalable large-size masks for AMOLEDs, meeting the needs of modern OLED manufacturing.

[0004] While GS-FMM and GS-FCM offer significant improvements in accuracy and stability compared to traditional photomasks, their use of rigid glass substrates results in a substantial overall weight. Compared to traditional invar wafer FMMs, these structures introduce new challenges, particularly regarding potential gravity-induced sagging during the adsorption and material deposition processes. Existing GS-FMM and GS-FCM solutions do not provide specific methods to address these weight-related issues, which can impact alignment accuracy and deposition uniformity in large-scale OLED production.

[0005] Meanwhile, US Patent No. 9385323B2 proposes a silicon-substrate fine silicon mask (SS-FSM) specifically for microOLED manufacturing. SS-FSM uses silicon nitride (Si3N4) as the mask material on the silicon substrate, and its coefficient of thermal expansion is highly matched to that of the silicon wafer, thereby improving alignment accuracy. This silicon-based structure addresses the technical requirement of high-resolution patterning in microOLEDs, but like GS-FMM and GS-FCM, it still faces challenges related to substrate weight during the adsorption and material deposition stages, issues that are not explicitly described in this patent.

[0006] Optimizing the thickness and weight of the substrate (whether glass or silicon) offers a potential solution to the adhesion problem caused by substrate weight. By selectively thinning the spacing between display areas, the overall weight of the photomask can be significantly reduced while maintaining the structural stability required for precise alignment and high-resolution material deposition. Summary of the Invention

[0007] This invention provides an optimized photomask structure for OLED display manufacturing, addressing the weight-related challenges and limitations of existing designs such as GS-FMM, GS-FCM, and SS-FSM. This invention significantly reduces the overall weight of the photomask by selectively thinning the thickness within the substrate's spacing regions, while maintaining the alignment accuracy and structural strength required for the material deposition process.

[0008] This photomask structure is suitable for both glass and silicon substrates and supports various configurations, including precision metal photomasks (FMM), precision ceramic photomasks (FCM), metal-organic photomasks (OMM), and ceramic-organic photomasks (OCM). By reducing the thickness of the spacer region, this invention improves adsorption performance, reduces gravity-induced sagging, enhances alignment accuracy, and ensures deposition uniformity and high resolution in OLED manufacturing processes.

[0009] This invention offers high flexibility in thinning the spacer region, enabling uniform thinning across the entire area or selective thinning of specific regions, such as preserving the full thickness of the central spacer region to provide additional structural support. This adaptability allows the photomask structure to meet a variety of production needs, including large-scale AMOLED manufacturing and high-precision microOLED applications.

[0010] To overcome the limitations of non-magnetic materials such as glass or ceramics in the adsorption process, this invention introduces a magnetic metal layer onto the substrate. This metal layer generates the necessary magnetic force to ensure stable alignment and operation during the evaporation process, thereby expanding the application range of photomasks on non-magnetic substrates and improving stability and precision under different manufacturing environments.

[0011] This invention combines multiple advanced manufacturing methods to achieve selective thinning of the spacer region, including wet etching, dry etching, and the use of protective photoresist (PR) coatings or UV dicing films to maintain the structural and functional integrity of the photomask. These methods enable precise control of the thickness distribution while ensuring the durability of the photomask during the manufacturing process.

[0012] By addressing issues of weight optimization, adsorption efficiency, and structural stability, this invention provides a versatile and scalable solution for OLED manufacturing. It enhances the overall performance of photomasks on glass and silicon substrates, facilitating their application in high-resolution displays and large-scale production environments. This innovation improves the reliability, precision, and efficiency of photomask structures, representing a significant advancement in the manufacturing of OLEDs and other advanced display technologies. Attached Figure Description

[0013] Figure 1 A illustrates the basic structure of a glass substrate fine metal mask (GS-FMM) for micro-OLED applications, demonstrating the arrangement of the display area and the spacer areas between the display areas. Figure 1 B Showcase Figure 1 The cross section along line AA' in section A illustrates the uniform structure and alignment characteristics of the masking assembly.

