Etching device with focus ring detection function

Abstract

The application discloses an etching device with a focusing ring detection function, which comprises a base, an intermediate ring, a focusing ring and a detection assembly. The detection assembly comprises a first sensor, a weight sensor, a controller, a battery and a circuit board. The first sensor, the weight sensor and the controller complete current and signal transmission through integrated circuits on the circuit board. The first sensor is used for detecting the thickness of the focusing ring. The weight sensor is used for measuring the weight of the part corresponding to the position of the weight sensor. After the weight sensor measures the focusing ring once, the separation assembly lifts the focusing ring to separate the focusing ring from the intermediate ring. After the rotating assembly drives the intermediate ring to rotate by a certain angle, the focusing ring falls back to the intermediate ring. The weight sensor measures the focusing ring again. In this way, the weight of the focusing ring at multiple positions is obtained, and the controller processes the data obtained through multiple measurements to obtain the deviation of the focusing ring.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an etching device with a focusing ring detection function. Background Technology

[0002] In the semiconductor manufacturing field, etching is one of the most important technologies. Etching refers to the process of selectively removing unwanted material from the surface of a silicon wafer using chemical or physical methods. Etching is divided into wet etching and dry etching, with dry etching utilizing plasma for anisotropic etching.

[0003] In the plasma etching process chamber, a base is used to support the wafer, and a focusing ring is arranged around the base. During the etching process, energy is applied to the etching gas to excite the gas and form plasma. The focusing ring has a focusing effect on the plasma, which can increase the plasma concentration on the wafer surface, especially in the edge region, and adjust the electric field intensity in the plasma etching process chamber to ensure the uniformity of etching in the central and edge regions of the wafer.

[0004] During the etching process, the thickness of the focusing ring gradually decreases as the etching process progresses. At the same time, after the focusing ring is placed on the substrate, the offset of the focusing ring relative to the substrate will affect the process results.

[0005] Therefore, how to detect the thickness and offset of the focusing ring has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application proposes an etching device with a focusing ring detection function to detect the thickness and offset of the focusing ring.

[0007] To achieve the above objectives, this application provides an etching apparatus with a focusing ring detection function, comprising a base, a focusing ring, and an intermediate ring, wherein the intermediate ring and the focusing ring are disposed on the base.

[0008] It also includes a detection component, which includes a first sensor, a weight sensor, a controller, a battery, and a circuit board. The first sensor, the weight sensor, and the controller are integrated on the circuit board. The battery is used to power the first sensor, the weight sensor, and the controller. The first sensor is used to detect the thickness of the focusing ring, and the weight sensor is used to detect the portion of the weight of the focusing ring corresponding to the position of the weight sensor.

[0009] It also includes a separation component, mounted on the base, for lifting the intermediate ring to separate the intermediate ring from the focusing ring;

[0010] A rotating component is used to drive the intermediate ring to rotate so that the weight sensor can detect the weight at multiple positions of the focusing ring, and the controller processes the weight at multiple positions to obtain the offset of the focusing ring.

[0011] Preferably, in the etching apparatus with focusing ring detection function described above, the rotating component includes at least two air duct components evenly arranged circumferentially along the base, and an air supply structure for supplying air to the air duct components.

[0012] The air passage assembly includes a first air passage and a second air passage with opposite jet directions. The nozzles of the first air passage and the second air passage are located on the end face of the base where the intermediate ring is set. The inlets of the first air passage and the second air passage are connected to the air supply structure. Valves are provided on both the first air passage and the second air passage.

[0013] Preferably, the etching apparatus with focusing ring detection function further includes a lifting assembly for driving the intermediate ring to rise and fall, comprising a magnetic assembly and a magnetic levitation assembly.

[0014] The magnetic component is disposed on the base, and the magnetic levitation component is disposed on the intermediate ring. The magnetic levitation component can drive the intermediate ring to rise and fall under the magnetic force of the magnetic component.

[0015] Preferably, in the etching apparatus with focusing ring detection function described above, the magnetic levitation component includes an electromagnetic induction coil, which is connected to the battery to generate a directional magnetic field.

[0016] The magnetic component includes a main electromagnet and a power source. The coil of the main electromagnet is connected to the power source to generate a magnetic field that can act on the directional magnetic field.

[0017] Preferably, in the etching device with focusing ring detection function described above, the magnetic component further includes an auxiliary electromagnet and an auxiliary power supply. The coil of the auxiliary electromagnet is connected to the auxiliary power supply. The auxiliary electromagnet is located within the space enclosed by the coil of the main electromagnet and is used to assist the main electromagnet in adjusting the magnitude and direction of the magnetic field acting on the magnetic levitation component.

