Temperature adjustment method and device, computer device and readable storage medium
By determining the target temperature range using multi-dimensional information and adjusting the temperature logic in real time, the problem of local temperature imbalance on the optical mounting base plate was solved, achieving high-precision assembly and imaging stability of optical components and reducing energy consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI INSTITUTE OF TECHNICAL PHYSICS CHINESE ACADEMY OF SCIENCES
- Filing Date
- 2026-05-12
- Publication Date
- 2026-07-07
AI Technical Summary
Local temperature imbalance in the optical mounting base plate of a space optical remote sensor can cause material deformation to exceed the allowable range, affecting the assembly accuracy and imaging stability of optical components.
Based on multi-dimensional information such as the assembly accuracy of optical components, the structural dimensions of the base plate, and the coefficient of thermal expansion of materials in each region, the target temperature range for each region is determined. The temperature logic is adjusted through real-time deformation detection to control the local temperature of the optical mounting base plate and reduce deformation.
It effectively balances the local temperature of the optical mounting base plate, reduces deformation, improves the assembly accuracy and imaging stability of optical components, and reduces energy consumption during the temperature adjustment process.
Smart Images
Figure CN122346207A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of space optical engineering technology, and in particular to a temperature adjustment method, apparatus, computer equipment, and readable storage medium. Background Technology
[0002] As space optical remote sensors rapidly evolve towards higher precision and lighter weight, the optical mounting base in these sensors needs to integrate multiple functions, including optical platform mounting, structural reference positioning, and circuit box bonding. Simply put, it refers to the mounting of optical components such as mirrors, lenses, and filters onto the optical mounting base, which is then bonded to the circuit box. The circuit box integrates electronic circuitry systems used for signal acquisition and processing, communication with the satellite platform, and status monitoring.
[0003] Currently, with the increasing scale of electronic circuit systems, their heat generation has surged. This heat is transferred to the optical mounting base and affects its temperature distribution. Coupled with fluctuations in the ambient temperature of the orbital environment, the optical mounting base is prone to localized temperature imbalances. This problem can cause the material deformation of the optical mounting base to exceed the maximum allowable deformation, directly affecting the assembly accuracy of optical components and the stability of system imaging. Therefore, there is an urgent need for a method to balance the local temperature of the optical mounting base and reduce its deformation to ensure the assembly accuracy of optical components and the stability of imaging. Summary of the Invention
[0004] This application provides a temperature adjustment method, a temperature adjustment device, a computer device, and a readable storage medium, which achieve the technical effect of balancing the local temperature of the optical mounting base plate and reducing the deformation of the optical mounting base plate.
[0005] To achieve the above objectives, the main technical solutions adopted in this application include: In a first aspect, embodiments of this application provide a temperature adjustment method, the method comprising: The temperature control temperature and temperature adjustment information of the optical mounting base plate are obtained. The optical mounting base plate is used to mount optical components. The temperature adjustment information includes the required assembly accuracy of the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate, wherein at least some regions have different material expansion coefficients. Using the temperature control temperature and the temperature adjustment information as constraints, the target temperature range of each region is determined, wherein, among multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges. For one of the regions, if the actual temperature of the region is not within the corresponding target temperature range, the actual temperature of the region is adjusted to the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of at least some regions is adjusted based on the real-time deformation. After adjusting the temperature of each of the aforementioned areas to the corresponding target temperature range, if the center temperature of the optical mounting base plate does not reach the temperature control temperature, the temperature of at least some areas shall be further adjusted so that the center temperature reaches the temperature control temperature.
[0006] Secondly, embodiments of this application provide a temperature adjustment device, the device comprising: The information acquisition module is used to acquire temperature control and temperature adjustment information of the optical mounting base plate, which is used to mount optical components. The temperature adjustment information includes the required assembly accuracy of the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate, wherein at least some regions have different material expansion coefficients. The temperature range determination module is used to determine the target temperature range of each region using the temperature control temperature and the temperature adjustment information as constraints, wherein, among multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges. The first temperature adjustment module is used to adjust the actual temperature of one of the regions to the corresponding target temperature range if the actual temperature of the region is not within the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of the region is adjusted based on the real-time deformation. The second temperature adjustment module is used to adjust the temperature of at least some areas after adjusting the temperature of each area to the corresponding target temperature range, so that the center temperature of the optical mounting base plate does not reach the temperature control temperature.
[0007] Thirdly, embodiments of this application provide a computer device, including: A memory and a processor are communicatively connected, the memory storing computer instructions, and the processor executing the computer instructions to perform the temperature adjustment method as described above.
[0008] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer instructions that cause a computer to perform the temperature adjustment method as described in any of the preceding claims.
[0009] In some embodiments of this application, the technical solutions firstly determine the target temperature range for each region based on three dimensions: the assembly accuracy of the optical element, the dimensions of the base plate structure, and the coefficient of thermal expansion of materials in each region. Compared to some technologies that determine the target temperature range based on a single dimension, this application imposes more constraints on determining the target temperature range, resulting in a more accurate target temperature range. Consequently, after temperature adjustment, the local temperature of the optical mounting base plate can be effectively balanced, reducing its deformation. Secondly, during temperature adjustment, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic for at least some regions is adjusted based on this real-time deformation. This balances the local temperature of the optical mounting base plate during temperature adjustment, preventing excessive deformation caused by large deformation differences between regions. By effectively controlling base plate deformation, the optical element of this application can achieve higher assembly accuracy and imaging stability. Attached Figure Description
[0010] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0011] Figure 1 A schematic diagram of an optical mounting base provided for some embodiments of this application; Figure 2 A schematic flowchart illustrating a temperature adjustment method provided for some embodiments of this application; Figure 3 Schematic diagram of a temperature adjustment device provided for some embodiments of this application; Figure 4 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application. Detailed Implementation
[0012] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0013] Before describing the technical solution of this application, the deformation principle of the optical mounting base plate will be explained. (Refer to the relevant references.) Figure 1 This is a schematic diagram of an optical mounting base plate 100 provided in some embodiments of this application. Figure 1 In this design, the optical mounting base 100 is divided into multiple regions 11, each region 11 may include one or more monitoring points 111. A temperature sensor is installed at each monitoring point 111. The temperature of that region 11 can be obtained by fusing and calculating (e.g., averaging) the temperatures of the monitoring points within the same region 11.
