A handling apparatus and a handling method thereof

Abstract

The application discloses a conveying device and a conveying method thereof, and belongs to the technical field of silicon wafer conveying, which comprises a feeding mechanism for feeding silicon wafers and silicon wafer boxes, a positioning mechanism arranged above the feeding mechanism and used for positioning the silicon wafer boxes, and a putting mechanism arranged on the positioning mechanism and used for putting the silicon wafers in the silicon wafer boxes; the conveying device integrates multiple functions of feeding, positioning, cover taking, wafer putting and cover resetting, and realizes full-process automation from wafer box feeding to wafer putting through orderly and cooperative operation among the mechanisms; the put-in mechanism is arranged to automatically unlock and clamp the box cover; when the cover is opened, the supporting column can reliably support the slope clamping block to release the locking, and meanwhile, the folding block drives the clamping column block to clamp the butt joint column, so that the box cover is smoothly lifted; when the cover is closed, the pressing plate can be accurately reset below the slope clamping block to be locked again, and the whole process is smooth, so that the box cover is prevented from slipping, colliding or damaging the structure of the silicon wafer box.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer handling technology, and in particular to a handling device and a handling method thereof. Background Technology

[0002] In the semiconductor and photovoltaic manufacturing industry, silicon wafers are a core basic material, and the cleanliness and integrity of their production, transportation, and storage processes are crucial. Silicon wafers are typically placed vertically in dedicated wafer boxes and sealed with lids during transportation or temporary storage to prevent contamination and physical damage. In automated production lines, wafer boxes filled with silicon wafers need to be automatically transported to designated workstations, with automatic lid opening, wafer picking and placing, and subsequent lid repositioning. Currently, common silicon wafer handling methods mostly rely on manual operation or semi-automated equipment, which suffers from low efficiency, insufficient positioning accuracy, and susceptibility to contamination or microcracks in the wafers. Especially in the lid opening and wafer placement stages, traditional equipment is often complex in structure and cumbersome in operation, making it difficult to efficiently and damage-free complete the clamping, opening, and precise repositioning of the lid within confined spaces. Furthermore, micro-dust may adhere to the surface of the silicon wafers after placement; if they proceed directly to the next process, it will affect product quality. While some existing technologies offer automated material handling solutions, their positioning mechanisms often suffer from poor adaptability and incompatibility with silicon wafer boxes of different sizes. Furthermore, insufficient coordination between the capping and wafer placement mechanisms leads to disjointed processes and impacts overall cycle time. Additionally, the lack of on-the-spot cleaning functionality during wafer placement makes it difficult to meet the requirements of high-cleanliness production environments. Therefore, there is an urgent need for a highly integrated, precisely positioned, fully automated material handling system capable of automatically completing capping, wafer placement, coarse cleaning, and capping re-capping actions to improve production efficiency and product yield. Summary of the Invention

[0003] To address the aforementioned technical problems, the present invention adopts the following technical solution: a handling device, comprising a feeding mechanism for feeding silicon wafers and silicon wafer boxes, the feeding mechanism comprising a conveyor frame, a positioning mechanism for positioning the silicon wafer box above the feeding mechanism, and an placement mechanism for placing the silicon wafers inside the silicon wafer box onto the positioning mechanism, the placement mechanism comprising an upper frame; Four elastic plates are fixedly installed on the silicon wafer box. Slope blocks are fixedly installed on the upper end of the elastic plates. Slope blocks are provided with slopes. In the initial state, a box cover is placed on the silicon wafer box. A clamping column is fixedly installed on the silicon wafer box. A clamping plate is slidably installed on the clamping column. A clamping spring is provided between the clamping plate and the box cover. Two docking columns are provided on the clamping plate. The clamping plate is located below the four slope blocks. The clamping spring is in a compressed state. Multiple silicon wafers are vertically placed inside the silicon wafer box.

[0004] Furthermore, the feeding mechanism includes a positioning bar fixedly installed on the conveyor frame, two conveyor wheels rotatably installed on the conveyor frame, a conveyor belt wrapped around the two conveyor wheels, a conveyor motor fixedly installed on the conveyor frame, the conveyor motor driving the conveyor wheels to rotate through the input belt, a front-end electric cylinder fixedly installed on the conveyor frame, and a front-end positioning rod fixedly installed on the output end of the front-end electric cylinder. In use, the silicon wafer box is placed on the conveyor belt.

[0005] Furthermore, a rear motor is fixedly installed on the conveyor frame, and a rear positioning rod is rotatably installed on the conveyor frame. The rear motor drives the rear positioning rod to rotate through a rear belt. A side motor is fixedly installed on the conveyor frame, and a side lead screw is rotatably installed on the conveyor frame. The side lead screw has two sections of threads with opposite thread directions. The side lead screw is fixedly installed on the motor shaft of the side motor. Two side positioning plates are slidably installed on the conveyor frame. The two side positioning plates and the two sections of threads of the side lead screw respectively form threaded transmission.

[0006] The wafer box filled with silicon wafers is placed on the conveyor belt. Initially, the retaining block holds the clamping plate in place. Under the action of the clamping spring, the clamping plate presses the box cover onto the wafer box, sealing it. The front electric cylinder extends, causing the front positioning rod to move upward and extend. The conveyor motor drives the conveyor wheel to rotate via the input belt. The conveyor wheel drives the conveyor belt to rotate, and the conveyor belt transports the wafer box forward. When the wafer box contacts the front positioning rod, the conveyor motor stops rotating. The rear motor drives the rear positioning rod to rotate via the rear belt. The rear and front positioning rods position the wafer box in the front-to-back direction. The side motor rotates, causing the side lead screw to rotate. The side lead screw drives the two side positioning plates to move inward simultaneously, positioning the wafer box in the left-to-right direction.

[0007] Furthermore, the positioning mechanism includes a positioning frame, on which two left and right electric cylinders and two front and rear electric cylinders are fixedly mounted. Two left and right rotating rods are rotatably mounted on the output ends of the left and right electric cylinders, and left and right clamping rods are rotatably mounted on the left and right rotating rods. The left and right clamping rods are rotatably mounted to the positioning frame. Two front and rear rotating rods are rotatably mounted on the output ends of the front and rear electric cylinders, and front and rear clamping rods are rotatably mounted on the front and rear rotating rods. The front and rear clamping rods are rotatably mounted to the positioning frame. Two left and right clamping blocks and two front and rear clamping blocks are slidably mounted on the positioning frame. The left and right clamping blocks are rotatably mounted to the front and rear clamping rods, and the front and rear clamping blocks are rotatably mounted to the left and right clamping rods.

