Electroplating device

Abstract

This application discloses an electroplating apparatus, comprising: an anode chamber, including a first anode chamber and a second anode chamber, the second anode chamber being located on the outer periphery of the first anode chamber; a first anode located within the first anode chamber; a second anode located within the second anode chamber, the second anode being a soluble anode; a first liquid inlet assembly for supplying anodic electroplating solution to the first anode chamber, the first liquid inlet assembly including a first liquid outlet facing the upper surface of the first anode; and a second liquid inlet assembly for supplying anodic electroplating solution to the second anode chamber, the second liquid inlet assembly including a second liquid outlet facing the upper surface of the second anode. By designing the outlet orientation of the first and second liquid outlets, during the supply of electroplating solution to the first and second anode chambers, the impact force of the liquid is used to promptly wash away the anode sludge on the upper surfaces of the first and second anodes, thereby preventing the anode sludge from affecting the normal operation of the electroplating process.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to an electroplating apparatus. Background Technology

[0002] In semiconductor wafer plating processes, soluble anodes are typically used as the anode in the plating system. Taking copper plating as an example, a copper block is usually used as the anode. After multiple runs, as the copper block dissolves, solid byproducts (such as copper oxide) are generated; these byproducts are commonly referred to as anode sludge. Anode sludge deposited on the copper block can affect the normal operation of the plating process. For example, excessive anode sludge deposits can increase circuit impedance, causing voltage spikes and triggering equipment standby, thus halting the plating process.

[0003] Furthermore, in some electroplating apparatuses, a multi-anode structure is typically employed to better control the electric field distribution between the anode and the wafer. The first anode is the main anode, located in the central region of the anode cavity, while the second anode surrounds the outer periphery of the first anode. The first and second anodes are respectively disposed within the first and second anode cavities, and the electroplating solutions within the first and second anode cavities are isolated from each other, each equipped with independent inlet and outlet systems.

[0004] Therefore, for electroplating equipment that uses a multi-anode structure and soluble anodes, how to effectively avoid the deposition of anode sludge on the surface of soluble anodes and thus affect the normal operation of the electroplating process has become a technical problem that needs to be solved. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this application is to provide an electroplating apparatus to solve the technical problem of how to avoid the normal operation of the electroplating process due to the deposition of anode mud on the surface of soluble anode.

[0006] To achieve the above and other related objectives, the electroplating apparatus of this application includes: an anode chamber, comprising a first anode chamber and a second anode chamber, the second anode chamber being located on the outer periphery of the first anode chamber; a first anode, located within the first anode chamber; a second anode, located within the second anode chamber, the second anode being a soluble anode; a first liquid inlet assembly for supplying anodizing solution to the first anode chamber, wherein the first liquid inlet assembly includes a first liquid outlet, the first liquid outlet facing the first anode upper surface; and a second liquid inlet assembly for supplying anodizing solution to the second anode chamber, wherein the second liquid inlet assembly includes a second liquid outlet, the second liquid outlet facing the second anode upper surface.

[0007] As described above, this application provides an electroplating apparatus that has at least the following beneficial effects: By designing the outlet orientation of the first and second outlet sections, during the process of supplying anodic electroplating solution to the first and second anode chambers, the impact force of the liquid is used to promptly flush away the anodic sludge deposited on the upper surfaces of the first and second anodes, thereby ensuring that the circuit impedance remains basically unchanged, avoiding equipment standby caused by voltage rise alarms, and preventing anodic sludge from affecting the normal operation of the electroplating process. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the electroplating apparatus in one embodiment of this application; Figure 2 This is a three-dimensional schematic diagram of the anode cavity in one embodiment of this application; Figure 3 This is an exploded schematic diagram of the liquid inlet ring and the anode cavity in one embodiment of this application; Figure 4 This is a cross-sectional schematic diagram of the anode cavity in another embodiment of this application; Figure 5 This is a three-dimensional schematic diagram of the anode cavity in another embodiment of this application; Figure 6 This is an exploded schematic diagram of the inlet ring and anode cavity in another embodiment of this application. Detailed Implementation

[0009] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or adjusted based on different viewpoints and applications without departing from the spirit of this application.