[0018] Preferably, in the etching apparatus with focusing ring detection function described above, the power supply is an AC power supply, which is connected to the coil through a first branch and a second branch connected in parallel. The first branch is provided with a first switch, a first rectifier circuit, and a first filter, and the second branch is provided with a second switch; or,

[0019] The power supply is a DC power supply, which is connected to the coil through a third branch and a fourth branch connected in parallel. A third switch and an inverter are provided on the third branch, and a fourth switch is provided on the fourth branch.

[0020] The electromagnetic induction coil is connected to the battery through a bridge rectifier circuit and a first filter. The electromagnetic induction coil can generate current under the electromagnetic induction of the magnetic component to charge the battery.

[0021] Preferably, in the etching apparatus with focusing ring detection function described above, the separation component is a pin, one end of which is connected to the base and the other end of which is connected to the focusing ring.

[0022] Preferably, in the etching apparatus with focusing ring detection function described above, the first sensor is an ultrasonic sensor or a laser sensor.

[0023] Preferably, in the etching apparatus with focusing ring detection function described above, the detection component further includes a second sensor for detecting the rotation angle of the intermediate ring, and the second sensor is integrated on the circuit board.

[0024] Preferably, in the etching apparatus with focusing ring detection function described above, the second sensor is an image sensor or a gyroscope.

[0025] The etching apparatus with focusing ring detection function provided in this application embodiment includes a base, an intermediate ring, and a focusing ring, and also includes a detection component. The detection component includes a first sensor, a weight sensor, a controller, a battery, and a circuit board. The battery supplies power to the first sensor, the weight sensor, and the controller. The first sensor, the weight sensor, and the controller complete current and signal transmission through integrated circuits on the circuit board. The first sensor is used to detect the thickness of the focusing ring; the weight sensor is used to measure the weight of the portion of the focusing ring corresponding to the position of the weight sensor. After the weight sensor measures the focusing ring once, the separation component lifts the focusing ring, separating it from the intermediate ring. The rotation component drives the intermediate ring to rotate the weight sensor, and the focusing ring falls back onto the intermediate ring. The weight sensor measures the focusing ring again, and this process is repeated to obtain the weight at multiple positions of the focusing ring. Finally, the controller performs corresponding calculations based on the data from multiple measurements to obtain the offset of the focusing ring. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this application can be applied to other similar scenarios based on the provided drawings. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0027] Figure 1 This is an exploded view of the base, intermediate ring, and focusing ring of the etching apparatus of this application;

[0028] Figure 2 This is a schematic diagram of the structure of the etching apparatus of this application with the middle ring facing the focusing ring;

[0029] Figure 3 This is a schematic diagram of the structure of the etching apparatus of this application, showing the middle ring facing away from the focusing ring.

[0030] Figure 4 This is a weight distribution diagram of the focusing ring of the etching apparatus of this application;

[0031] Figure 5 This is a schematic diagram of the structure of the gas channel assembly of the etching apparatus of this application;

[0032] Figure 6 This is a schematic diagram of the structure of the etching apparatus of this application, showing the cooperation between the magnetic levitation component and the magnetic component;

[0033] Figure 7 This is a schematic diagram of the etching apparatus of this application with the intermediate ring and focusing ring not separated;

[0034] Figure 8 This is a schematic diagram of the etching apparatus of this application, showing that the intermediate ring is separated from the focusing ring and that the intermediate ring rotates.

[0035] The attached diagram is described below:

[0036] 101-Circuit board; 102-Intermediate ring; 103-Electromagnetic induction coil; 104-Battery; 105-First sensor; 106-Controller; 107-Second sensor; 108-Weight sensor; 2-Focusing ring; 3-Supporting platform; 4-Electrostatic chuck; 5-Base; 6-Magnetic assembly; 601-Main electromagnet; 602-Auxiliary electromagnet; 603-Hall sensor; 8-Airway assembly; 701-Nozzle; 702-Valve. Detailed Implementation

[0037] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. The described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application.

[0038] It should be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features.

[0039] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0040] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0041] Please see Figures 1-8 .

[0042] Some embodiments of this application disclose an etching apparatus with a focusing ring detection function, which can detect the thickness and offset of the focusing ring 2.

[0043] The etching device with focusing ring detection function disclosed in this solution includes a base 5, an intermediate ring 102 and a focusing ring 2, with the intermediate ring 102 and the focusing ring 2 disposed on the base 5.