[0008] The positioning frame descends to the outside of the silicon wafer box. The left and right electric cylinders retract, causing the left and right rotating rods to rotate. The left and right rotating rods drive the left and right clamping rods to rotate. The left and right clamping rods drive the front and rear clamping blocks to move inward. At the same time, the front and rear electric cylinders retract, causing the front and rear rotating rods to rotate. The front and rear rotating rods drive the front and rear clamping rods to rotate. The front and rear clamping rods drive the left and right clamping blocks to move inward. The silicon wafer box is repositioned by the two front and rear clamping blocks and the two left and right clamping blocks to facilitate the removal of the cover.

[0009] Furthermore, the insertion mechanism includes a frame, on which a lifting motor is fixedly mounted, and a lifting screw is rotatably mounted. The lifting motor drives the lifting screw to rotate via a lifting belt. A lifting block is slidably mounted on the frame, and the lifting block and the lifting screw form a threaded transmission. A rotating motor is fixedly mounted on the lifting block, and a motor gear is fixedly mounted on the motor shaft of the rotating motor. A rotating frame is rotatably mounted on the lifting block, and a rotating gear is fixedly mounted on the rotating frame. The rotating gear meshes with the motor gear.

[0010] Furthermore, a picking motor is fixedly installed on the rotating frame, a picking seat is rotatably installed on the rotating frame, the picking seat is fixedly installed on the motor shaft of the picking motor, a rotating arm motor is fixedly installed on the picking seat, a rotating arm is rotatably installed on the picking seat, the rotating arm motor drives the rotating arm to rotate through the rotating arm belt, a suction cup motor is rotatably installed on the rotating arm, and a suction cup is fixedly installed on the motor shaft of the suction cup motor.

[0011] Furthermore, a connecting frame is fixedly installed on the rotating frame, and an upper frame is slidably installed on the connecting frame. The upper frame is provided with four protruding columns, which slide in the four sliding grooves of the connecting frame respectively. Four sets of shock-absorbing springs are provided between the upper frame and the connecting frame. An inner electric cylinder is fixedly installed on the upper frame, and a docking frame is fixedly installed on the output end of the inner electric cylinder. Four spreading columns and two closing blocks are fixedly installed on the docking frame, and two slopes are provided on the closing blocks.

[0012] Furthermore, two external electric cylinders are fixedly installed on the upper frame, a positioning frame is fixedly installed on the upper frame, a clamping frame is slidably installed on the positioning frame, the clamping frame is fixedly installed with the output end of the external electric cylinders, and two sets of clamping column modules are provided on the clamping frame. The clamping column module includes two clamping column blocks slidably installed on the clamping frame, a conical block is fixedly installed on the clamping column block, the conical block is provided with a slope, a spring is provided between the two conical blocks, the slope of the conical block cooperates with the slope of the closing block, and an arc-shaped notch is provided on the clamping column block.

[0013] Furthermore, a cleaning cylinder is fixedly installed on the upright frame, an extension plate is fixedly installed on the output end of the cleaning cylinder, a sliding sweeping plate is slidably installed on the extension plate, a guide frame is fixedly installed on the extension plate, two clamping cylinders are fixedly installed on the sliding sweeping plate, a swaying frame is fixedly installed on the output end of the clamping cylinder, the swaying frame is slidably installed with the guide frame, a brush is fixedly installed on the swaying frame, a cleaning motor is fixedly installed on the extension plate, an eccentric wheel is fixedly installed on the motor shaft of the cleaning motor, an eccentric rotating rod is eccentrically rotatably installed on the eccentric wheel, and the eccentric rotating rod is rotatably installed with the sliding sweeping plate.

[0014] The lifting motor drives the lifting screw to rotate via the lifting belt. The lifting screw causes the lifting block to descend, which in turn causes the rotating frame, upper frame, and positioning frame to descend. Once the silicon wafer box is clamped and fixed, the internal electric cylinder extends, causing the docking frame, closing block, and spreading column to descend. The spreading column pushes the slope block outward through the slope surface of the slope clamp, causing the elastic sheet to deform and rotate outward, thus moving the slope clamp away from the pressure plate. Simultaneously, the descending closing block pushes the two conical blocks and clamping column blocks inward through the slope surface, compressing the springs between the conical blocks and causing the two clamping column blocks to enclose the docking column. Subsequently, the left and right clamping blocks and the front and rear clamping blocks release. Then, the lifting motor drives the lifting block, rotating frame, upper frame, and positioning frame to rise, and the clamping column blocks lift the docking column and pressure plate, thereby removing the box cover from the silicon wafer box. The width of the box cover is smaller than the width of the pressure plate, so the slope clamp does not obstruct the box cover. After the box cover is removed from the silicon wafer box, the lifting block and rotating frame rise, and the rotating motor drives the electric cylinder to descend. The gears rotate, causing the rotating gear and rotating frame to rotate 180 degrees, bringing the suction cup above the silicon wafer box. The pick-up motor rotates, causing the pick-up base to rotate relative to the rotating frame. The rotating arm motor drives the rotating arm to rotate relative to the pick-up base via the rotating arm belt. The suction cup motor rotates, causing the suction cup to rotate relative to the rotating arm. Simultaneously, the lifting block and rotating frame raise and lower, allowing the suction cup to pick up the silicon wafers from the silicon wafer box. After the suction cup picks up the silicon wafer, the cleaning cylinder extends, allowing the two brushes to reach both sides of the silicon wafer. The clamping cylinder retracts, causing the swaying frame and brushes to move inward, bringing the two brushes into contact with the silicon wafer. The cleaning motor drives the eccentric wheel to rotate, which in turn drives the eccentric rotating rod to rotate eccentrically, causing the sliding sweeping plate to slide back and forth along the extended plate, thereby causing the brushes to slide back and forth, performing a rough cleaning of the silicon wafer with the brushes. Then, the clamping cylinder extends, the cleaning cylinder retracts, and in conjunction with the rotation and raising and lowering of the rotating frame, the silicon wafer is placed into the placement box by the suction cup.

