A straight fin for a heat dissipation module and a heat dissipation module
Patent Information
- Application Number
- CN202611006909.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-07
- Publication Date
- 2026-08-07
AI Technical Summary
该种方式在一定程度上增加换热面积或强化扰动，但会显著增大流道阻力，导致风机风量衰减、功耗上升、噪声增大，甚至在翅片间形成气流死区，使得整体散热性能提升有限；而在另一种方式中，采用改变直翅片扰流结构的方式，例如采用波纹翅片、百叶窗翅片等形式，使得翅片加工工艺复杂、模具成本高、量产一致性差，且易积尘、抗振动能力弱，长期使用后同样会造成散热性能衰减明显，不符合笔记本低成本、高可靠、易维护的设计要求
[0016] Through the above technical solution, this disclosure provides a straight fin for a heat dissipation module and a heat dissipation module, wherein the straight fin has a vertical hole in the middle and rear section in the airflow direction. In this invention, the inlet section of the straight fin is not perforated, ensuring smooth airflow entry and a stable flow field, avoiding premature disturbance that leads to increased flow resistance. A single vertical hole is present in the middle and rear section of the straight fin, where the laminar boundary layer is thickest and heat transfer is weakest, and the outlet section of the straight fin is not open, ensuring smooth airflow exit after mixing, reducing wake loss and backflow interference, thereby improving heat dissipation performance.
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Figure CN122523889A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of equipment heat dissipation technology, and in particular to a straight fin for a heat dissipation module and a heat dissipation module. Background Technology
[0002] With the continuous improvement of computing power of domestically produced high-performance processors and FPGAs, power consumption density has increased dramatically, placing extremely high demands on overall system heat dissipation. In portable computing devices such as laptops, air cooling remains the mainstream cooling method due to its high reliability, simple maintenance, and strong environmental adaptability. However, with the compact internal space of these devices, conventional straight-fin cooling solutions are gradually encountering bottlenecks.
[0003] In related technologies, structural improvements are typically achieved by adding corrugated or raised turbulence structures. While this approach increases the heat exchange area or enhances turbulence to some extent, it significantly increases flow resistance, leading to reduced fan airflow, increased power consumption, increased noise, and even the formation of dead zones between the fins, resulting in limited improvement in overall heat dissipation performance. Another approach involves altering the straight fin turbulence structure, such as using corrugated or louvered fins. However, this results in complex fin manufacturing processes, high mold costs, poor mass production consistency, and a tendency to accumulate dust and weaken vibration resistance. Over long-term use, this also leads to a significant decline in heat dissipation performance, failing to meet the design requirements of low cost, high reliability, and easy maintenance for laptops.
[0004] Therefore, how to improve the heat dissipation performance by modifying the straight fin structure has become an urgent problem to be solved. Summary of the Invention
[0005] One of the technical problems this disclosure aims to solve is how to improve heat dissipation performance by modifying the straight fin structure.
[0006] To address the aforementioned technical problems, in a first aspect, the present invention provides a straight fin for a heat dissipation module, the straight fin having a first end adjacent to the air inlet position and a second end opposite to the first end. The straight fin has a vertical hole, and the distance between the vertical hole and the first end is greater than the distance between the vertical hole and the second end.
[0007] In conjunction with the first aspect, in one possible implementation of the first aspect, the distance between the edge of the vertical hole near the first end and the first end is 1 / 2 to 4 / 5 of the length of the straight fin.
[0008] In conjunction with the first aspect, in one possible implementation of the first aspect, the distance between the edge of the vertical hole near the first end and the first end of the straight fin is 2 / 3 of the length of the straight fin.
[0009] In conjunction with the first aspect, in one possible implementation of the first aspect, the vertical hole is centrally located along the width direction of the straight fin.
[0010] In conjunction with the first aspect, in one possible implementation of the first aspect, the first distance between the upper edge of the vertical hole and the top of the straight fin is the same as the second distance between the lower edge of the vertical hole and the bottom of the straight fin.
[0011] In conjunction with the first aspect, in one possible implementation of the first aspect, the ratio of the length to the width of the vertical hole is greater than 2.
[0012] In conjunction with the first aspect, in one possible implementation of the first aspect, the ratio of the length to the width of the vertical hole is in the range of 2.5 to 3.5.
[0013] In a first aspect, the present invention provides a heat dissipation module, the heat dissipation module comprising: a substrate, a fin array composed of a plurality of straight fins for a heat dissipation module as described in the first aspect or any corresponding embodiment, and a fan, wherein the fin array is disposed on the substrate, and the air inlet position of the fin array is connected to the fan.
[0014] In conjunction with the first aspect, in one possible implementation of the first aspect, a plurality of straight fins for the heat dissipation module as described in the first aspect or any corresponding embodiment are evenly distributed on the fin array.