[0010] It should be noted that the accompanying drawings are only schematic representations of the basic concept of this application. Although the drawings only show components related to this application and are not drawn according to the actual number, shape and size of the components, the shape, quantity and proportion of each component can be arbitrarily adjusted in actual implementation, and the layout of the components may also be more complex.

[0011] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0012] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0013] In the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0014] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.

[0015] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., which may be used to indicate the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0016] This application discloses an electroplating apparatus for plating metal onto substrates such as wafers and wafers. See below for further details. Figure 1 , Figure 1 This is a schematic diagram of an electroplating apparatus according to an embodiment of this application. The electroplating apparatus includes an electroplating chamber 10, which includes an anode chamber 11 and a cathode chamber 12. The anode chamber 11 and the cathode chamber 12 are separated by a membrane 13 fixed on a membrane frame 14. The anode chamber 11 and the cathode chamber 12 respectively contain anodic electroplating solution and cathodic electroplating solution. As an example, the membrane 13 can be used as a cation exchange membrane for electroplating metals such as copper, nickel, and tin. The membrane 13 is fixed on the membrane frame 14. The membrane frame 14 is a rigid perforated or mesh frame. As an example, the membrane frame 14 is inclined between the anode chamber 11 and the cathode chamber 12, that is, the membrane frame 14 is not parallel to the bottom surface of the anode chamber 11, but has a certain inclination angle. Correspondingly, the top of the side wall of the anode chamber 11 also has the same inclination angle as the bottom surface of the anode chamber 11 to accommodate the membrane frame 14. A drain port is provided at the highest position of the top of the anode chamber 11 to discharge air bubbles in the anode chamber 11. The drain outlet will be described further later.

[0017] See below. Figures 2 to 3 and combined Figure 1 , Figure 2 This is a three-dimensional schematic diagram of the anode cavity in one embodiment of this application. Figure 3 This is an exploded view of the liquid inlet ring and anode cavity in one embodiment of this application. The electroplating apparatus includes a first anode 15 and a second anode 16. The anode cavity 11 includes a first anode cavity 111 and a second anode cavity 112, with the second anode cavity 112 located on the outer periphery of the first anode cavity 111. The sidewall of the first anode cavity 111 is a first sidewall 1110, and the sidewall of the second anode cavity 112 is a second sidewall 1120. Figure 1 From this perspective, the tops of the first sidewall 1110 and the second sidewall 1120 tilt upwards from left to right, respectively.

[0018] The first anode 15 is located within the first anode cavity 111, and the second anode 16 is located within the second anode cavity 112. Optionally, in some examples, an anode plate 1100 is respectively disposed at the bottom of the first anode cavity 111 and the second anode cavity 112, and the first anode 15 and the second anode 16 are respectively disposed on the anode plate 1100. Exemplarily, the anode plate 1100 is made of an insoluble conductive material, such as titanium or its metal oxide, and its shape is adapted to the first anode 15 and the second anode 16. The first anode 15 and the second anode 16 are connected to the positive terminal of a power source (not shown in the figure) through the anode plate 1100. Exemplarily, the first anode 15 and the second anode 16 are made of the same material, such as a soluble material, such as copper, nickel, or tin. As an example, the first anode 15 is a columnar body, and the second anode 16 is an annular body.

[0019] like Figures 1 to 3 As shown, the electroplating apparatus also includes a first liquid inlet assembly 113 and a second liquid inlet assembly 123. The first liquid inlet assembly 113 supplies anodic electroplating solution to the first anode chamber 111, and the second liquid inlet assembly 123 supplies anodic electroplating solution to the second anode chamber 112. The first liquid inlet assembly 113 includes a first liquid outlet 1130 facing the first anode upper surface 150 of the first anode 15; the second liquid inlet assembly 123 includes a second liquid outlet 1230 facing the second anode upper surface 160 of the second anode 16. By designing the orientation of the first liquid outlet 1130 and the second liquid outlet 1230, during the supply of anodic electroplating solution to the first anode chamber 111 and the second anode chamber 112, the impact force of the liquid promptly washes away the anode sludge on the first anode upper surface 150 and the second anode upper surface 160, thereby ensuring that the circuit impedance remains essentially constant, avoiding equipment standby caused by voltage rise alarms, and preventing anode sludge from affecting the normal operation of the electroplating process.