[0014] Figure 2 Describe the adsorption process of GS-FMM with micro OLED substrates in the evaporation chamber. Figure 2 A shows the state before adsorption, at which point gravity causes the GS-FMM to sag, especially in the display area. Figure 2 B shows the state after adsorption. The magnetic force generates an upward adsorption force to counteract gravity, allowing the GS-FMM to be precisely aligned on the micro OLED substrate.

[0015] Figure 3 Further, cross-sectional views of GS-FMM under different display area thickness reduction configurations are shown. Figure 3 A shows that the thickness of all display areas is uniformly reduced to 50%, effectively reducing the downward gravitational force. Figure 3 B showcases an alternative design where the thickness of all display area partitions, except for the central area, is reduced to 50%, which reduces the effect of gravity while increasing support rigidity.

[0016] Figure 4 This document details the manufacturing process that enables the thinning of the display area interlayer. Figure 4 After completing the front metal pattern, A applies a front protective photoresist (PR) layer and patterns the first back photoresist. Figure 4 B shows the initial etching step, in which the display area and the space between the display areas are etched to a thickness of 50%, and then the photoresist is removed. Figure 4 C patterns the second back-side photoresist, exposing only the display area for further processing. Figure 4 D shows the final etching step, which further etches the display area to completely remove the glass substrate in that area.

[0017] Figure 5 This paper introduces another manufacturing process for achieving thinning of the display area interlayer. Figure 5 After completing the front metal pattern, A applies a front protective photoresist (PR) and then patterns the first back photoresist. Figure 5 B shows the first step of the etching process, which reduces the thickness of the display area to 50%, followed by the removal of the photoresist. Figure 5 C patterns the second back-side photoresist. Figure 5 The final etching step involves further etching the remaining display area and the 50% display area gap to complete the mask structure.

[0018] Figure 6 Several mask examples with thinned display area spacing structures are provided. Figure 6 Display A shows an example of a GS-FCM with a thinned display area spacing region. Figure 6 B illustrates an example of an SS-FMM with a similar design. Figure 6 C describes an example of an SS-FCM with a thinned display area interstic. Figure 6 D shows an example of a GS-OMM with a similar configuration.

[0019] Figure 7 Focusing on GS-FMM designed specifically for AMOLED production. Figure 7 A shows a top view of the GS-FMM, which has a grid layout with 17 columns and 5 rows of display areas. Figure 7 B Showcase Figure 7 The cross section along line BB' in section A illustrates the thinned display area interval designed to reduce weight while maintaining structural integrity. Detailed Implementation

[0020] Figure 1 A top view illustrating a glass substrate fine metal mask (GS-FMM) used in the production of micro-OLEDs. The mask consists of a glass substrate 11 on which a grid of micro-OLED fine metal mask (FMM) display areas 12 are arranged. The display areas 12 are separated by display area spacing areas 14, maintaining a uniform thickness across the entire substrate. A peripheral region 13 surrounding the grid enhances the structural stability of the glass substrate 11, ensuring the mask can withstand operating pressures and processing loads during OLED deposition.

[0021] Figure 1 B Display Figure 1A cross-section along line AA' is shown in section A. This cross-section highlights the uniform thickness of the glass substrate 11 in the display area spacing region 14 and the peripheral region 13. A metal patterned mask layer 20 is deposited on the front side of the display area 12 to form a precision template for precisely depositing material onto the underlying micro-OLED substrate 15. The uniform thickness of the display area spacing region 14 enhances the rigidity of the mask structure, preventing deformation during adsorption and material deposition.

[0022] Figure 2 A depicts a cross-sectional view of the GS-FMM placed below the micro-OLED substrate 15 before adsorption in the evaporation chamber. At this time, the GS-FMM is supported by the substrate support 16, and the adsorption magnet 17 is inactive. The downward force 18 causes the GS-FMM to sag, particularly at the display area spacing region 14. While the uniform thickness of the GS-FMM provides structural rigidity, the weight of the display area spacing region 14 and the surrounding area 13 increases the overall load. An excessively heavy GS-FMM may exacerbate sagging, leading to alignment errors with the micro-OLED substrate 15 and consequently, uneven material deposition.

