Display device and manufacturing method

Abstract

The display device and manufacturing method according to embodiments of this disclosure include a barrier structure comprising: a first portion positioned in a first outer region of a first light-emitting device; a second portion positioned in a second outer region of a second light-emitting device and extending parallel to the first portion; and a third portion positioned between the first and second light-emitting devices and extending parallel to the first portion. By including this barrier structure, the light-emitting device can be easily secured, while also allowing for convenient repair.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0189625, filed on December 18, 2024, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] The embodiments disclosed herein relate to display devices and methods of manufacturing the same. Background Technology

[0004] With the advancement of the information society, the demand for display devices for displaying images has increased in various forms. Recently, a wide variety of display devices have been utilized, such as liquid crystal display (LCD) devices and organic light-emitting diode (OLED) display devices.

[0005] The display device may include a plurality of light-emitting devices. During the process of arranging the plurality of light-emitting devices, defective light-emitting devices can be detected. Defective light-emitting devices can be repaired by the operator. Summary of the Invention

[0006] The embodiments disclosed herein can provide a display device that can securely fix the light-emitting device using intermediate materials.

[0007] The embodiments disclosed herein can provide a display device in which defective light-emitting devices can be replaced by a repair process.

[0008] The embodiments disclosed herein can provide a display device that enables process optimization by fixing the light-emitting device with an intermediate material, while allowing defective light-emitting devices to be easily repaired.

[0009] The technical objectives of the embodiments disclosed herein are not limited to those expressly mentioned herein, and other objectives not expressly stated will be readily understood by those skilled in the art from the following description.

[0010] Embodiments of this disclosure may provide a display device comprising:

[0011] substrate;

[0012] A first connecting electrode disposed on a substrate and comprising a metallic material;

[0013] A first light-emitting device disposed on a first connecting electrode;

[0014] A second connecting electrode disposed on a substrate and comprising the metal material;

[0015] A second light-emitting device is disposed on the second connecting electrode;

[0016] A first intermediate material disposed on a first connecting electrode and disposed in contact with a portion of a first light-emitting device, the first intermediate material comprising a thermosetting material that is cured by exposure to heat or light;

[0017] A second intermediate material disposed on the second connecting electrode and configured to contact a portion of the second light-emitting device, the second intermediate material comprising the thermosetting material; and

[0018] The barrier structure includes a first portion located in a first outer region of a first light-emitting device, a second portion located in a second outer region of a second light-emitting device and extending parallel to the first portion, and a third portion located between the first light-emitting device and the second light-emitting device and extending parallel to the first portion.

[0019] Embodiments of this disclosure may provide a method for manufacturing a display device, the method comprising:

[0020] The installation steps include bringing the light-emitting device attached to the mold into contact with the intermediate material, and embedding a portion of the light-emitting device into the inner side of the intermediate material;

[0021] A voltage supply step, wherein a voltage is supplied to the light-emitting device via connecting electrodes, thereby causing the light-emitting device to emit light; and

[0022] An intermediate material curing step, wherein the intermediate material hardens upon receiving light emitted from the light-emitting device.

[0023] According to embodiments of this disclosure, a display device can be provided that can securely fix the light-emitting device using an intermediate material.

[0024] According to embodiments of this disclosure, a display device in which defective light-emitting devices can be replaced by a repair process can be provided.

[0025] According to embodiments of this disclosure, a display device can be provided that enables process optimization by fixing the light-emitting device with an intermediate material, while allowing defective light-emitting devices to be easily repaired.

[0026] The effects of the embodiments disclosed herein are not limited to those described above, and other effects not explicitly mentioned below will be apparent to those skilled in the art. Attached Figure Description

[0027] This disclosure will be more fully understood from the following detailed description and accompanying drawings. The detailed description and accompanying drawings are provided for illustrative purposes only and are not intended to limit the scope of this specification.

[0028] Figure 1This is a system configuration diagram of a display device according to an embodiment of the present disclosure.

[0029] Figure 2 A diagram of a light-emitting device according to an embodiment of this disclosure.

[0030] Figure 3 This is a cross-sectional view of a display panel and a light-emitting device according to an embodiment of the present disclosure.

[0031] Figure 4 This is a cross-sectional view of a display panel and a light-emitting device according to an embodiment of the present disclosure.

[0032] Figure 5 and Figure 6 This is a cross-sectional view of the manufacturing process of the display panel and the light-emitting device according to the embodiments of this disclosure.

[0033] Figure 7 and Figure 8 This is a cross-sectional view of the manufacturing process of the display panel and the light-emitting device according to the embodiments of this disclosure.

[0034] Figure 9 This is a cross-sectional view of a display panel and a light-emitting device according to an embodiment of the present disclosure.

[0035] Figure 10 This is a cross-sectional view of the light-emitting device and barrier structure according to an embodiment of the present disclosure.

[0036] Figure 11 and Figure 12 A diagram of a reflective layer according to an embodiment of this disclosure.

[0037] Figure 13 A diagram of a reflective layer according to an embodiment of this disclosure.

[0038] Figure 14 A flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure is provided. Detailed Implementation

[0039] In the following description of examples or embodiments of the invention, reference will be made to the accompanying drawings, which illustrate specific examples or embodiments that may be implemented, and wherein the same reference numerals and symbols may be used to denote the same or similar components, even when they are shown in different drawings. Furthermore, in the following description of examples or embodiments of the invention, descriptions will be omitted where detailed descriptions of well-known functions and components incorporated herein may make the subject matter of some embodiments of the invention quite unclear. Unless terms such as “comprising,” “having,” “including,” “constituting,” “made of,” and “formed by” are used herein in conjunction with the term “only,” these terms are generally intended to allow for the addition of additional components. Unless the context clearly indicates otherwise, the singular forms as used herein are intended to include the plural forms.

[0040] Terms such as “first,” “second,” “A,” “B,” “(A),” or “(B)” may be used herein to describe elements of the invention. Each of these terms is not used to define the nature, order, sequence, or number of elements, but only to distinguish the corresponding element from other elements.

[0041] When referring to the first element as "connected or coupled to," "in contact with," or "overlapping" the second element, it should be interpreted as meaning that not only can the first element be "directly connected or coupled to" or "directly in contact with or overlapping" the second element, but a third element can also be "inserted" between the first and second elements, or the first and second elements can be "connected or coupled," "in contact with," or "overlapping" with each other via a fourth element. Here, the second element can include at least one of two or more elements that are "connected or coupled," "in contact with," or "overlapping" with each other.

[0042] When time-related terms such as “after,” “following,” “next,” “before,” etc. are used to describe the process or operation of an element or configuration, or the flow or steps in an operating method, processing method, or manufacturing method, these time-related terms may be used to describe discontinuous or non-sequential processes or operations unless used with the terms “immediately” or “right away.”

