Liquid-cooled heat sink and water-cooled plate thereof

Abstract

This application relates to a liquid-cooled heat dissipation device and its water-cooled plate. The water-cooled plate includes a heat-conducting base and a cover. The heat-conducting base includes a base plate and fins extending from the base plate. A lower transverse flow channel and a lower oblique flow channel are provided at the end of the fins away from the base plate, wherein a portion of the lower oblique flow channel connects the two lower transverse flow channels. The cover corresponds to a cover of the heat-conducting base and forms a fluid chamber between the heat-conducting base and the cover. The cover includes an upper plate and an opening penetrating the upper plate, the opening being located between the two lower transverse flow channels. An upper oblique flow channel is provided on the surface of the upper plate facing the fins, wherein a portion of the upper oblique flow channel connects to the opening. The lower oblique flow channel and the upper oblique flow channel are intersected and interconnected. This increases the time the working fluid remains within the fluid chamber, thereby improving its heat exchange efficiency.

Description

Technical Field

[0001] This application relates to the technology of a liquid-cooled heat dissipation device, and more particularly to a liquid-cooled heat dissipation device and its water-cooled plate. Background Technology

[0002] With the advancement and development of technology, the graphics of various computer games are becoming more and more detailed, and the functions of computer-aided graphics software are becoming more and more powerful. When such software is running, it often puts the central processing unit and graphics chip processor under high load, which also leads to a lot of heat. If this heat cannot be effectively dissipated, it will at least cause a decrease in the performance of the central processing unit or graphics chip processor, and in severe cases, it may even cause damage to the central processing unit or graphics chip processor or a significant reduction in its lifespan.

[0003] To effectively reduce the operating temperature of heat-generating electronic components, the application of liquid cooling devices is quite common. A liquid cooling device mainly includes a water radiator, two water pipes, a water pump, and a water-cooled plate. The water radiator connects the water pump and the water-cooled plate through the water pipes, and the water-cooled plate is placed in contact with a heat-generating electronic component. The water pump drives the working fluid to flow onto the water radiator for heat dissipation, continuously circulating and cooling to quickly dissipate heat.

[0004] Existing water-cooled plates have the following problems in actual use: because the working fluid passes through its internal channels in a rapid manner, the heat energy that can be transferred to each fin is quite limited, which makes it impossible to effectively improve its heat dissipation performance.

[0005] In view of this, the inventors have devoted themselves to research and applied theoretical principles to address the shortcomings of the prior art, and have made every effort to solve the aforementioned problems, which is the target of the inventors' improvement. Summary of the Invention

[0006] One objective of this application is to provide a liquid-cooled heat dissipation device and its water-cooled plate, which can increase the time that the working fluid remains in the fluid chamber, thereby improving its heat exchange efficiency.

[0007] To achieve the above objectives, this application provides a liquid-cooled heat dissipation device, including a base, a water-cooling plate, and a liquid driving mechanism. The base has a receiving space and a heat exchange chamber, and a water supply pipe is provided between the receiving space and the heat exchange chamber. The water-cooling plate is connected to the base and located in the heat exchange chamber, and includes a heat-conducting base and a cover. The heat-conducting base includes a base plate and a plurality of fins extending upward from the base plate. At the end of each fin away from the base plate, there are two lower transverse flow channels and a plurality of lower oblique flow channels, wherein a portion of each of the lower oblique flow channels connects to the two lower transverse flow channels. The cover corresponds to the heat-conducting base. The cover forms a fluid chamber between the heat-conducting base and the cover body. The cover body includes an upper plate and an opening penetrating the upper plate. The opening is located between the two lower transverse flow channels. The surface of the upper plate facing each fin is provided with a plurality of upward oblique flow channels, some of which are connected to the opening. The lower oblique flow channels are intersected with and connected to each of the upper oblique flow channels. The liquid drive mechanism is connected to the base and located in the accommodating space. The liquid drive mechanism includes a housing and a rotor structure. The housing includes a cavity and a water outlet pipe connected to the cavity. The rotor structure is installed in the cavity, and the water outlet pipe is connected to the water supply pipe.

[0008] To achieve the above objectives, this application provides a water-cooled plate, including a heat-conducting base and a cover. The heat-conducting base includes a base plate and a plurality of fins extending upward from the base plate. Each fin has two lower transverse flow channels and a plurality of lower oblique flow channels at its end away from the base plate, wherein a portion of each of the lower oblique flow channels connects to the two lower transverse flow channels. The cover corresponds to the heat-conducting base cover and forms a fluid chamber between the heat-conducting base and the cover. The cover includes an upper plate and an opening penetrating the upper plate. The opening is located between the two lower transverse flow channels. The surface of the upper plate facing each fin has a plurality of upper oblique flow channels, wherein a portion of each of the upper oblique flow channels connects to the opening. The lower oblique flow channels and the upper oblique flow channels are arranged intersectingly and communicating with each other.