[0020] Exemplarily, the first liquid inlet assembly 113 includes a central flow pipe 1131 and multiple branch flow pipes 1132. The central flow pipe 1131 penetrates the anode plate 1100 and the first anode 15 within the first anode cavity 111. The first end of the central flow pipe 1131 is located at the bottom of the first anode cavity 111, serving as the inlet for the anodic electroplating solution. The second end of the central flow pipe 1131 communicates with the branch flow pipes 1132. The multiple branch flow pipes 1132 are located above the first anode 15 and extend from the second end of the central flow pipe 1131 in a direction away from the central flow pipe 1131. For example, the branch flow pipes 1132 are circular tubes, with a length less than the radius of the first anode 15, and their ends away from the central flow pipe 1131 are closed. In other embodiments, the branch flow pipes 1132 may also be square tubes or other shapes. The first liquid outlet 1130 is disposed on the branch flow pipe 1132 and faces the upper surface 150 of the first anode. During the supply of solution to the first anode chamber 111, the anolyte enters the branch pipe 1132 from the central flow pipe 1131 and flows to the upper surface 150 of the first anode via the first outlet section 1130 on the branch pipe 1132. For example, the first outlet section 1130 includes a plurality of outlet holes distributed along the extension direction of the branch pipe 1132.

[0021] Optionally, in some embodiments, the diameters of the plurality of outlet holes on each branch pipe 1132 may be the same or different. As the radius of the first anode 15 increases, the area of ​​the upper surface 150 of the first anode increases, requiring more anolyte to rinse. Therefore, in some embodiments, the diameter of the outlet holes gradually increases from the center to the edge of the first anode 15. Optionally, the density of outlet holes on each branch pipe may be the same or different. In some embodiments, the density of outlet holes gradually increases from the center to the edge of the first anode 15. According to one embodiment, the opening direction of each outlet hole is inclined relative to the vertical direction to avoid the anolyte being sprayed into the same place and causing impact. These plurality of outlet holes on each branch pipe 1132 may be divided into two groups. The opening directions of these two groups of outlet holes are different. In some embodiments, the opening directions of these two groups of outlet holes are symmetrical about the vertical direction. Alternatively, the opening directions of every two adjacent outlet holes on each branch pipe 1132 are different. In some embodiments, the opening directions of every two adjacent outlet holes are symmetrical about the vertical direction. In some embodiments, as shown in the figure, the second end of the central flow pipe 1131 is connected to four branch flow pipes 1132, and the included angle between adjacent branch flow pipes 1132 is 90 degrees to ensure uniform flow distribution. In other alternative embodiments, the first liquid outlet 1130 may not be a hole-like structure such as a liquid outlet orifice; for example, the first liquid outlet 1130 may include one or more spray slits.

[0022] Furthermore, in some embodiments, the first anode cavity 111 is provided with a first drain port 114. For example, the first drain port 114 is disposed on the first sidewall 1110 of the first anode cavity 111 and located at the top of the first sidewall 1110, for receiving the anodic plating solution in the first anode cavity 111. The first sidewall 1110 is also provided with a first drain channel 1140 for discharging the anodic plating solution in the first anode cavity 111. One end of the first drain channel 1140 is connected to the first drain port 114, and the other end is located at the bottom of the anode cavity 11 for connecting to an external drain pipe.

[0023] As an example, the second liquid inlet assembly 123 includes a liquid inlet ring 1231 and a liquid inlet channel 1232. The liquid inlet ring 1231 includes a liquid inlet portion 1231a, which communicates with the liquid inlet channel 1232. A second liquid outlet portion 1230 is disposed on the liquid inlet ring 1231 and faces the upper surface 160 of the second anode. During the supply of liquid to the second anode cavity 112, the anolyte plating solution enters the liquid inlet ring 1231 from the liquid inlet channel 1232 via the liquid inlet portion 1231a, and flows to the upper surface 160 of the second anode via the second liquid outlet portion 1230 on the liquid inlet ring 1231.