[0043] Furthermore, when referring to any size, relative size, etc., it should be assumed that the numerical values ​​of elements or features or corresponding information (e.g., levels, ranges, etc.) include tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even if no relevant description is specified. In addition, the term "may" fully encompasses all the meanings of the term "able to".

[0044] Various embodiments of this specification will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 This is a system configuration diagram of a display device 100 according to an embodiment of the present disclosure.

[0046] Reference Figure 1 The display device 100 according to an embodiment of the present disclosure may include a display panel 110 as a component for image display and a display driving circuit. The display driving circuit is a circuit for driving the display panel 110 and may include a data driving circuit 120, a gate driving circuit 130, and a display controller 140.

[0047] The display panel 110 may include a substrate 111 and a plurality of sub-pixels SP disposed on the substrate 111.

[0048] The substrate 111 of the display panel 110 may include a display area DA capable of displaying images and a non-display area NDA located outside the display area DA.

[0049] The display area DA may be arranged with a plurality of sub-pixels SP for image display, and the non-display area NDA may include a pad area PA positioned in a first direction relative to the display area DA.

[0050] In the display panel 110 according to the embodiments of this disclosure, the non-display area NDA can be very small. In this specification, the non-display area NDA is also referred to as the "border".

[0051] Various types of signal lines for driving multiple sub-pixels SP can be provided on the substrate 111 of the display panel 110.

[0052] The display device 100 according to the embodiments of this disclosure can be a liquid crystal display (LCD) in which the display panel 110 emits light independently or a self-emissive display. When the display device 100 is a self-emissive display, each of the plurality of sub-pixels SP can include a light-emitting device.

[0053] For example, the display device 100 according to embodiments of the present disclosure can be an organic light-emitting display in which the light-emitting device is implemented as an organic light-emitting diode (OLED). As another example, the display device 100 can be an inorganic light-emitting display in which the light-emitting device is implemented as an inorganic light-emitting diode. As yet another example, the display device 100 can be a quantum dot display in which the light-emitting device is implemented as a quantum dot (which is an independently emitting semiconductor crystal).

[0054] The structure of each subpixel SP can vary depending on the type of display device 100. For example, when the display device 100 is a self-emissive display in which each subpixel SP emits light independently, each subpixel SP may include a light-emitting device, at least one transistor, and at least one capacitor.

[0055] Various types of signal lines can include multiple data lines DL that transmit data signals (also known as data voltages or image signals) and multiple gate lines GL that transmit gate signals (also known as scan signals).

[0056] The data driver circuit 120 is a circuit used to drive multiple data lines DL and can output data signals to multiple data lines DL.

[0057] The data drive circuit 120 can receive digital image data DATA from the display controller 140, convert the received image data DATA into an analog data signal, and output the analog data signal to multiple data lines DL.

[0058] The data driving circuit 120 may be connected to one side of the display panel 110 (e.g., the top or bottom side). Alternatively, depending on the driving method or panel design, the data driving circuit 120 may be connected to both sides of the display panel 110 (e.g., the top and bottom sides) or two or more of the four sides of the display panel 110.

[0059] The data driving circuit 120 can be connected to the outer area of ​​the display area DA of the display panel 110. Alternatively, it can be located within the display area DA of the display panel 110.

[0060] The gate drive circuit 130 is a circuit for driving a plurality of gate lines GL and can output gate signals to the plurality of gate lines GL.

[0061] The gate drive circuit 130 can receive a first gate voltage corresponding to the turn-on level voltage and a second gate voltage corresponding to the turn-off level voltage, as well as various gate drive control signals GCS, to generate a gate signal and supply the generated gate signal to a plurality of gate lines GL.

[0062] The display controller 140 is a device for controlling the data drive circuit 120 and the gate drive circuit 130, and can control the driving timing of a plurality of data lines DL and a plurality of gate lines GL.

[0063] The display controller 140 can supply a data drive control signal DCS to the data drive circuit 120 to control the data drive circuit 120, and supply a gate drive control signal GCS to the gate drive circuit 130 to control the gate drive circuit 130.

[0064] The display controller 140 can receive input image data from the main system 150 and supply image data DATA to the data drive circuit 120 based on the input image data.

[0065] The display controller 140 can be implemented as a component separate from the data drive circuit 120 or can be integrated with the data drive circuit 120 as an integrated circuit.

[0066] The display controller 140 may be a timing controller used in conventional display technology, a control device that includes a timing controller and performs additional control functions, a control device separate from the timing controller, or a circuit within the control device.

[0067] The display controller 140 can be mounted on a printed circuit board (PCB) or a flexible printed circuit (FPC) and can be electrically connected to the data drive circuit 120 and the gate drive circuit 130 via the PCB or FPC.

[0068] In addition to image display functionality, the display device 100 according to embodiments of the present disclosure may also provide touch sensing functionality. For this purpose, the display device 100 may include a touch sensor and a touch sensing circuit, the touch sensing circuit detecting whether a touch has occurred by a touch object (e.g., a finger or pen) or detecting the touch location by sensing the touch sensor.

[0069] Touch sensing circuitry may include touch driver circuitry that drives and senses touch sensors to generate and output touch sensing data, and touch controller that detects touch events or determines touch locations based on touch sensing data.

[0070] A touch sensor may include a plurality of touch electrodes. A touch sensor may also include a plurality of touch lines for electrically connecting the plurality of touch electrodes to touch driving circuitry.

[0071] The touch driving circuit can supply a touch driving signal to at least one of a plurality of touch electrodes, and can sense at least one of the plurality of touch electrodes to generate touch sensing data.

[0072] The touch driving circuit and touch controller included in the touch sensing circuit can be implemented as separate devices or a single device. Furthermore, the touch driving circuit and data driving circuit can be implemented as separate devices or a single device.

[0073] The display device 100 may also include a power supply circuit that supplies various types of power to the display driving circuit and / or touch sensing circuit.

[0074] The display device 100 according to embodiments of this disclosure may also include electronic devices such as a camera (image sensor) or a sensing sensor. For example, the sensing sensor may be a sensor that detects objects or the human body by receiving light such as infrared light, ultrasonic light, or ultraviolet light.

[0075] Figure 2 A diagram illustrating a subpixel SP according to an embodiment of the present disclosure is provided.

[0076] Reference Figure 2 Each of the plurality of sub-pixels SP may include a light-emitting device ED and a sub-pixel circuit SPC for driving the light-emitting device ED.

[0077] Reference Figure 2 The subpixel circuit SPC may include a plurality of pixel driving transistors and at least one capacitor for driving the light-emitting device ED. In this disclosure, the subpixel circuit SPC can drive the light-emitting device ED by supplying a driving current to the light-emitting device ED in a predetermined timing sequence. The light-emitting device ED can be driven by the driving current and emit light.

[0078] The plurality of pixel driving transistors may include a driving transistor DT for driving the light-emitting device ED and a scanning transistor ST that turns on or off in response to a scanning signal SC.

