A dry film type photosensitive resin composition, a method for preparing the same, and an application thereof

Abstract

The present application relates to a dry film type photosensitive resin composition, and in particular to a dry film type photosensitive resin composition, a preparation method and application thereof, the preparation raw materials include 34-70 parts of main resin, 8-30 parts of reactive diluent, 2.5-6 parts of hydrophobic modification component, 7-20 parts of hydrophobic filler, 0.8-5 parts of photoinitiator and 1.2-6 parts of auxiliary agent by weight parts;The main resin at least includes fluorine-containing epoxy resin;The hydrophobic modification component contains fluorine element and has a reactive group, and the reactive group is selected from one or more of hydroxyl, epoxy, silane and vinyl groups.The present application realizes high hydrophobicity while ensuring that the resolution meets the processing requirements, and has no defects such as cracks and whitening, and meets the use requirements in the field of electronic packaging.

Description

Technical Field

[0001] This invention relates to dry film type photosensitive resin compositions, specifically to a dry film type photosensitive resin composition, its preparation method, and its application. Background Technology

[0002] Existing dry film photosensitive materials, such as acrylic alkaline developing dry films and some epoxy / cationic curing dry films, often exhibit the following problems under high temperature and humidity or long-term bias / ion contamination environments: ① High water absorption rate: Water penetration causes degradation of dielectric properties, blistering at the interface, and reduced peel strength, which in turn leads to reliability failure.

[0003] ② Adhesion decay after damp heat: On substrates such as Si / SiO2, Cu, PI, and glass, edge lifting, cracking, or interface corrosion are easily generated after high accelerated temperature and humidity stress and unbiased high accelerated stress test (HAST / UHAST).

[0004] ③ Conflict between hydrophobic modification and developability: Adding fluorine- or silicon-oxygen hydrophobic components often leads to phase separation, increased haze, post-exposure development residue, reduced resolution, or insufficient interlayer adhesion.

[0005] ④ Insufficient stability of dry film formation and storage: High filler or high hydrophobic formulations can easily cause dry film to become brittle, curl, whiten, and increase microbubbles during lamination, affecting mass production yield.

[0006] Chinese invention patent application CN108490737A prepared a photosensitive resin composition with properties such as easy film removal and fast film removal speed by adjusting the amount of ethylene oxide-propylene oxide block copolymer and the molar amount of olefin unsaturated double bonds in the photopolymer monomer. However, its hydrophobicity and adhesion still need to be improved. Summary of the Invention

[0007] To address the problems in the prior art, the first aspect of the present invention provides a dry film type photosensitive resin composition, wherein, by weight, the raw materials for preparation include 34-70 parts of main resin, 8-30 parts of reactive diluent, 2.5-6 parts of hydrophobic modifying component, 7-20 parts of hydrophobic filler, 0.8-5 parts of photoinitiator and 1.2-6 parts of additives; The main resin includes at least a fluorinated epoxy resin; The hydrophobic modification component contains fluorine and has reactive groups, which are selected from one or more of hydroxyl, epoxy, silane, and vinyl groups.

[0008] The main resin of this invention comprises a fluorinated epoxy resin. The fluorinated groups provide low surface energy, reducing water molecule adsorption. At the same time, the hydrophobic modified components containing fluorine and reactive groups in the system form chemical bonds with the main resin during the curing process, anchoring the hydrophobic components in the polymer network and preventing them from migrating to the surface or interface, which would cause problems such as increased developing residue, decreased resolution, or weakened adhesion.

[0009] In some embodiments, the main resin further includes at least one of phenolic epoxy resin and epoxy-modified polysiloxane resin.

[0010] In some embodiments, the main resin is a fluorinated epoxy resin.

[0011] Optionally, the fluorinated epoxy resin includes a fluorinated aromatic epoxy resin.

[0012] In some embodiments, the main resin comprises a fluorinated epoxy resin and a phenolic epoxy resin, wherein the mass ratio of the fluorinated epoxy resin to the phenolic epoxy resin is (2-3):1. Examples include 2:1, 2.4:1, 2.5:1, 3:1, or any value within the range of (2-3):1.