[0044] The etching device with focusing ring detection function disclosed in this solution also includes a detection component, which includes a first sensor 105, a weight sensor 108, a controller 106, a battery 104, and a circuit board 101. The battery 104 supplies power to the first sensor 105, the weight sensor 108, and the controller 106 to ensure their stable operation. The first sensor 105, the weight sensor 108, and the controller 106 are mounted on the circuit board 101. The transmission of current and signals between the first sensor 105, the weight sensor 108, and the controller 106 is completed through the integrated circuit on the circuit board 101. The controller 106 is used to control the opening and closing of the first sensor 105 and the weight sensor 108.

[0045] The first sensor 105 is used to detect the thickness of the focusing ring 2, the weight sensor 108 is used to measure the weight of the part of the focusing ring 2 corresponding to the position of the weight sensor 108, the controller 106 receives and stores the detected weight of the focusing ring 2, and performs corresponding calculations to obtain the offset of the focusing ring 2.

[0046] In this solution, the first sensor 105, weight sensor 108, controller 106, battery 104 and circuit board 101 of the detection component are all integrated in the intermediate ring 102, without occupying the space outside the etching device. This not only improves the integration of the etching device with focusing ring detection function, but also minimizes the improvement of the etching device with focusing ring detection function.

[0047] Specifically, a cavity or groove structure for installing the detection component can be provided within the intermediate ring 102 to enable the installation of the detection component within the intermediate ring 102.

[0048] Optionally, a portion of the first sensor 105, weight sensor 108, controller 106, battery 104, and circuit board 101 of the detection component are located inside the intermediate ring 102, while another portion is located outside the intermediate ring 102 or an etching device with a focusing ring detection function. The specific arrangement can be selected by those skilled in the art based on actual needs.

[0049] In some embodiments, the first sensor 105 can be an ultrasonic sensor, which obtains the thickness of the focusing ring 2 by measuring the reflection time of the ultrasonic waves, thereby determining the health status of the focusing ring 2. It is worth noting that the ultrasonic sensor, activated during the process, can also detect the thickness of the plasma sheath layer during the process.

[0050] The etching apparatus chamber is typically a high-vacuum chamber. When performing detection using an ultrasonic sensor, the first sensor 105 needs to be in contact with the focusing ring 2. Considering the above factors, the first sensor 105 is positioned on the side of the intermediate ring 102 facing the focusing ring 2.

[0051] In an embodiment where the first sensor 105 is an ultrasonic sensor, the intermediate ring 102 may have only one ultrasonic sensor or at least two ultrasonic sensors arranged in the circumferential direction.

[0052] In some embodiments, the first sensor 105 can also be a laser sensor, which utilizes the characteristics of laser light to determine the thickness of the focusing ring 2 by measuring the change in light intensity or interference phenomena when the laser light is reflected from the two surfaces of the focusing ring 2. When the first sensor 105 is a laser sensor, the thickness of the focusing ring 2 can be detected whether the focusing ring 2 is in contact with the first sensor 105 or not.

[0053] There are multiple weight sensors 108, which are evenly distributed around the circumference of the intermediate ring 102. The weight sensors 108, in conjunction with the rotation of the intermediate ring 102, can detect multiple positions of the focusing ring 2 with a small number of weight sensors 108, thereby obtaining more accurate data distribution.

[0054] In addition to using the first sensor 105 to measure the thickness of the focusing ring 2, this solution can also calculate the thickness of the focusing ring 2 by measuring the weight of the focusing ring 2 using multiple weight sensors 108. Specifically, the weights of multiple positions of the focusing ring 2 measured by the multiple weight sensors 108 are W1, W2, W3...Wn, respectively. Given the density ρ of the focusing ring 2 and the base area M of the focusing ring 2, the thickness h of the focusing ring 2 can be calculated.

[0055] h=

[0056] The focusing ring 2 is detected for placement misalignment using a gravity sensor. Specifically, the focusing ring 2 is separated from the intermediate ring 102 by a separation assembly, and the intermediate ring 102 is rotated by a rotation assembly, causing the weight sensor 108 to rotate synchronously with the intermediate ring 102. This allows for the detection of the weight at multiple different positions of the focusing ring 2. Based on the principle of force balance and distribution, if the weights detected at multiple different positions are different, it indicates that the focusing ring 2 is misaligned relative to the intermediate ring 102. Taking a detection assembly with three weight sensors 108 as an example, the three weight sensors 108 are evenly distributed on the intermediate ring 102, with an angle of 120° between adjacent weight sensors 108. The weight of the focusing ring 2 is 3N. If the weights measured at all positions of the focusing ring 2 by the three weight sensors 108 are equal, it indicates that the focusing ring 2 is not misaligned relative to the intermediate ring 102. If the weights measured at different positions of the focusing ring 2 by the three weight sensors 108 are not equal, it indicates that the focusing ring 2 is misaligned relative to the intermediate ring 102.

