Composite copper mesh with three-dimensional porous capillary structure and method of making same
By coating a rheological slurry onto a copper mesh and sintering it to form a three-dimensional porous capillary structure, the problem of insufficient capillary force of the copper mesh is solved, and a composite copper mesh with controllable thickness and stable structure is realized, which improves the two-phase flow circulation efficiency of the heat exchanger and is suitable for high power density applications and ultra-thin heat exchangers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD
- Filing Date
- 2024-12-19
- Publication Date
- 2026-06-23
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Figure CN122258680A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a capillary structure for use in heat spreader components, and more particularly to a composite copper mesh with a three-dimensional porous capillary structure formed by coating a special slurry onto a copper mesh structure and then subjecting it to drying, pyrolysis and sintering processes, as well as a method for manufacturing the same. Background Technology
[0002] Generally, vapor chamber elements using copper mesh as the capillary structure suffer from reduced two-phase flow circulation efficiency when facing high-power and high-power-density heat conduction and dissipation applications. This is due to insufficient capillary force of the copper mesh structure and poor phase change efficiency of the working fluid in the evaporation zone. This degradation is particularly pronounced when the vapor chamber element thickness decreases, requiring a thinner copper mesh capillary structure. To address this issue, conventional techniques utilize copper powder to create a slurry, which is then coated onto a copper mesh and sintered at high temperatures to produce a composite copper mesh with a three-dimensional porous capillary structure, thus increasing the capillary force of the copper mesh. However, this technique of using copper powder slurry to create a composite copper mesh has drawbacks. The poor rheological properties of the copper powder slurry hinder coating application, and the thickness of the composite copper mesh is difficult to control. Often, after sintering, the thickness of the three-dimensional porous capillary structure in the composite copper mesh exceeds the thickness of the copper mesh itself, making it difficult to control the airflow height of the vapor chamber element. Furthermore, the poor continuity of the three-dimensional porous capillary structure makes it prone to cracking and powder shedding.
[0003] Therefore, it is necessary to provide a composite copper mesh technology with a three-dimensional porous capillary structure that can precisely control the thickness of the capillary structure to be no greater than the thickness of the copper mesh, while having a finer texture and stronger adhesion, in order to solve the problems of the prior art. Summary of the Invention
[0004] In view of this, the purpose of the present invention is to provide a composite copper mesh with a three-dimensional porous capillary structure and a method for manufacturing the same, which can overcome the defects of the prior art. Due to the better rheological properties of the slurry, it can be coated more easily and the thickness is more controllable. In addition, it can be well applied to mass production mode, and can produce high-yield composite copper meshes that meet specifications on a large scale. The product has a stable structure, high porosity, and uniform distribution, which effectively improves the overall two-phase flow circulation efficiency of the component.
[0005] To achieve the above objectives, the present invention discloses a composite copper mesh with a three-dimensional porous capillary structure, characterized in that it comprises:
[0006] A copper mesh structure having multiple grids, the copper mesh structure being woven from multiple copper wires; and
[0007] Multiple three-dimensional porous capillary structures are formed in corresponding grids. Each three-dimensional porous capillary structure includes multiple chain-like copper structures and multiple block-like copper structures. The block-like copper structures are arranged and distributed among the chain-like copper structures so that the block-like copper structures, the chain-like copper structures and the copper wires are interconnected.
[0008] The thickness of the three-dimensional porous capillary structure is no greater than the thickness of the copper mesh structure.
[0009] Each of the block-shaped copper structures is either a spherical copper structure or an irregular copper structure.
[0010] In this process, the three-dimensional porous capillary structures are formed by first coating a slurry into each grid, then drying, cracking and sintering it, thereby filling the corresponding grid.
[0011] The slurry contains copper powder and cuprous oxide powder.
[0012] The copper powder in the slurry is sintered to form blocky copper structures, and the cuprous oxide powder in the slurry is sintered to form chain-like copper structures.