[0023] Figure 2 B shows the GS-FMM after adsorption. The adsorption magnet 17 generates an upward magnetic force 19 to counteract the downward gravity 18. This upward magnetic force 19 enables the GS-FMM to be precisely aligned onto the micro OLED substrate 15, eliminating sagging and ensuring that the FMM display area 12 is precisely aligned with the target substrate.

[0024] To strike a balance between weight reduction and maintaining structural rigidity, the GS-FMM design can employ a strategy of thinning non-critical areas (such as the display area spacing 14) while retaining sufficient material thickness in load-bearing areas such as the peripheral area 13. Thinning the display area spacing 14 reduces the overall weight of the GS-FMM, decreases the gravitational load 18 acting on the mask, and reduces the magnetic force 19 required by the adsorption system (adsorption magnet 17). However, the design must ensure that sufficient material is retained while reducing weight to maintain the rigidity of the mask during the vapor deposition process, preventing deformation or misalignment.

[0025] The GS-FMM structure optimization enhances adsorption performance while maintaining deposition accuracy. By reducing the weight of the display area spacer 14 and distributing the force more evenly in the surrounding area 13, the required stable adsorption upward magnetic force 19 can be minimized, thereby improving the overall efficiency and accuracy of the vapor deposition process.

[0026] The GS-FMM is built on a glass substrate 11 of a standard 300mm glass wafer. The wafer has a total area of ​​approximately 70,686 square millimeters and a uniform thickness of 0.5 millimeters. The mask comprises 128 grid-arranged FMM display areas 12, separated by horizontal and vertical display area spacing areas 14, each spacing area 14 being 4 millimeters wide. These display area spacing areas 14, along with the surrounding peripheral area 13, together enhance the structural integrity of the mask.

[0027] Before any thinning, the total weight of the GS-FMM is approximately 88.36 grams, calculated based on a glass density of 2.5 g / cm³. The FMM display area 12 occupies the main area, covering 38,400 square millimeters (54.3% of the total wafer area); the display area spacing area 14 covers 18,536 square millimeters (26.2%). The FMM display area 12 and the display area spacing area 14 together constitute the main structure of the mask.

[0028] After removing the glass from the FMM display area 12, the display area spacer 14 becomes the main source of the remaining weight of the GS-FMM. Without thinning, the display area spacer 14 weighs approximately 23.17 grams. By reducing the thickness of the display area spacer 14 by 50%, its weight can be reduced to 11.59 grams, resulting in a 29.3% reduction in the total weight of the GS-FMM after removing the glass from the display area 12. The lighter mask is easier to attract and precisely align with the micro-OLED substrate 15 because the upward magnetic force 19 required by the attraction magnet 17 to counteract gravity 18 is significantly reduced.

[0029] This weight reduction strategy achieves precise balance while maintaining structural rigidity. The peripheral area 13 of the GS-FMM retains its full thickness to provide mechanical support; in some cases, the central display area spacing 14 can also maintain a thicker design to improve overall stability. These design choices ensure that the mask remains durable and precisely aligned during OLED evaporation even after the thickness of the display area spacing 14 is reduced.

[0030] Figure 3 A schematic diagram of the cross-section of the GS-FMM during the adsorption process in the evaporation chamber, showing that the thickness of the display area spacer 14 is uniformly reduced to 50% of its original thickness. By reducing the thickness of all display area spacers 14, the overall weight of the GS-FMM can be significantly reduced. This weight reduction decreases the downward gravitational force 18 acting on the mask, thereby minimizing sagging and improving adsorption efficiency. The lighter structure allows the upward magnetic force 19 generated by the adsorption magnet 17 in the adsorption system to more effectively pull the GS-FMM toward the micro-OLED substrate 15, achieving high-precision alignment.

[0031] Figure 3B presents an alternative design in which the thickness of all display area spacing zones 14, except for the central display area spacing zone 14, is reduced to 50% of its original thickness. This design retains the full thickness of the central display area spacing zone 14 to provide additional support and improve the overall structural rigidity of the GS-FMM. Although this design cannot achieve... Figure 3 The scheme shown in A achieves the same weight reduction effect, but strikes a good balance between minimizing weight and ensuring stability, avoiding deformation during the vapor deposition process. In both configurations, the peripheral region 13 maintains its full thickness to further enhance the structural integrity of the mask.