[0014] When the temperature or material expansion coefficient differs in different regions 11, the optical mounting base plate 100 will deform. For example, Figure 1 In this design, assume that multiple regions 11, labeled A, are used to deploy optical components, and multiple regions 11, labeled B, are used to mount the circuit box. Heat dissipated by the electronic circuit system is transferred to region B through the circuit box, resulting in a temperature difference between regions A and B. This temperature difference causes the materials in regions A and B to expand, with region B expanding more than region A. This causes the optical mounting base 100 to deform with a higher right side and a lower left side. Alternatively, even if two regions 11 have the same temperature but different coefficients of thermal expansion, their expansion amounts will also differ, leading to deformation of the optical mounting base 100. When the deformation exceeds the maximum allowable deformation, it will affect the assembly accuracy of the optical components and the imaging stability of the system.
[0015] Therefore, adjusting the local temperature of the optical mounting base 100 to ensure that the expansion amounts in different areas are as uniform as possible is an important means to improve the assembly accuracy of optical components and the imaging stability of the system. However, in current technology, the temperature adjustment of the optical mounting base 100 is not precise enough, and the problem of base plate deformation cannot be avoided. The relevant technology is illustrated below with examples.
[0016] For example, in some technologies, the temperature range of each region 11 is determined based on a single factor, and then the temperature of each region 11 is adjusted based on the temperature range to control the deformation of the optical mounting base 100. Here, the single factor refers to one of the following: the coefficient of thermal expansion of the material, the structural dimensions of the optical mounting base 100, or the required assembly precision of the optical components. This temperature range determined based on a single factor is not accurate enough to precisely control the deformation of the optical mounting base 100.
[0017] In other technologies, the region 11 of the optical mounting base 100 is simply divided into a high-temperature region and a low-temperature region, and heat dissipation from the high-temperature region to the low-temperature region is controlled to adjust the local temperature of the optical mounting base 100. These technologies neglect the buffering effect of temperature transition regions, which can easily lead to abrupt temperature gradients. This results in a lack of smooth transition regions between adjacent regions of the optical mounting base 100 and drastic temperature abrupt changes, causing non-uniform thermal deformation of the base. For example, in two adjacent regions 11, if one region 11 has a temperature of 50 degrees Celsius and the other region 11 has a temperature of 10 degrees Celsius, the drastic temperature change between these two regions 11 may lead to non-uniform thermal deformation in these two regions 11.
[0018] In some technologies, the heat dissipation rate is a fixed, uniform rate. These technologies cannot adapt to different temperature differences between high-temperature and low-temperature zones, easily leading to low temperature adjustment efficiency or temperature overshoot. Temperature overshoot refers to the situation where, during temperature adjustment, the temperature of a zone exceeds the maximum or minimum allowable temperature due to the inertia of temperature changes. For example, assuming the temperature difference between high-temperature zone a1 and low-temperature zone b1 is 35 degrees Celsius, and the temperature difference between high-temperature zone a2 and low-temperature zone b2 is 5 degrees Celsius, if heat dissipation is carried out at a rate of 6 degrees Celsius per minute, the temperature adjustment efficiency between high-temperature zone a1 and low-temperature zone b1 will be low, while the temperature in low-temperature zone b2 is prone to overshoot.
[0019] In some other technologies, when temperature adjustment in certain areas 11 becomes abnormal, the abnormal areas are not sorted according to priority, making it impossible to adjust the temperature of each abnormal area in a targeted manner.
[0020] In view of this, this application provides a temperature adjustment method that can solve the above problems. The temperature adjustment method can be applied to the controller in a space optical remote sensor. (See also...) Figure 2 This is a schematic flowchart of a temperature adjustment method provided in some embodiments of this application. Figure 2 In this context, the temperature adjustment method includes the following steps: Step S201: Obtain the temperature control temperature and temperature adjustment information of the optical mounting base plate. The optical mounting base plate is used to mount optical components. The temperature adjustment information includes the required assembly accuracy of the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate. Among these, at least some regions have different material expansion coefficients.
[0021] Specifically, temperature control refers to the temperature that the center of the optical mounting plate needs to reach, i.e., the temperature adjustment target. The coefficient of thermal expansion (CTE) is a core parameter characterizing the length / volume deformation of the material in different areas of the optical mounting plate as a function of temperature, including the linear expansion coefficient and the fluctuation range of the CTE. Structural dimensions characterize the core geometric dimensions on the optical mounting plate related to the assembly and structural positioning of optical components, including the mounting surface length, datum surface spacing, and assembly hole tolerances. The required assembly precision for the optical components are the assembly constraints that ensure their normal operation, including the allowable gap between the optical components and the mounting plate, assembly coaxiality requirements, and allowable deformation thresholds.
[0022] Before implementing temperature control, ground personnel can transmit the aforementioned temperature control and adjustment information to the satellite platform via radio waves. When implementing the method of this application, the controller of the space optical remote sensor can obtain the temperature control and adjustment information from the satellite platform.
[0023] Step S202: Using temperature control and temperature adjustment information as constraints, determine the target temperature range for each region. Among the multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges.