[0013] A method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure is also disclosed, characterized by comprising:
[0014] Prepare a copper mesh structure woven from multiple copper wires, wherein the copper mesh structure has multiple grids; and
[0015] Multiple three-dimensional porous capillary structures are formed and respectively distributed in the corresponding grid. Each three-dimensional porous capillary structure includes multiple chain-like copper structures and multiple block-like copper structures. The block-like copper structures are arranged and distributed between the chain-like copper structures so that the block-like copper structures, the chain-like copper structures and the copper wires are interconnected. The thickness of the three-dimensional porous capillary structure is not greater than the thickness of the copper grid structure.
[0016] Each of the block-shaped copper structures is either a spherical copper structure or an irregular copper structure.
[0017] The step of forming multiple three-dimensional porous capillary structures and respectively filling the corresponding meshes further includes the following sub-steps:
[0018] A slurry is applied to each grid; and
[0019] The copper mesh structure coated with the slurry is dried, pyrolyzed, and sintered to form the three-dimensional porous capillary structure and fill the corresponding meshes.
[0020] The slurry contains a first copper powder and cuprous oxide powder.
[0021] The copper powder in the slurry is sintered to form blocky copper structures, and the cuprous oxide powder in the slurry is sintered to form chain-like copper structures.
[0022] In summary, this invention provides a composite copper mesh with a three-dimensional porous capillary structure and its manufacturing method. Due to the superior rheological properties of the cuprous oxide powder slurry, this composite copper mesh can be easily coated onto the copper mesh structure. Furthermore, during the drying, pyrolysis, and sintering processes, the colloid in the slurry is removed by drying and pyrolyzed. The volume of the sintered three-dimensional porous capillary structure shrinks significantly compared to the slurry. Therefore, the overall thickness of the composite copper mesh with a three-dimensional porous capillary structure of this invention will not exceed the original copper mesh thickness. In addition, the composite copper mesh with a three-dimensional porous capillary structure of this invention can also be applied in mass production, enabling the large-scale production of high-yield and compliant composite copper meshes with a three-dimensional porous capillary structure. Moreover, after sintering, a stable, highly porosity, and uniformly distributed three-dimensional porous capillary structure can be produced, which, when applied to heat exchangers or heat pipes, can effectively improve the overall two-phase flow circulation efficiency of the components. Attached Figure Description
[0023] Figure 1 A partial schematic diagram of the copper wire and mesh according to a specific embodiment of the present invention is shown.
[0024] Figure 2 A schematic diagram of a slurry coating on a grid according to a specific embodiment of the present invention is shown.
[0025] Figure 3 Showing according to Figure 2 A magnified view of a portion of region A.
[0026] Figure 4 Showing according to Figure 2 A schematic diagram of the slurry applied to the grid from another perspective.
[0027] Figure 5 A partial schematic diagram of a composite copper mesh with a three-dimensional porous capillary structure according to a specific embodiment of the present invention is shown.
[0028] Figure 6 Showing according to Figure 5 A magnified view of a portion of region A.
[0029] Figure 7 Showing according to Figure 5 A magnified view of a portion of the three-dimensional porous capillary structure.
[0030] Figure 8 Showing according to Figure 5 A schematic diagram of the copper mesh structure and the three-dimensional porous capillary structure from another perspective.
[0031] Figure 9 A flowchart illustrating the steps of a method for fabricating a composite copper mesh with a three-dimensional porous capillary structure according to a specific embodiment of the present invention is shown.
[0032] Figure 10 A flowchart illustrating the steps of a method for fabricating a composite copper mesh with a three-dimensional porous capillary structure according to a specific embodiment of the present invention is shown. Detailed Implementation
[0033] To make the advantages, spirit, and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It should be noted that these specific embodiments are merely representative examples of the present invention, and the specific methods, apparatus, conditions, materials, etc., exemplified are not intended to limit the present invention or the corresponding specific embodiments. Furthermore, the elements in the figures are only used to illustrate their relative positions and are not drawn to scale; the step numbers in the present invention are only for distinguishing different steps and do not represent the order of the steps, as will be stated previously.