[0032] Both designs emphasize the importance of optimizing the thickness of the display area spacing 14 to achieve weight reduction while maintaining structural stability. Figure 3 A or Figure 3 Design B depends on the specific requirements of the vapor deposition process, such as the mask size, the magnetic strength of the adsorption magnet 17, and the alignment accuracy required for high-quality micro-OLED production.

[0033] Figure 4 A manufacturing method for thinning the display area spacer 14 in a GS-FMM is described. The process employs thick glass etching technology, combined with photoresist (PR) coating, wet etching, and dry etching methods to ensure precise thinning of the display area spacer 14, while protecting the micro-OLED FMM display area 12 covered with a patterned metal pattern mask layer 20 and the peripheral area 13 that provides structural stability.

[0034] exist Figure 4 In step A, after fabricating the front metal pattern of the FMM display area 12 for the micro OLED, a metal pattern mask layer 20 is formed, and then a front protective photoresist 21 is coated on it. Thick photoresist (layered spin coating) is typically used, but a UV-cut film can also be selected to provide stable protection and facilitate uniform coverage on complex topological surfaces. Simultaneously, a first back photoresist 22 is coated and patterned to define the initial etched areas of the display area spacing region 14 and the FMM display area 12.

[0035] Figure 4 B shows the wafer state after the initial etching step is completed, where the display area spacer 14 and the FMM display area 12 have been partially etched, with a thickness reduction of approximately 50%. Depending on the glass material and the required processing precision, the following techniques can be used: Reactive Ion Etching (RIE) – using gases such as CF4, CHF3, SF6, or O2 to perform reactive ion etching (RIE) or deep reactive ion etching (DRIE) to achieve anisotropic profiles and precise depth control.

[0036] Wet etching (Buffered Hydrofluoric Acid, BHF): Buffered hydrofluoric acid (BHF) is the most commonly used etching solution for glass. Additives such as ammonium fluoride can also be added to improve etching uniformity and enhance control over high aspect ratio features.

[0037] After this step, the first back photoresist 22 and the front protective photoresist 21 (or UV cutting film) are removed to prepare for subsequent processing steps.

[0038] Figure 4 C illustrates the coating and patterning process of the second back-side photoresist 23. This photoresist exposes only the FMM display area 12 for further etching. When the substrate has already exhibited significant topology due to the initial etching, a spray coating or multi-layer spin coating process may be necessary to achieve uniform photoresist coverage. The display area spacer 14 is fully protected in this step to maintain the consistency of the thinning thickness.

[0039] Figure 4 D shows the final etching step, in which the remaining glass substrate 11 in the display area 12 is completely removed, forming an opening for material deposition. Wet etching is suitable for large-area material removal, while dry etching enables high-precision edge definition. The second back-side photoresist 23 is then removed, completing the mask fabrication process.

[0040] This manufacturing method reduces the overall weight of the GS-FMM by selectively thinning the display area spacing region 14. The application of a UV-cut film or a thick photoresist coating effectively protects the metal pattern mask layer 20, while advanced etching techniques and coating processes effectively address the processing challenges caused by severe topology. The resulting structure achieves weight optimization while maintaining the required structural rigidity, thereby improving the overall performance of the mask during the OLED evaporation process.

[0041] Figure 5 An alternative manufacturing method for thinning the display area spacer region 14 in a GS-FMM is described, the core of which lies in achieving precise thinning through selective etching steps. This method emphasizes the stepwise etching of the display area 12 and the display area spacer region 14 of the micro-OLED FMM covered by a metal patterned mask layer 20. The processing challenges of severe topology and thick glass substrate 11 are addressed by using advanced photoresist (PR) coating and protective layer processes, thereby ensuring structural integrity throughout the process.

[0042] exist Figure 5In step A, after the front metal pattern of the FMM display area 12 for the micro OLED is fabricated, a metal pattern mask layer 20 is formed, and a front protective layer is coated. Depending on the requirements, the following methods can be used: a UV-cut film is used to provide durable protection and achieve uniform coverage on rough surfaces; or a thick photoresist (PR) is used to ensure uniform adhesion on severely topological surfaces through multi-layer spin coating or spraying.