[0015] When the wafer box lid needs to be closed, the rotating frame rotates in conjunction with the descent of the lifting block, causing the positioning frame to return to the outside of the wafer box. The inner electric cylinder retracts, causing the spring between the closing block and the rising conical block of the spreading column to rebound, causing the clamping column block to slide outward. The clamping column block no longer supports the docking column, and at the same time, the elastic sheet rebounds and resets. Then, the outer electric cylinder extends, driving the pressing frame to descend. The pressing frame presses down the pressing plate, so that the pressing plate reaches below the slope block, pressing the wafer box lid onto the wafer box again. Then, the lifting block, rotating frame, upper frame, and positioning frame rise and reset.

[0016] A delivery mechanism is provided next to the feeding mechanism. The delivery mechanism includes a base plate on which a placement box is placed. Multiple placement motors are fixedly installed on the placement box. Multiple placement screws are rotatably installed on the placement box. The placement screws are fixedly installed with the motor shafts of the placement motors. Multiple layers of placement supports are slidably installed on the placement box. The placement supports and the placement screws form a threaded transmission.

[0017] The silicon wafers are moved above the placement trays using a suction cup. Then, the placement motor drives the placement screw to rotate, causing the two placement trays on the same layer to move inward until they are below the silicon wafers. The suction cups then place the silicon wafers onto the two placement trays. When the suction cups carry the next batch of silicon wafers to the placement box, the placement motor on the layer above the placement tray that has already placed the silicon wafers rotates, causing the placement tray on the upper layer to be below the silicon wafers. This process is repeated to place the silicon wafers into the placement box from bottom to top. Once the placement box is full of silicon wafers, it is transported to the next process.

[0018] A method for handling equipment includes the following steps: 1. Placing a silicon wafer box containing silicon wafers onto a feeding mechanism; 2. Transporting the silicon wafer box to a positioning mechanism via the feeding mechanism; 3. Positioning the silicon wafer box via the positioning mechanism; 4. Removing the lid from the silicon wafer box via an insertion mechanism; 5. Removing the silicon wafers from the silicon wafer box via the insertion mechanism; 6. Performing a rough cleaning on the silicon wafers; 7. Sending the cleaned silicon wafers to the next process; 8. After all the silicon wafers in the silicon wafer box have been delivered, pressing the lid back onto the silicon wafer box again and fixing it to the silicon wafer box via the insertion mechanism.

[0019] The beneficial effects of this invention compared with the prior art are: (1) This invention integrates multiple functions such as feeding, positioning, cover removal, wafer placement, cleaning and cover replacement. Through the orderly collaborative operation between various mechanisms, the entire process from silicon wafer box loading to silicon wafer placement is automated. The multi-level positioning system ensures the positional accuracy of the silicon wafer box at key work stations, laying a solid foundation for subsequent non-destructive cover opening and precise wafer placement, and significantly improving production efficiency and consistency; (2) The placement mechanism set in this invention realizes automatic unlocking and clamping of the box cover. When opening the cover, the supporting column can reliably support the ramp. The block is unlocked and the closing block drives the clamping column block to clamp the docking column, thereby smoothly lifting the box cover. When closing the cover, the pressing plate can be accurately reset to below the slope block and locked again. The whole process is smooth and avoids the box cover from slipping, colliding or damaging the silicon wafer box structure, and has high reliability. (3) The present invention integrates a cleaning module consisting of a brush, a cleaning motor and a reciprocating drive mechanism on the wafer feeding mechanism. After the silicon wafer is picked up, it can immediately perform reciprocating brushing on both sides of the silicon wafer on the transport path, effectively removing large particulate pollutants attached to the surface and reducing the chance of secondary pollution. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention (with the lid removed).

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention (in a cleaning state).

[0022] Figure 3 This is a schematic diagram of the feeding mechanism structure of the present invention. Figure 1 .

[0023] Figure 4 This is a schematic diagram of the feeding mechanism structure of the present invention. Figure 2 .

[0024] Figure 5 This is a schematic diagram of the silicon wafer box and lid structure of the present invention.

[0025] Figure 6 This is a schematic diagram of the positioning mechanism of the present invention.

[0026] Figure 7 This is a schematic diagram of the insertion mechanism of the present invention (with the cover removed).

[0027] Figure 8 This is a schematic diagram of the mechanism structure of the present invention. Figure 2 .

[0028] Figure 9 This is a schematic diagram of the mechanism structure of the present invention. Figure 3 .

[0029] Figure 10 This is a schematic diagram of the mechanism structure of the present invention (in a cleaning state).

[0030] Figure 11 This is a schematic diagram of the mechanism structure of the present invention. Figure 4 .

[0031] Figure 12 This is a schematic diagram of the mechanism structure of the present invention. Figure 5 .

[0032] Figure 13 This is a schematic diagram of the delivery mechanism of the present invention.

[0033] Reference numerals: 101-Conveyor frame; 102-Conveyor motor; 103-Input belt; 104-Conveyor wheel; 105-Conveyor belt; 106-Side positioning plate; 107-Side motor; 108-Side lead screw; 109-Rear motor; 110-Rear belt; 111-Rear positioning rod; 112-Front-end electric cylinder; 113-Front-end positioning rod; 114-Positioning strip; 115-Wafer box; 116-Box cover; 117-Pressure plate; 118 - Connecting post; 119- Clamping post; 120- Clamping spring; 121- Elastic sheet; 122- Slope block; 201- Positioning frame; 202- Left and right electric cylinders; 203- Left and right rotating rods; 204- Left and right clamping rods; 205- Front and rear clamping blocks; 206- Front and rear electric cylinders; 207- Front and rear rotating rods; 208- Front and rear clamping rods; 209- Left and right clamping blocks; 301- Upper frame; 302- Inner electric cylinder; 303- Outer electric cylinder; 304- Clamping frame; 30 5-Connecting frame; 306-Spreading column; 307-Clamping block; 308-Clamping block; 309-Conical block; 310-Upright frame; 311-Lifting motor; 312-Lifting belt; 313-Lifting screw; 314-Lifting block; 315-Rotating motor; 316-Motor gear; 317-Rotating gear; 318-Rotating frame; 319-Connecting frame; 320-Retrieval seat; 321-Retrieval motor; 322-Rotating arm motor; 323 - Rotating arm belt; 324 - Rotating arm; 325 - Suction cup motor; 326 - Suction cup; 327 - Sweeping cylinder; 328 - Sweeping motor; 329 - Eccentric wheel; 330 - Eccentric rotating rod; 331 - Shaking frame; 332 - Clamping cylinder; 333 - Brush; 334 - Guide frame; 335 - Shock-absorbing spring; 336 - Extending plate; 401 - Base plate; 402 - Placement box; 403 - Placement motor; 404 - Placement screw; 405 - Placement tray. Detailed Implementation