[0057] Furthermore, the intermediate ring 102 can be driven to rotate at a certain angle by a rotating component. Each time it rotates a certain angle, the weight sensor 108 performs a measurement, ultimately obtaining the following result: Figure 4 The weight distribution diagram shown indicates the offset direction of focusing ring 2 based on the location of the maximum or minimum weight. Figure 4 Taking the middle ring 102 as an example, every time the middle ring 102 rotates 20°, the three weight sensors 108 perform a weight measurement. The middle ring 102 rotates five times, for a total of 100°. It can be found that the maximum and minimum weight values ​​are on the line "0.68N-1.32N", indicating that the focusing ring 2 has shifted along this line and towards the direction of the maximum weight.

[0058] In one implementation, measurements can be taken by rotating smaller angles each time, thereby obtaining weight parameters at more different locations and thus determining a more precise offset direction.

[0059] The offset x can be calculated using the following formula.

[0060] x=k·(W1- )

[0061] W1 represents the maximum weight measured by the weight sensor 108, W represents the weight of the focusing ring 2, and k is the proportionality coefficient between the offset and the change in reading. The value of k needs to be determined through specific experiments. Factors such as the calibration of the weight sensor 108, its installation location, and the number of weight sensors 108 will all cause the proportionality coefficient k to change. When obtaining the proportionality coefficient k experimentally, it can be calculated using the following formula:

[0062] k=

[0063] The above formula only applies to cases where there is a linear relationship between the offset and the reading of the weight sensor 108, in which case the proportional coefficient k is approximately a fixed value.

[0064] However, when there is no linear relationship between the offset and the reading of the weight sensor 108, the proportional coefficient k is not a constant. In this case, a large amount of data needs to be collected to infer the choice of k value under different conditions. In addition, AI / ML (embedded artificial intelligence / machine learning) can be used to determine the offset x (mapping the offset and several weight parameters measured by the weight sensor 108 to each other).

[0065] The etching device with focusing ring detection function disclosed in this solution also has a separation component and a rotation component. The separation component is mounted on the base 5 and is used to lift the focusing ring 2 so that the focusing ring 2 is separated from the intermediate ring 102. The rotation component only drives the intermediate ring 102 to rotate, and the focusing ring 2 does not rotate.

[0066] The rotating assembly is used to drive the intermediate ring 102 to rotate after the focusing ring 2 separates from the intermediate ring 102, so that the intermediate ring 102 drives the detection assembly located on it to rotate synchronously, so that the weight sensor 108 of the detection assembly can detect the weight at multiple different positions of the focusing ring 2.

[0067] When the rotating component drives the intermediate ring 102 to rotate, the focusing ring 2 separates from the intermediate ring 102 under the action of the separating component, so that the intermediate ring 102 and the focusing ring 2 can rotate relative to each other; when the weight sensor 108 detects the weight of the focusing ring 2, the focusing ring 2 falls back onto the intermediate ring 102, so that the weight sensor 108 can detect the weight of the focusing ring 2.

[0068] In some embodiments, the rotating assembly includes an air passage assembly 7 and an air supply structure, the air supply structure supplying air to the air passage assembly 7, and the air passage assembly 7 ejecting the gas.

[0069] like Figure 5 As shown, the airway assembly 7 includes a first airway and a second airway with opposite jet directions. The nozzles 701 of the first airway and the second airway are located on the end face of the support platform 3 on the base 5. The inlets of the first airway and the second airway are connected to the air supply structure. Valves 702 are provided on both the first airway and the second airway.

[0070] The first and second air passages are arranged at an angle relative to the end face of the support platform 3 on the base 5. The gas discharged through the first and second air passages applies a force to the intermediate ring 102, including a thrust along the axis of the base 5 and a thrust perpendicular to the axis of the base 5. Under the action of the thrust along the axis of the base 5, the intermediate ring 102 tends to separate from the base 5, so as to reduce the normal pressure between the intermediate ring 102 and the base 5 and reduce the difficulty of the intermediate ring 102 rotating under the action of the thrust perpendicular to the axis of the base 5.

[0071] This design uses gas to drive the intermediate ring 102 to rotate, achieving non-contact actuation and preventing damage to the intermediate ring 102 during rotation. Optionally, the first and second air passages are arranged symmetrically to provide symmetrical driving forces to the intermediate ring 1022.