[0013] When the main resin includes fluorinated epoxy resin and phenolic epoxy resin, the fluorinated groups provide low surface energy, and the multifunctional structure of phenolic epoxy forms a high crosslinking density skeleton. The two work together to enhance the hydrophobicity and thermal stability of the system.

[0014] In some embodiments, the main resin comprises a fluorinated epoxy resin and an epoxy-modified polysiloxane resin, wherein the mass ratio of the fluorinated epoxy resin to the epoxy-modified polysiloxane resin is (5-7):1. Examples include 5:1, 6:1, 6.5:1, 7:1, or any value within the range of (5-7):1.

[0015] In some embodiments, the hydrophobic modified component comprises a reactive fluorinated additive containing perfluoropolyether segments and hydroxyl end groups and an epoxy-functionalized polysiloxane, wherein the mass ratio of the two is (1-2):1. Examples include 1:1, 1.5:1, 2:1, or any value within the range of (1-2):1.

[0016] In some embodiments, the reactive diluent includes at least one of a multifunctional epoxy resin, an oxetane, or a fluorinated reactive diluent.

[0017] In some embodiments, the reactive diluent comprises a multifunctional epoxy resin and an oxetane, wherein the mass ratio of the multifunctional epoxy resin to the oxetane is (2-3):1. Examples include 2:1, 7:3, 2.5:1, 3:1, or any value within the range of (2-3):1.

[0018] In some embodiments, the hydrophobic filler is an inorganic filler with a surface hydrophobic treatment, the hydrophobic treatment including silanization, fluorination or alkylation.

[0019] The hydrophobic filler surface blocks the capillary water absorption path, preventing water from penetrating along the filler-resin interface, and forms a three-level hydrophobic structure of surface-interface-bulk structure with the hydrophobic modified component and the main resin.

[0020] In some embodiments, the inorganic filler is selected from one or more of silica, alumina, calcium carbonate, and talc.

[0021] In some embodiments, the photoinitiator includes a cationic photoinitiator.

[0022] Optionally, the cationic photoinitiator includes at least one of triarylthionium salt and diaryliodoonium salt.

[0023] In some embodiments, the additives include one or more of adhesion promoters, leveling agents, defoamers, and light stabilizers.

[0024] In some embodiments, the mass ratio of the adhesion promoter, leveling agent, defoamer and light stabilizer is (5-7):(2-4):(2-4):(2-4).

[0025] In some embodiments, the adhesion promoter is a compound containing at least one of epoxy silane groups, metal chelate functional groups, and phosphate groups.

[0026] Optionally, the adhesion promoter is an epoxy silane adhesion promoter.

[0027] The adhesion promoter of the present invention forms a chemical bridge at the interface: the epoxy group is covalently bonded to the resin network, and the methoxy group is hydrolyzed and condensed with the hydroxyl group on the substrate surface, which significantly improves the interfacial adhesion.

[0028] A second aspect of the present invention provides a method for preparing a dry film-type photosensitive resin composition, comprising at least the following steps: The main resin is dissolved in a solvent, and then a reactive diluent, hydrophobic modifier, and additives are added and mixed evenly. Then, a hydrophobic filler is added and dispersed evenly. Finally, a photoinitiator is added, and the mixture is stirred in the dark. After filtration and vacuum degassing until no obvious bubbles are present, a resin composition solution is obtained. The resin composition solution is coated and dried to obtain the dry film type photosensitive resin composition.

[0029] In some embodiments, the coating and drying process includes: uniformly coating the resin composition solution onto a PET carrier film, sequentially drying it in three stages—the first stage at 60-70°C for 2-3 minutes, the second stage at 75-85°C for 2-3 minutes, and the third stage at 90-95°C for 1-2 minutes, forming a 30µm dry film, then hot-pressing it onto a PE protective film, and finally winding it into a roll to obtain the dry film-type photosensitive resin composition.