[0034] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0035] Example: Reference Figures 1-12 A handling device includes a feeding mechanism for feeding silicon wafers and silicon wafer boxes 115. The feeding mechanism includes a conveyor frame 101. A positioning mechanism for positioning the silicon wafer box 115 is provided above the feeding mechanism. An insertion mechanism for placing the silicon wafers in the silicon wafer box 115 is provided on the positioning mechanism. The insertion mechanism includes an upper frame 301. Four elastic plates 121 are fixedly installed on the silicon wafer box 115. A slope block 122 is fixedly installed on the upper end of the elastic plate 121. The slope block 122 is provided with a slope. In the initial state, the box cover 116 is placed on the silicon wafer box 115. A clamping column 119 is fixedly installed on the silicon wafer box 115. A clamping plate 117 is slidably installed on the clamping column 119. A clamping spring 120 is provided between the clamping plate 117 and the box cover 116. Two docking columns 118 are provided on the clamping plate 117. The clamping plate 117 is located below the four slope blocks 122. The clamping spring 120 is in a compressed state. Multiple silicon wafers are vertically placed inside the silicon wafer box 115.

[0036] like Figures 3-5 As shown, the feeding mechanism includes a positioning bar 114 fixedly installed on the conveyor frame 101. Two conveyor wheels 104 are rotatably installed on the conveyor frame 101. A conveyor belt 105 is wound around the two conveyor wheels 104. A conveyor motor 102 is fixedly installed on the conveyor frame 101. The conveyor motor 102 drives the conveyor wheels 104 to rotate through the input belt 103. A front-end electric cylinder 112 is fixedly installed on the conveyor frame 101. A front-end positioning rod 113 is fixedly installed on the output end of the front-end electric cylinder 112. In use, the silicon wafer box 115 is placed on the conveyor belt 105.

[0037] like Figures 3-5 As shown, a rear motor 109 is fixedly installed on the conveyor frame 101, and a rear positioning rod 111 is rotatably installed on the conveyor frame 101. The rear motor 109 drives the rear positioning rod 111 to rotate through the rear belt 110. A side motor 107 is fixedly installed on the conveyor frame 101, and a side lead screw 108 is rotatably installed on the conveyor frame 101. The side lead screw 108 is provided with two sections of threads with opposite thread directions. The side lead screw 108 is fixedly installed with the motor shaft of the side motor 107. Two side positioning plates 106 are slidably installed on the conveyor frame 101. The two side positioning plates 106 and the two sections of threads of the side lead screw 108 respectively form threaded transmission.

[0038] A silicon wafer box 115 filled with silicon wafers is placed on the conveyor belt 105. Initially, the retaining block 122 holds the clamping plate 117 in place. Under the action of the clamping spring 120, the clamping plate 117 presses the box cover 116 onto the silicon wafer box 115, closing the silicon wafer box 115. The front electric cylinder 112 extends, causing the front positioning rod 113 to move upward and extend. The conveyor motor 102 drives the conveyor wheel 104 to rotate through the input belt 103. The conveyor wheel 104 drives the conveyor belt 105 to rotate. The conveyor belt 105... 5. The silicon wafer box 115 is conveyed forward. When the silicon wafer box 115 contacts the front positioning rod 113, the conveying motor 102 stops rotating. The rear motor 109 drives the rear positioning rod 111 to rotate through the rear belt 110. The rear positioning rod 111 and the front positioning rod 113 are used to position the silicon wafer box 115 in the front-back direction. The side motor 107 rotates and drives the side lead screw 108 to rotate. The side lead screw 108 drives the two side positioning plates 106 to move inward at the same time. The two side positioning plates 106 are used to position the silicon wafer box 115 in the left-right direction.

[0039] like Figure 6 As shown, the positioning mechanism includes a positioning frame 201. Two left and right electric cylinders 202 and two front and rear electric cylinders 206 are fixedly mounted on the positioning frame 201. Two left and right rotating rods 203 are rotatably mounted on the output ends of the left and right electric cylinders 202. Left and right clamping rods 204 are rotatably mounted on the left and right rotating rods 203. The left and right clamping rods 204 are rotatably mounted to the positioning frame 201. Two front and rear rotating rods 207 are rotatably mounted on the output ends of the front and rear electric cylinders 206. Front and rear clamping rods 208 are rotatably mounted on the front and rear rotating rods 207. The front and rear clamping rods 208 are rotatably mounted to the positioning frame 201. Two left and right clamping blocks 209 and two front and rear clamping blocks 205 are slidably mounted on the positioning frame 201. The left and right clamping blocks 209 are rotatably mounted to the front and rear clamping rods 208, and the front and rear clamping blocks 205 are rotatably mounted to the left and right clamping rods 204.

[0040] The positioning frame 201 descends to the outside of the silicon wafer box 115. The left and right electric cylinders 202 retract, driving the left and right rotating rods 203 to rotate. The left and right rotating rods 203 drive the left and right clamping rods 204 to rotate. The left and right clamping rods 204 drive the front and rear clamping blocks 205 to move inward. At the same time, the front and rear electric cylinders 206 retract, driving the front and rear rotating rods 207 to rotate. The front and rear rotating rods 207 drive the front and rear clamping rods 208 to rotate. The front and rear clamping rods 208 drive the left and right clamping blocks 209 to move inward. The silicon wafer box 115 is repositioned by the two front and rear clamping blocks 205 and the two left and right clamping blocks 209 to facilitate the removal of the cover.