[0043] Meanwhile, the first back-side photoresist 22 is patterned to precisely define the initial etching area of ​​the FMM display area 12 and the display area spacing area 14 for the micro OLED, thereby ensuring the accuracy of subsequent etching steps.

[0044] Figure 5 B shows the structural state after the first etching step. During this process, the FMM display area 12 for the micro-OLED is partially etched, reducing its thickness by approximately 50%, while the display area spacing area 14 remains unetched. Depending on the precision and uniformity requirements, the following techniques can be used: Dry etching—using gases such as CF4, CHF3, or SF6 to perform anisotropic etching for precise control.

[0045] Wet etching: Buffered hydrofluoric acid (BHF) is used to remove bulk material and a smoother etched surface can be obtained.

[0046] After this step is completed, the first back photoresist 22 and the front protective photoresist 21 are removed to prepare for subsequent processing steps.

[0047] exist Figure 5 In step C, a second back-side photoresist 23 is coated and patterned so that it covers only the peripheral area 13, while the display area spacer 14 and the FMM display area 12 remain exposed for further etching. This patterning method ensures selective etching of the display area spacer 14 and the display area 12 while maintaining the structural integrity of the peripheral area 13. Due to the severe topology generated by the preceding processing, the photoresist coating employs a spraying or multi-layer spin coating process to achieve uniform coverage.

[0048] Figure 5 D illustrates the final etching step, in which the display area spacer 14 is etched to 50% of its original thickness, while the FMM display area 12 is completely etched through, forming an opening for material deposition. This step combines wet etching for efficient material removal with dry etching for fine edge control, achieving high structural precision. After etching, the second back-side photoresist 23 is removed, resulting in a mask structure with a thinned display area spacer 14 and a fully open FMM display area 12, meeting the requirements for micro-OLED material deposition.

[0049] This alternative method achieves high flexibility by separately controlling the thickness reduction of the display area 12 and the display area spacer 14 of the FMM for micro-OLEDs. Advanced photoresist technologies (such as thick photoresist and UV-cut films) combined with wet / dry etching processes ensure the precision and uniformity of the mask structure. By selectively thinning the display area spacer 14, the overall weight of the GS-FMM can be significantly reduced, adsorption performance can be improved, while maintaining the necessary mechanical strength required for the OLED evaporation process.

[0050] Figure 6 The exhibition showcases various mask configurations with a thinned display area spacing structure 14. These designs achieve weight optimization and structural performance improvement based on different substrates and materials used in OLED production.

[0051] Figure 6 Display A shows a glass substrate fine ceramic mask (GS-FCM). The mask is made of a glass substrate 11 on which a micro-OLED FCM display area 24 is formed. The thickness of the display area spacing region 14 is selectively thinned to reduce the weight of the mask. Thickness optimization minimizes sagging caused by downward gravity 18 during the vapor deposition process and improves the adsorption stability provided by the adsorption magnet 17.

[0052] Figure 6 B depicts a fine metal mask (SS-FMM) on a silicon substrate. The silicon substrate 25 provides a lightweight and highly rigid support for carrying the metal pattern of the FMM display area 12 for a micro OLED. The display area spacing area 14 is thinned to reduce weight while maintaining sufficient structural rigidity for high-resolution material deposition.

[0053] Figure 6 C illustrates a silicon-based fine ceramic mask (SS-FCM). This mask combines the high rigidity of the silicon substrate 25 with a micro-OLED FCM display area 24 formed from ceramic material. The thinning of the display area spacing region 14 significantly reduces the mask weight while maintaining structural support capabilities for large-scale OLED production.

[0054] Figure 6 D illustrates a glass-substrate metal-organic mask (GS-OMM). The glass substrate 11 supports the metal pattern of the OMM display area 26 for micro-OLEDs, providing high design flexibility for OLED deposition. The reduced thickness of the display area spacing region 14 reduces the mask weight, giving it both structural strength and deposition accuracy, making it suitable for high-load manufacturing environments.