[0072] The inlets of the first and second air passages may or may not be interconnected. In an embodiment where the inlets of the first and second air passages are interconnected, the first and second air passages are V-shaped. The angle between the first and second air passages and the surface of the base 5 is acute.

[0073] Both the first and second air passages are equipped with valves 702, which are used to control the connection between the first and second air passages and the air supply structure. When the valve 702 in the first air passage is open and the valve 702 in the second air passage is closed, the air supply structure ejects gas through the first air passage, and the gas pushes the intermediate ring 102 to rotate in the first direction; when the valve 702 in the first air passage is closed and the valve 702 in the second air passage is open, the air supply structure ejects gas through the second air passage, and the gas pushes the intermediate ring 102 to rotate in the second direction, which is opposite to the first direction.

[0074] During operation, the valve 702 of the first or second air passage can be opened according to the rotation direction requirements, or the valves 702 of the first and second air passages can be used in combination. For example, the valve 702 of the first air passage can be opened to make the intermediate ring 102 rotate in the first direction, and the valve 702 of the second air passage can be opened intermittently to provide a force in the opposite direction to help the intermediate ring 102 stop rotating, or to reduce the rotation speed of the intermediate ring 102 in the first direction to achieve fine adjustment of the rotation angle.

[0075] The first and second gas channels of the gas channel assembly 7 can be gas channels that are independently opened on the base 5, or they can be gas channels that are directly branched off from the helium supply line of the etching device itself.

[0076] When the air duct assembly 7 is independently opened on the base 5, it can be equipped with a separate air supply structure, or it can share an air supply structure with the etching device.

[0077] The gas supply structure can be a gas reservoir or gas storage tank, or it can be a gas compressor.

[0078] The gas supplied by the gas supply structure can be Ar, N2, He, or air, and will not cause air pollution.

[0079] The rotating component is not limited to non-contact drive; it can also rotate the intermediate ring 102 by contact drive. No specific limitation is made here.

[0080] like Figure 1 As shown, an electrostatic chuck 4 is mounted on the support stage 3 of the base 5. During the etching process, the wafer is placed and fixed on the surface of the electrostatic chuck 4. The electrostatic chuck 4 is designed with meandering grooves, and helium gas is transported into the grooves through pipes on the base 5 to cool the wafer during the process.

[0081] The etching device with focusing ring detection function disclosed in this solution also includes a lifting assembly for driving the intermediate ring 102 to rise and fall, so as to adjust the distance between the intermediate ring 102 and the base 5.

[0082] Before the rotating component drives the intermediate ring 102 to rotate, the lifting component drives the intermediate ring 102 to rise, so that the intermediate ring 102 is in a suspended state and does not contact the focusing ring 2 and the base 5, thereby reducing the difficulty of the rotating component driving the intermediate ring 102 to rotate.

[0083] The lifting assembly includes a magnetic component 6 and a magnetic levitation component. The intermediate ring 102 is equipped with the magnetic levitation component, and the base 5 is equipped with the magnetic component 6. The intermediate ring 102 acts as a float, and the base 5 acts as a magnetic levitation base. The intermediate ring 102 with the magnetic levitation component rises and falls under the magnetic force of the magnetic component 6 on the base 5. Specifically, the intermediate ring 102 with the magnetic levitation component moves along the axis of the base 5 under the magnetic force of the magnetic component 6. The movement direction of the intermediate ring 102 includes moving away from the base 5 and moving towards the base 5. Specifically, when the intermediate ring 102 moves away from the base 5, the intermediate ring 102 is in a suspended state; when the intermediate ring 102 moves towards the base 5, the intermediate ring 102 can fall back onto the surface of the base 5. In some embodiments, the suspension height of the intermediate ring 102 (the suspension height is the distance between the intermediate ring 102 and the end face of the support platform 3 on the base 5) is greater than the height of the focusing ring 2 along its own axis and less than the height of the support platform 3 along its own axis; when the intermediate ring 102 is in a suspended state, the intermediate ring 102 does not contact the base 5 and does not contact the intermediate ring 102.

[0084] After the intermediate ring 102 is in a suspended state, the rotating component drives the intermediate ring 102 to rotate around the axis of the base 5 (the focusing ring 2, the intermediate ring 102 and the base 5 are arranged coaxially).

[0085] This design involves driving the intermediate ring 102 to rotate only after it has separated from the base 5. This reduces the driving force required to rotate the intermediate ring 102 and also reduces wear on the intermediate ring 102 due to friction.