[0041] like Figures 7-12As shown, the insertion mechanism includes a frame 310, on which a lifting motor 311 is fixedly mounted, and a lifting screw 313 is rotatably mounted. The lifting motor 311 drives the lifting screw 313 to rotate via a lifting belt 312. A lifting block 314 is slidably mounted on the frame 310, and the lifting block 314 and the lifting screw 313 form a threaded transmission. A rotating motor 315 is fixedly mounted on the lifting block 314, and a motor gear 316 is fixedly mounted on the motor shaft of the rotating motor 315. A rotating frame 318 is rotatably mounted on the lifting block 314, and a rotating gear 317 is fixedly mounted on the rotating frame 318. The rotating gear 317 meshes with the motor gear 316.

[0042] like Figures 7-12 As shown, a pick-up motor 321 is fixedly mounted on the rotating frame 318, a pick-up seat 320 is rotatably mounted on the rotating frame 318, the pick-up seat 320 is fixedly mounted on the motor shaft of the pick-up motor 321, a rotating arm motor 322 is fixedly mounted on the pick-up seat 320, a rotating arm 324 is rotatably mounted on the pick-up seat 324, the rotating arm motor 322 drives the rotating arm 324 to rotate through the rotating arm belt 323, a suction cup motor 325 is rotatably mounted on the rotating arm 324, and a suction cup 326 is fixedly mounted on the motor shaft of the suction cup motor 325.

[0043] like Figures 7-12 As shown, a connecting frame 319 is fixedly installed on the rotating frame 318, and an upper frame 301 is slidably installed on the connecting frame 319. The upper frame 301 is provided with four protruding columns, which slide in the four sliding grooves of the connecting frame 319 respectively. Four sets of shock-absorbing springs 335 are provided between the upper frame 301 and the connecting frame 319. An inner electric cylinder 302 is fixedly installed on the upper frame 301, and a docking frame 305 is fixedly installed on the output end of the inner electric cylinder 302. Four spreading columns 306 and two closing blocks 307 are fixedly installed on the docking frame 305, and two slopes are provided on the closing blocks 307.

[0044] like Figures 7-12 As shown, two external electric cylinders 303 are fixedly installed on the upper frame 301, and the positioning frame 201 is fixedly installed on the upper frame 301. A clamping frame 304 is slidably installed on the positioning frame 201. The clamping frame 304 is fixedly installed with the output end of the external electric cylinders 303. Two sets of clamping column modules are provided on the clamping frame 304. The clamping column module includes two clamping column blocks 308 slidably installed on the clamping frame 304. A conical block 309 is fixedly installed on the clamping column block 308. A slope is provided on the conical block 309. A spring is provided between the two conical blocks 309. The slope of the conical block 309 cooperates with the slope of the closing block 307. An arc-shaped notch is provided on the clamping column block 308.

[0045] like Figures 7-12As shown, a cleaning cylinder 327 is fixedly installed on the upright frame 310. An extension plate 336 is fixedly installed on the output end of the cleaning cylinder 327. A sliding sweeping plate 337 is slidably installed on the extension plate 336. A guide frame 334 is fixedly installed on the extension plate 336. Two clamping cylinders 332 are fixedly installed on the sliding sweeping plate 337. A swaying frame 331 is fixedly installed on the output end of the clamping cylinder 332. The swaying frame 331 is slidably installed with the guide frame 334. A brush 333 is fixedly installed on the swaying frame 331. A cleaning motor 328 is fixedly installed on the extension plate 336. An eccentric wheel 329 is fixedly installed on the motor shaft of the cleaning motor 328. An eccentric rotating rod 330 is eccentrically rotatably installed on the eccentric wheel 329. The eccentric rotating rod 330 is rotatably installed with the sliding sweeping plate 337.

[0046] The lifting motor 311 drives the lifting screw 313 to rotate via the lifting belt 312. The lifting screw 313 causes the lifting block 314 to descend, which in turn causes the rotating frame 318, the upper frame 301, and the positioning frame 201 to descend. After the silicon wafer box 115 is clamped and fixed, the inner electric cylinder 302 extends, causing the docking frame 305, the closing block 307, and the spreading column 306 to descend. The spreading column 306 pushes the slope block 122 outward through the slope surface, causing the elastic sheet 121 to deform and rotate outward, so that the slope block 122 moves away from the pressure plate 117. At the same time, the descent of the closing block 307 pushes the two conical blocks 309 and the clamping column block 301 through the slope surface. 08 moves inward, compressing the springs between the conical blocks 309, causing the two clamping blocks 308 to enclose the docking post 118. Then, the left and right clamping blocks 209 and the front and rear clamping blocks 205 release. Subsequently, the lifting motor 311 drives the lifting block 314, rotating frame 318, upper frame 301, and positioning frame 201 to rise. The clamping blocks 308 then lift the docking post 118 and the pressure plate 117, thereby removing the box cover 116 from the silicon wafer box 115. The width of the box cover 116 is smaller than the width of the pressure plate 117, so the ramp block 122 does not obstruct the box cover 116. After the box cover 116 is removed from the silicon wafer box 115, the lifting block 314 and rotating frame 318... The lifting and rotating motor 315 drives the motor gear 316 to rotate, thereby causing the rotating gear 317 and the rotating frame 318 to rotate 180 degrees, so that the suction cup 326 reaches above the silicon wafer box 115. The picking motor 321 rotates, causing the picking seat 320 to rotate relative to the rotating frame 318. The rotating arm motor 322 drives the rotating arm 324 to rotate relative to the picking seat 320 through the rotating arm belt 323. The suction cup motor 325 rotates, causing the suction cup 326 to rotate relative to the rotating arm 324. At the same time, with the lifting block 314 and the rotating frame 318 lifting and lowering, the suction cup 326 can pick up the silicon wafers in the silicon wafer box 115. After the suction cup 326 picks up the silicon wafer... The cleaning cylinder 327 extends, allowing the two brushes 333 to reach both sides of the silicon wafer. The clamping cylinder 332 retracts, causing the swaying frame 331 and the brushes 333 to move inward, so that the two brushes 333 come into contact with the silicon wafer. The cleaning motor 328 drives the eccentric wheel 329 to rotate, and the eccentric wheel 329 drives the eccentric rotating rod 330 to rotate eccentrically, causing the sliding sweeping plate 337 to slide back and forth along the extended plate 336, thereby causing the brushes 333 to slide back and forth. The brushes 333 perform coarse cleaning on the silicon wafer. Then the clamping cylinder 332 extends, and the cleaning cylinder 327 retracts. With the rotation and lifting of the rotating frame 318, the silicon wafer is placed into the placement box 402 by the suction cup 326.