[0009] This application also has the following effects: by having each lower inclined flow channel and each upper inclined flow channel cross-configured and interconnected, the thermal boundary layer of the working fluid is disrupted, resulting in turbulence and disturbance, thereby extending the time the working fluid remains in the fluid chamber and allowing for sufficient heat exchange with each fin, thus improving the overall heat dissipation performance. Attached Figure Description

[0010] Figure 1 This is a three-dimensional view of the heat-conducting base of this application.

[0011] Figure 2 This is a top view of the heat-conducting seat of this application.

[0012] Figure 3 This is an exploded perspective view of the water-cooled plate in this application.

[0013] Figure 4 This is a perspective view of the water-cooled plate assembly of this application.

[0014] Figure 5 This is a cross-sectional view of the liquid-cooled heat dissipation device assembly of this application.

[0015] Figure 6 This is a cross-sectional view of the liquid-cooled heat dissipation device of this application from another direction.

[0016] In the attached figures, the following labels are used:

[0017] 10: Matrix

[0018] 11: Storage space

[0019] 12: Heat exchange chamber

[0020] 13: Water supply pipe

[0021] 14: Annular groove

[0022] 20: Water-cooled plate

[0023] 21: Heat-conducting seat

[0024] 211: Base Plate

[0025] 212: Fins

[0026] 213: Lower transverse flow channel

[0027] 214: Downward sloping flow channel

[0028] 215: Longitudinal Channel

[0029] 22: Cover

[0030] 221:On the board

[0031] 222: Opening

[0032] 223: Upward sloping flow channel

[0033] A: Fluid chamber

[0034] 30: Liquid-driven mechanism

[0035] 31: Shell

[0036] 311: Cavity

[0037] 312: Water outlet pipe

[0038] 32: Rotor Structure

[0039] 33: Sealing assembly Detailed Implementation

[0040] The detailed description and technical content of this application are explained below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this application.

[0041] Please see Figures 1 to 6 As shown, this application provides a liquid-cooled heat dissipation device and its water-cooled plate, wherein the liquid-cooled heat dissipation device mainly includes a base 10, a water-cooled plate 20, a liquid driving mechanism 30 and other necessary devices and components.

[0042] Please refer to the following first. Figure 5 and Figure 6 As shown, the substrate 10 is generally rectangular and has a receiving space 11 and a heat exchange chamber 12. The receiving space 11 is formed in the upper part of the substrate 10, and the heat exchange chamber 12 is formed in the lower part of the substrate 10. The heat exchange chamber 12 is connected to a drain pipe (not shown in the figure). A water supply pipe 13 is provided between the receiving space 11 and the heat exchange chamber 12, and an annular groove 14 is provided around the water supply pipe 13.

[0043] Please refer to the following: Figures 1 to 4 As shown, the water-cooled plate 20 is connected to the base 10 and located in the heat exchange chamber 12. In this embodiment, the water-cooled plate 20 mainly includes a heat-conducting base 21 and a cover 22.

[0044] The heat-conducting base 21 can be made of materials with good thermal conductivity such as copper, aluminum, magnesium, or their alloys. It mainly includes a base plate 211 and multiple fins 212 extending upward from the base plate 211. At the end of each fin 212 away from the base plate 211, there are two lower transverse flow channels 213 and multiple lower oblique flow channels 214, some of which are connected to the two lower transverse flow channels 213. In addition, a longitudinal channel 215 is provided on one side of each fin 212 of the base plate 211.

[0045] The cover 22 corresponds to the cover of the heat conduction seat 21 and forms a fluid chamber A between the heat conduction seat 21 and the cover 22. The cover 22 mainly includes an upper plate 221 and an opening 222 through the upper plate 221. The opening 222 is located between two lower transverse flow channels 213. The surface of the upper plate 221 facing each fin 212 is provided with multiple upward oblique flow channels 223, some of which are connected to the opening 222.

[0046] The downward inclined flow channels 214 and the upward inclined flow channels 223 are cross-configured and interconnected.

[0047] In one embodiment, the portion of the lower oblique flow channel 214 that is not connected to the two lower transverse flow channels 213 is intersected with and connected to the upper oblique flow channel 223 of the connecting opening 222.