[0024] Specifically, the coefficient of thermal expansion is a property related to the material type. In an optical mounting base plate, if two regions are made of different materials, their coefficients of thermal expansion can also differ. When two regions have different coefficients of thermal expansion, if they undergo the same deformation, the region with the larger coefficient of thermal expansion requires a smaller temperature change, and the region with the smaller coefficient of thermal expansion requires a larger temperature change. Therefore, in step S202, temperature adjustment information can be used as a constraint to determine the maximum allowable deformation range for each region under the controlled temperature. Based on the controlled temperature and the temperature fluctuation range, the target temperature range for each region can be determined. For ease of understanding, let's take an example. Assuming the controlled temperature is 25 degrees Celsius, the maximum allowable deformation range for region a1 is between -2 and 2 mm, and the maximum allowable deformation range for region a2 is between -1 and 1 mm. Then, based on the maximum allowable deformation ranges for regions a1 and a2 and their coefficients of thermal expansion, the allowable temperature fluctuation ranges for regions a1 and a2 can be determined. For example, the temperature fluctuation range of region a1 is between -3 and 3 degrees Celsius, and the temperature fluctuation range of region a2 is between -4 and 3 degrees Celsius. Based on a temperature control temperature of 25 degrees Celsius, by superimposing the temperature fluctuation ranges of regions a1 and a2, we can obtain the target temperature range of region a1 as 22 to 28 degrees Celsius, and the target temperature range of region a2 as 21 to 28 degrees Celsius.
[0025] The target temperature range refers to the theoretical temperature range of each region within the optical mounting plate to achieve the desired temperature adjustment. Based on the examples above, it can be seen that, provided the deformation of the optical mounting plate does not exceed the maximum deformation, the target temperature ranges for different regions can be different. When the actual temperature of each region falls within the target temperature range, it indicates that the local temperature of the optical mounting plate has reached equilibrium, and the optical mounting plate exhibits an isothermal structure.
[0026] Step S203: For one of the regions, if the actual temperature of the region is not within the corresponding target temperature range, the actual temperature of the region is adjusted to the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of at least some regions is adjusted based on the real-time deformation.
[0027] Specifically, during the operation of the optical mounting base, the actual temperature of each area can be detected at regular intervals. If there are areas where the actual temperature is not within the target temperature range, the temperature of the corresponding area is adjusted to bring the actual temperature of that area into the corresponding target temperature range. This can prevent excessive temperature differences between different areas, which could lead to excessive deformation of the optical mounting base.
[0028] Furthermore, during temperature adjustment, the coefficients of material expansion and the rate of temperature change may differ in different regions. Therefore, the deformation rates in different regions may vary, potentially causing the deformation of the optical mounting plate to exceed the maximum allowable deformation. That is, after temperature adjustment, the deformation of the optical mounting plate will not exceed the maximum allowable deformation, but during the temperature adjustment process, the deformation may exceed the maximum allowable deformation. For example, suppose region a1 has a larger coefficient of material expansion and a faster heating rate, while region a2 has a smaller coefficient of material expansion and a slower heating rate. Based on this assumption, adjusting the temperature of region a1 to the corresponding target temperature range may only take 2 minutes, and the expansion rate of region a1 will be faster. However, adjusting the temperature of region a2 to the corresponding target temperature range may take 10 minutes, and the expansion rate of region a2 will be slower. Thus, during the temperature adjustment process, there will be a significant deformation difference between regions a1 and a2, causing the deformation of the optical mounting plate to exceed the maximum allowable deformation.
[0029] Therefore, during the temperature adjustment process, the real-time deformation of the optical mounting base plate can be detected every second time interval. If the real-time deformation exceeds the deformation threshold, the temperature change rate of at least some areas can be adjusted based on the difference in the coefficients of thermal expansion between regions.
[0030] Specifically, the deformation threshold can be less than the maximum allowable deformation. When the real-time deformation of the optical mounting base exceeds the deformation threshold, the temperature change rate of at least some areas can be adjusted in a timely manner to ensure that the real-time deformation of the optical mounting base does not exceed the maximum allowable deformation. For example, in areas a1 and a2 mentioned above, the heating rate of area a2 can be appropriately increased, while the heating rate of area a1 can be decreased. In this way, the deformation difference between different areas can be reduced during the temperature adjustment process, thereby effectively controlling the deformation of the optical mounting base.
[0031] Step S204: After adjusting the temperature of each area to the corresponding target temperature range, if the center temperature of the optical mounting base plate does not reach the temperature control temperature, continue to adjust the temperature of at least some areas so that the center temperature reaches the temperature control temperature.
[0032] Specifically, after adjusting the temperature of each area to its corresponding target temperature range, the temperature of each area may fluctuate within the target temperature range, causing the center temperature of the optical mounting base to fail to reach the controlled temperature. Therefore, the temperature of at least some areas can be fine-tuned to ensure that the center temperature of the optical mounting base reaches the controlled temperature.
[0033] In summary, firstly, this application obtains the target temperature range for each region based on three dimensions: the assembly accuracy of the optical element, the structural dimensions of the base plate, and the coefficient of thermal expansion of materials in each region. Compared to some technologies that obtain the target temperature range for each region based on a single dimension, this application imposes more constraints when determining the target temperature range, resulting in a more accurate target temperature range. Consequently, after temperature adjustment, it can effectively balance the local temperature of the optical mounting base plate and reduce its deformation. Secondly, during the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic for at least some regions is adjusted based on this real-time deformation. In this way, the local temperature of the optical mounting base plate can be balanced during temperature adjustment, avoiding excessive deformation of the optical mounting base plate caused by excessive deformation differences between some regions. By effectively controlling the base plate deformation, the optical element of this application can have high assembly accuracy and imaging stability.
[0034] Furthermore, based on the relatively accurate target temperature range corresponding to each region, the temperature of each region can be precisely adjusted, reducing unnecessary temperature adjustment actions. This reduces the energy consumption of the controller during the temperature adjustment process.
[0035] In some embodiments, step S202, which uses temperature control temperature and temperature adjustment information as constraints to determine the target temperature range for each region, includes: Based on temperature adjustment information, determine the current regional characteristics of each region; If there are multiple historical region features corresponding to the temperature control temperature, then among the multiple historical region features, find the first historical region feature that is the same as the current region feature of the region, and take the temperature range corresponding to the first historical region feature as the target temperature range of the region.