[0079] The driving transistor DT can supply driving current to the light-emitting device ED.

[0080] The scanning transistor ST can be configured to control the electrical state of the corresponding node in the sub-pixel circuit SPC or to control the state or operation of the driving transistor DT.

[0081] At least one capacitor may include a storage capacitor Cst that maintains a constant voltage during a frame period.

[0082] To drive the sub-pixel SP, a data signal VDATA as an image signal and a scan signal SC as a gate signal can be applied to the sub-pixel SP. Furthermore, to drive the sub-pixel SP, a common pixel driving voltage including a driving voltage VDD and a reference voltage VSS can be applied to the sub-pixel SP.

[0083] The light-emitting device ED can be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), or a quantum dot light-emitting device. For example, when the light-emitting device ED is an OLED, the intermediate light-emitting layer EL in the light-emitting device ED can include an intermediate light-emitting layer EL containing organic materials.

[0084] The driving transistor DT is used to supply driving current to the light-emitting device ED. The driving transistor DT can be connected between the driving voltage line VDDL and the light-emitting device ED.

[0085] The driving transistor DT may include a first node N1 electrically connected to the light-emitting device ED, a second node N2 to which a data signal VDATA can be applied, and a third node N3 to which a driving voltage VDD is applied from the driving voltage line DVL.

[0086] In the driving transistor DT, the second node N2 can be the gate node, the first node N1 can be either the source or drain node, and the third node N3 can be either the drain or source node. For ease of description, the following example is given: where the second node N2 is the gate node, the first node N1 is the source node, and the third node N3 is the drain node.

[0087] Figure 2 The scanning transistor ST included in the sub-pixel circuit SPC shown can be a switching transistor used to transmit the data signal VDATA, which is an image signal, to the second node N2, which is the gate node of the driving transistor DT.

[0088] The scan transistor ST can be turned on and off by a scan signal SC, which is a gate signal applied via a scan line SCL, a type of gate line GL. This allows the scan transistor ST to control the electrical connection between the second node N2 of the drive transistor DT and the data line DL. The drain or source electrode of the scan transistor ST can be electrically connected to the data line DL, the source or drain electrode of the scan transistor ST can be electrically connected to the second node N2 of the drive transistor DT, and the gate electrode of the scan transistor ST can be electrically connected to the scan line SCL.

[0089] The storage capacitor Cst can be electrically connected between the first node N1 and the second node N2 of the driving transistor DT. The storage capacitor Cst can include a first capacitor electrode electrically connected to the first node N1 of the driving transistor DT or corresponding to the first node N1 of the driving transistor DT, and a second capacitor electrode electrically connected to the second node N2 of the driving transistor DT or corresponding to the second node N2 of the driving transistor DT.

[0090] The storage capacitor Cst is an external capacitor that is intentionally designed to be outside the driving transistor DT, rather than a parasitic capacitor (e.g., Cgs, Cgd) that can exist as an internal capacitor between the first node N1 and the second node N2 of the driving transistor DT.

[0091] The driving transistor DT and the scanning transistor ST can each be an n-type transistor or a p-type transistor.

[0092] The display panel 110 may have a top-emitting structure or a bottom-emitting structure.

[0093] When the display panel 110 has a top-emitting structure, at least a portion of the sub-pixel circuit SPC can overlap with at least a portion of the light-emitting device ED in the vertical direction. Conversely, when the display panel 110 has a bottom-emitting structure, the sub-pixel circuit SPC can not overlap with the light-emitting device ED in the vertical direction.

[0094] like Figure 2 As shown, the subpixel circuit SPC can have a 2T1C structure comprising two transistors DT and ST and a capacitor Cst. In some cases, the subpixel circuit SPC may also include at least one additional transistor or at least one additional capacitor.

[0095] For example, a subpixel circuit SPC can have an 8T1C structure comprising eight transistors and one capacitor. As another example, a subpixel circuit SPC can have a 6T2C structure comprising six transistors and two capacitors. As yet another example, a subpixel circuit SPC can have a 7T1C structure comprising seven transistors and one capacitor.

[0096] Depending on the structure of the sub-pixel circuit SPC, the type and number of gate lines supplying gate signals to the sub-pixel SP can vary.

[0097] Furthermore, depending on the structure of the sub-pixel circuit SPC, the type and quantity of the common pixel driving voltage supplied to the sub-pixel SP can vary.

[0098] Figure 3 This is a cross-sectional view of the display panel 110 and the light-emitting device according to an embodiment of the present disclosure.

[0099] Reference Figure 3 The lower substrate 310 can be positioned at Figure 1 The lowest part of the display panel 110 shown in the figure.

[0100] Reference Figure 3 Connection electrodes 321 and 322 may be disposed on the lower substrate 310. Connection electrodes 321 and 322 may comprise a metallic material. Connection electrodes 321 and 322 may comprise a conductive material. Connection electrodes 321 and 322 may comprise a transparent material. That is, connection electrodes 321 and 322 may comprise a conductive metallic material, and this metallic material may be a transparent material. For example, connection electrodes 321 and 322 may be made of ITO or IZO.

[0101] Reference Figure 3Intermediate materials 331 and 332 may be disposed on connecting electrodes 321 and 322. Intermediate materials 331 and 332 may include thermosetting materials. Intermediate materials 331 and 332 can be hardened by exposure to heat or light. For example, when intermediate materials 331 and 332 are exposed to a predetermined electromagnetic energy, a chemical change may occur in the intermediate materials. In this case, intermediate materials 331 and 332 may transform from a liquid state to a solid state. The electromagnetic energy may be in the range of 500 kJ / mol to 1000 kJ / mol.

[0102] Reference Figure 3 The light-emitting device EDa may include a light-emitting layer ELa, a first electrode Ea1, and a second electrode Ea2.

[0103] The light-emitting layer ELa can be a light-emitting layer. The light-emitting layer ELa can be formed as a single layer or as a multi-quantum-well structure. The light-emitting layer ELa can include an electron supply layer and a hole supply layer.

[0104] The first electrode Ea1 can be a pixel electrode or an anode electrode. The first electrode Ea1 can contain a metallic material. For example, the first electrode Ea1 can be a transparent metal oxide such as ITO, IGZO, or IZO.

[0105] The second electrode Ea2 can be a pixel electrode or an anode electrode. The second electrode Ea2 can contain a metallic material. For example, the second electrode Ea2 can be a transparent metal oxide such as ITO, IGZO, or IZO.

[0106] A barrier structure 350 may be disposed on the lower substrate 310. The barrier structure 350 may reflect or absorb light. The barrier structure 350 may be positioned between adjacent light-emitting devices EDa. A detailed description of the barrier structure 350 will be provided below.

[0107] An insulating layer 340 can be provided to cover the barrier structure 350 and the light-emitting device EDA. The insulating layer 340 may contain insulating material or organic material. The insulating layer 340 can fix the position of the light-emitting device EDA. The upper surface of the insulating layer 340 can be formed to be flat.

