Host board assembly and portable electronic device applying the same

Abstract

The application provides a host board assembly and a portable electronic device using the same. The host board assembly includes a host board body, a voltage regulation module, a heat dissipation element and a power noise shielding element. The voltage regulation module is located at a side edge of the host board body. The heat dissipation element is located on the voltage regulation module. The power noise shielding element includes a radiation shielding part and a grounding part. The radiation shielding part includes a first shielding section and a second shielding section. The first shielding section is connected with an upper surface of the heat dissipation element. The second shielding section is connected with the first shielding section and shields a side surface of the host board body, the voltage regulation module and the heat dissipation element. The grounding part is connected with the second shielding section. The power noise shielding element can solve the problem of board edge radiation caused by the voltage regulation module located at the side edge of the host board body, meet the electromagnetic interference standard specification, and improve the element configuration margin on the host board body.

Description

Technical Field

[0001] This invention relates to the field of electronics, and more particularly to a motherboard assembly and a portable electronic device using the same. Background Technology

[0002] Electronic products typically incorporate voltage regulation modules for voltage distribution. During operation, these modules generate magnetic fields due to voltage or current changes. If positioned at the edge of the motherboard, these magnetic fields can resonate with the printed circuit board lines, creating an antenna-like structure that radiates interference. The closer the voltage regulation module is to the edge, the stronger the radiation. With current design requirements necessitating low voltage and high current, this radiated interference has become increasingly important. To prevent electromagnetic interference between devices, various countries have established corresponding electromagnetic interference standards and specifications to ensure the stability and reliability of equipment operation.

[0003] In existing designs, to comply with electromagnetic interference standards, the voltage regulation module is usually recessed into the motherboard to reduce the intensity of radiation from the board edge. However, with the current trend of electronic products pursuing thinness and high efficiency, the internal components are becoming increasingly dense, and recessing the voltage regulation module into the motherboard significantly limits the design margin.

[0004] Furthermore, modern electronic products typically employ heat sinks or heat pipes to enhance heat dissipation, often integrated into voltage regulator modules to maintain their performance. However, the presence of heat dissipation components also prevents the voltage regulator module from effectively blocking edge radiation using traditional shielding methods. This is because the compromised sealing results in ineffective electromagnetic shielding. On the other hand, if the structure and dimensions of the heat dissipation device resonate with the voltage regulator module, an antenna effect may occur, further increasing edge radiation. Summary of the Invention

[0005] The purpose of this invention is to provide a motherboard assembly and a portable electronic device using the same, in order to solve at least one of the aforementioned problems.

[0006] To address the aforementioned problems, a motherboard assembly is provided. The motherboard assembly includes a motherboard body, a voltage regulation module, a heat sink, and a power noise shielding element. The voltage regulation module is located on the motherboard body and at one side edge of the motherboard body. A portion of the heat sink is located on the voltage regulation module. The power noise shielding element includes a radiation shielding portion and a grounding portion. The radiation shielding portion includes a first shielding section and a second shielding section. The first shielding section is connected to the upper surface of the heat sink, and the second shielding section is connected to the first shielding section and is substantially perpendicular to the first shielding section, shielding one side surface of the motherboard body, the voltage regulation module, and the heat sink. The grounding portion is connected to the second shielding section, and a portion of the grounding portion is connected to the lower surface of the motherboard body and is substantially parallel to the first shielding section.

[0007] The total length of the first shielding section, the second shielding section, and the grounding part is between 1.94 cm and 20 cm, and is less than half the wavelength of a power supply high-frequency noise. The frequency of the power supply high-frequency noise is 600 to 800 MHz. The width of the second shielding section is greater than or equal to the width of the voltage regulation module, and the length of the grounding part is greater than or equal to the length of the voltage regulation module.

[0008] In some embodiments, the radiation shielding portion and the grounding portion are interconnected.

[0009] More specifically, in some embodiments, the grounding portion includes a connection section and a third shielding section. The third shielding section is connected to the lower surface of the motherboard body and is generally parallel to the first shielding section. The connection section is generally perpendicular to the third shielding section, and the connection section includes multiple slots. The second shielding section includes multiple protrusions, which are respectively engaged in the slots.