[0036] If there are no multiple historical region features corresponding to the temperature control temperature, then find at least one multiple historical region features corresponding to the reference temperature, and compare the current region features of the region with the historical region features corresponding to the reference temperature. Based on the similarity comparison results, obtain the target temperature range of the region, where the reference temperature is the temperature adjacent to the temperature control temperature.
[0037] Specifically, for any parameter in the temperature adjustment information (i.e., any parameter among optical component assembly accuracy, base plate structure dimensions, and material expansion coefficient), the parameter value for the same region may differ under different temperature control temperatures. For example, at a temperature control temperature of 20 degrees Celsius, the material expansion coefficient of region a1 is 0.1. At a temperature control temperature of 22 degrees Celsius, the material expansion coefficient of region a1 is 0.15.
[0038] Regional characteristics refer to a set consisting of the assembly accuracy of optical components, the dimensions of the base plate structure, the coefficient of thermal expansion of materials, and the weights of these parameters. The weights characterize the sensitivity of the parameters to temperature. For example, if the coefficient of thermal expansion changes significantly for every 1 degree Celsius change in temperature, while the dimensions of the base plate change relatively little, then the coefficient of thermal expansion can have a higher weight, and the dimensions of the base plate can have a lower weight.
[0039] Because parameter values differ under different temperature control temperatures, the regional characteristics of the same area may vary under different temperature control temperatures. Current regional characteristics refer to the regional characteristics of each area under the current temperature control temperature. Each area has its own corresponding current regional characteristics.
[0040] In this embodiment, the correspondence between the regional characteristics of each region and the target temperature range can be obtained in advance through experiments. The regional characteristics obtained experimentally can also be referred to as historical regional characteristics.
[0041] For example, when the temperature control temperature is 20 degrees Celsius, through experiments, the correspondence between the regional characteristics of each region in the optical mounting base plate and the target temperature range can be obtained: {historical regional characteristics a11 of region a1 and target temperature range a11, historical regional characteristics a21 of region a2 and target temperature range a21, ..., historical regional characteristics an1 of region an and target temperature range an1}.
[0042] At a temperature control temperature of 23 degrees Celsius, experiments were conducted to obtain the correspondence between the regional characteristics of each area in the optical mounting base and the target temperature range: {historical regional characteristics a12 of region a1 and target temperature range a12, historical regional characteristics a22 of region a2 and target temperature range a22, ..., historical regional characteristics an2 of region an and target temperature range an2}. And so on.
[0043] The temperature control temperatures selected in the experiment are a finite number. In practical applications, the temperature control temperatures may or may not be included in the experimental selections. For ease of understanding, examples are provided below.
[0044] Suppose we selected 20°C, 23°C, 25°C, and 30°C as the temperature control temperatures for the experiment, and obtained multiple historical region characteristics corresponding to these temperatures. In practical applications, when the temperature control temperature is 23°C, since 23°C is included in the temperature control temperatures selected for the experiment, for any region, we can find the first historical region characteristic that matches the current region characteristic among the multiple historical region characteristics corresponding to 23°C, and use the temperature range corresponding to the first historical region characteristic as the target temperature range for that region. Conversely, when the temperature control temperature in practical applications is 22°C, since 22°C is not included in the temperature control temperatures selected for the experiment, we can use 20°C, 23°C, 25°C, and 30°C as reference temperatures adjacent to 22°C. For any region, based on expression (1), the current region features of the region can be compared with the multiple historical region features corresponding to each reference temperature to obtain the second historical region features with high similarity to the current region features, and the temperature range corresponding to the second historical region features can be used as the target temperature range of the region.
[0045] (1) Where S represents similarity, This represents the weight of the i-th parameter. This represents the value of the i-th parameter in the current region feature. This represents the value of the i-th parameter in the historical region features.
[0046] It should be noted that in practical applications, in order to eliminate the difference in data magnitude, the parameter values of expression (1) can be parameter values after standardization (such as normalization).
[0047] In the above embodiments, by comparing the current regional characteristics of each region with the historical regional characteristics, the target temperature range of each region can be quickly found with high efficiency. Furthermore, the obtained target temperature range can be an experimentally verified temperature range that meets the deformation and accuracy requirements of the optical mounting base plate, ensuring the accuracy of the target temperature range.
[0048] In some embodiments, obtaining the target temperature range of the region based on the similarity comparison result includes: Filter at least two second historical region features whose similarity to the current region features is greater than a similarity threshold to obtain at least two temperature ranges corresponding to the second historical region features; The lower limit temperature of the target temperature range is obtained by merging the lower limit temperature of at least two temperature ranges, and the upper limit temperature of the target temperature range is obtained by merging the upper limit temperature of at least two temperature ranges.
[0049] Specifically, the lower limit temperature of the target temperature range can be calculated using expression (2).
[0050] (2) in, This represents the upper limit temperature of the target temperature range, and n represents the number of second historical region features obtained through filtering that have a similarity greater than the similarity threshold with the current region features. This represents the similarity between the j-th second historical region feature and the current region feature. This represents the upper limit of the temperature range corresponding to the j-th second historical region feature.
[0051] Similarly, the lower limit temperature of the target temperature range can be calculated using expression (3).
[0052] (3) in, This indicates the lower limit temperature of the target temperature range. This represents the lower limit of the temperature range corresponding to the j-th second historical region feature.
[0053] In the above embodiments, by filtering at least two second historical region features that have a similarity greater than a similarity threshold with the current region features, multiple temperature ranges are obtained. The lower and upper limits of the multiple temperature ranges are then fused and calculated to obtain the upper and lower limits of the target temperature range. This is equivalent to referencing the temperature ranges corresponding to multiple historical region features to obtain the target temperature range, which can ensure the accuracy of the target temperature range.