[0024] Optionally, in some embodiments, the liquid inlet ring 1231 surrounds the outer periphery of the second anode 16, is disposed on the second sidewall 1120 (the sidewall of the second anode cavity 112) and is at least partially located above the second anode 16, thereby achieving the supply of anodic plating solution to the upper surface 160 of the second anode while avoiding the liquid inlet ring 1231 from affecting the electric field between the second anode 16 and the cathode (substrate) by blocking the second anode 16.

[0025] For example, combined Figure 1 and Figure 3The top of the second sidewall 1120 is provided with a stepped portion 1121, the shape and size of which are adapted to the liquid inlet ring 1231 for accommodating and installing the liquid inlet ring 1231. For example, the liquid inlet ring 1231 has a protrusion 12311, and a mounting hole 12310 is provided in the protrusion 12311. A corresponding mounting groove 11201 is provided on the second sidewall 1120. When assembling the liquid inlet ring 1231, the protrusion 12311 is fitted into the mounting groove 11201, and fasteners are used to pass through the mounting hole 12310 and the second sidewall 1120 to fix the liquid inlet ring 1231 onto the stepped portion 1121 of the second sidewall 1120. The liquid inlet channel 1232 is disposed inside the second side wall 1120. The liquid inlet portion 1231a of the liquid inlet ring 1231 is a tubular component disposed at the bottom of the liquid inlet ring 1231, extending downward from the liquid inlet ring 1231 into the liquid inlet channel 1232, so that the liquid inlet ring 1231 and the liquid inlet channel 1232 are in communication. The lower end of the liquid inlet channel 1232 is in communication with the liquid inlet port 1101 located at the bottom of the anode chamber 11. The liquid inlet port 1101 is used to connect to an external anode electroplating solution source (e.g., a liquid storage device storing anode electroplating solution).

[0026] Exemplarily, the second liquid outlet 1230 includes a plurality of liquid outlet holes. Preferably, the plurality of liquid outlet holes are evenly distributed circumferentially along the liquid inlet ring 1231, which can effectively increase the scouring range of the anolyte and improve the flow uniformity of the anolyte in the second anode cavity 112. In other alternative embodiments, the second liquid outlet 1230 may not be a hole-like structure such as liquid outlet holes; for example, the second liquid outlet 1230 may include one or more spray slits.

[0027] The supply flow rate of the anolyte in the second anode cavity 112 is usually limited. Therefore, in order to ensure that the anolyte supplied by the second outlet 1230 can effectively flush the upper surface 160 of the second anode, the second outlet 1230 should be close to the upper surface 160 of the second anode, and the distance between them should not be too large. Otherwise, the liquid will disperse upon reaching the upper surface 160 of the second anode, affecting the flushing effect. Optionally, in some embodiments, the inlet ring 1231 includes at least two rows of second outlets 1230, and the at least two rows of second outlets 1230 are distributed at intervals along the vertical direction. Figure 3 As shown, the inlet ring 1231 includes two rows of second outlet sections 1230. Combined with... Figure 2 and Figure 3Furthermore, when the second anode 16 is not dissolved, the upper surface 160 of the second anode is in its initial position, wherein at least one row of second liquid outlets 1230 is located above the initial position, and at least one row of second liquid outlets 1230 is located below the initial position. As the electroplating process continues, the second anode 16 is gradually dissolved, and the upper surface 160 of the second anode gradually descends below the initial position. The liquid inlet ring 1231 includes at least two rows of second liquid outlets 1230, which can adapt to the positional changes of the upper surface 160 of the second anode. For example, when the upper surface 160 of the second anode descends to a lower position, the distance between the upper row of second liquid outlets 1230 and the upper surface 160 of the second anode is greater, the impact force of the supplied anode electroplating solution on the upper surface 160 of the second anode is weaker, and the scouring effect is poor. However, the lower row of second liquid outlets 1230 remains close to the upper surface 160 of the second anode, thereby effectively scouring the upper surface 160 of the second anode and preventing the deposition of anode sludge on the upper surface 160 of the second anode.