[0010] More specifically, in some embodiments, the grounding portion includes a connection segment and a third shielding segment. The third shielding segment is connected to the lower surface of the motherboard body and is generally parallel to the first shielding segment. The connection segment is generally perpendicular to the third shielding segment. The radiation shielding portion also includes a snap-fit ​​segment, which is connected to the second shielding segment. A snap-fit ​​space is formed between the snap-fit ​​segment and the second shielding segment, and the connection segment snaps into the snap-fit ​​space.

[0011] In some embodiments, the second shielding section further includes a plurality of openings, the aperture of which is less than 3.75 mm.

[0012] In some embodiments, the motherboard assembly further includes a computing unit, a second heat dissipation element, and a power supply low-frequency noise cancellation component. The computing unit is located on the motherboard body and adjacent to the voltage regulation module. A portion of the heat dissipation element is located on the computing unit. The power supply low-frequency noise cancellation component is connected to a portion of the heat dissipation element on the voltage regulation module and the computing unit. The length of the power supply low-frequency noise cancellation component is less than 1 / 20 of the wavelength of the power supply low-frequency noise, and the frequency of the power supply low-frequency noise is 200 to 400 MHz.

[0013] In some embodiments, the motherboard assembly further includes a first arithmetic unit, a second arithmetic unit, and a power supply low-frequency noise cancellation component. The first and second arithmetic units are located on the motherboard body, with the first arithmetic unit situated between the voltage regulation module and the second arithmetic unit. A portion of a heat dissipation element is located on the first and second arithmetic units. The power supply low-frequency noise cancellation component connects to a portion of the heat dissipation element on the voltage regulation module and the second arithmetic unit, and shields the first arithmetic unit and its heat dissipation element. The length of the power supply low-frequency noise cancellation component is less than one-quarter of the wavelength of the power supply low-frequency noise, which has a frequency of 200 to 400 MHz.

[0014] In some embodiments, the motherboard assembly further includes a first arithmetic unit, a second arithmetic unit, and a power supply low-frequency noise cancellation component. The motherboard body includes a first carrier plate and a second carrier plate, which are separated from each other. A voltage regulation module is located on the first carrier plate, and the first and second arithmetic units are located on the second carrier plate. The first arithmetic unit is located between the voltage regulation module and the second arithmetic unit, and a portion of a heat dissipation element is located on both the first and second arithmetic units. The power supply low-frequency noise cancellation component connects the heat dissipation elements on the first and second arithmetic units, and the length of the power supply low-frequency noise cancellation component is less than 1 / 20 of the wavelength of a power supply low-frequency noise. The distance between the first and second carrier plates is less than 1 / 20 of the wavelength of a power supply low-frequency noise, and the frequency of the power supply low-frequency noise is 200 to 400 MHz.

[0015] In some embodiments, the motherboard body and the grounding portion are connected by connectors, as are the heat dissipation element and the radiation shielding portion.

[0016] Here, a portable electronic device is also provided. The portable electronic device includes a housing and the aforementioned motherboard assembly. The motherboard assembly is covered by the housing.

[0017] In some embodiments, the housing and the motherboard assembly are connected by a second connector, wherein the second connector connects the power noise shielding element and the housing.

[0018] As described in the previous embodiments, by designing the specific dimensions of the power supply noise shielding components, the problem of board edge radiation caused by the voltage regulation module located on the side edge of the motherboard body can be solved, which complies with electromagnetic interference standards and specifications, and can improve the component configuration margin on the motherboard body. Attached Figure Description

[0019] Figure 1 This is a perspective view of the first embodiment of the motherboard assembly.

[0020] Figure 2This is a top view of the first embodiment of the motherboard assembly.

[0021] Figure 3 This is a side view of the first embodiment of the motherboard assembly.

[0022] Figure 4 This is a three-dimensional schematic diagram of the first embodiment of the power supply noise shielding element.

[0023] Figure 5 This is a side view schematic diagram of a second embodiment of a power supply noise shielding element.

[0024] Figure 6 This is a three-dimensional schematic diagram of a third embodiment of a power supply noise shielding element.

[0025] Figure 7 This is a side view schematic diagram of the second embodiment of the motherboard assembly.

[0026] Figure 8 This is a side view schematic diagram of the third embodiment of the motherboard assembly.

[0027] Figure 9 This is a side view of the fourth embodiment of the motherboard assembly.

[0028] Figure 10 This is a side view schematic diagram of an embodiment of a portable electronic device.

[0029] Figure 11 Frequency-intensity plot for portable electronic devices.