[0054] In some embodiments, adjusting the actual temperature of the region to the corresponding target temperature range includes: For any given region, if the actual temperature of the region is higher than the corresponding target temperature range, the region is classified as a high-temperature region; if the actual temperature of the region is lower than the corresponding target temperature range, the region is classified as a low-temperature region. Control the heat dissipation from the high-temperature area to the low-temperature area in order to adjust the temperature of each area to the corresponding target temperature range.
[0055] Specifically, the optical mounting base can include heat transfer pipes connecting various areas. These heat transfer pipes can be used for heat transfer between areas. By controlling the heat transfer pipes, heat can be dissipated from high-temperature areas to low-temperature areas. This allows the temperature of high-temperature areas to be lowered to a target temperature range, and the temperature of low-temperature areas to be raised to a target temperature range. This method of temperature adjustment via heat transfer eliminates the need for separate cooling and heating devices for each area, thus significantly reducing the size and power consumption of the optical mounting base.
[0056] Furthermore, in the above embodiments, regions where the actual temperature is higher than the target temperature range are defined as high-temperature regions, and regions where the actual temperature is lower than the target temperature range are defined as low-temperature regions. Temperature adjustments are only made for the high-temperature and low-temperature regions. In this way, regions where the actual temperature is within the target temperature range can be used as buffer zones. Thus, during the temperature adjustment process, the problem of temperature abrupt changes between adjacent regions can be reduced, avoiding problems such as temperature overshoot and slow temperature adjustment efficiency.
[0057] In some embodiments, controlling heat dissipation from the high-temperature region to the low-temperature region includes: The midpoint of the target temperature range is used as the standard temperature to determine the temperature difference between the actual temperature and the standard temperature in each region. Locate the first high-temperature region and the first low-temperature region located within the same temperature difference range, and control the first high-temperature region to dissipate heat to the first low-temperature region. Different temperature difference ranges correspond to different heat dissipation rates.
[0058] Specifically, multiple temperature ranges can be pre-defined. For example, 0 to 2 degrees Celsius is the first temperature range, 2 to 4 degrees Celsius is the second temperature range, and so on.
[0059] Based on the target temperature range for each region, the standard temperature for that region can be determined. For example, assuming the target temperature range for region a1 is between 22 and 28 degrees Celsius, and the target temperature range for region a2 is between 21 and 28 degrees Celsius, then the standard temperature for region a1 is 25 degrees Celsius, and the standard temperature for region a2 is 24.5 degrees Celsius.
[0060] For any given region, subtracting the standard temperature from the actual temperature yields the absolute value of the temperature difference. The temperature difference interval within which this absolute value falls is the temperature difference interval for that region. For example, assuming region a1 has a standard temperature of 25 degrees Celsius and an actual temperature of 28 degrees Celsius, and region a2 has a standard temperature of 24.5 degrees Celsius and an actual temperature of 25 degrees Celsius, then region a1 falls within the second temperature difference interval mentioned above, and region a2 falls within the first temperature difference interval mentioned above.
[0061] In the above embodiments, by finding the first high-temperature region and the first low-temperature region located in the same temperature difference range, and controlling the first high-temperature region to dissipate heat to the first low-temperature region, it can be ensured that the heat to be released by the high-temperature region is roughly matched with the heat to be received by the low-temperature region, reducing the situation where the same high-temperature region transfers heat to multiple low-temperature regions, or the same low-temperature region receives heat from multiple high-temperature regions. In this way, the heat transfer logic between regions can be simplified.
[0062] Specifically, based on the structural layout and heat conduction path analysis of the optical mounting base, high and low temperature regions within the same temperature difference range can be preferentially paired up based on their proximity and the lowest heat conduction resistance. This improves heat transfer efficiency. If a high-temperature region corresponds to multiple low-temperature regions, the temperature difference ranges of the low-temperature regions are sorted, prioritizing the transfer of heat from the high-temperature regions to the low-temperature regions with more severe temperature deficiencies. Conversely, if a low-temperature region corresponds to multiple high-temperature regions, the temperature difference ranges of the high-temperature regions are sorted, allowing the low-temperature regions to preferentially absorb heat from the high-temperature regions with more severe overheating. This helps avoid excessive local temperature differences and significant deformation of the optical mounting base.
[0063] Furthermore, in the high and low temperature regions located in the first temperature difference range, the high temperature region can be controlled to dissipate heat to the low temperature region at a first heat dissipation rate. In the high and low temperature regions located in the second temperature difference range, the high temperature region can be controlled to dissipate heat to the low temperature region at the second heat dissipation rate; In this system, the maximum value of the first temperature difference range is less than the minimum value of the second temperature difference range, and the first heat dissipation rate is less than the second heat dissipation rate. For example, within a temperature difference range of 0 to 2 degrees Celsius, the high-temperature region can be controlled to dissipate heat to the corresponding low-temperature region at a heat dissipation rate of 0.5 degrees Celsius / second, and within a temperature difference range of 2 to 4 degrees Celsius, the high-temperature region can be controlled to dissipate heat to the corresponding low-temperature region at a heat dissipation rate of 1 degree Celsius / second.
[0064] Compared to some technologies that fix the heat dissipation rate at a constant rate, the solution in this application, on the one hand, can cool down severely overheated high-temperature areas and heat up severely underheated low-temperature areas according to a faster rate of temperature change, thus avoiding excessive local temperature differences on the optical mounting base plate. On the other hand, it can cool down less overheated high-temperature areas and heat up less underheated low-temperature areas according to a slower rate of temperature change, thus avoiding temperature overshoot in both high and low temperature regions.
[0065] Furthermore, during temperature adjustment, the temperature difference range of each region can be detected in real time, and the heat dissipation rate of each region can be adjusted accordingly. For example, suppose region a1 initially dissipates heat to region a2 at a higher rate. As the temperature of region a1 decreases, the absolute value of the temperature difference between the actual temperature of region a1 and the standard temperature may fall into a smaller temperature difference range. In this case, the heat dissipation rate of region a1 can be reduced to ensure that the heat dissipation rate of region a1 is compatible with the temperature difference range it falls within, thereby improving the efficiency of the temperature adjustment process and the stability of the base plate structure.