[0028] Furthermore, the second anode cavity 112 is provided with a second drain port 124. For example, the second drain port 124 is located on the second sidewall 1120 of the second anode cavity 112 and at the top of the second sidewall 1120, for receiving the anodic plating solution in the second anode cavity 112. The second sidewall 1120 is provided with a second drain channel 1240 for discharging the anodic plating solution in the second anode cavity 112. One end of the second drain channel 1240 communicates with the second drain port 124, and the other end is located at the bottom of the anode cavity 112 for connecting to an external drain pipe. As an example, the inlet ring 1231 has a clearance notch 12312 and is not a complete ring. The clearance notch 12312 is used to avoid the second drain port 124 so that the anodic plating solution in the second anode cavity 112 can be discharged from the second drain port 124 without being blocked by the inlet ring 1231. Figure 2 and Figure 3 As shown, the second sidewall 1120 has an extension 11202 adapted to the clearance notch 12312. The extension 11202 is located on both sides of the second drain port 124, and the end of the clearance notch 12312 in the circumferential direction is fitted with the extension 11202.

[0029] See below. Figures 4 to 6 , Figures 4 to 6 The anode cavity structure of the electroplating apparatus in another embodiment of this application is shown, wherein, Figure 4 This is a cross-sectional schematic diagram of the anode cavity in another embodiment of this application. Figure 5 This is a three-dimensional schematic diagram of the anode cavity in another embodiment of this application. Figure 6 This is an exploded schematic diagram of the inlet ring and anode cavity in another embodiment of this application.

[0030] and Figures 1 to 3 Compared to the embodiments shown, in Figures 4 to 6 In the illustrated embodiment, the second liquid inlet assembly includes a liquid inlet ring 4231 and a liquid inlet channel 4232. The liquid inlet ring 4231 is disposed directly above the second anode 16, and the ring width of the liquid inlet ring 4231 is smaller than the ring width of the second anode 16. That is, the projection of the liquid inlet ring 4231 on the horizontal plane falls on the upper surface 160 of the second anode 16, and in the radial direction, at least a portion of the upper surface 160 of the second anode is not obstructed by the liquid inlet ring 4231.

[0031] As an example, the inlet ring 4231 is a tubular component, and the second outlet portion 4230 is disposed on the inlet ring 4231. The second outlet portion 4230 includes multiple outlet holes, which are distributed circumferentially on the inlet ring 4231. The interior of the second anode 16 has a clearance space 161 for providing the inlet channel 4232. As an example, the clearance space 161 is formed by a notch structure penetrating the second anode 16, and the sidewalls of the notch structure enclose a semi-open receiving space. In other embodiments, the clearance space 161 may be formed by a through-hole structure penetrating the second anode 16, and the sidewalls of the through-hole structure enclose a fully enclosed receiving space. The liquid inlet channel 4232 is a tubular component, and the liquid inlet portion 4231a of the liquid inlet ring 4231 is a tubular component adapted to the liquid inlet channel 1232, located at the bottom of the liquid inlet ring 4231, extending downward from the liquid inlet ring 4231 into the liquid inlet channel 4232, so that the liquid inlet ring 4231 and the liquid inlet channel 4232 are in communication. The lower end of the liquid inlet channel 4232 is in communication with the liquid inlet port 1101 located at the bottom of the anode chamber 11.

