PCB soldering machine

Abstract

This invention discloses a PCB board soldering machine, belonging to the technical field of soldering machines. It includes a frame, a Y-axis moving assembly, an X-axis moving assembly, and a soldering mechanism. The Y-axis moving assembly is mounted on the frame and drives a vacuum suction plate holding the PCB board. The X-axis moving assembly is located on top of the frame and drives a moving frame thereon. The soldering mechanism is mounted on the frame and used to solder components on the PCB board. The independent X and Y-axis moving assemblies of this invention precisely drive the longitudinal movement of the PCB along the Y-axis and drive the lateral movement of the soldering mechanism along the X-axis, achieving high-precision planar positioning of the solder joints. A cylinder drives the mounting frame to make small-amplitude adjustments to the solder gun, ensuring precise alignment of the nozzle with the solder joint and improving the quality of precision solder joints. The solder feeding assembly features a double-wheel pressure clamping structure, with a tension spring providing constant pressure to adhere to the solder wire, preventing slippage and jamming. A rod, in conjunction with a limiting groove, constrains the swing amplitude of the oscillating plate, ensuring stable pressure and speed, precise solder feeding, and reducing defects such as insufficient solder accumulation and leakage, making it suitable for long-term continuous automated soldering.

Description

Technical Field

[0001] This invention relates to the technical field of soldering machines, and more specifically to a PCB board soldering machine. Background Technology

[0002] PCB boards are the core foundation of various electronic devices, and the soldering quality of the components on their surface directly determines the operational stability, lifespan, and performance of electronic products. With the continuous iteration and upgrading of electronic technology, electronic products are rapidly developing towards miniaturization, thinning, and precision. Correspondingly, PCB board structures are gradually exhibiting characteristics such as thinner boards, denser solder joints, irregularly shaped pad layouts, and diverse solder joint tilts. This places increasingly stringent requirements on PCB soldering equipment.

[0003] Currently, traditional automatic PCB soldering machines on the market still have many technical defects in actual production applications, making it difficult to adapt to the current soldering production needs of PCBs. The XY axis moving transmission structure of existing soldering machines is rudimentary, mostly using single screw drive or simple belt drive, resulting in poor transmission stability and low positioning accuracy. After long-term operation, transmission gaps and displacement deviations are prone to occur, making it impossible to achieve precise alignment of solder joints and meet the needs of continuous soldering operations with high density and small spacing precision solder joints.

[0004] In addition, conventional soldering machines have a simple solder feeding mechanism with uncontrollable solder wire clamping pressure and no constant pressure limiting structure. During the solder wire feeding process, problems such as slippage, deviation, and jamming are very likely to occur, resulting in uneven solder feeding and frequent problems such as solder piling, insufficient solder, and solder leakage, which seriously affect the stability of soldering quality. Furthermore, the solder feeding structure has no amplitude limiting function, which easily leads to over-feeding or under-feeding of solder, and cannot meet the feeding requirements of precision soldering. Summary of the Invention

[0005] The purpose of this invention is to provide a PCB board soldering machine to overcome the above-mentioned defects in the prior art.

[0006] A PCB board soldering machine includes a frame, a Y-axis moving component, an X-axis moving component, and a soldering mechanism. The Y-axis moving component is mounted on the frame and is used to drive a vacuum suction plate that holds the PCB board. The X-axis moving component is mounted on the top of the frame and is used to drive a moving frame thereon. The soldering mechanism is mounted on the frame and includes a lifting assembly, a solder gun, and a solder feeding assembly. The lifting assembly is mounted on a movable frame and is used to drive the lifting plate on it to move up and down. The lifting plate is provided with a fine-tuning assembly for adjusting the solder gun. The solder feeding assembly includes a solder feeding head, a motor, a swing plate, and a tension spring. A fixed plate connected to the mounting bracket of the fine-tuning assembly is mounted on the solder gun. The side of the fixed plate is provided with a solder feeding head. The motor is mounted on the fixed frame on the side of the movable frame and its output shaft is provided with a solder feeding wheel. One end of the swing plate is hinged to the fixed frame by a pin, and the other end of the swing plate is provided with a rod inserted into the upper limit slot of the fixed frame. A second solder feeding wheel is rotatably connected to the swing plate. One end of the tension spring is connected to the swing plate, and the other end of the tension spring is connected to the fixed frame. A solder tray is rotatably connected to the top of the fixed frame. Solder wire is wound on the solder tray, passing between the first and second solder feeding wheels and the solder feeding head.