[0034] Please refer to the following: Figures 1 to 8 , Figure 1 A partial schematic diagram of copper wires 102 and 103 and mesh 101 according to a specific embodiment of the present invention is shown. Figure 2 This diagram shows a specific embodiment of the present invention with slurry 60 coated on mesh 101. Figure 3 Showing according to Figure 2 A magnified view of a portion of region A. Figure 4 Showing according to Figure 2 A schematic diagram of slurry 60 applied to grid 101 from another perspective. Figure 5 This shows a partial schematic diagram of a composite copper mesh 1 with a three-dimensional porous capillary structure according to a specific embodiment of the present invention. Figure 6 Showing according to Figure 5 A magnified view of a portion of region A. Figure 7 Showing according to Figure 5 A magnified view of a portion of the three-dimensional porous capillary structure 20. Figure 8 Showing according to Figure 5 A schematic diagram of the copper mesh structure 10 and the three-dimensional porous capillary structure 20 from another perspective. (See diagram below.) Figures 1 to 8As shown in this specific embodiment, the composite copper mesh 1 with a three-dimensional porous capillary structure includes a copper mesh structure 10 and multiple three-dimensional porous capillary structures 20. The copper mesh structure 10 has multiple grids 101 and is woven from multiple copper wires 102 and 103. The multiple three-dimensional porous capillary structures 20 are respectively formed in the corresponding grids 101. Each three-dimensional porous capillary structure 20 includes multiple chain-like copper structures 201 and multiple block-like copper structures 202. The block-like copper structures 202 are disposed and distributed between the chain-like copper structures 201 so that the block-like copper structures 202, the chain-like copper structures 201, and the copper wires 102 and 103 are interconnected. The thickness T2 of the three-dimensional porous capillary structure 20 is not greater than the thickness T1 of the copper mesh structure 10.
[0035] In practice, copper mesh structures are made by weaving together multiple copper wires stacked and woven together in different directions. For example... Figure 1 As shown, when copper wires 102 are arranged sequentially in the X direction and copper wires 103 are arranged sequentially in the Y direction, the gaps formed between each copper wire 102 and each copper wire 103 are the grid 101.
[0036] In practice, the three-dimensional porous capillary structure 20 is formed by coating each grid 101 of the copper mesh structure 10 with a prepared slurry 60, followed by drying, pyrolysis, and sintering, thereby creating a three-dimensional porous capillary structure of thickness that fills the corresponding grids. For example... Figure 2 , Figure 3 as well as Figure 4 As shown, slurry 60 is coated onto each grid 101 of the copper mesh structure 10. Because slurry 60 containing cuprous oxide powder has excellent rheological properties, it can be easily coated onto the copper mesh structure. For example, Figure 3 As shown, the slurry 60 comprises copper powder 70 (in a spherical shape), cuprous oxide powder 80 (in an octahedral shape), and colloid 90.
[0037] During the baking, pyrolysis, and sintering process, the colloid 90 will volatilize due to its low boiling point and will also pyrolyze at high temperatures, leaving only stacked copper powder 70 and cuprous oxide powder 80. Then, when the temperature is raised to the sintering temperature, the cuprous oxide powder 80 is reduced and sintered into a chain-like copper structure in a hydrogen-containing environment, and sintersects and bonds with the copper powder 70 to form a three-dimensional porous capillary structure 20.
[0038] After the slurry is coated onto the copper mesh structure, it is dried, pyrolyzed, and sintered, thereby forming a thick three-dimensional porous capillary structure that fills the corresponding mesh, such as... Figures 5 to 7As shown, the composite copper mesh 1 with a three-dimensional porous capillary structure 20 in this specific embodiment can be uniformly disposed in each mesh. Figure 7 As shown, the copper powder in the original slurry forms a blocky copper structure 202 after sintering; the cuprous oxide powder in the slurry forms a chain-like copper structure 201 after sintering, and each blocky copper structure is either a spherical copper structure or an irregular copper structure.