[0030] Figure 12 Frequency-intensity plot for portable electronic devices.

[0031] The attached figures are labeled as follows:

[0032] 1: Motherboard Assembly

[0033] 10: Motherboard

[0034] 11: First carrier plate section

[0035] 13: Second carrier plate section

[0036] 20: Voltage regulation module

[0037] 30: Heat dissipation element

[0038] 35: Thermal pad

[0039] 40: Power supply noise shielding element

[0040] 41: Radiation shielding section

[0041] 411: First shielding section

[0042] 413: Second Shielding Section

[0043] 415: Bump

[0044] 417: Opening

[0045] 43: Grounding part

[0046] 431: Connector Section

[0047] 433: Third shielding segment

[0048] 435: Card Slot

[0049] 45: Clip Section

[0050] 50: Connector

[0051] 55: Second connector

[0052] 60: Arithmetic Unit

[0053] 61: First arithmetic unit

[0054] 63: Second Operational Unit

[0055] 70: Low-frequency noise cancellation component for power supply

[0056] 100: Portable electronic devices

[0057] 110: Chassis

[0058] G: Distance between the first carrier plate portion and the second carrier plate portion

[0059] L: Length of the voltage regulation module

[0060] L3: Length of the grounding part

[0061] S: Card slot

[0062] W: Width of the voltage regulation module

[0063] W2: Width of the second shielding segment Detailed Implementation

[0064] It should be understood that when a component is referred to as "set" or "connected" to another component, it can mean that the component is directly on the other component, or that there may be an intermediate component that connects the component to the other component. Conversely, when a component is referred to as "directly set / connected to another component" or "directly set / connected to another component," it can be understood that this explicitly defines the absence of an intermediate component.

[0065] Furthermore, the terms "first," "second," and "third" are used only to distinguish one element, component, region, layer, or part from another, and not to indicate a necessary sequential order. Additionally, relative terms such as "lower" and "upper" may be used herein to describe the relationship between one element and another. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in a figure is flipped, an element described as being "lower" than other elements would be oriented "upper" than other elements. This indicates only a relative orientation, not an absolute one.

[0066] Figure 1 This is a perspective view of the first embodiment of the motherboard assembly. Figure 2 This is a top view of the first embodiment of the motherboard assembly. Figure 3 This is a side view schematic diagram of the first embodiment of the motherboard assembly. Figures 1 to 3 As shown, the motherboard assembly 1 includes a motherboard body 10, a voltage regulator module 20, a heat sink 30, and a power noise shielding element 40. The voltage regulator module 20 is located on the motherboard body 10 and at one side edge of the motherboard body 10. The heat sink 30 is located on the voltage regulator module 20. The power noise shielding element 40 includes a radiation shielding portion 41 and a grounding portion 43. The radiation shielding portion 41 includes a first shielding section 411 and a second shielding section 413. The first shielding section 411 is connected to the upper surface of the heat sink 30, and the second shielding section 413 is connected to the first shielding section 411 and is substantially perpendicular to the first shielding section 411, shielding one side surface of the motherboard body 10, the voltage regulator module 20, and the heat sink 30. Here, "substantially perpendicular" means that it is perpendicular to the naked eye, but allows for a certain degree of deflection or bending tolerance.

[0067] The grounding portion 43 is connected to the second shielding section 413, and a portion of the grounding portion 43 is connected to the lower surface of the motherboard body 10, approximately parallel to the first shielding section 411. Here, the total length of the first shielding section 411, the second shielding section 413, and the grounding portion 43 is between 1.94 cm and 20 cm, and is less than half the wavelength of the power supply high-frequency noise. The frequency of the power supply high-frequency noise is 600 to 800 MHz. The width W2 of the second shielding section 413 is greater than or equal to the width W of the voltage regulation module 20, and the length L3 of the grounding portion 43 is greater than or equal to the length L of the voltage regulation module 20.

[0068] The 600-800MHz power supply high-frequency noise is the main frequency band that propagates outward because the voltage regulation module 20 easily forms an antenna effect with the motherboard body 10 during operation. Here, by limiting the specific dimensions of the first shielding section 411, the second shielding section 413, and the grounding part 43, resonance between the power supply noise shielding element 40 and this frequency band is avoided, thereby achieving the shielding effect.