[0066] In some embodiments, after adjusting the temperature of each region to the corresponding target temperature range, the method of this application further includes: For any high-temperature region, if the actual temperature of the high-temperature region is rising and the temperature rise rate exceeds the temperature rise threshold for a duration of a first preset duration, then the absolute value of the difference between the actual temperature of the high-temperature region and the upper limit temperature of the target temperature range is determined as the upper limit difference. If the upper limit difference is greater than the upper limit difference threshold, then the high-temperature area should be insulated. If the upper limit difference is less than or equal to the upper limit difference threshold, the high-temperature area will be cooled down.
[0067] Specifically, after temperature adjustment of the high-temperature area, the actual temperature of the high-temperature area should be within the corresponding target temperature range. However, if the high-temperature area continues to rise, and the temperature rise rate exceeds the temperature rise threshold for a duration that reaches the first preset duration, it indicates that the high-temperature area is abnormal, and the actual temperature of the high-temperature area may exceed the target temperature range again, thereby causing new deformation to the optical mounting base plate.
[0068] Therefore, after adjusting the temperature of the high-temperature area to the corresponding target temperature range, temperature changes in the high-temperature area can continue to be monitored. If the difference between the actual temperature of the high-temperature area and the upper limit of the target temperature range is greater than the upper limit difference threshold, it indicates that the actual temperature of the high-temperature area is still far from the upper limit of the target temperature range. In this case, there is no need to cool the high-temperature area, and it can continue to be kept warm. Conversely, if the upper limit difference is less than or equal to the upper limit difference threshold, it indicates that the actual temperature of the high-temperature area is close to the upper limit of the target temperature range. In this case, the high-temperature area can be cooled to prevent its temperature from exceeding the corresponding target temperature range.
[0069] Similarly, in some embodiments, after adjusting the temperature of each region to the corresponding target temperature range, the method of this application further includes: For any low-temperature region, if the actual temperature of the low-temperature region is decreasing and the temperature decrease rate exceeds the temperature decrease threshold for a duration of a second preset duration, then the absolute value of the difference between the actual temperature of the low-temperature region and the lower limit temperature of the target temperature range is determined as the lower limit difference. If the difference between the lower limits is greater than the threshold value, then the low-temperature area should be insulated. If the lower limit difference is less than or equal to the lower limit difference threshold, then the low temperature region is heated.
[0070] Similar to the high-temperature region described above, if the difference between the actual temperature of the low-temperature region and the lower limit of the target temperature range is greater than the lower limit difference threshold, it indicates that the actual temperature of the low-temperature region is still far from the lower limit of the target temperature range. In this case, it is not necessary to raise the temperature of the low-temperature region, and the region can continue to be kept warm. Conversely, if the difference is less than or equal to the lower limit difference threshold, it indicates that the actual temperature of the low-temperature region is close to the lower limit of the target temperature range. In this case, the temperature of the low-temperature region can be raised to prevent the temperature of the low-temperature region from falling below the target temperature range again.
[0071] In the above embodiments, after adjusting the temperature of each region to the corresponding target temperature range, the actual temperature of each region is monitored, and the temperature of each region is adjusted based on the upper limit difference threshold and the lower limit difference threshold. This can prevent the actual temperature of the high temperature region or the low temperature region from falling within the corresponding target temperature range again, thus ensuring the structural stability of the optical mounting base plate.
[0072] In some embodiments, if the upper limit difference is less than or equal to a first upper limit difference threshold, the high-temperature region is cooled according to a first heat dissipation rate. If the upper limit difference is less than or equal to the second upper limit difference threshold, the high temperature area is cooled according to the second heat dissipation rate. Specifically, the first upper limit difference threshold is greater than the second upper limit difference threshold, and the first heat dissipation rate is less than the second heat dissipation rate. Thus, as the temperature in the high-temperature region approaches the upper limit of the target temperature range, the high-temperature region can be cooled at a faster rate, preventing the actual temperature of the high-temperature region from exceeding the target temperature range.
[0073] Furthermore, if multiple high-temperature regions exist with upper limit differences less than or equal to the first upper limit difference threshold, these high-temperature regions can be sorted according to their upper limit differences, and the high-temperature regions with smaller upper limit differences can be cooled first. Compared to some technologies that do not sort abnormal regions according to priority, this application can prioritize the treatment of more severely abnormal high-temperature regions, maximizing the structural stability of the optical mounting base plate.
[0074] Similarly, in some embodiments, if the lower limit difference is less than or equal to the first lower limit difference threshold, the low-temperature region is cooled according to the first heat absorption rate. If the lower limit difference is less than or equal to the second lower limit difference threshold, the low temperature region is cooled according to the second heat absorption rate. Specifically, the first lower limit difference threshold is greater than the second lower limit difference threshold, and the first heat absorption rate is less than the second heat absorption rate. The relevant principles are similar to those in the high-temperature region described above, and will not be elaborated upon here.
[0075] Furthermore, if there are multiple low-temperature regions where the lower limit difference is less than or equal to the second lower limit difference threshold, these multiple low-temperature regions can be sorted according to their lower limit differences, and the low-temperature regions with smaller lower limit differences should be heated first. The relevant principle is similar to that of the high-temperature regions mentioned above, and will not be elaborated here.
[0076] In some embodiments, the method of this application further includes: According to a first temperature change rate, the temperature of each region is adjusted to the corresponding target temperature range, and according to a second temperature change rate, the temperature of at least some regions is adjusted so that the center temperature reaches the temperature control temperature, wherein the second temperature change rate is lower than the first temperature change rate.
[0077] Specifically, by adjusting the temperature of each region to its corresponding target temperature range according to a larger initial temperature change rate, high-temperature areas can be cooled down and low-temperature areas can be heated in a timely manner. In this way, the local temperature imbalance of the optical mounting plate can be quickly corrected, and the deformation of the optical mounting plate can be reduced.
