Wafer spin wet processing apparatus

Abstract

The application relates to the field of semiconductor manufacturing, and discloses a wafer rotating wet treatment device which comprises fixing mechanisms arranged in four groups and distributed at equal intervals along the axis of a rotating cylinder, wherein the fixing mechanisms comprise communicating columns, the outer surfaces of the communicating columns are fixedly connected with support plates and limiting cylinders respectively, the outer surfaces of the limiting cylinders are sleeved with buffer cylinders, and the outer surfaces of the buffer cylinders are fixedly connected with containing cylinders through connecting columns. Negative pressure is generated in the inner cavities of the communicating tubes, the negative pressure is finally applied to the lower surface of a wafer at the top of a suction disc under the communicating action of communicating cavities, communicating columns and hoses, so that suction force for fixing the wafer is generated, the suction force can maintain the wafer in a state of relative static with the fixing mechanism as a whole at the lowest value when the wafer rotates, the design greatly simplifies the structure of the device, and the negative pressure adsorption and fixing function of the wafer is also achieved, and the fixing effect is good.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a wafer rotation wet processing apparatus. Background Technology

[0002] Wafer cleaning is a process in semiconductor manufacturing that removes various contaminants from the surface of wafers using physical or chemical means to achieve the cleanliness standards required for the next process. It is a crucial step throughout the entire wafer fabrication process, accounting for 30% to 40% of the total steps. Depending on the cleaning medium and process principle, wafer cleaning is mainly divided into wet cleaning, dry cleaning, physical cleaning, and composite cleaning. Wet cleaning is currently the mainstream technology, accounting for approximately 85% of the market share. Among these, rotary wet cleaning is the most widely used. A robotic arm places the wafer on a rotating platform and rotates it. Simultaneously, a dispensing structure for the chemical cleaning solution is located above the device. The chemical cleaning solution drips onto the rotating wafer surface and cleans it. Simultaneously, the centrifugal force generated by the wafer's rotation ejects the cleaning solution, preventing residue. However, current technologies have several drawbacks in wafer fixation before processing: using vacuum chucks to fix the wafer presents a conflict between the negative pressure pipeline and the rotating platform. Excessive gap between these two systems can easily lead to negative pressure loss, causing wafer fixation failure and loosening, resulting in poor reliability. Using multiple sets of convex shafts along the wafer axis to drive its rotation can easily cause stress damage to the wafer's periphery. Furthermore, the rotating convex shaft tips can rub against the wafer's bottom during rotation, easily causing wear. Therefore, solutions are urgently needed. Summary of the Invention

[0003] This application proposes a wafer rotation wet processing apparatus with the advantage of good fixation effect, which solves the problems of the prior art.

[0004] To achieve the above objectives, this application adopts the following technical solution: a wafer rotation wet processing apparatus, comprising: A workbench, the workbench having a motor installed inside and multiple sets of supports installed at the bottom of the workbench; A liquid discharge mechanism, located above the device; A rotating cylinder is mounted on the output shaft of a motor. Multiple sets of connecting frames are mounted on the outer surface of the rotating cylinder, and multiple sets of connecting pipes are fixedly connected to one side of each connecting frame. The fixing mechanism is configured in four groups and is equidistantly distributed in a circle along the axis of the rotating cylinder. The fixing mechanism includes a connecting column, and a support plate and a limiting cylinder are fixedly connected to the outer surface of the connecting column respectively. A buffer cylinder is sleeved on the outer surface of the limiting cylinder. A receiving cylinder is fixedly connected to the outer surface of the buffer cylinder through the connecting column. A suction cup and a spring are movably sleeved inside the receiving cylinder. A limiting ring located inside the receiving cylinder is fixedly sleeved on the outer surface of the suction cup. The wafer is placed on top of multiple sets of support plates; This device has been redesigned, eliminating components such as the negative pressure pump. It provides the necessary negative pressure suction for wafer fixation even during rotation. To achieve this, the device uses a worktable and a support cylinder as a support platform. A motor inside the support cylinder drives the rotating cylinder, which is supported by four sets of fixing mechanisms mounted on the top of the rotating cylinder. These fixing mechanisms include a connecting column, a support plate, a limiting cylinder and a buffer cylinder, a flexible hose, a connecting column, a receiving cylinder, and a suction cup. The support plate, with the largest diameter, is responsible for limiting and supporting the wafer under the limiting cooperation of the limiting cylinder and the buffer cylinder. The top of the suction cup is higher than the support plate; when pressed downwards by the wafer, it is controlled by a limiting ring. A compression spring assists the suction cup in contacting the wafer to form a seal. A buffer cylinder limits and abuts the outer side of the wafer, generating friction. A connecting cavity and a flexible tube connect the suction cup and the connecting tube. When the motor drives the rotating cylinder, connecting frame, and connecting tube to rotate counterclockwise, a negative pressure is generated in the inner cavity of the connecting tube. This negative pressure, through the connection of the connecting cavity, connecting column, and flexible tube, ultimately acts on the lower surface of the wafer at the top of the suction cup, thereby generating a suction force to fix the wafer. This suction force can maintain the wafer at a minimum relative stationary position with the fixing mechanism during rotation. This design greatly simplifies the structure of the device and still achieves the function of negative pressure adsorption and fixing of the wafer, with the advantage of good fixing effect.