[0069] In some instances, the motherboard body 10 and the grounding portion 43, as well as the heat dissipation element 30 and the radiation shielding portion 41, are connected by connectors 50 to increase the stability of the assembly. Additionally, the voltage regulation module 20 and the heat dissipation element 30 also include thermal pads 35.

[0070] Figure 4 This is a three-dimensional schematic diagram of the first embodiment of the power supply noise shielding element. Figure 5 This is a side view schematic diagram of a second embodiment of the power supply noise shielding element. Figure 4 and Figure 5 As shown, the radiation shielding part 41 and the grounding part 43 are connected to each other. This method can provide semi-finished products for production, which helps the production end to prepare materials.

[0071] like Figure 4 As shown, the radiation shielding part 41 and the grounding part 43 are connected to each other by a snap-fit ​​mechanism. More specifically, in this embodiment, the grounding part 43 includes a connecting section 431 and a third shielding section 433. The third shielding section 433 is connected to the lower surface of the motherboard body 10 and is generally parallel to the first shielding section 411. The connecting section 431 is generally perpendicular to the third shielding section 433. The connecting section 431 includes a plurality of slots 435. The second shielding section 413 includes a plurality of protrusions 415. The protrusions 415 are respectively engaged in the slots 435 and are engaged with each other by a meshing mechanism.

[0072] like Figure 5 As shown, in this embodiment, the grounding portion 43 similarly includes a connection segment 431 and a third shielding segment 433. However, unlike the first embodiment, the power noise shielding element 40 also includes a snap-fit ​​segment 45, which is connected to the second shielding segment 413, forming a snap-fit ​​space S between the snap-fit ​​segment 45 and the second shielding segment 413, and the connection segment 431 is assembled in the snap-fit ​​space S.

[0073] Figure 6 This is a perspective view of a third embodiment of a power supply noise shielding element. Figure 6As shown, to improve overall heat dissipation performance, the second shielding section 413 also includes multiple openings 417, but the aperture of the openings 417 is less than 3.75 mm. The aperture design of the openings 417 is intended to increase electromagnetic wave dissipation and reduce outward propagation energy. The design of the third embodiment can be applied to the power noise shielding element 40 of the first and second embodiments described above.

[0074] Figure 7 This is a side view schematic diagram of the second embodiment of the motherboard assembly. Figure 7 As shown, and also refer to Figure 1 and Figure 2 The motherboard assembly 1 also includes a processing unit 60 and a power supply low-frequency noise cancellation component 70. The processing unit 60 is located on the motherboard body 10 and adjacent to the voltage regulation module 20. A portion of the heat sink 30 is located on the processing unit 60, and the power supply low-frequency noise cancellation component 70 connects the voltage regulation module 20 and a portion of the heat sink 30 on the processing unit 60. The length of the power supply low-frequency noise cancellation component 70 is less than 1 / 20 of the wavelength of the power supply low-frequency noise, which has a frequency of 200 to 400 MHz. Here, the 200 to 400 MHz power supply low-frequency noise frequency is another peak frequency band generated by the voltage regulation module 20 during operation. Preliminary testing revealed that the intensity is strongest around the processing unit 60, such as the CPU or GPU. Furthermore, the processing unit 60 and the heat sink 30 also include a thermal pad 35.

[0075] Figure 8 This is a side view schematic diagram of the third embodiment of the motherboard assembly. Figure 8 As shown, and also refer to Figure 7 In the third embodiment, the motherboard assembly 1 further includes a first arithmetic unit 61, a second arithmetic unit 63, and a power supply low-frequency noise cancellation component 70. The first arithmetic unit 61 and the second arithmetic unit 63 are located on the motherboard body 10, with the first arithmetic unit 61 located between the voltage regulation module 20 and the second arithmetic unit 63. A portion of the heat dissipation element 30 is located on the first arithmetic unit 61 and the second arithmetic unit 63. The power supply low-frequency noise cancellation component 70 connects to a portion of the heat dissipation element 30 on the voltage regulation module 20 and the second arithmetic unit 63, and shields the first arithmetic unit 61 and the heat dissipation element 30 thereon. The length of the power supply low-frequency noise cancellation component 70 is less than 1 / 4 of the wavelength of the power supply low-frequency noise, which has a frequency of 200 to 400 MHz. Further, the first arithmetic unit 61 and / or the second arithmetic unit 63 and the heat dissipation element 30 also include a thermal pad 35.