[0007] Furthermore, the Y-axis moving assembly includes a slide block and a motor. The bottom of the vacuum suction plate is slidably connected to a slide rail on a fixed seat inside the frame via the slide block. The motor is mounted on the bottom of the fixed seat and a synchronous pulley is mounted on its output shaft. A synchronous pulley is rotatably connected to the fixed seat. The synchronous pulley and the synchronous pulley are connected by a synchronous belt. The slide block is connected to the synchronous belt.

[0008] Furthermore, the X-axis moving assembly includes a slide block two and a motor two. The side of the moving frame is slidably connected to a slide rail two on a fixed plate inside the frame via the slide block two. The motor two is mounted on the fixed plate and a synchronous pulley three is mounted on its output shaft. A synchronous pulley four is rotatably connected to the fixed plate. The synchronous pulley three and the synchronous pulley four are connected by a synchronous belt two. The slide block two is connected to the synchronous belt two.

[0009] Furthermore, the fine-tuning component includes an arc plate, a mounting plate, and a cylinder. The lower end of the lifting plate is slidably connected to the arc plate, and the arc plate is detachably connected to the lifting plate. The end of the arc plate is provided with a mounting plate, and the mounting plate is provided with a cylinder. The piston rod of the cylinder is provided with a mounting bracket, and the mounting bracket is slidably connected to the mounting plate through a slide rail. The solder gun is connected to the mounting bracket through a fixing clamp.

[0010] Furthermore, the lifting assembly includes a drive screw, a third motor, and a movable seat. The two ends of the drive screw are rotatably connected to the movable frame. The third motor is installed in the movable frame and its output shaft is connected to one end of the drive screw. The movable seat is screwed to the drive screw through a screw nut and slidably connected to the slide rail four in the movable frame.

[0011] Furthermore, the upper and lower guide tubes are symmetrically arranged on the upper and lower sides of the fixing frame. A feeding tube is provided between the lower guide tube and the solder feeding head. The solder wire wound on the solder tray passes through the upper guide tube, between the first and second solder feeding wheels, the lower guide tube, the feeding tube and the solder feeding head.

[0012] Furthermore, a fixing rod is provided on the side of the fixing plate, and a support rod is bolted to the lower end of the fixing rod, with the soldering head located on the support rod.

[0013] Furthermore, the arc-shaped plate is provided with an arc-shaped groove, and the arc-shaped plate is connected to the lifting plate by bolts inserted into the arc-shaped groove.

[0014] Furthermore, the bottom of the slide block is provided with two clamping plates, which are connected to the timing belt by bolts.

[0015] Furthermore, the second synchronous belt is provided with a second clamping plate, which is connected to the second slide block by bolts.

[0016] The beneficial effects achieved by this invention are as follows: 1. This invention features independent Y-axis and X-axis moving components. The Y-axis can precisely drive the longitudinal displacement of the PCB board, while the X-axis can drive the lateral displacement of the soldering mechanism as a whole. The dual-axis linkage enables high-precision planar alignment of any solder point on the PCB board. Simultaneously, the mounting bracket is driven by a cylinder to slide slightly along the slide rail, which drives the soldering gun to complete fine-tuning. This effectively offsets the mechanical displacement errors caused by the XY-axis transmission and lifting transmission, ensuring that the soldering gun nozzle is accurately aligned with the point to be soldered. This completely solves the problems of large soldering point deviation and poor consistency in traditional equipment, and greatly improves the soldering quality of precision solder points.

[0017] 2. The solder feeding assembly of this invention adopts a dual solder feeding wheel clamping structure, which, together with a tension spring, continuously provides elastic clamping force, ensuring that the second solder feeding wheel is always in close contact with the solder wire. This achieves constant pressure clamping and feeding, completely eliminating slippage, deviation, and jamming problems during solder wire feeding. Simultaneously, the end rod of the swing plate cooperates with the limiting groove of the fixed frame to limit the swing amplitude of the swing plate, ensuring constant solder feeding pressure, uniform solder feeding speed, and precise control of the solder feeding amount. This effectively avoids solder pile-up, insufficient solder, and solder leakage, ensuring consistent and stable soldering quality throughout the entire process, and is suitable for long-term continuous automated soldering operations. Attached Figure Description

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure of the Y-axis moving component of the present invention.

