An embedded chip integrated PCB

Abstract

This invention relates to the field of printed circuit board manufacturing technology, and provides an integrated PCB with embedded chips, comprising: a PCB board with a groove for placing the chip; a cover plate for fixing the chip in the groove on the PCB; a first clamping assembly for electrically connecting the chip to the PCB board; and a second clamping assembly for clamping the chip. When the cover plate fixes the chip to the groove, the cover plate first drives the first clamping assembly to electrically connect the chip to the PCB board, and then drives the second clamping assembly to clamp the chip. This application reduces the difficulty of electrical connection and stable fixation between the chip and the PCB board by placing the chip in the groove of the PCB board and then clamping different positions of the chip sequentially by the first and second clamping assemblies. Furthermore, by placing the chip in the groove, i.e., embedding the chip within the PCB board, the chip does not protrude from the PCB board, reducing space occupation.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and more specifically to an integrated PCB with embedded chips. Background Technology

[0002] PCB, also known as printed circuit board, is an indispensable core component in electronic systems, carrying the key connections of various electronic components.

[0003] In the current PCB manufacturing process, chips are usually mounted on the surface of the circuit board by soldering or plugging. The installation and soldering require high precision. They also protrude from the PCB surface, taking up space. In addition, chips usually need to dissipate heat, so heat sinks are required, which further takes up space. This is not conducive to the use of small internal devices such as mobile phones and watches. Summary of the Invention

[0004] In view of the difficulties in installation and insufficient space occupied by existing technologies, the purpose of this invention is to provide an integrated PCB with embedded chips that is easy to install and does not occupy space.

[0005] To address the above problems, the present invention provides the following technical solution: This application provides an integrated PCB with an embedded chip, comprising: A PCB board, wherein the PCB board has grooves for placing chips; A cover plate is used to secure the chip within the groove on the PCB. A first clamping component is used to electrically connect the chip to the PCB board; The second clamping component is used to clamp the chip; Specifically, when the cover plate fixes the chip to the groove, the cover plate can first drive the first pressing component to electrically connect the chip to the PCB board, and then drive the second pressing component to press the chip.

[0006] The beneficial effects of the present invention are: by placing the chip in the groove of the PCB board, and then pressing the chip at different positions by the first pressing component and the second pressing component in turn, the difficulty of electrical connection and stable fixation between the chip and the PCB board is reduced, and the chip is placed in the groove, that is, embedded in the PCB board, so that the chip does not protrude from the PCB board, thus reducing the space occupied. Attached Figure Description

[0007] Figure 1 This is a perspective view of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle; Figure 4 This is a perspective view of the first and second clamping components of the present invention placed inside the cover plate; Figure 5 This is a perspective view of the cover plate of the present invention; Figure 6 This is the second clamping component of the present invention.

[0008] Figure label: 10. PCB board; 20. Cover plate; 30. First clamping assembly; 40. Second clamping assembly; 50. Chip; 60. First heat conduction strip; 70. Second heat conduction strip; 80. Heat sink; 11. Groove; 12. Relief groove; 31. First clamping element; 311. First pressure plate; 312. First flexible element; 313. Pressing element; 32. First elastic element; 41. Second clamping element; 411. Second flexible element; 412. Second pressure plate; 42. Second elastic element. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0010] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "multiple" means two or more, unless otherwise explicitly specified.

[0011] For ease of description of the first, second, and third directions in the embodiments of this application, the first direction is the left-right direction in the figures, the second direction is the front-back direction in the figures, and the third direction is the up-down direction in the figures. The x-axis arrow direction is referred to as the "right" direction, the y-axis arrow direction as the "up" direction, and the z-axis arrow direction as the "back" direction, but these are not the sole limitations in the actual application of this application.