[0076] Figure 9 This is a side view schematic diagram of the fourth embodiment of the motherboard assembly. Figure 9 As shown, and also refer to Figure 8The motherboard assembly 1 includes a first arithmetic unit 61, a second arithmetic unit 63, and a power supply low-frequency noise cancellation component 70. The difference from the third embodiment is that the motherboard body 10 includes a first carrier board portion 11 and a second carrier board portion 13, which are separated from each other. This can be two separate carrier boards, or the motherboard body 10 can have a slot separating the first carrier board portion 11 and the second carrier board portion 13. A voltage regulation module 20 is located on the first carrier board portion 11, and the first arithmetic unit 61 and the second arithmetic unit 63 are located on the second carrier board portion 13. The first arithmetic unit 61 is located between the voltage regulation module 20 and the second arithmetic unit 63, and a portion of the heat dissipation element 30 is located on both the first arithmetic unit 61 and the second arithmetic unit 63. The power supply low-frequency noise cancellation component 70 connects the heat dissipation elements 30 on the first arithmetic unit 61 and the second arithmetic unit 63, and the length of the power supply low-frequency noise cancellation component 70 is less than 1 / 20 of the wavelength of a power supply low-frequency noise. The distance G between the first carrier plate portion 11 and the second carrier plate portion 13 is less than 1 / 20 of the wavelength of the power supply low-frequency noise, and the frequency of the power supply low-frequency noise is 200 to 400 MHz.

[0077] Figure 10 This is a side view schematic diagram of an embodiment of a portable electronic device. Figure 10 As shown, the portable electronic device 100 includes a housing 110 and the aforementioned motherboard assembly 1. The motherboard assembly 1 is covered by the housing 110. Here, the portable electronic device 100 can be a desktop computer, a laptop computer, a tablet computer, a mobile phone, etc.

[0078] More specifically, in some embodiments, the housing 110 and the motherboard assembly 1 are connected by a second connector 55, wherein the second connector 55 connects the power noise shielding element 40 and the housing 110.

[0079] Figure 11 Frequency-intensity plot for portable electronic devices. Figure 12 Frequency-intensity plot for portable electronic devices. Figure 11 The voltage regulation module 20 is installed on the side edge of the motherboard body 10. A portable electronic device 100 with a power noise shielding element 40 installed is compared to a device without the power noise shielding element 40. Solid lines represent electromagnetic interference standard limits, while dashed lines represent industry-tightened standards 6 dB below the electromagnetic interference standard limits. Figure 11 As shown in the comparison, the two peak values ​​between 600 and 700 MHz and between 300 and 400 MHz both exceed the limits of the electromagnetic interference standard. Without any modifications, the product cannot pass the testing and certification of the electromagnetic interference standard and cannot be sold. However, by using the power supply noise shielding element 40, the intensity of the two peak values ​​is significantly reduced to below the industry's stricter standards.

[0080] exist Figure 12 The comparison focuses on the effects of installing power supply noise shielding components of different sizes. For example... Figure 12 As shown, when the length L3 of the grounding portion 43 is less than 0.2 times the length L of the voltage regulation module 20, the power supply high-frequency noise at a frequency of 600 to 800 MHz still slightly exceeds the industry's stringent standards. However, when it is greater than or equal to 0.5 times the length L of the voltage regulation module 20, the peak intensity is greatly reduced.

[0081] In summary, for the structure in which the voltage regulation module 20 is located on the side edge of the motherboard body 10, the edge radiation problem can be solved by setting the specific size of the power supply noise shielding element 40, so that it complies with the electromagnetic interference standard specifications and can improve the component configuration margin on the motherboard body 10.

[0082] Although the technical content of the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A motherboard assembly, comprising: One motherboard body; A voltage regulation module is located on the motherboard body and on one side edge of the motherboard body; A heat dissipation element is located on the voltage regulation module; and A power supply noise shielding element includes a radiation shielding portion and a grounding portion. The radiation shielding portion includes a first shielding section and a second shielding section. The first shielding section is connected to an upper surface of a heat dissipation element, and the second shielding section is connected to the first shielding section and is perpendicular to the first shielding section, shielding the motherboard body, the voltage regulation module, and one side surface of the heat dissipation element. The grounding portion is connected to the second shielding section, and a portion of the grounding portion is connected to a lower surface of the motherboard body and is parallel to the first shielding section. The total length of the first shielding section, the second shielding section, and the grounding portion is between 1.94 cm and 20 cm, and is less than half the wavelength of a power supply high-frequency noise with a frequency of 600 to 800 MHz. The width of the second shielding section is greater than or equal to the width of the voltage regulation module, and the length of the grounding portion is greater than or equal to the length of the voltage regulation module.