[0030] In some embodiments, the preparation method satisfies at least one of the following characteristics: (1) The main resin is dissolved in a solvent to form a mixed solution, and the solid content of the mixed solution is 25-45 wt%. (2) The dissolution temperature is 25-40℃; (3) The filtration process specifically involves using 0.5µm and 0.2µm filter elements in sequence.

[0031] In some embodiments, the solvent is selected from at least one of propylene glycol methyl ether acetate, cyclohexanone, propylene carbonate, and γ-butyrolactone.

[0032] A third aspect of the present invention provides the application of a dry film type photosensitive resin composition in electronic packaging.

[0033] Beneficial effects 1. The main resin of this invention comprises a fluorinated epoxy resin. The fluorinated groups provide low surface energy, reducing water molecule adsorption. Simultaneously, the hydrophobic modified components containing fluorine and reactive groups form chemical bonds with the main resin during curing, anchoring the hydrophobic components within the polymer network and preventing them from migrating to the surface or interface, thus avoiding problems such as increased developer residue, decreased resolution, or weakened adhesion. High adhesion retention after humid heat: A high peel / shear strength ratio is maintained even after HAST / UHAST, reducing warpage, blistering, and edge peeling.

[0034] 2. The hydrophobic filler of this invention is an inorganic filler with a hydrophobic surface treatment. The hydrophobic filler surface blocks the capillary water absorption path, preventing water from penetrating along the filler-resin interface, and forming a three-level hydrophobic structure of surface-interface-bulk structure with the hydrophobic modified component and the main resin. The dry film surface contact angle can reach ≥105°, and the water absorption rate can be reduced to ≤0.20 wt% (24h), reducing the risk of dielectric degradation and interface failure.

[0035] 3. The adhesion promoter of the present invention forms a chemical bridge at the interface: the epoxy group is covalently bonded to the resin network, and the methoxy group is hydrolyzed and condensed with the hydroxyl group on the substrate surface, which significantly improves the interfacial bonding force.

[0036] 4. The dry film type photosensitive resin composition provided by the present invention can be produced by roll-to-roll coating, and the bonding, exposure and post-baking windows are adjustable, making it suitable for multiple substrates such as Si / glass / Cu / PI.

[0037] 5. The dry film type photosensitive resin composition provided by the present invention reduces defects (whitening, cracking, residue, blistering) after damp heat, and improves the mass production stability of encapsulation / RDL / MEMS. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention. Experimental methods not specifying specific conditions in the embodiments were performed under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments whose manufacturers are not specified are all commercially available products.

[0039] Example 1 The first aspect of this example provides a dry film type photosensitive resin composition, which, by weight, comprises 68 parts of main resin, 20 parts of reactive diluent, 2.5 parts of hydrophobic modifier, 7 parts of hydrophobic filler, 1 part of photoinitiator and 1.5 parts of additives. The main resin is a fluorinated aromatic epoxy resin and a phenolic epoxy resin, and the mass ratio of the fluorinated aromatic epoxy resin to the phenolic epoxy resin is 3:1. The fluorinated aromatic epoxy resin is model OGSOL EG-200 and comes from Osaka Gas Chemical Co., Ltd.

[0040] The phenolic epoxy resin is a cresol phenolic type epoxy resin, model N-740, from DIC Corporation.

[0041] The reactive diluent comprises a multifunctional epoxy resin and oxetane, wherein the mass ratio of the multifunctional epoxy resin to oxetane is 7:3.

[0042] The multifunctional epoxy resin is a naphthalene-type difunctional epoxy resin, model HP-4032D, from DIC Corporation.

[0043] The oxetane is designated OXT-221 and is sourced from Toagosei Corporation.

[0044] The hydrophobic modification component comprises a reactive fluorinated additive containing perfluoropolyether segments and hydroxyl end groups, and an epoxy-functionalized polysiloxane, with a mass ratio of 1.5:1.

[0045] The reactive fluorinated additive containing perfluoropolyether segments and hydroxyl end groups is designated Fluorolink AD1700N and is sourced from Solvay.

[0046] The epoxy-functionalized polysiloxane is epoxy-modified polydimethylsiloxane, model X-22-163A, from Shin-Etsu Chemical Co., Ltd.