[0108] A protective layer 360 may be disposed on the insulating layer 340. The protective layer 360 may contain insulating material or inorganic material. Alternatively, the protective layer 360 may be a glass substrate. The protective layer 360 can protect the light-emitting device EDa from external factors.

[0109] Figure 4 This is a cross-sectional view of the display panel 110 and the light-emitting device according to an embodiment of the present disclosure.

[0110] Reference Figure 4 The lower substrate 310 can be positioned at Figure 1 The lowest part of the display panel 110 shown in the figure.

[0111] A connection electrode 421 may be disposed on the lower substrate 310. The connection electrode 421 can supply voltage to the light-emitting devices EDb to drive them.

[0112] An intermediate material 431 may be provided on the connecting electrode 421. Figure 4 The properties of the intermediate material 431 shown in the figure can be compared with those of the intermediate material 431. Figure 3 The intermediate material 331 shown in the figure has the same properties.

[0113] The light-emitting device EDb can be disposed on the connecting electrode 421. The light-emitting device EDb may include a first electrode Eb1, a light-emitting layer ELb, and a second electrode Eb2. The first electrode Eb1 of the light-emitting device can be positioned closer to the lower substrate 310 than the second electrode Eb2. The light-emitting layer ELb can be disposed on the first electrode Eb1. The second electrode Eb2 can be disposed on the light-emitting layer ELb.

[0114] The barrier structure 350 can be positioned around the light-emitting device EDb. The barrier structure 350 can reflect or absorb light.

[0115] A first insulating layer 440 may be provided to cover the light-emitting device EDb and the barrier structure 350. The first insulating layer 440 may contain an organic material. The upper surface of the first insulating layer 440 may be flat.

[0116] A base voltage line 441 may be provided in the first insulating layer 440. The base voltage line 441 may be electrically connected to the lower substrate 310 through a contact hole formed in the first insulating layer 440. The base voltage line 441 may receive a base voltage from the lower substrate 310. The base voltage line 441 may be electrically connected to the second electrode Eb2.

[0117] A second insulating layer 450 may be disposed on the first insulating layer 440. The second insulating layer 450 may contain inorganic or organic materials.

[0118] A protective layer 460 may be disposed on the second insulating layer 450. The protective layer 460 may contain insulating material or inorganic material. Alternatively, the protective layer 460 may be a glass substrate. The protective layer 460 can protect the light-emitting device EDb from external factors.

[0119] In the following text, it will be described Figure 3 and Figure 4 This is part of the manufacturing process of the light-emitting devices EDa and EDb shown in the figure.

[0120] Figure 5 and Figure 6This is a cross-sectional view of the display panel 110 and the light-emitting device according to an embodiment of the present disclosure.

[0121] Reference Figure 5 The lower substrate 310 can be positioned at Figure 1 The lowest part of the display panel 110 shown in the figure.

[0122] Figure 5 The lower substrate 310 shown may include Figure 1 The substrate 111 shown in the figure.

[0123] Figure 5 The lower substrate 310 shown may include, for example, Figure 2 The transistors ST and DT, and the storage capacitor Cst are shown.

[0124] Reference Figure 5 Connection electrodes 321 and 322 can be disposed on the lower substrate 310. Connection electrodes 321 and 322 can comprise a metallic material. Connection electrodes 321 and 322 can comprise a conductive material. Connection electrodes 321 and 322 can comprise a transparent material. That is, connection electrodes 321 and 322 can comprise a conductive metallic material, and this metallic material can be a transparent material. For example, connection electrodes 321 and 322 can be made of ITO or IZO.

[0125] Reference Figure 5 Intermediate materials 331 and 332 can be placed on the connecting electrodes 321 and 322.

[0126] Intermediate materials 331 and 332 may include thermosetting materials. Intermediate materials 331 and 332 can be hardened by exposure to heat or light. For example, when intermediate materials 331 and 332 are exposed to a predetermined electromagnetic energy, a chemical change may occur within the intermediate materials. In this case, intermediate materials 331 and 332 may transform from a liquid state to a solid state. The electromagnetic energy may range from 500 kJ / mol to 1000 kJ / mol.

[0127] Intermediate materials 331 and 332 can be acrylate-based (polyurethane acrylate, epoxy acrylate, polyester acrylate), epoxy-based (diglycidyl ether epoxy resin, phenolic varnish epoxy resin, polyol epoxy resin), polyester-based (unsaturated polyester, polyurethane polyester), or polyurethane-based (aliphatic polyurethane, aromatic polyurethane). Furthermore, intermediate materials 331 and 332 can include resin materials. For example, intermediate materials 331 and 332 can include polymethyl methacrylate, polyurethane, epoxy resin, polyester, or polyisoprene.

[0128] Intermediate materials 331 and 332 may include non-conductive materials. However, they may also include conductive materials. For example, intermediate materials 331 and 332 may include polyacetylene, polyaniline, polypyrrole, polyphenylene, polyphenylene vinylidene, or polythiophene. Furthermore, intermediate materials 331 and 332 may include inorganic conductive materials such as silver nanoparticles or carbon black.

[0129] Reference Figure 5 The intermediate materials 331 and 332 can have a convex hemispherical shape.

[0130] Reference Figure 5 The light-emitting device EDA can be attached to the mold 510. Subsequently, the light-emitting device EDA can be placed on the intermediate materials 331 and 332. This process can be referred to as the "LED transfer process" or the "LED pick-up and placement process".

[0131] Reference Figure 5 The light-emitting device EDa may include a light-emitting layer ELa, a first electrode Ea1, and a second electrode Ea2.

[0132] The light-emitting layer ELa can be a light-emitting layer. The light-emitting layer ELa can be formed as a single layer or a multi-quantum-well structure. The light-emitting layer ELa can include an electron supply layer and a hole supply layer.

[0133] The first electrode Ea1 can be a pixel electrode or an anode electrode. The first electrode Ea1 can contain a metallic material. For example, the first electrode Ea1 can be a transparent metal oxide such as ITO, IGZO, or IZO.

[0134] The second electrode Ea2 can be a pixel electrode or an anode electrode. The second electrode Ea2 can contain a metallic material. For example, the second electrode Ea2 can be a transparent metal oxide such as ITO, IGZO, or IZO.

[0135] Reference Figure 5 The light-emitting device EDa can be attached to the impression 510. (See reference...) Figure 5 The impression 510 may include a connecting portion 511, and the light-emitting device EDa may be attached to the connecting portion 511 of the impression 510. (See reference...) Figure 6 The mold 510 can move toward the lower substrate 310. Therefore, the light-emitting device EDa can contact the intermediate materials 331 and 332. (Refer to...) Figure 6 It can be observed that the connecting electrodes 321 and 322 are electrically connected to the light-emitting device EDa.