[0020] Figure 3This is a schematic diagram of the rear structure of the X-axis moving component of the present invention.

[0021] Figure 4 This is a schematic diagram of the front structure of the X-axis moving component of the present invention.

[0022] Figure 5 This is a schematic diagram of the front structure of the soldering mechanism of the present invention.

[0023] Figure 6 This is a schematic diagram of the rear structure of the soldering mechanism of the present invention.

[0024] The reference numerals in the attached diagrams are explained as follows: 1. Frame; 2. Y-axis moving assembly; 21. Vacuum suction plate; 22. Slide 1; 23. Fixed base; 24. Motor 1; 241. Synchronous pulley 1; 25. Synchronous pulley 2; 26. Synchronous belt 1; 27. Clamping plate 1; 3. X-axis moving assembly; 31. Moving frame; 311. Slide 2; 32. Fixed plate; 33. Motor 2; 34. Synchronous pulley 3; 35. Synchronous pulley 4; 36. Synchronous belt 2; 37. Clamping plate 2; 4. Soldering mechanism; 41. Lifting assembly; 411. Drive screw; 412. Motor 3; 413. Moving... 42. Moving base; 43. Lifting plate; 44. Arc plate; 45. Arc groove; 46. Mounting plate; 47. Cylinder; 48. Mounting bracket; 49. Solder gun; 40. Fixing clamp; 41. Solder feeding assembly; 492. Fixing plate; 493. Fixing rod; 494. Support rod; 495. Solder feeding head; 496. Fixing bracket; 497. Motor four; 498. Solder feeding wheel one; 499. Swing plate; 4971. Insert rod; 4972. Solder feeding wheel two; 4973. Tension spring; 499. Solder tray; 490. Upper guide tube; 4991. Lower guide tube; 4992. Feeding tube. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] like Figure 1-6 As shown, the present invention provides a PCB board soldering machine, including a frame 1, a Y-axis moving assembly 2, an X-axis moving assembly 3, and a soldering mechanism 4; In addition, the Y-axis moving assembly 2 is mounted on the frame 1 and is used to drive the vacuum suction plate 21 for placing the PCB board. The Y-axis moving assembly 2 includes a slide block 22 and a motor 24. The bottom of the vacuum suction plate 21 is slidably connected to the slide rail on the fixed seat 23 inside the frame 1 through the slide block 22. The motor 24 is mounted on the bottom of the fixed seat 23 and a synchronous pulley 241 is mounted on its output shaft. A synchronous pulley 25 is rotatably connected to the fixed seat 23. The synchronous pulley 241 and the synchronous pulley 25 are connected by a synchronous belt 26. The bottom of the slide block 22 is provided with two clamping pieces 27. The two clamping pieces 27 are connected to the synchronous belt 26 by bolts, so as to facilitate the disassembly and assembly of the two clamping pieces 27 and the synchronous belt 26. However, the X-axis moving assembly 3 is located on the top of the frame 1 and is used to drive the moving frame 31 thereon. The X-axis moving assembly 3 includes a slide block 311 and a motor 33. The side of the moving frame 31 is slidably connected to the slide rail 2 on the fixed plate 32 inside the frame 1 through the slide block 311. The motor 33 is mounted on the fixed plate 32 and a synchronous pulley 34 is mounted on its output shaft. A synchronous pulley 45 is rotatably connected to the fixed plate 32. The synchronous pulley 34 and the synchronous pulley 45 are connected by a synchronous belt 36. The synchronous belt 36 is provided with a clamping piece 37. The clamping piece 37 is connected to the slide block 311 by bolts, so as to facilitate the disassembly and assembly of the clamping piece 37 and the slide block 311. By adjusting the X and Y axes, automatic positioning of any solder joint within the PCB board plane can be achieved. In addition, the soldering mechanism 4 is mounted on the frame 1 and is used to solder components on the PCB board. The soldering mechanism 4 includes a lifting assembly 41, a solder gun 47, and a solder feeding assembly 49. The lifting assembly 41 is mounted on the movable frame 31 and is used to drive the lifting plate 42 on it to move up and down. The lifting assembly 41 includes a drive screw 411, a motor 412, and a movable seat 413. The two ends of the drive screw 411 are rotatably connected to the movable frame 31. The motor 412 is installed in the movable frame 31 and its output shaft is connected to one end of the drive screw 411. The movable seat 413 is screwed to the drive screw 411 through a screw nut and slidably connected to the slide rail 4 in the movable frame 31, so that the movable seat 413 can move more smoothly. In addition, an arc-shaped plate 43 is slidably connected to the lower end of the lifting plate 42. The arc-shaped plate 43 is provided with an arc-shaped groove 431. The arc-shaped plate 43 is connected to the lifting plate 42 by bolts inserted into the arc-shaped groove 431, allowing the solder gun 47 to adjust its angle within a certain fan-shaped range to adapt to pads with different inclinations or special layouts on the PCB board. The end of the arc-shaped plate 43 is provided with a mounting plate 44. The mounting plate 44 is provided with a cylinder 45. The piston rod of the cylinder 45 is provided with a mounting bracket 46. The mounting bracket 46 is slidably connected to the mounting plate 44 through a slide rail. The solder gun 47 is connected to the mounting bracket 46 through a fixing clip 48. Additionally, the solder feeding assembly 49 is mounted on the mounting frame 46 and the movable frame 31 and is used to feed solder wire. The solder feeding assembly 49 includes a solder feeding head 493, a motor 495, a swing plate 497, a tension spring 4973, and a solder tray 498. The solder gun 47 is fitted with a fixed plate 491 connected to the mounting frame 46. A fixing rod 492 is provided on the side of the fixed plate 491. The lower end of the fixing rod 492 is bolted to a support rod 4921. The solder feeding head 493 is mounted on the support rod 4921. A fixed frame 494 