[0005] Preferably, the top of the workbench is provided with a support cylinder, the motor is installed on the top of the inner wall of the support cylinder, the outer surface of the support cylinder is provided with multiple sets of heat dissipation grooves, the bottom of the rotating cylinder is fixedly connected with a guide cylinder, the outer surface of the guide cylinder is fixedly connected with multiple sets of fan blades, and the inner wall of the guide cylinder is adapted to the outer surface of the support cylinder. The motor in this device drives the rotating cylinder, the fixing mechanism, and the wafer to rotate. A support cylinder is provided on the top of the support to mount the motor. A guide cylinder and fan blades are installed on the top inner side of the rotating cylinder to improve the stability of the rotating cylinder during rotation. At the same time, multiple sets of fan blades on the outer side of the guide cylinder generate an upward airflow during rotation. This airflow moves upward to the top inner side of the rotating cylinder and moves outward along the radial line of the rotating cylinder. It is then discharged along the gap between the rotating cylinder and the support. Air is then introduced to the bottom of the support through heat dissipation grooves on the outer surface of the support cylinder, thereby accelerating the airflow velocity near the motor and significantly enhancing the heat dissipation performance of the motor.

[0006] Preferably, a gap is left between the bottom of the rotating cylinder and the top of the support, and the rotating cylinder is rotatably mounted on the top of the support cylinder by a motor and a guide cylinder; like Figure 3 As shown, the gap between the rotating cylinder and the top of the support is used to discharge the airflow that absorbs heat from the motor. The flow path of the airflow inside the rotating cylinder is as follows. Figure 3 The continuously rotating fan blades generate negative pressure inside the rotating cylinder, drawing in outside air from the bottom of the support along the heat dissipation grooves, thus carrying away the heat from the motor.

[0007] Preferably, the rotating cylinder has a connecting cavity inside, which is connected to a connecting column and a connecting frame, and the connecting pipe is connected to the connecting frame; like Figure 3 As shown, when the motor drives the rotating cylinder, connecting frame, connecting tube, connecting column, and suction cup to rotate, a negative pressure is generated inside the connecting tube, opening from the outside of the inner cavity of the connecting tube to one side of the connecting tube. This negative pressure will eventually act on the wafer at the top of the suction cup, thus realizing the function of fixing the wafer with negative pressure.

[0008] Preferably, the connecting pipe is configured as three sets of parallel connecting pipes installed on the outside of the connecting frame, the outer surface of the connecting pipe is parallel to the outer surface of the rotating cylinder, and multiple sets of liquid guiding grooves are opened on the top of the rotating cylinder. like Figure 2 , Figure 5 As shown, when the three sets of parallel connecting tubes rotate counterclockwise with the rotating cylinder and connecting frame, a negative pressure is generated inside the connecting tubes, which then converges upward through the connecting cavity and acts on the suction cup through the connecting column and hose. The liquid guide groove helps to drain the chemical cleaning liquid that falls on it by backflow.