[0015] In conjunction with the first aspect, in one possible implementation of the first aspect, the heat dissipation module further includes: a heat pipe and a boss, wherein the heat pipe is connected to the fin array and the boss respectively, and is connected to the chip to be cooled through the boss.
[0016] Through the above technical solution, this disclosure provides a straight fin for a heat dissipation module and a heat dissipation module, wherein the straight fin has a vertical hole in the middle and rear section in the airflow direction. In this invention, the inlet section of the straight fin is not perforated, ensuring smooth airflow entry and a stable flow field, avoiding premature disturbance that leads to increased flow resistance. A single vertical hole is present in the middle and rear section of the straight fin, where the laminar boundary layer is thickest and heat transfer is weakest, and the outlet section of the straight fin is not open, ensuring smooth airflow exit after mixing, reducing wake loss and backflow interference, thereby improving heat dissipation performance. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of a straight fin for a heat dissipation module disclosed in an embodiment of this disclosure; Figure 2 This is a schematic diagram of the flow field vortex in the vertical hole region disclosed in this embodiment; Figure 3 This is a schematic diagram of the flow field vortex in the vertical hole region under the cross-sectional view disclosed in this embodiment; Figure 4 This is a schematic diagram comparing the temperature of straight fins for a heat dissipation module disclosed in this embodiment with that of conventional straight fins; Figure 5 This is a schematic diagram of the structure of a heat dissipation module disclosed in an embodiment of this disclosure; Figure 6 This is a schematic diagram of the structure of another heat dissipation module disclosed in this embodiment.
[0019] Explanation of reference numerals in the attached figures: 1-Fin array; 2-Fan; 3-Heat pipe; 4-Boss; 6-Straight fins for heat dissipation module; 7-Substrate; 8-Vertical hole; 10-First end; 20-Second end. Detailed Implementation
[0020] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0021] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values set forth in these embodiments should be interpreted as exemplary only and not as limiting.
[0022] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0023] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.
[0024] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.
[0025] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.
[0026] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.
[0027] like Figure 1 As shown, the present invention discloses a straight fin for a heat dissipation module. The straight fin 6 has a first end 10 near the air inlet position and a second end 20 opposite to the first end 10. The straight fin 6 has a vertical hole 8, and the distance between the vertical hole 8 and the first end 10 is greater than the distance between the vertical hole 8 and the second end (20).
[0028] Specifically, after the cooling airflow enters the straight fin 6 channel, it flows smoothly in the inlet section, where the laminar boundary layer gradually thickens and heat transfer weakens. Upon entering the middle section, due to the pressure difference and abrupt spatial change inside and outside the vertical holes 8, a stable longitudinal vortex forms within the holes. This vortex impacts the hole walls and diffuses downstream, strongly mixing with the mainstream flow, transforming laminar flow into turbulent flow. This effectively interrupts and thins the thermal boundary layer, significantly improving the convective heat transfer coefficient. The airflow then flows smoothly out of the outlet section, reducing wake losses. Simultaneously, the vertical holes 8 do not intrude into the mainstream channel, maintaining a relatively constant overall flow resistance, achieving a balance between high-efficiency heat transfer and low flow resistance. Furthermore, this method only requires longitudinal holes in the rear section of the conventional straight fin, which can be achieved through processes such as stamping, laser cutting, and etching.
[0029] Through the above technical solution, this disclosure provides a straight fin for a heat dissipation module and a heat dissipation module, wherein the middle and rear section of the straight fin has a vertical hole. In the solution of this invention, the inlet section of the straight fin near the first end 10 is not perforated, ensuring smooth airflow entry and a stable flow field, and avoiding premature disturbance that leads to an increase in flow resistance. A single vertical hole is provided in the middle and rear section of the straight fin near the second end 20, where the laminar boundary layer is thickest and heat transfer is weakest, and the outlet section of the straight fin is not open, ensuring smooth airflow exit after mixing, reducing wake loss and backflow interference, thereby improving heat dissipation performance.
[0030] In some alternative embodiments, the distance between the edge of the vertical hole 8 near the first end 10 and the first end 10 is 1 / 2 to 4 / 5 of the length of the straight fin 6.
[0031] Specifically, when the vertical hole 8 is located within the region of 1 / 2 to 4 / 5 of the length of the straight fin 6, the vertical hole 8 is positioned in the middle to rear section of the straight fin 6, such as... Figure 1 As shown, the length of the straight fin 6 is L1, the width is H1, the length of the vertical hole 8 is H3, the width is L3, the first distance between the upper edge of the vertical hole 8 and the top of the straight fin 6 is H4, the second distance between the lower edge of the vertical hole 8 and the bottom of the straight fin 6 is H2, and the distance between the edge of the vertical hole 8 near the air inlet and the edge of the straight fin 6 near the air inlet is L2. In this embodiment, L2∈(1 / 2L1, 4 / 5L1), thereby ensuring that there are no holes in the inlet and outlet sections of the straight fin 6, and that there is a unique vertical hole in the middle and rear section where the laminar boundary layer of the straight fin 6 is thickest and the heat transfer is weakest.