[0047] When it is necessary to close the cover 116 back onto the silicon wafer box 115, the rotating frame 318 rotates in conjunction with the descent of the lifting block 314, causing the positioning frame 201 to return to the outside of the silicon wafer box 115. The inner electric cylinder 302 retracts, causing the spring between the closing block 307 and the rising conical block 309 of the spreading column 306 to rebound, causing the clamping block 308 to slide outward. The clamping block 308 no longer supports the docking column 118, and at the same time, the elastic sheet 121 rebounds and resets. Then, the outer electric cylinder 303 extends, driving the pressing frame 304 to descend. The pressing frame 304 presses down the pressing plate 117, so that the pressing plate 117 reaches below the ramp block 122, pressing the cover 116 onto the silicon wafer box 115 again. Then, the lifting block 314, the rotating frame 318, the upper frame 301, and the positioning frame 201 rise and reset.

[0048] A feeding mechanism is provided next to the feeding mechanism. The feeding mechanism includes a base plate 401, on which a placement box 402 is placed. Multiple placement motors 403 are fixedly installed on the placement box 402. Multiple placement screws 404 are rotatably installed on the placement box 402. The placement screws 404 are fixedly installed with the motor shafts of the placement motors 403. Multiple layers of placement supports 405 are slidably installed on the placement box 402. The placement supports 405 and the placement screws 404 form a threaded transmission.

[0049] The silicon wafers are moved above the placement tray 405 by the suction cup 326. Then, the placement motor 403 drives the placement screw 404 to rotate, causing the two placement trays 405 on the same layer to move inward, so that the placement trays 405 reach below the silicon wafers. Then, the suction cup 326 places the silicon wafers on the two placement trays 405. Then, when the suction cup 326 carries the next batch of silicon wafers to the placement box 402, the placement motor 403 of the layer above the placement tray 405 that has been filled with silicon wafers rotates, so that the placement tray 405 of the upper layer reaches below the silicon wafers. This process is repeated to place the silicon wafers into the placement box 402 from bottom to top. When the placement box 402 is full of silicon wafers, the placement box 402 is transported to the next process.

[0050] A method for handling equipment includes the following steps: 1. Placing a silicon wafer box 115 containing silicon wafers onto a feeding mechanism; 2. Transporting the silicon wafer box 115 to a positioning mechanism via the feeding mechanism; 3. Positioning the silicon wafer box 115 via the positioning mechanism; 4. Removing the box cover 116 from the silicon wafer box 115 via an insertion mechanism; 5. Removing the silicon wafers from the silicon wafer box 115 via the insertion mechanism; 6. Performing a coarse cleaning on the silicon wafers; 7. Sending the cleaned silicon wafers to the next process; 8. After all the silicon wafers in the silicon wafer box 115 have been delivered, pressing and fixing the box cover 116 back onto the silicon wafer box 115 via the insertion mechanism.

[0051] The working principle of the handling device disclosed in this invention is as follows: A silicon wafer box 115 filled with silicon wafers is placed on a conveyor belt 105. In the initial state, the ramp block 122 clamps the clamping plate 117. Under the action of the clamping spring 120, the clamping plate 117 presses the box cover 116 onto the silicon wafer box 115, and the box cover 116 closes the silicon wafer box 115. The front electric cylinder 112 extends, driving the front positioning rod 113 to move upward, causing the front positioning rod 113 to extend. The conveyor motor 102 drives the conveyor wheel 104 to rotate through the input belt 103. The conveyor wheel 104 drives the conveyor belt 105. 5. The conveyor belt 105 rotates and transports the silicon wafer box 115 forward. When the silicon wafer box 115 contacts the front positioning rod 113, the conveyor motor 102 stops rotating. The rear motor 109 drives the rear positioning rod 111 to rotate through the rear belt 110. The rear positioning rod 111 and the front positioning rod 113 position the silicon wafer box 115 in the front-back direction. The side motor 107 rotates and drives the side lead screw 108 to rotate. The side lead screw 108 drives the two side positioning plates 106 to move inward at the same time. The two side positioning plates 106 position the silicon wafer box 115 in the left-right direction. The lifting motor 311 drives the lifting screw 313 to rotate via the lifting belt 312. The lifting screw 313 drives the lifting block 314 to descend. The lifting block 314 drives the rotating frame 318, the upper frame 301, and the positioning frame 201 to descend. The positioning frame 201 descends to the outside of the silicon wafer box 115. The left and right electric cylinders 202 retract, driving the left and right rotating rods 203 to rotate. The left and right rotating rods 203 drive the left and right clamping rods 204 to rotate. The left and right clamping rods 204 drive the front and rear clamping blocks 205 to move inward. At the same time, the front and rear electric cylinders 206 retract, driving the front and rear rotating rods 207 to rotate. The front and rear rotating rods 207 drive the front and rear clamping rods 208 to rotate. The front and rear clamping rods 208 drive the left and right clamping blocks 209 to move inward. The silicon wafer box 115 is repositioned by the two front and rear clamping blocks 205 and the two left and right clamping blocks 209 to facilitate the removal of the cover.