[0086] The focusing ring 2 can also rise, fall, and rotate synchronously with the intermediate ring 102. At this time, the separation component does not apply a lifting effect to the focusing ring 2. The intermediate ring 102 with the magnetic levitation component moves away from the base 5 under the magnetic force of the magnetic component 6. The intermediate ring 102 drives the focusing ring 2 to move together. When the intermediate ring 102 separates from the base 5, the rotation component applies a driving force to the suspended intermediate ring 102 and the focusing ring 2. The intermediate ring 102 rotates along its own circumference, while carrying the focusing ring 2 to rotate.

[0087] Because the location of the positioning notch on the wafer corresponding to the focusing ring 2 will be etched into a pit due to the lack of wafer protection, the thickness of the focusing ring 2 at the positioning notch location along its own radial direction will become thinner, affecting the uniformity of etching. This solution uses the synchronous rotation of the focusing ring 2 with the intermediate ring 102 to allow the etched location of the focusing ring 2 to move away from the positioning notch on the wafer, preventing a certain location on the focusing ring 2 from being etched into a pit due to prolonged etching of the positioning notch on the wafer, thus ensuring the uniformity of etching. The magnetic levitation component includes an electromagnetic induction coil 103, which is connected to the battery 104 of the detection component to generate a directional magnetic field.

[0088] The magnetic component 6 includes a main electromagnet 601 and a power supply. The coil of the main electromagnet 601 is connected to the power supply. The main electromagnet 601 generates a magnetic field that can act on a directional magnetic field to make the intermediate ring 102 rise and fall.

[0089] In this design, the main electromagnet 601 is selected as the magnetic component 6. The magnetic field generated by the main electromagnet 601 can be turned off according to the requirements of the process. During the etching process, the intermediate ring 102 does not need to be suspended. Turning off the magnetic field generated by the main electromagnet 601 prevents the magnetic field from affecting the distribution of plasma and ensures the effectiveness of the etching process.

[0090] Battery 104 can be a rechargeable battery or a non-rechargeable battery.

[0091] In embodiments where battery 104 is a rechargeable battery, controller 106 controls the charging and discharging of battery 104.

[0092] In embodiments where battery 104 is a rechargeable battery, battery 104 can be charged by an external power source, or the electromagnetic induction coil 103 can generate current under the electromagnetic induction of the magnetic component 6 to charge battery 104.

[0093] In an embodiment where the electromagnetic induction coil 103 generates current under the electromagnetic induction of the magnetic component 6 to charge the battery 104, the electromagnetic induction coil 103 is connected to the battery 104 via a bridge rectifier circuit and a first filter. When the battery 104 is charging, the electromagnetic induction coil 103 generates current under the electromagnetic induction of the magnetic component 6 to charge the battery 104. At this time, the battery 104 does not supply power to the electromagnetic induction coil 103, and the intermediate ring 102 is not suspended. When the intermediate ring 102 is suspended, the battery 104 supplies power to the electromagnetic induction coil 103 to generate a directional magnetic field, thereby achieving the suspension of the intermediate ring 102.

[0094] The bridge rectifier circuit can supply current from the electromagnetic induction coil 103 to the battery 104 and from the battery 104 to the electromagnetic induction coil 103. The bridge rectifier circuit includes four diodes connected in a bridge configuration, allowing current to flow in both directions.

[0095] In this solution, the detection component and the magnetic levitation component share the same battery 104, which simplifies the structure of the etching device with focusing ring detection function and reduces costs.

[0096] The electromagnetic induction coil 103 in this design generates current through electromagnetic induction, reducing external wiring and simplifying the structure of the etching device.

[0097] The power supply for magnetic component 6 can be either AC or DC.

[0098] In embodiments where the power supply for the magnetic component 6 is AC, the power supply is connected to the coil via a first branch and a second branch connected in parallel. The first branch is equipped with a first switch, a first rectified current, and a first filter, while the second branch is equipped with a second switch. When the battery 104 of the magnetic levitation component needs to be charged, the first switch is open and the second switch is closed, allowing AC current to flow through the coil of the main electromagnet 601 to generate an induced current in the electromagnetic induction coil 103 of the magnetic levitation component. The electromagnetic induction coil 103 generates current through electromagnetic induction, charging the battery 104. When the battery 104 of the magnetic levitation component does not need to be charged, the first switch is closed and the second switch is open, allowing the AC current to pass through the first rectified current and the first filter in the second branch to form DC current, and the main electromagnet 601 provides a stable magnetic field.