[0055] Figure 6The various masking structures illustrate the versatility of the thinning design of the display area spacing region 14, which can be applied to different substrate and material combinations. This invention can be applied to GS-FMM, GS-FCM, SS-FMM, SS-FCM, GS-OMM, GS-OCM, SS-OMM, and SS-OCM. By reducing the weight of the display area spacing region 14, the adsorption performance can be improved, the downward gravity load 18 can be reduced, and high-precision alignment and uniform material deposition with the micro OLED substrate 15 can be ensured.

[0056] Figure 7 This paper describes a GS-FMM structure for AMOLED production. By arranging multiple AMOLED FMM display areas 27 on a large-area mask and thinning the display area spacing area 14 to reduce weight, the adsorption efficiency can be significantly improved.

[0057] Figure 7 A top view of the GS-FMM shows a grid layout of 17 columns and 5 rows for AMOLED FMM display areas 27. Each AMOLED FMM display area 27 is separated by display area spacing regions 14, which not only provide structural support but also ensure stable alignment during the vapor deposition process. The display area spacing regions 14 are strategically thinned to reduce mask weight while maintaining the rigidity required to prevent deformation.

[0058] Figure 7 B Exhibition Area Figure 7 A cross-section of line BB' in section A. The AMOLED FMM display area 27 is completely etched through to form vapor deposition openings, while the thickness of the display area spacer 14 is reduced to 50% of its original thickness. The peripheral area 13 remains at full thickness to provide structural support. The reduced mask weight decreases the downward gravity load 18, allowing the upward magnetic force 19 generated by the adsorption magnet 17 to more effectively counteract gravity, thereby ensuring precise alignment with the AMOLED substrate.

[0059] By combining a dense layout of AMOLED FMM display areas 27 with a reduction in the thickness of the display area spacing regions 14, GS-FMM achieves a good balance between weight optimization and structural stability. This characteristic is crucial for high-resolution AMOLED production, ensuring consistent and precise material deposition across all AMOLED FMM display areas 27.

[0060] The GS-FMM is constructed based on a large-size glass substrate 11 of 1500mm × 925mm, suitable for large-area AMOLED production. The mask layout includes 17 columns and 5 rows of AMOLED FMM display areas 27 arranged in a 16:9 aspect ratio. Each AMOLED FMM display area 27 has an area of ​​approximately 9905 square millimeters, with a total display area of ​​841909 square millimeters, accounting for 60.7% of the total area of ​​the glass substrate 11.

[0061] The total area of ​​the display area spacing regions 14 is 220,468.8 square millimeters, accounting for 15.9% of the total area of ​​the glass substrate 11. These display area spacing regions 14 separate adjacent AMOLED FMM display areas 27 with widths of 10 mm and 20 mm in the horizontal and vertical directions, respectively. Their function is to provide structural support during the evaporation process while maintaining the alignment accuracy between the AMOLED FMM display areas 27 and the substrate.

[0062] With a glass substrate 11 thickness of 0.5 mm and a density of 2.5 g / cm³, the total weight of the GS-FMM is approximately 1734.38 g. After removing the glass from the AMOLED FMM display area 27, the remaining weight of the GS-FMM is approximately 681.99 g, of which the weight of the display area spacing area 14 is 275.59 g, accounting for 40.4% of the remaining weight.

[0063] By reducing the thickness of the display area partition 14 by 50%, its weight is reduced to 137.80 grams, further reducing the total weight of the GS-FMM after removing the display glass by approximately 20.2%. This significant weight reduction reduces the downward gravitational force 18 acting on the mask, thereby reducing the load on the adsorption system and improving the working efficiency of the adsorption magnet 17.

[0064] Even with the reduction in thickness of the display area spacing region 14, the GS-FMM maintains its structural integrity by preserving the full thickness of the peripheral region 13 and, in some designs, the full thickness of the central display area spacing region 14. This design ensures that the mask remains sufficiently rigid after thickness reduction to avoid deformation during the vapor deposition process, while achieving the weight optimization required for AMOLED production.

[0065] The masking structure also includes a silicon substrate-organic metal mask (SS-OMM) and a silicon substrate-organic ceramic mask (SS-OCM). These structures combine the silicon substrate 25 with the metal or ceramic masking layer to provide a lightweight and highly rigid support base. The display area spacing region 14 on the silicon substrate 25 can be thinned to optimize weight, thereby improving its adsorption and deposition performance in the OLED evaporation process.