[0052] After the silicon wafer box 115 is clamped and fixed, the internal electric cylinder 302 extends, causing the docking frame 305, the closing block 307, and the spreading column 306 to descend. The spreading column 306 pushes the slope block 122 outward through the slope surface of the slope block 122, causing the elastic sheet 121 to deform and rotate outward, so that the slope block 122 moves away from the pressure plate 117. At the same time, the descent of the closing block 307 pushes the two conical blocks 309 and the clamping column block 308 inward through the slope surface. The spring between the conical blocks 309 is compressed, so that the two clamping column blocks 308 wrap around the docking column 118. Then the left and right clamping blocks 209 and the front and rear clamping blocks 205 are released. Then the lifting motor 311 drives the lifting block 314, the rotating frame 318, the upper frame 301, and the positioning frame 201 to rise, passing through the clamping column block 305. 8. The lifting block 314 and the rotating frame 318 rise with the docking post 118 and the clamping plate 117, thereby removing the box cover 116 from the silicon wafer box 115. The width of the box cover 116 is smaller than the width of the clamping plate 117, and the ramp block 122 will not obstruct the box cover 116. After the box cover 116 is removed from the silicon wafer box 115, the lifting block 314 and the rotating frame 318 rise. The rotating motor 315 drives the motor gear 316 to rotate, thereby causing the rotating gear 317 and the rotating frame 318 to rotate 180 degrees, so that the suction cup 326 reaches above the silicon wafer box 115. The picking motor 321 rotates, causing the picking seat 320 to rotate relative to the rotating frame 318. The rotating arm motor 322 drives the rotating arm 324 to rotate relative to the picking seat 320 through the rotating arm belt 323. The suction cup motor 325 rotates, causing the suction cup 326 to rotate. 6 rotates relative to the rotating arm 324, simultaneously coordinating with the lifting block 314 and the rotating frame 318 to allow the suction cup 326 to pick up the silicon wafers in the silicon wafer box 115. After the suction cup 326 picks up the silicon wafers, the cleaning cylinder 327 extends, causing the two brushes 333 to reach both sides of the silicon wafers. The clamping cylinder 332 retracts, driving the swaying frame 331 and the brushes 333 to move inwards, bringing the two brushes 333 into contact with the silicon wafers. The cleaning motor 328 drives the eccentric wheel 329 to rotate, which in turn drives the eccentric rotating rod 330 to rotate eccentrically, causing the sliding sweeping plate 337 to slide back and forth along the extended plate 336, thereby causing the brushes 333 to slide back and forth. The brushes 333 perform coarse cleaning on the silicon wafers. Subsequently, the clamping cylinder 332 extends, and the cleaning cylinder 327... The silicon wafers are retracted and, in conjunction with the rotation and lifting of the rotating frame 318, are placed into the placement box 402 via the suction cup 326. The suction cup 326 moves the silicon wafers above the placement tray 405. Then, the placement motor 403 drives the placement screw 404 to rotate, causing the two placement trays 405 on the same layer to move inwards until they are below the silicon wafers. The suction cup 326 then places the silicon wafers onto the two placement trays 405. Subsequently, when the suction cup 326 arrives at the placement box 402 with the next batch of silicon wafers, the placement motor 403 on the layer above the placement tray 405 that has already been filled rotates, causing the upper-layer placement tray 405 to be below the silicon wafers. This process is repeated to place silicon wafers into the placement box 402 from bottom to top. Once the placement box 402 is full of silicon wafers...The placement box 402 is conveyed to the next process. When it is necessary to close the box cover 116 back onto the silicon wafer box 115, the rotating frame 318 rotates in conjunction with the descent of the lifting block 314, causing the positioning frame 201 to return to the outside of the silicon wafer box 115. The inner electric cylinder 302 retracts, causing the spring between the closing block 307 and the rising conical block 309 of the spreading column 306 to rebound, causing the clamping block 308 to slide outward. The clamping block 308 no longer supports the docking column 118, and at the same time, the elastic sheet 121 rebounds and resets. Then, the outer electric cylinder 303 extends, driving the pressing frame 304 to descend. The pressing frame 304 presses down the pressing plate 117, so that the pressing plate 117 reaches below the ramp block 122, pressing the box cover 116 onto the silicon wafer box 115 again. Then, the lifting block 314, the rotating frame 318, the upper frame 301, and the positioning frame 201 rise and reset.

[0053] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the present invention based on the technical solution and inventive concept of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A handling device, comprising a feeding mechanism for feeding silicon wafers and wafer boxes (115), characterized in that: The feeding mechanism includes a conveyor frame (101), and a positioning mechanism for positioning the silicon wafer box (115) is provided above the feeding mechanism. The positioning mechanism is provided with an insertion mechanism for placing the silicon wafers in the silicon wafer box (115). The insertion mechanism includes an upper frame (301). Four elastic plates (121) are fixedly installed on the silicon wafer box (115). A slope block (122) is fixedly installed on the upper end of the elastic plate (121). A slope surface is provided on the slope block (122). In the initial state, a box cover (116) is placed on the silicon wafer box (115). A pressing column (119) is fixedly installed on the silicon wafer box (115). A pressing plate (117) is slidably installed on the pressing column (119). A pressing spring (120) is provided between the pressing plate (117) and the box cover (116). Two docking columns (118) are provided on the pressing plate (117). The pressing plate (117) is located below the four slope blocks (122). The pressing spring (120) is in a compressed state. Multiple silicon wafers are vertically placed inside the silicon wafer box (115).

2. The handling equipment according to claim 1, characterized in that: The feeding mechanism includes a positioning bar (114) fixedly installed on the conveyor frame (101). Two conveyor wheels (104) are rotatably installed on the conveyor frame (101). A conveyor belt (105) is wrapped around the two conveyor wheels (104). A conveyor motor (102) is fixedly installed on the conveyor frame (101). The conveyor motor (102) drives the conveyor wheels (104) to rotate through the input belt (103). A front-end electric cylinder (112) is fixedly installed on the conveyor frame (101). A front-end positioning rod (113) is fixedly installed on the output end of the front-end electric cylinder (112). When in use, the silicon wafer box (115) is placed on the conveyor belt (105).

3. The handling equipment according to claim 2, characterized in that: A rear motor (109) is fixedly installed on the conveyor frame (101), and a rear positioning rod (111) is rotatably installed on the conveyor frame (101). The rear motor (109) drives the rear positioning rod (111) to rotate through the rear belt (110). A side motor (107) is fixedly installed on the conveyor frame (101), and a side lead screw (108) is rotatably installed on the conveyor frame (101). The side lead screw (108) is provided with two sections of threads with opposite thread directions. The side lead screw (108) is fixedly installed with the motor shaft of the side motor (107). Two side positioning plates (106) are slidably installed on the conveyor frame (101). The two side positioning plates (106) and the two sections of threads of the side lead screw (108) respectively form threaded transmission.