is provided on the side of the movable frame 31. The motor 495 is mounted on... A solder feeding wheel 496 is provided on the fixed frame 494 and its output shaft. One end of the swing plate 497 is hinged to the fixed frame 494 by a pin. The other end of the swing plate 497 is provided with a plug rod 4971 that is inserted into the upper limit groove of the fixed frame 494. A second solder feeding wheel 4972 is rotatably connected to the swing plate 497. One end of the tension spring 4973 is connected to the swing plate 497, and the other end of the tension spring 4973 is connected to the fixed frame 494. The solder tray 498 is rotatably connected to the top of the fixed frame 494. The solder tray 498 can continuously provide a sufficient amount of solder wire during the soldering process of the PCB board. It is worth noting that the upper guide tube 499 and the lower guide tube 4991 are symmetrically arranged on the upper and lower sides of the fixing frame 494. The lower guide tube 4991 and the solder feeding head 493 are provided with a feeding tube 4992. The solder tray 498 is wound with solder wire passing through the upper guide tube 499, the space between the first solder feeding wheel 496 and the second solder feeding wheel 4972, the lower guide tube 4991, the feeding tube 4992 and the solder feeding head 493. The guide tube 499 and the feeding tube 4992 constrain the solder wire conveying direction, prevent the solder wire from bending, deviating and jamming, ensure the smooth conveying of the solder wire, and guide the solder wire accordingly to form a complete solder wire guiding path. Detailed implementation methods and principles: The staff places the PCB board to be soldered on the vacuum suction plate 21 of the equipment. The negative pressure adsorption of the vacuum suction plate 21 is used to fix the PCB board in all directions, effectively preventing shaking during the soldering process of thin PCB boards. After the PCB board is positioned, the equipment starts the Y-axis moving component 2. The motor 24 of the Y-axis moving component 2 starts and drives the synchronous wheel 241 on its output shaft to rotate. Through the synchronous belt 26, the synchronous wheel 25 on the fixed seat 23 rotates synchronously. During the transmission process, the synchronous belt 26 can drive the slide 22 to slide along the slide rail on the fixed seat 23, thereby driving the vacuum suction plate 21 and the PCB board fixed above to move longitudinally along the Y-axis, and transporting the area of ​​the PCB board to be soldered to the soldering operation area of ​​the soldering mechanism 4 to complete the longitudinal position alignment. After the PCB board is longitudinally positioned, the X-axis moving component 3 is started. The motor 33 of the X-axis moving component 3 works, driving the synchronous wheel 34 on the output shaft to rotate. Through the synchronous belt 36, the synchronous wheel 35 on the fixed plate 32 is rotated, realizing the horizontal transmission of the synchronous belt 36. The synchronous belt 36 drives the slide 311 to slide laterally along the slide rail 2 on the fixed plate 32, thereby driving the moving frame 31 at the top of the frame 1 and the overall soldering mechanism 4 to move laterally along the X-axis. After the XY axis plane alignment is completed, the lifting component 41 of the soldering mechanism 4 is started. The motor 412 of the lifting component 41 drives the drive screw 411 to rotate. The drive screw 411 drives the moving seat 413 to slide vertically along the slide rail 4 inside the moving frame 31, thereby driving the soldering gun 47 to move up and down. The staff can loosen the bolts to adjust the deflection angle of the arc plate 43 according to the required angle of the solder joint. After the adjustment is completed, the bolts are tightened to fix it, so as to realize the adjustment of the welding angle of the solder gun 47, meet the welding needs of irregular solder joints and inclined solder joints, and the disassembly and adjustment are convenient. After the height and angle are roughly adjusted, the cylinder 45 on the mounting plate 44 is activated. The piston rod of the cylinder 45 extends and retracts, driving the mounting bracket 46 to slide along the mounting plate 44 via the slide rail. This causes the solder gun 47 held on the fixing clamp 48 to move slightly, thus fine-tuning the soldering position of the solder gun 47, eliminating mechanical displacement errors, and ensuring that the nozzle of the solder gun 47 is accurately aligned with the point to be soldered. During operation, the motor 495 on the fixed frame 494 drives the first solder feeding wheel 496 to rotate. At the same time, the swing plate 497 is pressed against the fixed frame 494 under the elastic tension of the tension spring 4973, so that the second solder feeding wheel 4972 on the swing plate 497 tightly presses the solder wire. Through the counter-pressure clamping of the first solder feeding wheel 496 and the second solder feeding wheel 4972, and with the continuous clamping force provided by the tension spring 4973, the solder wire is prevented from slipping or shifting, and solder is supplied to the solder gun 47. The insertion rod 4971 at the end of the swing plate 497 is inserted into the limiting groove of the fixed frame 494, which can limit the swing amplitude of the swing plate 497 and ensure constant solder feeding pressure and stable solder feeding process. After all position adjustments and feeding preparations are completed, the solder gun 47 starts working and automatically solders the component solder joints on the PCB board. After the soldering of a single point is completed, the equipment adjusts its position through the X-axis moving component 3 and the Y-axis moving component 2 to perform soldering operations on the remaining solder joints on the PCB board in sequence.