2. The motherboard assembly as claimed in claim 1, wherein the radiation shielding portion and the grounding portion are interconnected.

3. The motherboard assembly as claimed in claim 2, wherein the grounding portion includes a set of terminals and a third shielding segment, the third shielding segment is connected to the lower surface of the motherboard body and is parallel to the first shielding segment, the set of terminals is perpendicular to the third shielding segment, and the set of terminals includes a plurality of slots, the second shielding segment includes a plurality of protrusions, and the plurality of protrusions are respectively engaged in the plurality of slots.

4. The motherboard assembly as claimed in claim 2, wherein the grounding portion includes a set of terminals and a third shielding portion, the third shielding portion being connected to the lower surface of the motherboard body and parallel to the first shielding portion, the set of terminals being perpendicular to the third shielding portion, and the radiation shielding portion further including a snap-fit ​​portion, the snap-fit ​​portion being assembled to the second shielding portion, a snap-fit ​​space being formed between the snap-fit ​​portion and the second shielding portion, and the set of terminals being snapped into the snap-fit ​​space.

5. The motherboard assembly as claimed in claim 1, wherein the second shielding section further includes a plurality of openings, the aperture of the plurality of openings being less than 3.75 mm.

6. The motherboard assembly as claimed in claim 1 further includes a computing unit and a power supply low-frequency noise cancellation component, the computing unit being located on the motherboard body and adjacent to the voltage regulation module, a portion of the heat dissipation element being located on the computing unit, the power supply low-frequency noise cancellation component being connected to the voltage regulation module and a portion of the heat dissipation element on the computing unit, and the length of the power supply low-frequency noise cancellation component being less than 1 / 20 of the wavelength of a power supply low-frequency noise, the frequency of which is 200 to 400 MHz.

7. The motherboard assembly as claimed in claim 1, further comprising a first processing unit, a second processing unit, and a power supply low-frequency noise cancellation component, wherein the first processing unit and the second processing unit are located on the motherboard body, the first processing unit is located between the voltage regulation module and the second processing unit, a portion of the heat dissipation element is located on the first processing unit and the second processing unit, the power supply low-frequency noise cancellation component is connected to a portion of the heat dissipation element on the voltage regulation module and the second processing unit, and shields the first processing unit and the heat dissipation element thereon, wherein the length of the power supply low-frequency noise cancellation component is less than 1 / 4 of the wavelength of a power supply low-frequency noise, and the frequency of the power supply low-frequency noise is 200 to 400 MHz.

8. The motherboard assembly as claimed in claim 1, further comprising a first processing unit, a second processing unit, and a power supply low-frequency noise cancellation component, wherein the motherboard body comprises a first carrier plate portion and a second carrier plate portion, the first carrier plate portion and the second carrier plate portion being separate from each other, the voltage regulation module being located on the first carrier plate portion, the first processing unit and the second processing unit being located on the second carrier plate portion, the first processing unit being located between the voltage regulation module and the second processing unit, a portion of the heat dissipation element being located on the first processing unit and the second processing unit respectively, the power supply low-frequency noise cancellation component being connected to the heat dissipation element on the first processing unit and the second processing unit, and the length of the power supply low-frequency noise cancellation component being less than 1 / 20 of the wavelength of a power supply low-frequency noise, the distance between the first carrier plate portion and the second carrier plate portion being less than 1 / 20 of the wavelength of the power supply low-frequency noise, and the frequency of the power supply low-frequency noise being 200 to 400 MHz.

9. The motherboard assembly as claimed in claim 1, wherein the motherboard body and the grounding portion are respectively connected by a connector, and the heat dissipation element and the radiation shielding portion are respectively connected by a connector.

10. A portable electronic device comprising: A casing; and The motherboard assembly as described in any one of claims 1 to 9 is enclosed by the housing.

11. The portable electronic device of claim 10, wherein the housing and the motherboard assembly are connected by a second connector, wherein the second connector connects the power noise shielding element to the housing.

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