[0032] In some alternative embodiments, the distance between the edge of the vertical hole 8 near the first end 10 and the first end 10 of the straight fin 6 is 2 / 3 of the length of the straight fin.
[0033] Specifically, using the same example as described above, in this case, L2 = 2 / 3L1, thus achieving the optimal disturbance position. For example... Figure 2 , Figure 3As shown, the eddy current of the vertical hole 8 flow field is schematically shown, where Figure 3 is a sectional view, and the red circle area in the figure corresponds to the eddy current of the flow field where the vertical hole 8 is located.
[0034] In some alternative embodiments, the vertical hole 8 is centrally arranged along the width direction of the straight fin 6.
[0035] Specifically, taking the above embodiment as an example, the vertical hole 8 is centrally arranged along the H1 direction of the straight fin 6.
[0036] In some alternative embodiments, the first distance between the upper edge of the vertical hole 8 and the top end of the straight fin 6 is the same as the second distance between the lower edge of the vertical hole 8 and the bottom end of the straight fin 6.
[0037] Specifically, taking the above embodiment as an example, H2 = H4.
[0038] In some alternative embodiments, the ratio of the length to the width of the vertical hole 8 is greater than 2.
[0039] Specifically, taking the above embodiment as an example, H3 is greater than 2L3.
[0040] In some alternative embodiments, the ratio of the length to the width of the vertical hole 8 is within the range of 2.5 to 3.5.
[0041] Specifically, taking the above embodiment as an example, 2.5 < H3 / L3 < 3.5. When the ratio is less than 2.5, it is difficult to stably form an eddy current, resulting in weak disturbance and limited heat transfer improvement. When the ratio is greater than 3.5, the eddy current intensity is too large and invades the mainstream, leading to a significant increase in flow resistance.
[0042] As < Figure 5 The red area represents a fin 6 with vertical holes. Multiple fins 6 with vertical holes are evenly distributed on the substrate 7. Figure 5 The arrows in the diagram indicate the direction of air intake.
[0046] In some alternative embodiments, such as Figure 6 As shown, the heat dissipation module further includes: a heat pipe 3 and a boss 4, wherein, The heat pipe 3 is connected to the fin array 1 and the boss 4 respectively, and is connected to the chip to be cooled through the boss 4.
[0047] Specifically, heat pipe 3 is used to absorb heat to transfer the heat from the chip to be cooled to the fin array 1.
[0048] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.
[0049] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.
Claims
1. A straight fin for a heat dissipation module, characterized in that, The straight fin (6) has a first end (10) near the air inlet position and a second end (20) opposite to the first end (10). The straight fin (6) has a vertical hole (8) and the distance between the vertical hole (8) and the first end (10) is greater than the distance between the vertical hole (8) and the second end (20).
2. The straight fin according to claim 1, characterized in that, The distance between the edge of the vertical hole (8) near the first end (10) and the first end (10) is 1 / 2 to 4 / 5 of the length of the straight fin (6).
3. The straight fin according to claim 2, characterized in that, The distance between the edge of the vertical hole (8) near the first end (10) and the first end (10) of the straight fin (6) is 2 / 3 of the length of the straight fin.
4. The straight fin according to claim 1, characterized in that, The vertical hole (8) is centered along the width direction of the straight fin (6).
5. The straight fin according to claim 4, characterized in that, The first distance between the upper edge of the vertical hole (8) and the top of the straight fin (6) is the same as the second distance between the lower edge of the vertical hole (8) and the bottom of the straight fin (6).
6. The straight fin according to claim 1, characterized in that, The ratio of the length to the width of the vertical hole (8) is greater than 2.
7. The straight fin according to claim 6, characterized in that, The ratio of the length to the width of the vertical hole (8) is in the range of 2.5 to 3.
5.
8. A heat dissipation module, characterized in that, The heat dissipation module includes: a substrate (7), a fin array (1) composed of a plurality of straight fins (6) for the heat dissipation module as described in any one of claims 1 to 7, and a fan (2), wherein, The fin array (1) shown is disposed on the substrate (7), and the air inlet position of the fin array (1) is connected to the fan (2).
9. The heat dissipation module according to claim 8, characterized in that, The fins (6) are evenly distributed on the fin array (1).
10. The heat dissipation module according to claim 8, characterized in that, The heat dissipation module further includes: a heat pipe (3) and a boss (4), wherein, The heat pipe (3) is connected to the fin array (1) and the boss (4) respectively, and is connected to the chip to be cooled through the boss (4).