[0099] In an embodiment where the power supply for the magnetic component 6 is a DC power supply, the power supply is connected to the coil via a third branch and a fourth branch connected in parallel. A third switch and an inverter are installed on the third branch, and a fourth switch is installed on the second branch. When the battery 104 of the magnetic levitation component needs to be charged, the third switch is closed and the fourth switch is open. The DC power is converted into AC power by the inverter in the third branch, and AC power is supplied to the coil of the main electromagnet 601 to generate an induced current in the electromagnetic induction coil 103 of the magnetic levitation component. The electromagnetic induction coil 103 generates current through electromagnetic induction to charge the battery 104. When the battery 104 of the magnetic levitation component does not need to be charged, the first switch is open and the second switch is closed. DC power is supplied to the coil of the main electromagnet 601 via the fourth branch, and the main electromagnet 601 provides a stable magnetic field.

[0100] In some embodiments, the magnetic component 6 further includes an auxiliary electromagnet 602 and an auxiliary power supply. The coil of the auxiliary electromagnet 602 is connected to the auxiliary power supply, and the auxiliary electromagnet 602 is located within the space enclosed by the coil of the main electromagnet 601.

[0101] The auxiliary electromagnet 602 is used to assist the main electromagnet 601 in regulating the magnetic field. It is used to adjust the magnitude and direction of the magnetic field to stabilize the intermediate ring 102 when there is a tendency for the intermediate ring 102 to deviate from its suspension.

[0102] Preferably, each auxiliary electromagnet 602 corresponds to an auxiliary power supply, allowing the magnetic field of each auxiliary electromagnet 602 to be adjusted individually, thus improving the precision of adjusting the intermediate ring 102. For example... Figure 6 The image shows an embodiment with four auxiliary electromagnets 602.

[0103] The circuit design of the auxiliary power supply and auxiliary electromagnet 602 can be the same as that of the main electromagnet 601 and the power supply. When it is necessary to charge the battery 104 of the magnetic levitation component through the magnetic component 6, alternating current is passed through the main electromagnet 601 and some or all of the auxiliary electromagnets 602 to generate an alternating magnetic field, which induces a current in the electromagnetic induction coil 103.

[0104] The circuit design of the auxiliary power supply and the auxiliary electromagnet 602 can also be different from that of the main electromagnet 601 and the power supply. The auxiliary power supply is a DC power supply, and the auxiliary electromagnet 602 does not generate an alternating magnetic field.

[0105] The magnetic component 6 also includes a Hall sensor 603, which is used to detect the magnetic field distribution of the main electromagnet 601 and the auxiliary electromagnet 602, thereby assessing the stability of the intermediate ring 102 when it is suspended, so as to adjust the magnitude and direction of the magnetic field of the auxiliary electromagnet 602 to stabilize the intermediate ring 102 when a tendency of the intermediate ring 102 to shift is detected.

[0106] Hall sensors 603 are typically distributed in two mutually perpendicular directions to detect changes in the magnetic field in the two directions respectively.

[0107] A Hall sensor 603 can also be set to detect whether a magnetic levitation component exists above the magnetic component 6.

[0108] After the etching device has been working for a period of time, the electromagnetic induction coil 103 and the main electromagnet 601 generate magnetic fields in opposite directions. Through the precise control of the auxiliary electromagnet 602 and the Hall sensor 603, the intermediate ring 102 is made to levitate. The rotation angle of the intermediate ring 102 is controlled by adjusting the jet flow rate of the rotating component or the opening duration of the valve 702. When the intermediate ring 102 rotates to the target angle, the magnetic field strength of the main electromagnet 601 is changed by changing the voltage, so that the intermediate ring 102 falls back smoothly back to the support platform 3.

[0109] In some embodiments, the separating component is a ejector pin, one end of which is connected to the base 5, and the other end of which is connected to the focusing ring 2. The ejector pin has a lifting seat and a plurality of ejector pins sequentially connected and arranged on the lifting seat, which can extend and retract according to the lifting requirements.

[0110] In some embodiments, the detection component further includes a second sensor 107 for detecting the rotation angle of the intermediate ring 102. The second sensor 107 is integrated on the circuit board 101 and is communicatively connected to the controller 106.

[0111] The second sensor 107 can be an image sensor. The camera of the image sensor is set on the side of the intermediate ring 102 facing the base 5. The support platform 3 of the base 5 is provided with scale markings. When the intermediate ring 102 rotates, the image sensor rotates synchronously with the intermediate ring 102. The camera of the image sensor sends the scale markings of the base 5 it has collected to the controller 106 to obtain the rotation angle of the intermediate ring 102.