[0136] Reference Figure 6After the light-emitting device EDa is electrically connected to the connecting electrodes 321 and 322, a voltage for driving the light-emitting device EDa can be supplied to the first electrode Ea1 and the second electrode Ea2. That is, after the impression 510 process is completed, the light-emitting device EDa can emit light while still attached to the impression 510.

[0137] A reflective layer 521 can be provided between the impression 510 and the light-emitting device EDa. The reflective layer 521 can be positioned on the outer periphery of the joint 511. The joint 511 can have a protruding shape, and the outer peripheral region 512 can be located around the joint 511. The outer peripheral region 512 can be a recessed groove region.

[0138] Reference Figure 5 The joint 511 can have a cylindrical shape. The outer peripheral region 512 can be shaped into a cylinder centered on the joint 511. Figure 5 In the cross-sectional view, a right-angled triangular groove is observed on the left side of the joint 511 near its lower portion. Similarly, a right-angled triangular groove is observed on the right side of the joint 511 near its lower portion. These right-angled triangular grooves can be formed around the entire outer periphery of the joint 511.

[0139] Reference Figure 5 The reflective layer 521 can be disposed in the outer peripheral region 512. The reflective layer 521 can be located in the outer peripheral region 512 and positioned at the lower part of the impression 510. (See reference...) Figure 5 The reflective layer 521 may not overlap with the joint 511.

[0140] The reflective layer 521 can reflect light emitted from the light-emitting device EDa. The reflective layer 521 can contain a material capable of reflecting light. For example, the reflective layer 521 can be a metallic material, but is not limited thereto.

[0141] Light emitted from the light-emitting device EDa can be reflected downwards by the reflective layer 521. The reflected light can travel towards the intermediate materials 331 and 332. The reflected light can pass through the light-emitting device EDa, the light-emitting layer EDa, the first electrode Ea1, and the second electrode Ea2.

[0142] When reflected light reaches intermediate materials 331 and 332, they can change from a liquid to a solid state. Their viscosity can also change from low to high as the reflected light reaches intermediate materials 331 and 332. Once intermediate materials 331 and 332 harden, the light-emitting device EDa can be fixed in place using these materials. (Refer to...) Figure 6 The first electrode Ea1 and the second electrode Ea2 of the light-emitting device EDa can be electrically connected to the connecting electrodes 321 and 322. That is, the light-emitting device EDa can be electrically connected to the connecting electrodes 321 and 322 while maintaining their stable and fixed positions.

[0143] The above process can be summarized as follows: The light-emitting device EDA can be brought into contact with the intermediate materials 331 and 332 on the connecting electrodes 321 and 322 via the mold 510. In this case, the first electrode Ea1 and the second electrode Ea2 can penetrate into the inner side of the intermediate materials 331 and 332, thereby allowing the light-emitting device EDA to be electrically connected to the connecting electrodes 321 and 322. Subsequently, the light-emitting device EDA can emit light. The emitted light can be reflected by the reflective layer 521 towards the lower part of the light-emitting device EDA, which can harden the intermediate materials 331 and 332. Therefore, the light-emitting device EDA can maintain its electrical connection to the connecting electrodes 321 and 322 while being securely fixed in place.

[0144] If the light-emitting device EDA is not electrically connected to the connecting electrodes 321 and 322, it may not emit light. If EDA does not emit light, the intermediate materials 331 and 332 overlapping with it may not harden. That is, if EDA itself is defective or if it is abnormally connected to the connecting electrodes 321 and 322, its position may not be fixed. Subsequently, the unfixed light-emitting device EDA can be fixed by a separate repair process. However, the repaired light-emitting device EDA may not overlap with the intermediate materials 331 and 332.

[0145] Figure 5 and Figure 6 The light-emitting device EDa shown can be a flip-type light-emitting device in which both the first electrode Ea1 and the second electrode Ea2 are disposed on one side of the device. Below, a vertical light-emitting device in which the first electrode Ea1 is disposed on one side and the second electrode Ea2 is disposed on the opposite side will be described.

[0146] Figure 7 and Figure 8 This is a cross-sectional view of the display panel 110 and the light-emitting device according to an embodiment of the present disclosure.

[0147] Reference Figure 7 A connection electrode 421 can be provided on the lower substrate 310. The connection electrode 421 can be an electrode supplied with a high potential voltage. However, depending on the design, the connection electrode 421 can also be an electrode supplied with a low potential voltage.

[0148] Intermediate material 431 can be placed on the connecting electrode 421. Figure 7 The properties of the intermediate material 431 shown in the figure can be compared with those of the intermediate material 431. Figure 5 The intermediate materials 331 and 332 shown in the figure have the same properties.

[0149] Reference Figure 7The light-emitting device EDb can be attached to the bonding portion 511 of the mold 510. The light-emitting device EDb may include a first electrode Eb1, a light-emitting layer ELb, and a second electrode Eb2. The first electrode Eb1 of the light-emitting device EDb can be positioned closer to the lower substrate 310 than the second electrode Eb2. The second electrode Eb2 of the light-emitting device EDb can be positioned to contact the bonding portion 511 of the mold 510. The light-emitting layer ELb can be located between the first electrode Eb1 and the second electrode Eb2. (Refer to...) Figure 7 The luminescent layer ELb can have a trapezoidal shape, but is not limited to this.

[0150] Reference Figure 7 and Figure 8 The mold 510 can move toward the lower substrate 310. Therefore, the light-emitting device EDb can be electrically connected to the connecting electrode 421. (See reference...) Figure 8 The first electrode Eb1 of the light-emitting device EDb can be electrically connected to the connecting electrode 421.

[0151] Reference Figure 7 and Figure 8 The impression 510 may include a power line 530. The power line 530 may be electrically connected to the second electrode Eb2 of the light-emitting device EDb. (See reference...) Figure 8 The first electrode Eb1 of the light-emitting device EDb can be electrically connected to the connecting electrode 421, while the second electrode Eb2 can be electrically connected to the power line 530 of the impression 510.

[0152] After the light-emitting device EDb is electrically connected to the connecting electrode 421, a voltage can be supplied to the light-emitting device EDb. For example, the first electrode Eb1 of the light-emitting device EDb can receive a high potential voltage through the connecting electrode 421, while the second electrode Eb2 of the light-emitting device EDb can receive a low potential voltage lower than the high potential voltage through the power supply line 530. However, alternatively, the first electrode Eb1 of the light-emitting device EDb can receive a low potential voltage through the connecting electrode 421, while the second electrode Eb2 of the light-emitting device EDb can receive a high potential voltage higher than the low potential voltage through the power supply line 530.