[0012] like Figures 1-4As shown, this embodiment provides an integrated PCB with an embedded chip, which includes a PCB board 10, a cover plate 20, a first pressing component 30, and a second pressing component 40. The PCB board 10 has a groove 11 for placing a chip 50. The cover plate 20 is used to fix the chip 50 in the groove 11 on the PCB. By fixing the chip 50 in the groove 11 of the PCB board 10, the space occupied by the chip 50 is reduced. The first pressing component 30 is used to electrically connect the chip 50 to the PCB board 10. The second pressing component 40 is used to press the chip 50. When the cover plate 20 fixes the chip 50 to the groove 11, the cover plate 20 can first drive the first pressing component 30 to electrically connect the chip 50 to the PCB board 10, and then drive the second pressing component 40 to press the chip 50. By employing the sequential arrangement of the first clamping component 30 and the second clamping component 40, the electrical connection between the chip 50 and the PCB board 10 is ensured first, and then the chip 50 is prevented from moving, thereby guaranteeing the stability of the chip 50 during use and preventing open circuits due to movement or shaking. Furthermore, the coordinated use of the cover plate 20, the first clamping component 30, and the second clamping component 40 allows for easy replacement of the chip 50 by simply opening the cover plate 20 if a problem occurs, reducing the difficulty of soldering and replacement.

[0013] like Figure 2 As shown, optionally, the groove 11 is provided with a relief groove 12 on its periphery for placing the corresponding pin of the chip, which can accurately position each pin, prevent misplacement, and make alignment more convenient.

[0014] like Figures 2-4 As shown, optionally, the first clamping assembly 30 includes a first clamping member 31 and a first elastic member 32. The first clamping member 31 is disposed inside the cover plate 20, and the first clamping member 31 can tightly press the pins of the chip 50 onto the corresponding positions on the PCB board 10. The first elastic member 32 can always apply a force to the first clamping member 31, so that the pins of the chip 50 do not detach from the corresponding positions on the PCB board 10. By using the first elastic member 32 to press the first clamping member 31, thereby preventing the pins of the chip 50 from detaching from the corresponding positions on the PCB board 10, it can prevent loosening of the direct clamping state due to vibration or shaking; that is, the first elastic member 32 can make up for the gap caused by loosening, and can prevent the problem of poor contact caused by loosening during later use.

[0015] like Figure 2 As shown, optionally, there are two or more first elastic elements 32. The multiple first elastic elements 32 are evenly arranged on the first pressing element 31. The evenly arranged first elastic elements 32 can provide a stable thrust to the first pressing element 31, preventing the first pressing element 31 from failing to press the pins of the chip 50 due to uneven force on the periphery.

[0016] Preferably, the number of the first elastic elements 32 is four or eight.

[0017] Preferably, the first elastic element 32 is a spring.

[0018] like Figures 2-4 As shown, optionally, the first clamping member 31 includes a first pressure plate 311, a first flexible member 312, and a clamping member 313; the first flexible member 312 is located between the first pressure plate 311 and the clamping member 313; the clamping member 313 is used to contact the pins of the chip 50, and the first elastic member 32 is located on the side of the first pressure plate 311 away from the clamping member 313. There is one first pressure plate 311 and one first flexible member 312, and multiple clamping members 313 corresponding to each pin of the chip 50. By using the first flexible member 312 located between the first pressure plate 311 and the clamping member 313, it can ensure that the first elastic member 32 can provide a stable pushing force to the first pressure plate 311, and also ensure stable clamping of the pins of the chip 50; at the same time, the first flexible member 312 can ensure that the corresponding clamping member 313 clamps the corresponding pin, which can avoid the problem of not being able to clamp all pins due to pin deformation or size differences of the clamping member 313.

[0019] Preferably, the first flexible component 312 is made of high-temperature resistant rubber.

[0020] Optionally, the first clamping member 31 and the first flexible member 312 are rectangular frames.

[0021] Optionally, the pressure component 313 is made of insulating material.

[0022] Preferably, the material of the pressure component 313 is insulating ceramic.