[0112] The second sensor 107 can also be a MEMS gyroscope, which detects the rotation angle of the intermediate ring 102. In this embodiment, it is not necessary to set a scale mark on the support platform 3 of the base 5.

[0113] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed, and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. The scope of this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described application concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. An etching device with focusing ring detection function, characterized in that, It includes a base (5), a focusing ring (2) and an intermediate ring (102), wherein the intermediate ring (102) and the focusing ring (2) are disposed on the base (5). It also includes a detection component, which includes a first sensor (105), a weight sensor (108), a controller (106), a battery (104), and a circuit board (101). The first sensor (105), the weight sensor (108), and the controller (106) are integrated on the circuit board (101). The battery (104) is used to power the first sensor (105), the weight sensor (108), and the controller (106). The first sensor (105) is used to detect the thickness of the focusing ring (2), and the weight sensor (108) is used to detect the weight of the focusing ring (2) corresponding to the position of the weight sensor (108). It also includes a separation component, mounted on the base (5), for lifting the intermediate ring (102) to separate the intermediate ring (102) from the focusing ring (2); A rotating component is used to drive the intermediate ring (102) to rotate so that the weight sensor (108) can detect the weight at multiple positions of the focusing ring (2), and the controller processes the weight at multiple positions to obtain the offset of the focusing ring (2).

2. The etching apparatus with focusing ring detection function according to claim 1, characterized in that, The rotating assembly includes at least two air passage assemblies (7) evenly arranged circumferentially along the base (5), and an air supply structure for supplying air to the air passage assemblies (7). The airway assembly (7) includes a first airway and a second airway with opposite jet directions. The nozzles (701) of the first airway and the second airway are located on the end face of the base (5) where the intermediate ring (102) is set. The inlets of the first airway and the second airway are connected to the air supply structure. Valves (702) are provided on both the first airway and the second airway.

3. The etching apparatus with focusing ring detection function according to claim 1 or 2, characterized in that, It also includes a lifting assembly for driving the intermediate ring (102) to rise and fall, comprising a magnetic assembly (6) and a magnetic levitation assembly. The magnetic component (6) is disposed on the base (5), and the magnetic levitation component is disposed on the intermediate ring (102). The magnetic levitation component can drive the intermediate ring (102) to rise and fall under the magnetic force of the magnetic component (6).

4. The etching apparatus with focusing ring detection function according to claim 3, characterized in that, The magnetic levitation assembly includes an electromagnetic induction coil (103) connected to the battery (104) to generate a directional magnetic field. The magnetic component (6) includes a main electromagnet (601) and a power source. The coil of the main electromagnet (601) is connected to the power source to generate a magnetic field that can act on the directional magnetic field.

5. The etching apparatus with focusing ring detection function according to claim 4, characterized in that, The magnetic component (6) further includes an auxiliary electromagnet (602) and an auxiliary power supply. The coil of the auxiliary electromagnet (602) is connected to the auxiliary power supply. The auxiliary electromagnet (602) is located within the space enclosed by the coil of the main electromagnet (601) and is used to assist the main electromagnet (601) in adjusting the magnitude and direction of the magnetic field acting on the magnetic levitation component.

6. The etching apparatus with focusing ring detection function according to claim 4 or 5, characterized in that, The power source is an AC power source, which is connected to the coil through a first branch and a second branch connected in parallel. The first branch is equipped with a first switch, a first rectifier circuit, and a first filter, and the second branch is equipped with a second switch; or, The power supply is a DC power supply, which is connected to the coil through a third branch and a fourth branch connected in parallel. A third switch and an inverter are provided on the third branch, and a fourth switch is provided on the fourth branch. The electromagnetic induction coil (103) is connected to the battery (104) through a bridge rectifier circuit and a first filter. The electromagnetic induction coil (103) can generate current under the electromagnetic induction of the magnetic component (6) to charge the battery (104).

7. The etching apparatus with focusing ring detection function according to claim 1, characterized in that, The separation component is a pin, one end of which is connected to the base (5), and the other end of which is connected to the focusing ring (2).

8. The etching apparatus with focusing ring detection function according to claim 1, characterized in that, The first sensor (105) is an ultrasonic sensor or a laser sensor.

9. The etching apparatus with focusing ring detection function according to claim 1, characterized in that, The detection component also includes a second sensor (107) for detecting the rotation angle of the intermediate ring (102), and the second sensor (107) is integrated on the circuit board 101.

10. The etching apparatus with focusing ring detection function according to claim 9, characterized in that, The second sensor (107) is an image sensor or a gyroscope.

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