[0009] Preferably, the rotating cylinder, the connecting frame, and the connecting pipe rotate counterclockwise, and the opening at one end of the connecting pipe faces the opposite direction to the rotation of the rotating cylinder. like Figure 5 As shown, the opening direction of one end of the connecting tube is not the same as its rotation direction, which can generate a negative pressure towards the outside of the opening of one end of the connecting tube in the inner cavity of the connecting tube, thereby forming a rotational negative pressure. This design makes the structure of the device simple and reliable, and its negative pressure source stable and reliable.

[0010] Preferably, the top of the connecting column is provided with a boss, the diameter of the support plate is larger than the diameter of the buffer cylinder, the bottom of the wafer abuts against the top of the suction cup, and the outer surface of the wafer abuts against the outer surface of the buffer cylinder. like Figure 3As shown, the support plate works in conjunction with the limiting cylinder and the buffer cylinder to limit and support the wafer. The buffer cylinder is made of flexible corrosion-resistant material, and the friction generated when it comes into contact with the outer surface of the wafer helps to fix the wafer.

[0011] Preferably, a flexible hose is installed between the suction cup and the inner cavity of the connecting column, and the upper and lower ends of the spring are elastically connected to the limiting ring and the receiving cylinder, respectively. The suction cup is elastically supported in the receiving cylinder by the limiting ring and the spring. like Figure 4 As shown, the wafer presses down on the chuck by its own weight. The chuck moves the limiting ring downward and compresses the spring. The resulting rebound force can make the wafer and the chuck come into contact and form a seal. The buffer cylinder limits the outer side of the wafer and generates friction. At low speeds, the friction generated between the wafer and the chuck and the buffer cylinder is used to resist the relative rotational sliding tendency of the wafer due to inertia.

[0012] The beneficial effects of this invention are as follows: 1. This device has been redesigned, eliminating components such as the negative pressure pump. It provides the necessary negative pressure suction for wafer fixation even during rotation. To achieve this, the device uses a worktable and a support cylinder as a support platform. A motor inside the support cylinder drives the rotating cylinder, which is supported by four sets of fixing mechanisms mounted on the top of the rotating cylinder. These fixing mechanisms include a connecting column, a support plate, a limiting cylinder and a buffer cylinder, a flexible hose, a connecting column, a receiving cylinder, and a suction cup. The support plate, with the largest diameter, is responsible for limiting and supporting the wafer under the limiting cooperation of the limiting cylinder and the buffer cylinder. The top of the suction cup is higher than the support plate; when pressed downwards by the wafer, it limits the wafer's position. A ring compression spring assists the suction cup in contacting the wafer to form a seal. A buffer cylinder limits and abuts the outer side of the wafer, generating friction. A connecting cavity and a flexible tube connect the suction cup and the connecting tube. When the motor drives the rotating cylinder, connecting frame, and connecting tube to rotate counterclockwise, a negative pressure is generated in the inner cavity of the connecting tube. This negative pressure, through the connection of the connecting cavity, connecting column, and flexible tube, ultimately acts on the lower surface of the wafer at the top of the suction cup, thereby generating a suction force to fix the wafer. This suction force can maintain the wafer at the minimum value that keeps it relatively stationary with the fixing mechanism during rotation. This design greatly simplifies the structure of the device and still achieves the function of negative pressure adsorption and fixing of the wafer, with the advantage of good fixing effect.

[0013] 2. The motor in this device is used to drive the rotating cylinder, the fixing mechanism, and the wafer to rotate. A support cylinder is provided on the top of the support to install the motor. A guide cylinder and fan blades are installed on the top inner side of the rotating cylinder to improve the stability of the rotating cylinder during rotation. At the same time, multiple sets of fan blades on the outer side of the guide cylinder generate an upward airflow during rotation. This airflow moves upward to the top inner side of the rotating cylinder and moves outward along the radial line of the rotating cylinder. It is then discharged along the gap between the rotating cylinder and the support. Then, air is introduced to the bottom of the support through the heat dissipation grooves opened on the outer surface of the support cylinder, thereby accelerating the airflow velocity near the motor and significantly enhancing the heat dissipation performance of the motor. Attached Figure Description

[0014] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0015] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein: Figure 1 This is a front view diagram of the overall structure of the present invention; Figure 2 This is a frontal perspective view of the overall structure of the present invention; Figure 3 This is a front sectional view of the overall structure of the present invention; Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at point A; Figure 5 This is a top sectional view of the rotating cylinder of the present invention; Figure 6 This is a schematic diagram showing the overall structure of the present invention separated; Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure at point B; Figure 8 This is a schematic diagram showing the separation of the fixing mechanism of the present invention.