[0153] After supplying a high-potential voltage and a low-potential voltage to the light-emitting device EDb, the device can emit light. (Refer to...) Figure 5 and Figure 7 , Figure 7 The impression 510 shown may include Figure 5The reflective layer 521 is shown. Light emitted from the light-emitting device EDb can be reflected by the reflective layer 521 towards the lower part of the light-emitting device EDb. Therefore, the intermediate material 431 can be hardened. Once the intermediate material 431 is hardened, the position of the light-emitting device EDb can be fixed. For example, the position of the first electrode Eb1 of the light-emitting device EDb can be fixed, and similarly, the position of the light-emitting layer ELb of the light-emitting device EDb can be fixed. That is, the first electrode Eb1 of the light-emitting device EDb can be electrically connected to the connecting electrode 421 while maintaining a fixed position.

[0154] If the light-emitting device EDb itself is defective, or if the first electrode Eb1 of the light-emitting device EDb is abnormally connected to the connecting electrode 421, the light-emitting device EDb may not emit light. Therefore, the intermediate material 431 may not harden. The unhardened intermediate material 431 can undergo a repair process performed by the operator. After the repair process, the intermediate material 431 may still remain beneath the repaired light-emitting device EDb, but it can also be removed. That is, the repaired light-emitting device EDb may not overlap with the intermediate material 431.

[0155] Figure 9 This is a cross-sectional view of the display panel 110 and the light-emitting device EDb according to an embodiment of the present disclosure.

[0156] Figure 9 The lower substrate 310, connecting electrode 421, intermediate material 931, light-emitting device EDb, and mold 510 shown can be connected to... Figure 7 and Figure 8 The ones shown are the same. Therefore, repeated descriptions will be omitted.

[0157] Reference Figure 9 The first electrode Eb1 of the light-emitting device EDb can be in contact with the intermediate material 931. In this case, the intermediate material 931 may include a conductive material. The first electrode Eb1 of the light-emitting device EDb can be spaced apart from the connecting electrode 421 without direct contact with the connecting electrode 421. Although the first electrode Eb1 is not in direct contact with the connecting electrode 421, the intermediate material 931 can electrically connect the first electrode Eb1 to the connecting electrode 421.

[0158] The above description can be summarized as follows: The connecting electrode 421 can be disposed on the lower substrate 310. The intermediate material 931 can be disposed on the connecting electrode 421. The first electrode Eb1 of the light-emitting device EDb can be disposed on the intermediate material 931. The first electrode Eb1 of the light-emitting device EDb can overlap with and be spaced apart from the connecting electrode 421. The first electrode Eb1 of the light-emitting device EDb can overlap with and contact the intermediate material 931. The intermediate material 931 may include a conductive material, and the first electrode Eb1 can be electrically connected to the connecting electrode 421 through the intermediate material 931.

[0159] At the same time, refer to Figures 7 to 8 When the intermediate material 431 is exposed to light, it can harden. This property of the intermediate material 431 allows for the determination of whether the light-emitting device EDb disposed on the intermediate material 431 is defective. However, the intermediate material 431 may also harden due to light emitted by the light-emitting device EDb, which never overlaps with the intermediate material 431. The following describes features of a display device designed to prevent this.

[0160] Figure 10 This is a cross-sectional view of the light-emitting device EDb and the barrier structure according to an embodiment of this disclosure.

[0161] Reference Figure 10 The light-emitting device EDb can be placed inside the barrier structure 350.

[0162] Reference Figure 10 The barrier structure 350 can have a grid shape or a linear shape.

[0163] Reference Figure 10 The first example (case 1) shows an instance where the barrier structure 350 has a grid shape. The grid structure can have a # shape or a repeating square pattern. The light-emitting device EDb can be located inside the # shape or square pattern.

[0164] Reference Figure 10 The second example (case 2) shows an instance where the barrier structure 350 has a linear shape. (Refer to...) Figure 10 The barrier structure 350 may include a first barrier 351, a second barrier 352, a third barrier 353, and a fourth barrier 354. The barrier structure 350 may be configured to extend in a vertical direction. A first light-emitting device EDb1 may be located between the first barrier 351 and the second barrier 352. A second light-emitting device EDb2 may be located between the second barrier 352 and the third barrier 353. A third light-emitting device EDb3 may be located between the third barrier 353 and the fourth barrier 354.

[0165] When the barrier structure 350 is positioned around the light-emitting device EDb, light emitted from the light-emitting device EDb can be reflected by the barrier structure 350. (Refer to...) Figure 10 Light emitted from the first light-emitting device EDb1 can be reflected by a barrier on the right side of the first light-emitting device EDb1, causing the light to initially travel to the right and then to the left. Similarly, light emitted from the third light-emitting device EDb3 can be reflected by a barrier on the left side of the third light-emitting device EDb3, causing the light to initially travel to the left and then to the right.

[0166] That is, the light emitted from the first light-emitting device EDb1 can be reflected by the barrier structure 350, so that it is directed to the upper side of the first light-emitting device EDb1. Similarly, the light emitted from the third light-emitting device EDb3 can be reflected by the barrier structure 350, so that it is directed to the upper side of the third light-emitting device EDb3.

[0167] Reference Figure 10 The second light-emitting device EDb2 may be a defective light-emitting device that does not emit light, or it may be a light-emitting device that is not electrically connected to the connecting electrode 421. Therefore, the intermediate material 431 located below the second light-emitting device EDb2 may not harden. In this case, due to the barrier structure 350, light emitted from the first light-emitting device EDb1 and the third light-emitting device EDb3 may not travel toward the intermediate material 431 located below the second light-emitting device EDb2. That is, when the barrier structure 350 is positioned around the light-emitting device EDb, the intermediate material 431 located below the defective light-emitting device EDb may not harden.

[0168] In other words, if the barrier structure 350 is not present, the intermediate material 431 positioned below the second light-emitting device EDb2 may still harden in some cases. However, when the barrier structure 350 is in the proper position, the intermediate material 431 positioned below the second light-emitting device EDb2 may not harden.

[0169] Figure 11 and Figure 12 A diagram relating to the reflective layer according to an embodiment of this disclosure.

[0170] Reference Figure 11 You can see the mold 510, the light-emitting device EDc attached to the mold 510, and the reflective layer 522 positioned below the mold 510.

[0171] The light-emitting device EDc can be attached to the joint 513 of the impression 510.

[0172] The outer region of the joint 513 can be an outer peripheral region 514. The outer peripheral region 514 can be a recessed, groove-shaped region. The reflective layer 522 can be disposed in the outer peripheral region 514. (Refer to...) Figure 11 The reflective layer 522 can have a convex hemispherical shape. In this case, the hemispherical shape can be elliptical or can have a uniform curvature.

