A method for maintaining an SPS electrolytic cell
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG DETONG ENVIRONMENTAL TECH CO LTD
- Filing Date
- 2026-05-26
- Publication Date
- 2026-08-07
AI Technical Summary
这种作业方式存在以下问题:首先,人工清理需要长时间停车,会导致整个微蚀液循环系统停产,影响生产连续性,降低生产效率;其次,微蚀液具有酸性腐蚀性,人工清理作业过程中存在安全隐患,容易对操作人员造成身体伤害;最后,人工收集的铜粉需要额外转运进行溶解处理,流程繁琐,增加了人工与物料转运成本
本发明通过设置过滤收集溶解结构,过滤收集溶解结构包括两组过滤收集溶解缸,通过使每组的过滤收集溶解缸分别与电解槽主体、AC循环副槽、微蚀用后液储罐和产线收集缸连接,能够使两组过滤收集溶解缸按照预设周期交替或根据电解槽主体的运行状态自动交替进行电解槽主体内的铜粉清理保养作业,无需使电解槽主体停车后人工对电解槽主体进行铜粉清理,避免了人工停车清理带来的生产中断问题,提升了生产效率,保证了电解槽主体的连续稳定运行。
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Figure CN122522262A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of SPS micro-etching solution recycling and reuse technology, and in particular to a method for maintaining an SPS electrolytic cell. Background Technology
[0002] As the micro-etching reaction continues, the concentration of copper ions in the micro-etching solution increases. When the copper ion concentration exceeds a certain threshold, the micro-etching rate decreases significantly, and the micro-etching effect fails to meet the production process requirements. At this point, the micro-etching solution becomes waste micro-etching solution (i.e., post-micro-etching solution) and needs to be treated or discharged. Directly discharging waste micro-etching solution not only wastes copper resources but also causes serious environmental pollution, and it also contradicts the current national development concept of green production and resource recycling. Therefore, the industry generally adopts electrolysis to treat waste micro-etching solution. Through electrolysis, copper ions in the solution are deposited on the cathode plate, achieving copper recovery while reducing the copper ion concentration in the solution. This allows the treated micro-etching solution to be reused in the production process, forming a recycling system for SPS micro-etching solution (sodium persulfate micro-etching solution).
[0003] In the electrolytic recovery of copper, a two-stage electrolytic cell series configuration is typically used: the primary electrolytic cell is mainly used for large-scale deposition and recovery of high-concentration copper ions in the solution, while the secondary electrolytic cell is used to further reduce the copper ion concentration in the solution to ensure that the copper ion concentration in the effluent meets the requirements for reuse. However, during long-term operation of the two-stage SPS electrolytic cell, due to the influence of various factors such as current density, solution flow rate, and electrode surface condition, the copper deposited on the cathode plate surface is often not a dense and flat copper plate, but rather forms a large amount of loose copper powder. This copper powder easily detaches from the cathode surface and deposits at the bottom of the electrolytic cell. If not cleaned in time, it will gradually accumulate and block the inlet and outlet pipes of the electrolytic cell, increasing the solution flow resistance and reducing the electrolytic processing efficiency. At the same time, the accumulated copper powder can also cause uneven local current density distribution, leading to more loose deposits on the cathode plate surface, forming a vicious cycle. In severe cases, it can even cause a short circuit in the electrolytic cell, affecting the stable operation of the entire electrolysis system.
[0004] Currently, for cleaning copper powder from secondary SPS electrolytic cells, existing technologies typically employ manual, periodic cleaning: this involves periodically stopping the electrolysis system, draining the solution from the cell, and having workers manually shovel and collect the accumulated copper powder. This method has the following problems: First, manual cleaning requires prolonged shutdowns, causing the entire micro-etching solution circulation system to stop, affecting production continuity and reducing efficiency; second, the micro-etching solution is acidic and corrosive, posing safety hazards during manual cleaning and potentially causing injury to operators; finally, the manually collected copper powder requires additional transportation for dissolution, a cumbersome process that increases labor and material handling costs. Summary of the Invention
[0005] One of the objectives of this invention is, at least, to provide an SPS electrolytic cell maintenance method that addresses the problems existing in the prior art, thereby removing copper powder from the electrolytic cell body and dissolving and recirculating the removed copper powder, ensuring stable operation of the electrolysis system, and reducing labor costs and safety risks.
[0006] To achieve the above objectives, the technical solution adopted by the present invention includes the following aspects.
[0007] A method for maintaining an SPS electrolytic cell is provided, which uses an SPS electrolytic cell maintenance device. The SPS electrolytic cell maintenance device includes an electrolytic cell body, an AC circulation auxiliary tank, a filtration and collection dissolution structure, a micro-etching post-liquid storage tank, and a production line collection cylinder. The electrolytic cell body is equipped with a spray pipeline. The filtration, collection, and dissolution structure includes two sets of filtration, collection, and dissolution cylinders, each set including one or more filtration, collection, and dissolution cylinders. Each of the filtration, collection, and dissolution cylinders is connected to the main body of the electrolytic cell, the AC circulation auxiliary tank, the micro-etching post-liquid storage tank, and the production line collection cylinder, respectively. The corresponding connecting pipelines are equipped with electric ball valves and corresponding pump bodies. The SPS electrolytic cell maintenance method includes the following steps: S1. Set the electrolysis time A and current parameters for the main body of the electrolytic cell; S2. Start the main body of the electrolytic cell to perform electrolysis; S3. Start the filtration, collection and dissolution structure. Use the first set of filtration, collection and dissolution tanks to circulate and collect copper powder, and use the second set of filtration, collection and dissolution tanks to circulate the liquid after micro-etching. S4. When the filtration time B of the first set of filter collection and dissolution tanks reaches the set value, adjust the filter collection and dissolution structure, use the micro-etching post-treatment liquid to dissolve the copper powder collected in the first set of filter collection and dissolution tanks, and return the micro-etching post-treatment liquid after dissolving the copper powder to the micro-etching post-treatment liquid storage tank; while the copper powder in the first set of filter collection and dissolution tanks is being dissolved, the second set of filter collection and dissolution tanks is being used for copper powder circulation filtration and collection. S5. When the filtration time C of the second set of filter collection and dissolution tanks reaches the set value, adjust the filter collection and dissolution structure, use the micro-etching post-treatment liquid to dissolve the copper powder collected in the second set of filter collection and dissolution tanks, and return the micro-etching post-treatment liquid after dissolving the copper powder to the micro-etching post-treatment liquid storage tank; while the copper powder in the second set of filter collection and dissolution tanks is dissolving, the first set of filter collection and dissolution tanks is used to circulate and filter the copper powder. S6. Repeat S4 and S5 until the electrolysis time A of the main body of the electrolytic cell reaches the set value.