[0016] The components are as follows: 1. Support; 2. Workbench; 3. Support cylinder; 4. Heat dissipation groove; 5. Fixing mechanism; 51. Connecting column; 52. Boss; 53. Support plate; 54. Limiting cylinder; 55. Buffer cylinder; 56. Hose; 57. Connecting column; 58. Receiving cylinder; 59. Suction cup; 510. Limiting ring; 511. Spring; 6. Motor; 7. Rotating cylinder; 8. Connecting frame; 9. Connecting pipe; 10. Liquid discharge mechanism; 11. Liquid guide groove; 12. Wafer; 13. Connecting cavity; 14. Guide cylinder; 15. Fan blade. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] Please see Figures 1-8 This embodiment discloses a wafer rotation wet processing apparatus, comprising: Workbench 2, with motor 6 installed inside and multiple sets of supports 1 installed at the bottom of workbench 2; Liquid discharge mechanism 10, which is located above the device; A rotating cylinder 7 is mounted on the output shaft of a motor 6. Multiple sets of connecting frames 8 are mounted on the outer surface of the rotating cylinder 7, and multiple sets of connecting pipes 9 are fixedly connected to one side of the connecting frames 8. The fixing mechanism 5 is configured in four groups and is distributed equidistantly in a circle along the axis of the rotating cylinder 7. The fixing mechanism 5 includes a connecting column 51. The outer surface of the connecting column 51 is fixedly connected to a support plate 53 and a limiting cylinder 54. The outer surface of the limiting cylinder 54 is sleeved with a buffer cylinder 55. The outer surface of the buffer cylinder 55 is fixedly connected to a receiving cylinder 58 through a connecting column 57. The inside of the receiving cylinder 58 is movably sleeved with a suction cup 59 and a spring 511. The outer surface of the suction cup 59 is fixedly sleeved with a limiting ring 510 located inside the receiving cylinder 58. Wafer 12, which is placed on top of multiple sets of support plates 53; This device has been redesigned, eliminating components such as the negative pressure pump. It provides the necessary negative pressure suction for fixing the wafer 12 even during rotation. To achieve this, the device uses a worktable 2 and a support cylinder 3 as a support platform. A motor 6 inside the support cylinder 3 drives the rotating cylinder 7 to rotate. Four sets of fixing mechanisms 5 mounted on the top of the rotating cylinder 7 support the wafer 12. Each fixing mechanism 5 includes a connecting column 51, a support plate 53, a limiting cylinder 54, a buffer cylinder 55, a flexible hose 56, a connecting column 57, a receiving cylinder 58, and a suction cup 59. The support plate 53 has the largest diameter and is responsible for limiting and supporting the wafer 12 under the limiting cooperation of the limiting cylinder 54 and the buffer cylinder 55. The top of the suction cup 59 is higher than the support plate 53. When pressed downwards by the wafer 12, it is stopped by a limiting ring 5. A compression spring 511 is used to assist the suction cup 59 in contacting the wafer 12 to form a seal. A buffer cylinder 55 limits and abuts the outer side of the wafer 12, generating friction. The suction cup 59 and the connecting tube 9 are connected by the connecting cavity 13 and the hose 56. When the motor 6 drives the rotating cylinder 7, the connecting frame 8 and the connecting tube 9 to rotate counterclockwise, a negative pressure is generated in the inner cavity of the connecting tube 9. This negative pressure, under the connection of the connecting cavity 13, the connecting column 51 and the hose 56, finally acts on the lower surface of the wafer 12 at the top of the suction cup 59, thereby generating a suction force to fix the wafer 12. This suction force can maintain the wafer 12 at the minimum value that keeps it relatively stationary with the fixing mechanism 5 when rotating. This design greatly simplifies the structure of the device and also realizes the negative pressure adsorption and fixing function of the wafer 12, with the advantage of good fixing effect.