[0027] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, are all within the protection scope of the present invention.

Claims

1. A PCB board soldering machine, characterized in that: It includes a frame (1), a Y-axis moving assembly (2), an X-axis moving assembly (3) and a soldering mechanism (4). The Y-axis moving assembly (2) is located on the frame (1) and is used to drive the vacuum suction plate (21) on which the PCB board is placed. The X-axis moving assembly (3) is located on the top of the frame (1) and is used to drive the moving frame (31) on it. The soldering mechanism (4) is mounted on the frame (1). The soldering mechanism (4) includes a lifting assembly (41), a solder gun (47), and a solder feeding assembly (49). The lifting assembly (41) is mounted on the movable frame (31) and is used to drive the lifting plate (42) on it to move up and down. The lifting plate (42) is provided with a fine-tuning assembly for adjusting the solder gun (47). The solder feeding assembly (49) includes a solder feeding head (493), a motor (495), a swing plate (497), and a tension spring (4973). The solder gun (47) is fitted with a fixed plate (491) connected to the mounting bracket (46) of the fine-tuning assembly. The side of the fixed plate (491) is provided with a solder feeding head (493). The motor (495) is mounted on the movable frame (31). 1) A solder feeding wheel 1 (496) is provided on the side of the fixed frame (494) and its output shaft. One end of the swing plate (497) is hinged to the fixed frame (494) by a pin. The other end of the swing plate (497) is provided with a plug rod (4971) inserted into the upper limit groove of the fixed frame (494). A solder feeding wheel 2 (4972) is rotatably connected to the swing plate (497). One end of the tension spring (4973) is connected to the swing plate (497), and the other end of the tension spring (4973) is connected to the fixed frame (494). A solder tray (498) is rotatably connected to the top of the fixed frame (494). A solder wire is wound on the solder tray (498) and passes between the solder feeding wheel 1 (496) and the solder feeding wheel 2 (4972) and the solder feeding head (493).