[0078] After adjusting the temperature of each area to the corresponding target temperature range, the temperature of at least some areas is adjusted according to a smaller second temperature change rate. In essence, this is a fine-tuning of the temperature of some areas. If the temperature change rate is too fast, it may lead to temperature overshoot. At the same time, it is not conducive to the structural stability of the optical mounting base plate.
[0079] See also Figure 3 This is a schematic diagram of a temperature adjustment device provided in some embodiments of this application. The temperature adjustment device includes: The information acquisition module 301 is used to acquire the temperature control temperature and temperature adjustment information of the optical mounting base plate. The optical mounting base plate is used to install optical components. The temperature adjustment information includes the assembly accuracy required for the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate, wherein at least some regions have different material expansion coefficients. Temperature range determination module 302 is used to determine the target temperature range of each region using temperature control temperature and temperature adjustment information as constraints. Among multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges. The first temperature adjustment module 303 is used to adjust the actual temperature of a region to the corresponding target temperature range if the actual temperature of the region is not within the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of the region is adjusted based on the real-time deformation. The second temperature adjustment module 304 is used to adjust the temperature of at least some areas after adjusting the temperature of each area to the corresponding target temperature range, so that the center temperature of the optical mounting base plate does not reach the temperature control temperature.
[0080] In some embodiments, the temperature range determination module 302 is specifically used for: Based on temperature adjustment information, determine the current regional characteristics of each region; If there are multiple historical region features corresponding to the temperature control temperature, then among the multiple historical region features, find the first historical region feature that is the same as the current region feature of the region, and take the temperature range corresponding to the first historical region feature as the target temperature range of the region.
[0081] In some embodiments, the temperature range determination module 302 is further configured to: If there are no multiple historical region features corresponding to the temperature control temperature, then find at least one multiple historical region feature corresponding to the reference temperature, which is the temperature adjacent to the temperature control temperature. The current regional characteristics of the region are compared with the historical regional characteristics corresponding to the reference temperature, and the target temperature range of the region is obtained based on the similarity comparison results.
[0082] In some embodiments, the temperature range determination module 302 is specifically used for: Filter at least two second historical region features whose similarity to the current region features is greater than a similarity threshold to obtain at least two temperature ranges corresponding to the second historical region features; The lower limit temperature of the target temperature range is obtained by merging the lower limit temperature of at least two temperature ranges, and the upper limit temperature of the target temperature range is obtained by merging the upper limit temperature of at least two temperature ranges.
[0083] In some embodiments, the second temperature adjustment module 304 is specifically used for: For any given region, if the actual temperature of the region is higher than the corresponding target temperature range, the region is classified as a high-temperature region; if the actual temperature of the region is lower than the corresponding target temperature range, the region is classified as a low-temperature region. Control the heat dissipation from the high-temperature area to the low-temperature area in order to adjust the temperature of each area to the corresponding target temperature range.
[0084] In some embodiments, the second temperature adjustment module 304 is specifically used for: The midpoint of the target temperature range is used as the standard temperature to determine the temperature difference between the actual temperature and the standard temperature in each region. Locate the first high-temperature region and the first low-temperature region located within the same temperature difference range, and control the first high-temperature region to dissipate heat to the first low-temperature region. Different temperature difference ranges correspond to different heat dissipation rates.
[0085] In some embodiments, the first temperature adjustment module 303 is specifically used for: If the real-time deformation exceeds the deformation threshold, the rate of temperature change in at least some regions is adjusted based on the difference in the coefficient of thermal expansion between regions.
[0086] In some embodiments, after adjusting the temperature of each region to the corresponding target temperature range, the second temperature adjustment module 304 is further configured to: For any high-temperature region, if the actual temperature of the high-temperature region is rising and the temperature rise rate exceeds the temperature rise threshold for a duration of a first preset duration, then the absolute value of the difference between the actual temperature of the high-temperature region and the upper limit temperature of the target temperature range is determined as the upper limit difference. If the upper limit difference is greater than the upper limit difference threshold, then the high-temperature area should be insulated. If the upper limit difference is less than or equal to the upper limit difference threshold, the high-temperature area will be cooled down.
[0087] In some embodiments, after adjusting the temperature of each region to the corresponding target temperature range, the second temperature adjustment module 304 is further configured to: For any low-temperature region, if the actual temperature of the low-temperature region is decreasing and the temperature decrease rate exceeds the temperature decrease threshold for a duration of a second preset duration, then the absolute value of the difference between the actual temperature of the low-temperature region and the lower limit temperature of the target temperature range is determined as the lower limit difference. If the difference between the lower limits is greater than the threshold value, then the low-temperature area should be insulated. If the lower limit difference is less than or equal to the lower limit difference threshold, then the low temperature region is heated.
[0088] In some embodiments, the second temperature adjustment module 304 is further configured to: According to a first temperature change rate, the temperature of each region is adjusted to the corresponding target temperature range, and according to a second temperature change rate, the temperature of at least some regions is adjusted so that the center temperature reaches the temperature control temperature, wherein the second temperature change rate is lower than the first temperature change rate.
[0089] In this embodiment, the temperature adjustment device is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.
[0090] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application, such as... Figure 4 As shown, the computer device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 4 Take a processor 10 as an example.
[0091] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GPA), or any combination thereof.
[0092] The memory 20 stores instructions executable by at least one processor 10 to cause the at least one processor 10 to perform the method shown in the above embodiments.
[0093] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.
[0094] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.
[0095] This application provides a computer program product including computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the method of any embodiment of this application.