[0008] Preferably, the first set of filtration, collection and dissolution tanks includes a first filtration, collection and dissolution tank, and the second set of filtration, collection and dissolution tanks includes a second filtration, collection and dissolution tank. The copper powder circulation filtration and collection process using the first set of filtration, collection and dissolution tanks includes: controlling electric ball valve 1, electric ball valve 2, electric ball valve 7 and electric ball valve 8 to open simultaneously, controlling electric ball valve 3, electric ball valve 4, electric ball valve 5 and electric ball valve 6 to close simultaneously, and simultaneously turning on the tank liquid filtration pump, the conveying pump, the used liquid output pump and the used liquid collection pump. In the first filtration, collection and dissolution tank, the electrolyte solution containing copper powder in the main body of the electrolytic cell is filtered by the electrolyte filtration pump and then fed into the AC circulation auxiliary tank by the transfer pump and then returned to the main body of the electrolytic cell by the electrolyte circulation pump. While the first filtration and collection dissolution tank is filtering, the micro-etching post-treatment liquid in the micro-etching post-treatment liquid storage tank is fed into the second filtration and collection dissolution tank through the post-treatment liquid output pump, and then fed into the production line collection tank through the delivery pump. The micro-etching post-treatment liquid in the production line collection tank is then fed into the micro-etching post-treatment liquid storage tank through the post-treatment liquid collection pump.
[0009] Preferably, S4 specifically includes: shutting down the used liquid output pump, simultaneously shutting down electric ball valve 1, electric ball valve 2, electric ball valve 7 and electric ball valve 8, and simultaneously opening electric ball valve 3, electric ball valve 4, electric ball valve 5 and electric ball valve 6, and then turning on the used liquid output pump; In the first filtration and collection dissolution tank, the micro-etching post-treatment liquid in the micro-etching post-treatment liquid storage tank is fed into the first filtration and collection dissolution tank through the post-treatment liquid output pump to dissolve the copper powder. After dissolving the copper powder, the micro-etching post-treatment liquid is then fed into the production line collection tank through the delivery pump. The micro-etching post-treatment liquid in the production line collection tank is fed into the micro-etching post-treatment liquid storage tank through the post-treatment liquid collection pump. While copper powder is dissolved in the first filtration and collection dissolution tank, the electrolyte solution containing copper powder in the main body of the electrolytic cell is filtered by the electrolyte filtration pump into the second filtration and collection dissolution tank. The filtered solution is then pumped into the AC circulation auxiliary tank by the transfer pump and then returned to the main body of the electrolytic cell by the electrolyte circulation pump.
[0010] Preferably, when the level sensor in the AC circulation auxiliary tank detects that the liquid in the AC circulation auxiliary tank has reached the first preset level, the level sensor sends a signal to the tank liquid circulation pump, and the tank liquid circulation pump starts to pump the liquid in the AC circulation auxiliary tank into the main body of the electrolytic cell; when the level sensor detects that the liquid in the AC circulation auxiliary tank has reached the second preset level, the level sensor sends a signal to the tank liquid circulation pump, and the tank liquid circulation pump stops, ceasing to deliver liquid to the main body of the electrolytic cell, and the second preset level value is lower than the first preset level value.
[0011] Preferably, the filtration and collection dissolution tank is equipped with a conveying pump body and a filter screen or filter bag, which divides the filtration and collection dissolution tank into upper and lower parts.
[0012] Preferably, the electrolytic cell body has multiple cathode plates and multiple anode frames arranged along its length. The cathode plates and anode frames are arranged in parallel and staggered. The anode frames are provided with anode plates. The electrolytic cell body is also provided with a tank liquid collection port, which is located on the tank wall and / or the bottom of the electrolytic cell body.
[0013] Preferably, the injection pipeline includes a bottom injection pipeline and an electrode plate injection pipeline. The bottom injection pipeline is a horizontal pipeline and is located at the bottom of the main body of the electrolytic cell. The electrode plate injection pipeline is connected to the bottom injection pipeline and is arranged along the height direction of the cathode plate. The bottom injection pipeline is connected to the injection liquid inlet pipeline.
[0014] Preferably, the bottom spray pipeline includes a first horizontal pipe and a second horizontal pipe. The first horizontal pipe is arranged along the length of the main body of the electrolytic cell, and the second horizontal pipe is arranged along the width of the main body of the electrolytic cell. The first horizontal pipe is connected to the spray inlet pipeline, and the second horizontal pipe is connected to the first horizontal pipe. The second horizontal pipe is also arranged between the cathode plate and the anode frame. A plurality of first nozzles are uniformly arranged along the length of the second horizontal pipe. The electrode spray pipeline includes a vertical pipe, which is vertically connected to the first horizontal pipe. Each first horizontal pipe has at least two vertical pipes along its length, and the vertical pipe has multiple third nozzles along its height.
[0015] Preferably, the filter collection and dissolution tank is further provided with a spray dissolution pipeline. The spray dissolution pipeline is arranged circumferentially along the filter collection and dissolution tank and is located above the filter screen. Multiple fifth nozzles are evenly arranged circumferentially on the spray dissolution pipeline. The micro-etching post-treatment liquid pumped by the post-treatment liquid output pump is sprayed onto the filter screen through the fifth nozzles from the spray dissolution pipeline that enters the top of the filter collection and dissolution tank.
[0016] Preferably, the system also includes a control module, which is connected to the tank liquid filtration pump, the used liquid output pump, the used liquid collection pump, the tank liquid circulation pump, the electrolysis power supply, the electric ball valve, and the liquid level sensor.
[0017] In summary, by adopting the above technical solution, the present invention has at least the following beneficial effects: This invention, by setting up a filtration, collection, and dissolution structure, includes two sets of filtration, collection, and dissolution cylinders. By connecting each set of filtration, collection, and dissolution cylinders to the main body of the electrolytic cell, the AC circulation auxiliary tank, the micro-etching post-treatment liquid storage tank, and the production line collection cylinder, the two sets of filtration, collection, and dissolution cylinders can perform copper powder cleaning and maintenance operations in the main body of the electrolytic cell in an alternating manner according to a preset cycle or automatically according to the operating status of the main body of the electrolytic cell. This eliminates the need for manual copper powder cleaning of the main body of the electrolytic cell after it is shut down, avoids production interruption caused by manual shutdown cleaning, improves production efficiency, and ensures the continuous and stable operation of the main body of the electrolytic cell.