[0047] The hydrophobic filler is nano-SiO2 with hexamethyldisilazane surface treatment, model AEROSIL R812, from Evonik Industries.

[0048] The photoinitiator is triarylthionium hexafluorophosphate, model CPI-210S, from San-Apro Ltd.

[0049] The additives include adhesion promoters, leveling agents, defoamers, and light stabilizers, and the mass ratio of the adhesion promoters, leveling agents, defoamers, and light stabilizers is 6:3:3:3.

[0050] The adhesion promoter is an epoxy silane adhesion promoter, model Silquest A-187, from Momentive Advanced Materials Group.

[0051] The leveling agent is BYK-307 leveling agent; The defoamer is BYK-A530 defoamer; The light stabilizer is Tinuvin 292, sourced from BASF.

[0052] The second aspect of this example provides a method for preparing a dry film-type photosensitive resin composition, comprising the following steps: The main resin was dissolved in propylene glycol methyl ether acetate solvent at 30°C to form a mixed solution with a solid content of 35 wt%. After adding a reactive diluent, hydrophobic modifier and additives to the mixed solution and mixing them evenly, a hydrophobic filler is added and dispersed evenly. Finally, a photoinitiator is added, and the mixture is stirred in the dark. The solution is then filtered through 0.5µm and 0.2µm filters in sequence, and vacuum degassing is performed until no obvious bubbles are present to obtain the resin composition solution. The resin composition solution is coated and dried to obtain the dry film type photosensitive resin composition.

[0053] The coating and drying process includes: uniformly coating the resin composition solution onto a PET carrier film, and sequentially drying it in three stages—drying at 65°C for 2.5 min in the first stage, drying at 80°C for 2.5 min in the second stage, and drying at 92°C for 1.5 min in the third stage, to form a 30µm dry film, followed by hot-pressing to form a composite PE protective film, and then winding it into a roll to obtain the dry film type photosensitive resin composition.

[0054] The third aspect of this example provides an application of a dry film-type photosensitive resin composition in electronic packaging.

[0055] Example 2 The specific implementation method of this example is the same as that of Example 1, except that, by weight, the raw materials include 63 parts of main resin, 23 parts of reactive diluent, 3 parts of hydrophobic modifying component, 9 parts of hydrophobic filler, 0.8 parts of photoinitiator and 1.2 parts of additives. The main resin is a fluorinated aromatic epoxy resin.

[0056] The reactive diluent is a multifunctional epoxy resin, specifically a tetrafunctional glycidylamine epoxy resin, model Araldite MY-721, from Huntsman Corporation.

[0057] The hydrophobic modification component is an epoxy-modified fluorinated polysiloxane, model X-22-169AS, from Shin-Etsu Chemical Co., Ltd.

[0058] The hydrophobic filler is nano-SiO2 with hexamethyldisilazane surface treatment, model SO-C2, from Admatechs.

[0059] The additives include adhesion promoters, leveling agents, and defoamers, and the mass ratio of the adhesion promoters, leveling agents, and defoamers is 7:2:3.

[0060] Example 3 The specific implementation method of this example is the same as that of Example 1, except that, by weight, the raw materials include 34 parts of main resin, 30 parts of reactive diluent, 6 parts of hydrophobic modifying component, 20 parts of hydrophobic filler, 5 parts of photoinitiator and 5 parts of additives. The main resin is a fluorinated aromatic epoxy resin and a phenolic epoxy resin, and the mass ratio of the fluorinated aromatic epoxy resin to the phenolic epoxy resin is 2.4:1. The reactive diluent includes a fluorinated reactive diluent and a multifunctional epoxy resin, wherein the mass ratio of the fluorinated reactive diluent to the multifunctional epoxy resin is 3:2. The fluorinated reactive diluent is perfluoropolyether diglycidyl ether, model Fluorolink E10 / H, from Solvay.