[0048] In one embodiment, the portion of the upper oblique flow channel 223 that is not connected to the opening 222 is intersected with and connected to the lower oblique flow channel 214 that connects the two lower transverse flow channels 213.

[0049] In one embodiment, any two adjacent downward-sloping channels 214 are arranged to form a V-shape.

[0050] In one embodiment, any two adjacent upward-sloping flow channels 223 are arranged to form a V-shape.

[0051] The liquid drive mechanism 30 is connected to the base 10 and located within the accommodating space 11. The liquid drive mechanism 30 mainly includes a housing 31 and a rotor structure 32. The housing 31 includes a cavity 311, a water outlet pipe 312 communicating with the cavity 311, and a water inlet pipe (not shown) communicating with the cavity 311. The water outlet pipe 312 is disposed in the annular groove 14 and communicates with the water supply pipe 13, wherein the water outlet pipe 312 and the water supply pipe 13 are sealed together by a sealing component 33. The rotor structure 32 is installed in the cavity 311 and mainly includes an impeller, a rotor, and a stator. The cavity has an upper chamber and a lower chamber formed below the upper chamber. The stator is placed in the upper chamber, and the rotor and impeller are placed in the lower chamber.

[0052] In use, the working fluid is driven by the liquid drive mechanism 30 and forcefully injected from its outlet pipe 312 through the water supply pipe 13 and the opening 222 of the cover 22 into the fluid chamber A of the water-cooled plate 20. After passing through each lower transverse 213, it flows through each lower oblique flow channel 214. Since each lower oblique flow channel 214 and each upper oblique flow channel 223 are cross-configured and interconnected, the thermal boundary layer of the working fluid is destroyed, resulting in turbulence and disturbance. This prolongs the time that the working fluid stays in the fluid chamber A and allows for sufficient heat exchange with each fin 212, thereby improving the overall heat dissipation efficiency.

[0053] The above description is only a preferred embodiment of this application and is not intended to limit the patent scope of this application. Other equivalent changes that utilize the patent spirit of this application should all fall within the patent scope of this application.

Claims

1. A water-cooled plate, characterized in that, include: A heat-conducting base includes a base plate and a plurality of fins extending upward from the base plate. At the end of each fin away from the base plate, there are two lower transverse flow channels and a plurality of lower oblique flow channels, wherein a portion of each of the lower oblique flow channels connects to the two lower transverse flow channels. as well as A cover body, corresponding to the heat-conducting seat cover, and forming a fluid chamber between the heat-conducting seat and the cover body, the cover body includes an upper plate and an opening through the upper plate, the opening being located between the two lower transverse flow channels, the surface of the upper plate facing each of the fins having a plurality of upward oblique flow channels, wherein a portion of each of the upward oblique flow channels communicates with the opening; The lower inclined flow channels are intersected with and connected to the upper inclined flow channels.

2. The water-cooled plate as described in claim 1, characterized in that, The portion of the lower oblique flow channel that is not connected to the two lower transverse flow channels is intersected with and connected to the upper oblique flow channel that connects to the opening.

3. The water-cooled plate as described in claim 1, characterized in that, The portion of the upper oblique flow channel that is not connected to the opening is intersected with and connected to the lower oblique flow channel that connects the two lower transverse flow channels.

4. The water-cooled plate as described in claim 1, characterized in that, Any two adjacent downward-sloping channels form a V-shape.

5. The water-cooled plate as described in claim 1, characterized in that, Any two adjacent upward-sloping flow channels form a V-shape.

6. The water-cooled plate as described in claim 1, characterized in that, A longitudinal channel is provided on one side of each of the fins on the base plate.

7. A liquid-cooled heat dissipation device, characterized in that, include: A substrate having a receiving space and a heat exchange chamber, with a water pipe communicating with the receiving space and the heat exchange chamber; A water-cooled plate as described in any one of claims 1 to 6, connected to the substrate and located in the heat exchange chamber; A liquid drive mechanism is connected to the base and located in the accommodating space. The liquid drive mechanism includes a housing and a rotor structure. The housing includes a cavity and a water outlet pipe communicating with the cavity. The rotor structure is installed in the cavity, and the water outlet pipe is communicating with the water supply pipe.

8. The liquid-cooled heat dissipation device as described in claim 7, characterized in that, The water supply pipe is surrounded by an annular groove, and the water outlet pipe is tightly connected to the annular groove by a sealing component.

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