A radio frequency detection assembly suitable for small electronic products

Abstract

The application discloses a radio frequency detection assembly suitable for small electronic products and relates to the technical field of radio frequency detection, which comprises a radio frequency probe base, an electronic chip signal probe arranged on one side of the top of the radio frequency probe base, an electronic chip GND probe arranged on the other side of the top of the radio frequency probe base, a switching signal probe arranged on one side of the bottom of the radio frequency probe base and a switching GND probe arranged on the other side of the bottom of the radio frequency probe base. The electronic chip signal probe, the electronic chip GND probe, the switching GND probe and the switching signal probe are all telescopic contact test point components, so that the probes can produce a certain length of displacement when contacting the chip pads to be measured, thereby offsetting the PCB thickness measurement error. In combination with the structure design of the radio frequency probe base as a rigid installation reference, the integrity of signal transmission and the accuracy of test data are ensured, and the damage of rigid contact to the chip golden fingers is avoided.

Description

Technical Field

[0001] This invention relates to the field of radio frequency detection technology, and more specifically to a radio frequency detection component suitable for small electronic products. Background Technology

[0002] Radio frequency (RF) probes are precision interfaces that integrate precision mechanics, high-frequency electromagnetic design, and advanced materials. They are used to test the internal performance of existing electronic products (earphones, smartwatches). In scenarios where signal testing points are small, one end of the RF probe contacts the chip of the electronic product, while the other end is connected to the instrument via an SMPM RF cable.

[0003] In existing RF testing solutions, during testing, one end of the RF probe serves as the test front end, used to contact the chip pads of the electronic product under test. The other end of the RF probe is directly connected to external instruments such as network analyzers or comprehensive testers via SMPM RF cables. When the automated test equipment is started, the fixture mechanism drives the RF probe to press down vertically, so that the probe front end contacts and conducts with the chip pads. The high-frequency signal is then transmitted to the instruments sequentially through the probe body and SMPM RF cables to complete signal acquisition and analysis.

[0004] However, the RF probe and the SMPM RF cable are directly connected. The pressure generated when the clamping mechanism presses down is directly transmitted to the connection interface between the probe and the cable, causing relative offset deformation at this point, which damages the stability of the contact connection. Furthermore, under long-term, high-frequency testing conditions, repeated offset friction will accelerate the wear of the RF cable connector and the probe tail, shortening their service life. Most of the contacts of existing RF probes are non-extensible rigid structures, which are prone to crush damage to the chip gold fingers due to overpressure contact when facing PCB board thickness tolerances or clamp stroke errors. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a radio frequency detection component suitable for small electronic products, which can effectively solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a radio frequency detection component suitable for small electronic products, including a radio frequency probe base. An electronic chip signal probe is disposed on one side of the top of the radio frequency probe base, and an electronic chip GND probe is disposed on the other side of the top of the radio frequency probe base. A transfer signal probe is disposed on one side of the bottom of the radio frequency probe base, and a transfer GND probe is disposed on the other side of the bottom of the radio frequency probe base. An insulating connector is provided, through which the electronic chip signal probe and the transfer signal probe are connected to the radio frequency probe base.

[0007] Furthermore, the electronic chip signal probe and the electronic chip GND probe are used to contact the chip of the electronic product after the clamping mechanism moves, and the adapter GND probe and the adapter signal probe are used to connect to the radio frequency adapter board.

[0008] Furthermore, the electronic chip signal probe, electronic chip GND probe, adapter GND probe, and adapter signal probe are all retractable contact test point components at the opposite end to the RF probe base.

[0009] Furthermore, the electronic chip signal probe, electronic chip GND probe, adapter GND probe, and adapter signal probe are all mounted on the radio frequency probe base in a pluggable manner.

[0010] Furthermore, both the GND adapter probe and the signal adapter probe are connected to external instruments via an SMA RF cable.

[0011] Furthermore, the radio frequency probe base has fixing protrusions on both sides of its bottom, and each of the two fixing protrusions has a through hole at its top.

[0012] The technical solution provided by this invention has the following advantages compared with the known prior art: 1. This application uses retractable contact test point components for the electronic chip signal probe, electronic chip GND probe, adapter GND probe, and adapter signal probe, so that the probe can generate a certain length displacement when it contacts the pad of the chip under test, thereby offsetting the PCB board thickness measurement error. Combined with the structural design of the RF probe base as a rigid mounting reference, it not only ensures the integrity of signal transmission and the accuracy of test data, but also avoids the pressure damage to the chip gold fingers caused by rigid contact.

[0013] 2. This application tests the chip's performance by connecting the RF probe to the chip pads, thereby selecting chips that meet the usage specifications. The RF probe is converted to SMPM via SMA, which improves stability during use, saves personnel debugging time and costs, and prevents data errors caused by factors such as the movement of the fixture mechanism from affecting the chip selection judgment. By using the conversion probe, the offset, deformation and friction between the RF probe base and the SMPM line can be avoided, thereby improving the service life of the RF probe and RF line and saving costs. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of a radio frequency detection component applicable to small electronic products according to the present invention; Figure 2 This is a side view of a radio frequency detection component applicable to small electronic products according to the present invention. Figure 3 This is a schematic diagram of the top structure of a radio frequency detection component applicable to small electronic products according to the present invention.

[0016] The labels in the diagram represent: 1. Electronic chip signal probe; 2. Electronic chip GND probe; 3. RF probe base; 4. Adapter GND probe; 5. Adapter signal probe; 6. Insulating connector; 7. Fixing bump. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] The following is in conjunction with the appendix Figures 1-3 This application will be described in further detail.