[0061] The hydrophobic filler is fluorinated nano-SiO2, which is obtained by surface treatment of gas-phase nano-SiO2 (model AEROSIL 200, from Evonik) in isopropanol with 1H,1H,2H,2H-perfluorooctyltriethoxysilane, followed by centrifugation and drying. The amount of the treatment agent is 5 wt% of the mass of SiO2.

[0062] The photoinitiator is a diaryliodonium salt, specifically bis(4-tert-butylphenyl)iodonium hexafluorophosphate, model Speedcure 938, from Lambson.

[0063] The additives include adhesion promoters, leveling agents, defoamers, and light stabilizers, with the mass ratio of adhesion promoters, leveling agents, defoamers, and light stabilizers being 5:2:2:2.

[0064] Example 4 The specific implementation method of this example is the same as that of Example 1, except that, by weight, the raw materials include 50 parts of main resin, 22 parts of reactive diluent, 5 parts of hydrophobic modifying component, 14 parts of hydrophobic filler, 3 parts of photoinitiator and 6 parts of additives. The main resin is a fluorinated aromatic epoxy resin, model OGSOL EG-200, from Osaka Gas Chemical Co., Ltd.

[0065] The hydrophobic modification component is a reactive fluorinated additive containing perfluorinated polyether segments and hydroxyl end groups and an epoxy-functionalized polysiloxane, with a mass ratio of 2:1 and the same type as in Example 1.

[0066] The hydrophobic filler is alkylated nano-alumina, which is obtained by surface treatment of α-Al2O3 powder (median diameter of about 80nm, model AKP-G015, from Sumitomo Chemical) in ethanol with n-octyltrimethoxysilane and then drying. The amount of the treatment agent is 3wt% of the mass of α-Al2O3.

[0067] The photoinitiator is a mixture of triarylthionium hexafluorophosphate and diaryliodonium hexafluorophosphate in a mass ratio of 1:1; the triarylthionium hexafluorophosphate is CPI-210S and is from San-Apro Ltd.; the diaryliodonium hexafluorophosphate is Speedcure 938 and is from Lambson.

[0068] The additives include adhesion promoters, leveling agents, defoamers, and light stabilizers in a mass ratio of 5:3:3:3.

[0069] Example 5 The specific implementation method of this example is the same as that of Example 1, except that, by weight, the raw materials include 70 parts of main resin, 8 parts of reactive diluent, 5 parts of hydrophobic modifying component, 10 parts of hydrophobic filler, 2 parts of photoinitiator and 5 parts of additives. The main resin is a fluorinated aromatic epoxy resin and an epoxy-modified polysiloxane resin, with a mass ratio of 6:1. The fluorinated aromatic epoxy resin is of type OGSOL EG-200; The epoxy-modified polysiloxane resin is epoxy-modified polydimethylsiloxane, model X-22-163A, from Shin-Etsu Chemical Industry Co., Ltd.

[0070] The reactive diluent is oxetane, model OXT-221, from Toa Synthetic Co., Ltd.

[0071] The hydrophobic modification component is a reactive fluorinated additive containing perfluorinated polyether segments and hydroxyl end groups and an epoxy-functionalized polysiloxane, with a mass ratio of 2:1.

[0072] The hydrophobic filler is silanized talc powder, which is obtained by gas-phase treatment of fine talc powder (median diameter of about 2µm, model JETFINE 3CA, from Imerys) with hexamethyldisilazane, and the amount of the treatment agent is 2wt% of the mass of the talc powder.

[0073] Comparative Example 1 The specific implementation method of this example is the same as that of Example 1, except that, by weight, the raw materials include 67 parts of main resin, 22 parts of reactive diluent, 9 parts of inorganic filler, 0.8 parts of photoinitiator and 1.2 parts of additives. The main resin is a biphenyl-type multifunctional epoxy resin, model NC-3000, from Nippon Kayaku Co., Ltd.

[0074] The inorganic filler is hydrophilic fumed silica, model AEROSIL 200, from Evonik Industries.

[0075] The additives include an adhesion promoter, a leveling agent, and a defoamer, wherein the mass ratio of the adhesion promoter, leveling agent, and defoamer is 6:3:3.