[0023] like Figure 2 , Figure 4 and Figure 6 As shown, optionally, the second clamping assembly 40 includes a second clamping member 41 and a second elastic member 42. The second clamping member 41 is disposed inside the cover plate 20, and the second clamping member 41 can press the chip 50 into the groove 11 on the PCB board 10. The second elastic member 42 can always apply a force to the second clamping member 41, so that the chip 50 remains in the groove 11 on the PCB board 10 without moving. By using the second elastic member 42 to press the second clamping member 41 and thus the chip 50, it can prevent the direct clamping state from loosening due to vibration or shaking; that is, the second elastic member 42 can make up for the gap caused by loosening, and can prevent the chip 50 from shifting due to loosening during later use.

[0024] like Figure 2 As shown, optionally, there are two or more second elastic elements 42. The multiple second elastic elements 42 are evenly arranged on the second pressing element 41. The evenly arranged second elastic elements 42 can provide a stable thrust to the second pressing element 41, preventing the second pressing element 41 from getting stuck and unable to move due to uneven force on the periphery.

[0025] Preferably, the number of the second elastic elements 42 is four or eight.

[0026] Preferably, the second elastic element 42 is a spring.

[0027] like Figure 2 , Figure 4 and Figure 6 As shown, optionally, the second clamping member 41 includes a second flexible member 411 and a second pressure plate 412; the second flexible member 411 is used for flexible contact with the chip 50; the second pressure plate 412 is disposed on the side of the second flexible member 411 away from the chip 50. By using the second flexible member 411 for flexible contact with the chip 50, it is possible to ensure that the chip 50 is clamped while preventing damage to the chip 50 from hard compression, thereby ensuring the normal use of the chip 50.

[0028] Optionally, the second flexible component 411 is made of an insulating and thermally conductive material, and the second pressure plate 412 is made of a thermally conductive material.

[0029] Preferably, the second flexible element 411 is a silicone thermal conductive sheet.

[0030] Optionally, the second pressure plate 412 is made of a metal thermally conductive material.

[0031] Preferably, the second pressure plate 412 is a thermally conductive material, such as copper, aluminum, or their alloys.

[0032] Optionally, the second pressure plate 412 is made of a non-metallic thermally conductive material.

[0033] Preferably, the second pressure plate 412 is made of a thermally conductive material such as a graphene thermally conductive ceramic sheet.

[0034] like Figure 2 and Figure 5 As shown, optionally, a first heat-conducting strip 60 and a second heat-conducting strip 70 are also included; the first heat-conducting strip 60 is disposed on the side of the second pressing member 41 away from the chip 50; the second heat-conducting strip 70 is disposed on the inner side of the cover plate 20; the first heat-conducting strip 60 and the second heat-conducting strip 70 are staggered, and the first heat-conducting strip 60 and the second heat-conducting strip 70 are always in contact but not fixed. By adopting the principle that the first heat-conducting strip 60 and the second heat-conducting strip 70 are always in contact but not fixed, it is possible to ensure that while the second elastic member 42 elastically compresses the chip 50 through the second pressing assembly 40, the heat generated by the chip 50 during operation can be transferred away in a timely manner, ensuring the stable operation of the chip 50.

[0035] Optionally, the cover plate 20 is made of a thermally conductive material.

[0036] like Figures 1-2As shown, optionally, a heat sink 80 is also included, which is located on the side of the cover plate 20 away from the chip 50. The heat sink can dissipate the heat dissipated by the chip 50 into the air in a timely manner, preventing the heat generated by the chip 50 from accumulating in the chip 50 and failing to dissipate in time, thus preventing the heat-conducting chip 50 from burning out.

[0037] Preferably, the heat sink is a heat sink fin.

[0038] Preferably, the heat sink is a cooling fan.

[0039] like Figure 2 and Figure 4 As shown in the first embodiment, the first elastic member 32 is located between the first pressing member 31 and the second pressing member 41, and the second elastic member 42 is located between the cover plate 20 and the second pressing member 41. The elastic force of the first elastic member 32 is less than that of the second elastic member 42. This ensures that the second elastic member 42 can press the chip 50 through the second pressing member 41 while the first elastic member 32 presses the pin of the chip 50. This ensures that the chip 50 is in electrical contact with the PCB board 10 while preventing the chip 50 from moving.