[0066] For configurations including glass substrate fine metal mask (GS-FMM), glass substrate fine ceramic mask (GS-FCM), glass substrate organometallic mask (GS-OMM), glass substrate organoceramic mask (GS-OCM), silicon substrate fine metal mask (SS-FMM), silicon substrate fine ceramic mask (SS-FCM), silicon substrate organometallic mask (SS-OMM), and silicon substrate organoceramic mask (SS-OCM), when the mask material or substrate material lacks magnetism, an additional magnetic metal layer can be formed on the front side of the substrate. This magnetic metal layer provides the necessary upward magnetic force 19 to counteract the downward gravity 18, thereby ensuring precise alignment during the vapor deposition process.

[0067] The thickness reduction ratio of the display area spacing region 14 can be flexibly adjusted according to design requirements, ranging from 10% to 90% of the original thickness. In some designs, all display area spacing regions 14 can be uniformly thinned; in other designs, selective thinning is also possible, for example, retaining the full thickness of the display area spacing region 14 near the central area to provide additional support. The thinning profile of the display area spacing region 14 can also employ different strategies between the rows and columns of the AMOLED FMM display area 27 to achieve the optimal balance between weight reduction and structural rigidity, thereby meeting the requirements of different OLED manufacturing processes.

[0068] Symbol Explanation 11: Glass substrate 12: FMM display area for micro OLED 13: Surrounding Area 14: Display area interval 15: Micro OLED substrate 16: Substrate support 17: Adsorption magnet 18: Downward gravity 19: Upward magnetic force 20: Metallic Pattern Masking Layer 21: Front-side protective photoresist 22: First back side photoresist 23: Second back side photoresist 24: FCM display area for micro OLED 25: Silicon substrate 26: OMM display area for micro OLED 27: AMOLED uses FMM display area.

Claims

1. A glass substrate fine metal mask (GS-FMM) or glass substrate fine ceramic mask (GS-FCM) for OLED display production, comprising: Glass substrate, including: The peripheral area located at the edge of the substrate; The display area interval is located between display areas; A mask layer made of metal or ceramic and aligned with the display area, used for material deposition; The thickness of one or more portions of the glass substrate in the display area spacing region is reduced compared to the surrounding area to reduce the overall weight of the mask.

2. A silicon substrate fine metal mask (SS-FMM) or silicon substrate fine ceramic mask (SS-FCM) for OLED display production, comprising: Silicon substrate, including: The peripheral area located at the edge of the substrate; The display area interval is located between display areas; A mask layer made of metal or ceramic and aligned with the display area, used for material deposition; The thickness of one or more portions of the silicon substrate in the display area spacing region is reduced compared to the surrounding region to reduce the overall weight of the mask.

3. A glass substrate organometallic mask (GS-OMM) or glass substrate organoceramic mask (GS-OCM) for OLED display production, comprising: Glass substrate, including: The peripheral area located at the edge of the substrate; The display area interval is located between display areas; A mask layer made of metal or ceramic and aligned with the display area, used for material deposition; The thickness of one or more portions of the glass substrate in the display area spacing region is reduced compared to the surrounding area to reduce the overall weight of the mask.

4. A silicon substrate organometallic mask (SS-OMM) or silicon substrate organoceramic mask (SS-OCM) for OLED display production, comprising: Silicon substrate, including: The peripheral area located at the edge of the substrate; The display area interval is located between display areas; A mask layer made of metal or ceramic and aligned with the display area, used for material deposition; The thickness of one or more portions of the silicon substrate in the display area spacing region is reduced compared to the surrounding region to reduce the overall weight of the mask.

5. The mask according to any one of claims 1 to 4, wherein the thickness reduction of the display area spacing minimizes gravity-induced sagging during the vapor deposition process, thereby improving the mask's adsorption performance.

6. The mask according to any one of claims 1 to 4, wherein an additional magnetic metal layer is formed on the substrate to achieve magnetic adsorption during the vapor deposition process.

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