[0173] Reference Figure 11 A cross-sectional view of the reflective layer 522 can be seen. Based on the cross-sectional view, the reflective layer 522 located on the right side of the joint 511 can have a shape that curves downward from the upper left to the lower right, and in this case, the reflective layer 522 can have a convex elliptical shape. Similarly, the reflective layer 522 located on the left side of the joint 511 can have a shape that curves downward from the upper right to the lower left, and in this case, the reflective layer 522 can also have a convex elliptical shape. Because the reflective layer 522 has a convex elliptical shape, the light emitted from the light-emitting device EDc can be more effectively guided to the center of the light-emitting device EDc. For example, with Figure 5 Compared to the reflective layer 521 shown in the figure, Figure 11 The reflective layer 522 shown can guide more light to the light-emitting device EDc.

[0174] Reference Figure 12 The mating portion 515 of the mold 510 may include a groove region 516. The groove region 516 of the mating portion 515 of the mold 510 may include multiple grooves. A plurality of internal reflective layers 523 and 524 may be disposed inside the plurality of grooves. The plurality of internal reflective layers 523 and 524 may overlap with the light-emitting device EDd. Therefore, light emitted from the light-emitting device EDd can be guided upward, and the plurality of internal reflective layers 523 and 524 positioned above the light-emitting device EDd can reflect light downward.

[0175] Reference Figure 12 The mating portion 515 of the mold 510 may have a flat bottom surface. The bottom surface of the mating portion 515 of the mold 510 may be flat, and a light-emitting device EDd may be attached to a central portion of the mating portion 515. The central region of the mating portion 515 may include an attachment region and a recessed region 516 for the light-emitting device EDd. An external reflective layer 525 may be provided in the outer peripheral region 517 of the center of the mating portion 515. The external reflective layer 525 may reflect light emitted from the light-emitting device EDd toward the lower part of the light-emitting device EDd.

[0176] Figure 13 A diagram illustrating the reflective layer 521 according to an embodiment of the present disclosure is provided.

[0177] Reference Figure 13 An intermediate material 1331 may be disposed on the lower substrate 310. Figure 13 The properties of intermediate material 1331 shown in the figure are similar to Figure 5The intermediate materials 331 and 332 shown in the figure have the same properties.

[0178] Reference Figure 13 The light-emitting device EDe may include a first electrode Ee1, a second electrode Ee2, and a light-emitting layer ELe. Figure 13 The structure of the light-emitting device EDe shown in the figure can be compared with... Figure 5 The structure of the light-emitting device EDe shown is the same. That is, the light-emitting device EDe can be an inverted type light-emitting device.

[0179] Reference Figure 13 The impression 510 may include a first type of voltage supply line 531 and a second type of voltage supply line 532. The first type of voltage supply line 531 may be electrically connected to the first electrode Ee1 of the light-emitting device EDe. The second type of voltage supply line 532 may be electrically connected to the second electrode Ee2 of the light-emitting device EDe. When a high potential voltage is supplied through the first type of voltage supply line 531, a low potential voltage may be supplied through the second type of voltage supply line 532.

[0180] Reference Figure 13 The light-emitting device EDe can be attached to the joint 511 of the mold 510. When the mold 510 moves toward the lower substrate 310, the light-emitting layer ELe of the light-emitting device EDe can come into contact with the intermediate material 1331.

[0181] After the light-emitting layer ELe of the light-emitting device EDe comes into contact with the intermediate material 1331, voltage can be supplied through the first type of voltage supply line 531 and the second type of voltage supply line 532, thereby causing the light-emitting device EDe to emit light. The light emitted from the light-emitting device EDe can be guided to the intermediate material 1331, thereby hardening the intermediate material 1331. As the intermediate material 1331 hardens, the position of the light-emitting device EDe can be fixed.

[0182] Figure 14 A flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure is provided.

[0183] Reference Figure 14 The method for manufacturing a display device may include an installation step S1410, a voltage supply step S1420, and an intermediate material curing step S1430.

[0184] Installation step S1410 may involve bringing the light-emitting device attached to the mold into contact with the intermediate material, thereby allowing a portion of the light-emitting device to penetrate into the interior region of the intermediate material. In installation step S1410, the intermediate material may be in an uncured state. In installation step S1410, the light-emitting device may remain attached to the mold at the joint.

[0185] The voltage supply step S1420 can be a step in which voltage is supplied to the light-emitting device through the connecting electrodes, thereby causing the light-emitting device to emit light. When the light-emitting device is operating, the light emitted from the light-emitting device can be directed to the intermediate material.

[0186] The intermediate material curing step S1430 can be a step in which the intermediate material hardens upon receiving light emitted from the light-emitting device. As the intermediate material hardens, the position of the light-emitting device can be fixed. In the intermediate material curing step S1430, a reflective layer positioned at the lower part of the impression can reflect the light emitted from the light-emitting device toward the area where the intermediate material is located. The reflective layer can be positioned in the outer peripheral region of the joint or in the groove region of the joint.

[0187] The display device according to an embodiment of the present disclosure can be described as follows.

[0188] Embodiments of this disclosure provide a display device comprising: a substrate; a first connecting electrode disposed on the substrate and comprising a metallic material; a first light-emitting device disposed on the first connecting electrode; a second connecting electrode disposed on the substrate and comprising a metallic material; a second light-emitting device disposed on the second connecting electrode; a first intermediate material disposed on the first connecting electrode and configured to contact a portion of the first light-emitting device, the first intermediate material comprising a thermosetting material that hardens upon exposure to heat; a second intermediate material disposed on the second connecting electrode and configured to contact a portion of the second light-emitting device, the second intermediate material comprising a thermosetting material; and a barrier structure comprising a first portion positioned in a first outer region of the first light-emitting device, a second portion positioned in a second outer region of the second light-emitting device and extending parallel to the first portion, and a third portion positioned between the first light-emitting device and the second light-emitting device and extending parallel to the first portion.

[0189] The first light-emitting device may include a light-emitting layer, a first electrode disposed on one side of the light-emitting layer, and a second electrode disposed on the same side of the light-emitting layer, wherein the first electrode may be embedded in the inner side of a first intermediate material.

[0190] A first intermediate material may surround the outer edge of the first electrode, and a second intermediate material may surround the outer edge of the second electrode.

[0191] The first electrode can be electrically connected to the first connecting electrode, and the second electrode can be electrically connected to the second connecting electrode.

[0192] The first electrode may contact the first connecting electrode, and the second electrode may contact the second connecting electrode. The first intermediate material and the second intermediate material may include non-conductive materials.

[0193] A first intermediate material may be disposed between the first electrode and the first connecting electrode, and a second intermediate material may be disposed between the second electrode and the second connecting electrode. Both the first and second intermediate materials may include conductive materials.

[0194] The first intermediate material may include at least one material selected from acrylate-based materials, epoxy-based materials, and polyurethane-based materials.

[0195] The position of the first light-emitting device can be fixed by the first intermediate material, and the position of the second light-emitting device can be fixed by the second intermediate material.

[0196] The first light-emitting device may include a first electrode overlapping with a first connecting electrode, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer, wherein the first electrode is embedded in the inner side of a first intermediate material, and the first intermediate material surrounds the outer edge of the first electrode.