4. The handling equipment according to claim 1, characterized in that: The positioning mechanism includes a positioning frame (201), on which two left and right electric cylinders (202) and two front and rear electric cylinders (206) are fixedly installed. Two left and right rotating rods (203) are rotatably installed on the output ends of the left and right electric cylinders (202), and left and right clamping rods (204) are rotatably installed on the left and right rotating rods (203). The left and right clamping rods (204) are rotatably installed with the positioning frame (201). Two front and rear rotating rods (207) are rotatably installed on the output ends of the front and rear electric cylinders (206), and front and rear clamping rods (208) are rotatably installed on the front and rear rotating rods (207). The front and rear clamping rods (208) are rotatably installed with the positioning frame (201). Two left and right clamping blocks (209) and two front and rear clamping blocks (205) are slidably installed on the positioning frame (201). The left and right clamping blocks (209) are rotatably installed with the front and rear clamping rods (208), and the front and rear clamping blocks (205) are rotatably installed with the left and right clamping rods (204).

5. A handling device according to claim 1, characterized in that: The placement mechanism includes a stand (310), on which a lifting motor (311) is fixedly installed, and a lifting screw (313) is rotatably installed. The lifting motor (311) drives the lifting screw (313) to rotate through a lifting belt (312). A lifting block (314) is slidably installed on the stand (310). The lifting block (314) and the lifting screw (313) form a threaded transmission. A rotating motor (315) is fixedly installed on the lifting block (314). A motor gear (316) is fixedly installed on the motor shaft of the rotating motor (315). A rotating frame (318) is rotatably installed on the lifting block (314). A rotating gear (317) is fixedly installed on the rotating frame (318). The rotating gear (317) meshes with the motor gear (316).

6. A handling device according to claim 5, characterized in that: A pick-up motor (321) is fixedly installed on the rotating frame (318). A pick-up seat (320) is rotatably installed on the rotating frame (318). The pick-up seat (320) is fixedly installed on the motor shaft of the pick-up motor (321). A rotating arm motor (322) is fixedly installed on the pick-up seat (320). A rotating arm (324) is rotatably installed on the pick-up seat (320). The rotating arm motor (322) drives the rotating arm (324) to rotate through the rotating arm belt (323). A suction cup motor (325) is rotatably installed on the rotating arm (324). A suction cup (326) is fixedly installed on the motor shaft of the suction cup motor (325).

7. A handling device according to claim 6, characterized in that: A connecting frame (319) is fixedly installed on the rotating frame (318). An upper frame (301) is slidably installed on the connecting frame (319). Four protruding columns are provided on the upper frame (301). The four protruding columns on the upper frame (301) slide in the four sliding grooves of the connecting frame (319). Four sets of shock-absorbing springs (335) are provided between the upper frame (301) and the connecting frame (319). An inner electric cylinder (302) is fixedly installed on the upper frame (301). A docking frame (305) is fixedly installed on the output end of the inner electric cylinder (302). Four spreading columns (306) and two closing blocks (307) are fixedly installed on the docking frame (305). Two slopes are provided on the closing blocks (307).

8. A handling device according to claim 7, characterized in that: Two external electric cylinders (303) are fixedly installed on the upper frame (301). The positioning frame (201) is fixedly installed on the upper frame (301). A clamping frame (304) is slidably installed on the positioning frame (201). The clamping frame (304) is fixedly installed with the output end of the external electric cylinder (303). Two sets of clamping column modules are provided on the clamping frame (304). The clamping column module includes two clamping column blocks (308) slidably installed on the clamping frame (304). A conical block (309) is fixedly installed on the clamping column block (308). A slope is provided on the conical block (309). A spring is provided between the two conical blocks (309). The slope of the conical block (309) cooperates with the slope of the closing block (307). An arc-shaped notch is provided on the clamping column block (308). A cleaning electric cylinder (327) is fixedly installed on the upright frame (310). An extension plate (336) is fixedly installed on the output end of the cleaning cylinder (327). A sliding sweeping plate (337) is slidably installed on the extension plate (336). A guide frame (334) is fixedly installed on the extension plate (336). Two clamping cylinders (332) are fixedly installed on the sliding sweeping plate (337). A swaying frame (331) is fixedly installed on the output end of the clamping cylinder (332). The swaying frame (331) is slidably installed with the guide frame (334). A brush (333) is fixedly installed on the swaying frame (331). A cleaning motor (328) is fixedly installed on the extension plate (336). An eccentric wheel (329) is fixedly installed on the motor shaft of the cleaning motor (328). An eccentric rotating rod (330) is eccentrically rotated on the eccentric wheel (329). The eccentric rotating rod (330) is rotatably installed with the sliding sweeping plate (337).

9. A handling device according to claim 1, characterized in that: A delivery mechanism is provided next to the feeding mechanism. The delivery mechanism includes a base plate (401), on which a placement box (402) is placed. Multiple placement motors (403) are fixedly installed on the placement box (402). Multiple placement screws (404) are rotatably installed on the placement box (402). The placement screws (404) are fixedly installed with the motor shafts of the placement motors (403). Multiple layers of placement trays (405) are slidably installed on the placement box (402). The placement trays (405) and the placement screws (404) form a threaded transmission.

10. A method for handling equipment according to claim 1, characterized in that: The steps are as follows:

1. Place the silicon wafer box (115) containing silicon wafers onto the feeding mechanism; 2. Transport the silicon wafer box (115) to the bottom of the positioning mechanism through the feeding mechanism; 3. Position the silicon wafer box (115) through the positioning mechanism; 4. Remove the box cover (116) on the silicon wafer box (115) through the placement mechanism; 5. Take out the silicon wafers in the silicon wafer box (115) through the placement mechanism; 6. Perform a rough cleaning on the silicon wafers; 7. Send the cleaned silicon wafers to the next process; 8. After all the silicon wafers in the silicon wafer box (115) have been sent out, press the box cover (116) again and fix it on the silicon wafer box (115) through the placement mechanism.

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