[0018] By installing spray pipes in the main body of the electrolytic cell, copper powder adhering to the cathode plate and the bottom of the electrolytic cell can be detached and mixed into the electrolyte. The copper powder can be discharged from the main body of the electrolytic cell with the electrolyte and collected in a set of filtration and collection dissolution tanks. The copper powder collected in the filtration and collection dissolution tanks can be dissolved and discharged from the filtration and collection dissolution tanks. The discharged copper powder can be returned to the micro-etching post-treatment liquid storage tank through the production line collection tank, realizing the automated recycling of copper resources, reducing resource waste, and lowering enterprise production costs. The cleaning, collection, dissolution, and return process of copper powder is all completed in a closed device, avoiding manual contact with acidic electrolyte and copper powder, avoiding shutdown to recover copper powder in the micro-etching post-treatment liquid storage tank, replace filter screens or filter bags, etc., eliminating the safety hazards of manual cleaning and the risk of electrolyte leakage and pollution, and improving the safety and environmental protection of the operation process.
[0019] The control module enables fully automated operation of the entire process. It can automatically adjust the copper powder cleaning frequency in the electrolytic cell according to the operating status of the electrolytic cell, adapting to the copper powder accumulation under different production loads. It has strong adaptability, stable operation, and low maintenance costs. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of an SPS electrolytic cell maintenance device according to an exemplary embodiment of the present invention.
[0021] Figure 2 This is a schematic diagram of the injection pipeline arrangement in the main body of the electrolytic cell according to an exemplary embodiment of the present invention.
[0022] Figure 3 This is a schematic diagram of the arrangement of the third nozzle relative to the cathode plate in an exemplary embodiment of the present invention.
[0023] Figure 4 This is a schematic diagram of the injection pipeline arrangement of another exemplary embodiment of the present invention.
[0024] Figure 5 This is a schematic diagram of a filtration, collection, and dissolution tank according to an exemplary embodiment of the present invention.
[0025] Figure 6This is a schematic diagram of an SPS electrolytic cell maintenance device according to another exemplary embodiment of the present invention.
[0026] Diagram labels: 1-Electrolytic cell body, 100-Tank solution collection port, 101-Cathode plate, 102-Anode frame, 103-Anode plate, 2-AC circulation auxiliary tank, 3-Filtration, collection, and dissolution structure, 301-First filtration, collection, and dissolution tank, 302-Second filtration, collection, and dissolution tank, 303-Third filtration, collection, and dissolution tank, 300-Filter screen, 4-Micro-etching post-treatment liquid storage tank, 5-Production line collection tank, 6-Tank solution circulation pump, 7-Injection pipeline, 70-Injection inlet pipe, 71-Tank bottom injection pipeline, 711-First horizontal pipe, 712-Second horizontal pipe, 713-First nozzle. 72-Electric plate spray pipeline, 720-Vertical pipe, 721-Third nozzle, 722-Third horizontal pipe, 8-Tank liquid filter pump, 9-Used liquid output pump, 10-Used liquid collection pump, 11-Spray dissolution pipeline, 110-Fifth nozzle, b1-Electric ball valve one, b2-Electric ball valve two, b3-Electric ball valve three, b4-Electric ball valve four, b5-Electric ball valve five, b6-Electric ball valve six, b7-Electric ball valve seven, b8-Electric ball valve eight, b9-Electric ball valve nine, b10-Electric ball valve ten, b11-Electric ball valve eleven, b12-Electric ball valve twelve. Detailed Implementation
[0027] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments, so that the objectives, technical solutions, and advantages of the present invention will be clearer. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention. Example 1
[0028] like Figure 1As shown, the SPS electrolytic cell maintenance device of an exemplary embodiment of the present invention includes an electrolytic cell body 1, an AC circulation auxiliary tank 2, a filtration, collection and dissolution structure 3, a micro-etching post-treatment liquid storage tank 4, and a production line collection cylinder 5. The electrolytic cell body 1 and the AC circulation auxiliary tank 2 are connected, and the solution in the AC circulation auxiliary tank 2 is introduced into the electrolytic cell body 1 through a tank solution circulation pump 6. The electrolytic cell body 1 is provided with a spray pipe 7, which is used to mix copper powder adhering to the bottom of the electrolytic cell body 1 and the cathode plate into the tank solution. The electrolytic cell body 1 is connected to the filtration, collection and dissolution structure 3, and copper powder is mixed into the electrolytic cell body 1. The copper powder is filtered and collected in the tank solution via the tank solution filtration pump 8. The filtration and collection dissolution structure 3 is connected to the AC circulation auxiliary tank 2. The filtered solution in the filtration and collection dissolution structure 3 enters the AC circulation auxiliary tank 2. The micro-etching post-treatment liquid storage tank 4 is connected to the filtration and collection dissolution tank 3. The micro-etching post-treatment liquid in the micro-etching post-treatment liquid storage tank 4 is fed into the filtration and collection dissolution tank 3 via the post-treatment liquid output pump 9 to dissolve the copper powder. The micro-etching post-treatment liquid after dissolving the copper powder enters the production line collection tank 5. The micro-etching post-treatment liquid in the production line collection tank 5 enters the micro-etching post-treatment liquid storage tank 4 via the post-treatment liquid collection pump 10.