[0076] Comparative Example 2 The specific implementation method of this example is the same as that of Comparative Example 1, except that, by weight, the amount of the hydrophobic modified component is increased to 10 parts, and the other preparation raw materials are reduced proportionally to keep the total weight of the preparation raw materials unchanged at 100 parts.

[0077] Comparative Example 3 The specific implementation method in this example is the same as that in Comparative Example 1, except that the hydrophobic modification component is replaced with a nonionic perfluoroalkyl ether surfactant and a non-reactive polydimethylsiloxane.

[0078] The mass ratio of the nonionic perfluoroalkyl ether surfactant to the non-reactive polydimethylsiloxane is 1.5:1.

[0079] The nonionic perfluoroalkyl ether surfactant is designated Novec FC-4430 and is sourced from 3M.

[0080] The non-reactive polydimethylsiloxane is designated as 200 Fluid and is sourced from Dow Corning.

[0081] Comparative Example 4 The specific implementation method in this example is the same as in Example 1, except that the main resin is bisphenol A epoxy resin, model EPON 828, which comes from Henson Chemicals in the United States.

[0082] Performance testing The dry film-type photosensitive resin compositions prepared in Examples 1-5 and Comparative Examples 1-4 were tested as follows: 1. Hydrophobicity (water contact angle) test: The water droplet method (2µL) was used at 23°C, and the average value was taken from 5 points.

[0083] A contact angle >90° indicates significant hydrophobicity, which can effectively repel processing solutions.

[0084] 2. Water absorption rate: Soak in deionized water at 23°C for 24 h / 168 h, weighing method (refer to ASTM D570). 3. Damp heat reliability test: HAST: 130°C / 85%RH / 2.3atm, 96h; UHAST: 130°C / 85%RH (without bias) for 48 hours. Based on the peel force (90°) before and after the above test, the peel retention rate is obtained.

[0085] 4. Resolution test: Test method: Exposure and development were performed using a Stouffer 21-level optical wedge and resolution test film.

[0086] Judgment: The minimum line width / line spacing (L / S) that can be clearly developed (no residual glue at the base and no peeling at the top).

[0087] High hydrophobicity criteria: water contact angle ≥105° and 24h water absorption rate ≤0.20wt%, and adhesion retention rate after HAST / UHAST ≥80%.

[0088] 5. Developing residue / haze test: (1) Developing residue: obtained after exposure (exposure dose approximately 200 mJ / cm). 2 The roots, tops, and unexposed areas of the graphic lines were observed under a 50x optical microscope, and the cleanliness of the line boundaries and bottoms was verified by scanning electron microscopy (SEM) at 500–2000x magnification.

[0089] (2) Haze: According to ASTM D1003 standard, the transmittance haze of a 30µm dry film (after peeling off the carrier film and protective film) is tested using a haze meter (such as BYK haze-gard).

[0090] Comprehensive judgment criteria: Low: Under microscopic examination, no residual adhesive is visible at the base of the lines and in unexposed areas; dry film haze is <3%. Medium: Occasionally, dot-like residual adhesive is observed (<5 dots / mm) 2 (or localized rough edges, dry film haze 3-8%) High: Continuous residual adhesive or large-area rough edge, or dry film haze >8%, or obvious white haze and phase separation streaks visible to the naked eye.

[0091] 6. Post-curing glass transition temperature (Tg) test: After coating and drying the resin composition solution to form a 30µm dry film, a full exposure dose of approximately 500mJ / cm was applied. 2 UV exposure was performed, followed by post-baking at 150°C for 60 minutes for curing. After peeling off the carrier film and protective film, the samples were cut into 10mm×30mm×30µm specimens. Dynamic thermomechanical analyzer (DMA) was used in tensile mode, with a frequency of 1Hz, a heating rate of 3°C / min, and a temperature range of 25-250°C under nitrogen atmosphere. The temperature corresponding to the peak value of the loss factor tan δ curve was taken as the glass transition temperature Tg of the post-curing system (denoted as "post-curing Tg", unit °C).

[0092] The test results are shown in Tables 1 and 2.