[0019] This application discloses a radio frequency (RF) detection assembly suitable for small electronic products, including an RF probe base 3. An electronic chip signal probe 1 is disposed on one side of the top of the RF probe base 3, an electronic chip GND probe 2 is disposed on the other side of the top of the RF probe base 3, a transfer signal probe 5 is disposed on one side of the bottom of the RF probe base 3, and a transfer GND probe 4 is disposed on the other side of the bottom of the RF probe base 3; an insulating connector 6 is used to connect the electronic chip signal probe 1 and the transfer signal probe 5 to the RF probe base 3.

[0020] Reference Appendix Figure 1The electronic chip signal probe 1 and electronic chip GND probe 2 are used to contact the chip of the electronic product after the fixture mechanism moves. The adapter GND probe 4 and adapter signal probe 5 are used to connect the RF adapter board. The RF probe base 3 serves as a fixed bridge in the middle. When the test fixture is pressed down, the force is directly applied to the RF probe base 3. The front probe extends and retracts to contact the chip pad, while the adapter probe at the rear end remains stationary and connected to the RF adapter board, thereby physically isolating the mechanical action from the electrical transmission path.

[0021] Reference Appendix Figure 1 Among them, the electronic chip signal probe 1, electronic chip GND probe 2, adapter GND probe 4 and adapter signal probe 5 are all retractable contact test point components on the opposite end of the RF probe base 3. The retractable structure allows the probe to produce a certain length displacement when it contacts the test point, thereby offsetting the PCB board thickness measurement error and avoiding rigid contact that could damage the chip's gold fingers.

[0022] Reference Appendix Figure 1 The electronic chip signal probe 1, electronic chip GND probe 2, adapter GND probe 4 and adapter signal probe 5 are all installed on the RF probe base 3 in a pluggable manner. When one of the probes is damaged due to long-term use, the damaged single probe can be simply pulled out and replaced.

[0023] Reference Appendix Figure 1 Both the GND probe 4 and the signal probe 5 are connected to external instruments via SMA RF cables. The SMA interface has a more stable mechanical locking force, and the probes at the adapter end will not shake when the external cable is pulled, thus avoiding the situation where the test signal increases due to poor contact.

[0024] Reference Appendix Figure 2 and 3 The RF probe base 3 has fixing protrusions 7 on both sides of its bottom. The top of each fixing protrusion 7 has a through hole. The fixing protrusions 7 are used to fix the RF probe base 3 to the mounting plate of the test fixture. The screws are inserted into the through holes to achieve precise positioning and installation, preventing the base from loosening or shifting during repeated high-frequency tests.

[0025] The workflow of this invention is as follows: First, precisely secure the RF probe base 3 to the carrier plate or mounting plate of the test fixture using screws through the fixing protrusions 7 and through holes on both sides of its bottom, ensuring that the base remains stable and does not shift during subsequent high-frequency repetitive operations. Next, align and press the GND adapter probe 4 and signal adapter probe 5 onto the corresponding signal and ground pads of the RF adapter board. Connect the output of the RF adapter board to external instruments such as a network analyzer or comprehensive tester via an SMA to SMPM RF cable. After completing the hardware connection, start the automated test equipment; the fixture mechanism will drive the entire RF probe assembly vertically. When pressed down in a straight direction, the electronic chip signal probe 1 and electronic chip GND probe 2 located on the top of the RF probe base 3 make precise contact with the chip test pads of the small electronic product under test (such as a Bluetooth headset motherboard or smartwatch PCB) as the fixture moves. At the moment of contact, the high-frequency test signal is input from the chip pad through the electronic chip signal probe 1, passes through the signal transmission path inside the RF probe base 3, and is output to the RF adapter board through the transfer signal probe 5 isolated and protected by the insulating connector 6. Finally, it is stably transmitted to the instrument through the SMA RF cable to complete the data acquisition and analysis.

[0026] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A radio frequency detection component suitable for small electronic products, characterized in that, include: Radio frequency probe base (3), an electronic chip signal probe (1) is provided on one side of the top of the radio frequency probe base (3), an electronic chip GND probe (2) is provided on the other side of the top of the radio frequency probe base (3), a transfer signal probe (5) is provided on one side of the bottom of the radio frequency probe base (3), and a transfer GND probe (4) is provided on the other side of the bottom of the radio frequency probe base (3). The electronic chip signal probe (1) and the transfer signal probe (5) are connected to the radio frequency probe base (3) through the insulating connector (6).

2. The radio frequency detection component for small electronic products according to claim 1, characterized in that: The electronic chip signal probe (1) and electronic chip GND probe (2) are used to contact the chip of the electronic product after the clamping mechanism is activated. The adapter GND probe (4) and adapter signal probe (5) are used to connect the radio frequency adapter board.

3. The radio frequency detection component for small electronic products according to claim 1, characterized in that: The electronic chip signal probe (1), electronic chip GND probe (2), adapter GND probe (4) and adapter signal probe (5) are all retractable contact test point components on the opposite side of the radio frequency probe base (3).

4. The radio frequency detection component suitable for small electronic products according to claim 1, characterized in that: The electronic chip signal probe (1), electronic chip GND probe (2), adapter GND probe (4) and adapter signal probe (5) are all installed on the radio frequency probe base (3) in a pluggable manner.

5. The radio frequency detection component for small electronic products according to claim 1, characterized in that: The GND probe (4) and signal probe (5) are both connected to external instruments via SMA RF cables.

6. The radio frequency detection component for small electronic products according to claim 1, characterized in that: The radio frequency probe base (3) has fixed protrusions (7) on both sides of its bottom, and the top of each of the two fixed protrusions (7) has a through hole.

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