[0032] Furthermore, a connector 42310 is provided on the inlet ring 4231, extending downward from the outer periphery of the inlet ring 4231. A connecting seat 11210 adapted to the connector 42310 is disposed inside the second anode cavity 112. For example, the connecting seat 11210 is disposed on the anode plate 1100 inside the second anode cavity 112. Figure 6 As shown, an mounting flange 11001 is provided on the outer periphery of the anode plate 1100 inside the second anode cavity 112 for mounting the anode plate 1100 onto the second anode cavity 112. A connecting seat 11210 is provided on the mounting flange 11001. When assembling the liquid inlet ring 4231, the connecting head 42310 is embedded in the connecting seat 11210 to fix the liquid inlet ring 4231 above the second anode 16, preventing the liquid inlet ring 4231 from falling onto the upper surface 160 of the second anode and affecting the scouring effect on the upper surface 160 of the second anode.

[0033] In these embodiments, the liquid inlet ring 4231 is located above the second anode 16 and occupies the existing internal space of the second anode cavity 112. There is no need to modify the main structure of the existing anode cavity 11. Only an obstacle space needs to be provided on the second anode 16, which is a consumable component, to install the liquid inlet ring 4231 and the liquid inlet channel 4232 on the existing anode cavity 11. This can be well compatible with the existing electroplating equipment and reduce the difficulty and cost of modifying the electroplating equipment.

[0034] It should be understood that, in Figures 4 to 6 In the embodiment shown, the device still includes components such as a first anode chamber 111, a first liquid inlet assembly 113, a first liquid outlet 114, and a second liquid outlet 124. For details about these components, please refer to the relevant descriptions above, which will not be repeated here.

[0035] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. An electroplating apparatus, characterized in that, include: The anode cavity includes a first anode cavity and a second anode cavity, wherein the second anode cavity is located on the outer periphery of the first anode cavity; The first anode is located within the first anode cavity; The second anode is located inside the second anode cavity, and the second anode is a soluble anode; A first liquid inlet assembly is used to supply anodic plating solution to the first anode cavity, wherein the first liquid inlet assembly includes a first liquid outlet, the first liquid outlet facing the upper surface of the first anode; and The second liquid inlet assembly is used to supply anodic plating solution to the second anode cavity, wherein the second liquid inlet assembly includes a second liquid outlet, the second liquid outlet facing the upper surface of the second anode.

2. The electroplating apparatus according to claim 1, characterized in that, The first inlet assembly includes a central flow tube and multiple branch flow tubes. The central flow tube passes through the first anode, and the first end of the central flow tube is located at the bottom of the first anode cavity, serving as the inlet of the anodic electroplating solution for the first anode cavity. The second end of the central flow tube is located above the first anode and communicates with the branch flow tube, which extends from the central flow tube in a direction away from the central flow tube. The first liquid outlet is located in the branch flow pipe.

3. The electroplating apparatus according to claim 1, characterized in that, The second liquid inlet assembly includes a liquid inlet ring and a liquid inlet channel, wherein the liquid inlet ring is connected to the liquid inlet channel, and the second liquid outlet is disposed on the liquid inlet ring.

4. The electroplating apparatus according to claim 3, characterized in that, The liquid inlet ring is disposed around the outer periphery of the second anode, on the side wall of the second anode cavity, and at least partially located above the second anode.

5. The electroplating apparatus according to claim 4, characterized in that, The side wall of the second anode chamber is provided with a second drain port for receiving the anode electroplating solution in the second anode chamber; The inlet ring has a clearance notch, which is used to avoid the second outlet.

6. The electroplating apparatus according to claim 3, characterized in that, The liquid inlet ring includes at least two rows of the second liquid outlet, and the at least two rows of the second liquid outlet are distributed at intervals along the vertical direction.

7. The electroplating apparatus according to claim 6, characterized in that, When the second anode is not dissolved, the upper surface of the second anode is in the initial position, wherein at least one row of the second liquid outlet is located below the initial position.

8. The electroplating apparatus according to claim 3, characterized in that, The liquid inlet ring is positioned directly above the second anode, and the width of the liquid inlet ring is smaller than the width of the second anode.

9. The electroplating apparatus according to claim 8, characterized in that, The interior of the second anode has a clearance space, which is used to set up the liquid inlet channel.

10. The electroplating apparatus according to claim 3, characterized in that, The second liquid outlet section includes a plurality of liquid outlet holes, which are distributed circumferentially along the liquid inlet ring.

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