[0039] It is worth noting that the volume shrinks when the colloids in the slurry are removed and broken down. Please refer to [further details omitted]. Figure 4 as well as Figure 8 ,like Figure 4 as well as Figure 8 As shown, the thickness T2 of the three-dimensional porous capillary structure 20 in each grid will not exceed the thickness T1 of the copper mesh structure. In other words, since the copper mesh structure is formed by stacking copper wires in two directions, the overall thickness T1 of the copper mesh structure is equal to twice the diameter D of the copper wires. Similarly, the thickness T2 of the three-dimensional porous capillary structure 20 will not exceed twice the diameter D of the copper wires. Therefore, after sintering, the overall thickness of the composite copper mesh with a three-dimensional porous capillary structure of the present invention will not exceed the original copper mesh thickness design requirements due to the slurry.
[0040] In practical applications, the rheological properties of slurries containing cuprous oxide powder allow for easy application onto copper mesh structures, facilitating mass production. For example, entire rolls of copper mesh can be sequentially immersed in the slurry and then subjected to drying, pyrolysis, and sintering processes via a conveyor belt, thereby mass-producing composite copper meshes with a three-dimensional porous capillary structure. Furthermore, the thickness of the three-dimensional porous capillary structure produced in mass production remains no greater than the thickness of the original copper mesh structure.
[0041] It is worth noting that the three-dimensional porous capillary structure produced through mass production is a stable, highly porosity-rich, and uniformly distributed three-dimensional porous capillary structure. High porosity significantly improves the efficiency of the working fluid flowing through the porous capillary structure. Therefore, when the composite copper mesh with a three-dimensional porous capillary structure provided by this invention is applied to a heat spreader or heat pipe, it can effectively improve the overall two-phase flow circulation efficiency. Furthermore, due to the excellent rheological properties of the slurry, regardless of the thickness of the copper mesh structure, the slurry can be quickly and uniformly coated onto the mesh without size limitations. Therefore, the composite copper mesh with a three-dimensional porous capillary structure provided by this invention is also suitable for use in ultra-thin heat spreaders, especially for finished product thicknesses of only 0.3 mm, or even 0.2 mm or less.
[0042] This invention further provides a method for fabricating a composite copper mesh with a three-dimensional porous capillary structure. Please refer to [link to relevant documentation]. Figure 9 , Figure 9 A flowchart illustrating the steps of a method for fabricating a composite copper mesh with a three-dimensional porous capillary structure according to a specific embodiment of the present invention is shown. The steps in this specific embodiment can be achieved using the aforementioned apparatus (i.e., the composite copper mesh 1 with a three-dimensional porous capillary structure). Figure 9 As shown, the method for fabricating a composite copper mesh with a three-dimensional porous capillary structure in this specific embodiment includes the following steps:
[0043] Step S1: Prepare a copper mesh structure woven from multiple copper wires. The copper mesh structure has multiple grids; and
[0044] Step S2: Form multiple three-dimensional porous capillary structures and distribute them in the corresponding mesh. Each three-dimensional porous capillary structure includes multiple chain-like copper structures and multiple block-like copper structures. The block-like copper structures are distributed among the chain-like copper structures to connect the block-like copper structures, chain-like copper structures, and copper wires to each other. The thickness of the three-dimensional porous capillary structure is not greater than the thickness of the copper mesh structure.
[0045] Please see Figure 10 , Figure 10 A flowchart illustrating the steps of a method for fabricating a composite copper mesh with a three-dimensional porous capillary structure according to a specific embodiment of the present invention is shown. The steps in this specific embodiment can be achieved using the aforementioned apparatus. Figure 10 As shown, the step of forming multiple three-dimensional porous capillary structures and respectively filling the corresponding mesh further includes the following sub-steps:
[0046] Step S21: Apply a slurry to each grid; and
[0047] Step S22: Drying, pyrolysis and sintering the slurry-coated copper mesh structure to form a three-dimensional porous capillary structure that fills the corresponding mesh.