[0029] The SPS electrolytic cell maintenance device of the present invention mixes copper powder adhering to the bottom of the electrolytic cell body 1 and the cathode plate into the electrolyte through the spray pipe 7 in the electrolytic cell body 1. This allows the copper powder adhering to the electrolytic cell body 1 to detach without stopping the machine, avoiding manual entry into the electrolytic cell body 1 to clean the copper powder and reducing safety hazards. The electrolytic cell body 1, AC circulation auxiliary tank 2, and filtration and collection dissolution tank 3 can form a circulating filtration system to circulate and filter the electrolyte in the electrolytic cell body 1, improving the filtration and removal effect of the copper powder mixed in the electrolyte. After the copper powder mixed in the electrolyte is collected in the filtration and collection dissolution tank 3, it is then... The post-etching solution in the micro-etching solution storage tank 4 is fed into the filtration and collection dissolution tank 3 to dissolve copper powder, avoiding the need to open the filtration and collection dissolution tank 3 to remove the copper powder and improving the safety of copper powder collection. Furthermore, this method of dissolving the copper powder in the filtration and collection dissolution tank 3 also prevents the filter media in the filtration and collection dissolution tank 3 from clogging, which would affect the filtration effect. After the copper powder in the filtration and collection dissolution tank 3 is dissolved (the copper powder is converted into copper ions), it is fed into the production line collection tank 5, and then pumped by the post-etching solution collection pump 10 into the post-etching solution storage tank 4. The post-etching solution in the storage tank 4 then enters the primary electrolytic cell for electrolytic recovery, preventing the loss of copper ions. This invention's device can remove and filter copper powder without stopping the electrolytic cell body 1, and can also dissolve and reuse the filtered copper powder. Compared to manually dissolving copper powder separately, this invention's device eliminates the tedious process of manually removing and dissolving copper powder, and also avoids manual contact with the post-etching solution, improving copper powder recovery efficiency and safety, and increasing production efficiency.
[0030] The AC circulation auxiliary tank 2 is equipped with a liquid level sensor (not shown in the figure). The liquid level sensor is connected to the tank liquid circulation pump 6. When the liquid level sensor detects that the liquid in the AC circulation auxiliary tank 2 has reached the first preset liquid level, the liquid level sensor sends a signal to the tank liquid circulation pump 6, and the tank liquid circulation pump 6 starts to pump the liquid in the AC circulation auxiliary tank 2 into the electrolytic cell body 1. When the liquid level sensor detects that the liquid in the AC circulation auxiliary tank 2 has reached the second preset liquid level (the second preset liquid level value is lower than the first preset liquid level value), the liquid level sensor sends a signal to the tank liquid circulation pump 6, and the tank liquid circulation pump 6 shuts down, stopping the delivery of liquid to the electrolytic cell body 1.
[0031] The filtration and dissolution collection structure 3 includes two sets of filtration and dissolution collection tanks, each set including one or more filtration and dissolution collection tanks. When each set includes one filtration and dissolution collection tank, refer to... Figure 1 For ease of description, the first group of filter collection and dissolution tanks is referred to as the first filter collection and dissolution tank 301, and the second group of filter collection and dissolution tanks is referred to as the second filter collection and dissolution tank 302. The first filter collection and dissolution tank 301 is connected to the main body of the electrolytic cell 1, the AC circulation auxiliary tank 2, the micro-etching post-liquid storage tank 4, and the production line collection tank 5, respectively. The corresponding connecting pipes are equipped with electric ball valves b1, b2, b3, and b4, respectively. The second filter collection and dissolution tank 302 is connected to the main body of the electrolytic cell 1, the AC circulation auxiliary tank 2, the micro-etching post-liquid storage tank 4, and the production line collection tank 5, respectively. The corresponding connecting pipes are equipped with electric ball valves b5, b6, b7, and b8, respectively.
[0032] Multiple cathode plates 101 and multiple anode frames 102 (with anode plates 103 inside the anode frames) are arranged along the length of the electrolytic cell body 1. The cathode plates 101 and anode frames 102 are arranged alternately, and the cathode plates 101 and anode frames 102 are arranged parallel to each other (see reference). Figure 2 The electrolytic cell body 1 is provided with one or more tank liquid collection ports 100, which are set at the preset highest liquid level on the wall of the electrolytic cell body 1. When the copper powder attached to the cathode plate 101 and the bottom of the electrolytic cell body 1 falls into the tank liquid, and the liquid level is at the preset highest liquid level, the copper powder floating on the top of the tank liquid will flow out of the electrolytic cell body 1 through the tank liquid collection port 100 along with the tank liquid, and be pumped into the first or second filtration collection dissolution tank for filtration by the tank liquid filter pump 8. The tank liquid collection port can also be set at the bottom of the electrolytic cell body 1 (not shown in the figure). At this time, when the tank liquid is lower than the highest preset highest liquid level, the tank liquid mixed with copper powder can be drawn out from the tank liquid collection port 100 at the bottom of the electrolytic cell body 1 by the tank liquid filter pump 8.
[0033] The injection pipeline 7 includes a bottom injection pipeline 71 and an electrode injection pipeline 72. The bottom injection pipeline 71 is a horizontal pipeline located at the bottom of the electrolytic cell body 1. It is used to remove copper powder adhering to the bottom of the electrolytic cell body 1 and mix it into the electrolyte. The electrode injection pipeline 72 is connected to the bottom injection pipeline 71 and is arranged along the height direction of the cathode plate 101. It is used to remove copper powder adhering to the cathode plate 101 and mix it into the electrolyte. The bottom injection pipeline 71 is connected to the injection inlet pipeline 70. The solution in the AC circulation auxiliary tank 2 can be directly pumped into the electrolytic cell body 1 after being pumped by the electrolyte circulation pump 10. Alternatively, it can enter the bottom injection pipeline 71 and the electrode injection pipeline 72 through the injection inlet pipeline 70 and then enter the electrolytic cell body 1 through the bottom injection pipeline 71 and the electrode injection pipeline 72, so that the electrolyte in the electrolytic cell body 1 can be recycled.
[0034] The bottom spray pipe 71 includes a first horizontal pipe 711 and a second horizontal pipe 712. The first horizontal pipe 711 is arranged along the length of the electrolytic cell body 1, and the second horizontal pipe 712 is arranged along the width of the electrolytic cell body 1 (also the length of the cathode plate). The first horizontal pipe 711 is connected to the spray inlet pipe 70, and the second horizontal pipe 712 is connected to the first horizontal pipe 711. The second horizontal pipe 712 is also arranged between the cathode plate 101 and the anode frame 102. A plurality of first nozzles 713 are evenly arranged along the length of the second horizontal pipe 712. The first nozzle 713 is arranged upwards so that its spray direction is towards the top of the electrolytic cell body 1. During spraying, the first nozzle 713 can agitate the electrolyte solution containing copper powder in the electrolytic cell body 1, preventing the copper powder from settling to the bottom and facilitating its discharge with the electrolyte solution. Furthermore, a second nozzle is provided between adjacent first nozzles 713, arranged downwards so that its spray direction is towards the bottom of the electrolytic cell body 1. When copper powder is deposited at the bottom of the electrolytic cell body 1, spraying the bottom helps to float the deposited copper powder and mix it into the electrolyte solution. The second horizontal pipe 712 is longer than the cathode plate 101 to improve the copper powder removal effect. The first horizontal pipe 711 and the second horizontal pipe 712 can be supported by a bracket, ensuring that both are a certain distance from the bottom of the electrolytic cell body 1 to prevent contact with the bottom and thus maintain the copper powder removal effect. During use, a corresponding first nozzle can also be set along the length of the first horizontal pipe 711, with the first nozzle on the first horizontal pipe 711 arranged upwards.