[0096] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A temperature adjustment method, characterized in that, The method includes: The temperature control temperature and temperature adjustment information of the optical mounting base plate are obtained. The optical mounting base plate is used to mount optical components. The temperature adjustment information includes the required assembly accuracy of the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate, wherein at least some regions have different material expansion coefficients. Using the temperature control temperature and the temperature adjustment information as constraints, the target temperature range of each region is determined, wherein, among multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges. For one of the regions, if the actual temperature of the region is not within the corresponding target temperature range, the actual temperature of the region is adjusted to the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of at least some regions is adjusted based on the real-time deformation. After adjusting the temperature of each of the aforementioned areas to the corresponding target temperature range, if the center temperature of the optical mounting base plate does not reach the temperature control temperature, the temperature of at least some areas shall be further adjusted so that the center temperature reaches the temperature control temperature.
2. The method according to claim 1, characterized in that, The step of determining the target temperature range for each region using the temperature control temperature and the temperature adjustment information as constraints includes: Based on the temperature adjustment information, the current regional characteristics of each region are determined; If multiple historical region features exist corresponding to the temperature control temperature, then among the multiple historical region features, find the first historical region feature that is the same as the current region feature of the region, and take the temperature range corresponding to the first historical region feature as the target temperature range of the region.
3. The method according to claim 2, characterized in that, The method further includes: If there are no multiple historical region features corresponding to the temperature control temperature, then find at least one multiple historical region feature corresponding to a reference temperature, where the reference temperature is a temperature adjacent to the temperature control temperature. The current regional features of the region are compared with the historical regional features corresponding to the reference temperature, and the target temperature range of the region is obtained based on the similarity comparison results.
4. The method according to claim 3, characterized in that, The step of obtaining the target temperature range of the region based on the similarity comparison results includes: Filter at least two second historical region features whose similarity to the current region features is greater than a similarity threshold to obtain at least two temperature ranges corresponding to the second historical region features; The lower limit temperature of the target temperature range is obtained by merging the lower limit temperature of the at least two temperature ranges, and the upper limit temperature of the target temperature range is obtained by merging the upper limit temperature of the at least two temperature ranges.
5. The method according to claim 1, characterized in that, Adjusting the actual temperature of the region to the corresponding target temperature range includes: For any of the aforementioned regions, if the actual temperature of the region is higher than the corresponding target temperature range, then the region is classified as a high-temperature region; if the actual temperature of the region is lower than the corresponding target temperature range, then the region is classified as a low-temperature region. The high-temperature region is controlled to dissipate heat to the low-temperature region, so as to adjust the temperature of each region to the corresponding target temperature range.
6. The method according to claim 5, characterized in that, The control of heat dissipation from the high-temperature region to the low-temperature region includes: The midpoint of the target temperature range is used as the standard temperature to determine the temperature difference between the actual temperature and the standard temperature of each region. Locate the first high-temperature region and the first low-temperature region located within the same temperature difference range, and control the first high-temperature region to dissipate heat to the first low-temperature region, wherein different temperature difference ranges correspond to different heat dissipation rates.
7. The method according to claim 5, characterized in that, The temperature adjustment logic based on the real-time deformation adjustment of at least a portion of the region includes: If the real-time deformation exceeds the deformation threshold, the temperature change rate of at least some regions is adjusted based on the difference in the material expansion coefficients between regions.
8. The method according to claim 5, characterized in that, After adjusting the temperature of each of the aforementioned regions to the corresponding target temperature range, the method further includes: For any of the high-temperature regions, if the actual temperature of the high-temperature region is rising and the temperature rise rate exceeds the temperature rise threshold for a duration of a first preset duration, then the absolute value of the difference between the actual temperature of the high-temperature region and the upper limit temperature of the target temperature range is determined as the upper limit difference. If the upper limit difference is greater than the upper limit difference threshold, then the high temperature area is insulated. If the upper limit difference is less than or equal to the upper limit difference threshold, then the high-temperature region is cooled down.
9. The method according to claim 5, characterized in that, After adjusting the temperature of each of the aforementioned regions to the corresponding target temperature range, the method further includes: For any of the aforementioned low-temperature regions, if the actual temperature of the low-temperature region is in a decreasing state, and the duration of the temperature decrease rate exceeding the temperature decrease threshold reaches a second preset duration, then the absolute value of the difference between the actual temperature of the low-temperature region and the lower limit temperature of the target temperature range is determined as the lower limit difference. If the lower limit difference is greater than the lower limit difference threshold, then the low-temperature region is insulated. If the lower limit difference is less than or equal to the lower limit difference threshold, then the low temperature region is heated.
10. The method according to claim 1, characterized in that, The method further includes: According to a first temperature change rate, the temperature of each of the regions is adjusted to the corresponding target temperature range, and according to a second temperature change rate, the temperature of at least some regions is adjusted so that the center temperature reaches the temperature control temperature, wherein the second temperature change rate is lower than the first temperature change rate.
11. A temperature adjustment device, characterized in that, The device includes: The information acquisition module is used to acquire temperature control and temperature adjustment information of the optical mounting base plate, which is used to mount optical components. The temperature adjustment information includes the required assembly accuracy of the optical components, the structural dimensions of the optical mounting base plate, and the material expansion coefficient of each region in the optical mounting base plate, wherein at least some regions have different material expansion coefficients. The temperature range determination module is used to determine the target temperature range of each region using the temperature control temperature and the temperature adjustment information as constraints, wherein, among multiple regions with different material expansion coefficients, at least some regions have different target temperature ranges. The first temperature adjustment module is used to adjust the actual temperature of one of the regions to the corresponding target temperature range if the actual temperature of the region is not within the corresponding target temperature range. During the temperature adjustment process, the real-time deformation of the optical mounting base plate is detected, and the temperature adjustment logic of the region is adjusted based on the real-time deformation. The second temperature adjustment module is used to adjust the temperature of at least some areas after adjusting the temperature of each area to the corresponding target temperature range, so that the center temperature of the optical mounting base plate does not reach the temperature control temperature.
12. A computer device, characterized in that, include: A memory and a processor are communicatively connected, the memory storing computer instructions, and the processor executing the computer instructions to perform the temperature adjustment method according to any one of claims 1 to 10.
13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing the computer to perform the temperature adjustment method according to any one of claims 1 to 10.