[0040] In a specific embodiment 2 (not shown in the figure), the first elastic member 32 is located between the cover plate 20 and the first pressing member 31, and the second elastic member 42 is located between the cover plate 20 and the second pressing member 41. The first elastic member 32 presses the pins of the chip 50 through the first pressing member 31 to prevent poor contact between the chip 50 and the PCB board 10. The second elastic member 42 can press the chip 50 through the second pressing member 41 to prevent the chip 50 from moving.

[0041] Optionally, the cover plate 20 is fixed to the PCB board 10 with bolts (not shown in the figure). This ensures a stable fixation between the chip 50 and the PCB board 10, allowing the chip 50 to be packaged in advance, saving the tedious soldering process later.

[0042] In summary, the present invention provides an integrated PCB with an embedded chip. By placing the chip in a groove in the PCB board and then pressing the chip at different positions by the first and second pressing components, the difficulty of electrical connection and stable fixation between the chip and the PCB board is reduced. Furthermore, the chip is placed in the groove, which means that the chip is embedded in the PCB board, so that the chip does not protrude from the PCB board and the space occupied is reduced.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An integrated PCB with embedded chip, characterized in that, include: A PCB board, wherein the PCB board has grooves for placing chips; A cover plate is used to secure the chip within the groove on the PCB. A first clamping component is used to electrically connect the chip to the PCB board; The second clamping component is used to clamp the chip; Specifically, when the cover plate fixes the chip to the groove, the cover plate can first drive the first pressing component to electrically connect the chip to the PCB board, and then drive the second pressing component to press the chip.

2. The integrated PCB with embedded chip according to claim 1, characterized in that: The first clamping assembly includes a first clamping element and a first elastic element; The first clamping member is disposed inside the cover plate, and the first clamping member can tightly press the chip pins at the corresponding positions on the PCB board; The first elastic element can always apply a force to the first clamping element, so that the chip pins do not disengage from the corresponding positions on the PCB board.

3. The integrated PCB with embedded chip according to claim 2, characterized in that: The first clamping component includes a first pressure plate, a first flexible component, and a pressing component; The first flexible member is located between the first pressure plate and the pressure member; The pressure member is used to contact the pins of the chip, and the first elastic member is located on the side of the first pressure plate away from the pressure member.

4. The integrated PCB with embedded chip according to claim 3, characterized in that: The pressure component is made of insulating material.

5. The integrated PCB with embedded chip according to claim 1, characterized in that: The second clamping assembly includes a second clamping element and a second elastic element; The second clamping member is disposed inside the cover plate, and the second clamping member can press the chip into the groove on the PCB board; The second elastic element can always apply a force to the second clamping element, so that the chip remains in the groove on the PCB board and does not move.

6. The integrated PCB with embedded chip according to claim 5, characterized in that: The second clamping element includes a second flexible element and a second pressure plate; The second flexible component is used to make flexible contact with the chip; The second pressure plate is located on the side of the second flexible member away from the chip.

7. The integrated PCB with embedded chips according to claim 6, characterized in that: The second flexible component is made of an insulating and thermally conductive material, and the second pressure plate is also made of an insulating and thermally conductive material.

8. The integrated PCB with embedded chip according to claim 7, characterized in that: It also includes a first heat-conducting strip and a second heat-conducting strip; The first heat-conducting strip is located on the side of the second clamping member away from the chip; The second heat-conducting strip is located on the inner side of the cover plate; The first and second heat-conducting strips are arranged in a staggered manner, and the first and second heat-conducting strips are always in contact but not fixed.

9. The integrated PCB with embedded chip according to claim 1, characterized in that: The cover plate is made of a thermally conductive material.

10. The integrated PCB with embedded chip according to claim 1, characterized in that: It also includes a heat sink, which is located on the side of the cover plate away from the chip.

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