[0019] In this embodiment, the top of the workbench 2 is provided with a support cylinder 3, the motor 6 is installed on the top of the inner wall of the support cylinder 3, multiple sets of heat dissipation grooves 4 are opened on the outer surface of the support cylinder 3, the bottom of the rotating cylinder 7 is fixedly connected with a guide cylinder 14, multiple sets of fan blades 15 are fixedly connected to the outer surface of the guide cylinder 14, and the inner wall of the guide cylinder 14 is adapted to the outer surface of the support cylinder 3. The motor 6 in this device is used to drive the rotating cylinder 7, the fixing mechanism 5, and the wafer 12 to rotate. A support cylinder 3 is provided on the top of the support 1 to mount the motor 6. A guide cylinder 14 and fan blades 15 are installed on the top inner side of the rotating cylinder 7 to improve the stability of the rotating cylinder 7 during rotation. At the same time, multiple sets of fan blades 15 on the outer side of the guide cylinder 14 generate an upward airflow during rotation. This airflow moves upward to the top inner side of the rotating cylinder 7 and moves outward along the radial line of the rotating cylinder 7. Then it is discharged along the gap between the rotating cylinder 7 and the support 1. Then, the heat dissipation grooves 4 opened on the outer surface of the support cylinder 3 introduce air into the bottom of the support 1, thereby accelerating the airflow velocity near the motor 6 and significantly enhancing the heat dissipation performance of the motor 6.

[0020] In this embodiment, a gap is left between the bottom of the rotating cylinder 7 and the top of the support 1, and the rotating cylinder 7 is rotatably mounted on the top of the support cylinder 3 by the motor 6 and the guide cylinder 14. like Figure 3 As shown, the gap between the top of the rotating cylinder 7 and the support 1 is used to discharge the airflow that absorbs heat from the motor 6. The flow path of the airflow inside the rotating cylinder 7 is as follows: Figure 3 The continuously rotating fan blades 15 will generate negative pressure inside the rotating cylinder 7 and draw in outside air from the bottom of the support 1 along the heat dissipation groove 4, thereby carrying away the heat of the motor 6.

[0021] In this embodiment, the rotating cylinder 7 has a connecting cavity 13 inside, which is connected to the connecting column 51 and the connecting frame 8 respectively, and the connecting pipe 9 is connected to the connecting frame 8. like Figure 3 As shown, 17 connects the connecting frame 8, the connecting tube 9, the connecting post 51, and the suction cup 59. When the motor 6 drives the rotating cylinder 7, the connecting frame 8, and the connecting tube 9 to rotate, a negative pressure will be generated inside the connecting tube 9, opening from the outside of the inner cavity of the connecting tube 9 towards one side end of the connecting tube 9. This negative pressure will eventually act on the wafer 12 on the top of the suction cup 59, realizing the function of fixing the wafer 12 with negative pressure.

[0022] In this embodiment, the connecting pipe 9 is configured as three sets of parallel connecting pipes installed on the outside of the connecting frame 8. The outer surface of the connecting pipe 9 is parallel to the outer surface of the rotating cylinder 7. Multiple sets of liquid guiding grooves 11 are opened on the top of the rotating cylinder 7. like Figure 2 , Figure 5 As shown, when the three sets of parallel connecting pipes 9 rotate counterclockwise with the rotating cylinder 7 and the connecting frame 8, a negative pressure is generated inside the connecting pipes 9, which then converges upward through the connecting cavity 13 and acts on the suction cup 59 through the connecting column 51 and the hose 56. Meanwhile, the liquid guide groove 11 helps to drain the chemical cleaning liquid that falls on it by backflow.