[0093] Table 1

[0094] Table 2

[0095] As shown in Tables 1 and 2, Comparative Example 1, which does not contain hydrophobic modification components, and whose main resin does not contain fluorine and whose filler surface has not been hydrophobically treated, may still form capillary water absorption paths, resulting in a significant reduction in hydrophobicity and peel retention rate.

[0096] In Comparative Example 2, excessive use of hydrophobic modification components resulted in haze, whitening, increased development residue, rough line boundaries after exposure, and decreased interlayer adhesion in the dry film.

[0097] Although the initial contact angle of Comparative Example 3 was high, the hydrophobic modified component was non-reactive and could not be bound by the cross-linking network. During long-term storage or post-baking, it migrated and accumulated on the surface, resulting in a significant decline in the adhesion of the HAST / UHAST interface. Furthermore, the migrated material caused an increase in developing residue and a decrease in resolution.

[0098] Even though Comparative Example 4 retained the hydrophobic modification components, the main resin skeleton did not contain fluorine, resulting in a significant decrease in overall hydrophobicity (contact angle of only 88°), a significant increase in water absorption, and failure to meet the adhesion retention rate after HAST.

[0099] Examples 1-5 of this application construct a three-level hydrophobic structure by combining a fluorinated epoxy resin as the main resin with reactive hydrophobic modification components and fillers with surface hydrophobic treatment. While ensuring that the resolution meets the processing requirements, it achieves high hydrophobicity and is free from defects such as cracks and whitening, thus meeting the application requirements in the field of electronic packaging.

Claims

1. A dry film type photosensitive resin composition, characterized in that, By weight, the raw materials include 34-70 parts of main resin, 8-30 parts of reactive diluent, 2.5-6 parts of hydrophobic modifying component, 7-20 parts of hydrophobic filler, 0.8-5 parts of photoinitiator and 1.2-6 parts of additives; The main resin includes fluorinated epoxy resin and epoxy-modified polysiloxane resin, and the mass ratio of the fluorinated epoxy resin to the epoxy-modified polysiloxane resin is (5-7):

1. The hydrophobic modification component is an epoxy-modified fluorinated polysiloxane or a composition of a reactive fluorinated additive containing perfluorinated polyether segments and hydroxyl end groups and an epoxy-functionalized polysiloxane, wherein the mass ratio of the reactive fluorinated additive containing perfluorinated polyether segments and hydroxyl end groups to the epoxy-functionalized polysiloxane is (1-2):

1. The hydrophobic filler is an inorganic filler with a surface hydrophobic treatment, which includes silanization, fluorination, or alkylation.

2. The dry film type photosensitive resin composition according to claim 1, characterized in that, The reactive diluent includes at least one of multifunctional epoxy resins, oxobutanes, or fluorine-containing reactive diluents.

3. The dry film type photosensitive resin composition according to claim 1, characterized in that, The inorganic filler is selected from one or more of silicon dioxide, alumina, calcium carbonate, and talc.

4. The dry film type photosensitive resin composition according to claim 1, characterized in that, The photoinitiator includes a cationic photoinitiator.

5. The dry film type photosensitive resin composition according to claim 1, characterized in that, The additives include one or more of the following: adhesion promoters, leveling agents, defoamers, and light stabilizers.

6. The dry film type photosensitive resin composition according to claim 5, characterized in that, The adhesion promoter is a compound containing at least one of epoxy silane groups, metal chelate functional groups, and phosphate groups.

7. A method for preparing a dry film-type photosensitive resin composition according to any one of claims 1-6, characterized in that, At least the following steps are included: The main resin is dissolved in a solvent, and then a reactive diluent, hydrophobic modifier, and additives are added and mixed evenly. Then, a hydrophobic filler is added and dispersed evenly. Finally, a photoinitiator is added, and the mixture is stirred in the dark. After filtration and vacuum degassing until no obvious bubbles are present, a resin composition solution is obtained. The resin composition solution is coated and dried to obtain the dry film type photosensitive resin composition.

8. The use of a dry film type photosensitive resin composition according to any one of claims 1-6 in electronic packaging.

Images