[0197] The first electrode can be electrically connected to the first connecting electrode.

[0198] The first electrode may be in contact with the first connecting electrode, and the first intermediate material may include a non-conductive material.

[0199] The first intermediate material may be disposed between the first electrode and the first connecting electrode, and the first intermediate material may include a conductive material.

[0200] The barrier structure may contain reflective materials.

[0201] The barrier structure may contain light-absorbing materials.

[0202] The barrier structure can be positioned to surround the first light-emitting device and the second light-emitting device.

[0203] The first part can be extended to connect to the second part, and the third part can be extended to connect to the second part.

[0204] The second part can be separated from the first and third parts.

[0205] The first light-emitting device may include a light-emitting layer, a first electrode disposed on one side of the light-emitting layer, and a second electrode disposed on the same side of the light-emitting layer, wherein the light-emitting layer is embedded in the inner side of a first intermediate material.

[0206] Therefore, the display device can securely fix the light-emitting device. Furthermore, defective light-emitting devices can be replaced through repair processes. Additionally, process optimization can be achieved.

[0207] Embodiments of this disclosure provide a method for manufacturing a display device, the method comprising: an mounting step, wherein a light-emitting device attached to a mold is brought into contact with an intermediate material, and a portion of the light-emitting device is embedded in the inner side of the intermediate material; a voltage supply step, wherein a voltage is supplied to the light-emitting device via a connecting electrode, thereby causing the light-emitting device to emit light; and an intermediate material curing step, wherein the intermediate material hardens upon receiving light emitted from the light-emitting device.

[0208] During the installation step, the light-emitting device can be attached to the joint of the mold. During the intermediate material curing step, a reflective layer positioned beneath the mold reflects light emitted from the light-emitting device toward the area where the intermediate material is located. The reflective layer can be positioned in the outer area of ​​the joint or in the recessed area of ​​the joint.

[0209] The foregoing description has been presented to enable any person skilled in the art to obtain and use the technical ideas of the invention, and has been provided in the context of a particular application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the invention. The foregoing description and drawings are provided for illustrative purposes only, illustrating examples of the technical ideas of the invention. That is, the disclosed embodiments are intended to illustrate the scope of the technical ideas of the invention.

Claims

1. A display device, comprising: substrate; A first connecting electrode disposed on the substrate and comprising a metallic material; A first light-emitting device disposed on the first connecting electrode; A second connecting electrode disposed on the substrate and comprising the metal material; A second light-emitting device disposed on the second connecting electrode; A first intermediate material disposed on the first connecting electrode and disposed in contact with a portion of the first light-emitting device, the first intermediate material comprising a thermosetting material that is cured by exposure to heat or light; A second intermediate material is disposed on the second connecting electrode and configured to contact a portion of the second light-emitting device, the second intermediate material comprising the thermosetting material; as well as The barrier structure includes a first portion located in a first outer region of the first light-emitting device, a second portion located in a second outer region of the second light-emitting device and extending parallel to the first portion, and a third portion located between the first light-emitting device and the second light-emitting device and extending parallel to the first portion.

2. The display device according to claim 1, wherein the first light-emitting device comprises: First luminescent layer; A first electrode disposed on one side of the first light-emitting layer; as well as A second electrode is disposed on the same side of the first light-emitting layer. The first electrode is embedded in the inner side of the first intermediate material, and The second light-emitting device includes: Second light-emitting layer; The third electrode disposed on the second light-emitting layer; and The fourth electrode is disposed on the second light-emitting layer together with the third electrode. The third electrode is embedded in the inner side of the second intermediate material.

3. The display device according to claim 2, wherein the first intermediate material surrounds the outer edge of the first electrode, and the second intermediate material surrounds the outer edge of the third electrode.

4. The display device according to claim 3, wherein the first electrode is electrically connected to the first connection electrode; and the third electrode is electrically connected to the second connection electrode.

5. The display device according to claim 4, The first electrode is in contact with the first connecting electrode. The third electrode is in contact with the second connecting electrode, and The first intermediate material and the second intermediate material include non-conductive materials.

6. The display device according to claim 4, The first intermediate material is disposed between the first electrode and the first connecting electrode. The second intermediate material is disposed between the third electrode and the second connecting electrode, and The first intermediate material and the second intermediate material include conductive materials.

7. The display device according to claim 1, wherein the first intermediate material comprises at least one material selected from acrylate-based materials, epoxy-based materials, and polyurethane-based materials.

8. The display device according to claim 1, The position of the first light-emitting device is fixed by the first intermediate material, and The position of the second light-emitting device is fixed by the second intermediate material.

9. The display device according to claim 1, wherein the first light-emitting device comprises: The first electrode that overlaps with the first connecting electrode; A light-emitting layer disposed on the first electrode; as well as A second electrode is disposed on the light-emitting layer, wherein the first electrode is embedded in the inner side of the first intermediate material, and the first intermediate material surrounds the outer edge of the first electrode.

10. The display device according to claim 9, wherein the first electrode is electrically connected to the first connecting electrode.

11. The display device of claim 10, wherein the first electrode is in contact with the first connecting electrode, and the first intermediate material comprises a non-conductive material.

12. The display device of claim 10, wherein the first intermediate material is disposed between the first electrode and the first connecting electrode, and the first intermediate material comprises a conductive material.

13. The display device according to claim 1, wherein the barrier structure comprises a reflective material.

14. The display device according to claim 1, wherein the barrier structure comprises a light-absorbing material.

15. The display device according to claim 1, wherein the barrier structure is positioned to surround the first light-emitting device and the second light-emitting device.

16. The display device of claim 1, wherein the first portion extends to be connected to the second portion, and the third portion extends to be connected to the second portion.

17. The display device of claim 1, wherein the second portion is spaced apart from the first portion and the third portion.

18. The display device according to claim 1, wherein the first light-emitting device comprises: Emissive layer; A first electrode is disposed on one side of the light-emitting layer; as well as A second electrode is disposed on the same side of the light-emitting layer, wherein the light-emitting layer is embedded in the inner side of the first intermediate material.

19. A method for manufacturing a display device, comprising: The installation steps include bringing the light-emitting device attached to the mold into contact with the intermediate material, and embedding a portion of the light-emitting device into the inner side of the intermediate material; A voltage supply step, wherein a voltage is supplied to the light-emitting device via a connecting electrode, thereby causing the light-emitting device to emit light; as well as An intermediate material curing step, wherein the intermediate material is hardened by receiving light emitted from the light-emitting device.

20. The method of manufacturing a display device according to claim 19, In the installation step, the light-emitting device is attached to the joint of the printing mold; In the intermediate material curing step, a reflective layer positioned below the mold reflects light emitted from the light-emitting device toward the area where the intermediate material is positioned; and The reflective layer is located in the outer region of the joint or in the groove region of the joint.

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