[0035] The electrode spraying pipeline 72 includes vertical pipes 720, which are vertically connected to the first horizontal pipe 711. Each first horizontal pipe 711 has at least two vertical pipes 720 along its length. Each vertical pipe 720 has multiple third nozzles 721 along its height. The third nozzles 721 on the two vertical pipes 720 are symmetrically arranged (they can be arranged opposite each other or facing the cathode plate 101). During spraying, the liquid between the opposite third nozzles 721 can convect, causing copper powder to fall off the cathode plate 101 through the flow of the liquid. When two vertical pipes 720 are arranged along the length of the first horizontal pipe 711, the two vertical pipes 720 can be located at both ends of the cathode plate 101 or corresponding to the middle of the cathode plate 101. When more vertical pipes 720 are arranged, they are evenly distributed along the length of the first horizontal pipe 711. In a preferred embodiment of this invention, the vertical pipe 720 on one side of the cathode plate 101 is designated as the first group of vertical pipes, and the vertical pipe 720 on the other side of the cathode plate 101 is designated as the second group of vertical pipes. When two vertical pipes 720 are provided in each group, the third nozzle 721 on the two vertical pipes 720 has an angle c between it and the surface of the cathode plate 101, such that the spraying direction of the third nozzle 721 forms an angle c with the surface of the cathode plate 101 (see reference). Figure 3 This facilitates the removal of copper powder from the surface of the cathode plate 101.
[0036] In the main body 1 of the electrolytic cell, there is one more cathode plate 101 than anode plate 103. The length of cathode plate 101 is longer than that of anode plate 103, and the height of cathode plate 101 is greater than that of anode plate 103, resulting in a larger area for cathode plate 101 than for anode plate 103. In this case, when the spacing between cathode plate 101 and anode 102 is too small to meet the arrangement requirements of vertical pipe 720, one or more vertical pipes 720 can be arranged on both sides of the length of cathode plate 101, and a third horizontal pipe 722 is connected to the top of the vertical pipe 720 (see reference). Figure 4 A fourth nozzle is installed along the length of the third horizontal pipe 722, with the fourth nozzle facing downwards. This allows for convection of the electrolyte between the fourth nozzle and the first nozzle 713, improving the removal of copper powder from the cathode plate in the area directly opposite the anode plate. Furthermore, the solution pressure sprayed from the first to fourth nozzles can be 1.0~1.5 bar. Since the electrolyte in the electrolytic cell body 1 (secondary electrolytic cell) is introduced from the primary electrolytic cell, the copper ion concentration in the electrolyte of the electrolytic cell body 1 is significantly lower than that of the primary electrolytic cell. Under the set current parameters of the electrolytic cell body 1 (same as or similar to the current parameters of the primary electrolytic cell, or higher than the current parameters of the primary electrolytic cell, determined according to actual production requirements), the adhesion of copper powder decreases. Therefore, setting the solution pressure sprayed from the first to fourth nozzles to 1.0~1.5 bar is beneficial for dispersing and removing copper powder from the cathode plate.
[0037] Each filtration and collection dissolution tank is equipped with a filter screen 300 (or filter bag) and a delivery pump (not shown in the figure). The filtration and collection dissolution tank has a closed cavity structure, and its shape is not limited to cylindrical, prismatic, etc. When the filter screen 300 is installed, it divides the filtration and collection dissolution tank into upper and lower parts. The electrolyte in the main body 1 of the electrolytic cell is introduced into the filtration and collection dissolution tank from above via the electrolyte filtration pump 8 and corresponding pipelines. The copper powder mixed in the electrolyte is intercepted by the filter screen 300. The electrolyte after filtering the copper powder is located below the filter screen 300. The electrolyte below the filter screen 300 is output from the filtration and collection dissolution tank through the delivery pump and corresponding pipelines, and is introduced into the AC circulation auxiliary tank 2 from the top. At this time, the filtration and collection dissolution... Only copper powder remains on filter screen 300 in the dissolution tank. When the micro-etching post-treatment liquid is introduced into the filtration collection and dissolution tank, it is introduced from above the filtration collection and dissolution tank through the post-treatment liquid output pump and corresponding pipeline, so that the micro-etching post-treatment liquid dissolves the copper powder on filter screen 300. The liquid level in the filtration collection and dissolution tank after the introduction of the micro-etching post-treatment liquid can be higher than the filter screen 300, so that the filter screen 300 is immersed in the micro-etching post-treatment liquid, and the copper powder on the filter screen 300 is fully dissolved. After the copper powder on the filter screen 300 is dissolved, it is mixed into the micro-etching post-treatment liquid in the form of copper ions. The micro-etching post-treatment liquid with dissolved copper powder in the filtration collection and dissolution tank is introduced into the production line collection tank 5 through the delivery pump. The micro-etching post-treatment liquid in the production line collection tank 5 enters the micro-etching post-treatment liquid storage tank through the post-treatment liquid collection pump and corresponding pipeline.
[0038] By dissolving the copper powder on the filter screen 300, the copper powder in the filter collection and dissolution tank can be removed without opening the filter collection and dissolution tank. This avoids the copper powder from accumulating on the filter screen for a long time and clogging the filter screen, thus affecting the filter screen's filtration effect. It also avoids the need for manual transfer of copper powder or replacement of filter media, and avoids manual contact with the micro-etching solution.
[0039] The filtration and collection dissolution tank is also equipped with a spray dissolution pipe 11, for reference. Figure 5 The spray dissolution pipeline 11 is arranged circumferentially along the filter collection dissolution tank. The spray dissolution pipeline 11 is fixed to the inner wall of the filter collection dissolution tank by a pipe rack (not shown in the figure). The spray dissolution pipeline 11 is set above the filter screen 300 and is separated from the filter screen 300 by a certain distance (the specific distance is determined according to the design requirements, such as 30~50cm). Multiple fifth nozzles 110 are evenly arranged circumferentially on the spray dissolution pipeline 11. The micro-etching post-liquid pumped by the post-liquid output pump 9 is sprayed from the spray dissolution pipeline 11, which enters the top of the filter collection dissolution tank, onto the filter screen 300 through the fifth nozzles 110, so that the copper powder on the filter screen 300 dissolves into the micro-etching post-liquid. Through the arrangement of the spray dissolution pipeline 11 and the fifth nozzles 110, the contact area between the micro-etching post-liquid and the copper powder on the filter screen 300 is increased, so that the copper powder on the filter screen 300 is dispersed and dissolved more quickly, thereby improving the copper powder dissolution efficiency.