[0023] In this embodiment, the rotating cylinder 7, the connecting frame 8, and the connecting pipe 9 rotate counterclockwise, and the orientation of the opening at one end of the outer side of the connecting pipe 9 is opposite to the rotation direction of the rotating cylinder 7. like Figure 5 As shown, the opening direction of one end of the connecting pipe 9 is not the same as its rotation direction, which can generate a negative pressure towards the outside of the opening of one end of the connecting pipe 9 in the inner cavity of the connecting pipe 9, thereby forming a rotational negative pressure. This design makes the structure of the device simple and reliable, and its negative pressure source stable and reliable.

[0024] In this embodiment, the top of the connecting column 51 is provided with a boss 52, the diameter of the support plate 53 is greater than the diameter of the buffer cylinder 55, the bottom of the wafer 12 abuts against the top of the suction cup 59, and the outer surface of the wafer 12 abuts against the outer surface of the buffer cylinder 55. like Figure 3As shown, the support plate 53 cooperates with the limiting cylinder 54 and the buffer cylinder 55 to limit and support the wafer 12. The buffer cylinder 55 is made of flexible corrosion-resistant material, and the friction generated when it comes into contact with the outer surface of the wafer 12 helps to fix the wafer 12.

[0025] In this embodiment, a flexible hose 56 is installed between the suction cup 59 and the inner cavity of the connecting column 51. The upper and lower ends of the spring 511 are elastically connected to the limiting ring 510 and the receiving cylinder 58, respectively. The suction cup 59 is elastically supported in the receiving cylinder 58 by the limiting ring 510 and the spring 511. like Figure 4 As shown, the wafer 12 presses down on the chuck 59 by its own weight. The chuck 59 drives the limiting ring 510 to move downward and compresses the spring 511. The rebound force generated by the spring compresses the wafer 12 and the chuck 59 to form a seal. The buffer cylinder 55 limits the outer side of the wafer 12 and generates friction. At low speeds, the friction generated between the wafer 12 and the chuck 59 and the buffer cylinder 55 is used to resist the relative rotational sliding tendency of the wafer 12 due to inertia.

[0026] Working principle: When this device is in operation: the liquid dispensing mechanism 10 is responsible for providing the chemical cleaning solution. First, the wafer 12 is placed on the fixing mechanism 5, such as... Figure 1 As shown, wafer 12 directly abuts against four sets of suction cups 59, and under its own weight, it continuously presses the suction cups 59 downward, causing the suction cups 59 to drive the limiting ring 510 to compress the spring 511 downward (Note: the weight of wafer 12 is greater than the elastic force generated by the compression of spring 511). The top of suction cup 59 abuts against the bottom of wafer 12 to form a seal, and the outer surface of wafer 12 abuts against the buffer cylinder 55 to generate friction, which restricts the low-speed relative rotation of wafer 12. Finally, wafer 12 abuts against the top of support plate 53 to obtain rigid support. Then, the motor 6 is started, driving the rotating cylinder 7, the fixing mechanism 5, and the wafer 12 to rotate. At low speeds, the friction generated between the wafer 12 and the chuck 59 and the buffer cylinder 55 resists the relative rotational sliding tendency of the wafer 12 due to inertia. Figure 2 , Figure 3 As shown, the rotation direction of the rotating cylinder 7 is counterclockwise. At this time, since the outer end of the connecting tube 9 is open in the opposite direction to the rotation direction of the rotating cylinder 7, a negative pressure is generated inside the connecting tube 9. This negative pressure is ultimately applied to the lower surface of the wafer 12 on the top of the suction cup 59 under the connection of the connecting cavity 13, the connecting column 51 and the hose 56, thereby generating a suction force for fixing the wafer 12. This suction force can maintain the wafer 12 at the minimum value that keeps it relatively stationary with the fixing mechanism 5 when rotating. Finally, the chemical cleaning liquid is discharged downwards by the liquid discharge mechanism 10, cleaning the upper surface of the wafer 12. The cleaning liquid is thrown outwards by the centrifugal force generated by the rotation of the wafer 12. Simultaneously, inside the rotating cylinder 7, such as... Figure 3 As shown, the rotating cylinder 7 drives the guide cylinder 14 and the fan blade 15 to rotate, and generates an upward airflow. The airflow flows outward along the inner wall of the rotating cylinder 7 and is finally discharged through the gap between the rotating cylinder 7 and the support 1. The heat dissipation groove 4 is an air intake channel, which provides air pressure balance for the inner side of the rotating cylinder 7, thereby providing heat dissipation for the motor 6.