[0048] In summary, this invention provides a composite copper mesh with a three-dimensional porous capillary structure. Due to the superior rheological properties of the cuprous oxide powder slurry, it can be easily coated onto the copper mesh structure. Furthermore, during the drying, pyrolysis, and sintering processes, the colloid in the slurry is removed by drying and pyrolyzed, resulting in a significant volume reduction in the three-dimensional porous capillary structure after sintering compared to the slurry. Therefore, the overall thickness of the composite copper mesh with a three-dimensional porous capillary structure of this invention will not exceed the original copper mesh thickness. In addition, the composite copper mesh with a three-dimensional porous capillary structure of this invention can be applied to mass production, enabling the large-scale production of high-yield and compliant composite copper meshes with a three-dimensional porous capillary structure. Moreover, after sintering, a stable, highly porosity, and uniformly distributed three-dimensional porous capillary structure can be produced, which, when applied to heat exchangers or heat pipes, can effectively improve the overall two-phase flow circulation efficiency of the device.
[0049] The detailed description of the preferred embodiments above is intended to more clearly describe the features and spirit of the present invention, and is not intended to limit the scope of the invention to the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by this invention. Therefore, the scope of the patent claims made by this invention should be interpreted in the broadest possible sense based on the foregoing description, so as to cover all possible modifications and equivalent arrangements.
Claims
1. A composite copper mesh with a three-dimensional porous capillary structure, characterized in that... Includes: A copper mesh structure having multiple grids, the copper mesh structure being woven from multiple copper wires; and Multiple three-dimensional porous capillary structures are formed in corresponding grids. Each three-dimensional porous capillary structure includes multiple chain-like copper structures and multiple block-like copper structures. The block-like copper structures are arranged and distributed among the chain-like copper structures so that the block-like copper structures, the chain-like copper structures and the copper wires are interconnected. The thickness of the three-dimensional porous capillary structure is no greater than the thickness of the copper mesh structure.
2. The composite copper mesh with a three-dimensional porous capillary structure as described in claim 1, characterized in that, Each piece of copper structure is either a spherical copper structure or an irregular copper structure.
3. The composite copper mesh with a three-dimensional porous capillary structure as described in claim 1, characterized in that, These three-dimensional porous capillary structures are formed by first coating a slurry into each grid, then drying, pyrolyzing and sintering it, thereby filling the corresponding grid.
4. The composite copper mesh with a three-dimensional porous capillary structure as described in claim 3, characterized in that, The slurry contains copper powder and cuprous oxide powder.
5. The composite copper mesh with a three-dimensional porous capillary structure as described in claim 4, characterized in that, The copper powder in the slurry is sintered to form the blocky copper structures, and the cuprous oxide powder in the slurry is sintered to form the chain-like copper structures.
6. A method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure, characterized in that... Includes: Prepare a copper mesh structure woven from multiple copper wires, wherein the copper mesh structure has multiple grids; and Multiple three-dimensional porous capillary structures are formed and respectively distributed in the corresponding grid. Each three-dimensional porous capillary structure includes multiple chain-like copper structures and multiple block-like copper structures. The block-like copper structures are arranged and distributed between the chain-like copper structures so that the block-like copper structures, the chain-like copper structures and the copper wires are interconnected. The thickness of the three-dimensional porous capillary structure is not greater than the thickness of the copper grid structure.
7. The method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure as described in claim 6, characterized in that, Each piece of copper structure is either a spherical copper structure or an irregular copper structure.
8. The method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure as described in claim 6, characterized in that, The step of forming multiple three-dimensional porous capillary structures and respectively covering the corresponding meshes further includes the following sub-steps: A slurry is applied to each grid; and The copper mesh structure coated with the slurry is dried, pyrolyzed, and sintered to form the three-dimensional porous capillary structure and fill the corresponding meshes.
9. The method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure as described in claim 8, characterized in that, The slurry contains a first copper powder and cuprous oxide powder.
10. The method for manufacturing a composite copper mesh with a three-dimensional porous capillary structure as described in claim 9, characterized in that, The copper powder in the slurry is sintered to form the blocky copper structures, and the cuprous oxide powder in the slurry is sintered to form the chain-like copper structures.