[0040] When the first group includes two filter collection and dissolution tanks and the second group includes one filter collection and dissolution tank, refer to Figure 6 The two filtration, collection, and dissolution tanks in the first group are designated as the first filtration, collection, and dissolution tank 301 and the third filtration, collection, and dissolution tank 303, respectively. The filtration, collection, and dissolution tanks in the second group are designated as the second filtration, collection, and dissolution tank 302. The third filtration, collection, and dissolution tank 303 is connected to the main body of the electrolytic cell 1, the AC circulation auxiliary tank 2, the micro-etching post-liquid storage tank 4, and the production line collection tank 5, respectively. Electric ball valves b9, b10, b11, and b12 are respectively installed on the corresponding connecting pipelines. The third filtration, collection, and dissolution tank 303 is equipped with a conveying pump (not shown in the figure). Setting up more filtration, collection, and dissolution tanks further improves the copper powder filtration and dissolution efficiency.
[0041] During electrolysis, the copper powder filtration, collection, and reflux process is as follows: the two filtration, collection, and dissolving tanks of the first group simultaneously circulate and collect copper powder, while the micro-etching post-treatment liquid circulates in the filtration, collection, and dissolving tanks of the second group; when copper powder in the two filtration, collection, and dissolving tanks of the first group needs to be dissolved, the micro-etching post-treatment liquid is used to dissolve the copper powder, and the micro-etching post-treatment liquid after dissolving the copper powder is circulated back to the post-treatment liquid storage tank 4, while the second group of filtration, collection, and dissolving tanks simultaneously performs the copper powder filtration process; by adjusting the working status of the first and second groups of filtration, collection, and dissolving tanks, the copper powder filtration, collection, and reflux process can be carried out without stopping the main body of the electrolytic cell 1.
[0042] The SPS electrolytic cell maintenance device of the present invention also includes a control module, which is connected to each pump body (transfer pump, tank liquid filter pump, used liquid output pump, used liquid collection pump, tank liquid circulation pump), electrolysis power supply, each electric ball valve (electric ball valve one to electric ball valve twelve, more or fewer, depending on actual requirements), and liquid level sensor (signal connection, electrical connection or other connection method, depending on specific circumstances) to control the working state of the electrolytic cell body 1 (such as start / stop state, current parameters, electrolysis time, etc.), the working state of each pump body and each electric ball valve (such as start / stop state, working time, etc.), and the working state of the liquid level sensor (such as start / stop state, etc.). Example 2
[0043] This embodiment provides a method for maintaining an SPS electrolytic cell. The method uses the SPS electrolytic cell maintenance device from Embodiment 1 and includes the following steps: S1. Set the electrolysis time A and current parameters of the electrolytic cell body 1. The current parameter is the set value when the electrolytic cell body 1 is running during the electrolysis time A, and the current is 0 after the electrolysis time A ends.
[0044] The operating time of the filtration, collection, and dissolution structure 3 is set. Specifically, the filtration time B of the first filtration, collection, and dissolution tank and the filtration time C of the second filtration, collection, and dissolution tank are set. The sum of the set values of filtration time B and filtration time C is not greater than the set value of electrolysis time A. Filtration time B and filtration time C are controlled by electrolysis time A (controlled by the control module). Under filtration time B, the first filtration, collection, and dissolution tank performs copper powder filtration, while the second filtration, collection, and dissolution tank performs micro-etching post-treatment liquid self-circulation or circulation dissolution of copper powder. Under filtration time C, the second filtration, collection, and dissolution tank performs copper powder filtration, while the first filtration, collection, and dissolution tank performs micro-etching post-treatment liquid self-circulation or circulation dissolution of copper powder (when copper powder is present, the micro-etching post-treatment liquid circulates to dissolve copper powder; when copper powder is absent, the micro-etching post-treatment liquid self-circulates). During the electrolysis process of the electrolytic cell body 1, the first and second filtration, collection, and dissolution tanks work alternately.
[0045] For example, when the first set of filtration, collection, and dissolution tanks includes the first filtration, collection, and dissolution tank 301, and the second set of filtration, collection, and dissolution tanks includes the second filtration, collection, and dissolution tank 302, when the first filtration, collection, and dissolution tank 301 filters copper powder and the second filtration, collection, and dissolution tank 302 self-circulates or circulates to dissolve copper powder, electric ball valves one b1, two b2, seven b7, and eight b8 open simultaneously, and electric ball valves three b3, four b4, five b5, and six b6 close simultaneously. At the same time, the tank liquid filtration pump 8, the delivery pump body, the used liquid output pump 9, and the used liquid collection pump 10 are turned on, and the running time of each electric ball valve and each pump body is the filtration time B.
[0046] When adjusting the second filter collection and dissolution tank 302 to filter copper powder and the first filter collection and dissolution tank 301 to self-circulate or circulate to dissolve copper powder, shut down the used liquid output pump 9, and simultaneously open electric ball valves three b3, four b4, five b5 and six b6, and simultaneously close electric ball valve one b1, two b2, seven b7 and eight b8. Then turn on the used liquid output pump 9. The running time of each electric ball valve and each pump body is the filtration time C.
[0047] When the first set of filtration and collection dissolution tanks includes the first filtration and collection dissolution tank 301 and the third filtration and collection dissolution tank 303, and the second set of filtration and collection dissolution tanks includes the second filtration and collection dissolution tank 302, when the first filtration and collection dissolution tank 301 and the third filtration and collection dissolution tank 303 filter copper powder, and the second filtration and collection dissolution tank 302 self-circulates or circulates to dissolve copper powder, electric ball valves one b1, two b2, seven b7, eight b8, nine b9 and ten b10 open simultaneously, and electric ball valves three b3, four b4, five b5, six b6, eleven b11 and twelve b12 close simultaneously. At the same time, the tank liquid filtration pump 8, the delivery pump body, the used liquid output pump 9 and the used liquid collection pump 10 are turned on. The running time of each electric ball valve and each pump body is the filtration time B.