2. The PCB soldering machine according to claim 1, characterized in that: The Y-axis moving assembly (2) includes a slide block (22) and a motor (24). The bottom of the vacuum suction plate (21) is slidably connected to the slide rail on the fixed seat (23) inside the frame (1) via the slide block (22). The motor (24) is installed at the bottom of the fixed seat (23) and a synchronous wheel (241) is installed on its output shaft. A synchronous wheel (25) is rotatably connected to the fixed seat (23). The synchronous wheel (241) and the synchronous wheel (25) are connected by a synchronous belt (26). The slide block (22) is connected to the synchronous belt (26).

3. A PCB board soldering machine according to claim 1, characterized in that: The X-axis moving assembly (3) includes a slide block two (311) and a motor two (33). The side of the moving frame (31) is slidably connected to the slide rail two on the fixed plate (32) inside the frame (1) through the slide block two (311). The motor two (33) is mounted on the fixed plate (32) and a synchronous wheel three (34) is mounted on its output shaft. A synchronous wheel four (35) is rotatably connected to the fixed plate (32). The synchronous wheel three (34) and the synchronous wheel four (35) are connected through a synchronous belt two (36). The slide block two (311) is connected to the synchronous belt two (36).

4. A PCB soldering machine according to claim 1, characterized in that: The fine-tuning component includes an arc plate (43), a mounting plate (44), and a cylinder (45). The lower end of the lifting plate (42) is slidably connected to the arc plate (43). The arc plate (43) and the lifting plate (42) are detachably connected. The end of the arc plate (43) is provided with a mounting plate (44). The mounting plate (44) is provided with a cylinder (45). The piston rod of the cylinder (45) is provided with a mounting bracket (46). The mounting bracket (46) is slidably connected to the mounting plate (44) through a slide rail. The solder gun (47) is connected to the mounting bracket (46) through a fixing clip (48).

5. A PCB board soldering machine according to claim 1, characterized in that: The lifting assembly (41) includes a drive screw (411), a motor (412), and a movable seat (413). The two ends of the drive screw (411) are rotatably connected to the movable frame (31). The motor (412) is installed in the movable frame (31), and its output shaft is connected to one end of the drive screw (411). The movable seat (413) is screwed to the drive screw (411) through a screw nut and slidably connected to the slide rail four in the movable frame (31).

6. A PCB board soldering machine according to claim 1, characterized in that: The fixing frame (494) is symmetrically provided with an upper guide tube (499) and a lower guide tube (4991) on its upper and lower sides. A feeding tube (4992) is provided between the lower guide tube (4991) and the solder feeding head (493). The solder wire wound on the solder tray (498) passes through the upper guide tube (499), between the first solder feeding wheel (496) and the second solder feeding wheel (4972), the lower guide tube (4991), the feeding tube (4992) and the solder feeding head (493).

7. A PCB board soldering machine according to claim 1, characterized in that: The fixed plate (491) has a fixed rod (492) on its side. The lower end of the fixed rod (492) is connected to a support rod (4921) by bolts. The soldering head (493) is located on the support rod (4921).

8. A PCB board soldering machine according to claim 4, characterized in that: The arc plate (43) is provided with an arc groove (431), and the arc plate (43) is connected to the lifting plate (42) by bolts inserted into the arc groove (431).

9. A PCB board soldering machine according to claim 2, characterized in that: The bottom of the slide block (22) is provided with two clamping plates (27), which are connected to the timing belt (26) by bolts.

10. A PCB board soldering machine according to claim 3, characterized in that: The timing belt 2 (36) is provided with a clamp 2 (37), which is connected to the slide 2 (311) by bolts.

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