[0027] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer rotary wet processing apparatus, characterized in that, include: Workbench (2), a motor (6) is installed inside the workbench (2), and multiple sets of supports (1) are installed at the bottom of the workbench (2). Liquid discharge mechanism (10), which is located above the device; A rotating cylinder (7) is mounted on the output shaft of a motor (6). Multiple sets of connecting frames (8) are mounted on the outer surface of the rotating cylinder (7). Multiple sets of connecting pipes (9) are fixedly connected to one side of the connecting frame (8). The fixing mechanism (5) is configured in four groups and is distributed equidistantly in a circle along the axis of the rotating cylinder (7). The fixing mechanism (5) includes a connecting column (51). The outer surface of the connecting column (51) is fixedly connected to a support plate (53) and a limiting cylinder (54). The outer surface of the limiting cylinder (54) is sleeved with a buffer cylinder (55). The outer surface of the buffer cylinder (55) is fixedly connected to a receiving cylinder (58) through a connecting column (57). The inside of the receiving cylinder (58) is movably sleeved with a suction cup (59) and a spring (511). The outer surface of the suction cup (59) is fixedly sleeved with a limiting ring (510) located inside the receiving cylinder (58). The wafer (12) is placed on top of multiple sets of support plates (53).

2. The wafer rotary wet processing apparatus according to claim 1, characterized in that, The top of the workbench (2) is provided with a support cylinder (3), the motor (6) is installed on the top of the inner wall of the support cylinder (3), the outer surface of the support cylinder (3) is provided with multiple heat dissipation grooves (4), the bottom of the rotating cylinder (7) is fixedly connected with a guide cylinder (14), the outer surface of the guide cylinder (14) is fixedly connected with multiple fan blades (15), and the inner wall of the guide cylinder (14) is adapted to the outer surface of the support cylinder (3).

3. The wafer rotary wet processing apparatus according to claim 2, characterized in that, There is a gap between the bottom of the rotating cylinder (7) and the top of the support (1). The rotating cylinder (7) is rotatably mounted on the top of the support cylinder (3) by the motor (6) and the guide cylinder (14).

4. The wafer rotary wet processing apparatus according to claim 3, characterized in that, The rotating cylinder (7) has a connecting cavity (13) inside, which is connected to the connecting column (51) and the connecting frame (8) respectively, and the connecting pipe (9) is connected to the connecting frame (8).

5. The wafer rotary wet processing apparatus according to claim 4, characterized in that, The connecting pipe (9) is configured as three sets of parallel connecting pipes installed on the outside of the connecting frame (8). The outer surface of the connecting pipe (9) is parallel to the outer surface of the rotating cylinder (7). Multiple sets of liquid guiding grooves (11) are opened on the top of the rotating cylinder (7).

6. The wafer rotary wet processing apparatus according to claim 5, characterized in that, The rotating cylinder (7), the connecting frame (8) and the connecting pipe (9) rotate counterclockwise, and the opening at one end of the outer side of the connecting pipe (9) faces the opposite direction to the rotation direction of the rotating cylinder (7).

7. The wafer rotary wet processing apparatus according to claim 6, characterized in that, The top of the connecting column (51) is provided with a boss (52), the diameter of the support plate (53) is greater than the diameter of the buffer cylinder (55), the bottom of the wafer (12) abuts against the top of the suction cup (59), and the outer surface of the wafer (12) abuts against the outer surface of the buffer cylinder (55).

8. The wafer rotary wet processing apparatus according to claim 7, characterized in that, A flexible tube (56) is installed between the suction cup (59) and the inner cavity of the connecting column (51). The upper and lower ends of the spring (511) are elastically connected to the limiting ring (510) and the receiving cylinder (58) respectively. The suction cup (59) is elastically supported in the receiving cylinder (58) through the limiting ring (510) and the spring (511).

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