[0048] When adjusting the second filter collection and dissolution tank 302 to filter copper powder, and the first filter collection and dissolution tank 301 and the third filter collection and dissolution tank 303 to self-circulate or circulate to dissolve copper powder, shut down the used liquid output pump 9, and simultaneously open electric ball valves three b3, four b4, five b5, six b6, eleven b11 and twelve b12, and simultaneously close electric ball valves one b1, two b2, seven b7, eight b8, nine b9 and ten b10. Then turn on the used liquid output pump 9. The running time of each electric ball valve and each pump body is the filtration time C.
[0049] S2. Start the electrolytic cell body 1 to perform electrolysis, so that the electrolytic cell body 1 operates under the set electrolysis time A and current parameters; S3. Activate the filtration and dissolution structure 3. Use the first set of filtration and dissolution tanks for copper powder circulation filtration and collection, and use the second set of filtration and dissolution tanks for micro-etching post-treatment liquid circulation; alternatively, use the second set of filtration and dissolution tanks for copper powder circulation filtration and collection, and use the first set of filtration and dissolution tanks for micro-etching post-treatment liquid circulation; this process combines... Figure 1 Instructions: Simultaneously open electric ball valves b1, b2, b7, and b8, and close electric ball valves b3, b4, b5, and b6. Turn on the tank solution filtration pump 8 and the delivery pump in the first filtration collection and dissolution tank 301 (referred to as the first delivery pump) to circulate and filter copper powder in the first filtration collection and dissolution tank 301. Turn on the used liquid output pump 9, the used liquid collection pump 10, and the delivery pump in the second filtration collection and dissolution tank 302 (referred to as the second delivery pump) to circulate the micro-etching used liquid in the second filtration collection and dissolution tank 302. S4. When the filtration time B of the first set of filter collection and dissolution tanks reaches the set value, adjust the filter collection and dissolution structure to dissolve the copper powder collected in the first set of filter collection and dissolution tanks using the micro-etching post-treatment liquid, and return the micro-etching post-treatment liquid after dissolving the copper powder to the micro-etching post-treatment liquid storage tank 4; while the copper powder in the first set of filter collection and dissolution tanks is dissolving, the second set of filter collection and dissolution tanks is used for copper powder circulation filtration and collection; Reference Figure 1 This process includes: shutting off the used liquid output pump 9, simultaneously shutting off electric ball valves b1, b2, b7, and b8, and simultaneously opening electric ball valves b3, b4, b5, and b6, and then turning on the used liquid output pump 9; during this process, copper powder is filtered in the second filter collection and dissolution tank 302, and copper powder is dissolved in the first filter collection and dissolution tank 301; S5. When the filtration time C of the second set of filter collection and dissolution tanks reaches the set value, adjust the filter collection and dissolution structure to dissolve the copper powder collected in the second set of filter collection and dissolution tanks using the micro-etching post-treatment liquid, and return the micro-etching post-treatment liquid after dissolving the copper powder to the micro-etching post-treatment liquid storage tank 4; while the copper powder is dissolving in the second set of filter collection and dissolution tanks, the first set of filter collection and dissolution tanks is used for copper powder circulation filtration and collection; continue to refer to Figure 1 This process includes: shutting off the used liquid output pump 9, simultaneously opening electric ball valves one b1, two b2, seven b7 and eight b8 to circulate and filter copper powder in the first filter collection and dissolution tank 301, and simultaneously shutting off electric ball valves three b3, four b4, five b5 and six b6, and then turning on the used liquid output pump 9 to circulate and dissolve copper powder in the second filter collection and dissolution tank 302.
[0050] S6. Repeat S4 and S5 until the electrolysis time A of the main body of the electrolytic cell 1 reaches the set value.
[0051] The above description is merely a detailed illustration of specific embodiments of the present invention and is not intended to limit the invention. Various substitutions, modifications, and improvements made by those skilled in the art without departing from the principles and scope of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for maintaining an SPS electrolytic cell, characterized in that, The maintenance is carried out using an SPS electrolytic cell maintenance device, which includes an electrolytic cell body (1), an AC circulation auxiliary tank (2), a filtration and collection dissolution structure (3), a micro-etching post-liquid storage tank (4), and a production line collection cylinder (5). The electrolytic cell body (1) is equipped with a spray pipe (7). The filter collection and dissolution structure (3) includes two sets of filter collection and dissolution cylinders, each set including one or more filter collection and dissolution cylinders. Each filter collection and dissolution cylinder is connected to the main body of the electrolytic cell (1), the AC circulation auxiliary tank (2), the micro-etching liquid storage tank (4), and the production line collection cylinder (5), respectively. Electric ball valves are provided on the corresponding connecting pipelines. The SPS electrolytic cell maintenance method includes the following steps: S1. Set the electrolysis time A and current parameters of the main body of the electrolytic cell (1); S2. Start the main body of the electrolytic cell (1) to carry out electrolysis; S3. Start the filtration, collection and dissolution structure. Use the first set of filtration, collection and dissolution tanks to circulate and collect copper powder, and use the second set of filtration, collection and dissolution tanks to circulate the liquid after micro-etching. S4. When the filtration time B of the first set of filter collection and dissolution tanks reaches the set value, the filter collection and dissolution structure is adjusted, and the copper powder collected in the first set of filter collection and dissolution tanks is dissolved using the micro-etching post-liquid. The micro-etching post-liquid after dissolving the copper powder is returned to the micro-etching post-liquid storage tank (4). While the copper powder in the first set of filter collection and dissolution tanks is dissolved, the copper powder is circulated and collected using the second set of filter collection and dissolution tanks. S5. When the filtration time C of the second set of filter collection and dissolution tanks reaches the set value, adjust the filter collection and dissolution structure, use the micro-etching post-treatment liquid to dissolve the copper powder collected in the second set of filter collection and dissolution tanks, and return the micro-etching post-treatment liquid after dissolving the copper powder to the micro-etching post-treatment liquid storage tank (4); while the copper powder in the second set of filter collection and dissolution tanks is dissolved, the first set of filter collection and dissolution tanks is used to perform copper powder circulation filtration and collection. S6. Repeat S4 and S5 until the electrolysis time A of the main body of the electrolytic cell (1) reaches the set value.
2. The SPS electrolytic cell maintenance method according to claim 1, characterized in that, The first set of filtration, collection and dissolution tanks includes the first filtration, collection and dissolution tank (301), and the second set of filtration, collection and dissolution tanks includes the second filtration, collection and dissolution tank (302). The copper powder circulation filtration and collection process using the first set of filtration, collection and dissolution tanks includes: controlling the simultaneous opening of electric ball valves one (b1), two (b2), seven (b7) and eight (b8), controlling the simultaneous closing of electric ball valves three (b3), four (b4), five (b5) and six (b6), and simultaneously opening the tank liquid filtration pump (8), the delivery pump body, the used liquid output pump (9), and the used liquid collection pump (10). In the first filtration collection and dissolution tank (301), the electrolyte solution containing copper powder in the main body of the electrolytic cell (1) is filtered by the electrolyte filtration pump (8). The filtered solution is then fed into the AC circulation auxiliary tank (2) by the transfer pump and then returned to the main body of the electrolytic cell (1) by the electrolyte circulation pump (6). While filtering in the first filtration collection and dissolution tank (301), the micro-etching post-treatment liquid in the micro-etching post-treatment liquid storage tank (4) is fed into the second filtration collection and dissolution tank (302) through the post-treatment liquid output pump (9), and then fed into the production line collection tank (5) through the delivery pump body. The micro-etching post-treatment liquid in the production line collection tank (5) is fed into the micro-etching post-treatment liquid storage tank (4) through the post-treatment liquid collection pump (10).
3. The SPS electrolytic cell maintenance method according to claim 2, characterized in that, The S4 specifically includes: shutting off the used liquid output pump (9), simultaneously shutting off electric ball valve one (b1), electric ball valve two (b2), electric ball valve seven (b7) and electric ball valve eight (b8), and simultaneously opening electric ball valve three (b3), electric ball valve four (b4), electric ball valve five (b5) and electric ball valve six (b6), and then opening the used liquid output pump (9); In the first filter collection and dissolution tank (301), the micro-etching post-treatment liquid in the micro-etching post-treatment liquid storage tank (4) is introduced into the first filter collection and dissolution tank (301) through the post-treatment liquid output pump (9) to dissolve copper powder. After dissolving the copper powder, the micro-etching post-treatment liquid is then input into the production line collection tank (5) through the delivery pump body. The micro-etching post-treatment liquid in the production line collection tank (5) enters the micro-etching post-treatment liquid storage tank (4) through the post-treatment liquid collection pump (10). While copper powder is dissolved in the first filtration and collection dissolution tank (301), the electrolyte solution containing copper powder in the main body of the electrolytic cell (1) is filtered by the electrolyte filtration pump (8) and then the filtered solution is fed into the AC circulation auxiliary tank (2) by the transfer pump body and then returned to the main body of the electrolytic cell (1) by the electrolyte circulation pump (6).
4. The SPS electrolytic cell maintenance method according to claim 2 or 3, characterized in that, When the liquid level sensor in the AC circulation sub-tank (2) detects that the liquid in the AC circulation sub-tank (2) has reached the first preset liquid level, the liquid level sensor sends a signal to the tank liquid circulation pump (6), and the tank liquid circulation pump (6) starts to pump the liquid in the AC circulation sub-tank (2) into the electrolytic cell body (1); when the liquid level sensor detects that the liquid in the AC circulation sub-tank (2) has reached the second preset liquid level, the liquid level sensor sends a signal to the tank liquid circulation pump (6), and the tank liquid circulation pump (6) shuts down and stops supplying liquid to the electrolytic cell body (1), and the second preset liquid level value is lower than the first preset liquid level value.
5. The SPS electrolytic cell maintenance method according to claim 1, characterized in that, The filtration and collection dissolution tank is equipped with a conveying pump body and a filter screen or filter bag, which divides the filtration and collection dissolution tank into upper and lower parts.
6. The SPS electrolytic cell maintenance method according to claim 1, characterized in that, The electrolytic cell body (1) is provided with multiple cathode plates (101) and multiple anode frames (102) along its length. The cathode plates (101) and anode frames (102) are arranged in parallel and staggered. An anode plate (103) is provided in the anode frame (102). The electrolytic cell body (1) is also provided with a tank liquid collection port (100), which is located on the tank wall and / or the bottom of the electrolytic cell body (1).
7. The SPS electrolytic cell maintenance method according to claim 1, characterized in that, The injection pipeline (7) includes a bottom injection pipeline (71) and an electrode plate injection pipeline (72). The bottom injection pipeline (71) is a horizontal pipeline and is located at the bottom of the electrolytic cell body (1). The electrode plate injection pipeline (72) is connected to the bottom injection pipeline (71) and is arranged along the height direction of the cathode plate (101). The bottom injection pipeline (71) is connected to the injection inlet pipeline (70).
8. The SPS electrolytic cell maintenance method according to claim 6, characterized in that, The bottom spray pipe (71) includes a first horizontal pipe (711) and a second horizontal pipe (712). The first horizontal pipe (711) is arranged along the length of the electrolytic cell body (1), and the second horizontal pipe (712) is arranged along the width of the electrolytic cell body (1). The first horizontal pipe (711) is connected to the spray inlet pipe (70), and the second horizontal pipe (712) is connected to the first horizontal pipe (711). The second horizontal pipe (712) is also arranged between the cathode plate (101) and the anode frame (102). A plurality of first nozzles (713) are uniformly arranged along the length of the second horizontal pipe (712). The electrode spray pipe (72) includes a vertical pipe (720), which is vertically connected to the first horizontal pipe (711). Each first horizontal pipe (711) has at least two vertical pipes (720) in the length direction, and the vertical pipe (720) has multiple third nozzles (721) in the height direction.
9. The SPS electrolytic cell maintenance method according to claim 4, characterized in that, The filter collection and dissolution tank is also provided with a spray dissolution pipeline (11). The spray dissolution pipeline (11) is arranged around the filter collection and dissolution tank. The spray dissolution pipeline (11) is set above the filter screen (300). Multiple fifth nozzles (110) are evenly arranged around the spray dissolution pipeline (11). The micro-etching post-treatment liquid pumped by the post-treatment liquid output pump (9) is sprayed from the spray dissolution pipeline (11) at the top of the filter collection and dissolution tank to the filter screen through the fifth nozzles (110).
10. The SPS electrolytic cell maintenance method according to any one of claims 1 to 9, characterized in that, It also includes a control module, which is connected to the tank liquid filtration pump, the used liquid output pump, the used liquid collection pump, the tank liquid circulation pump, the electrolysis power supply, the electric ball valve, and the liquid level sensor.